CN114889121B - Device and method for manufacturing nonmetal cutter wire die - Google Patents
Device and method for manufacturing nonmetal cutter wire die Download PDFInfo
- Publication number
- CN114889121B CN114889121B CN202210486857.3A CN202210486857A CN114889121B CN 114889121 B CN114889121 B CN 114889121B CN 202210486857 A CN202210486857 A CN 202210486857A CN 114889121 B CN114889121 B CN 114889121B
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- Prior art keywords
- cutter
- manufacturing
- die
- film
- cutter wire
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 56
- 229910052755 nonmetal Inorganic materials 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title description 5
- 239000000463 material Substances 0.000 claims abstract description 43
- 238000005507 spraying Methods 0.000 claims abstract description 28
- 238000007639 printing Methods 0.000 claims abstract description 18
- 229920000642 polymer Polymers 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 239000007921 spray Substances 0.000 claims abstract description 6
- 238000003825 pressing Methods 0.000 claims description 26
- 238000005520 cutting process Methods 0.000 claims description 14
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 13
- 239000002318 adhesion promoter Substances 0.000 claims description 12
- 239000003963 antioxidant agent Substances 0.000 claims description 12
- 239000000178 monomer Substances 0.000 claims description 12
- 239000002105 nanoparticle Substances 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 9
- 238000003756 stirring Methods 0.000 claims description 9
- 230000003078 antioxidant effect Effects 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 125000005396 acrylic acid ester group Chemical group 0.000 claims description 7
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 6
- 238000013519 translation Methods 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 5
- -1 acrylic ester Chemical class 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 3
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 3
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical group CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 3
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical group CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- FSDNTQSJGHSJBG-UHFFFAOYSA-N piperidine-4-carbonitrile Chemical compound N#CC1CCNCC1 FSDNTQSJGHSJBG-UHFFFAOYSA-N 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- FZHFLPZIOJBRGW-UHFFFAOYSA-N 3-(oxolan-2-yl)prop-2-enoic acid Chemical compound OC(=O)C=CC1CCCO1 FZHFLPZIOJBRGW-UHFFFAOYSA-N 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- RKPILPRSNWEZJV-UHFFFAOYSA-N 1-morpholin-4-ylbutane-1,3-dione Chemical compound CC(=O)CC(=O)N1CCOCC1 RKPILPRSNWEZJV-UHFFFAOYSA-N 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000001723 curing Methods 0.000 description 23
- 238000010586 diagram Methods 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 238000007373 indentation Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- DGEKBHNMRGURMV-UHFFFAOYSA-N 1-(4-acetylmorpholin-3-yl)prop-2-en-1-one Chemical compound CC(N(CCOC1)C1C(C=C)=O)=O DGEKBHNMRGURMV-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- JRWNODXPDGNUPO-UHFFFAOYSA-N oxolane;prop-2-enoic acid Chemical compound C1CCOC1.OC(=O)C=C JRWNODXPDGNUPO-UHFFFAOYSA-N 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002910 solid waste Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/205—Means for applying layers
- B29C64/209—Heads; Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/307—Handling of material to be used in additive manufacturing
- B29C64/314—Preparation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/10—Pre-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y70/00—Materials specially adapted for additive manufacturing
- B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/006—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00
- C08F283/008—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers provided for in C08G18/00 on to unsaturated polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/01—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
- C08F283/105—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule on to unsaturated polymers containing more than one epoxy radical per molecule
Abstract
The invention discloses a manufacturing device and a manufacturing method of a nonmetal cutter wire die, wherein the manufacturing device of the nonmetal cutter wire die comprises a control device, a film and a cutter wire die printing device; the cutter line die printing device comprises a machine head assembly and a light-curing surface light source assembly, wherein the machine head assembly is used for spraying cutter line die materials with preset shapes on a film, the light-curing surface light source assembly is used for curing the cutter line die materials sprayed on the film by the machine head assembly, and the control device controls the machine head assembly to spray the cutter line die materials along a preset path, and the cutter line die materials are photosensitive resin polymers. In the nonmetal cutter wire die provided by the application, the nonmetal cutter wire passes through a printing technology, namely a wire die printing device walks according to a design graph to preset a path, and a rigid line with a certain mechanical property is formed under the irradiation of the light-cured surface light source assembly, so that the cutter wire die is formed, the manufacture is simple, the operation is convenient, and the manufacturing process of the cutter wire die is effectively simplified.
