CN114899561A - Embedded combined ceramic filter - Google Patents
Embedded combined ceramic filter Download PDFInfo
- Publication number
- CN114899561A CN114899561A CN202210489998.0A CN202210489998A CN114899561A CN 114899561 A CN114899561 A CN 114899561A CN 202210489998 A CN202210489998 A CN 202210489998A CN 114899561 A CN114899561 A CN 114899561A
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- CN
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- Prior art keywords
- filter
- ceramic
- low
- embedded
- temperature
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- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 102
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 239000002131 composite material Substances 0.000 claims description 5
- 238000000608 laser ablation Methods 0.000 claims description 3
- 238000003780 insertion Methods 0.000 abstract description 2
- 230000037431 insertion Effects 0.000 abstract description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/201—Filters for transverse electromagnetic waves
- H01P1/203—Strip line filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
Abstract
The invention discloses an embedded combined ceramic filter, which comprises a ceramic cavity filter and a low-temperature co-fired ceramic bottom-pass filter, wherein the ceramic cavity filter and the low-temperature co-fired ceramic bottom-pass filter are respectively prepared by adopting two microwave low-loss dielectric ceramics; embedding a low-temperature co-fired ceramic bottom-pass filter into the bottom surface of the ceramic cavity filter; the bottom surface of the ceramic cavity filter is provided with a microstrip line, and the output end of the bottom surface of the ceramic cavity filter is electrically connected with the input end of the bottom surface of the low-temperature co-fired ceramic bottom-pass filter through the microstrip line. The embedded combined ceramic filter has the performances of small volume, low insertion loss, better out-of-band rejection and the like.
Description
Technical Field
The invention relates to an embedded combined ceramic filter.
Background
Filtering is an important concept in signal processing, and a filter is required for filtering. A filter is a device that filters waves, and can pass specific frequency components of a signal while greatly attenuating or suppressing other frequency components. The ceramic cavity filter and the low-temperature co-fired ceramic bottom-pass filter are the types of the existing filters, but the two filters are independently used at present, and a scheme for combining the two filters into a whole for use is not provided.
Disclosure of Invention
The invention aims to provide an embedded combined ceramic filter, which comprises a ceramic cavity filter and a low-temperature co-fired ceramic bottom-pass filter, wherein the ceramic cavity filter and the low-temperature co-fired ceramic bottom-pass filter are respectively prepared by adopting two microwave low-loss dielectric ceramics; embedding a low-temperature co-fired ceramic bottom-pass filter into the bottom surface of the ceramic cavity filter; the bottom surface of the ceramic cavity filter is provided with a microstrip line, and the output end of the bottom surface of the ceramic cavity filter is electrically connected with the input end of the bottom surface of the low-temperature co-fired ceramic bottom-pass filter through the microstrip line.
Preferably, the following components are arranged on the side wall of the ceramic cavity filter: and the resonant frequency adjusting circuit is used for adjusting the resonant frequency of the ceramic cavity filter.
Preferably, the ceramic cavity filter is provided with: and a shield for shielding the resonant frequency adjusting circuit.
Preferably, the shielding case is provided with an air window for debugging.
Preferably, the outer surface of the ceramic cavity filter is coated with a silver layer, and the silver layer is formed into a resonant frequency adjusting circuit by laser ablation.
The invention has the advantages and beneficial effects that:
according to the invention, the low-temperature co-fired ceramic bottom-pass filter is embedded in the bottom surface of the ceramic cavity filter, so that the volume of the whole filter is reduced, and the whole welding and testing are convenient.
The in-band loss of the embedded combined ceramic filter is less than 2.0 dB.
The out-of-band far-end rejection of the embedded combined ceramic filter reaches 6G.
The embedded combined ceramic filter has the performances of small volume, low insertion loss, better out-of-band rejection and the like.
Drawings
FIG. 1 is a schematic front view of an embedded composite ceramic filter;
FIG. 2 is a schematic illustration of FIG. 1 with the shield removed;
fig. 3 is a schematic rear view of an embedded composite ceramic filter.
