CN114927448A - Wafer dividing and guiding equipment and working method thereof - Google Patents

Abstract

The application discloses wafer dividing and guiding equipment and a working method thereof, wherein the working method of the wafer dividing and guiding equipment comprises the following steps: forming a first carrying position on the carrying seat for carrying a wafer boat containing wafers to be separated; the wafer boat loaded on the first loading position drives a stop block to move through a belt moving assembly so as to avoid a space for separately guiding the movement of a sub-guide arm loaded on the wafer boat, wherein the stop block is arranged to extend along the arrangement direction of a plurality of sub-guide arms, the stop block is arranged on the loading seat in a manner that the stop block can be driven by the belt moving assembly and can be switched between a state of moving away from a moving path of a push-guide end and a state of returning to the moving path of the push-guide end, and each sub-guide arm corresponds to a wafer of a first placing groove of the wafer boat; and pushing the guide dividing arm to divide and derive the wafers which correspond to the pushed guide dividing arm and are positioned in the first placing groove of the wafer bearing boat.

Description

Wafer dividing and guiding equipment and working method thereof

Technical Field

The invention relates to the field of semiconductor equipment, in particular to wafer dividing and guiding equipment and a working method thereof.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material of which is silicon, and the cassette is a commonly used wafer storage device. The wafer cassette generally stores batch wafers, after all wafers in a wafer cassette are put into production, the produced wafers need to be detected so as to screen the wafers, if unqualified wafers exist in the wafer cassette, products which pass the detection in the wafer cassette need to be sliced and delivered, the batch wafers are stored in the wafer cassette, the wafers in the middle and the bottom of the wafers are shielded by the wafers at the top, and therefore the target wafers can be moved out of other wafer cassettes only by manually taking out the wafers at the top one by one, and the efficiency is low.

The boat is produced by a number of different processes that place the wafers in different environments, and therefore the boat carrying the wafers needs to be separated according to the different process environments. For example, when a wafer boat needs to be baked during production, a common wafer boat box cannot meet the temperature requirement in the baking process, a part of wafers in the common wafer boat box needs to be transferred to a wafer boat box special for the baking process, and if the wafers in the wafer boat box are respectively led into the special wafer boat boxes one by one, the efficiency is too low, which is not favorable for production.

Some automatic wafer dividing and guiding machines are available on the market, but each boat storing wafers has difference in length and height, and the wafers are easily damaged by small force. Therefore, when the wafer is guided out, the guiding device needs to be aligned with the wafer, otherwise, the wafer is easily damaged due to uneven stress, so that when the automatic machine is used, a large amount of time is needed for debugging the wafer, and the guiding efficiency is low.

In addition, since the wafers are fragile, that is, the wafers on the carrier and boat are damaged by a small pressure, it is necessary to prevent the wafers from being damaged during the wafer dividing process.

Disclosure of Invention

One advantage of the present invention is to provide a wafer de-guiding apparatus and a method for operating the same, which can separate and guide a wafer located at any position of a wafer boat without taking out other wafers placed on the wafer boat in advance, thereby improving the efficiency of de-guiding.

Another advantage of the present invention is to provide a wafer dividing and guiding apparatus and a method thereof, wherein the apparatus further comprises an integral dividing and guiding assembly for synchronously dividing at least two wafers in the wafer boat to a receiving wafer boat.

The invention also provides a wafer dividing and guiding device and a working method thereof, and the wafer dividing and guiding device is also provided with an integral dividing and guiding component which can synchronously divide and guide the wafers in the bearing wafer boat to a receiving wafer boat at one time.

Another advantage of the present invention is to provide a wafer de-guiding apparatus and a method for operating the same, wherein the wafer de-guiding apparatus can prevent a wafer to be de-guided from being damaged due to uneven stress.

Another advantage of the present invention is to provide a wafer de-guiding apparatus and a method for operating the same, wherein the wafer de-guiding apparatus can prevent a worker from being mishandled and damaging a wafer without preventing a wafer boat from being in a correct position.

The wafer dividing and guiding equipment has the advantages that the wafer dividing and guiding equipment and the working method thereof are provided, and the limiting component is further arranged and used for fixing the position of the wafer boat assembly, so that the stability of the wafer boat in the dividing and guiding process is improved.

The wafer guiding device has the advantages that the wafer guiding device is provided, and the fool-proof mechanism is further arranged, so that when the bearing wafer boat and the receiving wafer boat are not at preset positions at will, the fool-proof mechanism can prevent the guiding arm from pushing the wafer, the wafer is prevented from being guided out, and the wafer is protected.

To achieve at least one of the above advantages, the present invention provides a wafer dividing and guiding apparatus for dividing at least one wafer out of a carrier boat, the carrier boat having a first inlet, a first opening and a first storage space communicating with the first inlet and the first opening, at least one set of first placing grooves formed on an inner wall of the carrier boat forming the first storage space, wherein the first placing grooves extend in a transverse direction and are disposed between the first inlet and the first opening for placing the wafer, the wafer dividing and guiding apparatus comprising:

the bearing seat forms a first bearing position for bearing the wafer boat;

a dividing guide assembly, wherein the dividing guide assembly comprises a plurality of dividing guide arms arranged at intervals and a guide main body, wherein the dividing guide arms are provided with pushing ends, the guide main body is arranged on the bearing seat, each dividing guide arm is arranged on the guide main body in a parallel sliding manner, each dividing guide arm corresponds to the wafer of the first placing groove of the bearing wafer boat, so that after any dividing guide arm is driven to slide into the first storage space through the first inlet, the corresponding wafer in the first placing groove is pushed by the dividing guide arm, and the wafer is divided and led out from the first opening as the dividing guide arms continuously slide towards the first opening;

the fool-proof mechanism comprises at least one stop block and a belt moving assembly, the stop block is arranged to extend along the arrangement direction of the plurality of branch guide arms, the stop block is arranged on the bearing seat in a mode that the stop block can be driven by the belt moving assembly to switch between a state of moving away from the pushing end moving path and a state of returning to the pushing end moving path, when the belt moving assembly drives the stop block to move, the stop block moves away from the pushing end moving path, and therefore the pushing end is allowed to cross the position of the stop block and extend into the first storage space of the bearing wafer boat.

