CN114892248A - Electroplating clamp - Google Patents
Electroplating clamp Download PDFInfo
- Publication number
- CN114892248A CN114892248A CN202210619171.7A CN202210619171A CN114892248A CN 114892248 A CN114892248 A CN 114892248A CN 202210619171 A CN202210619171 A CN 202210619171A CN 114892248 A CN114892248 A CN 114892248A
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- conductive
- bearing
- assembly
- wafer
- sealing
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- 238000009713 electroplating Methods 0.000 title claims abstract description 28
- 238000007789 sealing Methods 0.000 claims abstract description 64
- 238000002788 crimping Methods 0.000 claims abstract description 30
- 230000006835 compression Effects 0.000 claims abstract description 13
- 238000007906 compression Methods 0.000 claims abstract description 13
- 238000007747 plating Methods 0.000 claims description 28
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 210000004907 gland Anatomy 0.000 claims description 13
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract description 2
- 239000000306 component Substances 0.000 description 47
- 238000010586 diagram Methods 0.000 description 10
- 238000003825 pressing Methods 0.000 description 7
- 239000003792 electrolyte Substances 0.000 description 6
- 239000000047 product Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005685 electric field effect Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
- C25D17/08—Supporting racks, i.e. not for suspending
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The application relates to the technical field of chip manufacturing electrochemical machining, in particular to an electroplating clamp. The electroplating clamp comprises a sealing conductive mechanism and a bearing conductive mechanism; the bearing conductive mechanism comprises a bearing component formed with a wafer positioning groove; the sealing conductive mechanism comprises a first sealing assembly, a crimping assembly and an annular conductive elastic sheet, the annular conductive elastic sheet is arranged around the wafer positioning groove, the inner ring of the annular conductive elastic sheet extends into the wafer positioning groove and is suspended relative to the wafer positioning groove, and the crimping assembly is pressed on the annular conductive elastic sheet and is provided with a through hole; the first seal assembly includes at least a first seal member; the compression joint component is detachably connected with the bearing component, so that the first sealing component is compressed between the annular conductive elastic sheet and the wafer. The electroplating clamp realizes the upgrading of the wafer conduction mode from point contact to surface contact, obviously improves the conduction uniformity of the wafer, and can improve the current density uniformity of the front surface of the wafer and the product yield through effective sealing.
Description
Technical Field
The application relates to the technical field of chip manufacturing electrochemical machining, in particular to an electroplating clamp.
Background
In the chip manufacturing process, the wafer surface needs to be electroplated to form a metal layer. Wafer electroplating is one of the key steps in semiconductor manufacture, and includes setting wafer in electroplating solution, connecting negative pole voltage as cathode to the wafer, connecting positive pole voltage to soluble or insoluble anode, and depositing metal ions in the electroplating solution onto the surface of the wafer via electric field.
The wafer electroplating fixture is a core component of electroplating equipment, and the uniformity of the electric conduction and the tightness of the wafer electroplating fixture directly influence the uniformity of the thickness of a coating layer of a wafer and the yield of products.
At present, the wafer electroplating clamp on the market has poor conductive uniformity, adopts non-sealed positioning to the wafer, always keeps the back (surface not required to be electroplated) and the front (surface required to be electroplated) of the wafer to be simultaneously contacted with the plating solution when the wafer is electroplated, and causes the problems of uniform current density on the front of the wafer, damaged graph on the back of the wafer and the like due to the phenomenon of electric field shunting, thereby causing the low product yield.
Disclosure of Invention
The present application is directed to provide an electroplating fixture, so as to solve the technical problems of the prior art that the uniformity of the wafer plating thickness and the product yield are both at low levels.
The application provides an electroplating clamp which comprises a sealing conductive mechanism and a bearing conductive mechanism;
the bearing conductive mechanism comprises a bearing component, and a wafer positioning groove matched with the wafer is formed in the bearing component;
the sealing conductive mechanism comprises a first sealing assembly, a crimping assembly and an annular conductive elastic sheet, the annular conductive elastic sheet is arranged around the wafer positioning groove, an inner ring of the annular conductive elastic sheet extends into the wafer positioning groove and is suspended relative to the wafer positioning groove, and the crimping assembly is pressed on the annular conductive elastic sheet and is provided with a through hole corresponding to the wafer positioning groove;
the first sealing component at least comprises a first sealing component which is arranged on the crimping component corresponding to the edge of the through hole;
the crimping assembly is detachably connected with the bearing assembly, so that the first sealing member is pressed between the annular conductive elastic sheet and the wafer.
