CN114951859A - Electrolyte plasma processing device and method - Google Patents

Electrolyte plasma processing device and method Download PDF

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Publication number
CN114951859A
CN114951859A CN202210602757.2A CN202210602757A CN114951859A CN 114951859 A CN114951859 A CN 114951859A CN 202210602757 A CN202210602757 A CN 202210602757A CN 114951859 A CN114951859 A CN 114951859A
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China
Prior art keywords
station
polishing liquid
polishing
workpiece
plasma processing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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CN202210602757.2A
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Chinese (zh)
Inventor
卢秉恒
郭文华
钟静
雷泽鑫
李娜
李垒柱
李涵清
王展
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National Institute Corp of Additive Manufacturing Xian
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National Institute Corp of Additive Manufacturing Xian
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Publication date
Application filed by National Institute Corp of Additive Manufacturing Xian filed Critical National Institute Corp of Additive Manufacturing Xian
Priority to CN202210602757.2A priority Critical patent/CN114951859A/en
Publication of CN114951859A publication Critical patent/CN114951859A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H11/00—Auxiliary apparatus or details, not otherwise provided for
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H1/00—Water heaters, e.g. boilers, continuous-flow heaters or water-storage heaters
    • F24H1/18—Water-storage heaters
    • F24H1/20—Water-storage heaters with immersed heating elements, e.g. electric elements or furnace tubes
    • F24H1/201—Water-storage heaters with immersed heating elements, e.g. electric elements or furnace tubes using electric energy supply
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H15/00—Control of fluid heaters
    • F24H15/20—Control of fluid heaters characterised by control inputs
    • F24H15/212—Temperature of the water
    • F24H15/223—Temperature of the water in the water storage tank
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H9/00—Details
    • F24H9/18—Arrangement or mounting of grates or heating means
    • F24H9/1809—Arrangement or mounting of grates or heating means for water heaters
    • F24H9/1818—Arrangement or mounting of electric heating means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
    • F24H9/00—Details
    • F24H9/20—Arrangement or mounting of control or safety devices
    • F24H9/2007—Arrangement or mounting of control or safety devices for water heaters
    • F24H9/2014—Arrangement or mounting of control or safety devices for water heaters using electrical energy supply
    • F24H9/2021—Storage heaters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

The invention discloses an electrolyte plasma processing device and method. Comprises a machine body, a polishing solution box, a water tank, a rectifier cabinet and a main machine; a station is arranged in the machine body, the station is a hollow cube with an opening at the top, and a heating rod, a conductivity meter and a temperature sensor are arranged in the station; the output ends of the polishing liquid tank and the water tank are communicated with the interior of the station, and the output ends of the polishing liquid tank and the water tank are provided with electromagnetic valves; the heating rod, the conductivity meter, the temperature sensor, the electromagnetic valve and the rectifier cabinet are all in communication connection with the host; when the working station is in work, polishing liquid is filled in the station, a workpiece is placed in the station, the workpiece is completely soaked in the polishing liquid, the positive electrode of the rectifier cabinet is connected with the workpiece, and the negative electrode of the rectifier cabinet is connected with the polishing liquid. Automatic electrolyte plasma polishing operation is realized, the artificial danger coefficient is reduced, and the polishing efficiency is improved.

