CN114898912B - High-temperature-resistant insulating boron nitride block and manufacturing process thereof - Google Patents
High-temperature-resistant insulating boron nitride block and manufacturing process thereof Download PDFInfo
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- CN114898912B CN114898912B CN202210627985.5A CN202210627985A CN114898912B CN 114898912 B CN114898912 B CN 114898912B CN 202210627985 A CN202210627985 A CN 202210627985A CN 114898912 B CN114898912 B CN 114898912B
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- boron nitride
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- resistant insulating
- oxide powder
- supporting frame
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- 229910052582 BN Inorganic materials 0.000 title claims abstract description 129
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 title claims abstract description 129
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000011049 filling Methods 0.000 claims abstract description 20
- 239000002245 particle Substances 0.000 claims description 74
- 229910052810 boron oxide Inorganic materials 0.000 claims description 55
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 55
- 239000000843 powder Substances 0.000 claims description 55
- 239000000203 mixture Substances 0.000 claims description 43
- 238000005245 sintering Methods 0.000 claims description 20
- 238000001125 extrusion Methods 0.000 claims description 14
- 238000002156 mixing Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- JNFRNXKCODJPMC-UHFFFAOYSA-N aniline;boric acid Chemical compound OB(O)O.NC1=CC=CC=C1 JNFRNXKCODJPMC-UHFFFAOYSA-N 0.000 claims 2
- XIPRTRJDLZVSHO-UHFFFAOYSA-N aminooxy(phenoxy)borinic acid Chemical compound NOB(O)OC1=CC=CC=C1 XIPRTRJDLZVSHO-UHFFFAOYSA-N 0.000 description 9
- 238000009413 insulation Methods 0.000 description 9
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- ILOJFJBXXANEQW-UHFFFAOYSA-N aminooxy(phenyl)borinic acid Chemical compound NOB(O)C1=CC=CC=C1 ILOJFJBXXANEQW-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
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Abstract
The invention belongs to the technical field of boron nitride, and particularly relates to a high-temperature-resistant insulating boron nitride block and a manufacturing process thereof, the high-temperature-resistant insulating boron nitride block comprises a supporting frame, wherein high-temperature-resistant insulating plates are arranged on the upper side and the lower side of the supporting frame, filling grooves are formed in a body of the supporting frame, connecting grooves are formed in the body of the supporting frame, two sides of each connecting groove are respectively communicated with two adjacent filling grooves, porous plates are arranged in each connecting groove and each filling groove, the upper end and the lower end of each porous plate are respectively attached to the upper side and the lower side of each high-temperature-resistant insulating plate, and positioning grooves are formed in one side, close to the supporting frame, of the body of each high-temperature-resistant insulating plate.
Description
Technical Field
The invention relates to the technical field of boron nitride, in particular to a high-temperature-resistant insulating boron nitride block and a manufacturing process thereof.
Background
Boron nitride is a crystal composed of nitrogen atoms and boron atoms, with four different variations of hexagonal boron nitride, diamond Fang Danhua boron, cubic boron nitride, and wurtzite boron nitride. Wherein, the hexagonal boron nitride has high temperature resistance, stable chemical property, strong acid corrosion resistance and very high electrical insulation property. Therefore, the boron nitride block mainly adopts hexagonal boron nitride to realize the effects of high temperature resistance and insulation. In order to achieve certain toughness and adsorptivity, a part of the boron nitride block is doped with porous boron nitride, in addition, the density of the porous boron nitride is lower, and when the boron nitride block is thicker, the boron nitride block doped with the porous boron nitride has lighter weight compared with the boron nitride block of pure hexagonal boron nitride.
The boron nitride blocks in the prior art are usually shaped by sintering at high temperature and high pressure and extruding by a machine; in the extrusion process, molten hexagonal boron nitride particles are mutually adhered to form a whole, but extrusion by a machine can not only eliminate gaps among the hexagonal boron nitride particles, but also eliminate gaps of porous boron nitride, and further cause the porous boron nitride to lose the due effect, so that the porous boron nitride still exists in the boron nitride block, the prior art is to increase the specific gravity of the porous boron nitride, and the high temperature resistance of the boron nitride block is reduced.