In the above technical solution, further, the sealed conductive mechanism further includes a plurality of fastening connectors and a plurality of elastic compression columns;
the annular conductive elastic sheet comprises an inner ring portion and an outer ring portion, the inner ring of the outer ring portion is connected with the outer ring of the inner ring portion, the outer ring portion is connected with the bearing assembly through a plurality of fastening connecting pieces, one end of the elastic compression columns is connected with the crimping assembly, and the other end of each elastic compression column is connected with the inner ring portion in an abutting mode, so that the inner ring portion is bent relative to the outer ring portion and faces towards the bottom of the wafer positioning groove.
In any of the above technical solutions, further, the load-bearing conductive mechanism further includes a second sealing component and a conductive component;
the conductive assembly penetrates through the bearing assembly, one end of the conductive assembly is exposed relative to the bearing assembly, and the other end of the conductive assembly is electrically connected with the annular conductive elastic sheet;
the second sealing assembly is arranged at a connecting gap between the conductive assembly and the bearing assembly.
In any of the above technical solutions, further, the bearing assembly includes a cylindrical bearing main body and a locking pin, and the locking pin is disposed on a peripheral sidewall of the bearing main body;
the compression joint assembly comprises a cylindrical connecting sleeve and a gland part provided with the through hole, the gland part is connected to an opening at the top end of the connecting sleeve, a locking sliding groove is formed in the inner peripheral side wall of the connecting sleeve, a first end of the locking sliding groove is communicated with one end, far away from the gland part, of the connecting sleeve, and a second end of the locking sliding groove is inclined towards the gland part in a one-way mode along the circumferential direction of the connecting sleeve;
the locking pin slides into the locking sliding groove through the first end of the locking sliding groove, and the bearing component and the connecting sleeve are relatively rotated to lock the connecting sleeve and the bearing main body and enable the gland part to tightly press the top of the bearing component.
In any of the above technical solutions, further, the electroplating fixture further includes a guide pin telescopically disposed in the bearing main body, and a guide groove adapted to the guide pin is formed in an inner peripheral sidewall of the connection sleeve;
when the guide pin is aligned with the guide groove, the locking pin is aligned with the first end of the locking chute.
In any of the above technical solutions, further, the bearing body includes a locking ring, a bearing disc and a chuck, which are stacked in sequence;
the locking pin set up in the peripheral lateral wall of locking ring, the chuck deviate from in the surface formation of bearing the dish bear the top of main part, the uide pin set up in the peripheral lateral wall of chuck.
In any of the above technical solutions, further, the conductive assembly includes a conductive connection block, a conductive sheet, and a conductive column;
the bearing disc is provided with a mounting ring and positioning rings, the positioning rings are sleeved on the outer side of the mounting ring at intervals, the bearing disc is provided with power connection holes communicated with the hollow part of the mounting ring, the conductive connecting block is arranged in the power connection holes of the mounting ring, and the top of the conductive connecting block extends out of the bearing disc through the power connection holes;
the conductive column penetrates through the chuck, the bottom end of the conductive column is electrically connected with the top end of the conductive connecting block through the conductive sheet, and the top end of the conductive column is in contact with the annular conductive elastic sheet and forms electrical connection;
the number of the conductive columns is multiple, the conductive columns are arranged at intervals along the circumferential direction of the outer ring part, and the conductive columns are electrically connected with the conductive connecting block through the conductive sheets.
In any one of the above technical solutions, further, the electroplating fixture further includes a mounting disc mechanism, where the mounting disc mechanism includes a fixed disc, a rotating disc sleeved on the fixed disc, a first positioning pin disposed on the rotating disc, and a second positioning pin disposed on the fixed disc;
the locking ring is detachably sleeved on the outer side of the positioning ring and provided with a first positioning pin hole, and the first positioning pin hole and the first positioning pin are correspondingly inserted so as to enable the locking ring to be detachably connected with the rotating disc;
the positioning ring is provided with a second positioning pin hole, and the second positioning pin hole and the second positioning pin are correspondingly inserted so that the bearing disc is detachably connected with the fixed disc.