According to an embodiment of the present invention, the susceptor forms a second bearing position for bearing a receiving boat aligned with the first opening, wherein the receiving boat has a second inlet, a second opening and a second storage space communicated with the second inlet and the second opening, at least one set of second placing grooves is formed on an inner wall of the bearing boat forming the second storage space, wherein the second placing grooves extend in a transverse direction and are between the second inlet and the second opening, wherein the second inlet and the first opening are aligned, and wherein each of the second placing grooves is aligned with the first placing groove after the receiving boat is borne in the second bearing position.

According to an embodiment of the present invention, the fool-proofing mechanism includes two stopping blocks and two belt moving assemblies, each stopping block is disposed on the bearing seat in a manner that the stopping block can be driven by the belt moving assembly to switch between a state of moving away from the pushing end moving path and a state of returning to the pushing end moving path, the two stopping blocks moving away from the pushing end moving path are respectively retained on two sides of the sub-guide arm, and a distance between the two stopping blocks moving away from the pushing end moving path is set to allow the sub-guide arm to pass through.

According to an embodiment of the present invention, the belt moving assembly includes at least one sliding block, a connecting rod and an elastic member, the stop block and the sliding block are fixed to two ends of the connecting rod respectively, the elastic member is disposed between the sliding block and a blocking wall formed by the bearing seat, and the sliding block is slidably disposed on the bearing seat along a transverse direction perpendicular to a moving direction of the guide arm.

According to an embodiment of the present invention, the fool-proof mechanism further includes at least one position-limiting member, wherein the position-limiting member is disposed at an edge of the first carrying position of the carrying seat.

According to an embodiment of the present invention, the stop member and the sliding block of the belt moving assembly form a bayonet with adjustable size at the second bearing position.

According to an embodiment of the invention, the wafer dividing and guiding apparatus comprises an integral dividing and guiding assembly, the integral dividing and guiding assembly comprises an integral dividing and guiding member and a plurality of driving members arranged in the same row, wherein said integral branching member forms a set of evacuation channels, wherein each of said evacuation channels is at the same level as each of said branching arms, when the branch guide arms slide along the transverse direction, each branch guide arm can respectively enter the first storage space from the first inlet of the wafer boat through the corresponding avoidance channel, the driving piece is arranged on each branch guide arm of the branch guide assembly and is arranged between the pushing end of the branch guide arm and the integral branch guide piece, wherein the driving member is disposed in a path along which the integral sub-guide moves so that the driving member can move together with the movement of the integral sub-guide when the integral sub-guide moves.

According to an embodiment of the invention, the driver is implemented as a projection provided on the minute guiding arm.

According to an embodiment of the present invention, the driving element is telescopically disposed on the branch guide arm along a direction perpendicular to an extending direction of the branch guide arm.

According to an embodiment of the invention, the guide body comprises a body forming a first slide and at least a first movement limiting structure arranged on the guide body, the guide body defining at least an exit opening communicating with the first slide, wherein the exit opening communicates with the first entrance opening, the diversion arm being movably mounted to the first movement limiting structure along an extension direction of the first movement limiting structure.

According to an embodiment of the present invention, the guide dividing assembly includes at least one first sliding control structure, and the guide dividing arm is fixedly connected to the first sliding control structure.

According to an embodiment of the present invention, the first sliding control structure includes at least one control pin and at least one limiting groove, the limiting groove is formed on the body, and the limiting groove is communicated with the first slideway. The extending direction of the limiting groove is parallel to the moving direction of the branch guide arm, the limiting groove is used for limiting the moving direction of the control pin, one end of the control pin is connected to the branch guide arm, and one end of the control pin, far away from the branch guide arm, extends out of the limiting groove, so that an operator can operate the branch guide arm conveniently.

According to an embodiment of the present invention, the sliding path of the guiding arm is located on a straight line where the diameters of the wafers loaded in the wafer boat are located.

In order to achieve at least one of the above objects, according to another aspect of the present invention, there is provided an operating method of a wafer de-guiding apparatus, the operating method including:

forming a first carrying position on the carrying seat for carrying a carrying boat containing wafers to be separated;

the wafer boat loaded on the first loading position drives a stop block to move through a belt moving assembly so as to avoid a space for separately guiding the movement of a sub-guide arm loaded on the wafer boat, wherein the stop block is arranged to extend along the arrangement direction of a plurality of sub-guide arms, the stop block is arranged on the loading seat in a manner that the stop block can be driven by the belt moving assembly and can be switched between a state of moving away from a moving path of a push-guide end and a state of returning to the moving path of the push-guide end, and each sub-guide arm corresponds to a wafer of a first placing groove of the wafer boat;

and pushing the guide dividing arm to divide and derive the wafers which correspond to the pushed guide dividing arm and are positioned in the first placing groove of the wafer bearing boat.