Disclosure of Invention
The invention aims to provide a high-temperature-resistant insulating boron nitride block and a manufacturing process thereof, so as to solve the problem that porous boron nitride is extruded when the boron nitride block is extruded in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the high-temperature-resistant insulating boron nitride block comprises a supporting frame, wherein high-temperature-resistant insulating plates are arranged on the upper side and the lower side of the supporting frame, filling grooves are formed in the body of the supporting frame, connecting grooves are formed in the body of the supporting frame, two sides of each connecting groove are respectively communicated with two adjacent filling grooves, porous plates are arranged in each connecting groove and each filling groove, and the upper end and the lower end of each porous plate are respectively attached to the upper high-temperature-resistant insulating plate and the lower high-temperature-resistant insulating plate;
a positioning groove is formed in one side, close to the supporting frame, of the body of the high-temperature-resistant insulating plate, and the upper side and the lower side of the supporting frame are respectively inserted into the positioning grooves of the upper-side and the lower-side high-temperature-resistant insulating plate;
the depth of the positioning groove is less than or equal to half of the depth of the connecting groove.
Preferably, the thickness of the support frame is smaller than the thickness of the high temperature resistant insulating plate.
A manufacturing process of a high-temperature-resistant insulated boron nitride block, which comprises the following steps of:
uniformly mixing hexagonal boron nitride particles and boron oxide powder, and then placing the mixture at 1500 ℃ for sintering; uniformly mixing cubic boron nitride particles and boron oxide powder, and then placing the mixture at 1700 ℃ for sintering; uniformly mixing porous boron nitride particles with boron oxide powder, and then placing the mixture at 1600 ℃ for sintering;
extruding the mixture of the sintered hexagonal boron nitride particles and the boron oxide powder into a high-temperature-resistant insulating plate by using extrusion equipment, and extruding the mixture of the sintered cubic boron nitride particles and the boron oxide powder into a supporting frame;
step three: placing a supporting frame on a high-temperature-resistant insulating plate, placing a mixture of hexagonal boron nitride particles and boron oxide powder after high-temperature sintering at the contact position of the supporting frame and the high-temperature-resistant insulating plate, and then pressing the supporting frame and the high-temperature-resistant insulating plate;
step four: filling the sintered porous boron nitride particles and boron oxide powder mixture in the connecting groove and the filling groove of the supporting frame, and extruding the porous boron nitride particles and boron oxide powder mixture by using the pressure of 0.5-1 GPa;
and fifthly, scattering a mixture of hexagonal boron nitride particles and boron oxide powder after high-temperature sintering on the upper part of the high-temperature-resistant insulating plate, placing a supporting frame bonded with the high-temperature-resistant insulating plate on the upper part of the high-temperature-resistant insulating plate, and finally pressing the supporting frame and the high-temperature-resistant insulating plate below the supporting frame by using extrusion equipment.
Preferably, the content of the boron oxide powder in the mixture of the hexagonal boron nitride particles and the boron oxide powder, the mixture of the cubic boron nitride particles and the boron oxide powder and the mixture of the porous boron nitride particles and the boron oxide powder is not more than 8%.
Preferably, in the fourth step, when the sintered porous boron nitride particles and boron oxide powder mixture is filled, an aminophenylboric acid is further added thereto, and the weight of the aminophenylboric acid is not more than 2% of the weight of the porous boron nitride particles.
Preferably, the particle size of the hexagonal boron nitride particles, the cubic boron nitride particles, the porous boron nitride particles and the boron oxide powder is less than 100um.
