CN114871932A - Environment-friendly production equipment for semiconductor material and use method thereof - Google Patents

Environment-friendly production equipment for semiconductor material and use method thereof Download PDF

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Publication number
CN114871932A
CN114871932A CN202210665066.7A CN202210665066A CN114871932A CN 114871932 A CN114871932 A CN 114871932A CN 202210665066 A CN202210665066 A CN 202210665066A CN 114871932 A CN114871932 A CN 114871932A
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CN
China
Prior art keywords
polishing
wafer
sealing cover
environment
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210665066.7A
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Chinese (zh)
Inventor
朱春
李述周
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Jiangsu Kepeida Semiconductor Technology Co ltd
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Jiangsu Kepeida Semiconductor Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Kepeida Semiconductor Technology Co ltd filed Critical Jiangsu Kepeida Semiconductor Technology Co ltd
Priority to CN202210665066.7A priority Critical patent/CN114871932A/en
Publication of CN114871932A publication Critical patent/CN114871932A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/04—Protective covers for the grinding wheel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention discloses an environment-friendly production device for semiconductor materials and a using method thereof, wherein the environment-friendly production device comprises a workbench, a polishing mechanism, a sealing and positioning mechanism and a dust collection mechanism; an upper plate is arranged on the upper side of the workbench, a plurality of connecting columns are connected between the workbench and the upper plate, and a polishing plate is arranged on the workbench; the polishing mechanism is arranged on the lower bottom surface of the upper plate and is used for polishing the wafer; the sealing and positioning mechanism is arranged on the outer side of the polishing mechanism and used for positioning and sealing the wafer, so that the flying dust generated during the polishing of the wafer is prevented from overflowing, and the sealing and positioning mechanism comprises a sealing cover. According to the invention, through the arrangement of the corresponding mechanism, the wafer can be positioned, the manual positioning of workers is avoided, and the safety of the workers can be ensured.

Description

Environment-friendly production equipment for semiconductor material and use method thereof
Technical Field
The invention belongs to the technical field of semiconductor materials, and particularly relates to environment-friendly production equipment for a semiconductor material and a using method thereof.
Background
Semiconductor materials are a class of electronic materials having semiconducting properties (electrical conductivity between conductor and insulator, and resistivity in the range of about 1m Ω -cm-1G Ω -cm) that can be used to fabricate semiconductor devices and integrated circuits. Semiconductor materials are widely used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion, and the like.
The main processing procedures of semiconductor products are divided into wafer manufacturing and packaging test, wherein the wafer manufacturing comprises 7 procedures of diffusion, photoetching, etching, ion implantation, film growth, polishing and metallization. When the wafer is polished, the wafer is small in size, the conventional polishing machine is not easy to position, so that workers need to manually position the wafer, time and labor are wasted, safety is poor, flying dust is easily generated in the polishing process of the wafer, and the flying dust is easily scattered in the air and then easily sucked into the body by the workers, so that the body of the workers is damaged.
Therefore, in order to solve the above technical problems, it is necessary to provide an environment-friendly production apparatus for semiconductor materials and a method for using the same.
Disclosure of Invention
The invention aims to provide environment-friendly production equipment for semiconductor materials and a using method thereof, so as to solve the problem that a polishing machine cannot polish wafers easily.
In order to achieve the above object, an embodiment of the present invention provides the following technical solutions:
an environment-friendly production device for semiconductor materials comprises a workbench, a polishing mechanism, a sealing and positioning mechanism and a dust collection mechanism;
an upper plate is arranged on the upper side of the workbench, a plurality of connecting columns are connected between the workbench and the upper plate, and a polishing plate is arranged on the workbench;
the polishing mechanism is arranged on the lower bottom surface of the upper plate and is used for polishing a wafer;
the sealing and positioning mechanism is arranged at the outer side of the polishing mechanism and used for positioning and sealing the wafer to avoid the overflow of flying dust generated during the polishing of the wafer, the sealing and positioning mechanism comprises a sealing cover, the lower end of the sealing cover is connected with an elastic part, the elastic part is connected with a contact element, the elastic part is filled with filling liquid, the inner side of the elastic part is provided with a plurality of positioning arc plates, and a telescopic part is connected between the elastic part and the positioning arc plates;
the dust collection mechanism is arranged on the sealing cover and used for absorbing flying dust generated during wafer polishing in the sealing cover.