Drawings

Fig. 1 shows a schematic structural view of the load bearing assembly of the present invention.

Fig. 2 is a schematic diagram illustrating the wafer dividing apparatus of the present invention dividing wafers from a carrier boat to a receiving boat.

Fig. 3 shows an enlarged schematic view of portion a of fig. 2.

Fig. 4 is a perspective view of the wafer de-guiding apparatus according to the present invention.

Fig. 5 is a schematic structural diagram of a portion of the wafer dividing and guiding apparatus according to the present invention.

Fig. 6 is a schematic structural diagram of another part of the wafer de-guiding apparatus according to the present invention.

Fig. 7 shows a schematic view of the driver according to the invention in a state in which it is able to block it.

Fig. 8 shows a schematic view of the driver according to the invention in a state in which it is not possible to block it.

Fig. 9 shows a bottom view of the wafer de-guiding apparatus of the present invention.

Fig. 10 is a schematic view showing the sliding of one of the sliders when the boat is loaded in the first loading position.

Fig. 11 is a schematic view showing another sliding block sliding when the receiving boat is carried in the second carrying position.

Detailed Description

The following description is provided to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.

It is understood that the terms "a" and "an" should be interpreted as meaning "at least one" or "one or more," i.e., that a quantity of one element may be one in one embodiment, while a quantity of another element may be plural in other embodiments, and the terms "a" and "an" should not be interpreted as limiting the quantity.

Referring to fig. 1 to 11, a wafer de-indexing apparatus for de-indexing at least one wafer 700 carried in a boat assembly according to a preferred embodiment of the present invention will be described in detail below.

Referring to fig. 1, the boat assembly includes a carrier boat 800 and a receiving boat 900, and the carrier boat 800 is detachably mounted to the receiving boat 900. The boat 800 has a first inlet 801 and a first opening 802, and a first storage space 8001 is formed between the first inlet 801 and the first opening 802 for storing the wafer 700. The receiving boat 900 has a second inlet 901 and a second opening 902, and a second storage space 9001 is formed between the second inlet 901 and the second opening 902 for storing the wafers 700.

The wafer dividing and guiding apparatus of the embodiment can divide the wafers 700 in the receiving boat 800 into the receiving boat 900, and can also guide the wafers 700 carried in the receiving boat 900 to the receiving boat 800. That is, the wafers 700 in the carrier boat 800 may be guided to the receiving boat 900 or the wafers 700 in the receiving boat 900 may be guided to the carrier boat 800 only by adjusting the relative positions of the carrier boat 800 and the receiving boat 900 with respect to the wafer dividing apparatus.

In order to enable those skilled in the art to understand the embodiment of the present invention, the wafer guiding apparatus is only used to guide the wafers 700 in the carrier boat 800 to the receiving boat 900.

At least one set of first placing grooves 803 is formed on the inner wall of the boat 800 defining the first storage space 8001, wherein the first placing grooves 803 extend in the transverse direction and are disposed between the first inlet 801 and the first opening 802 for placing the wafers 700.

Preferably, the carrier boat 800 forms a plurality of the first placing grooves 803 horizontally spaced at a predetermined distance at different heights for horizontally placing the wafers 700. The receiving boat 900 forms a plurality of second placing grooves 903 horizontally spaced at predetermined intervals at different heights, and the second placing grooves 903 extend in the transverse direction to support the wafers 700.

It should be noted that the receiving boat 900 and the carrying boat 800 have the same size, and the extending direction of each second placing groove 903 on the receiving boat 900 is collinear with the extending direction of the first placing groove 803 on the carrying boat 800, so that when the wafers 700 placed on the first placing grooves 803 are pushed towards the receiving boat 900, the wafers 700 can slide into the second placing grooves 903 through the first placing grooves 803.

Referring to fig. 6 and 2, the wafer de-bonding apparatus includes a de-bonding assembly 10. The indexing assembly 10 comprises at least one indexing arm 11, wherein the indexing arm 11 is arranged to be movable in a transverse direction.

Preferably, the indexing assembly 10 comprises a plurality of indexing arms 11. A plurality of the branch guide arms 11 are provided at intervals, and each of the branch guide arms 11 is provided to be individually slidable laterally. Therefore, when the wafer guiding apparatus is required to guide the wafers 700 loaded in the loaded boat 800 to the receiving boat 900, at least one of the guiding arms 11 of the guiding assembly 10 is only required to be aligned with the first inlet 801 of the loaded boat 800, and the first opening 802 of the loaded boat 800 is aligned with the second opening 902 of the receiving boat 900. Subsequently, as the guide arm 11 is operated to move laterally to protrude from the first inlet 801 into the first storage space 8001, the wafers 700 carried in the first placing groove 803 are pushed into the second placing groove 903 of the receiving boat 900.

Preferably, the path along which the sub-guide arm 11 slides is located on a straight line where the diameter of the wafer 700 loaded in the wafer boat 800 is located, so that the wafer 700 can be uniformly stressed.

Referring to fig. 2, the guide assembly 10 includes a guide body 12. The guide body 12 forms at least a first slideway 1201, and the guide arm 11 is transversely slidably arranged on the first slideway 1201.

