CN114928342B - High-isolation low-loss integrated passive miniature duplexer and application thereof - Google Patents
High-isolation low-loss integrated passive miniature duplexer and application thereof Download PDFInfo
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H7/463—Duplexers
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- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
Abstract
The invention relates to a high-isolation low-loss integrated passive miniature duplexer, which comprises a low-pass filter and a high-pass filter, wherein the low-pass filter comprises two inductors, four capacitors, two grounding blocks and two signal ports; the high-pass filter comprises five capacitors, two inductors, two grounding blocks and a signal port; the capacitors are metal-medium-metal capacitors, the inductors are annular inductors, and an air bridge structure formed by multiple layers of metals is arranged at the port of each annular inductor. The invention designs the low-pass filter and the high-pass filter through the combination of the annular inductor and the metal-medium-metal type capacitor, and designs the miniature duplexer through the combination of the low-pass filter and the high-pass filter, thereby realizing high-isolation communication based on the microwave device, realizing low-loss signal transmission at the working frequency, improving the performance of the duplexer and greatly reducing the size of the device.
Description
Technical Field
The invention relates to the technical field of microwave communication, in particular to a high-isolation low-loss integrated passive micro duplexer and application thereof.
Background
Electronic devices are an indispensable part of people's daily lives, but as the variety of electronic devices increases, a series of problems also occur. Different electronic devices have different operating frequencies and therefore cannot share a common communication channel, and only a separate communication channel can be established for each device, but this greatly increases the communication cost. Therefore, in order to reduce the communication cost, a duplexer is often used to solve the above-mentioned problems.
A diplexer is a passive device that can implement frequency division multiplexing and is typically reciprocal, i.e., the device itself has no input or output concept. When the duplexer works, the frequencies on the two ports are multiplexed to one port, and signals on the two ports occupy disjoint frequency bands, so that the signals on the two ports can coexist on the third port and cannot interfere with each other, and a common communication channel can be shared through the duplexer. The diplexer generally multiplexes the frequencies of two ports to one port, or may multiplex to more than two ports, and the three-port to one-port multiplexer is called a triplexer, and the four-port to one-port multiplexer is a quadruplex.
There are many kinds of diplexers currently applied to mobile communication terminals, and there are waveguide diplexers, coaxial diplexers, dielectric diplexers, and SAW diplexers in common. The waveguide duplexer is the duplexer which is applied to the communication field at the earliest, has wider application, but has large volume, high cost and very difficult tuning; the coaxial duplexer has lower power loss and good practicability, but the application in electronic equipment is difficult due to the larger volume, and based on the defect, the improved spiral coaxial duplexer has the advantages that the size is greatly reduced, and the quality factor Q value of the coaxial duplexer is also reduced; the dielectric duplexer is composed of a dielectric filter, the dielectric constant of the dielectric material is tens of times higher than that of an air medium, miniaturization can be realized, the performance of the duplexer is improved, and the dielectric duplexer is widely used at present; the SAW duplexer is a transduction type passive band-pass filter which is made by utilizing the piezoelectric effect of the piezoelectric quartz crystal oscillator material and the physical characteristics of acoustic surface wave propagation, can inhibit the interference of the problems of higher harmonic waves, mirror image information, emission leakage signals, various parasitic clutters and the like of electronic equipment, and can realize the filtering of amplitude-frequency characteristics and phase-frequency characteristics of any required precision. The integrated passive micro-duplexer is a novel process, and the process is widely used in the design of passive devices such as microwave sensors at present, so that the design of the integrated passive micro-duplexer with high isolation and low loss is particularly important.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to overcome the problems existing in the prior art, and provide a high-isolation low-loss integrated passive micro duplexer and application thereof, wherein a low-pass filter and a high-pass filter are designed through the combination of a toroidal inductor and a metal-medium-metal type capacitor, and the micro duplexer is designed through the combination of the low-pass filter and the high-pass filter, so that high-isolation communication based on a microwave device is realized, low-loss signal transmission can be realized under the working frequency, the performance of the duplexer is improved, and meanwhile, the size of the device is greatly reduced; the method provides an effective solution for the application of the micro-duplexer in duplex communication, and is helpful for promoting the exploration and application of the micro-duplexer in duplex communication.
