CN114932595A - Method for improving hole thickness and hole edge whitening of PCB (printed Circuit Board) drilling hole - Google Patents
Method for improving hole thickness and hole edge whitening of PCB (printed Circuit Board) drilling hole Download PDFInfo
- Publication number
- CN114932595A CN114932595A CN202210650936.3A CN202210650936A CN114932595A CN 114932595 A CN114932595 A CN 114932595A CN 202210650936 A CN202210650936 A CN 202210650936A CN 114932595 A CN114932595 A CN 114932595A
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- Prior art keywords
- drilling
- hole
- drill
- pcb
- diameter
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- 238000005553 drilling Methods 0.000 title claims abstract description 127
- 238000000034 method Methods 0.000 title claims abstract description 27
- 230000002087 whitening effect Effects 0.000 title claims abstract description 24
- 238000005520 cutting process Methods 0.000 abstract description 19
- 239000000463 material Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000008685 targeting Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000013467 fragmentation Methods 0.000 description 3
- 238000006062 fragmentation reaction Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Drilling And Boring (AREA)
Abstract
The invention provides a method for improving PCB drilling hole thickness and hole edge whitening, which comprises the following steps: (1) providing a PCB, arranging a drilling position on the PCB, and presetting a target diameter of a drilling hole; (2) performing primary pre-drilling at a drilling position by using a first drill, wherein the diameter of the primary pre-drilling is 30-50% of the target diameter; (3) performing secondary pre-drilling at the drilling position by using a second drill, wherein the diameter of the secondary pre-drilling is 80-90% of the target diameter; (4) drilling a hole at the drilling location to the target diameter using a third drill bit having a tip angle in a range of 110-120 degrees. The method for improving the roughness and whitening of the hole edge of the PCB drilling hole greatly reduces the cutting amount of single drilling, ensures the stability of the drilling hole, improves the hole wall processing quality and solves the problems of roughness and whitening of the hole edge of the hole wall.
Description
Technical Field
The invention relates to the technical field of PCB drilling, in particular to a method for improving PCB drilling hole thickness and hole edge whitening.
Background
A Printed Circuit Board (PCB) is a carrier for electrical interconnection of electronic components. The main base material of the Printed Circuit Board (PCB) is a copper-clad plate, and the copper-clad plate mainly comprises copper foil, glass fiber cloth and resin. The existing copper-clad plate has the characteristics of hardness and brittleness due to the addition of filling materials such as silicon micropowder, aluminum oxide, aluminum hydroxide and the like.
Printed circuit boards are usually provided with via holes for conducting the lines of the printed circuit board and with insertion holes for mounting a plug-in, so that drilling is an essential process in the production of printed circuit boards. At present, the drilling mode of the printed circuit board generally adopts a method of drilling by a drill with a large drill point angle for one time, namely, the printed circuit board is drilled to the required diameter at one time. The method of drilling a hole has the following problems: firstly, in the hole machining process of the printed circuit board, along with the increase of cutting temperature, resin in a copper clad plate base material is melted and bonded with copper foil fragments, and bonding materials can be attached to the surface of a drill bit, so that the drill bit is continuously worn and the cutting edges are passivated; secondly, the copper-clad plate is hard and brittle, so that the thermal stress and the mechanical stress generated when the printed circuit board is drilled can cause local fracture of the substrate.
Disclosure of Invention
The invention aims to provide a method for improving the hole thickness and the hole edge whitening of a PCB drilling hole, so as to prevent the phenomenon of local fragmentation of a substrate and improve the hole wall processing quality.
In order to achieve the purpose, the invention provides a method for improving the hole thickness and the hole edge whitening of a PCB drilling hole, which comprises the following steps: (1) providing a PCB, arranging a drilling position on the PCB, and presetting a target diameter of a drilling hole; (2) using a first drill bit to perform first pre-drilling at the drilling position, wherein the diameter of the first pre-drilling is 30% -50% of the target diameter; (3) performing a second pre-drilling at the drilling location using a second drill bit, the second pre-drilling having a diameter of 80-90% of the target diameter; (4) drilling at the drilling location to the target diameter using a third drill bit having a tip angle in a range of 110-120 degrees.
Preferably, the first drill bit, the second drill bit and the third drill bit have the same rotation speed during drilling.
Preferably, the first, second and third drill bits are rotated at a speed in the range of 30Krpm-55 Krpm.
Preferably, the feed speeds of the first drill bit, the second drill bit and the third drill bit are the same when drilling.
Preferably, the feed rate of the first, second and third drill bits while drilling is in the range of 50IPM-65 IPM.
