CN114940771A - Shell assembly, preparation method thereof and electronic equipment - Google Patents

Shell assembly, preparation method thereof and electronic equipment Download PDF

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Publication number
CN114940771A
CN114940771A CN202110177412.2A CN202110177412A CN114940771A CN 114940771 A CN114940771 A CN 114940771A CN 202110177412 A CN202110177412 A CN 202110177412A CN 114940771 A CN114940771 A CN 114940771A
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CN
China
Prior art keywords
layer
acrylate oligomer
glue solution
average functionality
housing assembly
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Pending
Application number
CN202110177412.2A
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Chinese (zh)
Inventor
黄劲松
徐幸河
周谦
朱杰
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN202110177412.2A priority Critical patent/CN114940771A/en
Publication of CN114940771A publication Critical patent/CN114940771A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/042Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • C08J7/0423Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • C08J7/046Forming abrasion-resistant coatings; Forming surface-hardening coatings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2369/00Characterised by the use of polycarbonates; Derivatives of polycarbonates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2433/00Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • C08J2433/04Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2475/00Characterised by the use of polyureas or polyurethanes; Derivatives of such polymers
    • C08J2475/04Polyurethanes
    • C08J2475/14Polyurethanes having carbon-to-carbon unsaturated bonds

Abstract

The application provides a shell assembly, a preparation method thereof and an electronic device. A casing subassembly of this application embodiment includes: a housing body; a first topcoat layer formed on one side of the housing body, the raw material components of the first topcoat layer including an acrylate oligomer of a first average functionality; and a second topcoat layer formed on a surface of the first topcoat layer remote from the housing body, the raw material components of the second topcoat layer including an acrylate oligomer of a second average functionality, wherein the second average functionality is greater than the first average functionality. The shell assembly provided by the embodiment of the application has better toughness and wear resistance, and can well meet the requirements of ultrathin electronic equipment on the toughness and wear resistance of the shell assembly.

Description

Shell assembly, preparation method thereof and electronic equipment
Technical Field
The application relates to the field of electronics, in particular to a shell assembly, a manufacturing method thereof and electronic equipment.
Background
With the thinning of electronic devices such as mobile phones, the thickness of the housing of the electronic device is thinner and thinner, which causes the deformation of the housing to be larger during the assembling process of the electronic device, and the housing is required to have better toughness. However, the housing before the improvement is difficult to simultaneously provide sufficient wear resistance to the housing while satisfying the assembly deformation.
Disclosure of Invention
In view of the above problems, embodiments of the present application provide a housing assembly having better toughness and wear resistance.
The application provides a casing subassembly, it includes:
a housing body;
the first finishing coat layer is formed on one side of the shell body, and raw material components of the first finishing coat layer comprise acrylate oligomer with first average functionality; and
the second finishing layer is formed on the surface, far away from the shell body, of the first finishing layer, and raw material components of the second finishing layer comprise acrylate oligomer with second average functionality, wherein the second average functionality is greater than the first average functionality.
Based on the same inventive concept, the embodiment of the present application further provides a method for preparing a housing assembly, which includes:
providing a shell body;
coating a first glue solution on one side of the shell body to form a first glue solution layer, wherein the first glue solution comprises acrylate oligomer with first average functionality;
coating a second glue solution on the surface, far away from the shell body, of the first surface paint layer to form a second glue solution layer, wherein the second glue solution comprises an acrylate oligomer with a second average functionality, and the second average functionality is greater than the first average functionality; and
and carrying out photocuring on the first glue solution layer and the second glue solution layer so as to enable the first glue solution layer to be cured to form a first finish layer, and the second glue solution layer to be cured to form a second finish layer.
Based on the same inventive concept, the embodiment of the application further provides an electronic device, and the electronic device comprises the shell assembly.
The shell assembly of the embodiment of the application comprises a shell body; a first topcoat layer formed on one side of the housing body, the raw material components of the first topcoat layer including an acrylate oligomer of a first average functionality; and a second topcoat layer formed on a surface of the first topcoat layer remote from the housing body, the raw material components of the second topcoat layer including an acrylate oligomer of a second average functionality, wherein the second average functionality is greater than the first average functionality. From this, the toughness of the first finish layer of the shell assembly of this application is greater than the toughness of the second finish layer, and the second finish layer has sufficient wearability to make the whole better toughness and the wearability that has of shell assembly, be difficult for being scraped the flower, have longer life.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a housing assembly according to an embodiment of the present application.
Fig. 2 is a schematic structural view of a housing assembly according to a further embodiment of the present application.
Fig. 3 is a schematic flow chart illustrating the preparation of a housing assembly according to an embodiment of the present application.
Fig. 4 is a schematic flow chart illustrating a process for manufacturing a housing body according to an embodiment of the present application.
Fig. 5 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
Detailed Description
In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms "first," "second," and the like in the description and claims of the present application and in the foregoing drawings are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements but may alternatively include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.
It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.
Referring to fig. 1 and 2, a housing assembly 100 according to an embodiment of the present disclosure includes: a housing body 10; a first topcoat layer 30 formed on one side of the housing body 10, a raw material component of the first topcoat layer 30 including an acrylate oligomer of a first average functionality; and a second topcoat layer 50 formed on a surface of the first topcoat layer 30 away from the housing body 10, a raw material component of the second topcoat layer 50 including an acrylate oligomer having a second average functionality, wherein the second average functionality is greater than the first average functionality.
The term "one side of the housing body 10" means that the first varnish layer 30 may be formed directly on the surface of the housing body 10, and there may be other film layers between the first varnish layer 30 and the housing body 10, that is, the first varnish layer 30 may not be formed directly on the housing surface.
Alternatively, the first average functionality is the average luminous energy of the oligomer of the acrylate involved in the reaction in the starting component of the first topcoat layer 30 and the second average luminous energy is the average luminous energy of the oligomer of the acrylate involved in the reaction in the starting component of the second topcoat layer 50.
The housing assembly 100 of the embodiment of the present application includes a housing body 10; a first topcoat layer 30 formed on one side of the housing body 10, a raw material component of the first topcoat layer 30 including an acrylate oligomer of a first average functionality; and a second topcoat layer 50 formed on a surface of the first topcoat layer 30 away from the housing body 10, wherein a raw material composition of the second topcoat layer 50 includes an acrylate oligomer having a second average functionality, wherein the second average functionality is greater than the first average functionality. From this, the toughness of the first finish coat layer 30 of the housing assembly 100 of the present application is greater than the toughness of the second finish coat layer 50, and the second finish coat layer 50 has sufficient wear resistance, thereby making the housing assembly 100 have better toughness and wear resistance on the whole, being difficult for being scraped the flower, having longer life.