Further, the polishing mechanism comprises an air cylinder for controlling the polishing motor to lift so as to further realize the polishing of the wafer, and the fixed end of the air cylinder is connected with the upper plate;
the free end of the cylinder is connected with a mounting plate for mounting a polishing motor.
Further, a polishing motor is mounted on the mounting plate and used for driving the polishing disc to rotate;
and the output shaft of the polishing motor is connected with a polishing disk, and the polishing disk is used for polishing the wafer on the polishing plate.
Furthermore, the sealing cover is rotatably connected with the output shaft of the polishing motor through a bearing, so that the influence on the rotation of the output shaft of the polishing motor is avoided;
the integral height of the sealing cover, the elastic piece and the contact piece is larger than the length of the output shaft of the polishing motor, when the polishing motor descends, the contact piece can be contacted with the polishing plate before the polishing plate is contacted with the polishing plate, and then the contact piece is used for sealing the wafer on the polishing plate and simultaneously extending the positioning arc plates for positioning the wafer.
Furthermore, the elastic piece and the contact piece are made of rubber materials, and the sealing effect inside the sealing cover is guaranteed.
Furthermore, the intelligent shielding mechanism is installed on the side wall of the sealing cover and used for intelligently shielding the inside of the sealing cover and simultaneously ensuring the overall strength of the sealing cover, the intelligent shielding mechanism comprises a pair of glasses, a pair of conducting films are arranged between the glasses, an adhesive film clamping film is connected between the glasses and the conducting films, liquid crystal molecules are arranged between the conducting films, when the conducting films are powered on, the glasses, the adhesive film clamping film and the conducting films are wholly transparent, and when the conducting films are powered off, the glasses, the adhesive film clamping film and the conducting films become opaque and used for shielding the inside of the sealing cover and simultaneously saving power.
Furthermore, the dust collection mechanism comprises an air suction pump and a filter box, wherein the air suction pump is used for generating suction force, and the filter box is used for filtering flying dust;
the air suction pump and the filter box are both arranged on the sealing cover, and the filter box is connected with the air suction end of the air suction pump.
Furthermore, a plurality of filtering pieces are arranged in the filtering box and used for filtering flying dust.
Furthermore, an annular pipe is arranged on the inner side of the sealing cover and is arranged on the outer side of the output shaft of the polishing motor, a through groove is formed in the annular pipe, and flying dust in the sealing cover is absorbed through the annular pipe so as to be centralized;
the annular pipe with be connected with the connecting pipe between the rose box, the both sides of rose box are located respectively to connecting pipe and aspirator pump induction end.