Description
Technical Field
The invention relates to the technical field of cutter wire mould manufacturing, in particular to a device for manufacturing a nonmetal cutter wire mould. The invention also relates to a manufacturing method of the nonmetal wire die.
Background
The cutter line of the cutter die is divided into a bending cutter line and a shearing cutter line; the bending knife line is also called an indentation line; the bending knife line is used for forming the sheet material according to the shape designed by a designer; the shear line, also called die line, is the unfolded shape of the box from which the sheet is sheared.
Most of cutter wires in the traditional cutter molds adopt iron sheets as blades, then cutter wire formers adopt specific tools for forming according to the design of designers, and then the cutter wires are inlaid on specific plates to form the iron sheet cutter molds capable of pressing products.
However, the shape of the iron wire must be consistent with the design shape according to the design of the design engineer, which requires a sophisticated molding engineer to make the wire; and the cooperation of multiple kinds of personnel and multiple devices is needed, including blanking, molding, embedding and the like, and the manufacturing process is complex.
Therefore, how to simplify the manufacturing process of the cutting wire die is a technical problem to be solved by the skilled person.
Disclosure of Invention
The invention aims to provide a manufacturing device of a nonmetal cutter wire die, which is used for simplifying the manufacturing process of the cutter wire die. Another object of the present invention is to provide a method for manufacturing a nonmetallic cutter wire die.
In order to achieve the above object, the present invention provides a device for manufacturing a nonmetal cutting die, which is characterized by comprising a control device, a film and a cutting die printing device; the cutter wire die printing device comprises a machine head assembly and a light-curing surface light source assembly, wherein the machine head assembly is used for spraying cutter wire die materials with preset shapes on the film, the light-curing surface light source assembly is used for curing the cutter wire die materials sprayed on the film by the machine head assembly, the control device is used for controlling the machine head assembly to spray the cutter wire die materials along a preset path, and the cutter wire die materials are photosensitive resin polymers.
Preferably, the machine head assembly comprises a spraying device, a point light source curing device, a lifting device and a rotating device for driving the spraying device and the point light source curing device to horizontally and relatively rotate, and the lifting device is used for driving the spraying device and the point light source curing device to lift.
Preferably, the rotating device is mounted at the lifting end of the lifting device.
Preferably, the roll body assembly further comprises a roll body assembly and a translation device for driving the machine head assembly to move along the roll body axis direction of the roll body assembly, wherein the roll body assembly comprises a rotating roll and a film fixing device, and the film fixing device is used for locking the film to the surface of the rotating roll.
Preferably, the film fixing device comprises a locking spring plate, the locking spring plate comprises a pressing plate and an elastic piece used for pressing the pressing plate to the surface of the rotating roller, the pressing plate is used for pressing the film to the surface of the rotating roller, and the pressing plate is rotatably installed on the rotating roller.
Preferably, the locking spring plates are multiple, and all the locking spring plates are sequentially arranged along the axis direction of the rotating roller.
Preferably, the film fixing device comprises an adsorption device, the adsorption device comprises a vacuum pump and an air suction hole arranged on a roller body of the rotating roller, a hollow cavity is formed in the rotating roller, and the hollow cavity is connected with the air suction hole and the vacuum pump.
Preferably, the film fixing device comprises a locking device, the locking device comprises a rotating shaft and an operating shaft for driving the rotating shaft to rotate, the axis of the rotating shaft is parallel to the axis of the rotating roller and is arranged on the outer surface of the roller body, the free end of the film is wound on the rotating shaft, and the locking device and the locking elastic piece are respectively arranged at two opposite ends of the film in the circumferential direction.
Preferably, the locking device further includes a worm gear mechanism connecting the operation shaft and the rotation shaft, and the worm gear mechanism and the operation shaft are both installed at a side portion of the rotation roller.
Preferably, the cutting wire die material comprises acrylic acid ester oligomer, acrylic acid ester active monomer, photoinitiator, antioxidant and adhesion promoter.
Preferably, the photosensitive resin polymer of the knife wire die comprises the following components in parts by weight: 60-75 parts of acrylic acid ester oligomer, 20-35 parts of acrylic acid ester active monomer, 2-5 parts of photoinitiator, 0.05-0.1 part of antioxidant and 1-2 parts of adhesion promoter.
Preferably, the wire cutting die material further comprises 0.01-0.03 parts of inorganic nano particles by weight.
