CN114917797A - Silicon chip grinds ground paste circulating device - Google Patents
Silicon chip grinds ground paste circulating device Download PDFInfo
- Publication number
- CN114917797A CN114917797A CN202210630676.3A CN202210630676A CN114917797A CN 114917797 A CN114917797 A CN 114917797A CN 202210630676 A CN202210630676 A CN 202210630676A CN 114917797 A CN114917797 A CN 114917797A
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- China
- Prior art keywords
- slurry
- silicon wafer
- collecting
- wafer grinding
- belt
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 54
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 54
- 239000010703 silicon Substances 0.000 title claims abstract description 54
- 239000002002 slurry Substances 0.000 claims abstract description 99
- 238000000227 grinding Methods 0.000 claims abstract description 53
- 238000001914 filtration Methods 0.000 claims abstract description 51
- 238000003756 stirring Methods 0.000 claims description 43
- 230000001360 synchronised effect Effects 0.000 claims description 22
- 230000005540 biological transmission Effects 0.000 claims description 14
- 238000005498 polishing Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 9
- 239000004576 sand Substances 0.000 claims description 7
- 238000005406 washing Methods 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 5
- 239000002699 waste material Substances 0.000 claims description 4
- 239000008237 rinsing water Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 7
- 238000005507 spraying Methods 0.000 description 7
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 5
- 238000011010 flushing procedure Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000011856 silicon-based particle Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002572 peristaltic effect Effects 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F27/00—Mixers with rotary stirring devices in fixed receptacles; Kneaders
- B01F27/80—Mixers with rotary stirring devices in fixed receptacles; Kneaders with stirrers rotating about a substantially vertical axis
- B01F27/90—Mixers with rotary stirring devices in fixed receptacles; Kneaders with stirrers rotating about a substantially vertical axis with paddles or arms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D33/00—Filters with filtering elements which move during the filtering operation
- B01D33/04—Filters with filtering elements which move during the filtering operation with filtering bands or the like supported on cylinders which are impervious for filtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D33/00—Filters with filtering elements which move during the filtering operation
- B01D33/44—Regenerating the filter material in the filter
- B01D33/48—Regenerating the filter material in the filter by flushing, e.g. counter-current air-bumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D36/00—Filter circuits or combinations of filters with other separating devices
- B01D36/02—Combinations of filters of different kinds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/70—Pre-treatment of the materials to be mixed
- B01F23/708—Filtering materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/80—After-treatment of the mixture
- B01F23/808—Filtering the mixture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
The invention belongs to the technical field of silicon wafer grinding processing, and particularly relates to a silicon wafer grinding slurry circulating device, which comprises: the coarse filter is used for performing coarse filtration on the silicon wafer grinding slurry; the slurry collecting barrel is used for collecting the silicon wafer grinding slurry subjected to coarse filtration; the belt type filtering mechanism is used for finely filtering the silicon wafer grinding slurry in the slurry collecting barrel; the slurry output barrel is used for collecting the silicon wafer grinding slurry subjected to fine filtration; the slurry output barrel is provided with a slurry output port and used for outputting silicon wafer grinding slurry to grind and process the silicon wafer. According to the silicon wafer grinding slurry circulating device, the filtering link is divided into two procedures of coarse filtering and fine filtering, wherein the belt type filtering mechanism designed in the fine filtering link enables the filtering net to circulate through belt type rotation, filtering holes for filtering are continuously updated, and the problem of blockage is reduced.
Description
Technical Field
The invention belongs to the technical field of silicon wafer grinding, and particularly relates to a silicon wafer grinding slurry circulating device.
Background
Monocrystalline silicon has become one of the most widely used semiconductor materials in integrated circuit fabrication, with more than 95% of semiconductor devices and more than 99% of integrated circuits worldwide using monocrystalline silicon as the substrate material.
In the process of preparing the silicon wafer, the surface of the monocrystalline silicon wafer needs to be ground and polished, and when the monocrystalline silicon wafer is ground and polished, the front side and the back side of the monocrystalline silicon wafer are ground and polished simultaneously by two modes, namely two-sided grinding. In order to reduce the material cost in the grinding treatment link, a grinding slurry circulation process is generally adopted, and more silicon grinding sheets can be processed under the condition of the same amount of grinding sand and grinding fluid. However, the following disadvantages exist during the circulation of the abrasive slurry:
(1) because the grinding sand particles are small, the ground silicon particles can be adsorbed on the grinding sand, so that the silicon particles can be agglomerated in the filtering process, a filtering opening is blocked, and filtering cannot be performed;
(2) the filtering speed is slow, and the grinding slurry is easy to overflow from the filtering opening.