In order to solve the technical problems, the present invention provides a high-isolation low-loss integrated passive micro duplexer, comprising:
the low-pass filter comprises a first inductor, a second inductor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first signal port and a second signal port, wherein the first inductor and the first capacitor are connected in parallel, one end of the first inductor is connected with the first signal port, the other end of the first inductor is connected with the second capacitor and grounded, the end connected with the second capacitor is simultaneously connected with one end of the second inductor and the third capacitor after being connected in parallel, the other end of the second inductor and the third capacitor after being connected in parallel is connected with the fourth capacitor and grounded, and the end connected with the fourth capacitor is simultaneously connected with the second signal port;
the high-pass filter comprises a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a ninth capacitor, a third inductor, a fourth inductor and a third signal port, wherein one end of the fifth capacitor is connected with the first signal port, the other end of the fifth capacitor is connected with one end of the third inductor and the sixth capacitor which are connected in series, the end of the third inductor and the end of the sixth capacitor which are connected in series are simultaneously connected with one end of the seventh capacitor, and the other end of the seventh capacitor is connected with one end of the fourth inductor and the eighth capacitor which are connected in series; the end of the fourth inductor and the eighth capacitor which are connected in series is connected with one end of the ninth capacitor, the other end of the ninth capacitor is connected with a third signal port, the third inductor and the sixth capacitor are connected in series and then grounded, and the fourth inductor and the eighth capacitor are connected in series and then grounded;
the first capacitor, the second capacitor, the third capacitor, the fourth capacitor, the fifth capacitor, the sixth capacitor, the seventh capacitor, the eighth capacitor and the ninth capacitor are all metal-medium-metal type capacitors; the first inductor, the second inductor, the third inductor and the fourth inductor are annular inductors.
In one embodiment of the invention, an air bridge structure is provided at the port of the toroidal inductor, the air bridge structure being composed of multiple layers of metal.
In one embodiment of the invention, the toroidal inductor comprises a toroidal metal wire and a rectangular metal wire, wherein when the toroidal metal wire is manufactured, a gap is formed by cutting off a place where the toroidal metal wire and the rectangular metal wire cross, a first layer of metal is laid on the toroidal metal wire, the rectangular metal wire is unchanged, a second layer of metal is laid on the toroidal metal wire and all the toroidal metal wires are communicated, and the rectangular metal wire is unchanged, so that the toroidal inductor with the air bridge structure is manufactured.
In one embodiment of the invention, the metal-dielectric-metal type capacitor comprises a first polar plate, a dielectric layer and a second polar plate which are arranged in a stacked manner.
In one embodiment of the present invention, when the metal-dielectric-metal type capacitor is manufactured, a first layer of metal is manufactured, a first rectangular port is manufactured to be connected with the first layer of metal to serve as a second polar plate, a layer of silicon nitride is manufactured to serve as a dielectric layer in an effective area of the second polar plate, a second layer of metal is manufactured on the silicon nitride, and a second rectangular port is manufactured to be connected with the second layer of metal to serve as a first polar plate, so that the metal-dielectric-metal type capacitor is manufactured.
In one embodiment of the present invention, the low-pass filter further includes a first grounding block and a second grounding block, the grounding end after the first inductor and the first capacitor are connected in parallel is connected to the first grounding block, and the grounding end after the second inductor and the third capacitor are connected in parallel is connected to the second grounding block.
In one embodiment of the present invention, the high pass filter further includes a third ground block and a fourth ground block, the third inductor and the sixth capacitor are connected in series and then connected to the third ground block, and the fourth inductor and the eighth capacitor are connected in series and then connected to the fourth ground block.
In one embodiment of the invention, the inductance value in the low-pass filter is calculated as follows:
ω C ＝2πf C
wherein L represents inductance, Ω C Represents the cut-off frequency, gamma 0 Represents the impedance scale factor, g represents the inductance value, ω, of the prototype series-parallel inductor C Represents the angular cut-off frequency, Z 0 Represents port impedance, g 0 Represents the source conductance, f C Indicating the operating frequency.
In one embodiment of the invention, the capacitance value in the low pass filter is calculated as follows:
ω C ＝2πf C
wherein C represents capacitance, Ω C Represents the cut-off frequency, g represents the capacitance value of the prototype series-parallel capacitor, gamma 0 Represents the impedance scale factor, omega C Represents the angular cut-off frequency, Z 0 Represents port impedance, g 0 Represents the source conductance, f C Indicating the operating frequency.
In one embodiment of the present invention, the inductance value in the high-pass filter is calculated as follows:
wherein L represents inductance, gamma 0 Represents the impedance scale factor, omega C Represents the angular cut-off frequency, Ω C Represents the cut-off frequency and g represents the inductance value of the prototype parallel-series inductor.
In one embodiment of the invention, the capacitance value in the high pass filter is calculated as follows:
wherein C represents capacitance, Ω C Represents the cut-off frequency, gamma 0 Represents the impedance scale factor, omega C Represents the angular cut-off frequency and g represents the capacitance value of the prototype parallel-series capacitor.
In addition, the invention also provides an application of the high-isolation low-loss integrated passive micro-duplexer in duplex communication.
