CN114879084A - System and method for testing efficient leakage current of array diode chip - Google Patents

System and method for testing efficient leakage current of array diode chip Download PDF

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Publication number
CN114879084A
CN114879084A CN202210797229.7A CN202210797229A CN114879084A CN 114879084 A CN114879084 A CN 114879084A CN 202210797229 A CN202210797229 A CN 202210797229A CN 114879084 A CN114879084 A CN 114879084A
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double
circuit
throw switch
channel
pole double
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CN114879084B (en
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王伟
包智杰
夏玲慧
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Nanjing Hongtai Semiconductor Technology Co ltd
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Nanjing Hongtai Semiconductor Technology Co ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/52Testing for short-circuits, leakage current or ground faults
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416Connectors, terminals
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The invention discloses a system and a method for testing efficient leakage current of an array diode chip, wherein the system comprises an input circuit, a power circuit, a circuit conversion module, a control circuit and an output circuit, wherein the input circuit is used for realizing input and information exchange from a testing machine to a testing board; the power supply circuit provides a power supply circuit required by the circuit; the control module is used for controlling the circuit conversion module to realize the specific circuit output function under different test conditions; and the output circuit is connected with an external device to be tested. The invention uses two of the three groups of outputs of the tester as output ends, and the other group as input test ends, and completes the switching between the outputs to different pins through the double-pole double-throw switch. The invention realizes the test of the array diode chip, reduces the test cost, improves the test stability, reduces the test time and improves the test efficiency.