Description

Electrolyte plasma processing device and method
Technical Field
The invention belongs to the field of electrolyte plasma polishing, and relates to an electrolyte plasma processing device and method.
Background
Sls and the like are well-established, and a large number of devices using the technology are also available on the market. Due to the nature of metallic printing, the printed workpiece must be subjected to a surface finish for application. The electrolyte plasma polishing technique is now in operation. The electrolyte plasma technology is used as a research field of interdisciplinary frontier and has wide application in the aspects of materials, energy, astronomy, chemical engineering and the like. The metal surface electrolyte plasma polishing utilizes a gas-liquid plasma generation technology to place a workpiece in polishing liquid, applies direct current voltage with certain characteristics to vaporize the polishing liquid around the workpiece to form a gas layer surrounding the workpiece, and selectively removes surface materials by forming discharge channels at different positions of the gas layer to polish the surface of the metal workpiece. Under the combined action of four phases of an electrode (polishing workpiece), a discharge medium, a gas layer and polishing liquid, surface materials are removed mainly through discharge, the polishing system is different from the traditional chemical removal of plasma polishing and also different from the interaction of two phases of the electrode and electrolyte under an electrolytic polishing system, and the polishing is finished by utilizing the electrochemical dissolution of the electrolyte. The polishing effect of the polishing solution is low, the polishing solution is a neutral salt solution with low concentration, the environment is hardly polluted, and the polishing quality and efficiency are difficult to achieve by the traditional polishing method.
However, in the prior art, the electrolyte plasma polishing operation is often performed manually, the danger coefficient of the manual operation is large, and the polishing efficiency is slow.
Disclosure of Invention
The present invention is directed to overcome the above disadvantages of the prior art, and provides an electrolyte plasma processing apparatus and method, which implement automated electrolyte plasma polishing operation, reduce the risk factor of labor, and improve the polishing efficiency.
In order to achieve the purpose, the invention adopts the following technical scheme to realize the purpose:
an electrolyte plasma processing device comprises a machine body, a polishing solution box, a water tank, a rectifier cabinet and a main machine;
a station is arranged in the machine body, the station is a hollow cube with an opening at the top, and a heating rod, a conductivity meter and a temperature sensor are arranged in the station; the output ends of the polishing liquid tank and the water tank are communicated with the interior of the station, and the output ends of the polishing liquid tank and the water tank are provided with electromagnetic valves; the heating rod, the conductivity meter, the temperature sensor, the electromagnetic valve and the rectifier cabinet are all in communication connection with the host;
when the working station is in work, polishing liquid is filled in the station, a workpiece is placed in the station, the workpiece is completely soaked in the polishing liquid, the positive electrode of the rectifier cabinet is connected with the workpiece, and the negative electrode of the rectifier cabinet is connected with the polishing liquid.
Preferably, a liquid level sensor is arranged in the station and is in communication connection with the host.
Preferably, a radiating pipe is arranged in the station, a water cooling machine is arranged outside the station and connected with the radiating pipe, and the water cooling machine is in communication connection with the host machine.
Preferably, be provided with the motor-driven cabinet door on the organism, the motor-driven cabinet door adopts servo motor drive, and servo motor's input is connected with servo driver, and servo driver and host computer communication are connected.
Preferably, be provided with electronic stores pylon in the organism, electronic stores pylon adopts servo motor drive, and servo motor's input is connected with servo driver, and servo driver is connected with the host computer communication.
Preferably, the temperature sensor is a thermocouple probe.
Preferably, the host computer adopts a PLC.
Preferably, the host is connected with a touch screen.
A processing method based on the electrolyte plasma processing device as claimed in any one of the preceding claims, comprising the steps of:
adding polishing liquid into a station to a required height, feeding back the temperature of the polishing liquid to a host by a temperature sensor in real time, controlling a heating rod by the host to heat the polishing liquid to a required temperature, connecting the anode of a rectifier cabinet with a workpiece, putting the workpiece into the polishing liquid, completely soaking the workpiece in the polishing liquid, connecting the cathode of the rectifier cabinet with the polishing liquid, electrifying the rectifier cabinet to polish the workpiece, and controlling the temperature of the heating rod by the host by monitoring the temperature of the polishing liquid in the polishing process to keep the temperature of the polishing liquid constant all the time; and after polishing is finished, the rectifier cabinet is powered off, the workpiece is fished out, and the heating rod is closed.
Preferably, the rectifier cabinet outputs DC0-400V adjustable voltage.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the polishing liquid in the station is heated by the heating rod, the temperature is monitored by the temperature sensor, so that the temperature of the polishing liquid is controlled, the conductivity of the polishing liquid is monitored by the conductivity meter, so that the real-time concentration can be obtained, and further the polishing liquid is timely supplemented and adjusted by the polishing liquid box and the water box, so that the automatic electrolyte plasma polishing operation is realized, the artificial danger coefficient is reduced, and the polishing efficiency is improved.
Further, the liquid level of the polishing solution is monitored through a liquid level sensor, so that whether the polishing solution needs to be added or not is judged, and the polishing solution is supplemented through a polishing solution box.
Furthermore, make the cooling tube internal water flow through the water-cooling machine for thereby heat loss accomplishes the back at the polishing, takes off processing work piece faster, raises the efficiency.