Compared with the prior art, the invention has the beneficial effects that:
1) According to the invention, the porous plate is arranged in the filling groove of the supporting frame, and the supporting frame is used for supporting the two high-temperature-resistant insulating plates, so that the porous plate can be prevented from being subjected to larger pressure, and the porous plate mainly consists of porous boron nitride, so that the performance of the porous boron nitride can be prevented from being damaged;
2) The high-temperature-resistant insulating plate is mainly made of hexagonal boron nitride, the hexagonal boron nitride has higher high-temperature resistance and insulating performance, the supporting frame is mainly made of cubic boron nitride, the cubic boron nitride has higher wear resistance and pressure resistance, and when the high-temperature-resistant insulating plate is bonded with the supporting frame, the cubic boron nitride is used as a support, so that the supporting frame can be prevented from deforming, and further the porous boron nitride can be protected.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of a support frame structure according to the present invention;
FIG. 3 is a schematic view of the structure of the high temperature resistant insulating plate of the present invention;
FIG. 4 is a plot of boron oxide powder usage of the present invention;
FIG. 5 is a plot of the amount of aminophenylboronic acid employed in accordance with the present invention.
In the figure: 1 high temperature resistant insulating board, 11 constant head tank, 2 perforated plate, 3 braced frame, 31 spread groove, 32 filling groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present invention and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Examples:
referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a high temperature resistant insulating boron nitride piece, including braced frame 3, braced frame 3 has many horizontal and vertical crisscross strip shaped plates to constitute, space between the crossed strip shaped plates is filling groove 32 promptly, for aspect filling groove 32 intercommunication each other, set up spread groove 31 on the strip shaped plate, arbitrary adjacent two filling grooves 32 all can communicate through spread groove 31, braced frame 3's upside all is provided with high temperature resistant insulation board 1, high temperature resistant insulation board 1 mainly by hexagonal boron nitride compression molding, hexagonal boron nitride has very high electrical insulation ability and high temperature resistance, all be provided with perforated plate 2 in spread groove 31 and the filling groove 32, the upper and lower extreme of perforated plate 2 is laminated with upper and lower side high temperature resistant insulation board 1 respectively, promptly be through braced frame 3 bonding between the high temperature resistant insulation board 1, thereby avoid applys high pressure to perforated plate 2, thereby make the space in the perforated plate 2 can be kept.
The length and width of the support frame 3 are equal to those of the high-temperature-resistant insulating plate 1, a positioning groove 11 is formed in one side, close to the support frame 3, of the body of the high-temperature-resistant insulating plate 1, the upper side and the lower side of the support frame 3 are respectively inserted into the positioning grooves 11 of the upper-side and the lower-side high-temperature-resistant insulating plate 1, and the alignment of the support frame 3 and the high-temperature-resistant insulating plate 1 can be facilitated through the assistance of the positioning grooves 11.
The degree of depth of constant head tank 11 is less than or equal to the half of spread groove 31 degree of depth, the thickness of braced frame 3 is less than the thickness of high temperature resistant insulation board 1, the thickness of high temperature resistant insulation board 1 is about 1cm, the thickness of braced frame 3 is about 6mm, the degree of depth of constant head tank 11 is about 1mm, the thickness of constant head tank 11 is about 2mm, the degree of depth of restriction constant head tank 11 can avoid spread groove 31 to be sheltered from by constant head tank 11, the thickness of restriction braced frame 3, the thickness of porous plate 2 can be avoided too big, when the thickness of thickening boron nitride piece is needed, the number of piles of high temperature resistant insulation board 1, braced frame 3 and porous plate 2 can be increased, high temperature resistant insulation board 1 and braced frame 3 are arranged in turn.