Disclosure of Invention
In view of the above-mentioned disadvantages and shortcomings of the prior art, it is an object of the present invention to at least address one or more of the above-mentioned problems of the prior art, in other words, to provide an apparatus for circulating a silicon wafer polishing slurry that satisfies one or more of the above-mentioned needs.
In order to achieve the purpose, the invention adopts the following technical scheme:
a silicon wafer grinding slurry circulating device comprises:
the coarse filter is used for performing coarse filtration on the silicon wafer grinding slurry;
the slurry collecting barrel is used for collecting the silicon wafer grinding slurry subjected to coarse filtration;
the belt type filtering mechanism is used for finely filtering the silicon wafer grinding slurry in the slurry collecting barrel;
the slurry output barrel is used for collecting the silicon wafer grinding slurry subjected to fine filtration; the slurry output barrel is provided with a slurry output port and used for outputting silicon wafer grinding slurry to grind the silicon wafer.
As a preferred scheme, the slurry collecting barrel is communicated to the upper part of the belt type filtering mechanism through a conveying pipeline, and the silicon wafer grinding slurry is sprayed to the belt type filtering mechanism through a spray head;
wherein, the conveying pipeline is provided with a sand pump.
Preferably, the belt type filtering mechanism comprises a rack, and a driving roller, a driven roller, a conveying filter belt, a liquid collecting tank and a driving mechanism which are arranged on the rack, wherein the conveying filter belt is wound on the driving roller and the driven roller, the driving mechanism is used for driving the driving roller to rotate, and the liquid collecting tank is used for collecting silicon wafer grinding slurry which is finely filtered by the conveying filter belt.
As a preferred scheme, the driving mechanism comprises a motor, a small synchronous pulley, a large synchronous pulley and a synchronous belt, the small synchronous pulley is coaxially connected with a motor shaft of the motor, the large synchronous pulley is coaxially connected with the driving roller, and the synchronous belt is wound on the small synchronous pulley and the large synchronous pulley.
Preferably, a spraying and washing device is arranged on one side of the rack and used for spraying and washing the conveying filter belt.
Preferably, the frame is further provided with a material collecting groove, and the material collecting groove is used for collecting residual slurry and spraying flushing water on the conveying filter belt.
As the preferred scheme, the material collecting groove is communicated with the outside through a waste discharge pipeline.
Preferably, a stirring mechanism is arranged in the slurry collecting barrel.
Preferably, a stirring mechanism is arranged in the slurry output barrel.
As the preferred scheme, the stirring mechanism comprises a stirring motor, a stirring shaft and stirring blades, wherein the stirring motor is in transmission connection with the stirring shaft, and the stirring blades are arranged on the stirring shaft.
Compared with the prior art, the invention has the beneficial effects that:
according to the silicon wafer grinding slurry circulating device, the filtering link is divided into two procedures of coarse filtering and fine filtering, wherein the belt type filtering mechanism designed in the fine filtering link enables the filtering net to circulate through belt type rotation, filtering holes for filtering are continuously updated, and the problem of blockage is reduced; and the filter is matched with spray flushing equipment for real-time cleaning, so that the problems of filter blockage and low filter rate and easiness in overflow caused by the filter blockage in the prior art are solved.
Drawings
FIG. 1 is a schematic structural view of a silicon wafer polishing slurry circulation apparatus according to example 1 of the present invention;
FIG. 2 is a schematic view of the structure of a belt filter mechanism according to embodiment 1 of the present invention;
FIG. 3 is a schematic view of an internal transmission structure of a belt filter mechanism according to embodiment 1 of the present invention;
FIG. 4 is a schematic view of an external transmission structure of a belt filter mechanism according to embodiment 1 of the present invention;
fig. 5 is a schematic structural view of a stirring mechanism in embodiment 1 of the present invention.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention, the following description will explain the embodiments of the present invention with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.
Example 1:
as shown in fig. 1 to 4, the silicon wafer polishing slurry circulation apparatus of the present embodiment includes a coarse filter 3, a slurry collection tank 5, a belt filter mechanism 8, and a slurry output tank 13.
Specifically, the coarse filter 3 is used to coarsely filter the silicon wafer abrasive slurry discharged from the outlet 1 of the grinder.
The slurry collecting barrel 5 of the present embodiment is located below the coarse filter 3, and is configured to collect the silicon wafer polishing slurry subjected to the coarse filtration.
