CN114899561B - Embedded combined ceramic filter - Google Patents
Embedded combined ceramic filter Download PDFInfo
- Publication number
- CN114899561B CN114899561B CN202210489998.0A CN202210489998A CN114899561B CN 114899561 B CN114899561 B CN 114899561B CN 202210489998 A CN202210489998 A CN 202210489998A CN 114899561 B CN114899561 B CN 114899561B
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- CN
- China
- Prior art keywords
- ceramic
- filter
- low
- cavity filter
- temperature
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Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 103
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 238000000608 laser ablation Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 abstract description 2
- 230000037431 insertion Effects 0.000 abstract description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The invention discloses an embedded combined ceramic filter, which comprises a ceramic cavity filter and a low-temperature co-fired ceramic bottom pass filter, wherein the ceramic cavity filter and the low-temperature co-fired ceramic bottom pass filter are respectively prepared by adopting two microwave low-loss dielectric ceramics; embedding a low-temperature co-fired ceramic bottom pass filter on the bottom surface of the ceramic cavity filter; and a microstrip line is arranged on the bottom surface of the ceramic cavity filter, and the output end of the bottom surface of the ceramic cavity filter is electrically connected with the input end of the bottom surface of the low-temperature co-fired ceramic bottom-pass filter through the microstrip line. The embedded combined ceramic filter has the advantages of small volume, low insertion loss, good out-of-band rejection and the like.
Description
Technical Field
The invention relates to an embedded combined ceramic filter.
Background
Filtering is an important concept in signal processing, and filters are required for filtering. A filter is a device that filters waves, and can pass certain frequency components in a signal while greatly attenuating or suppressing other frequency components. The ceramic cavity filter and the low-temperature co-fired ceramic bottom pass filter are the existing filter types, but at present, the two filters are independently used, and no scheme for combining the two filters into a whole is available.
Disclosure of Invention
The invention aims to provide an embedded combined ceramic filter, which comprises a ceramic cavity filter and a low-temperature co-fired ceramic bottom pass filter, wherein the ceramic cavity filter and the low-temperature co-fired ceramic bottom pass filter are respectively prepared by adopting two microwave low-loss dielectric ceramics; embedding a low-temperature co-fired ceramic bottom pass filter on the bottom surface of the ceramic cavity filter; and a microstrip line is arranged on the bottom surface of the ceramic cavity filter, and the output end of the bottom surface of the ceramic cavity filter is electrically connected with the input end of the bottom surface of the low-temperature co-fired ceramic bottom-pass filter through the microstrip line.
Preferably, the side wall of the ceramic cavity filter is provided with: and the resonant frequency adjusting circuit is used for adjusting the resonant frequency of the ceramic cavity filter.
Preferably, a ceramic cavity filter is provided with: and a shield for covering the resonant frequency adjusting circuit.
Preferably, an air window for debugging is formed in the shielding case.
Preferably, a silver layer is coated on the outer surface of the ceramic cavity filter, and laser ablation is adopted to enable the silver layer to form a resonant frequency adjusting circuit.
The invention has the advantages and beneficial effects that:
the low-temperature co-fired ceramic bottom pass filter is embedded in the bottom surface of the ceramic cavity filter, so that the volume of the whole filter is reduced, and the whole filter is convenient to weld and test.
The in-band loss of the embedded combined ceramic filter is less than 2.0dB.
The out-of-band far-end inhibition of the embedded combined ceramic filter reaches 6G.
The embedded combined ceramic filter has the advantages of small volume, low insertion loss, good out-of-band rejection and the like.
Drawings
FIG. 1 is a schematic front view of an embedded composite ceramic filter;
FIG. 2 is a schematic illustration of the shielded enclosure of FIG. 1 after removal;
fig. 3 is a schematic back view of an embedded combined ceramic filter.
Detailed Description
The following describes the embodiments of the present invention further with reference to the drawings and examples. The following examples are only for more clearly illustrating the technical aspects of the present invention, and are not intended to limit the scope of the present invention.
