CN114919273B - Printing stacking clamp for small-size circuit substrate and using method - Google Patents
Printing stacking clamp for small-size circuit substrate and using method Download PDFInfo
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- CN114919273B CN114919273B CN202210643936.0A CN202210643936A CN114919273B CN 114919273 B CN114919273 B CN 114919273B CN 202210643936 A CN202210643936 A CN 202210643936A CN 114919273 B CN114919273 B CN 114919273B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
- B41F15/26—Supports for workpieces for articles with flat surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/10—Screen printing machines characterised by their constructional features
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to the technical field of circuit substrate printing, and particularly discloses a printing stacking clamp for a small-size circuit substrate and a use method thereof, wherein the printing stacking clamp comprises a stacking clamp body provided with clamping cavities and a plurality of bulges which are arranged in the symmetrical two sides of the clamping cavities in a staggered manner; and the clamping positioning grooves are formed by the plurality of bulges and the side surfaces of the clamping cavity. The application method specifically comprises the following steps: mounting the printing stacking clamp on a vacuum adsorption area on a workbench of printing equipment; the circuit substrate is arranged in the clamping cavity to form close-to-close staggered arrangement, and the printing stacking clamp and the circuit substrate are fixed on the workbench through vacuum adsorption of the workbench; and clamping the silk screen above the circuit substrate, setting the distance from the silk screen, and realizing pattern printing through a printing scraper. The invention solves the problems of low printing efficiency and high operation difficulty of the surface patterns of the small-size circuit substrate and realizes batch printing of the surface patterns of the small-size circuit substrate.
Description
Technical Field
The invention relates to the technical field of pattern printing of multilayer co-fired ceramic circuit substrates, in particular to a printing and stacking clamp for small-size circuit substrates and a using method thereof.
Background
The multilayer cofired ceramic circuit substrate has high integration density and high reliability, and is widely applied in the fields of aviation, aerospace and military. With further improvement of product integration density and increasingly compact assembly modes, the mode of combining substrate-level airtight packaging with BGA interface output becomes increasingly a product development trend, and the quality of solder resist on a BGA pad becomes one of important factors of substrate application effect.
In the aspect of multi-layer co-fired ceramic substrate BGA bonding pad resistance welding, the problem of size deviation of co-fired medium resistance welding is caused due to shrinkage fluctuation of the substrate in the co-firing process, and the alignment precision of the BGA array bonding pad is seriously verified and influenced when the product size is large, so that after the substrate co-firing is finished, the surface resistance welding manufacturing mode based on post printing and exposure development has obvious advantages in the aspects of high-precision and tiny opening resistance welding.
In view of exposure alignment precision control, high-temperature assembly process compatibility and the like, in some cases, the printing coating and exposure development of the back surface solder resist material are required to be performed after the multi-layer co-fired ceramic substrate is cut into a final size, even after packaging is completed, so that the batch printing efficiency and the printing quality of the back surface patterns of the small-size substrate are directly related to the production efficiency and the solder resist forming quality of the solder resist processing of the product.
In terms of printing small-size products, the patent application number is CN201210332571.6, and the name of the patent application number is CN201210332571.6, namely a ceramic substrate side printing method and a ceramic substrate side printing device is a fixture for ceramic substrate side printing, so that the number of products printed at a time is increased, but the method is required to manufacture a plurality of clamping cavities which have complex structures and are required to be filled with a curing adhesive small through cavity, the fixture is difficult to manufacture, each product is required to be clamped in the clamping cavity respectively, the upward side surfaces of a plurality of substrates are flattened, the operation is complex, and the operation efficiency of placing and taking out the products is low.
In the patent application number of CN201410156754.6 and the name of a printing clamp for a radio frequency filter, a printing method for a ceramic dielectric filter is disclosed so as to realize that one set of clamp can be compatible with a plurality of side surfaces for printing, but the method needs a blind groove clamp and a through groove clamp to be matched for use, a true suction through hole is also needed to be formed in the bottom of the blind groove clamp, the structure of the clamp is complex, and the side alignment of each product is needed to be realized through the clamp cover plate matched with the clamp body in the operation process, so that the operation is complex.
The patent application number is CN201811094527.X, and the name is 'alignment fixture and alignment method for screen printing preparation of sheet type oxygen sensor', an alignment fixture for printing of oxygen sensor is disclosed, but the fixture needs a matched alignment adjusting device, has a complex structure, and has long interval distance between printing units, which is not beneficial to batch printing of small-size products.