Alternatively, the shape of the housing assembly 100 may be a 2D shape, a 2.5D shape, a 3D shape, or the like. The housing assembly 100 may be, but is not limited to, a rear cover, a center frame, a decoration, etc. of an electronic device.
Referring to fig. 2, in some embodiments, the housing body 10 includes a substrate 11. The substrate 11 may be, but is not limited to, one or more of Polycarbonate (PC), polymethyl methacrylate (PMMA), Polyethylene terephthalate (PET), and Glass Fiber (GF). When the substrate 11 is a plurality of materials selected from polycarbonate, polymethyl methacrylate, polyethylene terephthalate, and glass fiber, any two or more composite sheets or any two or more sheets formed by copolymerization may be used.
In some embodiments, the housing body 10 further includes a first primer layer 13, and the first primer layer 13 is formed on the surface of the substrate 11 for increasing the adhesion of a second primer layer 15, which will be described below, on the surface of the substrate 11, and at the same time, the first primer layer 13 can also shield defects on the surface of the substrate 11, so that the manufactured housing assembly 100 has a better appearance. Alternatively, the raw material components of the first primer layer 13 include a thermoplastic resin, an Ultraviolet (UV) curable resin, a photoinitiator, and a solvent. Alternatively, the thermoplastic resin may be, but is not limited to, a thermoplastic acrylate; the UV curable resin may be, but is not limited to, 2-3 functional urethane acrylate oligomer resin; the photoinitiator may be, but is not limited to, cyclohexanone (HCPK), Diphenyl- (2,4,6-Trimethylbenzoyl) oxyphosphate (Diphenyl (2,4,6-Trimethylbenzoyl) phenyl Oxide, TPO), 1-hydroxycyclohexylphenylketone (photoinitiator 184, 1-hydroxycyclohexylphenylketone), Benzophenone (Benzophenone, BP), propylthioxanthone (ITX), 2, 4-Diethylthioxanthone (DETX), 2-hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator 1173), 2-phenylbenzyl-2-dimethylamine-1- (4-morpholinebenzyl phenyl) butanone (photoinitiator 369), phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide (photoinitiator 819), and the like. Specifically, a glue solution obtained by mixing thermoplastic acrylate, 2-3 functional urethane acrylate oligomer resin, a photoinitiator, a solvent and the like is coated on the surface of the substrate 11, dried at 50 ℃ to 70 ℃ for 3min to 8min to volatilize most of the solvent, and then cured by ultraviolet light under a mercury lamp (curing energy of 500 + 600mj/cm2) to form the first primer layer 13. Alternatively, the solvent may be, but is not limited to, one or more of ethyl acetate, propyl acetate, butyl acetate, cyclohexanone, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, isopropanol, methyl ethyl ketone, methyl butyl ketone. The raw material components of the first primer layer 13 further include an auxiliary agent such as a defoaming agent and a leveling agent. The defoaming agent can be one or more of organic silicon defoaming agent and polyether defoaming agent, and the leveling agent can be, but is not limited to, organic silicon leveling agent and the like.
Alternatively, the thickness of the first primer layer 13 is 12 μm to 16 μm, and particularly, the thickness of the first primer layer 13 may be, but is not limited to, 12 μm, 13 μm, 14 μm, 15 μm, 16 μm, and the like.
In some embodiments, the housing body 10 further includes a second primer layer 15, and the second primer layer 15 is formed on the surface of the first primer layer 13 far from the substrate 11 for shielding the surface defects of the first primer layer 13, so that the housing assembly 100 has a better appearance, and the following coating layer 17 can be better attached. Optionally, the raw material components of second primer layer 15 include acrylate, 2-3 functional urethane acrylate oligomer, auxiliaries, photoinitiator, and solvent. The acrylate may be, but is not limited to, one or more of 1,6 hexanediol diacrylate (HDDA), tripropylene glycol diacrylate (TPGDA), trimethylolpropane triacrylate (TMPTA). The photoinitiator may be, but is not limited to, cyclohexanone (HCPK), Diphenyl- (2,4,6-Trimethylbenzoyl) oxyphosphate (Diphenyl (2,4,6-Trimethylbenzoyl) phenyl Oxide, TPO), 1-hydroxycyclohexylphenylketone (photoinitiator 184, 1-hydroxycyclohexylphenylketone), Benzophenone (Benzophenone, BP), propylthioxanthone (ITX), 2, 4-Diethylthioxanthone (DETX), 2-hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator 1173), 2-phenylbenzyl-2-dimethylamine-1- (4-morpholinebenzyl phenyl) butanone (photoinitiator 369), phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide (photoinitiator 819), and the like. Alternatively, the solvent may be, but is not limited to, one or more of ethyl acetate, propyl acetate, butyl acetate, cyclohexanone, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, isopropanol, methyl ethyl ketone, methyl butyl ketone. The auxiliary agent comprises an antifoaming agent, a leveling agent and the like. The defoaming agent can be one or more of organic silicon defoaming agent and polyether defoaming agent, and the leveling agent can be, but is not limited to, organic silicon leveling agent and the like. The curing energy adopted by photocuring is 500mj/cm 2 To 600mj/cm 2 The curing energy of the mercury lamp is not too high, and when the curing energy of the mercury lamp is too high, the degree of crosslinking of the formed second primer layer 15 is too high, and the hardness is too high, which affects the adhesion of the below-described optical coating layer 17 on the second primer layer 15.
Alternatively, the thickness of second primer layer 15 is 20 μm to 30 μm, and specifically, the thickness of second primer layer 15 may be, but is not limited to, 20 μm, 22 μm, 25 μm, 28 μm, 30 μm, and the like.
Optionally, after coating the glue solution of the first primer layer 13, removing most of the solvent of the glue solution of the first primer layer 13, coating the glue solution of the second primer layer 15, and then adopting the curing energy of 500mj/cm 2 To 600mj/cm 2 The mercury lamp of (a) is irradiated with light to cure the glue solution of the first primer layer 13 and the glue solution of the second primer layer 15, thereby forming the first primer layer 13 and the second primer layer 15.