In any of the above solutions, further, the second sealing assembly includes a third sealing member, a fourth sealing member, a fifth sealing member, a sixth sealing member, and a seventh sealing member;
the conductive connecting block comprises a first small-diameter section and a large-diameter section, the large-diameter section is connected to the top end of the first small-diameter section, the mounting disc mechanism further comprises a mounting disc and a centering sleeve, the fixing disc is provided with a centering through hole, the centering sleeve penetrates through the centering through hole, and the top end of the centering sleeve is sleeved on the first small-diameter section and abutted to the shoulder of the large-diameter section;
the third sealing member is connected between a bottom edge of the large-diameter section and an inner circumferential side wall of the mounting ring;
the fourth sealing member is disposed between an outer circumferential side wall of the large-diameter section and an inner circumferential side wall of the mounting ring;
the conductive connecting block further comprises a second small-diameter section, the second small-diameter section is connected to the top end of the large-diameter section, a centering groove is formed in the bottom surface of the chuck, the second small-diameter section is inserted into the centering groove, and the fifth sealing member is arranged between the second small-diameter section and the centering groove;
the sixth sealing component is arranged at the joint surface of the chuck and the bearing disc;
the seventh sealing component is arranged at the bottom of the wafer positioning groove.
In any of the above solutions, further, the first sealing assembly further includes a second sealing member;
the second sealing member is disposed between a top edge of the carrier body and the capping portion.
Compared with the prior art, the beneficial effect of this application is:
the application provides an electroplating fixture includes sealed electrically conductive mechanism and bears electrically conductive mechanism. The bearing component for bearing the conductive mechanism fixes the wafer through the wafer positioning groove, when the compression joint component for sealing the conductive mechanism and the bearing component are compressed in place, the front surface of the wafer is exposed through the through hole of the compression joint component so as to be contacted with electroplating solution, meanwhile, the inner ring of the annular conductive elastic sheet extends into the wafer positioning groove and forms an annular contact surface on the front surface of the wafer in the wafer positioning groove, the annular conductive elastic sheet is used for connecting a negative electrode, and therefore metal ions in the electroplating solution are deposited on the front surface of the wafer through the electric field effect, and compared with an electroplating clamp in the prior art, the electroplating clamp realizes the upgrading of the wafer conductive mode from point contact to surface contact, and obviously improves the conductive uniformity of the wafer.
In addition, the first sealing mechanism of the sealed conductive mechanism at least comprises a first sealing component which is tightly pressed between the annular conductive elastic sheet and the wafer, so that the phenomenon that electroplating liquid permeates into the back of the wafer through the contact position between the annular conductive elastic sheet and the wafer can be avoided, the accompanying electric field shunting phenomenon is avoided, the current density uniformity of the front of the wafer can be accurately controlled and improved, the back pattern of the wafer can be effectively prevented from being damaged, and the product yield is effectively improved.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic view of a first structure of a plating jig according to an embodiment of the present disclosure;
FIG. 2 is a second structural diagram of a plating jig according to an embodiment of the present disclosure;
FIG. 3 is a schematic diagram of a third structure of a plating jig according to an embodiment of the present disclosure;
FIG. 4 is a cross-sectional view of FIG. 3 at section A-A;
FIG. 5 is a cross-sectional view of FIG. 3 at section B-B;
FIG. 6 is a schematic diagram of a fourth structure of a plating jig according to an embodiment of the present disclosure (omitting a capping assembly);
FIG. 7 is a fifth structural schematic diagram of a plating jig provided in an embodiment of the present application (with the capping assembly and the chuck omitted);
FIG. 8 is a schematic structural diagram of a conductive component of a plating jig according to an embodiment of the present disclosure;
FIG. 9 is a schematic view of a first structure of a gland assembly of a plating jig according to an embodiment of the present application;
FIG. 10 is a second structural diagram of a gland assembly of a plating jig according to an embodiment of the present disclosure;
FIG. 11 is a first structural diagram of a chuck of a plating jig according to an embodiment of the present disclosure;
FIG. 12 is a second structural diagram of a chuck of a plating jig according to an embodiment of the present disclosure;
FIG. 13 is a schematic structural diagram of a carrier tray of a plating jig according to an embodiment of the present disclosure;
fig. 14 is a schematic structural diagram of a locking ring of a plating jig according to an embodiment of the present disclosure.