Furthermore, the electric hanging frame can automatically place the workpiece into the polishing solution or take the workpiece out of the polishing solution, so that the automation capacity is improved, meanwhile, an operator is prevented from being close to the polishing solution, and the artificial risk coefficient is reduced.
Drawings
FIG. 1 is a schematic view of the communication connections of the components of the present invention;
fig. 2 is a flow diagram of the electrolyte plasma process of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments; all other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that as used in the following description, the terms "front," "back," "left," "right," "upper" and "lower" refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, the electrolyte plasma processing apparatus according to the present invention includes a machine body, a polishing solution tank, a water tank, a rectification cabinet, and a main machine.
A station is arranged in the machine body, the station is a hollow cube with an opening at the top, and a heating rod, a liquid level sensor, a conductivity meter and a temperature sensor are arranged in the station; the output ends of the polishing liquid tank and the water tank are communicated with the interior of the station, and the output ends of the polishing liquid tank and the water tank are provided with electromagnetic valves; the heating rod, the conductivity meter, the temperature sensor, the liquid level sensor, the electromagnetic valve and the rectifier cabinet are all in communication connection with the host;
when the working station is in work, polishing liquid is filled in the station, a workpiece is placed in the station, the workpiece is completely soaked in the polishing liquid, the positive electrode of the rectifier cabinet is connected with the workpiece, and the negative electrode of the rectifier cabinet is connected with the polishing liquid.
Be provided with the cooling tube in the station, the station outside is provided with the water-cooling machine, and the water-cooling machine is connected with the cooling tube, and the water-cooling machine is connected with the host computer communication.
Be provided with electronic cabinet door and electronic stores pylon on the organism, electronic cabinet door and electronic stores pylon all adopt the servo motor drive, and servo motor's input is connected with servo driver, and servo driver is connected with the host computer communication.
The temperature sensor adopts a thermocouple probe.
The host is connected with a touch screen through Ethernet communication.
The touch screen replaces a mechanical button panel, interacts with the PLC through Ethernet communication, and is used for displaying and operating temperature, liquid level, switching value signals and the like of the field equipment through configuration picture graphs. And realizing visualized equipment operation and feedback.
The host machine adopts a PLC (programmable logic controller) as a core element of control equipment, and controls and collects various types of field equipment or instruments through digital and analog input/output and communication functions.
The servo driver is controlled by PLC communication and is used for driving the servo motor to run.
The servo motor is driven by the servo driver to drive the door and the hanging piece to move.
The heating rod is used to heat the solution to a preset temperature.
The water cooling machine enables water in the radiating pipe to flow through the water pump, so that heat loss is accelerated, and the processed workpiece can be taken down more quickly.
The rectifier cabinet comprises a transformer and a rectifier module, and can convert AC380V voltage into DC0-400V adjustable voltage for providing proper voltage for the pre-polishing workpiece.
The rectifier cabinet outputs DC0-400V, stepless voltage regulation can be realized, and the voltage amplitude with the best polishing efficiency can be accurately found out in a workpiece polishing experiment.
The conductivity meter is used for collecting the conductivity of the solution and transmitting data to the PLC through communication, so that the concentration of the polishing solution is obtained.
The conductivity of the electrolyte solution is detected by a sensor, and the system adjusts the concentration of the solution in real time according to the feedback value, so that the working stability is ensured.
The liquid level sensor is used for detecting the liquid level of the solution and transmitting data to the PLC through analog quantity.
The temperature sensor adopts a thermocouple probe, and the current measured temperature is acquired through a PLC thermocouple module.
As shown in fig. 2, the processing method using the electrolyte plasma processing apparatus includes the following processes:
the method comprises the following steps: preparing in the early stage; and the power supply of the device is turned on, so that the whole control system is powered on.
Step two: after power is obtained, the PLC compares signals fed back by the servo driver, the liquid level sensor, the conductivity meter and the temperature sensor with an initial set value, and automatically adjusts each system to an initial preset state.
When the concentration and the height of the polishing solution do not meet the requirements, the PLC controls the electromagnetic valves of the polishing solution tank and the water tank to supplement or adjust the concentration in time.
Step three: and fixing the workpiece to be polished on the electric hanger.
Step four: and clicking a 'start to use' button on the touch screen to enter the touch screen interface.
Step four: either the "manual mode" or the "automatic mode" is selected at the touch screen interface.
Step five: and selecting a manual mode, clicking a manual mode button, and jumping the interface to a manual mode interface. At the moment, a heating rod is clicked to start working to heat the bath solution, and a door closing button is clicked to control the closing of the electric cabinet door when the heating rod stops heating; and clicking a 'hanger descending' button to carry out descending inching control on the workpiece, so that the workpiece can be soaked by the bath solution.
Step six: and selecting an automatic mode, clicking an automatic mode button, and automatically completing the step five.
Step seven: after polishing, the rectifier cabinet cuts off the power supply, the electric hanger rises to salvage the workpiece, the electric cabinet door is opened, and the heating rod is closed.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided would be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of subject matter that is disclosed herein is not intended to forego such subject matter, nor should the applicant consider that such subject matter is not considered part of the disclosed subject matter.