Preferably, the inorganic nanoparticle is a nanosilica or a nanosilica.
Preferably, the acrylic oligomer is one or more of aliphatic urethane acrylate with the viscosity of 60000-90000 cps at 25 ℃, polyester acrylate with the viscosity of 140000 ~ 150000cps at 50 ℃, aliphatic urethane acrylate with the viscosity of 13000-18000 cps at 60 ℃, epoxy acrylate with the viscosity of 30000-40000 cps at 25 ℃ and epoxy acrylate with the viscosity of 330000 ~ 380000cps at 25 ℃.
Preferably, the acrylic acid active monomer is one or more of 1, 6-hexanediol diacrylate, cyclotrimethylolpropane methylacrylate, dipropylene glycol diacrylate, trimethylolpropane triacrylate, tetrahydrofuran acrylate and 4-acetyl acryloylmorpholine.
Preferably, the photoinitiator is phenyl bis (2, 4, 6-trimethylbenzoyl) phosphine oxide.
Preferably, the antioxidant is pentaerythritol tetrakis (β - (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate).
Preferably, the adhesion promoter is a monofunctional acid ester.
A method for manufacturing a nonmetallic cutter wire die, which is used for processing the manufacturing device, wherein the cutter wire die material processing comprises the following steps:
adding 60-75 parts of acrylic oligomers and 20-35 parts of acrylic active monomers into a container with a stirring device according to parts by weight, stirring for 1h at 50 ℃, adding 2-5 parts of photoinitiators, 0.05-0.1 part of antioxidants and 1-2 parts of adhesion promoters according to parts by weight, stirring for 30min, placing the obtained blending liquid into a high-speed dispersing machine for dispersing treatment, and simultaneously adding inorganic nano particles along with the dispersion and dispersing for 1h at high speed to obtain the cutter wire die material.
In the technical scheme, the manufacturing device of the nonmetal cutter wire die provided by the invention comprises a control device, a film and a cutter wire die printing device; the cutter line die printing device comprises a machine head assembly and a light-curing surface light source assembly, wherein the machine head assembly is used for spraying cutter line die materials with preset shapes on a film, the light-curing surface light source assembly is used for curing the cutter line die materials sprayed on the film by the machine head assembly, and the control device controls the machine head assembly to spray the cutter line die materials along a preset path, and the cutter line die materials are photosensitive resin polymers. When the nonmetallic lead die is required to be manufactured, firstly, the film is placed at a preset position, a pre-printing pattern is input into the control device, the control device controls the machine head assembly to walk along a preset path, meanwhile, the cutter wire die material is sprayed, the photocuring area light source assembly cures the printed cutter wire die material to form a nonmetallic cutter wire die, and finally, the nonmetallic lead die cured on the film is taken down for use.
According to the description, in the nonmetal cutter wire die provided by the application, the nonmetal cutter wire passes through a printing technology, namely, a wire die printing device walks according to a preset path according to a design pattern, and forms a rigid line with certain mechanical property under the irradiation of the light-curing surface light source assembly, so that the cutter wire die is formed, the manufacturing is simple, the operation is convenient, and the manufacturing process of the cutter wire die is effectively simplified.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a device for manufacturing a nonmetal cutter wire die according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a handpiece assembly according to an embodiment of the present invention;
FIG. 3 is a diagram illustrating an installation position of a locking spring according to an embodiment of the present invention;
FIG. 4 is a diagram showing the installation position of the adsorption device according to the embodiment of the invention;
FIG. 5 is a diagram showing an installation position of a locking device according to an embodiment of the present invention;
FIG. 6 is a schematic view of a roll body assembly according to an embodiment of the present invention;
FIG. 7 is an enlarged view of a locking device according to an embodiment of the present invention;
fig. 8 is an enlarged view of a locking spring according to an embodiment of the present invention.
Wherein in fig. 1-8:
110-a machine head assembly, 111-a lifting device, 112-a rotating device, 113-a spraying device, 114-a point light source curing device and 115-a spraying needle head;
120-translation means;
130-roll body assembly, 131-film, 132-driving gear;
140-a light-cured surface light source assembly;
150-locking spring pieces, 151-elastic pieces and 152-pressing plates;
160-locking device, 161-rotating shaft, 162-operating shaft, 163-turbine, 164-worm, 165-turbine worm seat;
170-an adsorption device, 171-a high-speed rotary joint, 172-an electromagnetic valve and 173-a vacuum pump;
180-a first clamping piece;
190-second snap.