The patent application number is CN2012202799441. X, and the name is 'a printing base for a plurality of glass lenses' discloses a step cavity structure, the structure of the fixture is complex, the processing precision requirement is high, and products are separately placed, so that the stacking density of batch printing is reduced.
The patent application number is CN201320195251.0, and the name is SMT jigsaw printing device discloses a clamp for solving the problem of positioning deviation of multi-jigsaw solder paste printing, but the clamp is not provided with an adsorption fixing device and is not suitable for printing and fixing of a small-size substrate.
Disclosure of Invention
The invention aims to solve the technical problem of providing a printing and stacking clamp for a small-size circuit substrate and a using method thereof; the problem of small-size circuit substrate surface figure printing efficiency is low, the operation degree of difficulty is big is solved, realizes the batch printing of small-size circuit substrate surface figure.
The invention solves the technical problems by adopting the following solution:
on the one hand:
a printing stacking clamp for small-size circuit substrates comprises a stacking clamp body provided with a clamping cavity and two groups of protruding structures which are arranged in two symmetrical sides of the clamping cavity in a staggered manner;
the convex structure comprises a plurality of convex with the same structure; clamping positioning grooves are formed between two adjacent bulges; the clamping positioning grooves on one side of the clamping cavity are in one-to-one correspondence with the protrusions on the other side of the clamping cavity.
When the printing device is used, the printing stacking clamp is placed in a vacuum adsorption area of a working table of the printing device, the circuit substrate is installed in the clamping cavity, the position staggering between two adjacent rows of the circuit substrate is realized through the clamping positioning groove, and the clamp and the product are adsorbed and fixed on the working table together by utilizing the vacuum adsorption of the working table of the printing device; and clamping the silk screen above the stacked circuit substrate, setting a certain off-screen distance, and then printing.
Compared with the prior art, the circuit substrates with the same thickness are arranged in the clamping cavity in a staggered mode, good fixation is achieved, consistency and stability of a printing surface in a printing process can be guaranteed, all the circuit chips are arranged in close proximity, and batch processing capacity is high. The problem of small-size circuit substrate surface figure printing efficiency is low, the operation degree of difficulty is big is solved, realizes the batch printing of small-size circuit substrate surface figure.
In some possible embodiments, to effectively achieve constrained positioning for each row of circuit substrates;
and the length a of the protrusion along the length direction of the circuit substrate is a of the length of the circuit substrate, wherein a=1/4A-3/4A.
In some of the possible embodiments of the present invention,
and the clamping positioning groove has a width D along the width direction of the circuit substrate, wherein the width of the circuit substrate is D, and D-d=0.05 mm-0.2 mm.
In some possible embodiments, to avoid that the screen is in contact with the printing stacking jig during printing, affecting quality;
the thickness of the printing stacking clamp is H, and the thickness of the circuit substrate is H, wherein H-h=0.1 mm-0.5 mm.
In some possible embodiments, to facilitate circuit substrate clamping and positioning while avoiding vacuum leakage over a large area;
the effective length E of the clamping cavity is equal to or less than 0.1mm and equal to or less than 0.5mm, and the sum of the lengths of a plurality of circuit substrates arranged in the clamping cavity is equal to or less than E.
In some possible embodiments, to facilitate circuit substrate clamping and positioning while avoiding vacuum leakage over a large area;
the effective width of the clamping cavity is F, and the sum of the widths of the circuit substrates arranged in the clamping cavity in a plurality of rows is F, wherein F-F is more than or equal to 0.1mm and less than or equal to 0.5mm.
In some of the possible embodiments of the present invention,
the stacking clamp body and the bulge are integrally formed, and are made of any one of bakelite plate, aluminum alloy and stainless steel.