An embedded combined ceramic filter comprises a ceramic cavity filter and a low-temperature co-fired ceramic bottom pass filter which are respectively prepared by adopting two microwave low-loss dielectric ceramics;
embedding a low-temperature co-fired ceramic bottom pass filter on the bottom surface of the ceramic cavity filter;
a microstrip line is arranged on the bottom surface of the ceramic cavity filter, and the output end of the bottom surface of the ceramic cavity filter is electrically connected with the input end of the bottom surface of the low-temperature co-fired ceramic bottom-pass filter through the microstrip line;
the side wall of the ceramic cavity filter is provided with: a resonant frequency adjusting circuit for adjusting a resonant frequency of the ceramic cavity filter;
firstly, coating a silver layer on the outer surface of a ceramic cavity filter, and forming a resonant frequency adjusting circuit by adopting laser ablation to form the silver layer;
the ceramic cavity filter is provided with: a shield for covering the resonant frequency adjustment circuit;
an air window for debugging is arranged on the shielding cover.
Specific embodiments of the invention are as follows:
as shown in fig. 1 to 3, an embedded combined ceramic filter comprises a low-temperature co-fired ceramic bottom-pass filter 1 and a ceramic cavity filter 2;
the low-temperature co-fired ceramic bottom pass filter 1 and the ceramic cavity filter 2 are respectively prepared from two types of microwave low-loss dielectric ceramics, wherein the two types of microwave low-loss dielectric ceramics are both high-dielectric-constant ceramic materials;
the right side of the front end of the bottom surface of the ceramic cavity filter 2 is provided with: a right pad 31 as an input terminal of the ceramic cavity filter 2;
the left side of the front end of the bottom surface of the ceramic cavity filter 2 is provided with: a left pad 32 as an output end of the ceramic cavity filter 2;
the left side of the rear end of the bottom surface of the ceramic cavity filter 2 is provided with: an embedded groove for installing the low-temperature co-fired ceramic bottom pass filter 1; the embedded groove is arranged along the front-back direction;
the low-temperature co-fired ceramic bottom pass filter 1 is embedded in the embedded groove, and the combination of the low-temperature co-fired ceramic bottom pass filter 1 and the ceramic cavity filter 2 is realized through silver brushing and co-firing;
the front end of the bottom surface of the low-temperature co-fired ceramic bottom-pass filter 1 is provided with: a front pad 33 as an input terminal of the low-temperature co-fired ceramic bottom pass filter 1;
the rear end of the bottom surface of the low-temperature co-fired ceramic bottom pass filter 1 is provided with: a rear bonding pad 34 as the output end of the low-temperature co-fired ceramic bottom-pass filter 1;
the bottom surface of ceramic cavity filter 2 still is equipped with: a microstrip line 4 extending from the left pad 32 to the front pad 33;
a row of resonant holes 5 are arranged in the ceramic cavity filter 2, the resonant holes 5 are arranged at equal intervals along the left-right direction, and the resonant holes 5 are arranged along the front-back direction;
the front end of the ceramic cavity filter 2 is provided with: a sheet silver layer 6 for adjusting the resonance frequency of the ceramic cavity filter 2; firstly, completely covering the outer surface of the ceramic cavity filter 2 with silver, and then laser ablating a flaky silver layer 6 at the front end of the ceramic cavity filter 2;
the front side of the ceramic cavity filter 2 is provided with: a shield 7 for covering the sheet silver layer 6; the shielding cover 7 is fixedly connected with the ceramic cavity filter 2; the shield cover 7 is provided with: a debug air window 8.
The right pad 31 is used as the input end of the whole embedded combined ceramic filter, and the later pad 34 is used as the output end of the whole embedded combined ceramic filter.
According to the invention, the low-temperature co-fired ceramic bottom pass filter 1 is embedded in the bottom surface of the ceramic cavity filter 2, so that the volume of the whole filter is reduced, and the whole welding and testing are convenient.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that it will be apparent to those skilled in the art that several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the scope of the invention.
Claims (7)
1. The embedded combined ceramic filter is characterized by comprising a ceramic cavity filter and a low-temperature co-fired ceramic low-pass filter which are respectively prepared by adopting two microwave low-loss dielectric ceramics; embedding a low-temperature co-fired ceramic low-pass filter on the bottom surface of the ceramic cavity filter; and a microstrip line is arranged on the bottom surface of the ceramic cavity filter, and the output end of the bottom surface of the ceramic cavity filter is electrically connected with the input end of the bottom surface of the low-temperature co-fired ceramic low-pass filter through the microstrip line.