Description

System and method for testing efficient leakage current of array diode chip
Technical Field
The invention relates to an array diode chip efficient leakage current testing system and method, and belongs to the technical field of discrete device testing.
Background
In the prior art, a matrix box is adopted, and a relay matrix consisting of a plurality of relays is arranged in the matrix box, so that input and output conduction under different requirements is realized.
According to the scheme, the relays need to be conducted one by one to achieve conducting connection between the test circuit and the pins of the device to be tested in the test process, so that longer test time is needed, the internal circuit of the matrix box is complex, and the influence on low-current test is large.
Disclosure of Invention
The purpose of the invention is as follows: aiming at the defects of long test time and complex circuit in the prior art, the invention provides the efficient leakage current test system and method for the array diode chip, which can simplify the test circuit, reduce the test time and reduce the test cost on the premise of ensuring the test precision.
The technical scheme is as follows: in order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides an array diode chip high efficiency leakage current test system, includes input circuit, power supply circuit, circuit conversion module, control circuit and output circuit, wherein:
the input circuit is used for realizing the input of the testing machine to the testing board and information exchange.
The output circuit is used for completing connection with an external device to be tested.
The power supply circuit provides a power supply circuit required by the circuit.
The input circuit is two groups of channels in three groups of channels of the testing machine, the output circuit is the other group of channels in the three groups of channels of the testing machine, wherein the three groups of channels of the testing machine are respectively marked as a channel B, a channel E and a channel C, the channel B and the channel E are used as the input circuit, and the channel C is used as the output circuit.
The circuit conversion module comprises a first double-pole double-throw switch group and a second double-pole double-throw switch group, the first double-pole double-throw switch group comprises a first double-pole double-throw switch and a second double-pole double-throw switch, the immobile end of the first double-pole double-throw switch is connected with a power circuit, the mobile end of the first double-pole double-throw switch points to the test loop end of the channel B, the immobile end of the second double-pole double-throw switch is connected with the power circuit, and the mobile end of the second double-pole double-throw switch points to the output loop end of the channel B. The second double-pole double-throw switch group comprises a first double-pole double-throw switch and a second double-pole double-throw switch, the immobile end of the first double-pole double-throw switch is connected with the power circuit, the active end of the first double-pole double-throw switch points to the test loop end of the E channel, the immobile end of the second double-pole double-throw switch is connected with the power circuit, and the active end of the second double-pole double-throw switch points to the output loop end of the E channel.
The control module is used for controlling the circuit conversion module to realize circuit output under different test conditions.
Preferably: the control module is loaded with a single-pole control time sequence and controls the first double-pole double-throw switch group and the second double-pole double-throw switch group according to the single-pole control time sequence, so that the output of the circuit under different test conditions is realized.
Preferably: the output circuit is connected with an external device to be tested in a clamping mode; or the output circuit is connected with an external device to be tested in a bolt connection mode.
Preferably: the first double-pole double-throw switch group and the second double-pole double-throw switch group are both relays.
A method for testing the efficient leakage current of an array diode chip comprises the following steps:
step 1, loading a single-blade control time sequence to be controlled into a control module during testing.
And 2, switching on a power circuit.
And 3, the control module respectively controls the first double-pole double-throw switch I and the first double-pole double-throw switch II to finish the input of the test signal and the output signal of the channel B according to the single-pole control time sequence, and controls the actions of the actuating ends of the second double-pole double-throw switch I and the second double-pole double-throw switch II to finish the input of the test signal and the output signal of the channel E.
And 4, outputting a final signal through the C channel by the tester according to the input of the test signal and the output signal of the B channel and the input of the test signal and the output signal of the E channel.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention realizes the test of the array diode chip, reduces the test cost and improves the test stability.
2. Aiming at the characteristics of the existing testing machine, the relay is skillfully utilized to complete a specific testing loop under different conditions, the purpose of rapid testing is realized, the testing time is reduced, and the testing efficiency is improved.
Drawings
Fig. 1 is a test schematic of a tester.
Fig. 2 is a circuit diagram of the circuit converting module.
Fig. 3 is a simplified schematic diagram of the internal principle of the chip.
Fig. 4 is a circuit diagram of the present invention.
Fig. 5 is a timing chart of the switching control.
Detailed Description
The present invention is further illustrated by the following description in conjunction with the accompanying drawings and the specific embodiments, it is to be understood that these examples are given solely for the purpose of illustration and are not intended as a definition of the limits of the invention, since various equivalent modifications will occur to those skilled in the art upon reading the present invention and fall within the limits of the appended claims.
An array diode chip high-efficiency leakage current test system is shown in fig. 4, and comprises an input circuit, a power circuit, a circuit conversion module, a control circuit and an output circuit, wherein:
the input circuit mainly realizes the input and information exchange from the testing machine to the testing board.
The power supply circuit provides a power supply circuit required by the circuit.
The control module is used for controlling the circuit conversion module to realize the specific circuit output function under different test conditions.
The output circuit is used for completing connection with an external device to be tested and is connected with the external device to be tested in a clamping mode; or the output circuit is connected with an external device to be tested in a bolt connection mode.