Detailed Description
The following description of the embodiments of the present invention will be made with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
An embedded combined ceramic filter comprises a ceramic cavity filter and a low-temperature co-fired ceramic bottom-pass filter which are respectively prepared by adopting two microwave low-loss dielectric ceramics;
embedding a low-temperature co-fired ceramic bottom-pass filter into the bottom surface of the ceramic cavity filter;
arranging a microstrip line on the bottom surface of the ceramic cavity filter, and electrically connecting the output end of the bottom surface of the ceramic cavity filter with the input end of the bottom surface of the low-temperature co-fired ceramic bottom-pass filter through the microstrip line;
the side wall of the ceramic cavity filter is provided with: a resonant frequency adjusting circuit for adjusting the resonant frequency of the ceramic cavity filter;
firstly, coating a silver layer on the outer surface of a ceramic cavity filter, and forming a resonant frequency adjusting circuit on the silver layer by adopting laser ablation;
the ceramic cavity filter is provided with: a shielding case for covering the resonance frequency adjusting circuit;
an air window for debugging is arranged on the shielding cover.
The specific embodiment of the invention is as follows:
as shown in fig. 1 to 3, an embedded combined ceramic filter includes a low temperature co-fired ceramic bottom-pass filter 1 and a ceramic cavity filter 2;
the low-temperature co-fired ceramic bottom-pass filter 1 and the ceramic cavity filter 2 are respectively prepared by two microwave low-loss dielectric ceramics which are high-dielectric-constant ceramic materials;
the bottom surface front end right side of ceramic cavity wave filter 2 is equipped with: a right pad 31 as an input end of the ceramic cavity filter 2;
the bottom surface front end left side of ceramic cavity filter 2 is equipped with: a left pad 32 as an output end of the ceramic cavity filter 2;
the left side of the rear end of the bottom surface of the ceramic cavity filter 2 is provided with: the embedded groove is used for installing the low-temperature co-fired ceramic bottom-pass filter 1; the embedded groove is arranged along the front and back direction;
the low-temperature co-fired ceramic bottom-pass filter 1 is embedded in the embedded groove, and the low-temperature co-fired ceramic bottom-pass filter 1 and the ceramic cavity filter 2 are combined through silver brushing and co-firing;
the front end of the bottom surface of the low-temperature co-fired ceramic bottom-pass filter 1 is provided with: a front bonding pad 33 as the input end of the low-temperature co-fired ceramic bottom-pass filter 1;
the rear end of the bottom surface of the low-temperature co-fired ceramic bottom-pass filter 1 is provided with: a back bonding pad 34 as the output end of the low temperature co-fired ceramic bottom-pass filter 1;
the bottom surface of the ceramic cavity filter 2 is also provided with: a microstrip line 4 extending from the left pad 32 to the front pad 33;
a row of resonance holes 5 are arranged in the ceramic cavity filter 2, the resonance holes 5 are arranged at equal intervals along the left-right direction, and the resonance holes 5 are arranged along the front-back direction;
the front end of the ceramic cavity filter 2 is provided with: a flaky silver layer 6 for adjusting the resonant frequency of the ceramic cavity filter 2; firstly, the outer surface of the ceramic cavity filter 2 is completely covered by silver, and then a flaky silver layer 6 at the front end of the ceramic cavity filter 2 is ablated by laser;
the front side of the ceramic cavity filter 2 is provided with: a shielding cover 7 for covering the sheet silver layer 6; the shielding cover 7 is fixedly connected with the ceramic cavity filter 2; the shielding case 7 is provided with: the debugging is with an air window 8.
The right pad 31 is used as an input terminal of the entire embedded composite ceramic filter, and the rear pad 34 is used as an output terminal of the entire embedded composite ceramic filter.
According to the invention, the low-temperature co-fired ceramic bottom-pass filter 1 is embedded in the bottom surface of the ceramic cavity filter 2, so that the volume of the whole filter is reduced, and the whole welding and testing are convenient.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the technical principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (7)
1. An embedded combined ceramic filter is characterized by comprising a ceramic cavity filter and a low-temperature co-fired ceramic bottom-pass filter which are respectively prepared by adopting two microwave low-loss dielectric ceramics; embedding a low-temperature co-fired ceramic bottom-pass filter into the bottom surface of the ceramic cavity filter; the bottom surface of the ceramic cavity filter is provided with a microstrip line, and the output end of the bottom surface of the ceramic cavity filter is electrically connected with the input end of the bottom surface of the low-temperature co-fired ceramic bottom-pass filter through the microstrip line.