The guide body 12 includes a body 121 and at least a first movement limiting structure 122. The body 121 forms the first sliding track 1201, the first movement limiting structure 122 is disposed on the body 121 to limit the movement of the guide arm 11, and the guide arm 11 is movably mounted on the first movement limiting structure 122 along the extending direction of the first movement limiting structure 122. The guide body 12 defines at least one outlet 12201 communicating with the first slide 1201, and communicates with the first inlet 801 through the outlet 12201, and the guide arm 11 is provided to be movable in and out of the first slide 1201 in a horizontal direction through the first inlet 801.

In this way, when the wafer 700 is pushed by the branch guide arm 11 to move along the second storage space 9001, the wafer 700 placed on the boat 800 is transferred to the receiving boat 900.

It is worth mentioning that the distance that the guiding arm 11 can slide along the first sliding path 1201 is larger than the width of the carrier wafer boat 800, so that the wafers 700 can be completely guided to the receiving wafer boat 900.

Preferably, the body 121 has two side walls, wherein a groove is transversely formed on one side of each of the two side walls, so as to define the first sliding channel 1201.

The two sides of the branch guide arm 11 are transversely slidably disposed in the two grooves to guide the branch guide arm 11 to slide in the transverse direction.

Referring to fig. 2 and 4, preferably, the guide assembly 10 further includes at least one first sliding control structure 13, and the guide arm 11 is fixedly connected to the first sliding control structure 13 for controlling the sliding distance of the guide arm 11.

Specifically, the first sliding control structure 13 includes at least one first control pin 131 and at least one first limiting groove 132, the first limiting groove 132 is formed in the body 121, and the first limiting groove 132 is communicated with the first sliding channel 1201. The extending direction of the first limiting groove 132 is parallel to the moving direction of the branch guide arm 11, the first limiting groove 132 is used for limiting the moving direction of the first control pin 131, one end of the first control pin 131 is connected to the branch guide arm 11, and an end of the first control pin 131 away from the branch guide arm 11 extends out of the first limiting groove 132, so that an operator can operate the branch guide arm 11.

In a variant embodiment, the first coasting control mechanism 13 comprises a drive unit configured as an air cylinder, a hydraulic cylinder, or any other component capable of driving the lateral movement of the minute arm 11.

It is worth mentioning that, since the plurality of the guide arms 11 are provided, and the guide arms 11 are respectively installed at different levels of the first sliding path 1201. In this way, the wafers 700 at different levels can be individually separated by the separation arm 11 having the same level. And when singulating, it is not necessary to remove all other wafers on top of the wafer 700.

It can be understood that, by the operator controlling the first control pin 131 to move along the first limiting groove 132 to a side close to the outlet 12201, the first control pin 131 drives the guide arm 11 to move toward the receiving boat 900 through the carrying boat 800, thereby transferring the wafers 700 located on the carrying boat 800 to the receiving boat 900. And the wafer 700 at different horizontal positions is guided out by the guide arms 11 at different horizontal heights according to actual requirements.

Referring to fig. 2, 3 and 6, further, the wafer de-bonding apparatus further includes an integral de-bonding assembly 20.

The integral sub-guide assembly 20 is transversely slidably disposed on the path along which the sub-guide arms 11 move, wherein at least one avoidance channel 201 is disposed on the integral sub-guide assembly 20, as shown in fig. 6, each avoidance channel 201 is at the same level as each sub-guide arm 11, so that when the sub-guide arms 11 slide along the transverse direction, each sub-guide arm 11 can enter the first storage space 8001 from the first inlet 801 of the carrier boat 800 through the corresponding avoidance channel 201, and further, the wafers 700 in the first storage space 8001 are pushed out to the second storage space 9001 of the receiving boat 900.

Referring specifically to fig. 6, the integral branch guide assembly 20 includes an integral branch guide 21 and a driver 22, wherein the integral branch guide 21 forms the transverse bypass channel 201. The driver 22 is disposed on each of the branch guide arms 11 of the branch guide assembly 10 between the push end 111 of the branch guide arm 11 and the integral branch guide 21, and further, on a path along which the driver 22 is disposed on the integral branch guide 21.

Preferably, the integral sub-guide assembly 20 includes a plurality of the drivers 22 arranged in the same row, that is, each of the drivers 22 is located at the same distance from the pushing end 111 of the sub-guide arm 11, so that when the integral sub-guide 21 moves, the drivers 22 can move together with the movement of the integral sub-guide 21, and all the sub-guide arms 11 can synchronously push the wafers in the carrier boat 800 to move to the receiving boat 900. In this way, the wafer dividing and guiding apparatus can guide all the wafers 700 in the carrier wafer boat 800 to the receiving wafer boat 900 at one time.

In one embodiment, the driving member 22 is implemented as a protrusion disposed on the sub-guide arms 11, so that when the integral sub-guide 21 moves toward the carrier wafer boat 800, the integral sub-guide 21 gradually approaches the driving member 22, so that the integral sub-guide 21 drives the driving member 22 to slide together, and all the sub-guide arms 11 simultaneously push the wafers in the carrier wafer boat 800 to move to the receiving wafer boat 900. Thereby all of the wafers 700 in the carrier boat 800 are diverted to the receiving boat 900 at once.