Detailed Description
The core of the invention is to provide a manufacturing device of a nonmetal cutter wire die so as to simplify the manufacturing process of the cutter wire die. The invention further provides a manufacturing method of the nonmetal cutter wire die.
The present invention will be described in further detail below with reference to the drawings and embodiments, so that those skilled in the art can better understand the technical solutions of the present invention.
Please refer to fig. 1 to 8.
In one embodiment, the apparatus for manufacturing a nonmetal cutting die according to the embodiment of the present invention includes a control device, a film 131, and a cutting die printing device. The film 131 can be a metallic material or a metallic material, although the film 131 can be formed from a combination of materials, wherein the film 131 can be fabricated from a thinner material.
The cutter wire die printing device comprises a machine head assembly 110 and a light curing surface light source assembly 140, wherein the machine head assembly 110 is used for spraying cutter wire die materials with preset shapes on the film 131, the light curing surface light source assembly 140 is used for curing the cutter wire die materials sprayed on the film 131 by the machine head assembly 110, and the control device controls the machine head assembly 110 to spray the cutter wire die materials along a preset path, wherein the cutter wire die materials are photosensitive resin polymers. The shape of the injection needle 115 on the handpiece assembly 110 is determined according to practical needs, and the present application is not particularly limited.
The manufacture of nonmetallic cutter lines is divided into two cases, wherein one is based on the manufacture of nonmetallic cutter lines on a roller body (round), namely roller polymer cutter lines; one is to manufacture a polymer cutter wire for short on a plane by a nonmetal cutter wire on a plane; wherein the roll polymer cutter wire and the face polymer cutter wire are collectively referred to as polymer cutter wires. The steps of manufacturing the cutter lines are consistent, and only the reference surfaces are manufactured differently; wherein the roll body is a knife line manufactured on a curved surface; the polymer knife line is made on a plane.
When the nonmetallic wire die needs to be manufactured, firstly, the film 131 is placed at a preset position, a pre-printing pattern is input into the control device, the control device controls the machine head assembly 110 to walk along a preset path, meanwhile, the cutter wire die material is sprayed, the photocuring area light source assembly 140 cures the printed cutter wire die material to form a nonmetallic cutter wire die, and finally, the nonmetallic wire die cured on the film 131 is taken down for use.
As can be seen from the above description, in the nonmetal cutter wire die provided in the specific embodiment of the present application, the nonmetal cutter wire is formed into a rigid line with a certain mechanical property under the irradiation of the light-curing surface light source assembly 140 by a printing technology, that is, the wire die printing device walks along a preset path according to a design pattern, so as to form the cutter wire die, so that the manufacturing process of the cutter wire die is simple, the operation is convenient, and the manufacturing process of the cutter wire die is effectively simplified.
In one embodiment, the head assembly 110 includes a spraying device 113, a spot light curing device 114, a lifting device 111, and a rotating device 112 for driving the spraying device 113 and the spot light curing device 114 to horizontally rotate relative to each other, wherein the lifting device 111 is used for driving the spraying device 113 and the spot light curing device 114 to lift, and in particular, the lifting device 111 drives a spraying needle 115 on the spraying device 113 to lift. Wherein, the number of the spraying devices 113 on the machine head can be one or at least two, and one or at least two spraying needles 115 can be arranged on each spraying device 113.
In specific use, the film 131 can be tiled and fixed, and the spraying device 113 moves transversely and longitudinally in the plane, so that in-plane use is realized, and then a preset pattern is printed.
Preferably, the lifting device 111 drives the rotating device 112 and the spraying device 113 to rotate at the same time, and specifically, the rotating device 112 is installed at the lifting end of the lifting device 111.
In one embodiment, the apparatus for manufacturing a nonmetallic cutter wire die further includes a roll body assembly 130 and a translation device 120 for driving the head assembly 110 to move along the axis direction of the roll body assembly 130, wherein the roll body assembly 130 includes a rotating roller and a film fixing device for locking the film 131 to the surface of the rotating roller. Specifically, the roll body assembly 130 may be manually rotated by a worker, or may be rotated by a die-cutting seat motor, and specifically, the die-cutting seat motor may be rotated by driving a driving gear 132 on the rotating roll, thereby driving the roll body assembly 130 to rotate. Specifically, a drive gear 132 is mounted at the rotating roller side end.