Compared with the prior art, the method for improving the thickness and whitening of the hole of the PCB drill hole adopts a three-time drilling mode, the first drill hole and the second drill hole are pre-drill holes, the diameter of the first pre-drill hole is 30% -50% of the target diameter, the diameter of the second pre-drill hole is 80% -90% of the target diameter, the remaining cutting amount is cut off and the drill hole with the target diameter is obtained through the third drill hole, under the condition that the processing efficiency is guaranteed, the cutting amount of the single drill hole is greatly reduced, the cutting load during drilling is reduced, the stability of the drill hole is guaranteed, the processing quality of the hole wall is improved, particularly for the PCB with the characteristics of hardness and brittleness, the PCB is drilled for three times, and the phenomenon of local fragmentation of a substrate can be prevented; in addition, when the third drilling is carried out, the drill point angle of the third drill is in the range of 110-120 degrees, compared with the existing large drill with the drill point angle in the range of 130-165 degrees, the drill point angle of the third drill is small, the main cutting edge is long, the cutting temperature can be reduced, and the durability of the cutter is high, so that when the third drill is used for final complete cutting of drilling, the generation of bonding substances due to high cutting temperature can be avoided, the hole wall quality of a target hole obtained by cutting through the third drill is ensured, and the problems of hole wall roughness and hole edge whitening are solved.
Drawings
FIG. 1 is a block diagram of a third drill bit useful in the present invention.
Fig. 2 is a structural view of a third drill of the present invention when drilling a PCB.
FIG. 3 is a block diagram of a targeting orifice made in accordance with the present invention in a first embodiment.
FIG. 4 is a structural view of a targeting orifice obtained in example two of the present invention.
FIG. 5 is a structural diagram of a targeting orifice obtained in example three of the present invention.
FIG. 6 is a structural diagram of a targeting orifice obtained in comparative example one.
FIG. 7 is a structural diagram of a targeting orifice obtained in comparative example two.
FIG. 8 is a structural diagram of a targeting orifice obtained in comparative example III.
Detailed Description
In order to explain technical contents and structural features of the present invention in detail, the following description is made with reference to the embodiments and the accompanying drawings.
Referring to fig. 1 and 2, the method for improving the whitening of the hole edge and the hole thickness of the PCB drilling hole of the present invention includes the following steps:
s1, providing a PCB3, arranging a drilling position on the PCB3, and presetting a target diameter of a drilling hole;
s2, performing primary pre-drilling at the drilling position by using a first drill bit, wherein the diameter of the primary pre-drilling is 30% -50% of the target diameter;
s3, performing secondary pre-drilling at the drilling position by using a second drill bit, wherein the diameter of the secondary pre-drilling is 80-90% of the target diameter;
and S4, drilling a hole at the drilling position to a target diameter by using the third drill bit 1 so as to obtain a target hole 2, wherein the drill point angle of the third drill bit 1 is in the range of 110-120 degrees.
As shown in fig. 1, α represents the drill point angle of the third drill 1, and α has a size in the range of 110 to 120 degrees. For example, the size of the drill tip angle of the third drill bit 1 may be 110 degrees, 111 degrees, 113 degrees, 114 degrees, 117 degrees, or 120 degrees, etc.
In the drilling process, the rotating speed and the feed speed of the drill bit are two important parameters, and the matching of the rotating speed and the feed speed of the drill bit can influence the quality of the hole wall obtained by drilling. Preferably, the rotating speed of the first drill bit, the second drill bit and the third drill bit 1 is in the range of 30Krpm-55Krpm, and the feed speed of the first drill bit, the second drill bit and the third drill bit 1 during drilling is in the range of 50IPM-65IPM, so that the hole wall quality of the drilled hole can be improved. Therefore, in S2, the rotation speed of the first drill is in the range of 30Krpm-55Krpm, and the feed speed of the first drill is in the range of 50IPM-65 IPM; in S3, the rotation speed of the second drill is in the range of 30Krpm-55Krpm, and the feed speed of the second drill is in the range of 50IPM-65 IPM; in S4, the rotation speed of the third drill bit 1 is in the range of 30Krpm to 55Krpm, and the feed speed of the third drill bit 1 is in the range of 50IPM to 65 IPM. Specifically, the first drill bit, the second drill bit and the third drill bit 1 have the same rotation speed during drilling, and the first drill bit, the second drill bit and the third drill bit 1 have the same feed speed during drilling, so as to conveniently control the drilling of the first drill bit, the second drill bit and the third drill bit 1.