In some embodiments, the casing body 10 further includes a coating layer 17, and the coating layer 17 is formed on a side of the second primer layer 15 away from the substrate 11, so as to provide the casing assembly 100 with a better texture or appearance. Optionally, the plating layer 17 may be an optical plating, and optionally, the plating layer 17 uses In/Sn, TiO 2 、NbO 2 、Nb 2 O 3 、Nb 2 O 2 、Nb 2 O 5 、SiO 2 、ZrO 2 Or one or more of other Non-conductive oxides as an electroplating material, and a coating layer 17 is coated on the second primer layer 15 by a Non-conductive vacuum plating (NCVM) technique. Alternatively, the thickness of the plating layer 17 may be 20nm to 35nm, and specifically, the thickness of the plating layer 17 may be, but not limited to, 20nm, 22nm, 25nm, 28nm, 30nm, 32nm, 34nm, 35nm, and the like. The light transmittance of the blank film layer 17 is 5% to 10%, and specifically, may be, but not limited to, 5%, 6%, 7%, 8%, 9%, 10%, and the like.
In some embodiments, the housing body 10 further includes a color paint layer 19, and the color paint layer 19 is formed on the surface of the coating layer 17 away from the substrate 11, so that the housing assembly 100 has different colors and the adhesion of the first surface paint layer 30 on the surface of the coating layer 17 can be increased. Optionally, the raw material components of the colored paint layer 19 include modified acrylate polyurethane resin, nano color paste, photoinitiator, and the like. Alternatively, the photoinitiator may be, but is not limited to, cyclohexylphenyl ketone (HCPK), Diphenyl- (2,4,6-Trimethylbenzoyl) oxyphosphorus (Diphenyl (2,4,6-Trimethylbenzoyl) Phosphine Oxide, TPO), 1-hydroxycyclohexylphenylketone (photoinitiator 184, 1-hydroxycyclohexylphenylketone), Benzophenone (Benzophenone, BP), propylthioxanthone (ITX), 2, 4-Diethylthiaxanthone (DETX), 2-hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator 1173), 2-phenylbenzyl-2-dimethylamine-1- (4-morpholinebenzylphenyl) butanone (photoinitiator 369), phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide (photoinitiator 819), and the like. The thickness of the color paint layer 19 is 5 μm to 10 μm, and specifically, may be, but not limited to, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, and the like. Alternatively, the pigmented paint layer 19 is formed by subjecting the raw material components of the pigmented paint layer 19 to a curing energy of 600mj/cm 2 To 800mj/cm 2 Is formed by photocuring under a mercury lamp. When the colored paint layer 19 is cured, the curing energy of the mercury lamp is not too high, and if the curing energy of the mercury lamp is too high, the crosslinking degree of the prepared colored paint layer 19 is too high, and the hardness is too high, so that the adhesive force between the first surface paint layer 30 and the colored paint layer 19 is influenced.
Optionally, the toughness of the first topcoat layer 30 is greater than the toughness of the second topcoat layer 50, such that the first topcoat layer 30 has better toughness and the second topcoat layer 50 has better wear resistance. Therefore, the shell assembly 100 has good wear resistance and good toughness, and can better meet the requirement of the current ultrathin design of the electronic device on the shell assembly 100. So that the first topcoat layer 30 has better toughness and the second topcoat layer 50 has better wear resistance.
Optionally, the crosslinking degree of the second topcoat layer 50 is greater than the crosslinking degree of the first topcoat layer 30, so that the prepared housing assembly 100 has good wear resistance and good toughness, and can better meet the requirement of the current electronic device ultra-thin design on the housing assembly 100.
In some embodiments, the acrylate oligomer of the first average functionality is a solvent-borne acrylate oligomer, a 2-3 functional urethane acrylate oligomer, a 6-9 functional urethane acrylate oligomer, a polydipentaerythritol hexaacrylate (DPHA monomer), and the first average functionality is a solvent-borne acrylate oligomer, a 2-3 functional urethane acrylate oligomerAverage functionality of acrylate oligomer, 6-9 functional urethane acrylate oligomer, poly dipentaerythritol hexaacrylate. The raw material components of the first topcoat layer 30 further include a photoinitiator, an auxiliary agent and a solvent. Optionally, the raw material components of the first topcoat layer 30 include the following components in parts by weight: 15 to 20 parts of solvent-type acrylate oligomer, 20 to 25 parts of 2-3 functional polyurethane acrylate oligomer, 8 to 12 parts of 6-9 functional polyurethane acrylate oligomer, 3 to 5 parts of polydipentaerythritol hexaacrylate, 0.5 to 2 parts of photoinitiator and 0.5 to 2 parts of auxiliary agent. Alternatively, the photoinitiator may be, but is not limited to, cyclohexanone (HCPK), Diphenyl- (2,4,6-Trimethylbenzoyl) Phosphine Oxide (Diphenyl (2,4,6-Trimethylbenzoyl) Phospholine Oxide, TPO), 1-hydroxycyclohexylphenylketone (photoinitiator 184, 1-hydroxycyclohexylphenylketone), Benzophenone (Benzophenone, BP), propylthioxanthone (ITX), 2, 4-Diethylthioxanthone (DETX), 2-hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator 1173), 2-phenylbenzyl-2-dimethylamine-1- (4-morpholinebenzyl phenyl) butanone (photoinitiator 369), phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide (photoinitiator 819), and the like. In one embodiment, the photoinitiator comprises 2 parts HCPK photoinitiator and 1 part TPO photoinitiator. Alternatively, the solvent may be, but is not limited to, one or more of ethyl acetate, propyl acetate, butyl acetate, cyclohexanone, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, isopropanol, methyl ethyl ketone, methyl butyl ketone. The auxiliary agent comprises a defoaming agent, a leveling agent and the like; the defoaming agent can be one or more of organic silicon defoaming agent and polyether defoaming agent, and the leveling agent can be, but is not limited to, organic silicon leveling agent and the like. In one embodiment, the raw material components of the first topcoat layer 30 include, in weight fractions, 17% solvent-based acrylate oligomer, 22% 2-3 functional urethane acrylate oligomer, 10% 6-9 functional urethane acrylate oligomer, 4% polydipentaerythritol hexaacrylate, 1% HCPK photoinitiator, 0.5% TPO photoinitiator, 1% silicone leveling agent, and 44.5% solvent. Optionally, a first topcoat layer30 the raw material components are put into curing energy of 800mj/cm 2 To 1000mj/cm 2 Under the mercury lamp, ultraviolet light curing is performed.
Alternatively, the solvent-borne acrylate oligomer may have an average functionality of, but not limited to, 2 to 3 functional groups. The solvent-based acrylate oligomer used in the examples of the present application was purchased from Changxing chemical industry (China) Inc. under the model number ETERCURE 6071.