In a specific operation, a cutter line design engineer designs a cutter line unfolding diagram according to the requirements of a customer, then transmits the designed cutter line diagram to fixed recognition software through a computer, converts the designed cutter line diagram into bytes which can be recognized by an execution mechanism of a control device, and then the translation device 120 moves to a formulated position under the driving of a motor, and the lifting device 111 descends the injection device 113 to a set height.
When the transverse lines are printed, the rotating device 112 rotates to enable the point light source curing device 114 to rotate to the rear of the spraying device 113, and the photosensitive resin composition sprays nonmetallic materials from the spraying needle 115 under the action of the spraying device 113 to form nonmetallic knife lines; the translation device 120 can be driven by a motor to move left and right to form the length of the line segment.
When the longitudinal lines are printed, the rotating device 112 rotates to rotate the point light source solidifying device 114 to the rear of the spraying device 113; the spraying device 113 is stationary; the roll body assembly 130 is rotated by the die cutter motor to an angle that results in the length of the longitudinal nonmetallic cutter lines.
In order to facilitate fixing of the film 131, it is preferable that the film fixing means includes a locking spring 150, the locking spring 150 includes a pressing plate 152 and an elastic member 151 for pressing the pressing plate 152 to the surface of the rotating roller, the pressing plate 152 is for pressing the film 131 to the surface of the rotating roller, and the pressing plate 152 is rotatably installed on the rotating roller. Specifically, the elastic member 151 may be a torsion spring. The pressing plate 152 may be mounted on the rotating roller by a hinge. To facilitate the crimping of the film 131, it is preferable that the surface of the pressing plate 152 to which the film 131 is attached is provided with anti-slip patterns.
More preferably, the locking spring pieces 150 are plural, and all the locking spring pieces 150 are sequentially arranged along the axis direction of the rotating roller. Preferably, the distance between two adjacent locking spring pieces 150 is equal along the axis direction of the rotating roller.
In order to further improve the mounting stability of the film 131, preferably, the mounting position of the locking spring 150 on the rotating roller is provided with a first clamping piece 180 for clamping the film 131, the film 131 is provided with a first clamping hole clamped on the first clamping piece 180, and specifically, the pressing plate 152 can be provided with a mounting hole for the first clamping piece 180 to pass through. The number of the first clamping members 180 may be one or at least two, and preferably, two first clamping members 180 are disposed on each locking spring 150 along the axis direction of the rotating roller.
In a specific embodiment, the film fixing device comprises an adsorption device 170, the adsorption device 170 comprises a vacuum pump 173 and an air suction hole arranged on a roller body of a rotating roller, a hollow cavity is arranged inside the rotating roller, and the hollow cavity is connected with the air suction hole and the vacuum pump 173. Specifically, the vacuum pump 173 is connected to an air cavity inside the rotating roller through the high-speed rotary joint 171. In operation, the vacuum pump 173 is controlled to operate by the solenoid valve 172.
In one embodiment, the film fixing device includes a locking device 160, where the locking device 160 includes a rotating shaft 161 and an operating shaft 162 for driving the rotating shaft 161 to rotate, the axis of the rotating shaft 161 is parallel to the axis of the roll body and is disposed on the outer surface of the roll body, and a limiting hole for hooking the free end of the film 131 is provided on the rotating shaft 161. The locking device 160 and the locking spring 150 are respectively installed at opposite ends of the film 131 in the circumferential direction. Specifically, both ends of the rotating shaft are rotatably installed at opposite sides of the rotating roller. The operating shaft 162 may be directly connected to the rotating shaft, and the operating shaft 162 is located outside the rotating roller. The operation shaft 162 can be locked by a locking member, so that rotation during operation is avoided.
Preferably, the locking device 160 further includes a worm gear mechanism connecting the operating shaft 162 and the rotating shaft 161, and the worm gear mechanism and the operating shaft 162 are mounted at the side of the roll body. Specifically, the operating shaft 162 is connected to a worm 164 of the worm gear mechanism, and the rotating shaft 161 is connected to a worm gear 163 of the worm gear mechanism. In the specific installation, both ends of the worm wheel 163 are rotatably installed on the worm wheel and worm seat 165, and the worm wheel and worm seat 165 is installed on the side wall of the rotating roller.