The use method of the environment-friendly production equipment for the semiconductor material comprises the following steps:
s1, placing the wafer on a polishing plate, controlling the cylinder to extend, and driving the mounting plate, the polishing motor and the polishing disc to move downwards by the cylinder;
s2, the sealing cover on the side wall of the output shaft of the polishing motor moves down synchronously with the polishing motor, and because the integral height of the sealing cover, the elastic part and the contact part is greater than the length of the output shaft of the polishing motor, when the polishing motor drops to a certain height, the contact part contacts with the polishing plate first, and at the moment, the elastic part is extruded and contracted;
s3, when the elastic piece is squeezed and contracted, filling liquid in the elastic piece enters the telescopic piece, so that the telescopic piece is extended, the positioning arc plates can be driven to move when the telescopic piece is extended, the wafer is positioned by utilizing synchronous movement of the plurality of positioning arc plates, and the wafer is ensured to be positioned at the center of the polishing plate;
s4, controlling a polishing motor to operate, wherein the polishing motor drives a polishing disc to rotate, the rotating polishing disc is used for polishing the surface of the wafer, and flying dust generated during wafer polishing is sealed in a sealing cover;
s5, turning on an air suction pump, wherein the air suction pump sucks the flying dust sealed in the sealing cover through an air suction end, a filter box, a connecting pipe and a ring pipe so as to perform centralized treatment on the flying dust;
s6, when the flying dust enters the filter box, filtering the flying dust by a plurality of filter elements;
s7, when the condition in the sealing cover needs to be observed, the conducting film is only needed to be electrified, the conducting film enables the glass and the adhesive film to become transparent under the action of electric power, observation is facilitated, and when the conducting film is powered off, the glass, the adhesive film and the conducting film become opaque, so that the shielding effect is achieved, and meanwhile, the electric power is saved.
Compared with the prior art, the invention has the following advantages:
according to the invention, through the arrangement of the corresponding mechanism, the wafer can be positioned, the manual positioning of workers is avoided, and the safety of the workers can be ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a perspective view of an environment-friendly manufacturing apparatus for semiconductor materials according to an embodiment of the present invention;
FIG. 2 is a schematic view of the structure at A in FIG. 1;
FIG. 3 is a front view of an environment-friendly manufacturing apparatus for semiconductor materials according to an embodiment of the present invention;
FIG. 4 is a partial cross-sectional view of an apparatus for environmentally friendly manufacturing of semiconductor materials in accordance with one embodiment of the present invention;
FIG. 5 is a schematic view of the structure at B in FIG. 4;
FIG. 6 is a schematic view of the structure of FIG. 4 at C;
FIG. 7 is a sectional top view of an apparatus for manufacturing semiconductor materials in accordance with one embodiment of the present invention;
fig. 8 is a schematic structural view at D in fig. 7.
In the figure: 1. the polishing machine comprises a workbench, 101, an upper plate, 102, a connecting column, 103, a polishing plate, 2, a polishing mechanism, 201, an air cylinder, 202, a mounting plate, 203, a polishing motor, 204, a polishing disc, 3, a sealing and positioning mechanism, 301, a sealing cover, 302, a bearing, 303, an elastic piece, 304, a contact piece, 305, filling liquid, 306, a positioning arc plate, 307, a telescopic piece, 308, glass, 309, a laminated film, 310, a conductive film, 4, a dust suction mechanism, 401, a suction pump, 402, a filter box, 403, a ring pipe, 404, a through groove, 405, a connecting pipe, 406 and a filter piece.
Detailed Description
The present invention will be described in detail below with reference to embodiments shown in the drawings. The embodiments are not intended to limit the present invention, and structural, methodological or functional changes made by those skilled in the art according to the embodiments are included in the scope of the present invention.
The invention discloses environment-friendly production equipment for semiconductor materials, which is shown in figures 1-8 and comprises a workbench 1, a polishing mechanism 2, a sealing and positioning mechanism 3 and a dust suction mechanism 4.
Wherein, the upper side of the working table 1 is provided with an upper plate 101, and the upper plate 101 is used for installing the polishing mechanism 2.
In addition, a plurality of connecting columns 102 are connected between the worktable 1 and the upper plate 101, a polishing plate 103 is mounted on the worktable 1, and the polishing plate 103 is used for placing a wafer for polishing the wafer.
Referring to fig. 1 to 8, a polishing mechanism 2 is mounted on a lower bottom surface of an upper plate 101 for polishing a wafer.
The polishing mechanism 2 includes a cylinder 201 for controlling the polishing motor 203 to move up and down, so as to polish the wafer, and a fixed end of the cylinder 201 is connected to the upper plate 101.