A manufacturing process of a high-temperature-resistant insulated boron nitride block, which comprises the following steps of:
uniformly mixing hexagonal boron nitride particles and boron oxide powder, and then placing the mixture at 1500 ℃ for sintering; uniformly mixing cubic boron nitride particles and boron oxide powder, and then placing the mixture at 1700 ℃ for sintering; uniformly mixing porous boron nitride particles with boron oxide powder, and then placing the mixture at 1600 ℃ for sintering; the boron oxide powder can avoid the automatic decomposition of hexagonal boron nitride particles, cubic boron nitride particles and porous boron nitride particles at high temperature on one hand, and can facilitate the extrusion molding of the hexagonal boron nitride particles, the cubic boron nitride particles and the porous boron nitride particles on the other hand;
extruding the mixture of the sintered hexagonal boron nitride particles and the boron oxide powder into a high-temperature-resistant insulating plate 1 by using extrusion equipment, wherein the extrusion pressure is 5-6 GPa, extruding the mixture of the sintered cubic boron nitride particles and the boron oxide powder into a supporting frame 3, and the extrusion pressure is 6-7 GPa, wherein the length and the width of the high-temperature-resistant insulating plate 1 are equal to those of the supporting frame 3, and the shape of the high-temperature-resistant insulating plate 1 is two, one is that only one surface is provided with a positioning groove 11, and the other surface is provided with the positioning groove 11;
step three: placing the support frame 3 on the high-temperature-resistant insulating plate 1, placing a mixture of hexagonal boron nitride particles and boron oxide powder after high-temperature sintering at the contact position of the support frame 3 and the high-temperature-resistant insulating plate 1, paving the mixture of hexagonal boron nitride particles and boron oxide powder after high-temperature sintering in the positioning groove 11 with the paving thickness of 1mm, then pressing the support frame 3 and the high-temperature-resistant insulating plate 1 together, wherein the extrusion pressure is 5-6 GPa, and bonding between the support frame 3 and the high-temperature-resistant insulating plate 1 is assisted by the mixture of hexagonal boron nitride particles and boron oxide powder after high-temperature sintering, so that the support frame 3 and the high-temperature-resistant insulating plate 1 are connected into a whole;
step four: the connecting groove 31 and the filling groove 32 of the supporting frame 3 are filled with the sintered mixture of the porous boron nitride particles and the boron oxide powder, the mixture of the porous boron nitride particles and the boron oxide powder is extruded by using the pressure of 0.5-1 GPa, the pressure can not damage the gaps of the porous boron nitride particles, and meanwhile, the porous boron nitride particles can be pressed, so that the porous boron nitride particles are prevented from being too loose, and the protruding height of the supporting frame 3 is about 0.5-0.6 mm after the porous boron nitride particles are pressed;
and fifthly, scattering a mixture of hexagonal boron nitride particles and boron oxide powder after high-temperature sintering on the upper side of the high-temperature-resistant insulating plate 1, paving the mixture of hexagonal boron nitride particles and boron oxide powder after high-temperature sintering in a positioning groove 11, wherein the paving thickness is 1mm, then placing a supporting frame 3 bonded with the high-temperature-resistant insulating plate 1 on the upper side of the high-temperature-resistant insulating plate 1, and finally pressing the supporting frame 3 and the high-temperature-resistant insulating plate 1 below the supporting frame 3 by using extrusion equipment, wherein the extrusion pressure is 5-6 GPa, and the pressure born by a porous plate 2 formed by combining porous boron nitride particles is hardly larger than 1GPa in the extrusion process.
In the mixture of hexagonal boron nitride particles and boron oxide powder, the mixture of cubic boron nitride particles and boron oxide powder, and the mixture of porous boron nitride particles and boron oxide powder, the content of boron oxide powder is not more than 8%, the gaps between the boron nitride particles gradually decrease as the content of boron oxide powder increases, and the high temperature resistance of the boron nitride block gradually decreases as the content of boron oxide powder increases after the content of boron oxide powder reaches a certain level, as can be seen from fig. 4, when the content of boron oxide powder exceeds 8%, the high temperature resistance of the boron nitride block rapidly decreases.
And step four, when the sintered mixture of the porous boron nitride particles and the boron oxide powder is filled, the aminophenylboric acid is added, the weight of the aminophenylboric acid is not more than 2% of the weight of the porous boron nitride particles, activated amino groups are contained in the aminophenylboric acid, the activated amino groups repair the porous boron nitride, so that the performance of the porous boron nitride is prevented from being damaged, and as the content of the aminophenylboric acid is gradually increased when the content of the aminophenylboric acid is lower than 2%, the adsorption performance of the porous boron nitride can be obviously improved, and after the content of the aminophenylboric acid reaches 2% of the weight of the porous boron nitride particles, the better effect cannot be achieved after the aminophenylboric acid is added.
The particle sizes of the hexagonal boron nitride particles, the cubic boron nitride particles, the porous boron nitride particles and the boron oxide powder are all smaller than 100um, and the small particles are easier to be extruded and molded after sintering.
