CN114883237A - 一种基于机器视觉的器件对位对接系统及方法 - Google Patents
一种基于机器视觉的器件对位对接系统及方法 Download PDFInfo
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- CN114883237A CN114883237A CN202210470282.6A CN202210470282A CN114883237A CN 114883237 A CN114883237 A CN 114883237A CN 202210470282 A CN202210470282 A CN 202210470282A CN 114883237 A CN114883237 A CN 114883237A
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- 238000003032 molecular docking Methods 0.000 claims abstract description 14
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- 230000006872 improvement Effects 0.000 description 3
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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CN202210470282.6A CN114883237B (zh) | 2022-04-28 | 2022-04-28 | 一种基于机器视觉的器件对位对接系统及方法 |
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CN114883237A true CN114883237A (zh) | 2022-08-09 |
CN114883237B CN114883237B (zh) | 2023-05-12 |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003152031A (ja) * | 2001-11-15 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置およびボンディング方法 |
JP2004151390A (ja) * | 2002-10-30 | 2004-05-27 | Nippon Telegr & Teleph Corp <Ntt> | 光モジュールの組立方法、光モジュールの組立装置およびプログラム |
JP2006162554A (ja) * | 2004-12-10 | 2006-06-22 | Matsushita Electric Ind Co Ltd | 測距方法、傾き検出方法、およびフリップチップ実装方法 |
CN203894510U (zh) * | 2014-05-29 | 2014-10-22 | 深圳市中欣科技有限公司 | Ccd视觉对位真空贴合机 |
CN106425692A (zh) * | 2016-09-19 | 2017-02-22 | 深圳大宇精雕科技有限公司 | Ccd高光机定位检测系统及方法 |
CN206726191U (zh) * | 2017-04-25 | 2017-12-08 | 信利半导体有限公司 | 一种显示模组的贴合装置 |
CN110470225A (zh) * | 2019-09-23 | 2019-11-19 | 业成科技(成都)有限公司 | 贴合设备和贴合方法 |
CN113329566A (zh) * | 2021-04-14 | 2021-08-31 | 中电科风华信息装备股份有限公司 | Cof与tp-fpc自动对位预压装置 |
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- 2022-04-28 CN CN202210470282.6A patent/CN114883237B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003152031A (ja) * | 2001-11-15 | 2003-05-23 | Matsushita Electric Ind Co Ltd | 電子部品のボンディング装置およびボンディング方法 |
JP2004151390A (ja) * | 2002-10-30 | 2004-05-27 | Nippon Telegr & Teleph Corp <Ntt> | 光モジュールの組立方法、光モジュールの組立装置およびプログラム |
JP2006162554A (ja) * | 2004-12-10 | 2006-06-22 | Matsushita Electric Ind Co Ltd | 測距方法、傾き検出方法、およびフリップチップ実装方法 |
CN203894510U (zh) * | 2014-05-29 | 2014-10-22 | 深圳市中欣科技有限公司 | Ccd视觉对位真空贴合机 |
CN106425692A (zh) * | 2016-09-19 | 2017-02-22 | 深圳大宇精雕科技有限公司 | Ccd高光机定位检测系统及方法 |
CN206726191U (zh) * | 2017-04-25 | 2017-12-08 | 信利半导体有限公司 | 一种显示模组的贴合装置 |
CN110470225A (zh) * | 2019-09-23 | 2019-11-19 | 业成科技(成都)有限公司 | 贴合设备和贴合方法 |
CN113329566A (zh) * | 2021-04-14 | 2021-08-31 | 中电科风华信息装备股份有限公司 | Cof与tp-fpc自动对位预压装置 |
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Effective date of registration: 20241219 Address after: No. 5-1 Huanghai Avenue, Linhai Street, Xingcheng City, Huludao City, Liaoning Province, China 125107 Patentee after: Jiuding Communication Equipment (Xingcheng) Co.,Ltd. Country or region after: China Address before: 101299 building 7-8, yard 26, Xinggu Road, Pinggu Park, Zhongguancun Science and Technology Park, Pinggu District, Beijing Patentee before: Beijing guomu Wuke Electronics Co.,Ltd. Country or region before: China |