Alternatively, the thickness of the first topcoat layer 30 is 15 μm to 20 μm, and specifically, the thickness of the first topcoat layer 30 may be, but is not limited to, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, and the like. When the thickness of the first topcoat layer 30 is too thin, the coverage for the location of the defect points formed by the colored paint layer 19 is poor, and the surface of the manufactured case assembly 100 is prone to have the defect points, which affects the appearance of the case assembly 100 and thus the yield of the case assembly 100. When the thickness of the first topcoat layer 30 is too thick, the hardness of the first topcoat layer 30 is increased, the toughness is reduced, when the housing assembly 100 is made thinner, the yield of the assembly of the housing assembly 100 is easily affected during the assembly, that is, during the assembly, the deformation amount is too small due to the insufficient toughness of the housing assembly 100, so that the housing assembly is damaged during the assembly process.
In some embodiments, the acrylate oligomers of the second average functionality are average functionalities of the silicone-modified urethane acrylate oligomers, 2-3 functional urethane acrylate oligomers, and polydipentaerythritol hexaacrylate. The raw material components of the second topcoat layer 50 further include a photoinitiator, an auxiliary agent and a solvent. Optionally, the raw material components of the second topcoat layer 50 include the following components in parts by weight: 28 to 32 parts of 6-functional or above organosilicon modified urethane acrylate oligomer, 8 to 12 parts of 2-3 functional urethane acrylate oligomer, 4 to 6 parts of polydipentaerythritol hexaacrylate, 0.5 to 2 parts of photoinitiator and 0.5 to 2 parts of auxiliary agent. Alternatively, the photoinitiator may be, but is not limited to, cyclohexylphenyl ketone (HCPK), diphenylOne or more of (2,4,6-Trimethylbenzoyl) oxyphosphorus (Diphenyl (2,4,6-Trimethylbenzoyl) Phosphine Oxide, TPO), 1-hydroxycyclohexylphenylketone (photoinitiator 184, 1-hydroxycyclohexylphenylketone), Benzophenone (Benzophenone, BP), propylthioxanthone (ITX), 2, 4-Diethylthioxanthone (DETX), 2-hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator 1173), 2-phenylbenzyl-2-dimethylamine-1- (4-morpholinylbenzyl) butanone (photoinitiator 369), phenylbis (2,4,6-Trimethylbenzoyl) Phosphine Oxide (photoinitiator 819), and the like. Alternatively, the solvent may be, but is not limited to, one or more of ethyl acetate, propyl acetate, butyl acetate, cyclohexanone, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, isopropanol, methyl ethyl ketone, methyl butyl ketone. The auxiliary agent comprises a defoaming agent, a leveling agent and the like; the defoaming agent can be one or more of organic silicon defoaming agent and polyether defoaming agent, and the leveling agent can be, but is not limited to, organic silicon leveling agent and the like. In one embodiment, the raw material components of the second topcoat layer 50 layer include (by weight), 30% of silicone modified urethane acrylate oligomer, 10% of 2-3 functional urethane acrylate oligomer, 5% of polydipentaerythritol hexaacrylate, 1% of HCPK photoinitiator, 1% of silicone leveling agent and 53% of solvent. Alternatively, the first topcoat layer 30 is exposed to a curing energy of 800mj/cm through the above-mentioned raw material components 2 To 1000mj/cm 2 Under the mercury lamp, ultraviolet light curing is performed.
Alternatively, the silicone-modified urethane acrylate oligomer may be a 6-or more-functional silicone-modified urethane acrylate, and specifically, may be, but not limited to, a 6-functional silicone-modified urethane acrylate oligomer, a 7-functional silicone-modified urethane acrylate oligomer, an 8-functional silicone-modified urethane acrylate oligomer, a 9-functional silicone-modified urethane acrylate oligomer, or the like.
Alternatively, the thickness of the second topcoat layer 50 is 5 μm to 10 μm, and specifically, the thickness of the second topcoat layer 50 may be, but is not limited to, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, and the like. When the thickness of the second topcoat layer 50 is too thick, the second topcoat layer 50 becomes brittle, which is not favorable for assembling the housing assembly 100, and when the thickness of the second topcoat layer 50 is too thin, the wear resistance of the housing assembly 100 is not good.
Optionally, after the glue solution of the first topcoat layer 30 is coated, most of the solvent of the glue solution of the first topcoat layer 30 is removed, the glue solution of the second topcoat layer 50 is coated, and then the curing energy is adopted to be 800- 2 The mercury lamp is irradiated with light to cure the glue solution of the first topcoat layer 30 and the glue solution of the second topcoat layer 50, thereby forming the first topcoat layer 30 and the second topcoat layer 50.
Referring to fig. 3, the present embodiment further provides a method for manufacturing a housing assembly 100, which includes:
s201, providing a shell body 10;
specifically, the detailed description of the housing body 10 can refer to the specific embodiment of the housing assembly 100, and will not be repeated herein.
Referring to fig. 4, in an embodiment, the housing body 10 includes a substrate 11, a first primer layer 13, a second primer layer 15, a coating layer 17, and a color paint layer 19, which are sequentially stacked. In the present embodiment, the case body 10 is obtained by:
s2011, coating a first primer layer glue solution on the surface of the substrate 11, and removing the solvent in the first primer layer glue solution to form a first primer film layer;
specifically, the first primer layer 13 glue solution includes thermoplastic acrylate, 2-3 functional urethane acrylate oligomer resin, photoinitiator, solvent and the like. Specifically, the first primer layer 13 glue solution may be baked at 50 to 70 ℃ for 3 to 10min to remove most of the solvent. Specifically, the baking temperature may be, but is not limited to, 50 ℃, 55 ℃, 60 ℃, 65 ℃, 70 ℃, etc. The baking time may be, but is not limited to, 3min, 4min, 5min, 6min, 7min, 8min, 9min, 10min, etc.
S2012, coating a second primer layer glue solution on the surface, far away from the substrate 11, of the first primer layer, and removing the solvent in the second primer layer glue solution to form a second primer layer from the second primer layer glue solution;
specifically, the second primer layer 15 glue solution includes acrylate, 2-3 functional urethane acrylate oligomer, silicone leveling agent, photoinitiator, solvent, and the like, and the acrylate may be, but is not limited to, one or more of 1,6 hexanediol diacrylate (HDDA), tripropylene glycol diacrylate (TPGDA), and trimethylolpropane triacrylate (TMPTA). Specifically, the second primer layer 15 glue solution may be baked at 50 to 70 ℃ for 3 to 10min to remove most of the solvent. Specifically, the baking temperature may be, but not limited to, 50 ℃, 55 ℃, 60 ℃, 65 ℃, 70 ℃, etc. The baking time may be, but is not limited to, 3min, 4min, 5min, 6min, 7min, 8min, 9min, 10min, etc.