Compared with the prior art, the technical scheme of the invention has the following advantages:
1. the low-pass filter and the high-pass filter are designed through the combination of the annular inductor and the metal-medium-metal type capacitor, and the miniature duplexer is designed through the combination of the low-pass filter and the high-pass filter, so that high-isolation communication based on a microwave device is realized, low-loss signal transmission can be realized under the working frequency, the performance of the duplexer is improved, and meanwhile, the size of the device is greatly reduced;
2. the invention provides an effective solution for the application of the micro-duplexer in duplex communication, and is helpful for promoting the exploration and application of the micro-duplexer in duplex communication.
Drawings
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings.
Fig. 1 is an equivalent circuit diagram of an integrated passive micro-duplexer of the present invention;
FIG. 2 is a schematic diagram of a planar layout structure of the integrated passive micro-duplexer of the present invention;
FIG. 3 is a schematic diagram of a partial structure of an integrated passive micro-duplexer of the present invention;
FIG. 4 is a chart of S-parameter testing of the integrated passive micro-diplexer of the present invention;
FIG. 5 is a schematic diagram of a planar layout structure of the low-pass filter of the present invention;
FIG. 6 is a chart of S-parameter test of the low pass filter of the present invention;
FIG. 7 is a schematic diagram of a planar layout of the high pass filter of the present invention;
fig. 8 is an S-parameter test chart of the high-pass filter of the present invention.
Wherein reference numerals are as follows: 1. an inductance; 2. a capacitor; 3. a grounding block; 4. a signal port; 5. a first plate; 6. a dielectric layer; 7. a second polar plate; 8. an air bridge structure.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
Referring to fig. 1 to 3, an embodiment of the present invention provides a high-isolation low-loss integrated passive micro duplexer, which includes a low-pass filter and a high-pass filter, wherein the low-pass filter includes two inductors 1, four capacitors 2, two grounding blocks 3 and two signal ports 4; the high-pass filter comprises five capacitors 2, two inductors 1, two grounding blocks 3 and a signal port 4; the capacitors 2 are metal-medium-metal capacitors, the inductors 1 are annular inductors, and air bridge structures 8 formed by multiple layers of metals are arranged at the ports of the annular inductors.
Specifically, the inductance in the low-pass filter is sequentially recorded as a first inductance L1 and a second inductance L2 from left to right, the capacitance is sequentially recorded as a first capacitance C1, a second capacitance C2, a third capacitance C3 and a fourth capacitance C4 from left to right, the signal Port is sequentially recorded as a first signal Port1 and a second signal Port2 from left to right, the first inductance L1 and the first capacitance C1 are connected in parallel, one end of the first inductance L1 is connected with the first signal Port1, the other end of the first inductance L1 is connected with the second capacitance C2 and is connected with a first grounding block, the end of the second capacitance C2 is connected with one end of the second capacitance C2 which is connected with the third capacitance C3 in parallel, the other end of the second inductance L2 and the third capacitance C3 which is connected with the fourth capacitance C4 is connected with the second grounding block, and the end of the fourth capacitance C4 is connected with the second signal Port2; the inductor in the high-pass filter is sequentially marked as a third inductor L3 and a fourth inductor L4, the capacitor is sequentially marked as a fifth capacitor C5, a sixth capacitor C6, a seventh capacitor C7, an eighth capacitor C8 and a ninth capacitor C9, one end of the fifth capacitor C5 is connected with the first signal Port1, the other end of the fifth capacitor C5 is connected with one end of the third inductor L3 and the sixth capacitor C6 after being connected in series, the end of the third inductor L3 and the end of the sixth capacitor C6 after being connected in series are simultaneously connected with one end of the seventh capacitor C7, and the other end of the seventh capacitor C7 is connected with one end of the fourth inductor L4 and the eighth capacitor C8 after being connected in series; and the end of the fourth inductor L4 and the eighth capacitor C8 which are connected in series is connected with one end of the ninth capacitor C9, the other end of the ninth capacitor C9 is connected with the third signal Port3, the third inductor L3 and the sixth capacitor C6 are connected in series and then connected with the third grounding block, and the fourth inductor L4 and the eighth capacitor C8 are connected in series and then connected with the fourth grounding block.
The first capacitor C1, the second capacitor C2, the third capacitor C3, the fourth capacitor C4, the fifth capacitor C5, the sixth capacitor C6, the seventh capacitor C7, the eighth capacitor C8 and the ninth capacitor C9 are all metal-dielectric-metal type capacitors 2; the first inductor L1, the second inductor L2, the third inductor L3 and the fourth inductor L4 are all annular inductors 1, and an air bridge structure 8 formed by multiple layers of metals is arranged at the port of the annular inductors 1.