While the fundamental and principal features of the invention and advantages of the invention have been shown and described, it will be apparent to those skilled in the art that the invention is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a high temperature resistant insulating boron nitride piece, includes braced frame (3), its characterized in that: the high-temperature-resistant insulating plate (1) is arranged on the upper side and the lower side of the supporting frame (3), the filling groove (32) is arranged on the body of the supporting frame (3), the connecting groove (31) is formed in the body of the supporting frame (3), two sides of the connecting groove (31) are respectively communicated with two adjacent filling grooves (32), porous plates (2) are arranged in the connecting groove (31) and the filling grooves (32), and the upper end and the lower end of each porous plate (2) are respectively attached to the upper and the lower side high-temperature-resistant insulating plates (1);
a positioning groove (11) is formed in one side, close to the supporting frame (3), of the body of the high-temperature-resistant insulating plate (1), and the upper side and the lower side of the supporting frame (3) are respectively inserted into the positioning grooves (11) of the upper-side and the lower-side high-temperature-resistant insulating plate (1); the depth of the positioning groove (11) is less than or equal to half of the depth of the connecting groove (31).
2. The high temperature resistant insulated boron nitride block of claim 1, wherein: the thickness of the supporting frame (3) is smaller than that of the high-temperature-resistant insulating plate (1).
3. A process for manufacturing a high temperature resistant insulating boron nitride block according to any one of claims 1 to 2, characterized in that: the manufacturing process of the high-temperature-resistant insulating boron nitride block comprises the following steps:
uniformly mixing hexagonal boron nitride particles and boron oxide powder, and then placing the mixture at 1500 ℃ for sintering; uniformly mixing cubic boron nitride particles and boron oxide powder, and then placing the mixture at 1700 ℃ for sintering; uniformly mixing porous boron nitride particles with boron oxide powder, and then placing the mixture at 1600 ℃ for sintering;
step two, extruding the mixture of the sintered hexagonal boron nitride particles and the boron oxide powder into a high-temperature-resistant insulating plate (1) by using extrusion equipment, and extruding the mixture of the sintered cubic boron nitride particles and the boron oxide powder into a supporting frame (3);
step three: placing a supporting frame (3) on the high-temperature-resistant insulating plate (1), placing a mixture of hexagonal boron nitride particles and boron oxide powder after high-temperature sintering at the contact position of the supporting frame and the high-temperature-resistant insulating plate (1), and then pressing the supporting frame (3) and the high-temperature-resistant insulating plate (1);
step four: filling the sintered porous boron nitride particle and boron oxide powder mixture in a connecting groove (31) and a filling groove (32) of the supporting frame (3), and extruding the porous boron nitride particle and boron oxide powder mixture by using the pressure of 0.5-1 GPa;
and fifthly, scattering a mixture of hexagonal boron nitride particles and boron oxide powder after high-temperature sintering above the high-temperature-resistant insulating plate (1), placing a supporting frame (3) bonded with the high-temperature-resistant insulating plate (1) above the high-temperature-resistant insulating plate (1), and finally pressing the supporting frame (3) and the high-temperature-resistant insulating plate (1) below the supporting frame by using extrusion equipment.
4. A process for manufacturing a high temperature resistant insulating boron nitride block according to claim 3, wherein: the content of the boron oxide powder in the mixture of the hexagonal boron nitride particles and the boron oxide powder, the mixture of the cubic boron nitride particles and the boron oxide powder and the mixture of the porous boron nitride particles and the boron oxide powder is not more than 8 percent.
5. A process for manufacturing a high temperature resistant insulating boron nitride block according to claim 3, wherein: and step four, when the sintered porous boron nitride particle and boron oxide powder mixture is filled, aminobenzene boric acid is added into the porous boron nitride particle and boron oxide powder mixture, wherein the weight of the aminobenzene boric acid is not more than 2% of that of the porous boron nitride particle.
6. A process for manufacturing a high temperature resistant insulating boron nitride block according to claim 3, wherein: the particle sizes of the hexagonal boron nitride particles, the cubic boron nitride particles, the porous boron nitride particles and the boron oxide powder are all smaller than 100um.
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