S2013, curing is carried out under ultraviolet light, so that the first primer film layer is cured to form a first primer layer 13, and the second primer film layer is cured to form a second primer layer 15;
specifically, the curing energy is 500mj/cm 2 To 600mj/cm 2 Under mercury lamp (9), photocuring was performed. The mercury lamp generates 500mj/cm of energy 2 To 600mj/cm 2 The photoinitiator is decomposed under the action of ultraviolet light to generate free radicals, and the free radicals initiate double bonds in the first primer film layer and the second primer film layer to generate free radical polymerization reaction, so that the first primer film layer is cured to form a first primer layer 13, and the second primer film layer is cured to form a second primer layer 15.
S2014, plating a coating layer 17 on the surface of the second primer layer 15 far away from the substrate 11; and
specifically, In/Sn, TiO are used 2 、NbO 2 、Nb 2 O 3 、Nb 2 O 2 、Nb 2 O 5 、SiO 2 、ZrO 2 Or one or more of other Non-conductive oxides, as a plating material, and a plating layer 17 is plated on the second primer layer 15 using a Non-conductive vacuum plating (NCVM) technique. In one embodiment, the plating layer 17 is an indium plating layer.
S2015, forming a colored paint layer 19 on the surface of the coating layer 17 away from the substrate 11.
Specifically, the surface of the coating layer 17 far away from the substrate 11 is coated with a color paint layer glue solution, and is baked to remove the solventAt a curing energy of 600mj/cm 2 To 800mj/cm 2 Is photo-cured under a mercury lamp to form the color paint layer 19. The color paint layer glue solution comprises modified acrylate polyurethane resin, nano color paste, a photoinitiator, a solvent and the like. Photoinitiators include cyclohexanone (HCPK), Diphenyl- (2,4,6-Trimethylbenzoyl) oxyphosphorus (Diphenyl (2,4,6-Trimethylbenzoyl) Phospholine Oxide, TPO). Optionally, the baking temperature is from 50 ℃ to 70 ℃; specifically, the baking temperature may be, but not limited to, 50 ℃, 55 ℃, 60 ℃, 65 ℃, 70 ℃, etc. Baking for 3-10 min; specifically, the baking time may be, but is not limited to, 3min, 4min, 5min, 6min, 7min, 8min, 9min, 10min, etc.
S202, coating a first glue solution on one side of the shell body 10 to form a first surface paint layer 30, wherein the first glue solution comprises acrylate oligomer with a first average functionality;
specifically, a first glue solution is coated on the surface of the colored paint layer 19 far away from the substrate 11, and after most of the solvent of the first glue solution is removed by baking, the first glue solution layer is formed. Alternatively, the acrylate oligomers of a first average functionality, which is the average functionality of the solvent-based acrylate oligomer, the 2-3 functional urethane acrylate oligomer, the 6-9 functional urethane acrylate oligomer, the polydipentaerythritol hexaacrylate (DPHA monomer), include the solvent-based acrylate oligomer, the 2-3 functional urethane acrylate oligomer, the 6-9 functional urethane acrylate oligomer, and the polydipentaerythritol hexaacrylate. The first glue solution also comprises a photoinitiator, an auxiliary agent and a solvent. Optionally, the first glue solution comprises the following components in parts by weight: 15 to 20 parts of solvent-type acrylate oligomer, 20 to 25 parts of 2-3 functional polyurethane acrylate oligomer, 8 to 12 parts of 6-9 functional polyurethane acrylate oligomer, 3 to 5 parts of polydipentaerythritol hexaacrylate, 0.5 to 2 parts of photoinitiator and 0.5 to 2 parts of auxiliary agent. Alternatively, the photoinitiator may be, but is not limited to, cyclohexanone (HCPK), Diphenyl- (2,4,6-Trimethylbenzoyl) oxyphosphate (Diphenyl (2,4,6-Trimethylbenzoyl) phenyl Oxide, TPO), 1-hydroxycyclohexylphenylketone (photoinitiator 184, 1-hydroxycyclohexylphenylketone), Benzophenone (Benzophenone, BP), propylthioxanthone (ITX), 2, 4-Diethylthioxanthone (DETX), 2-hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator 1173), 2-phenylbenzyl-2-dimethylamine-1- (4-morpholinebenzyl phenyl) butanone (photoinitiator 369), phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide (photoinitiator 819), and the like. In one embodiment, the photoinitiator comprises 2 parts HCPK photoinitiator and 1 part TPO photoinitiator. Alternatively, the solvent may be, but is not limited to, one or more of ethyl acetate, propyl acetate, butyl acetate, cyclohexanone, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, isopropanol, butanone, methyl butanone, and the like. The auxiliary agent comprises a defoaming agent, a leveling agent and the like; the defoaming agent can be one or more of organic silicon defoaming agent and polyether defoaming agent, and the leveling agent can be, but is not limited to, organic silicon leveling agent and the like.
Optionally, the baking temperature is from 50 ℃ to 70 ℃; specifically, the baking temperature may be, but not limited to, 50 ℃, 55 ℃, 60 ℃, 65 ℃, 70 ℃, etc. Optionally, the baking time is 3min to 10 min; specifically, the baking time may be, but is not limited to, 3min, 4min, 5min, 6min, 7min, 8min, 9min, 10min, and the like.
For the description of the same parts in this step as those in the above embodiments of the present application, refer to the above embodiments, and are not repeated herein.