On the other hand:
the application method of the printing stacking clamp for the small-size circuit substrate specifically comprises the following steps:
mounting a printing stacking clamp on a vacuum adsorption area on a workbench of printing equipment, and starting a vacuum adsorption function of the printing equipment for adsorption and fixation;
the circuit substrate is arranged in the clamping cavity of the printing stacking clamp, and finally the circuit substrate is arranged in a plurality of rows, close to each other and staggered according to the position limitation of the clamping positioning grooves;
the printing stacking clamp and the circuit substrate are fixed on the workbench through vacuum adsorption of the workbench of the printing equipment;
and clamping the silk screen above the stacked circuit substrates, setting a certain off-screen distance, and realizing graphic printing through a printing scraper.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the clamping cavities are arranged in the printing stacking clamp body, and the clamping cavities and the bulges are matched to form a plurality of groups of clamping positioning grooves, so that a plurality of circuit substrates with the same thickness can be densely arranged in the clamp for printing at the same time, and batch processing is realized; the control of the dimensional tolerance of the printing stacking clamp is convenient for clamping the circuit substrate, ensures that the vacuum of the workbench is not seriously leaked, and can effectively adsorb and fix the circuit substrate; the adjacent and staggered arrangement of the circuit substrates can be realized through the constraint positioning of the clamping positioning grooves in the printing stacking clamp, so that the stability of the printing surface in the printing process is ensured, and the mass printing quality is ensured;
the printing stacking clamp has the advantages of simple structure, low processing precision requirement and good compatibility with printing equipment; the invention is used for printing batch products, and has simple operation and stable printing quality.
Drawings
FIG. 1 is a schematic view of a printing stacking jig according to the present invention;
FIG. 2 is a schematic diagram of a printed stacking jig and a circuit board according to the present invention;
FIG. 3 is a schematic diagram of a stacking arrangement of circuit substrates;
FIG. 4 is a schematic illustration of the application of pressure to a screen during printing using the printing stack according to the invention;
FIG. 5 is a flow chart of the method of use of the present invention;
wherein: 1. stacking the clamp body; 10. a clamping cavity; 11. a protrusion; 12. clamping the positioning groove; 2. a circuit substrate; 20. a silk screen; 30. acting force.
Detailed Description
In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. Reference to "first," "second," and similar terms in this application does not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. In the implementation of the present application, "and/or" describes an association relationship of an association object, which means that there may be three relationships, for example, a and/or B may mean: a exists alone, A and B exist together, and B exists alone. In the description of the embodiments of the present application, unless otherwise indicated, the meaning of "a plurality" means two or more. For example, a plurality of positioning posts refers to two or more positioning posts. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The present invention will be described in detail below.
As shown in fig. 1-5:
on the one hand:
the printing stacking clamp for the small-size circuit substrate 2 comprises a stacking clamp body 1 provided with a clamping cavity 10, and two groups of protruding structures which are arranged in the symmetrical two sides of the clamping cavity in a staggered manner;
the convex structure comprises a plurality of convex 11 with the same structure; clamping positioning grooves 12 are formed between two adjacent bulges 11 on the same side; the clamping positioning grooves 12 on one side of the clamping cavity 10 are arranged in one-to-one correspondence with the protrusions 11 on the other side of the clamping cavity 10.
The spacing between two adjacent bulges 11 on the same side can be equal or unequal; which is determined mainly depending on whether the widths of the plurality of circuit substrates 2 having the same length are the same; if the widths of the plurality of circuit substrates 2 are the same, the projections 11 are arranged at equal intervals; if the widths of the plurality of circuit boards 2 having the same length are different, the pitch between the adjacent two projections 11 is set according to the width of the circuit board 2.
As shown in fig. 1, the protrusions 11 are arranged on two symmetrical inner side surfaces of the clamping cavity 10 and are staggered, and clamping positioning grooves 12 are formed between two adjacent protrusions and the inner side surfaces of the clamping cavity 10;
when the printing device is used, the printing stacking clamp is placed in a vacuum adsorption area of the working table of the printing device, the circuit substrate 2 is installed in the clamping cavity 10, the position staggering between two adjacent rows of the circuit substrate 2 is realized through the clamping positioning groove 12, and the printing stacking clamp and the circuit substrate 2 are adsorbed and fixed on the working table together by utilizing the vacuum adsorption of the working table of the printing device; the screen 20 is clamped above the stacked circuit substrates 2, a certain off-screen distance is set, and then printing is performed.
Compared with the prior art, the circuit substrates 2 with the same thickness are placed in the clamping cavity in an staggered mode, good fixing is achieved, consistency and stability of a printing surface in a printing process can be guaranteed, all the circuit chips are arranged in close proximity, and batch processing capacity is high. The invention solves the problems of low printing efficiency and high operation difficulty of the surface patterns of the small-size circuit substrate and realizes batch printing of the surface patterns of the small-size circuit substrate.