With reference to fig. 3 to 8, the embodiment and the comparative example of drilling the PCB3 using the improved method of the present invention for improving the hole thickness and the hole edge whitening are as follows:
the first embodiment is as follows:
as shown in fig. 3, taking the specification of 0.7tEM-390 plate materials, 3 plate material laminated sheets and 0.15T AL cover plate for PCB3 as an example, when the diameter of the target hole 2 is 0.8mm (i.e. the target diameter is 0.8mm), the diameter of the first pre-drilling hole is 30% of the target diameter, the diameter of the second pre-drilling hole is 80% of the target diameter, and the drill point angle of the third drill bit 1 is 110 degrees, the data processed by the method for improving the thickness of the PCB drilling hole and the whitening of the hole edge of the PCB drilling hole of the present invention are as follows:
drilling quality: observing the drilling quality by using a magnifying lens more than one hundred times, wherein the thickness without holes is thick, and recording that V represents that the drill wall is smooth, and X represents that the drill wall is rough.
Example two:
as shown in fig. 4, taking the specification of 0.7tEM-390 plate materials, 3 plate material laminated sheets and 0.15T AL cover plate for PCB3 as an example, when the diameter of the target hole 2 is 0.8mm (i.e. the target diameter is 0.8mm), the diameter of the first pre-drilling hole is 30% of the target diameter, the diameter of the second pre-drilling hole is 80% of the target diameter, and the drill point angle of the third drill bit 1 is 115 degrees, the data processed by the method for improving the thickness of the PCB drilling hole and the whitening of the hole edge of the PCB drilling hole of the present invention are as follows:
drilling quality: observing the drilling quality by using a magnifying lens more than one hundred times, wherein the thickness without holes is thick, and recording that V represents that the drill wall is smooth, and X represents that the drill wall is rough.
Example three:
as shown in fig. 5, taking the specification of 0.7tEM-390 plate materials for PCB3, 3 plate material laminated sheets, and 0.15T AL for cover plate as an example, when the diameter of the target hole 2 is 0.8mm (i.e. the target diameter is 0.8mm), the diameter of the first pre-drilling hole is 30% of the target diameter, the diameter of the second pre-drilling hole is 80% of the target diameter, and the drill point angle of the third drill 1 is 120 degrees, the data of the improvement method for improving the thickness of the PCB drilling hole and the whitening of the hole edge of the PCB drilling hole of the present invention are as follows:
drilling quality: observing the drilling quality by using a magnifying lens more than one hundred times, wherein the thickness without holes is thick, and recording that V represents that the drill wall is smooth, and X represents that the drill wall is rough.
Comparative example one:
as shown in fig. 6, taking the specification of 0.7tEM-390 plate materials for PCB3, 3 plate material laminated sheets, and 0.15T AL for cover plate as an example, when the diameter of the target hole 2 is 0.8mm (i.e. the target diameter is 0.8mm), the diameter of the first pre-drilling hole is 30% of the target diameter, the diameter of the second pre-drilling hole is 80% of the target diameter, and the drill point angle of the third drill 1 is 130 degrees, the data of the improvement method for improving the thickness of the PCB drilling hole and the whitening of the hole edge are as follows:
drilling quality: observing the drilling quality by using a magnifying lens more than one hundred times, wherein the thickness without holes is thick, and recording that V represents that the drill wall is smooth, and X represents that the drill wall is rough.
Comparative example two:
as shown in fig. 7, taking the specifications of 0.7tEM-390 plate materials, 3 laminated plate materials and 0.15T AL for the PCB3 as an example, when the diameter of the target hole 2 is 0.8mm (i.e. the target diameter is 0.8mm), the diameter of the first pre-drilling hole is 30% of the target diameter, the diameter of the second pre-drilling hole is 80% of the target diameter, and the drill point angle of the third drill 1 is 165 degrees, the data of the improvement method for the coarse and whitening of the hole edge of the PCB drilling hole of the present invention are as follows:
drilling quality: observing the drilling quality by using a magnifier more than one hundred times, wherein the holes are coarse, and recording that V represents that the drilling wall is smooth, and X represents that the drilling wall is coarse.
Comparative example three:
as shown in fig. 8, taking the specification of 0.7tEM-390 plates, 3 plate lamination sheets and 0.15T AL cover plate as an example for PCB3, when the hole diameter of the target hole 2 is 0.8mm (i.e. the target diameter is 0.8mm), a drill with a large drill point angle is used for drilling once, and the drill point angle is 130 degrees, the data of the method for improving the thickness of the drilled hole and the whitening of the hole edge of the PCB according to the present invention are as follows:
drilling quality: observing the drilling quality by using a magnifier more than one hundred times, wherein the holes are coarse, and recording that V represents that the drilling wall is smooth, and X represents that the drilling wall is coarse.
Comparing the first, second and third embodiments with the first, second and third embodiments, it can be seen that the present invention adopts a three-time drilling method, in which the first and second drilling is pre-drilling and the third drilling is full drilling, and the drill point angle of the third drill bit 1 used in the third full drilling is in the range of 110-120 degrees, so as to greatly improve the quality of drilling and the problems of rough hole wall and whitening hole edge, compared with the existing large drill bit adopting the drill point angle in the range of 130-165 degrees.