As shown in fig. 1, in the discrete device testing industry, kelvin link is often used, a testing machine generally provides three channels, i.e., (b), (base), c (collector), and e (emitter), and each channel provides a Force (output circuit) and a Sense (judgment circuit) to form an output loop and a testing loop.
In this embodiment, two of the three outputs of the tester are used as output terminals, and the other output is used as an input test terminal, and the output is switched to different pins through the double-pole double-throw switch.
The input circuit is two groups of channels in three groups of channels of the testing machine, the output circuit is the other group of channels in the three groups of channels of the testing machine, wherein the three groups of channels of the testing machine are respectively marked as a channel B, a channel E and a channel C, the channel B and the channel E are used as the input circuit, and the channel C is used as the output circuit.
The circuit conversion module comprises a first double-pole double-throw switch group and a second double-pole double-throw switch group, the first double-pole double-throw switch group comprises a first double-pole double-throw switch and a second double-pole double-throw switch, the immobile end of the first double-pole double-throw switch is connected with a power circuit, the mobile end of the first double-pole double-throw switch points to the test loop end of the channel B, the immobile end of the second double-pole double-throw switch is connected with the power circuit, and the mobile end of the second double-pole double-throw switch points to the output loop end of the channel B. The second double-pole double-throw switch group comprises a first second double-pole double-throw switch and a second double-pole double-throw switch, the fixed end of the first second double-pole double-throw switch is connected with the power circuit, the actuating end of the first second double-pole double-throw switch points to the test loop end of the E channel, the fixed end of the second double-pole double-throw switch is connected with the power circuit, and the actuating end of the second double-pole double-throw switch points to the output loop end of the E channel. The first double-pole double-throw switch group and the second double-pole double-throw switch group are both relays.
The control module is loaded with a single-pole control time sequence and controls the first double-pole double-throw switch group and the second double-pole double-throw switch group according to the single-pole control time sequence, so that the output of the circuit under different test conditions is realized.
As shown in fig. 2 and 3: BF denotes a B (base) channel output circuit (Force), and BS denotes a B (base) channel determination circuit (Sense). CF denotes a C (collector) channel output circuit (Force), and CS denotes a C (collector) channel judgment circuit (Sense). EF represents E (Emitter) channel output circuit (Force), ES represents E (Emitter) channel judgment circuit (Sense). RY1A/RY2A is a relay number, G6K is an exemplary relay model (the technical requirement is not limited to the model), U1 is a tested device, and TVS _ SP1064 is an exemplary tested device model (the technical requirement is not limited to the model). The first double-pole double-throw switch group is a relay RY1A, and the second double-pole double-throw switch group is a relay RY 2A.
In fig. 2, taking TVS _ SP1064 device as an example, BS and BF are respectively connected to two mutually independent input pins of relay RY1A, ES and EF are respectively connected to two mutually independent input pins of relay RY2A, CS and CF are respectively connected to pins 8 and 3 of the device under test, and pins 3 and 8 are common terminal pins of the device under test. The pin 3 of the input end of the relay RY1A corresponds to two pins 2 and 4 of output, a control signal can control which output pin an input signal is output from, the pin 6 of the input end corresponds to two pins 7 and 5 of output, the control signal can control which output pin the input signal is output from, two groups of outputs are switched simultaneously, the principle of the relay RY2A is similar to that of a double-pole double-throw switch, and the principle of the relay RY1A is the same as that of the relay RY1 3878. Pins 2, 4, 7 and 5 of the relay RY1A are respectively connected to pins 10, 9, 1 and 2 of the device U1 to be tested, pins 2, 4, 7 and 5 of the relay RY2A are respectively connected to pins 4, 5, 7 and 6 of the device U1 to be tested, the pins 1, 10, pins 2 and 9, the pins 4 and 7, the pins 5 and 6 of the device to be tested are input and output mutually, and each group of pins are connected with a transient suppression diode and combined to pins 3 and 8 of a common end in a chip. When the BS signal is connected to pin 10 of U1 through the switch, the BF signal is also provided to pin 1 of U1, which forms a Kelvin connection with CF/CS, and similarly, the EF/ES and CF/CS form a Kelvin connection. During testing, the Force circuit gives signals, and the sensor circuit conducts testing.
A method for testing the efficient leakage current of an array diode chip comprises the following steps:
step 1, loading a single-blade control time sequence to be controlled into a control module during testing.
And 2, switching on a power circuit.
And 3, the control module respectively controls the first double-pole double-throw switch I and the first double-pole double-throw switch II to finish the input of the test signal and the output signal of the channel B according to the single-pole control time sequence, and controls the actions of the actuating ends of the second double-pole double-throw switch I and the second double-pole double-throw switch II to finish the input of the test signal and the output signal of the channel E.
And 4, outputting a final signal through the C channel by the tester according to the input of the test signal and the output signal of the B channel and the input of the test signal and the output signal of the E channel.
As shown in fig. 5, which is a timing chart of the embodiment of the present invention, SW1 indicates the output timing of relay RY1A, and SW2 indicates the output timing of relay RY2A, and the high level is active.
The working steps are as follows:
1. SW1 and SW2 are set to low level, BF/BS and CF/CS actions are enabled, a BF action signal is output, CF is used as a BF signal loop, and the BS and CS actions are tested;
2. BF closes the output, BS closes the test, EF effects the output, CF is regarded as the EF signal return circuit, BS and ES effects the test;
3. EF closing output, ES closing test, SW1 and SW2 giving high level, switch switching output;
4. BF action signal output, CF as BF signal loop, BS and CS action test;
5. BF closes the output, BS closes the test, EF effects the output, CF is regarded as the EF signal return circuit, BS and ES effects the test;
6. EF off output, ES off test, SW1 and SW2 go low.
The above description is only of the preferred embodiments of the present invention, and it should be noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention and these are intended to be within the scope of the invention.