Claims (10)

1. An electrolyte plasma processing device is characterized by comprising a machine body, a polishing solution box, a water tank, a rectifying cabinet and a host machine;
a station is arranged in the machine body, the station is a cube with a hollow interior and an opening at the top, and a heating rod, a conductivity meter and a temperature sensor are arranged in the station; the output ends of the polishing liquid tank and the water tank are communicated with the interior of the station, and the output ends of the polishing liquid tank and the water tank are provided with electromagnetic valves; the heating rod, the conductivity meter, the temperature sensor, the electromagnetic valve and the rectifier cabinet are all in communication connection with the host;
when the working station is in work, polishing liquid is filled in the station, a workpiece is placed in the station, the workpiece is completely soaked in the polishing liquid, the positive electrode of the rectifier cabinet is connected with the workpiece, and the negative electrode of the rectifier cabinet is connected with the polishing liquid.
2. The electrolyte plasma processing apparatus according to claim 1, wherein a liquid level sensor is provided in the station, and the liquid level sensor is in communication with the host machine.
3. The electrolyte plasma processing apparatus according to claim 1, wherein a heat radiating pipe is provided inside the station, a water cooling machine is provided outside the station, the water cooling machine is connected to the heat radiating pipe, and the water cooling machine is connected to the main machine in communication.
4. The apparatus of claim 1, wherein the body is provided with a motor cabinet door, the motor cabinet door is driven by a servo motor, and the input end of the servo motor is connected with a servo driver, and the servo driver is in communication connection with the host.
5. The apparatus as claimed in claim 1, wherein the body is provided with a motor-driven rack, the motor-driven rack is driven by a servo motor, and the input end of the servo motor is connected with a servo driver, and the servo driver is in communication connection with the host machine.
6. The electrolyte plasma processing apparatus according to claim 1, wherein the temperature sensor employs a thermocouple probe.
7. The electrolyte plasma processing apparatus as recited in claim 1, wherein the host machine employs a PLC.
8. The electrolyte plasma processing apparatus according to claim 1, wherein a touch screen is connected to the main body.
9. A processing method based on the electrolyte plasma processing apparatus according to any one of claims 1 to 8, characterized by comprising the steps of:
adding polishing liquid into a station to a required height, feeding back the temperature of the polishing liquid to a host by a temperature sensor in real time, controlling a heating rod by the host to heat the polishing liquid to a required temperature, connecting the anode of a rectifier cabinet with a workpiece, putting the workpiece into the polishing liquid, completely soaking the workpiece in the polishing liquid, connecting the cathode of the rectifier cabinet with the polishing liquid, electrifying the rectifier cabinet to polish the workpiece, and controlling the temperature of the heating rod by the host by monitoring the temperature of the polishing liquid in the polishing process to keep the temperature of the polishing liquid constant all the time; and after polishing is finished, the rectifier cabinet is powered off, the workpiece is fished out, and the heating rod is closed.
10. The electrolyte plasma processing method according to claim 9, wherein the rectifying cabinet outputs a DC0-400V adjustable voltage.
CN202210602757.2A 2022-05-30 2022-05-30 Electrolyte plasma processing device and method Pending CN114951859A (en)