Reference numerals:
1-a first seal assembly; 10-a first sealing member; 11-a second sealing member; 2-a crimping assembly; 20-a connecting sleeve; 21-a capping part; 22-locking chute; 23-a guide groove; 30-an annular conductive spring plate; 300-an inner ring portion; 301-an outer ring portion; 31-fastening the connecting piece; 32-elastic compression column; 4-a carrier assembly; 40-a chuck; 400-wafer positioning groove; 41-carrying tray; 410-a guide pin; 411-a positioning ring; 412-a mounting ring; 42-a locking ring; 420-a locking pin; 6-a second seal assembly; 60-a third sealing member; 61-a fourth sealing member; 62-a fifth sealing member; 63-a sixth sealing member; 64-a seventh sealing member; 7-a conductive component; 70-a conductive connection block; 71-a conductive sheet; 72-a conductive post; 8-mounting a disc mechanism; 80-rotating the disc; 81-fixing disc; 82-centering sleeve; 83-first alignment pin; 84-a second locating pin; 85-a third locating pin; 9-wafer.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example one
Referring to fig. 1 to 14, an embodiment of the present application provides a plating jig including a sealing conductive mechanism, a carrying conductive mechanism, and a mounting plate mechanism 8.
Hereinafter, the above-described components of the plating jig will be described in detail.
The bearing conductive mechanism provided by this embodiment is used for bearing and installing the wafer 9, and the bearing conductive mechanism includes the bearing component 4, and the bearing component 4 is formed with the wafer positioning slot 400 adapted to the wafer 9, so that the wafer 9 can be borne by the bearing component 4 by placing the wafer 9 in the wafer positioning slot 400.
The sealing conductive mechanism comprises a first sealing component 1, a crimping component 2 and an annular conductive elastic sheet 30, wherein the annular conductive elastic sheet 30 is arranged around the wafer positioning groove 400, the inner ring of the annular conductive elastic sheet 30 extends into the wafer positioning groove 400 and is suspended relative to the wafer positioning groove 400, the crimping component 2 is arranged on the annular conductive elastic sheet 30 in a pressing manner and is provided with a through hole corresponding to the wafer positioning groove 400, so that the wafer 9 can be limited in the wafer positioning groove 400 through the crimping component 2, the front surface (the surface to be coated) of the wafer 9 is exposed through the through hole of the crimping component 2 so as to be contacted with electroplating solution, the annular conductive elastic sheet 30 can be pressed towards the wafer 9 through the crimping component 2 so that the annular conductive elastic sheet 30 is in annular contact with the front surface of the wafer 9, the annular conductive elastic sheet 30 is used for connecting with a negative electrode, and thus the uniform conduction of electrolyte on the front surface of the negative electrode phase wafer 9 is realized through the annular conductive elastic sheet 30, the conductive mode is upgraded from point contact to surface contact, and the coating thickness uniformity of the front surface of the wafer 9 is improved.
The first sealing component 1 at least comprises a first sealing member 10 which is arranged on the crimping component 2 corresponding to the edge of the through hole; the crimping component 2 is detachably connected with the bearing component 4, so that the first sealing component 10 is tightly pressed between the annular conductive elastic sheet 30 and the wafer 9, namely, the gap between the annular conductive elastic sheet 30 and the wafer 9 can be sealed through the first sealing component 10, the positive electrolyte of the wafer 9 is prevented from leaking through the gap between the annular conductive elastic sheet and the wafer 9, the electrolyte and the wafer 9 are prevented from contacting other surfaces except the front surface accident, the shunting phenomenon is prevented, the stability uniformity of the current of the front surface coating of the wafer 9 is improved, and the thickness uniformity of the front surface coating of the wafer 9 is further improved.
In an alternative of this embodiment, the hermetically sealed conductive mechanism further comprises a plurality of fastening connectors 31 and a plurality of elastic compression columns 32.
The annular conductive elastic sheet 30 comprises an inner ring portion 300 and an outer ring portion 301, an inner ring of the outer ring portion 301 is connected with an outer ring of the inner ring portion 300, the outer ring portion 301 is connected with the bearing component 4 through a plurality of fastening connecting pieces 31, specifically, a first fastening connecting hole is formed in the bearing component 4, a second fastening connecting hole corresponding to the first fastening connecting hole is formed in the outer ring portion 301, and the fastening connecting pieces 31 penetrate through the first fastening connecting hole and the second fastening connecting hole so that the annular conductive elastic sheet 30 is connected with the bearing component 4.