S203, coating a second glue solution on the surface of the first glue solution layer far from the housing body 10 to form a second glue solution layer, where the second glue solution includes an acrylate oligomer with a second average functionality, and the second average functionality is greater than the first average functionality; and
specifically, the second glue solution layer is coated on the surface of the first glue solution layer far from the substrate 11, and after most of the solvent of the second glue solution is removed by baking, the second glue solution layer is formed. Alternatively, the acrylate oligomers of a second average functionality of the average functionalities of the silicone modified urethane acrylate oligomer, the 2-3 functional urethane acrylate oligomer, and the polydipentaerythritol hexaacrylate include silicone modified urethane acrylate oligomers, 2-3 functional urethane acrylate oligomers, and polydipentaerythritol hexaacrylate. The second glue solution also comprises a photoinitiator, an auxiliary agent and a solvent. Optionally, the second glue solution comprises the following components in parts by weight: 28 to 32 parts of 6-functional or above organosilicon modified urethane acrylate oligomer, 8 to 12 parts of 2-3 functional urethane acrylate oligomer, 4 to 6 parts of polydipentaerythritol hexaacrylate, 0.5 to 2 parts of photoinitiator and 0.5 to 2 parts of auxiliary agent. Alternatively, the photoinitiator may be, but is not limited to, cyclohexanone (HCPK), Diphenyl- (2,4,6-Trimethylbenzoyl) oxyphosphate (Diphenyl (2,4,6-Trimethylbenzoyl) phenyl Oxide, TPO), 1-hydroxycyclohexylphenylketone (photoinitiator 184, 1-hydroxycyclohexylphenylketone), Benzophenone (Benzophenone, BP), propylthioxanthone (ITX), 2, 4-Diethylthioxanthone (DETX), 2-hydroxy-2-methyl-1-phenyl-1-propanone (photoinitiator 1173), 2-phenylbenzyl-2-dimethylamine-1- (4-morpholinebenzyl phenyl) butanone (photoinitiator 369), phenylbis (2,4,6-trimethylbenzoyl) phosphine oxide (photoinitiator 819), and the like. Alternatively, the solvent may be, but is not limited to, one or more of ethyl acetate, propyl acetate, butyl acetate, cyclohexanone, propylene glycol methyl ether acetate, ethylene glycol monobutyl ether, ethylene glycol monomethyl ether, isopropanol, methyl ethyl ketone, methyl butyl ketone. The auxiliary agent comprises a defoaming agent, a leveling agent and the like; the defoaming agent can be one or more of organic silicon defoaming agent and polyether defoaming agent, and the leveling agent can be, but is not limited to, organic silicon leveling agent and the like.
Optionally, the baking temperature is from 50 ℃ to 70 ℃; specifically, the baking temperature may be, but not limited to, 50 ℃, 55 ℃, 60 ℃, 65 ℃, 70 ℃, etc. Optionally, the baking time is 3min to 10 min; specifically, the baking time may be, but is not limited to, 3min, 4min, 5min, 6min, 7min, 8min, 9min, 10min, and the like.
For the description of the same parts in this step as those in the above embodiments of the present application, refer to the above embodiments, and are not repeated herein.
And S204, carrying out photocuring on the first glue solution layer and the second glue solution layer so as to solidify the first glue solution layer to form a first finish layer 30, and solidify the second glue solution layer to form a second finish layer 50.
Specifically, the material obtained in step S203 is subjected to curing energy of 800mj/cm 2 To 1000mj/cm 2 Under the mercury lamp, ultraviolet light curing is performed so that the first glue solution layer is cured to form the first topcoat layer 30, and the second glue solution layer is cured to form the second topcoat layer 50.
Alternatively, the thickness of the first topcoat layer 30 is 15 μm to 20 μm, and specifically, the thickness of the first topcoat layer 30 may be, but is not limited to, 15 μm, 16 μm, 17 μm, 18 μm, 19 μm, 20 μm, and the like. When the thickness of the first topcoat layer 30 is too thin, the coverage for the location of the defect points formed by the colored paint layer 19 is poor, and the surface of the manufactured case assembly 100 is prone to have the defect points, which affects the appearance of the case assembly 100 and thus the yield of the case assembly 100. When the thickness of the first topcoat layer 30 is too thick, the hardness of the first topcoat layer 30 may increase, the toughness may decrease, and when the housing assembly 100 is thin, the yield of the assembly of the housing assembly 100 may be easily affected.
Alternatively, the thickness of the second topcoat layer 50 is 5 μm to 10 μm, and specifically, the thickness of the second topcoat layer 50 may be, but is not limited to, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, and the like. When the thickness of the second topcoat layer 50 is too thick, the second topcoat layer 50 becomes brittle, which is not favorable for assembling the housing assembly 100, and when the thickness of the second topcoat layer 50 is too thin, the wear resistance of the housing assembly 100 is not good.
For the description of the same parts in this step as those in the above embodiments of the present application, refer to the above embodiments, and are not repeated herein.
In the preparation method of the housing assembly 100 according to the above embodiment of the present application, the first average functionality of the reactive monomer of the first glue solution is smaller than the second average functionality of the reactive monomer of the second glue solution, and the crosslinking degree of the second topcoat layer 50 of the prepared housing assembly 100 is greater than the crosslinking degree of the first topcoat layer 30, so that the first topcoat layer 30 has good toughness, and the second topcoat layer 50 has good wear resistance, and therefore, the prepared housing assembly 100 has good toughness and wear resistance, is not easily scratched, and has a long service life.
The housing assembly 100 according to the embodiment of the present application will be further described with reference to specific examples and comparative examples.
Example 1
A method of making a housing assembly 100, comprising:
1) providing a substrate 11, the substrate 11 being Polycarbonate (PC);
2) coating glue solution consisting of thermoplastic acrylate, 2-3 functional polyurethane acrylate oligomer resin, a photoinitiator, a solvent and the like on the surface of the base material 11, baking for 5min at 60 ℃, removing most of the solvent, and forming a first primer film layer;
3) coating glue solution consisting of 1, 6-hexanediol diacrylate (HDDA), 2-3 functional polyurethane acrylate oligomer, an organic silicon leveling agent, a photoinitiator, a solvent and the like on the surface of the first primer film layer, which is far away from the base material 11, baking for 5min at 60 ℃, and removing most of the solvent to form a second primer film layer;
4) at a curing energy of 500mj/cm 2 To 600mj/cm 2 Under a mercury lamp, so that the first primer film layer is cured to form a first primer layer 13, and the second primer film layer is cured to form a second primer layer 15;
5) plating an indium layer on the surface of the second primer layer 15 away from the substrate 11;
6) coating a glue solution consisting of modified acrylate polyurethane resin, nano color paste, a photoinitiator, a solvent and the like on the surface of the indium-plated layer far away from the base material 11, baking for 5min at 60 ℃, removing most of the solvent, and curing at the curing energy of 600mj/cm 2 To 800mj/cm 2 Is photo-cured under a mercury lamp to form a varnish layer 19;
7) coating a glue solution consisting of 17% of solvent type acrylate oligomer, 22% of 2-3 functional polyurethane acrylate oligomer, 10% of 6-9 functional polyurethane acrylate oligomer, 4% of DPHA monomer, 1% of HCPK photoinitiator, 0.5% of TPO photoinitiator, 1% of organosilicon leveling agent and 44.5% of solvent on the surface of the colored paint layer 19 away from the base material 11, baking for 5min at 60 ℃, and removing most of the solvent to form a first glue solution layer;
8) coating a glue solution consisting of 30% of 6-functional organic silicon modified polyurethane acrylate oligomer, 10% of 2-3-functional polyurethane acrylate oligomer, 5% of DPHA monomer, 1% of HCPK photoinitiator, 1% of organic silicon flatting agent and 53% of solvent on the surface of the first glue solution layer away from the shell body 10, baking for 5min at 60 ℃, removing most of the solvent, and forming a second glue solution layer; and
9) photocuring the first glue solution layer and the second glue solution layer to enable the first glue solution layer to be cured to form a first finish layer 30, and the second glue solution layer to be cured to form a second finish layer 50, wherein the curing energy is 800mj/cm 2 To 1000mj/cm 2
The thickness of the first topcoat layer 30 of the case assembly 100 prepared above was 18 μm; the thickness of the second topcoat layer 50 is 8 μm.