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CN202210602757.2A CN114951859A (en) 2022-05-30 2022-05-30 Electrolyte plasma processing device and method

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Application Number Priority Date Filing Date Title
CN202210602757.2A CN114951859A (en) 2022-05-30 2022-05-30 Electrolyte plasma processing device and method

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003090962A1 (en) * 2002-04-23 2003-11-06 Koninklijke Philips Electronics N.V. A method, an apparatus,a control system and a computer program to perform an automatic removal of cathode depositions during a bi polar electrochemical machining
CN201148476Y (en) * 2008-01-23 2008-11-12 陈宁英 Electric pulp polishing machine with elevating gear
CN101648365A (en) * 2009-09-14 2010-02-17 中国电子科技集团公司第四十五研究所 CMP polishing solution supplying system
CN102039095A (en) * 2009-10-15 2011-05-04 中芯国际集成电路制造(上海)有限公司 Polishing solution mixing equipment
CN109759911A (en) * 2019-03-29 2019-05-17 西安增材制造国家研究院有限公司 A kind of electrolyte plasma polissoir
CN110184608A (en) * 2019-06-11 2019-08-30 广东工业大学 A kind of electrolyte plasma polishing machine and its polishing method
CN112538651A (en) * 2020-12-02 2021-03-23 山东理工大学 Method for polishing titanium alloy by ultrasonic-assisted electrolytic plasma
CN112589543A (en) * 2020-12-01 2021-04-02 江苏徐工工程机械研究院有限公司 Control system and control method for electrolyte plasma polishing equipment
CN215469953U (en) * 2021-04-19 2022-01-11 东莞市荣迅自动化设备有限公司 Automatic electrolyte plasma polishing equipment based on metal plate surface treatment
CN114473649A (en) * 2022-03-09 2022-05-13 江苏徐工工程机械研究院有限公司 Electrolyte plasma polishing assembly and electrolyte plasma polishing device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003090962A1 (en) * 2002-04-23 2003-11-06 Koninklijke Philips Electronics N.V. A method, an apparatus,a control system and a computer program to perform an automatic removal of cathode depositions during a bi polar electrochemical machining
CN201148476Y (en) * 2008-01-23 2008-11-12 陈宁英 Electric pulp polishing machine with elevating gear
CN101648365A (en) * 2009-09-14 2010-02-17 中国电子科技集团公司第四十五研究所 CMP polishing solution supplying system
CN102039095A (en) * 2009-10-15 2011-05-04 中芯国际集成电路制造(上海)有限公司 Polishing solution mixing equipment
CN109759911A (en) * 2019-03-29 2019-05-17 西安增材制造国家研究院有限公司 A kind of electrolyte plasma polissoir
CN110184608A (en) * 2019-06-11 2019-08-30 广东工业大学 A kind of electrolyte plasma polishing machine and its polishing method
CN112589543A (en) * 2020-12-01 2021-04-02 江苏徐工工程机械研究院有限公司 Control system and control method for electrolyte plasma polishing equipment
CN112538651A (en) * 2020-12-02 2021-03-23 山东理工大学 Method for polishing titanium alloy by ultrasonic-assisted electrolytic plasma
CN215469953U (en) * 2021-04-19 2022-01-11 东莞市荣迅自动化设备有限公司 Automatic electrolyte plasma polishing equipment based on metal plate surface treatment
CN114473649A (en) * 2022-03-09 2022-05-13 江苏徐工工程机械研究院有限公司 Electrolyte plasma polishing assembly and electrolyte plasma polishing device

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Application publication date: 20220830