One end of each of the elastic pressing columns 32 is connected to the crimping component 2, and the other end of each of the elastic pressing columns 32 abuts against the inner ring portion 300, so that the inner ring portion 300 bends towards the bottom of the wafer positioning groove 400 relative to the outer ring portion 301, and therefore, a wafer 9 is fixed in the wafer positioning groove 400, when the crimping component 2 is mounted on the carrier component 4, the inner ring portion 300 can contact with the wafer 9 under the pressing action of the elastic pressing columns 32, and the annular conductive elastic sheet 30 contacts with the front surface of the wafer 9 through the inner ring portion 300.
Alternatively, the plurality of elastic pressing columns 32 are uniformly spaced along the circumferential direction of the wafer positioning groove 400.
Alternatively, the fastening connector 31 is a bolt or a screw, etc.
In an alternative of this embodiment, the load-bearing conductive means further comprises a second sealing member 6 and a conductive member 7.
The conductive assembly 7 penetrates through the bearing assembly 4, one end of the conductive assembly 7 is exposed relative to the bearing assembly 4, and the other end of the conductive assembly 7 is electrically connected with the annular conductive elastic sheet 30, so that an external negative electrode is electrically connected with the annular conductive elastic sheet 30 through the conductive assembly 7, namely, the external negative electrode is communicated with the annular conductive elastic sheet 30 through the conductive assembly 7, and the conduction is realized between the external negative electrode and the annular conductive elastic sheet 30.
In an alternative of this embodiment, the bearing assembly 4 includes a bearing body having a cylindrical shape and a locking pin 420, and the locking pin 420 is disposed on a peripheral sidewall of the bearing body.
The crimping component 2 comprises a connecting sleeve 20 which is cylindrical and a crimping part 21 provided with a through hole, the crimping part 21 is connected to the top end opening of the connecting sleeve 20, a locking sliding groove 22 is formed in the inner peripheral side wall of the connecting sleeve 20, the first end of the locking sliding groove 22 is opened to one end, far away from the crimping part 21, of the connecting sleeve 20, and the second end of the locking sliding groove 22 inclines towards the crimping part 21 in a one-way mode along the circumferential direction of the connecting sleeve 20.
When the locking pin 420 slides into the locking slide 22 via the first end of the locking slide 22, the connecting sleeve 20 can be locked with the carrier body and the capping portion 21 can be pressed against the top of the carrier assembly 4 by relatively rotating the carrier assembly 4 and the connecting sleeve 20.
In an alternative of this embodiment, the plating jig further includes a guide pin 410 disposed on the bearing body, the inner peripheral sidewall of the connection sleeve 20 is provided with a guide groove 23 adapted to the guide pin 410, and the guide groove 23 extends along the axial direction of the connection sleeve 20.
When the guide pin 410 is aligned with the guide slot 23, the locking pin 420 is aligned with the first end of the locking runner 22. Thus, by aligning the guide pin 410 with the guide groove 23 and pressing the connecting sleeve 20 down towards the carrier body, the guide pin 410 can be inserted into the guide groove 23, which has the effect of locking the connecting sleeve 20, while the locking pin 420 is inserted into the first end of the locking runner 22.
In an alternative of this embodiment, as shown in fig. 12 to 14, the carrier body comprises a locking ring 42, a carrier disc 41 and a chuck 40 stacked in sequence.
The locking pin 420 is disposed on the peripheral sidewall of the locking ring 42, the chuck 40 is separated from the surface of the carrier plate 41 to form the top of the carrier body, the guide pin 410 is disposed on the peripheral sidewall of the chuck 40, and the wafer positioning groove 400 is opened in the middle of the chuck 40 and penetrates through the chuck 40, so as to support the wafer 9 through the carrier plate 41 and radially limit the wafer 9 through the chuck 40.