In addition, a mounting plate 202 is connected to the free end of the cylinder 201 for mounting a polishing motor 203.
Specifically, a polishing motor 203 is mounted on the mounting plate 202 and is used for driving a polishing disk 204 to rotate, the polishing disk 204 is connected to an output shaft of the polishing motor 203, and the polishing disk 204 is used for polishing a wafer on the polishing plate 103.
Referring to fig. 1-8, the sealing and positioning mechanism 3 is disposed outside the polishing mechanism 2 for positioning and sealing the wafer to prevent the dust generated during the polishing process from overflowing.
The sealing and positioning mechanism 3 includes a sealing cover 301, and when the polishing disk 204 polishes the wafer, the sealing cover 301 can cover the outer side of the wafer, so as to prevent the flying dust from overflowing during the wafer polishing.
Preferably, the sealing cover 301 is rotatably connected with the output shaft of the polishing motor 203 through a bearing 302, so as to avoid influencing the rotation of the output shaft of the polishing motor 203.
In addition, an elastic member 303 is connected to the lower end of the sealing cover 301, a contact member 304 is connected to the elastic member 303, and when the contact member 304 contacts the polishing plate 103, the elastic member 303 is compressed and contracted, so that a filling liquid 305 in the elastic member 303 flows to extend the positioning arc plate 306.
Specifically, the elastic member 303 is filled with filling liquid 305, the inner side of the elastic member 303 is provided with a plurality of positioning arc plates 306, an expansion member 307 is connected between the elastic member 303 and the positioning arc plates 306, when the filling liquid 305 flows, the filling liquid 305 can enter the positioning arc plates 306, and then the positioning arc plates 306 extend, and the expansion member 307 can contact with the outer wall of the wafer and is used for positioning the wafer.
Preferably, the filling liquid 305 is water, which is convenient for drawing materials.
In addition, the overall height of the sealing cap 301, the elastic member 303 and the contact member 304 is greater than the length of the output shaft of the polishing motor 203, so that the contact member 304 can contact with the polishing plate 103 before the polishing plate 103 descends, thereby sealing the wafer on the polishing plate 103, and simultaneously extending the positioning arc plates 306 for positioning the wafer.
Preferably, the elastic member 303 and the contact member 304 are made of rubber, so as to ensure the sealing effect inside the sealing cover 301.
Referring to fig. 1 to 8, an intelligent shielding mechanism is installed on a side wall of the sealing cover 301 for intelligently shielding the inside of the sealing cover 301, and meanwhile, the overall strength of the sealing cover 301 can be ensured.
The intelligent shielding mechanism comprises a pair of glasses 308, a pair of conducting films 310 are arranged between the pair of glasses 308, an adhesive film 309 is connected between the glasses 308 and the conducting films 310, liquid crystal molecules are arranged between the conducting films 310, when the conducting films 310 are powered on, the glasses 308, the adhesive film 309 and the conducting films 310 are transparent integrally, and when the conducting films 310 are powered off, the glasses 308, the adhesive film 309 and the conducting films 310 become opaque and are used for shielding the inside of the sealing cover 301 and saving power.
Referring to fig. 1 to 8, the dust suction mechanism 4 is mounted on the sealing cover 301, and is used for sucking dust generated during wafer polishing in the sealing cover 301.
The dust suction mechanism 4 includes a suction pump 401 and a filter box 402, wherein the suction pump 401 is used for generating suction force, and the filter box 402 is used for filtering flying dust.
Further, a getter pump 401 and a filter tank 402 are mounted on the hermetic container 301, and the filter tank 402 is connected to a suction end of the getter pump 401.
Specifically, the inner side of the sealing cover 301 is provided with a ring-shaped pipe 403, the ring-shaped pipe 403 is arranged on the outer side of the output shaft of the polishing motor 203, a through groove 404 is cut on the ring-shaped pipe 403, and the flying dust in the sealing cover 301 is sucked through the ring-shaped pipe 403 so as to be intensively treated.