Preferably, the driver 22 is telescopically arranged on the branch guide arm 11 along a direction perpendicular to the extension direction of the branch guide arm 11. Thus, when only two wafers 700 in the carrier boat 800 need to be guided to the receiving boat 900, the driving member 22 on the corresponding sub-guide arm 11 corresponding to the wafer to be guided can be extended, and the other driving members 22 can be retracted to the corresponding sub-guide arm 11, so that the sub-guide arm 11 with the retracted driving member 22 can escape from the sliding space of the integral sub-guide member 21 when the integral sub-guide member 21 moves; the sub-guide arm 11 with the extended driving member 22 can be driven by the integral sub-guide member 21 to slide toward the first storage space 8001 of the loaded wafer boat 800, so that at least two corresponding wafers 700 are synchronously sub-guided to the receiving wafer boat 900.

Preferably, the driver 22 is provided as a telescopic pin structure, in particular comprising a spring and a telescopic pin, wherein the spring is sleeved on the telescopic pin and the protruding part of the telescopic pin forms the protrusion. When the retractable pin is in the retracted state, the entire retractable pin is hidden in the branch guide arm 11.

The integral indexing assembly 20 further includes a pusher arm 23, as shown in figures 3, 7 and 8. The body 121 of the guide body 12 is provided with a second slideway 1202 parallel to the first slideway 1201, wherein the integral divider 21 is fixed to the end of the push arm 23 and the push arm 23 is slidably arranged on the second slideway 1202. Thus, when the pushing arm 23 is pushed, the integral guiding member 21 will also slide horizontally until the driving member 22 drives all the guiding arms 11 to push the wafers in the wafer boat 800.

It is worth mentioning that the integral divider 21 is sized to slide from the first inlet 801 of the carrier boat 800 into the first storage space 8001.

In a variant embodiment, the integral guide member 21 of the integral guide assembly 20 comprises a guide body 211 and an integral guide plate 212, wherein the guide body 211 forms the second slideway 1202, wherein the integral guide plate 212 forms the escape passage 201.

Referring to fig. 5, preferably, the integral guide assembly 20 further includes at least one second sliding control structure 24, and the push arm 23 is controllably connected to the second sliding control structure 24 for controlling the moving distance of the push arm 23 relative to the body 121, so as to control the sliding distance of the integral guide arm 11.

Specifically, the second sliding control structure 24 forms at least one second sliding slot 241 and at least one second limit pin 242, and the second sliding slot 241 is formed in the body 121. The second sliding groove 241 is communicated with the first sliding channel 1201, the extending direction of the second sliding groove 241 is parallel to the moving direction of the branch guide arm 11, one end of the second limit pin 242 is connected to the pushing arm 23, and one end of the second limit pin 242, which is far away from the pushing arm 23, extends out of the second sliding groove 241, so that an operator can operate the second limit pin 242, and the sliding distance of the whole branch guide arm 11 is controlled by controlling the pushing arm 23.

Referring to fig. 4, in a preferred embodiment, the integral guide-splitting assembly 20 further comprises at least one integral restoring assembly 25, the integral restoring assembly 25 is mounted to the body 121, and the integral restoring assembly 25 is used for restoring the integral guide arm 11.

Referring to fig. 4, the integral reset assembly 25 includes a toggle member 251, and the toggle member 251 is mounted to the body 121. The toggle member 251 has an initial position, in which the toggle member 251 is disposed at an end of the body 121 close to the outlet 12201. The toggle member 251 pushes all the first control pins 131 close to the outlet 12201 to an end away from the outlet 12201, so as to integrally reset the branch guide arm 11. In this way, the toggle member 251 moves from the initial position to an end away from the boat 800 to push the first control pins 131 close to the boat 800 to an end away from the boat 800, thereby resetting all the guide arms 11.

The integral reset assembly 25 further comprises at least one sliding reset groove 252, the toggle member 251 is movably disposed in the sliding reset groove 252, and the sliding reset groove 252 is disposed between the toggle member 251 and the guide body 12 for limiting the movement of the toggle member 251.

The sliding reset groove 252 may be implemented as a third recess and a protrusion mounted to the third recess to limit the movement of the toggle member 251.

In one embodiment, the protrusion is disposed on a side of the toggle member 251 close to the guide body 12, and the third groove is formed on a side of the guide body 12 close to the toggle member 251.

It can be understood that, by the operator controlling the first control pin 131 to move along the first limiting groove 132 to the side close to the outlet 12201, the partial guide arm 11 moves towards the first storage space 8001 through the avoiding channel 201, so that the partial guide arm 11 pushes the wafer 700 to move from the carrier boat 800 to the receiving boat 900. The operator can control the movement of the guide arm 11 at different heights to transfer the wafers 700 at different heights. The operator controls the second limit pin 242 to move along the second chute 241 to a side close to the outlet 12201, the second limit pin 242 drives the pushing arm 23 to move to a direction close to the outlet 12201, subsequently, the pushing arm 23 pushes the integral branch guide 21 to move from the wafer boat 800 to the wafer boat 900, and under the action of the driving member 22, the driving member 22 drives all the branch guide arms 11 penetrating through the avoiding channel 201 to transfer the wafers 700 in the wafer boat 800 to the wafer boat 900. The wafer dividing and guiding device can achieve the purpose of independent division and can also achieve the operation of integral transfer.

Further, the wafer de-guiding apparatus further includes a susceptor 30. The carrier 30 forms a first carrying position for carrying the boat 800 and a second carrying position for carrying the receiving boat 900.

The sub-guide assembly 10 is mounted on the carrier 30, and the carrier 30 is used to support the boat assembly, the sub-guide assembly 10 and the integral sub-guide assembly 20.