Therefore, the guide pin 410 on the chuck 40 is abutted with the guide groove 23 on the connection sleeve 20, the locking pin 420 on the locking ring 42 is abutted with the first end of the locking chute 22 on the connection sleeve 20 by rotating the locking ring 42, then the locking ring 42 is rotated continuously, the connection sleeve 20 is pulled down while the locking pin 420 slides along the locking chute 22, meanwhile, the guide pin 410 slides up in the guide groove 23, due to the guiding effect of the guide pin 410 and the guide groove 23, the connection sleeve 20 can only move in the up-and-down direction without rotating until the locking pin 420 slides along the locking chute 22 to the second end of the locking chute 22, the locking of the connection sleeve 20 is realized under the friction action between the locking pin 420 and the locking chute 22, and after the connection sleeve 20 is locked, the capping part 21 is pulled down to press the wafer 9.
In an alternative of the present embodiment, the conductive member 7 includes a conductive connection block 70, a conductive sheet 71, and a conductive post 72.
As shown in fig. 14, the carrier plate 41 is provided with a mounting ring 412 and a positioning ring 411, the positioning ring 411 is sleeved outside the mounting ring 412 at intervals, the carrier plate 41 is provided with a power connection hole penetrating through the hollow portion of the mounting ring 412, as shown in fig. 5, 6, 8 and 9, the conductive connection block 70 is arranged in the power connection hole of the mounting ring 412, the top of the conductive connection block 70 extends out of the carrier plate 41 through the power connection hole, and the bottom of the conductive connection block 70 is used for connecting the negative electrode.
As shown in fig. 5, 6, 8 and 9, the conductive column 72 is disposed through the chuck 40, the bottom end of the conductive column 72 is electrically connected to the top end of the conductive connection block 70 through the conductive sheet 71, and the top end of the conductive column 72 is in contact with and electrically connected to the annular conductive elastic sheet 30, so that the current of the negative electrode is sequentially transmitted to the annular conductive elastic sheet 30 through the conductive connection block 70, the conductive sheet 71 and the conductive column 72.
In this embodiment, the number of the conductive posts 72 is plural, the plurality of conductive posts 72 are arranged at intervals along the circumferential direction of the outer ring portion 301, and the plurality of conductive posts 72 are electrically connected to the conductive connection block 70 through the plurality of conductive sheets 71, so as to improve the uniformity of the current transmission to the annular conductive elastic piece 30.
In an alternative embodiment, as shown in fig. 5, the plating jig further includes a mounting plate mechanism 8, and the mounting plate mechanism 8 includes a fixed plate 81, a rotating plate 80 rotatably sleeved on the fixed plate 81, a first positioning pin 83 disposed on the rotating plate 80, and a second positioning pin 84 disposed on the fixed plate 81.
The locking ring 42 is detachably sleeved outside the positioning ring 411, the locking ring 42 is provided with a first positioning pin hole, and the first positioning pin hole and the first positioning pin 83 are correspondingly inserted, so that the locking ring 42 is detachably connected with the rotating disc 80.
The positioning ring 411 is provided with a second positioning pin hole, and the second positioning pin hole and the second positioning pin 84 are correspondingly inserted so as to detachably connect the bearing tray 41 and the fixed tray 81.
Optionally, the fixing plate 81 is provided with a third positioning pin 85 for plugging with a third positioning pin hole on the working platform so as to fix the fixing plate on the working platform.
Specifically, the assembly process of the electroplating fixture is as follows: first, the rotating disk 80 is rotatably fitted around the outer side of the fixed disk 81, and then the fixed disk 81 is fixed to the equipment deck plate using the plating jig by the third positioning pin 85, so that both the fixed disk 81 and the rotating disk 80 are mounted on the equipment deck plate.
The wafer is placed in the wafer positioning groove 400, the carrier body is aligned with the second positioning pin 84 of the fixed disk 81 through the second positioning pin hole on the positioning ring 411, so that the chuck 40 and the fixed disk 81 are fixedly arranged, at the same time, the rotating disk 80 is rotated, so that the first positioning pin 83 on the rotating disk 80 is aligned with the first positioning pin hole on the locking ring 42, so that the locking ring 42 can follow the rotating disk 80, after the positioning pins and the positioning pin holes are all aligned, the guide groove 23 of the crimping component 2 is aligned with the guide pin 410 of the chuck of the carrier body, then the rotating disk 80 is rotated, the rotating disk 80 drives the locking ring 42 and the locking pin 420 thereon to slide along the locking slide groove 22 of the connecting sleeve 20, the downward pulling of the crimping component 2 is realized until the locking of the crimping component 2 is completed, and the assembling of the electroplating fixture can be completed.