Preferably, the outer contour dimension of the stacking clamp body 1 is larger than the vacuum adsorption area of the workbench of the printing equipment; thus, the circuit substrate 2 which is piled up in the whole piling clamp body 1 can be adsorbed and fixed by vacuum;
in some possible embodiments, in order to effectively achieve constrained positioning for each row of circuit substrates 2;
the length a of the protrusion 11 along the length direction of the circuit substrate 2, wherein a=1/4A to 3/4A of the length a of the circuit substrate 2; namely: the length a of the protrusion along the length direction of the circuit substrate is 25% -75% of the length A of the circuit substrate.
In some of the possible embodiments of the present invention,
the clamping positioning groove 12 has a width D along the width direction of the circuit substrate 2, and the width of the circuit substrate 2 is D, wherein D-d=0.05 mm to 0.2mm. Namely: the width D of the clamping positioning groove 12 along the width direction of the circuit substrate 2 is 0.05 mm-0.2 mm larger than the width D of the circuit substrate 2
In some possible embodiments, to avoid that the screen 20 comes into contact with the printing stack during printing, affecting quality;
the thickness of the printing stacking clamp is H, and the thickness of the circuit substrate 2 is H, wherein H-h=0.1 mm-0.5 mm; namely: the thickness H of the print stacking jig is thinner than the thickness H of the circuit board 2 by 0.1 to 0.5mm.
In some possible embodiments to facilitate clamping and positioning of the circuit substrate 2 while avoiding vacuum leakage over a large area;
the effective length of the clamping cavity is E, and the sum of the lengths of a plurality of circuit substrates 2 arranged in the clamping cavity is E, wherein E-E which is more than or equal to 0.1mm and less than or equal to 0.5mm; namely: the effective length E of the holding chamber 10 is 0.1mm to 0.5mm larger than the sum E of the lengths of the plurality of circuit boards 2 mounted therein.
In some possible embodiments, to facilitate clamping and positioning of the circuit substrate 2 while avoiding vacuum leakage over a large area;
the width of the clamping cavity 10 is F, and the sum of the widths of the circuit substrates 2 arranged in a plurality of rows is F, wherein F-F is more than or equal to 0.1mm and less than or equal to 0.5mm; namely: the effective width F of the holding chamber 10 is 0.1mm to 0.5mm larger than the sum F of the widths of the plurality of rows of circuit boards 2 mounted therein.
In some of the possible embodiments of the present invention,
the stacking clamp body 1 and the protrusions 11 are integrally formed, and are made of bakelite plates, aluminum alloy, stainless steel and other equivalent materials.
On the other hand:
the application method of the printing stacking clamp for the small-size circuit substrate 2 specifically comprises the following steps:
mounting a printing stacking clamp on a vacuum adsorption area on a workbench of printing equipment, and starting a vacuum adsorption function of the printing equipment for adsorption and fixation;
the circuit substrate 2 is arranged in the clamping cavity 10 of the printing stacking clamp, and finally the circuit substrate 2 is arranged in a plurality of rows, adjacent and staggered manner according to the position limitation of the clamping cavity 10;
the printing stacking clamp and the circuit substrate 2 are fixed on the workbench through vacuum adsorption of the workbench of the printing equipment;
the silk screen 20 is clamped above the stacked circuit substrates 2, a certain off-screen distance is set, and pattern printing is achieved through the printing scraper.
Example 1:
the small-sized circuit board 2 in the present embodiment means: the multilayer cofired ceramic circuit board 2 is smaller than 30mm in length and width and smaller than 5mm in thickness;
in the embodiment, 45 LTCC substrates subjected to cofiring and profile cutting are subjected to one-time printing, the size of the circuit substrate 2 is 22mm by 15mm, and the thickness of the circuit substrate 2 is 3.2mm;
in order to meet the requirement of stacking 45 LTCC substrates, a 9-row and 5-column compact staggered stacking method design is carried out: the staggered distance between two adjacent rows is 11mm, and the 9 rows are stacked to form a whole, wherein the length of the whole is 110mm, and the width of the whole is 135mm;
the stacking fixture body 1 of the printing stacking fixture is made of bakelite plates, the thickness of the printing stacking fixture is 3.0mm, the overall dimension is 220mm x 220mm, the length of each protrusion 11 along the length direction of the circuit substrate 2 is 11.0mm, the width of the clamping positioning groove 12 between two adjacent protrusions 11 is 15.1mm, the effective length of the clamping cavity 10 is 110.2mm, and the effective width of the clamping cavity 10 is 135.2mm;
placing the printing stacking clamp on a vacuum adsorption area of a workbench of printing equipment, and starting a vacuum adsorption function of the equipment to perform adsorption fixation;
45 LTCC circuit substrates 2 are arranged in the clamping cavity 10 of the printing stacking clamp, and finally the circuit substrates 2 are arranged in a close-to-close and staggered mode according to the position limitation of the clamping positioning groove 12.