Referring to fig. 2, fig. 4, fig. 5, fig. 9 and fig. 10, and especially referring to fig. 5 and fig. 9, further, the wafer dividing and guiding apparatus further includes at least one fool-proof mechanism 40. The fool-proof mechanism 40 includes at least one stop 41 and a strap assembly 42. The stopper 41 is provided to extend in a direction in which the plurality of branch guide arms 11 are arranged, and specifically, in at least one embodiment, the stopper 41 is provided to extend in a vertical direction. The stop block 41 is disposed on the carrying seat 30 in a manner that it can be driven by the belt moving assembly 42 to switch between a state of moving away from the moving path of the pushing end 111 and a state of returning to the moving path of the pushing end 111. Therefore, when the belt moving assembly 42 moves the stopper 41, the stopper 41 moves away from the moving path of the pushing end 111, so as to allow the pushing end 111 to pass the stopper 41 and extend into the first storage space 8001 of the boat 800.

Preferably, the belt shift assembly 42 is disposed at an edge of the first carrying position, so that when the carrying boat 800 is placed in the first carrying position, the belt shift assembly 42 is triggered to move the stop block 41.

Specifically, in one embodiment, the belt moving assembly 42 includes at least one sliding block 421, a link 422, and an elastic member 423. The stopper 41 and the sliding block 421 are fixed to both ends of the link 422, respectively, and the elastic member 423 is disposed between the sliding block 421 and a stopper wall formed by the bearing seat 30.

The sliding block 421 is slidably disposed on the bearing seat 30 along a transverse direction perpendicular to the moving direction of the branch guide arm 11. That is, when the sliding block 421 is pushed to move toward the edge of the bearing seat 30, the elastic element 423 is compressed, and at the same time, the link 422 with the end fixed to the sliding block 421 is also driven, so that the moving stop 41 can be switched between a state of moving away from the moving path of the push end 111 and a state of returning to the moving path of the push end 111.

The sliding block 421 is disposed at the boundary of the second bearing position or the boundary of the first bearing position, preferably, the sliding block 421 is disposed at the boundary of the second bearing position, and when the receiving boat 900 is placed at the second bearing position, the sliding block 421 is pushed away by the receiving boat 900 and slides toward the edge of the bearing seat 30, accordingly, the elastic member 423 is compressed to press the sliding block 421 against the receiving boat 900. At the same time, the stopper 41 is moved away from the moving path of the pushing end 111 by the driving of the connecting rod 422, so as to allow the guiding arm 11 to guide the wafers 700 in the wafer boat 800.

It can be understood that the stop 41 will move away from the moving path of the pushing end 111 only when the receiving boat 900 is correspondingly placed in the second loading position. And when the receiving boat 900 is not placed in the second loading position, the pushing end 111 of the branch guide arm 11 is blocked by the stopper 41 and cannot extend into the first storage space 8001, so the fool-proof mechanism 40 can effectively prevent the user from operating the branch guide arm 11 when forgetting to place the receiving boat 800. In this way, the wafers 700 can be prevented from falling off the boat 800 due to the operation of the guide arm 11 without the boat 800.

Preferably, the fool-proofing mechanism 40 includes two stop blocks 41 and two belt moving assemblies 42, and each stop block 41 is disposed on the carrier 30 in a manner that can be driven by the belt moving assembly 42 to switch between a state of moving away from the moving path of the pushing end 111 and a state of returning to the moving path of the pushing end 111. And the two stopping blocks 41 after moving away from the moving path of the pushing end 111 are respectively kept at two sides of the branch guide arm 11, and the distance between the two stopping blocks 41 after moving away from the moving path of the pushing end 111 is set to allow the branch guide arm 11 to pass through. Moving away from the path of movement of the pusher end 111, the spacing between the two stops 41 is set to allow the passage of the integral tap piece 21.

In this way, the indexing arm 11 and/or the integral indexing member 21 can be allowed to operate only when the carrier boat 800 and the receiving boat 900 are simultaneously carried in the first carrying position and the second carrying position, respectively. In this way, the misoperation of the operator under the condition that the first carrying position does not carry the boat 800 and/or the second carrying position does not carry the receiving boat 900 can be effectively avoided, and the wafer 700 can be protected.

At least one sliding through groove 301 is formed on the bearing seat 30, and the sliding block 421 is slidably disposed in the sliding through groove 301, so that the sliding block 421 can slide along the extending direction of the sliding through groove 301. That is, the extending direction of the sliding through groove 301 is set to coincide with the sliding direction of the sliding block 421, and the sliding through groove 301 is set to penetrate the top and bottom of the bearing seat 30. The belt-moving assembly 42 is disposed at the bottom of the susceptor 30 to prevent the linkage of the belt-moving assembly 42 from causing interference with the carrier boat 800 and/or the receiving boat 900.

The fool-proof mechanism 40 further comprises at least one position-limiting member 43, wherein the position-limiting member 43 is disposed at an edge of the first carrying position and/or an edge of the second carrying position of the carrying seat 30. The limiting member 43 forms a bayonet with an adjustable size at the first carrying position and/or the second carrying position together with the sliding block 421 of the belt moving assembly 42, so that when the carrying boat 800 and/or the receiving boat 900 are placed at the corresponding first carrying position and/or the second carrying position, the carrying boat 800 and/or the receiving boat 900 can be clamped at the corresponding position. In this way, the first placing groove 803 of the carrier boat 800 and the second placing groove 903 of the receiving boat 900, which is at the same height as the first placing groove 803, can be aligned in the direction in which the wafers 700 slide, and thus it can be ensured that the wafers 700 are not damaged by being blocked due to misalignment between the second placing groove 903 and the first placing groove 803 during the process of sliding from the carrier boat 800 to the receiving boat 900.