Therefore, the electroplating clamp is easy to disassemble and assemble, and the bearing guide mechanism and the sealing guide mechanism can form reliable sealing connection in an assembly state, so that high-uniformity electric conduction of the wafer 9 is ensured.
In an alternative of the present embodiment, the second seal assembly 6 includes a third seal member 60, a fourth seal member 61, a fifth seal member 62, a sixth seal member 63, and a seventh seal member 64.
Wherein, electrically conductive connecting block 70 includes first path section and big path section, and big path section connects in the top of first path section, and the mounting disc mechanism still includes mounting disc and centering cover 82, and the centering through-hole has been seted up to the fixed disk, and centering cover 82 wears to locate in the centering through-hole, and the top cover of centering cover 82 locates first path section and locates looks butt with the circular bead department of big path section.
The third seal member 60 is connected between the bottom edge of the large diameter section and the inner peripheral sidewall of the mounting ring 412.
The fourth seal member 61 is disposed between the outer circumferential side wall of the large diameter section and the inner circumferential side wall of the mount ring 412.
The conductive connection block 70 further includes a second small diameter section connected to the top end of the large diameter section, a centering groove is formed in the bottom surface of the chuck 40, the second small diameter section is inserted into the centering groove, and the fifth sealing member 62 is disposed between the second small diameter section and the centering groove.
The sixth sealing member 63 is disposed at the mating surface of the chuck 40 and the carrier plate 41.
The seventh sealing member 64 is disposed at the bottom of the wafer positioning groove 400.
In an alternative of this embodiment, the first seal assembly 1 further comprises a second seal member 11, the second seal member 11 being disposed between the top edge of the carrier body and the gland portion 21.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention. Furthermore, those skilled in the art will appreciate that while some embodiments herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (10)
1. An electroplating clamp is characterized by comprising a sealing conductive mechanism and a bearing conductive mechanism;
the bearing conductive mechanism comprises a bearing component, and a wafer positioning groove matched with the wafer is formed in the bearing component;
the sealing conductive mechanism comprises a first sealing assembly, a crimping assembly and an annular conductive elastic sheet, the annular conductive elastic sheet is arranged around the wafer positioning groove, an inner ring of the annular conductive elastic sheet extends into the wafer positioning groove and is suspended relative to the wafer positioning groove, and the crimping assembly is pressed on the annular conductive elastic sheet and is provided with a through hole corresponding to the wafer positioning groove;
the first sealing component at least comprises a first sealing component which is arranged on the crimping component corresponding to the edge of the through hole;
the crimping assembly is detachably connected with the bearing assembly, so that the first sealing member is pressed between the annular conductive elastic sheet and the wafer.
2. The plating jig of claim 1, wherein the sealed conductive mechanism further comprises a plurality of fastening connectors and a plurality of elastic compression columns;
the annular conductive elastic sheet comprises an inner ring portion and an outer ring portion, the inner ring of the outer ring portion is connected with the outer ring of the inner ring portion, the outer ring portion is connected with the bearing assembly through a plurality of fastening connecting pieces, one end of the elastic compression columns is connected with the crimping assembly, and the other end of each elastic compression column is connected with the inner ring portion in an abutting mode, so that the inner ring portion is bent relative to the outer ring portion and faces towards the bottom of the wafer positioning groove.
3. The plating jig of claim 2, wherein the load-bearing conductive mechanism further comprises a second sealing component and a conductive component;
the conductive assembly penetrates through the bearing assembly, one end of the conductive assembly is exposed relative to the bearing assembly, and the other end of the conductive assembly is electrically connected with the annular conductive elastic sheet;
the second sealing assembly is arranged at a connecting gap between the conductive assembly and the bearing assembly.
4. The plating jig of claim 3, wherein the carrier assembly comprises a cylindrical carrier body and a locking pin disposed on a peripheral sidewall of the carrier body;
the compression joint assembly comprises a cylindrical connecting sleeve and a gland part provided with the through hole, the gland part is connected to an opening at the top end of the connecting sleeve, a locking sliding groove is formed in the inner peripheral side wall of the connecting sleeve, a first end of the locking sliding groove is communicated with one end, far away from the gland part, of the connecting sleeve, and a second end of the locking sliding groove is inclined towards the gland part in a one-way mode along the circumferential direction of the connecting sleeve;
the locking pin slides into the locking sliding groove through the first end of the locking sliding groove, and the bearing component and the connecting sleeve are relatively rotated to lock the connecting sleeve and the bearing main body and enable the gland part to tightly press the top of the bearing component.