The invention designs the low-pass filter and the high-pass filter through the combination of the annular inductor 1 and the metal-medium-metal type capacitor 2, and designs the miniature duplexer through the combination of the low-pass filter and the high-pass filter, thereby realizing high-isolation communication based on a microwave device, realizing low-loss signal transmission at the working frequency, improving the performance of the duplexer and greatly reducing the size of the device.
The miniature duplexer provided by the embodiment adopts the processing technology of an integrated passive device to design a metal transmission line, a toroidal inductor 1 and a metal-medium-metal type capacitor 2, combines an air bridge structure 8 and an optimized parallel-serial connection mode, improves the integration level of the duplexer, can greatly reduce the size of the device, consists of a low-pass filter and a high-pass filter transformed by an elliptic function prototype filter, wherein the inductance value and the capacitance value of the elliptic function prototype low-pass filter can be determined by the following equation,
ω C ＝2πf C
wherein L represents inductance, C represents capacitance, Ω C Represents the cut-off frequency, gamma 0 Representing the impedance scale factor, solving the inductance value of the prototype series-parallel inductor by g in the inductance formula, and solving the capacitance value of the prototype series-parallel capacitor by g in the capacitance formula, ω C Represents the angular cut-off frequency, Z 0 Represents port impedance, g 0 Represents the source conductance, f C Indicating the operating frequency.
The inductance and capacitance values of the elliptic function prototype high-pass filter can be determined by the following equation,
wherein L represents inductance, C represents capacitance, gamma 0 Represents the impedance scale factor, omega C Indicating angular cut-off frequencyRate, Ω C And (3) expressing the cut-off frequency, solving the inductance value of the prototype parallel-series inductor by g in an inductance formula, and solving the capacitance value of the prototype parallel-series capacitor by g in a capacitance formula.
The plane layout structure schematic diagram of the miniature duplexer is shown in fig. 2, the whole miniature duplexer comprises a low-pass filter and a high-pass filter, and the size of the device is reduced by adopting a resonance mode with a small number of annular inductors 1 in the structure of the whole device; in the structure of a single device, a plurality of layers of metal are designed at the port of the annular inductor 1 to form an air bridge structure 8, so that the three-dimensional design of the device is realized, the design error is reduced, a new thought is provided for the three-dimensional overlapping design of the device, and the size of the microwave passive device is expected to be further reduced. The partial structure schematic diagram of the integrated passive micro-duplexer is shown in fig. 3, and shows that the air bridge structure 8 at the port of the toroidal inductor 1 is adopted at both ports, so that the connection mode of the toroidal inductor 1 and the metal-dielectric-metal type capacitor 2 in parallel is optimized, the capacitor 2 is connected inside the inductor 1 coil, the space is fully utilized, the length of a metal wire is shortened, the partial size of a low-pass filter is reduced, the size of the duplexer is further reduced, and the integration level of the duplexer is improved.
Fig. 1 is an equivalent circuit diagram of an integrated passive micro duplexer of the present invention, a low-pass filter is connected to a signal Port1 and a signal Port2, wherein after an inductor L1 and a capacitor C1 are connected in parallel, one end is connected to the signal Port1, the other end is connected to the capacitor C2 to be grounded, and simultaneously, one end of the inductor L2 and the capacitor C3 are connected in parallel, and the other end of the inductor L2 and the capacitor C3 is connected to the capacitor C4 to be grounded, and simultaneously, the inductor L1 and the capacitor C1 are connected to the signal Port2; the high pass filter is connected to the signal Port1 and the signal Port3, wherein one end of the capacitor C5 is connected to the signal Port1, the other end is connected to the inductor L3 and the capacitor C6 in series and then grounded, and simultaneously connected to one end of the capacitor C7, the other end of the capacitor C7 is connected to the inductor L4 and the capacitor C8 in series and then grounded, and simultaneously connected to one end of the capacitor C9, and the other end of the capacitor C9 is connected to the signal Port2. When the device works, low-frequency signals are communicated between the signal ports 1 and 2, and high-frequency signals are communicated between the signal ports 1 and 3 without mutual interference.
As shown in FIG. 4, the S parameter test chart of the integrated passive micro-duplexer shows that at the frequencies of 0.9GHz and 1.8GHz, the insertion loss of the duplexer, namely S21 and S31, is very small, which proves that the communication performance is very good at the two working frequencies and almost can completely pass through, and the return loss of the duplexer, namely S11, is relatively large, which proves that most of signals can pass through the signal Port2 and the signal Port3 at the two working frequencies, and almost no signals return to the signal Port1, namely the designed duplexer has the characteristic of low loss. The isolation of the duplexer, namely S32, is larger, which indicates that almost no signal passes between the signal Port2 and the signal Port3 under the two working frequencies, and in the design process of the duplexer, the low-pass filter is improved, and one capacitor between the signal Port1 and the low-pass filter is omitted, so that the isolation between the signal Port2 and the signal Port3 can be increased, the two ports are not mutually influenced and mutually not interfered, and the duplexer has the characteristic of high isolation.