2. The embedded ceramic combi filter of claim 1, wherein on the side walls of the ceramic cavity filter are provided: and the resonant frequency adjusting circuit is used for adjusting the resonant frequency of the ceramic cavity filter.
3. The embedded ceramic combi filter of claim 2, wherein on the ceramic cavity filter are disposed: and a shield for shielding the resonant frequency adjusting circuit.
4. The embedded ceramic filter of claim 3, wherein an air window for debugging is opened on the shield case.
5. The embedded composite ceramic filter of claim 4, wherein the ceramic cavity is coated with a silver layer on the outer surface of the filter, and the silver layer is formed into a resonant frequency adjusting circuit by laser ablation.
6. The embedded ceramic combined filter of claim 1, wherein the filter in-band loss is less than 2.0 dB.
7. The embedded combined ceramic filter of claim 1, wherein the filter out-of-band far end rejection is up to 6G.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210489998.0A CN114899561B (en) | 2022-05-07 | 2022-05-07 | Embedded combined ceramic filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210489998.0A CN114899561B (en) | 2022-05-07 | 2022-05-07 | Embedded combined ceramic filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114899561A true CN114899561A (en) | 2022-08-12 |
| CN114899561B CN114899561B (en) | 2023-11-17 |
Family
ID=82720089
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210489998.0A Active CN114899561B (en) | 2022-05-07 | 2022-05-07 | Embedded combined ceramic filter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114899561B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5157364A (en) * | 1991-05-22 | 1992-10-20 | Hughes Aircraft Company | Airline transmission structures in low temperature co-fired ceramic |
| US6483404B1 (en) * | 2001-08-20 | 2002-11-19 | Xytrans, Inc. | Millimeter wave filter for surface mount applications |
| KR20040016105A (en) * | 2002-08-16 | 2004-02-21 | 엘지이노텍 주식회사 | Module for high frequency switch |
| JP2004203631A (en) * | 2002-12-24 | 2004-07-22 | Abc Taiwan Electronics Corp | Ceramic, low-temperature co-fired ceramic-ferrite composite material, method for preparing slurry, and method for manufacturing combined filter inhibiting electromagnetic interference |
| US20050279412A1 (en) * | 2004-06-18 | 2005-12-22 | Harris Corporation | Embedded microfluidic check-valve |
| CN104466308A (en) * | 2014-11-28 | 2015-03-25 | 南通大学 | Balanced dielectric filter and manufacturing method thereof |
| CN107768785A (en) * | 2016-10-24 | 2018-03-06 | 苏州艾福电子通讯有限公司 | A kind of built-in ceramic cavity body filter |
-
2022
- 2022-05-07 CN CN202210489998.0A patent/CN114899561B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5157364A (en) * | 1991-05-22 | 1992-10-20 | Hughes Aircraft Company | Airline transmission structures in low temperature co-fired ceramic |
| US6483404B1 (en) * | 2001-08-20 | 2002-11-19 | Xytrans, Inc. | Millimeter wave filter for surface mount applications |
| KR20040016105A (en) * | 2002-08-16 | 2004-02-21 | 엘지이노텍 주식회사 | Module for high frequency switch |
| JP2004203631A (en) * | 2002-12-24 | 2004-07-22 | Abc Taiwan Electronics Corp | Ceramic, low-temperature co-fired ceramic-ferrite composite material, method for preparing slurry, and method for manufacturing combined filter inhibiting electromagnetic interference |
| US20050279412A1 (en) * | 2004-06-18 | 2005-12-22 | Harris Corporation | Embedded microfluidic check-valve |
| CN104466308A (en) * | 2014-11-28 | 2015-03-25 | 南通大学 | Balanced dielectric filter and manufacturing method thereof |
| CN107768785A (en) * | 2016-10-24 | 2018-03-06 | 苏州艾福电子通讯有限公司 | A kind of built-in ceramic cavity body filter |
Non-Patent Citations (2)
| Title |
|---|
| CHENG QUAN ET.AL: "A Ka-band cavity bandpass filter using LTCC technology", 《2009 INTERNATIONAL CONFERENCE ON APPLIED SUPERCONDUCTIVITY AND ELECTROMAGNETIC DEVICES》 * |
| 汤清华;熊波涛;吴国安;罗伟;: "一种改进结构的LTCC滤波器", 华中科技大学学报(自然科学版), no. 02 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114899561B (en) | 2023-11-17 |
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