Fixing the printing stacking clamp and the LTCC circuit substrate 2 on a workbench through vacuum adsorption of a workbench of printing equipment, wherein the surface of the printing stacking clamp is 0.2mm lower than the surface of the substrate;
the stacked circuit substrates 2 are printed, the pressure application of the printing scraping strips is shown in fig. 4, D is the advancing direction of the printing scraping knife, S-start, S-n and S-end respectively represent the starting position, the middle position and the end position of the product area in the advancing process of the printing scraping knife of the silk screen 20, and the supporting condition of the printing scraping knife by the upper circuit substrate 2 in each position is shown in fig. 5. In the whole printing process, the stacked circuit substrate 2 and the printing stacking clamp are firmly adsorbed on the working table of the printing equipment through the vacuum adsorption force V, the upper surface of the circuit substrate 2 is tightly contacted with the lower surface of the silk screen 20 under the acting force 30, and the carrying of graphic printing is realized.
The invention is not limited to the specific embodiments described above. The invention extends to any novel one, or any novel combination, of the features disclosed in this specification, as well as to any novel one, or any novel combination, of the steps of the method or process disclosed.
Claims (3)
1. The printing stacking clamp for the small-size circuit substrate is characterized by comprising a stacking clamp body provided with clamping cavities and a plurality of protruding structures which are arranged in the symmetrical two sides of the clamping cavities in a staggered manner;
the convex structure comprises a plurality of convex with the same structure; clamping positioning grooves are formed between two adjacent bulges; the clamping positioning grooves on one side of the clamping cavity are in one-to-one correspondence with the bulges on the other side of the clamping cavity; the length a of the protrusion along the length direction of the circuit substrate, wherein a=1/4A-3/4A of the length of the circuit substrate; the width D of the clamping positioning groove along the width direction of the circuit substrate is D, and D-d=0.05 mm-0.2 mm; the thickness of the printing stacking clamp is H, and the thickness of the circuit substrate is H, wherein H-h=0.1 mm-0.5 mm; the effective length of the clamping cavity is E, the sum of the lengths of a plurality of circuit substrates arranged in the clamping cavity is E, and E-E is more than or equal to 0.1mm and less than or equal to 0.5mm; the effective width of the clamping cavity is F, and the sum of the widths of the circuit substrates arranged in the clamping cavity in a plurality of rows is F, wherein F-F is more than or equal to 0.1mm and less than or equal to 0.5mm.
2. The printed stacking jig for small-sized circuit boards according to claim 1, wherein the stacking jig body and the protrusions are integrally formed.
3. The method for using the printing stacking jig for small-sized circuit boards according to any one of claims 1 to 2, comprising the steps of:
mounting a printing stacking clamp on a vacuum adsorption area on a workbench of printing equipment, and starting a vacuum adsorption function of the printing equipment for adsorption and fixation;
the circuit substrate is arranged in the clamping cavity of the printing stacking clamp, and finally the circuit substrate is arranged in a plurality of rows, close to each other and staggered according to the position limitation of the clamping cavity;
the printing stacking clamp and the circuit substrate are fixed on the workbench through vacuum adsorption of the workbench of the printing equipment;
and clamping the silk screen above the stacked circuit substrates, setting the distance from the silk screen, and realizing graphic printing through a printing scraper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210643936.0A CN114919273B (en) | 2022-06-09 | 2022-06-09 | Printing stacking clamp for small-size circuit substrate and using method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210643936.0A CN114919273B (en) | 2022-06-09 | 2022-06-09 | Printing stacking clamp for small-size circuit substrate and using method |
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| CN114919273A CN114919273A (en) | 2022-08-19 |
| CN114919273B true CN114919273B (en) | 2023-06-23 |
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| CN114919273A (en) | 2022-08-19 |
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