The design method of the low-pass filter is as follows:
in order to reduce design errors and facilitate connection of circuits, the invention designs the air bridge structure 8 for the internal interface of the loop inductor 1 coil, and connects the loop inductor 1 to the outside of the coil in a non-contact manner on the basis of not influencing the inductance value of the loop inductor 1, thereby reducing errors possibly generated in the use process of the loop inductor 1.
The low-pass filter is connected with the signal Port1 and the signal Port2, wherein after the inductor L1 and the capacitor C1 are connected in parallel, one end is connected with the signal Port1, the other end is connected with the capacitor C2 in ground, meanwhile, one end is connected with the inductor L2 and the capacitor C3 in parallel, and the other end is connected with the capacitor C4 in ground, and meanwhile, the other end is connected with the signal Port2. Wherein the inductance L1 is composed of 6.375 turns of annular metal wire, a single line width of 15 μm, a line spacing of 15 μm, an inner diameter of 50 μm and an outer diameter of 230 μm. The inductance L2 consists of 4.5 turns of annular metal wire, a single line width of 15 μm, a line spacing of 15 μm, an inner diameter of 125 μm and an outer diameter of 245 μm. The effective area of the capacitor C1 is 25 multiplied by 25.158 mu m, the effective area of the capacitor C2 is 200 multiplied by 83.438 mu m, the effective area of the capacitor C3 is 25 multiplied by 72.982 mu m, the effective area of the capacitor C4 is 100 multiplied by 92.099 mu m, and the line widths at both ends of the capacitor are 20 mu m. The grounding of the capacitor C2 and the capacitor C4 is designed to be a square block with the size of 100 multiplied by 100 mu m, so that the square block is conveniently grounded, the quality factor of the inductor can be improved by determining the values, and the loss of the capacitor is reduced.
One capacitor grounding structure is omitted in the design of the low-pass filter, the isolation between the signal Port2 and the signal Port3 can be increased through the design, the performance of the duplexer is improved, and the low-pass filter can be applied to more complex and higher-requirement environments. In order to solve the problem that the volume of the duplexer is too large, the invention improves the parallel connection mode of the capacitor 2 and the inductor 1 through the air bridge structure 8, and provides a connection mode of designing the capacitor 2 in a blank area in the middle of the annular inductor 1, so that the volume of the low-pass filter can be reduced by half, and the size of the duplexer is reduced.
The design method of the toroidal inductor 1 and the air bridge comprises the following steps: firstly, a layer of 5 mu m metal is arranged on a gallium arsenide substrate where the toroidal inductor 1 is manufactured, a gap is formed by cutting off the intersection of the toroidal metal wire and the rectangular metal wire, then only a layer of 3 mu m metal is arranged on the toroidal metal wire, the rectangular metal wire is unchanged, finally, a layer of 2 mu m metal is arranged on the toroidal metal wire and all the toroidal metal wires are communicated, the rectangular metal wire is unchanged, and the toroidal inductor 1 with an air bridge is designed. The design can reduce the size of the duplexer and simultaneously provides a new connection mode for the parallel connection of the annular inductor and the metal-dielectric-metal type capacitor.
The design method of the high-pass filter is as follows:
the high pass filter is connected to the signal Port1 and the signal Port3, wherein one end of the capacitor C5 is connected to the signal Port1, the other end is connected to the inductor L3 and the capacitor C6 in series and then grounded, and simultaneously connected to one end of the capacitor C7, the other end of the capacitor C7 is connected to the inductor L4 and the capacitor C8 in series and then grounded, and simultaneously connected to one end of the capacitor C9, and the other end of the capacitor C9 is connected to the signal Port2. Wherein the inductance L3 is composed of 3.25 turns of annular metal wires, the single line width is 15 μm, the line spacing is 15 μm, the inner diameter is 100 μm, and the outer diameter is 190 μm. The inductance L4 consisted of 3.5 turns of annular metal wire with a single line width of 15 μm, a line spacing of 15 μm, an inner diameter of 100 μm and an outer diameter of 190 μm. The effective area of the capacitor C5 is 56.267 ×100 μm, the effective area of the capacitor C6 is 235× 223.572 μm, the effective area of the capacitor C7 is 50× 67.608 μm, the effective area of the capacitor C8 is 200× 137.56 μm, the effective area of the capacitor C9 is 100× 60.695 μm, and the line widths of both ends of the capacitor are 20 μm. The grounding of the capacitor C6 and the capacitor C8 is designed to be a square block with the size of 100 multiplied by 100 mu m, so that the square block is conveniently grounded, the quality factor of the inductor can be improved by determining the values, and the loss of the capacitor is reduced.