In other words, in the present embodiment, the provision of the fool-proof mechanism 40 can facilitate the alignment of the first placement groove 803 and the second placement groove 903.

The position limiting member 43 includes a fixing block 431, wherein the fixing block 431 is fixed at an edge of the first bearing position and/or an edge of the second bearing position.

Referring to fig. 9, 10 and 11, preferably, the stop member 43 includes a movable block 431A, a spring 432 and a sliding rod 433, wherein the movable block 431A is disposed at an edge of the first carrying position and/or an edge of the second carrying position, wherein the sliding rod 433 is provided to the bearing block 30, wherein the spring 432 is compressively held between the movable block 431A and a stopper on the bearing block 30, so as to enable the movable block 431A to switch between the state of returning to the edge of the first bearing position and/or the edge of the second bearing position and the position far away from the edge of the first bearing position and/or the edge of the second bearing position, wherein when the movable block 431A is far away from the edge of the first bearing position and/or the edge of the second bearing position, the bearing wafer boat 800 or the receiving wafer boat 900 is clamped.

Preferably, the position-limiting member 43 and the sliding block 421 surround the edge of the first carrying position and/or the edge of the second carrying position, so that the carrying boat 800 and the receiving boat 900 can be guided to the position corresponding to the guiding arm 11 by the position-limiting member 43 and the sliding block 421. That is, the fool-proof mechanism 40 is also defined as an alignment mechanism.

Preferably, the fool-proof mechanism 40 is provided with two stop members 43, wherein one stop member 43 is disposed opposite to one sliding block 421 to form one size-adjustable bayonet with the sliding block 421, and the other stop member 43 is disposed opposite to the other sliding block 421 to form the other size-adjustable bayonet with the other sliding block 421.

When the load-bearing wafer boat 800 and the receiving wafer boat 900 are both placed in the first load-bearing position and the second load-bearing position, the two slide blocks 421 are respectively pressed by the load-bearing wafer boat 800 and the receiving wafer boat 900 and move towards the edge of the load-bearing seat 30, on one hand, the stop block 41 is driven by the belt moving assembly 42 to move away from the moving path of the push-guide end 111, so as to make room for the sub-guide arm 11 to slide; on the other hand, the carrier wafer boat 800 and the receiving wafer boat 900 are clamped at the corresponding first carrier position and the second carrier position, so as to ensure that the second placing slot 903 is aligned with the first placing slot 803.

According to another aspect of the present invention, the present invention further provides a working method of a wafer de-bonding apparatus, where the working method of the wafer de-bonding apparatus includes:

forming a first carrying position on the carrying base 30 for carrying the wafer boat 800 loaded with the wafers to be separated;

the carrier boat 800 carried in the first carrying position moves the stop block 41 through a belt moving assembly 42 to avoid a space for separately guiding the movement of the sub-guide arms 11 carried on the carrier boat 800, wherein the stop block 41 is disposed to extend along the direction in which the sub-guide arms 11 are arranged, the stop block 41 is disposed on the carrier 30 in a manner that the stop block 41 can be driven by the belt moving assembly 42 to switch between a state of moving away from the moving path of the push-guide end 111 and a state of returning to the moving path of the push-guide end 111, and each sub-guide arm 11 corresponds to the wafer 700 in the first placing groove 803 of the carrier boat 800;

the guiding arm 11 is pushed, and the wafers 700 corresponding to the pushed guiding arm 11 and located in the first placing groove 803 of the wafer boat 800 are guided out.

According to another aspect of the present invention, the fool-proof mechanism 40 can align the receiving boat 900 and the carrying boat 800 on the carrying seat 30 with the moving path of the guiding arm 11 of the guiding assembly 10. Specifically, when the receiving boat 900 and the receiving boat 800 are simultaneously placed in the first carrying position and the second carrying position, respectively, the slide block 421 and the stopper member 43 of the belt moving assembly 42 can guide the receiving boat 900 and the receiving boat 800 to positions aligned with the moving path of the branch guide arm 11.

Thus, in a preferred embodiment, during the sliding process of the guide arm 11, the sliding path of the guide arm 11 can be always kept on the straight line of the diameter of the wafers 700 carried in the carrier boat 800. In this way, the wafers 700 in the boat 800 are not damaged by uneven stress.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The advantages of the present invention have been fully and effectively realized. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims (10)

1. The wafer dividing and guiding device is used for dividing and guiding at least one wafer out of a bearing wafer boat through a dividing and guiding arm of at least one dividing and guiding assembly, wherein the dividing and guiding assembly comprises a guiding main body and a plurality of dividing and guiding arms arranged at intervals, each dividing and guiding arm is provided with a pushing and guiding end, the dividing and guiding arms are arranged on the guiding main body in a parallel sliding mode, the bearing wafer boat is provided with a first inlet, a first outlet and a first storage space communicated with the first inlet and the first outlet, at least one group of first placing grooves are formed in the inner wall of the bearing wafer boat, the first placing grooves extend in the transverse direction and are arranged between the first inlet and the first outlet to place the wafer, and the wafer dividing and guiding device is characterized by comprising:

the bearing seat forms a first bearing position for bearing the wafer boat;