The belt type filtering mechanism 8 of the embodiment is used for finely filtering silicon wafer grinding slurry in the slurry collecting barrel. The slurry collecting barrel 5 is communicated to the upper side of the belt type filtering mechanism 8 through a conveying pipeline 6, and the silicon wafer grinding slurry is sprayed to the belt type filtering mechanism 8 through a spraying head 7 so as to be subjected to fine filtering. The conveying pipeline 6 is provided with a sand pump 2 to realize pumping.
Specifically, the belt type filtering mechanism 8 comprises a frame 25, a driving roller 23, a driven roller 24, a transmission filter belt 14, a liquid collecting tank 15 and a driving mechanism, wherein the driving roller 23, the driven roller 24, the transmission filter belt 14, the liquid collecting tank 15 and the driving mechanism are installed on the frame, the transmission filter belt 14 is wound on the driving roller 23 and the driven roller 24, the driving mechanism is used for driving the driving roller 23 to rotate, the liquid collecting tank 15 is used for collecting silicon wafer grinding slurry which is finely filtered by the transmission filter belt 14, and the liquid collecting tank 15 is communicated with the slurry output barrel 13 through a pipeline 9. Wherein, actuating mechanism includes motor 21, motor cover 22, little synchronous pulley 20, big synchronous pulley 18 and hold-in range 19, and little synchronous pulley 20 and motor 21's motor shaft coaxial coupling, big synchronous pulley 18 and drive roll 23 coaxial coupling, hold-in range 19 around locating little synchronous pulley 20 and big synchronous pulley 18, realize the transmission.
In addition, one side of the frame 25 can be provided with an opening which is externally connected with a spraying and washing device and used for spraying and washing the conveying filter belt, and the specific setting position can be adjusted according to the actual structural design.
A material collecting groove is also arranged on the frame 25 and is used for collecting residual slurry and spraying flushing water on the transmission filter belt; the sump communicates with the environment via a waste pipe 10, for example to a subsurface drainage channel.
The slurry output barrel 13 of the present embodiment is used for collecting the silicon wafer polishing slurry subjected to the fine filtration; the slurry output barrel is provided with a slurry output port 12 and used for outputting silicon wafer grinding slurry to grind the silicon wafer, and the slurry is recycled.
The slurry collecting barrel 5 of the embodiment is internally provided with a stirring mechanism for stirring the grinding slurry in the stirring mechanism to prevent precipitation.
The slurry output barrel 13 of this embodiment is also provided with a stirring mechanism for stirring the slurry therein to prevent sedimentation.
As shown in fig. 5, the stirring mechanism includes a stirring motor 4, a stirring shaft 16, and a stirring blade 17, the stirring motor is connected to the stirring shaft in a transmission manner, and the stirring blade 17 is disposed on the stirring shaft 16.
The operation process of the silicon wafer polishing slurry circulating device of the embodiment is as follows:
the grinding slurry is discharged from an outlet 1 of the grinding machine, passes through a coarse filter 3 and enters a slurry collecting barrel 5, a stirring motor 4 positioned above the slurry collecting barrel 5 drives a stirring shaft 16 and a stirring blade 17 to stir the grinding slurry to prevent the grinding slurry from precipitating, the grinding slurry in the slurry collecting barrel 5 is sprayed onto a belt type filtering mechanism 8 from a spray head 7 through a sand pump 2 arranged above the grinding slurry through a conveying pipeline 6, the grinding slurry is filtered by a conveying filter belt 14 (a belt type filter screen) on the belt type filtering mechanism 8, enters a liquid collecting tank 15 and enters a slurry output barrel 13 at the lower part through a pipeline 9, a stirring motor 11 is arranged above the slurry output barrel 13, the stirring motor 11 drives the stirring rotating shaft and the stirring blades to stir the grinding slurry to prevent precipitation, and finally, the filtered grinding slurry is pumped by a peristaltic pump arranged on the double-sided grinding machine through a slurry output port 12 to grind and process the silicon wafer; the abrasive slurry remaining on the belt filter 8 is discharged directly to a drain channel through a waste pipe 10 provided below the belt filter 8.
The foregoing has outlined rather broadly the preferred embodiments and principles of the present invention and it will be appreciated that those skilled in the art may devise variations of the present invention that are within the spirit and scope of the appended claims.