The design method of the metal-dielectric-metal type capacitor 2 comprises the following steps: firstly, a layer of 5 mu m metal is arranged on a gallium arsenide substrate, meanwhile, a rectangular port is arranged and connected together to serve as a second pole plate 7 (lower pole plate) of the capacitor 2, next, a layer of silicon nitride is arranged and connected on an effective area of the second pole plate 7 to serve as a dielectric layer 6 of the capacitor 2, finally, a layer of 5 mu m metal is arranged on the silicon nitride, meanwhile, a rectangular port is grown and connected together to serve as a first pole plate 5 (upper pole plate) of the capacitor 2, so that the three-dimensional capacitor 2 with a metal-dielectric-metal structure is designed, and meanwhile, the method is applicable to all shapes of metal-dielectric-metal capacitors 2, and is not limited to rectangular, circular, diamond, polygonal and the like.
The low-pass filter and the high-pass filter can be combined together to form the high-isolation low-loss integrated passive micro duplexer, in the whole design, the width of a transmission line is 20 mu m, the size of each signal port is 100 multiplied by 137.604 mu m, the size is calculated by simulation software Advanced Design System 2020, 50 omega matching can be better carried out on the size, the device can be conveniently combined with other devices, the device can be directly connected together, and errors caused by the combination are very small and can be ignored.
In a preferred embodiment, fig. 5 shows a schematic plan layout structure of the low-pass filter of the present invention, where the low-pass filter includes two toroidal inductors 1, five metal-medium-metal capacitors 2, three grounding blocks 3 and two signal ports 4, and the structure adopts a series-parallel resonance mode, so that the number of inductors in the circuit can be reduced, and the overall size of the low-pass filter is further reduced, and at the same time, when the shunt capacitors 2 obtain transmission zero points, a larger series impedance is generated when the shunt capacitors resonate under the high frequency condition, so as to prevent signal transmission.
The inductance value and the capacitance value of the low-pass filter can be determined through calculation by the equation, and the omitted capacitance value in the low-pass filter is 3.46pF, and the capacitance C1 is: 0.23pF, capacitance C2:5.71pF, capacitance C3:0.64pF, capacitance C4:3.11pF, inductance L1:10.29nH, inductance L2:9.1nH. In the schematic plan layout structure of fig. 5, the capacitor adopts a metal-dielectric-metal type structure, the omitted capacitor structure in the low-pass filter has a size of 53×203 μm, the inductor adopts a circular toroidal inductor structure, and the line width and the line spacing are both 15 μm. Preferably, these values reduce the insertion loss of the low pass filter, ensuring that the signal passes as completely as possible; the return loss of the low-pass filter is increased, and the return of signals from an input port is reduced as much as possible; the isolation of the diplexer is increased.
The frequency response results of the low-pass filter are shown in fig. 6, the transmission poles are respectively 0.615GHz and 0.957GHz, the transmission zeros are respectively 2.085GHz and 3.272GHz, the positions of the transmission poles can ensure that the low-pass filter normally works at the frequency of 0.9GHz, meanwhile, the transmission zeros can prevent signal transmission at high frequency, and the low-pass filter can realize five-order low-pass frequency response and has good performance. The frequency band of 0.9GHz is very widely used in wireless electromagnetic communication, and has been used since the original GSM communication system. From 1G of wireless communication to present 5G to future 6G, the frequency of the used wireless electromagnetic wave is continuously increased, the frequency band is continuously widened, but the initial wave band is also continuously used, so that the low-pass filter has a great application prospect in the field of wireless electromagnetic wave communication. The low pass filter may also be used to filter high frequency noise signals from the circuit, which may be blocked from removal as the signals pass through the low pass filter.
In a preferred embodiment, fig. 7 is a schematic plan layout of a high-pass filter of the present invention, which includes two toroidal inductors 1, five metal-dielectric-metal capacitors 2, two ground blocks 3, and two signal ports 4. The design of the high-pass filter is obtained by inversely transforming the inductance 1 and the capacitance 2 elements in the low-pass filter structure, so that the size of the whole device is reduced in order to reduce the number of the inductance 1 elements in the circuit, the design of the circuit adopts a parallel-series resonance mode, five inductances 1 are changed into two inductances 1 after transformation, and simultaneously the structures of the parallel inductances 1 and the capacitance 2 obtain transmission zero points, so that the transmission of signals is prevented by generating larger parallel impedance when resonance is performed under the condition of low frequency, and the five-order elliptic function high-pass filter is formed.