5. A plating jig according to claim 4, further comprising a guide pin provided to the carrier body, wherein a guide groove adapted to the guide pin is formed in an inner peripheral side wall of the connection sleeve;
when the guide pin is aligned with the guide slot, the locking pin is aligned with the first end of the locking runner.
6. A plating jig according to claim 5, wherein the carrier body comprises a locking ring, a carrier plate and a chuck stacked in this order;
the locking pin set up in the peripheral lateral wall of locking ring, the chuck deviate from in the surface formation of bearing the dish bear the top of main part, the uide pin set up in the peripheral lateral wall of chuck.
7. The plating jig of claim 6, wherein the conductive assembly comprises a conductive connection block, a conductive sheet, and a conductive post;
the bearing disc is provided with a mounting ring and positioning rings, the positioning rings are sleeved on the outer side of the mounting ring at intervals, the bearing disc is provided with power connection holes communicated with the hollow part of the mounting ring, the conductive connecting block is arranged in the power connection holes of the mounting ring, and the top of the conductive connecting block extends out of the bearing disc through the power connection holes;
the conductive column penetrates through the chuck, the bottom end of the conductive column is electrically connected with the top end of the conductive connecting block through the conductive sheet, and the top end of the conductive column is in contact with the annular conductive elastic sheet and forms electrical connection;
the number of the conductive columns is multiple, the conductive columns are arranged at intervals along the circumferential direction of the outer ring part, and the conductive columns are electrically connected with the conductive connecting block through the conductive sheets.
8. The plating jig of claim 7, further comprising a mounting plate mechanism, wherein the mounting plate mechanism comprises a fixed plate, a rotating plate rotatably sleeved on the fixed plate, a first positioning pin arranged on the rotating plate, and a second positioning pin arranged on the fixed plate;
the locking ring is detachably sleeved on the outer side of the positioning ring and provided with a first positioning pin hole, and the first positioning pin hole and the first positioning pin are correspondingly inserted so as to enable the locking ring to be detachably connected with the rotating disc;
the positioning ring is provided with a second positioning pin hole, and the second positioning pin hole and the second positioning pin are correspondingly inserted so that the bearing disc is detachably connected with the fixed disc.
9. The plating jig of claim 8, wherein the second seal assembly comprises a third seal member, a fourth seal member, a fifth seal member, a sixth seal member, and a seventh seal member;
the conductive connecting block comprises a first small-diameter section and a large-diameter section, the large-diameter section is connected to the top end of the first small-diameter section, the mounting disc mechanism comprises a mounting disc and a centering sleeve, the fixing disc is provided with a centering through hole, the centering sleeve is arranged in the centering through hole in a penetrating mode, and the top end of the centering sleeve is sleeved on the first small-diameter section and abutted to the shoulder of the large-diameter section;
the third sealing member is connected between a bottom edge of the large-diameter section and an inner circumferential side wall of the mounting ring;
the fourth sealing member is disposed between an outer circumferential side wall of the large-diameter section and an inner circumferential side wall of the mounting ring;
the conductive connecting block further comprises a second small-diameter section, the second small-diameter section is connected to the top end of the large-diameter section, a centering groove is formed in the bottom surface of the chuck, the second small-diameter section is inserted into the centering groove, and the fifth sealing member is arranged between the second small-diameter section and the centering groove;
the sixth sealing component is arranged at the joint surface of the chuck and the bearing disc;
the seventh sealing component is arranged at the bottom of the wafer positioning groove.
10. The plating jig of claim 4, wherein the first seal assembly further comprises a second sealing member disposed between a top edge of the carrier body and the capping portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210619171.7A CN114892248B (en) | 2022-06-01 | 2022-06-01 | Electroplating clamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210619171.7A CN114892248B (en) | 2022-06-01 | 2022-06-01 | Electroplating clamp |
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| CN114892248A true CN114892248A (en) | 2022-08-12 |
| CN114892248B CN114892248B (en) | 2024-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN116575098A (en) * | 2023-07-11 | 2023-08-11 | 深圳市星国华先进装备科技有限公司 | Data recording processing device for wafer processing |
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| CN114892248B (en) | 2024-01-26 |
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