In conclusion, the method for improving the coarseness and whitening of the hole of the PCB drill hole adopts a mode of three times of drilling, the first time of drilling and the second time of drilling are pre-drilling, the diameter of the first time of pre-drilling is 30% -50% of the target diameter, the diameter of the second time of pre-drilling is 80% -90% of the target diameter, the third time of drilling cuts off the rest cutting scrap and obtains the drill hole with the target diameter, under the condition of ensuring the processing efficiency, the cutting scrap of single time of drilling is greatly reduced, the cutting load during drilling is reduced, the stability of drilling is ensured, the processing quality of the hole wall is improved, especially for the PCB3 with the characteristics of hardness and brittleness, the PCB3 is drilled for three times, and the phenomenon of local fragmentation of a substrate can be prevented; in addition, during the third drilling, the drill point angle of the third drill bit 1 is in the range of 110-120 degrees, compared with the existing large drill bit with the drill point angle in the range of 130-165 degrees, the drill point angle of the third drill bit 1 is small, the main cutting edge is long, the cutting temperature can be reduced, and the durability of the cutter is high, so that when the third drill bit 1 is used for finally and completely cutting the drilled hole, the generation of bonding substances due to high cutting temperature can be avoided, the quality of the hole wall of the target hole 2 obtained by cutting the third drill bit 1 is ensured, and the problems of hole wall roughness and hole edge whitening are solved; furthermore, the rotation speed of the first drill bit, the second drill bit and the third drill bit 1 is set within the range of 30Krpm-55Krpm, and the feed speed of the first drill bit, the second drill bit and the third drill bit 1 during drilling is set within the range of 50IPM-65IPM, so that the hole wall quality of the drilled hole can be improved.
The above disclosure is only a preferred embodiment of the present invention, and should not be taken as limiting the scope of the invention, so that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention.
Claims (5)
1. A PCB drilling hole thickness and hole edge whitening improvement method is characterized by comprising the following steps:
(1) providing a PCB, arranging a drilling position on the PCB, and presetting a target diameter of a drilling hole;
(2) using a first drill bit to perform first pre-drilling at the drilling position, wherein the diameter of the first pre-drilling is 30% -50% of the target diameter;
(3) performing a second pre-drilling at the drilling location using a second drill bit, the second pre-drilling having a diameter of 80-90% of the target diameter;
(4) drilling at the drilling location to the target diameter using a third drill bit having a tip angle in a range of 110-120 degrees.
2. The method for improving PCB hole coarsening and hole edge whitening of claim 1, wherein the first drill, the second drill and the third drill rotate at the same speed during drilling.
3. The method of claim 1, wherein the first, second and third drills are rotated at a speed in a range of 30Krpm-55 Krpm.
4. The method for improving PCB hole coarsening and hole edge whitening of claim 1, wherein the feed speeds of the first drill, the second drill and the third drill are the same during drilling.
5. The method of claim 1, wherein the first, second and third drill bits have a feed rate in the range of 50IPM to 65 IPM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210650936.3A CN114932595A (en) | 2022-06-09 | 2022-06-09 | Method for improving hole thickness and hole edge whitening of PCB (printed Circuit Board) drilling hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210650936.3A CN114932595A (en) | 2022-06-09 | 2022-06-09 | Method for improving hole thickness and hole edge whitening of PCB (printed Circuit Board) drilling hole |
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| Publication Number | Publication Date |
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| CN114932595A true CN114932595A (en) | 2022-08-23 |
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| CN202210650936.3A Pending CN114932595A (en) | 2022-06-09 | 2022-06-09 | Method for improving hole thickness and hole edge whitening of PCB (printed Circuit Board) drilling hole |
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|---|---|---|---|---|
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| CN213104680U (en) * | 2020-08-06 | 2021-05-04 | 南阳鼎泰高科有限公司 | Special drill bit for improving roughness of medium and large drill hole wall |
| CN213163244U (en) * | 2020-07-07 | 2021-05-11 | 苏州梅克卡斯汽车科技有限公司 | Twist drill for machining aluminum alloy accessories |
| CN213379465U (en) * | 2020-10-16 | 2021-06-08 | 秦皇岛立中车轮有限公司 | Novel drill bit for machining aluminum alloy wheel positioning hole |
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2022
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101862843A (en) * | 2010-06-13 | 2010-10-20 | 大连太平洋多层线路板有限公司 | Drilling method of thick copper power circuit board of 5-12oz |
| KR20140057101A (en) * | 2012-11-02 | 2014-05-12 | 삼성전기주식회사 | Printed circuit board and method for manufacturing the same |
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