In operation, one end of the film 131 is pressed on the roller body by pulling the pressing plate 152 by hand, the pressing plate 152 is put down, one end of the film 131 is fixed tightly under the action of the elastic member 151, and at this time, the film 131 can be hung on the first clamping member 180. The other end of the film 131 is hung on the rotating shaft 161; under the action of the vacuum pump 173, the electromagnetic valve 172 is opened, the inside of the cavity of the rotating roller is vacuumized through the high-speed rotary joint 171, the film 131 is firmly adsorbed on the roller body of the rotating roller, at this time, the other end of the film 131 is mounted on the rotary shaft 161, and specifically, the rotary shaft 161 is provided with the second clamping piece 190 for clamping the film 131. Then, the manual operation shaft 162 is rotated, and the rotation shaft 161 is rotated by the rotation of the worm and gear mechanism, whereby the film 131 on the roll surface is firmly locked by the dual functions of the suction device 170 and the locking device 160.
The cutting line mould material comprises acrylic acid ester oligomer, acrylic acid ester active monomer, photoinitiator, antioxidant and adhesion promoter.
The photosensitive resin polymer of the cutter wire die comprises the following components in parts by weight: 60-75 parts of acrylic oligomers, 20-35 parts of acrylic active monomers, 2-5 parts of photoinitiators, 0.05-0.1 part of antioxidants and 1-2 parts of adhesion promoters.
The wire cutting die material also comprises inorganic nano particles, and the inorganic nano particles are 0.01-0.03 part by weight. When the polymeric cutter wire requires high frequency indentation for a long period of time, it is considered to incorporate inorganic nanoparticles as reinforcing phases in the composition to enhance the thermal high temperature resistance and surface abrasion resistance of the polymeric cutter wire.
Specifically, the inorganic nanoparticles may be nano silica or nano titania.
In one specific embodiment, the acrylate oligomer is one or more of aliphatic urethane acrylate with the viscosity of 60000-90000 cps at 25 ℃, polyester acrylate with the viscosity of 140000 ~ 150000cps at 50 ℃, aliphatic urethane acrylate with the viscosity of 13000-18000 cps at 60 ℃, epoxy acrylate with the viscosity of 30000-40000 cps at 25 ℃ and epoxy acrylate with the viscosity of 330000 ~ 380000cps at 25 ℃.
The acrylic acid active monomer is one or more of 1, 6-hexanediol diacrylate, cyclotrimethylolpropane methylacrylate, dipropylene glycol diacrylate, trimethylolpropane triacrylate, tetrahydrofuranacrylate and 4-acetyl acryloylmorpholine.
The photoinitiator is phenyl bis (2, 4, 6-trimethylbenzoyl) phosphine oxide.
The antioxidant is pentaerythritol tetra (beta- (3, 5-di-tert-butyl-4-hydroxyphenyl) propionate).
The adhesion promoter is a monofunctional acid ester.
Because the photosensitive resin polymer cutter wire adopts the additive manufacturing scheme, the loss of raw materials is greatly reduced.
The machine head assembly adopts a 3D printing technology, the photosensitive resin composition is directly extruded to the base material in a liquid form according to the appearance designed by a design engineer, the resin polymer is solidified into rigid lines with certain mechanical properties under the irradiation of UV light of the light-curing surface light source assembly, and the rigid lines directly replace a traditional metal cutting die to mould paper, so that the manufacturing is simple, and meanwhile, the diversity of the lines is more flexible. The curing time is short, the forming of a cutter mold line is greatly shortened, the manufacturing period and the time of the product to be put into the market are very short, and the production efficiency is high.
The application adopts 3D printing technology and UV light curing technology, just need not too many engineers just can make the cutting die take shape fast, reduces the cost of product, because convenient operation is simple, realizes full-automatic indentation equipment easy operation, easy to use, easy maintenance, reducible hire cost to professional technical operation personnel. The application requires a plurality of indentation products, including gift boxes, envelopes, products with concave-convex structures and the like, and improves diversified production.
According to the nonmetal cutter wire die, films 131 with different thicknesses are adopted for manufacturing according to the paper with different thicknesses, so that the thickness of the nonmetal cutter die is greatly reduced, meanwhile, the nonmetal cutter die can be recycled, and the storage space of the conventional cutter die is eliminated.
The light-sensitive resin cured line is small in size and light in weight, and is abandoned together with the film material rolled on the rotating roller as solid waste after indentation is finished, and the light-sensitive resin is reshaped when needed next time, so that a storage space is not needed, the cloud storage of an indentation scheme is realized, and the light-sensitive resin is simple and convenient to disassemble and assemble.