The inductance value and the capacitance value of the high-pass filter can be determined through calculation of the equation, and the values of all devices in the high-pass filter are as follows, and the capacitance C5 is as follows: 1.95pF, capacitance C6:28.99pF, capacitor C7:1.18pF, capacitance C8:10.59pF, capacitance C9:2.17pF, inductance L3:4.1nH, inductance L4:4.64nH. Preferably, these values reduce the insertion loss of the high pass filter, ensuring that the signal passes as completely as possible; the return loss of the high-pass filter is increased, and the return of signals to the input port is reduced as much as possible; the performance of the transmission zero point is optimized, and the isolation degree of the duplexer is improved.
The frequency response results of the high-pass filter are shown in fig. 8, the transmission poles are 1.569GHz and 2.435GHz respectively, the transmission zeros are 0.462GHz and 0.718GHz respectively, the positions of the transmission poles can ensure that the high-pass filter works normally under the frequency of 1.8GHz, meanwhile, the transmission zeros can prevent signal transmission under the low frequency, and the high-pass filter can realize five-order high-pass frequency response, and has high sensitivity and good performance. The 1.8GHz frequency band wireless communication plays a significant role in the field of automatic power distribution, and domestic radio frequency application is mainly divided into three bands: 0.223-0.235GHz, 1.427-1.525GHz and 1.785-1.805GHz, wherein 0.223-0.235GHz is transmitted by a power grid company with 25kHz as a frequency point; a part of frequency points in 1.427-1.525GHz are used as microwaves by part of power grid companies; only some sporadic bands of 1.785-1.805GHz are applied. The coverage range of the power wireless broadband private network is basically identical with the power supply range of the 110kV transformer substation, and a TD-LTE wireless communication network based on 1.8GHz is built in China, so that the power wireless broadband private network is a wireless broadband with the largest power industry standard, and covers the scenes of open areas of dense urban areas and suburban areas, emergency exercise points and the like. Therefore, the 1.8GHz high-pass filter with optimized performance has a great application prospect in the power wireless communication technology, and can further enlarge the coverage range of the area and improve the stability of power grid communication.
Corresponding to the embodiment of the high-isolation low-loss integrated passive micro-duplexer, the embodiment of the invention also provides an application of the high-isolation low-loss integrated passive micro-duplexer in duplex communication.
In a preferred embodiment, the present invention utilizes an integrated passive device fabrication process to design a miniature five-stage duplexer that allows bi-directional (duplex) communications in a single path, in radar and radio communication systems, that isolates the receiver from the transmitter while allowing them to share a common antenna, that can function in many radio repeater systems, operating on a frequency, polarization or timing basis. The duplexer designed by the invention can be composed of a five-order elliptic function low-pass filter and a five-order elliptic function high-pass filter so as to isolate a receiver from a transmitter. The total circuit size is 2236 multiplied by 1966 mu m, the working frequency is 0.9GHz and 1.8GHz, the insertion loss of the two working frequency bands is 0.003dB and 0.001dB, the insertion loss is the loss of a passband frequency point to a useful signal in a signal channel corresponding to the working frequency, the smaller the loss is, the smaller the in-band fluctuation is, the easier the signal passes through, and the designed loss is smaller than 0.01dB, so that the aim of low loss is fulfilled; the isolation is 39.439dB and 43.197dB respectively, the isolation refers to the stop band attenuation of the low-pass filter and the high-pass filter, the stop band attenuation in the receiving channel and the transmitting channel of the general duplexer is equivalent, under the condition of small isolation, signals can pass through the two channels, and under the condition of large isolation, the signals can only pass through the own channel, and the designed isolation is more than 35dB, so that the aim of high isolation is fulfilled, and the working efficiency of the duplexer can be improved to a great extent. The invention utilizes the processing technology of the integrated passive device, can greatly reduce the size of the passive device, increases the design precision and the design flexibility by combining the annular inductor with the metal-medium-metal type capacitor, has stable structure and smaller influence by environment, realizes three-dimensional design to a certain extent, can be easily integrated with other devices through a jumper wire, is beneficial to improving the integration level of a radio frequency circuit and increases the performance of the radio frequency circuit.
When the high-isolation low-loss integrated passive micro-duplexer is applied to duplex communication, the invention provides an effective solution for the application of the micro-duplexer in duplex communication, and is beneficial to the exploration and application of the micro-duplexer in duplex communication.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.