Claims (5)

1. The utility model provides an array diode chip high efficiency leaks current test system which characterized in that: including input circuit, power supply circuit, circuit conversion module, control circuit and output circuit, wherein:
the input circuit is used for realizing the input and information exchange from the testing machine to the testing board;
the output circuit is used for completing the connection with an external device to be tested;
the power supply circuit provides a power supply circuit required by the circuit;
the input circuit is two groups of channels in three groups of channels of the testing machine, the output circuit is the other group of channels in the three groups of channels of the testing machine, wherein the three groups of channels of the testing machine are respectively marked as a channel B, a channel E and a channel C, the channel B and the channel E are used as the input circuit, and the channel C is used as the output circuit;
the circuit conversion module comprises a first double-pole double-throw switch group and a second double-pole double-throw switch group, the first double-pole double-throw switch group comprises a first double-pole double-throw switch and a second double-pole double-throw switch, the immobile end of the first double-pole double-throw switch is connected with a power circuit, the mobile end of the first double-pole double-throw switch points to the test loop end of the channel B, the immobile end of the second double-pole double-throw switch is connected with the power circuit, and the mobile end of the second double-pole double-throw switch points to the output loop end of the channel B; the second double-pole double-throw switch group comprises a first double-pole double-throw switch and a second double-pole double-throw switch, the immobile end of the first double-pole double-throw switch is connected with the power circuit, the active end of the first double-pole double-throw switch points to the test loop end of the E channel, the immobile end of the second double-pole double-throw switch is connected with the power circuit, and the active end of the second double-pole double-throw switch points to the output loop end of the E channel;
the control module is used for controlling the circuit conversion module to realize circuit output under different test conditions.
2. The efficient leakage current testing system for the array diode chip of claim 1, wherein: the control module is loaded with a single-pole control time sequence and controls the first double-pole double-throw switch group and the second double-pole double-throw switch group according to the single-pole control time sequence, so that the output of the circuit under different test conditions is realized.
3. The efficient leakage current testing system for the array diode chip of claim 2, wherein: the output circuit is connected with an external device to be tested in a clamping mode; or the output circuit is connected with an external device to be tested in a bolt connection mode.
4. The array diode chip high efficiency leakage current test system of claim 3, wherein: the first double-pole double-throw switch group and the second double-pole double-throw switch group are both relays.
5. A testing method based on the array diode chip high-efficiency leakage current testing system of claim 4 is characterized by comprising the following steps:
step 1, loading a single-blade control time sequence to be controlled into a control module during testing;
step 2, switching on a power circuit;
step 3, the control module respectively controls the first double-pole double-throw switch I and the first double-pole double-throw switch II to finish the input of the test signal and the output signal of the channel B according to the single-pole control time sequence, and controls the actions of the actuating ends of the second double-pole double-throw switch I and the second double-pole double-throw switch II to finish the input of the test signal and the output signal of the channel E;
and 4, outputting a final signal through the C channel by the tester according to the input of the test signal and the output signal of the B channel and the input of the test signal and the output signal of the E channel.
CN202210797229.7A 2022-07-08 2022-07-08 System and method for testing efficient leakage current of array diode chip Active CN114879084B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116794491A (en) * 2023-08-22 2023-09-22 悦芯科技股份有限公司 Relay matrix software and hardware system for assisting remote debugging

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CN101107670A (en) * 2003-10-15 2008-01-16 Pdf技术公司 Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing
CN107733524A (en) * 2017-09-30 2018-02-23 天津大学 A kind of detector with fexible film PIN photodiode array
CN211179914U (en) * 2019-09-25 2020-08-04 航天科工防御技术研究试验中心 Diode array test fixture
CN112114244A (en) * 2020-09-08 2020-12-22 深圳市拓普泰克电子有限公司 Automatic test circuit, automatic test instrument and automatic test system
CN113196073A (en) * 2018-12-19 2021-07-30 ams有限公司 Circuit fault detection for diode arrays
CN114487774A (en) * 2022-01-11 2022-05-13 江阴捷芯电子科技有限公司 Test system of charging and discharging integrated circuit chip

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Publication number Priority date Publication date Assignee Title
CN101107670A (en) * 2003-10-15 2008-01-16 Pdf技术公司 Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing
CN107733524A (en) * 2017-09-30 2018-02-23 天津大学 A kind of detector with fexible film PIN photodiode array
CN113196073A (en) * 2018-12-19 2021-07-30 ams有限公司 Circuit fault detection for diode arrays
CN211179914U (en) * 2019-09-25 2020-08-04 航天科工防御技术研究试验中心 Diode array test fixture
CN112114244A (en) * 2020-09-08 2020-12-22 深圳市拓普泰克电子有限公司 Automatic test circuit, automatic test instrument and automatic test system
CN114487774A (en) * 2022-01-11 2022-05-13 江阴捷芯电子科技有限公司 Test system of charging and discharging integrated circuit chip

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116794491A (en) * 2023-08-22 2023-09-22 悦芯科技股份有限公司 Relay matrix software and hardware system for assisting remote debugging
CN116794491B (en) * 2023-08-22 2023-11-24 悦芯科技股份有限公司 Relay matrix software and hardware system for assisting remote debugging

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