at least two guiding mechanisms, wherein each guiding mechanism comprises at least one stopping block, a belt moving component and at least two limiting components, the stopping block is arranged on the bearing seat in a manner that the stopping block can be driven by the belt moving component to switch between a state of moving away from the pushing end moving path and a state of returning to the pushing end moving path, when the belt moving component drives the stopping block to move, the stopping block moves away from the pushing end moving path, so that the pushing end is allowed to cross the position of the stopping block and extend into the first storage space of the bearing wafer boat, the belt moving component comprises at least one sliding block, a connecting rod and an elastic piece, the stopping block and the sliding block are respectively fixed at two ends of the connecting rod, and the elastic piece is arranged between the sliding block and a blocking wall formed by the bearing seat, the sliding blocks are slidably arranged on the bearing seats along a transverse direction perpendicular to the moving direction of the guide arm, the sliding block of one of the belt moving assemblies is arranged at the edge of a plurality of first bearing positions, the sliding block of the other belt moving assembly is arranged at the edge of the second bearing position, one of the limiting members is arranged at a position opposite to the sliding block so as to form one size-adjustable bayonet with the sliding block, and the other limiting member is arranged at a position opposite to the other sliding block so as to form the other size-adjustable bayonet with the other sliding block.

2. The wafer dividing and guiding apparatus as claimed in claim 1, wherein the guiding mechanism comprises two stopping blocks and two belt moving assemblies, each stopping block is disposed on the carrier in such a manner that it can be moved by the belt moving assembly to switch between a state of moving away from the pushing end moving path and a state of returning to the pushing end moving path, the two stopping blocks after moving away from the pushing end moving path are respectively retained on two sides of the dividing and guiding arm, and the distance between the two stopping blocks after moving away from the pushing end moving path is set to allow the dividing and guiding arm to pass through.

3. The wafer dividing and guiding apparatus as claimed in claim 1, wherein the wafer dividing and guiding apparatus comprises an integral dividing and guiding assembly, the integral dividing and guiding assembly comprises an integral dividing and guiding member and a plurality of driving members arranged in the same row, wherein the integral dividing and guiding member forms a set of avoiding channels, each of the avoiding channels is located at a same level as each of the dividing and guiding arms, so that each of the dividing and guiding arms can enter the first storage space from the first inlet of the wafer boat through the corresponding avoiding channel when the dividing and guiding arm slides in the transverse direction, the driving member is disposed on each of the dividing and guiding arms of the dividing and guiding assembly and between the pushing end of the dividing and guiding arm and the integral dividing and guiding member, wherein the driving member is disposed on a moving path of the integral dividing and guiding member so as to move the integral dividing and guiding member, the entrainment member is movable with the movement of the integral distributor.

4. The wafer indexing apparatus of claim 3, wherein the catch is implemented as a protrusion disposed on the indexing arm.

5. The wafer dividing and guiding apparatus as claimed in claim 3, wherein the driving member is telescopically disposed on the dividing arm in a direction perpendicular to an extending direction of the dividing arm.

6. The wafer de-guiding apparatus as claimed in claim 1, wherein the guide body includes a body forming a first slide way and at least a first movement limiting structure disposed on the guide body, the guide body defining at least an outlet communicating with the first slide way, wherein the outlet communicates with the first inlet, the guide arm is movably mounted to the first movement limiting structure along an extending direction of the first movement limiting structure, the guide assembly includes at least a first sliding control structure, the guide arm is fixedly connected to the first sliding control structure, the first sliding control structure includes at least a control pin and at least a limiting groove, the limiting groove is formed on the body and communicates with the first slide way, the extending direction of the limiting groove is parallel to the moving direction of the guide arm, the limiting groove is used for limiting the moving direction of the control pin, one end of the control pin is connected to the branch guide arm, one end part, far away from the branch guide arm, of the control pin extends out of the limiting groove, so that an operator can operate the branch guide arm, the integral branch guide assembly further comprises a pushing arm, the body of the guide main body is provided with a second slide way parallel to the first slide way, the integral branch guide is fixed at the end part of the pushing arm, and the pushing arm is slidably arranged on the second slide way.

7. The wafer de-indexing apparatus as claimed in claim 6, wherein the integral de-indexing assembly further comprises at least a second sliding control structure, the push arm being controllably connected to the second sliding control structure for controlling a distance of movement of the push arm relative to the body, thereby controlling a sliding distance of the integral de-indexing arm.

8. The wafer de-guiding apparatus as claimed in claim 7, wherein the second sliding control structure forms at least a second sliding slot and at least a second limiting pin, the second sliding slot is formed on the body, wherein the second sliding slot is connected to the first sliding channel, the extending direction of the second sliding slot is parallel to the moving direction of the de-guiding, one end of the second limiting pin is connected to the pushing arm, and one end of the second limiting pin, which is far away from the pushing arm, extends out of the second sliding slot.

9. The wafer de-indexing apparatus of claim 8, wherein the integral de-indexing assembly comprises at least one integral repositioning assembly mounted to the body, the integral repositioning assembly being configured to reposition the integral de-indexing arm.

10. The wafer de-guiding apparatus as claimed in claim 9, wherein the integral reset assembly includes a toggle member and a sliding reset slot, the toggle member is mounted to the body, the toggle member has an initial position in which the toggle member is disposed at an end of the body near the outlet, the toggle member is movably disposed in the sliding reset slot, and the sliding reset slot is disposed between the toggle member and the guiding body.

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