2. The embedded combined ceramic filter of claim 1, wherein the ceramic cavity filter is provided with: and the resonant frequency adjusting circuit is used for adjusting the resonant frequency of the ceramic cavity filter.
3. The embedded combined ceramic filter of claim 2, wherein the ceramic cavity filter is provided with: and a shield for covering the resonant frequency adjusting circuit.
4. The embedded ceramic filter of claim 3, wherein a debugging air window is provided in the shield.
5. The embedded ceramic filter of claim 4, wherein the ceramic cavity filter has a silver layer applied to an outer surface thereof, and the silver layer is formed into a resonant frequency adjustment circuit by laser ablation.
6. The embedded combined ceramic filter of claim 1, wherein the filter in-band loss is less than 2.0dB.
7. The embedded combined ceramic filter of claim 1, wherein the out-of-band far-end rejection of the filter reaches 6G.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210489998.0A CN114899561B (en) | 2022-05-07 | 2022-05-07 | Embedded combined ceramic filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210489998.0A CN114899561B (en) | 2022-05-07 | 2022-05-07 | Embedded combined ceramic filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114899561A CN114899561A (en) | 2022-08-12 |
| CN114899561B true CN114899561B (en) | 2023-11-17 |
Family
ID=82720089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210489998.0A Active CN114899561B (en) | 2022-05-07 | 2022-05-07 | Embedded combined ceramic filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114899561B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5157364A (en) * | 1991-05-22 | 1992-10-20 | Hughes Aircraft Company | Airline transmission structures in low temperature co-fired ceramic |
| US6483404B1 (en) * | 2001-08-20 | 2002-11-19 | Xytrans, Inc. | Millimeter wave filter for surface mount applications |
| KR20040016105A (en) * | 2002-08-16 | 2004-02-21 | 엘지이노텍 주식회사 | Module for high frequency switch |
| JP2004203631A (en) * | 2002-12-24 | 2004-07-22 | Abc Taiwan Electronics Corp | Ceramic, low-temperature co-fired ceramic-ferrite composite material, method for preparing slurry, and method for manufacturing combined filter inhibiting electromagnetic interference |
| CN104466308A (en) * | 2014-11-28 | 2015-03-25 | 南通大学 | Balanced dielectric filter and manufacturing method thereof |
| CN107768785A (en) * | 2016-10-24 | 2018-03-06 | 苏州艾福电子通讯有限公司 | A kind of built-in ceramic cavity body filter |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7290555B2 (en) * | 2004-06-18 | 2007-11-06 | Harris Corporation | Embedded microfluidic check-valve |
-
2022
- 2022-05-07 CN CN202210489998.0A patent/CN114899561B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5157364A (en) * | 1991-05-22 | 1992-10-20 | Hughes Aircraft Company | Airline transmission structures in low temperature co-fired ceramic |
| US6483404B1 (en) * | 2001-08-20 | 2002-11-19 | Xytrans, Inc. | Millimeter wave filter for surface mount applications |
| KR20040016105A (en) * | 2002-08-16 | 2004-02-21 | 엘지이노텍 주식회사 | Module for high frequency switch |
| JP2004203631A (en) * | 2002-12-24 | 2004-07-22 | Abc Taiwan Electronics Corp | Ceramic, low-temperature co-fired ceramic-ferrite composite material, method for preparing slurry, and method for manufacturing combined filter inhibiting electromagnetic interference |
| CN104466308A (en) * | 2014-11-28 | 2015-03-25 | 南通大学 | Balanced dielectric filter and manufacturing method thereof |
| CN107768785A (en) * | 2016-10-24 | 2018-03-06 | 苏州艾福电子通讯有限公司 | A kind of built-in ceramic cavity body filter |
Non-Patent Citations (2)
| Title |
|---|
| A Ka-band cavity bandpass filter using LTCC technology;Cheng Quan et.al;《2009 International Conference on Applied Superconductivity and Electromagnetic Devices》;全文 * |
| 一种改进结构的LTCC滤波器;汤清华;熊波涛;吴国安;罗伟;;华中科技大学学报(自然科学版)(第02期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114899561A (en) | 2022-08-12 |
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