Claims (6)
1. A high isolation low loss integrated passive micro-duplexer, comprising:
the low-pass filter comprises a first inductor, a second inductor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a first signal port and a second signal port, wherein the first inductor and the first capacitor are connected in parallel, one end of the first inductor is connected with the first signal port, the other end of the first inductor is connected with the second capacitor and grounded, one end of the second capacitor is connected with one end of the second capacitor, which is connected with the second inductor and the third capacitor in parallel, the other end of the second capacitor is connected with the fourth capacitor and grounded, and the end of the second capacitor is connected with the fourth capacitor and the second signal port;
the high-pass filter comprises a fifth capacitor, a sixth capacitor, a seventh capacitor, an eighth capacitor, a ninth capacitor, a third inductor, a fourth inductor and a third signal port, wherein one end of the fifth capacitor is connected with the first signal port, the other end of the fifth capacitor is connected with one end of the third inductor and the sixth capacitor which are connected in series, the end of the third inductor and the end of the sixth capacitor which are connected in series are simultaneously connected with one end of the seventh capacitor, and the other end of the seventh capacitor is connected with one end of the fourth inductor and the eighth capacitor which are connected in series; the end of the fourth inductor and the eighth capacitor which are connected in series is connected with one end of the ninth capacitor, the other end of the ninth capacitor is connected with a third signal port, the third inductor and the sixth capacitor are connected in series and then grounded, and the fourth inductor and the eighth capacitor are connected in series and then grounded;
the first capacitor, the second capacitor, the third capacitor, the fourth capacitor, the fifth capacitor, the sixth capacitor, the seventh capacitor, the eighth capacitor and the ninth capacitor are all metal-medium-metal type capacitors; the first inductor, the second inductor, the third inductor and the fourth inductor are annular inductors;
an air bridge structure is arranged at the port of the annular inductor, and the air bridge structure is formed by multiple layers of metals;
the annular inductor comprises annular metal wires and rectangular metal wires, when the annular inductor is manufactured, the intersection of the annular metal wires and the rectangular metal wires is broken to form gaps, a first layer of metal is arranged on the annular metal wires, the rectangular metal wires are unchanged, a second layer of metal is arranged on the annular metal wires, all the annular metal wires are communicated, the rectangular metal wires are unchanged, and the annular inductor with the air bridge structure is manufactured;
the metal-dielectric-metal type capacitor comprises a first polar plate, a dielectric layer and a second polar plate which are arranged in a stacked manner;
when the metal-medium-metal type capacitor is manufactured, a first layer of metal is manufactured, a first rectangular port is manufactured to be connected with the first layer of metal to serve as a second polar plate, a layer of silicon nitride is manufactured in an effective area of the second polar plate to serve as a medium layer, a second layer of metal is manufactured on the silicon nitride, and a second rectangular port is manufactured to be connected with the second layer of metal to serve as the first polar plate, so that the metal-medium-metal type capacitor is manufactured;
the high-isolation low-loss integrated passive miniature duplexer adopts the processing technology of an integrated passive device to design a metal transmission line, a toroidal inductor and a metal-medium-metal capacitor, and is connected in parallel-series by combining an air bridge structure.
2. The high isolation low loss integrated passive micro-duplexer of claim 1, wherein: the low-pass filter further comprises a first grounding block and a second grounding block, wherein the grounding end of the first inductor and the first capacitor after being connected in parallel is connected with the first grounding block, and the grounding end of the second inductor and the third capacitor after being connected in parallel is connected with the second grounding block.
3. The high isolation low loss integrated passive micro-duplexer of claim 1, wherein: the high-pass filter further comprises a third grounding block and a fourth grounding block, wherein the third inductor and the sixth capacitor are connected in series and then connected with the third grounding block, and the fourth inductor and the eighth capacitor are connected in series and then connected with the fourth grounding block.
4. The high isolation low loss integrated passive micro-duplexer of claim 1, wherein: the inductance and capacitance values in the low-pass filter are calculated as follows:
ω c ＝2mf c
wherein L represents inductance, C represents capacitance, Ω C Representing the cut-off frequency, solving the inductance value of the prototype series-parallel inductor by g in the inductance formula, and solving the capacitanceG in the formula represents the capacitance value of the prototype series-parallel capacitor, gamma 0 Represents the impedance scale factor, omega C Represents the angular cut-off frequency, Z 0 Represents port impedance, g 0 Represents the source conductance, f C Indicating the operating frequency.
5. The high isolation low loss integrated passive micro-duplexer of claim 1, wherein: the inductance and capacitance values in the high pass filter are calculated as follows:
wherein L represents inductance, C represents capacitance, Ω C Represents the cut-off frequency, gamma 0 Represents the impedance scale factor, omega C And (3) expressing the angular cutoff frequency, solving the inductance value of the prototype parallel-series inductor by g in an inductance formula, and solving the capacitance value of the prototype parallel-series capacitor by g in a capacitance formula.
6. Use of a high isolation low loss integrated passive micro-duplexer according to any of claims 1 to 5 in duplex communication.
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