The manufacturing method of the nonmetal cutter wire die is used for processing the manufacturing device, wherein the cutter wire die material processing comprises the following steps:
adding 60-75 parts of acrylic oligomers and 20-35 parts of acrylic active monomers into a container with a stirring device according to parts by weight, stirring for 1h at 50 ℃, adding 2-5 parts of photoinitiators, 0.05-0.1 part of antioxidants and 1-2 parts of adhesion promoters according to parts by weight, stirring for 30min, placing the obtained blending liquid into a high-speed dispersing machine for dispersing treatment, and simultaneously adding inorganic nano particles along with the dispersion and dispersing for 1h at high speed to obtain the cutter wire die material. The rotation speed of the motor of the high-speed dispersing machine is determined according to actual needs, and the application is not particularly limited.
The cutter wire die material of the photosensitive resin composition provided by the application is characterized in that: the adhesive force with the film 131 is strong; the surface hardness after solidification is high; the adhesive has certain viscosity at room temperature, and can maintain certain dimensional accuracy before pre-curing; has certain temperature resistance, and does not generate thermal deformation and thermal failure in the repeated pressing process.
Performance parameters of the photosensitive resin composition after curing:
mechanical properties
Surface hardness (Shore D) | 75~88 |
Tensile Strength (Mpa) | 34~47 |
Impact Strength (KJ/m 2) | 12~26 |
High temperature resistance (mechanical property at 75℃)
In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (14)
1. The manufacturing device of the nonmetal cutter wire die is characterized by comprising a control device, a film (131) and a cutter wire die printing device; the cutter line die printing device comprises a machine head assembly (110) and a light-curing surface light source assembly (140), wherein the machine head assembly (110) is used for spraying cutter line die materials with preset shapes on the film (131), the light-curing surface light source assembly (140) is used for curing the cutter line die materials sprayed on the film (131) by the machine head assembly (110), and the control device controls the machine head assembly (110) to spray the cutter line die materials along a preset path, wherein the cutter line die materials are photosensitive resin polymers;
the device further comprises a roller body assembly (130), wherein the roller body assembly (130) comprises a rotating roller and a film fixing device, and the film fixing device is used for locking the film (131) to the surface of the rotating roller;
the film fixing device comprises a locking elastic piece (150), wherein the locking elastic piece (150) comprises a pressing plate (152) and an elastic piece (151) used for pressing the pressing plate (152) to the surface of the rotating roller, the pressing plate (152) is used for pressing the film (131) to the surface of the rotating roller, and the pressing plate (152) is rotatably arranged on the rotating roller;
the film fixing device comprises a locking device (160), the locking device (160) comprises a rotating shaft (161) and an operating shaft (162) for driving the rotating shaft (161) to rotate, the axis of the rotating shaft (161) is parallel to the axis of the rotating roller and is arranged on the outer surface of the roller body of the rotating roller, the free end of the film (131) is wound on the rotating shaft (161), and the locking device (160) and the locking elastic piece (150) are respectively arranged at the opposite ends of the film (131) in the circumferential direction;
the machine head assembly (110) comprises a spraying device (113), a point light source curing device (114), a lifting device (111) and a rotating device (112) for driving the spraying device (113) and the point light source curing device (114) to horizontally and relatively rotate, wherein the lifting device (111) is used for driving the spraying device (113) and the point light source curing device (114) to lift;
the device also comprises a translation device (120) for driving the machine head assembly (110) to move along the axial direction of the roller body assembly (130);
the film fixing device comprises an adsorption device (170), wherein the adsorption device (170) comprises a vacuum pump (173) and an air suction hole arranged on a roller body of the rotating roller, a hollow cavity is formed in the rotating roller, and the hollow cavity is connected with the air suction hole and the vacuum pump (173).
2. The apparatus for manufacturing a nonmetallic cutter line die according to claim 1, wherein the rotating device (112) is installed at a lifting end of the lifting device (111).
3. The apparatus for manufacturing a nonmetallic cutter wire die according to claim 1, wherein the locking spring pieces (150) are plural, and all the locking spring pieces (150) are sequentially arranged along the axis direction of the rotating roller.
4. The apparatus for manufacturing a nonmetallic cutter wire die according to claim 1, wherein the locking device (160) further includes a worm gear mechanism connecting the operating shaft (162) and the rotating shaft (161), both of which are installed at a side portion of the rotating roller.