Claims (10)
1. A silicon wafer grinding slurry circulating device is characterized by comprising:
the coarse filter is used for performing coarse filtration on the silicon wafer grinding slurry;
the slurry collecting barrel is used for collecting the silicon wafer grinding slurry subjected to coarse filtration;
the belt type filtering mechanism is used for finely filtering the silicon wafer grinding slurry in the slurry collecting barrel;
the slurry output barrel is used for collecting the silicon wafer grinding slurry subjected to fine filtration; the slurry output barrel is provided with a slurry output port and used for outputting silicon wafer grinding slurry to grind the silicon wafer.
2. The silicon wafer polishing slurry circulation device according to claim 1, wherein the slurry collecting barrel is communicated to the upper part of the belt-type filtering mechanism through a conveying pipeline, and the silicon wafer polishing slurry is sprayed to the belt-type filtering mechanism through a spray head;
wherein, the conveying pipeline is provided with a sand pump.
3. The silicon wafer grinding slurry circulating device according to claim 2, wherein the belt type filter mechanism comprises a frame, and a driving roller, a driven roller, a transmission filter belt, a liquid collecting tank and a driving mechanism which are arranged on the frame, wherein the transmission filter belt is wound on the driving roller and the driven roller, the driving mechanism is used for driving the driving roller to rotate, and the liquid collecting tank is used for collecting the silicon wafer grinding slurry which is finely filtered by the transmission filter belt.
4. The silicon wafer grinding slurry circulating device according to claim 3, wherein the driving mechanism comprises a motor, a small synchronous pulley, a large synchronous pulley and a synchronous belt, the small synchronous pulley is coaxially connected with a motor shaft of the motor, the large synchronous pulley is coaxially connected with the driving roller, and the synchronous belt is wound around the small synchronous pulley and the large synchronous pulley.
5. The silicon wafer polishing slurry circulating apparatus according to claim 3, wherein a shower washing device is provided on one side of the frame for shower washing the transfer filter belt.
6. The apparatus as claimed in claim 5, wherein a collecting trough is further provided on the frame, the collecting trough collecting residual slurry on the transfer filter belt and spray rinsing water.
7. The silicon wafer polishing slurry circulating apparatus according to claim 6, wherein the collecting tank is connected to the outside through a waste discharge pipe.
8. The apparatus as claimed in claim 1, wherein a stirring mechanism is provided in the slurry collecting vessel.
9. The silicon wafer polishing slurry circulation device according to claim 1, wherein a stirring mechanism is provided in the slurry outlet barrel.
10. The silicon wafer grinding slurry circulating device according to claim 8 or 9, wherein the stirring mechanism comprises a stirring motor, a stirring shaft and a stirring blade, the stirring motor is in transmission connection with the stirring shaft, and the stirring blade is arranged on the stirring shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210630676.3A CN114917797A (en) | 2022-06-06 | 2022-06-06 | Silicon chip grinds ground paste circulating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210630676.3A CN114917797A (en) | 2022-06-06 | 2022-06-06 | Silicon chip grinds ground paste circulating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114917797A true CN114917797A (en) | 2022-08-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210630676.3A Pending CN114917797A (en) | 2022-06-06 | 2022-06-06 | Silicon chip grinds ground paste circulating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114917797A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6306020B1 (en) * | 2000-03-10 | 2001-10-23 | The United States Of America As Represented By The Department Of Energy | Multi-stage slurry system used for grinding and polishing materials |
| CN207309690U (en) * | 2017-10-17 | 2018-05-04 | 马鞍山荣泰科技有限公司 | A kind of recyclable wafer polishing apparatus |
| CN213004696U (en) * | 2020-06-29 | 2021-04-20 | 深圳融科科技有限公司 | Grinding fluid regeneration and recovery system |
| CN213407923U (en) * | 2020-09-03 | 2021-06-11 | 河南绿丰环保工程有限公司 | Special dirt separator of sewage preliminary treatment |
-
2022
- 2022-06-06 CN CN202210630676.3A patent/CN114917797A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6306020B1 (en) * | 2000-03-10 | 2001-10-23 | The United States Of America As Represented By The Department Of Energy | Multi-stage slurry system used for grinding and polishing materials |
| CN207309690U (en) * | 2017-10-17 | 2018-05-04 | 马鞍山荣泰科技有限公司 | A kind of recyclable wafer polishing apparatus |
| CN213004696U (en) * | 2020-06-29 | 2021-04-20 | 深圳融科科技有限公司 | Grinding fluid regeneration and recovery system |
| CN213407923U (en) * | 2020-09-03 | 2021-06-11 | 河南绿丰环保工程有限公司 | Special dirt separator of sewage preliminary treatment |
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Application publication date: 20220819 |
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| RJ01 | Rejection of invention patent application after publication |