Comparative example 1
A method of making a housing assembly 100, comprising:
1) providing a substrate 11, the substrate 11 being Polycarbonate (PC);
2) coating glue solution consisting of thermoplastic acrylate, 2-3 functional polyurethane acrylate oligomer resin, a photoinitiator, a solvent and the like on the surface of the base material 11, baking for 5min at 60 ℃, and removing most of the solvent to form a first primer film layer;
3) coating glue solution consisting of 1, 6-hexanediol diacrylate (HDDA), 2-3 functional polyurethane acrylate oligomer, an organic silicon leveling agent, a photoinitiator, a solvent and the like on the surface of the first primer film layer, which is far away from the base material 11, baking for 5min at 60 ℃, and removing most of the solvent to form a second primer film layer;
4) at a curing energy of 500mj/cm 2 To 600mj/cm 2 Under a mercury lamp of (a), performing photocuring so that the first primer film layer is cured to form a first primer layer 13 and the second primer film layer is cured to form a second primer layer 15;
5) plating an indium layer on the surface of the second primer layer 15 away from the substrate 11;
6) coating modified acrylic ester polyurethane resin, nano color paste and light guide on the surface of the indium-plated layer far away from the base material 11Baking the glue solution composed of hair agent and solvent at 60 deg.C for 5min, removing most solvent, and curing at 600mj/cm 2 To 800mj/cm 2 Under a mercury lamp to form a varnish layer 19;
7) coating a glue solution consisting of more than 30% of organosilicon modified polyurethane acrylate oligomer with 6 functional groups, 10% of 2-3 functional polyurethane acrylate oligomer, 5% of DPHA monomer, 1% of HCPK photoinitiator, 1% of organosilicon leveling agent and 53% of solvent on the surface of the color paint layer 19 away from the shell body 10, baking for 5min at 60 ℃, removing most of the solvent, and forming a second glue solution layer; and
8) performing photocuring on the second glue solution layer to cure the second glue solution layer to form a second finish coat layer 50, wherein the curing energy is 800mj/cm 2 To 1000mj/cm 2
The thickness of the second topcoat layer 50 of the case assembly 100 prepared above was 26 μm.
Comparative example 2
A method of making a housing assembly 100, comprising:
1) providing a substrate 11, the substrate 11 being Polycarbonate (PC);
2) coating glue solution consisting of thermoplastic acrylate, 2-3 functional polyurethane acrylate oligomer resin, a photoinitiator, a solvent and the like on the surface of the base material 11, baking for 5min at 60 ℃, and removing most of the solvent to form a first primer film layer;
3) coating glue solution consisting of 1, 6-hexanediol diacrylate (HDDA), 2-3 functional polyurethane acrylate oligomer, an organic silicon leveling agent, a photoinitiator, a solvent and the like on the surface of the first primer film layer, which is far away from the base material 11, baking for 5min at 60 ℃, and removing most of the solvent to form a second primer film layer;
4) at a curing energy of 500mj/cm 2 To 600mj/cm 2 Under a mercury lamp of (a), performing photocuring so that the first primer film layer is cured to form a first primer layer 13 and the second primer film layer is cured to form a second primer layer 15;
5) plating an indium layer on the surface of the second primer layer 15 away from the substrate 11;
6) at the far side of the indium plating layerCoating glue solution consisting of modified acrylate polyurethane resin, nano color paste, photoinitiator, solvent and the like on the surface of the base material 11, baking for 5min at 60 ℃, removing most of the solvent, and curing at the energy of 600mj/cm 2 To 800mj/cm 2 Under a mercury lamp to form a varnish layer 19;
7) coating a glue solution consisting of 17% of solvent type acrylate oligomer, 15% of 2-3 functional polyurethane acrylate oligomer, 9% of 6-9 functional polyurethane acrylate oligomer, 8% of DPHA monomer, 1% of HCPK photoinitiator, 0.5% of TPO photoinitiator, 1% of organosilicon leveling agent and 48.5% of solvent on the surface of the colored paint layer 19 away from the shell body 10 to form a film layer; and
8) photo-curing the film layer obtained in the step 7) to cure the film layer to form an appearance layer, wherein the curing energy is 800mj/cm 2 To 1000mj/cm 2
The thickness of the appearance layer of the case assembly 100 prepared above was 26 μm.
Comparative example 3
A method of making a housing assembly 100, comprising:
1) providing a substrate 11, the substrate 11 being Polycarbonate (PC);
2) coating glue solution consisting of thermoplastic acrylate, 2-3 functional polyurethane acrylate oligomer resin, a photoinitiator, a solvent and the like on the surface of the base material 11, baking for 5min at 60 ℃, and removing most of the solvent to form a first primer film layer;
3) coating glue solution consisting of 1, 6-hexanediol diacrylate (HDDA), 2-3 functional polyurethane acrylate oligomer, an organic silicon leveling agent, a photoinitiator, a solvent and the like on the surface of the first primer film layer, which is far away from the base material 11, baking for 5min at 60 ℃, and removing most of the solvent to form a second primer film layer;
4) at a curing energy of 500mj/cm 2 To 600mj/cm 2 Under a mercury lamp of (a), performing photocuring so that the first primer film layer is cured to form a first primer layer 13 and the second primer film layer is cured to form a second primer layer 15;
5) plating an indium layer on the surface of the second primer layer 15 away from the substrate 11;
6) coating a glue solution consisting of modified acrylate polyurethane resin, nano color paste, photoinitiator, solvent and the like on the surface of the indium-plated layer far away from the substrate 11, baking for 5min at 60 ℃, removing most of the solvent, and curing at the curing energy of 600mj/cm 2 To 800mj/cm 2 Under a mercury lamp to form a varnish layer 19;
7) coating a glue solution consisting of 13% of solvent type acrylate oligomer, 12% of 2-3 functional polyurethane acrylate oligomer, 16% of 6-9 functional polyurethane acrylate oligomer, 8% of DPHA monomer, 1% of HCPK photoinitiator, 0.5% of TPO photoinitiator, 1% of organosilicon leveling agent and 48.5% of solvent on the surface of the colored paint layer 19 away from the shell body 10 to form a film layer; and
8) carrying out photocuring on the film layer obtained in the step 7) so as to cure the film layer to form an appearance layer, wherein the curing energy is 800mj/cm 2 To 1000mj/cm 2
The thickness of the appearance layer of the case assembly 100 prepared above was 26 μm.