5. The apparatus for manufacturing a nonmetallic cutter wire die according to claim 1, wherein the cutter wire die material comprises an acrylic oligomer, an acrylic reactive monomer, a photoinitiator, an antioxidant, and an adhesion promoter.
6. The apparatus for manufacturing a nonmetallic cutter wire die according to claim 5, wherein the photosensitive resin polymer of the cutter wire die is calculated in parts by weight: 60-75 parts of acrylic ester oligomer, 20-35 parts of acrylic ester active monomer, 2-5 parts of photoinitiator, 0.05-0.1 part of antioxidant and 1-2 parts of adhesion promoter.
7. The apparatus for manufacturing a nonmetallic cutter wire die according to claim 5, wherein the cutter wire die material further comprises inorganic nanoparticles, and the inorganic nanoparticles are 0.01-0.03 parts by weight.
8. The apparatus for manufacturing a nonmetallic cutter line die according to claim 7, wherein the inorganic nanoparticles are nano-silica or nano-titania.
9. The apparatus for manufacturing a nonmetallic cutter wire die according to claim 5, wherein the acrylate oligomer is one or more of an aliphatic urethane acrylate having a viscosity of 60000 to 90000cps at 25 ℃, a polyester acrylate having a viscosity of 140000 to 150000cps at 50 ℃, an aliphatic urethane acrylate having a viscosity of 13000 to 18000cps at 60 ℃, an epoxy acrylate having a viscosity of 30000 to 40000cps at 25 ℃, and an epoxy acrylate having a viscosity of 330000 to 38000cps at 25 ℃.
10. The apparatus for manufacturing a nonmetallic cutter wire die according to claim 5, wherein the acrylic acid ester type active monomer is one or more of 1, 6-hexanediol diacrylate, cyclo-trimethylolpropane methylacrylate, dipropylene glycol diacrylate, trimethylolpropane triacrylate, tetrahydrofuranacrylate, and 4-acetoacetoylmorpholine.
11. The apparatus for manufacturing a nonmetallic cutter wire die according to claim 5, wherein the photoinitiator is phenyl bis (2, 4, 6-trimethylbenzoyl) phosphine oxide.
12. The apparatus for manufacturing a nonmetallic cutter wire die according to claim 5, wherein the antioxidant is pentaerythritol tetrakis (β - (3, 5-di-t-butyl-4-hydroxyphenyl) propionate).
13. The apparatus for manufacturing a nonmetallic cutter line die according to claim 5, wherein the adhesion promoter is a monofunctional acid ester.
14. A method of manufacturing a nonmetallic wire form for processing the manufacturing apparatus of any one of claims 1-4, 7, or 8, the wire form material processing comprising the steps of:
adding 60-75 parts of acrylic oligomers and 20-35 parts of acrylic active monomers into a container with a stirring device according to parts by weight, stirring for 1h at 50 ℃, adding 2-5 parts of photoinitiators, 0.05-0.1 part of antioxidants and 1-2 parts of adhesion promoters according to parts by weight, stirring for 30min, placing the obtained blending liquid into a high-speed dispersing machine for dispersing treatment, and simultaneously adding inorganic nano particles along with the dispersion and dispersing for 1h at high speed to obtain the wire-cutting die material.
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NL2014302B1 (en) * | 2015-02-17 | 2016-10-13 | Color Control B V | Sleeve for filling the space in a sleeve, sleeve to be used for flexo printing and method for manufacturing such a sleeve and sleeve. |
CN106986971A (en) * | 2017-03-17 | 2017-07-28 | 大族激光科技产业集团股份有限公司 | A kind of high temperature resistant photo-curing material and preparation method thereof |
CN206643773U (en) * | 2017-03-30 | 2017-11-17 | 蓝思科技(长沙)有限公司 | A kind of slice-shaped workpiece planarization grinding location device |
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CN203557766U (en) * | 2013-10-29 | 2014-04-23 | 辽宁大族冠华印刷科技股份有限公司 | Rotary indenting device based on 3D print technology |
NL2014302B1 (en) * | 2015-02-17 | 2016-10-13 | Color Control B V | Sleeve for filling the space in a sleeve, sleeve to be used for flexo printing and method for manufacturing such a sleeve and sleeve. |
CN106986971A (en) * | 2017-03-17 | 2017-07-28 | 大族激光科技产业集团股份有限公司 | A kind of high temperature resistant photo-curing material and preparation method thereof |
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