The housing assemblies 100 prepared in example 1 and comparative examples 1 to 3 were subjected to toughness, hardness and wear resistance measurements.
The toughness measurement method comprises the following steps: adopt the diameter to be 80mm in proper order, 75mm, 65mm, 60mm, 55mm, 50mm, 45mm, 40mm, 35mm, 30mm, the cylinder of different diameters such as 25mm, make the casing subassembly 100 that makes into the plane sample, substrate 11 faces the cylinder, press close to the cylinder with the sample and buckle, the cylinder diameter when casing subassembly 100 surface fracture, then be the ultimate size of casing subassembly 100 toughness, when casing subassembly 100 fracture, the cylinder diameter is the smaller, it is stronger to explain casing subassembly 100 toughness.
The pencil hardness measuring method comprises the following steps: pencil hardness measurements were performed using GB/T6739-.
And (3) testing the wear resistance: the appearance surface of the shell assembly 100 is rubbed back and forth by using 0000# steel wool and a load of 300g, and the wear resistance of the shell assembly 100 is stronger as the number of rubbing is larger before the appearance surface of the shell assembly 100 is scratched.
The test results of the case assemblies 100 manufactured in example 1, comparative example 1 to comparative example 3 are shown in table 1.
Examples of the invention Toughness testing (bending limit diameter) Hardness of pencil Abrasion resistance test
Example 1 30mm 1H No abrasion damage for 50 times
Comparative example 1 80mm 1H No abrasion damage for 200 times
Comparative example 2 30mm 1H 5 times of severe frosting
Comparative example 3 40mm 1H 5 times of obvious grinding
From the table above, the shell assembly 100 that this application was made both had good toughness, simultaneously, had good wearability, can be fine satisfy the ultra-thin design of electronic equipment, to the requirement of shell assembly 100 toughness during the equipment, simultaneously can be fine satisfy the requirement to shell assembly 100 surperficial wearability.
Referring to fig. 5, an electronic device 300 is further provided in the embodiment of the present application, where the electronic device 300 includes the housing assembly 100 according to the embodiment of the present application.
The electronic device 300 of the embodiment of the present application includes, but is not limited to, portable devices including a mobile phone, a tablet computer, a notebook computer, a smart watch, a smart bracelet, an e-reader, and the like.
Reference herein to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Finally, it should be noted that the above embodiments are only for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims (12)

1. A housing assembly, comprising:
a housing body;
a first topcoat layer formed on one side of the housing body, the raw material components of the first topcoat layer including an acrylate oligomer of a first average functionality; and
the second finishing layer is formed on the surface, far away from the shell body, of the first finishing layer, and raw material components of the second finishing layer comprise acrylate oligomer with second average functionality, wherein the second average functionality is greater than the first average functionality.
2. The housing assembly of claim 1 wherein the acrylate oligomer of the first average functionality is an average functionality of a solvent-based acrylate oligomer, a 2-3 functional urethane acrylate oligomer, a 6-9 functional urethane acrylate oligomer, a polydipentaerythritol hexaacrylate.
3. The housing assembly of claim 2 wherein the acrylate oligomer of the first average functionality comprises the following components in parts by weight: 15 to 20 parts of a solvent-based acrylate oligomer, 20 to 25 parts of a 2-3 functional urethane acrylate oligomer, 8 to 12 parts of a 6-9 functional urethane acrylate oligomer, and 3 to 5 parts of polydipentaerythritol hexaacrylate.
4. The housing assembly of claim 1 wherein the acrylate oligomers of the second average functionality comprise silicone modified urethane acrylate oligomers, 2-3 functional urethane acrylate oligomers, and polydipentaerythritol hexaacrylate, the second average functionality being the average functionality of the silicone modified urethane acrylate oligomers, 2-3 functional urethane acrylate oligomers, and polydipentaerythritol hexaacrylate.
5. The housing assembly of claim 4 wherein the second average functionality acrylate oligomer comprises the following components in parts by weight: 28 to 32 parts of organosilicon modified urethane acrylate oligomer, 8 to 12 parts of 2-3 functional urethane acrylate oligomer and 4 to 6 parts of poly dipentaerythritol hexaacrylate.
6. The housing assembly of claim 1, wherein the first topcoat layer has a thickness of 15 to 20 μ ι η and the second topcoat layer has a thickness of 5 to 10 μ ι η.
7. The housing assembly of claim 1, wherein the housing body comprises a substrate, a first primer layer, a second primer layer, a coating layer and a color paint layer, which are sequentially stacked, and the first surface paint layer is formed on a surface of the color paint layer, which faces away from the substrate.
8. A method of making a housing assembly, comprising:
providing a shell body;
coating a first glue solution on one side of the shell body to form a first glue solution layer, wherein the first glue solution comprises acrylate oligomer with first average functionality;
coating a second glue solution on the surface, far away from the shell body, of the first glue solution layer to form a second glue solution layer, wherein the second glue solution comprises acrylate oligomer with second average functionality, and the second average functionality is greater than the first average functionality; and
and carrying out photocuring on the first glue solution layer and the second glue solution layer so as to enable the first glue solution layer to be cured to form a first finish layer, and the second glue solution layer to be cured to form a second finish layer.
9. The method of making a housing assembly of claim 8, wherein the acrylate oligomer of the first average functionality is an average functionality of a solvent-based acrylate oligomer, a 2-3 functional urethane acrylate oligomer, a 6-9 functional urethane acrylate oligomer, and a polydipentaerythritol hexaacrylate.
10. The method of making a housing assembly of claim 8, wherein the acrylate oligomers of the second average functionality are average functionalities of silicone modified urethane acrylate oligomers, 2-3 functional urethane acrylate oligomers, and polydipentaerythritol hexaacrylate.
11. The method of making a housing assembly of claim 8, wherein forming a first glue layer comprises: placing the first glue solution at 50-70 ℃, and drying for 3-10 min to form a first glue solution layer; forming the second glue layer includes: placing the second glue solution at 50-70 ℃, and drying for 3-10 min to form a second glue solution layer; the curing energy of the photocuring is 800mj/cm 2 To 1000mj/cm 2
12. An electronic device, characterized in that the electronic device comprises a housing assembly according to any of claims 1-7.
CN202110177412.2A 2021-02-07 2021-02-07 Shell assembly, preparation method thereof and electronic equipment Pending CN114940771A (en)

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