A connection pipe 405 is connected between the ring pipe 403 and the filter tank 402, and the connection pipe 405 and the suction end of the suction pump 401 are provided on both sides of the filter tank 402.
Preferably, a plurality of filter elements 406 are provided within the filter box 402 for filtering fly ash.
An environment-friendly production device for semiconductor materials and a using method thereof comprise the following steps:
s1, placing the wafer on the polishing plate 103, controlling the cylinder 201 to extend, and driving the mounting plate 202, the polishing motor 203 and the polishing disc 204 to move downwards by the cylinder 201;
s2, the sealing cover 301 on the side wall of the output shaft of the polishing motor 203 also moves downwards synchronously with the polishing motor 203, and because the integral height of the sealing cover 301, the elastic element 303 and the contact element 304 is greater than the length of the output shaft of the polishing motor 203, when the polishing motor 203 descends to a certain height, the contact element 304 is firstly contacted with the polishing plate 103, and at the moment, the elastic element 303 is pressed and contracted;
s3, when the elastic part 303 is squeezed and contracted, the filling liquid 305 in the elastic part 303 enters the telescopic part 307, so that the telescopic part 307 is extended, the positioning arc plates 306 can be driven to move when the telescopic part 307 is extended, the wafer is positioned by utilizing the synchronous movement of the positioning arc plates 306, and the wafer is ensured to be positioned at the center of the polishing plate 103;
s4, controlling the polishing motor 203 to operate, driving the polishing disk 204 to rotate by the polishing motor 203, wherein the rotating polishing disk 204 is used for polishing the surface of the wafer, and the flying dust generated during the wafer polishing is sealed in the sealing cover 301;
s5, turning on the air suction pump 401, and sucking the flying dust sealed in the sealing cover 301 by the air suction pump 401 through an air suction end, the filter box 402, the connecting pipe 405 and the annular pipe 403 so as to perform centralized treatment on the flying dust;
s6, filtering the fly ash by the plurality of filter elements 406 when the fly ash enters the filter box 402;
s7, when the inside of the sealing cap 301 needs to be observed, the conductive film 310 is only needed to be electrified, the conductive film 310 makes the glass 308 and the adhesive film 309 transparent under the action of power, so as to facilitate observation, and when the conductive film 310 is powered off, the glass 308, the adhesive film 309 and the conductive film 310 become opaque, so as to achieve the shielding effect and save power.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. An environment-friendly production facility for semiconductor materials, comprising:
the polishing device comprises a workbench (1), wherein an upper plate (101) is arranged on the upper side of the workbench (1), a plurality of connecting columns (102) are connected between the workbench (1) and the upper plate (101), and a polishing plate (103) is arranged on the workbench (1);
the polishing mechanism (2) is arranged on the lower bottom surface of the upper plate (101) and is used for polishing the wafer;
the sealing and positioning mechanism (3) is arranged on the outer side of the polishing mechanism (2) and is used for positioning and sealing the wafer to avoid the overflow of flying dust generated during the polishing of the wafer;
the sealing and positioning mechanism (3) comprises a sealing cover (301), an elastic part (303) is connected to the lower end of the sealing cover (301), a contact part (304) is connected to the elastic part (303), filling liquid (305) is filled in the elastic part (303), a plurality of positioning arc plates (306) are arranged on the inner side of the elastic part (303), and a telescopic part (307) is connected between the elastic part (303) and the positioning arc plates (306);
and the dust collection mechanism (4) is arranged on the sealing cover (301) and is used for absorbing flying dust generated during the wafer polishing in the sealing cover (301).
2. The environment-friendly production equipment for semiconductor materials as claimed in claim 1, wherein the polishing mechanism (2) comprises a cylinder (201), a fixed end of the cylinder (201) is connected with the upper plate (101), and a free end of the cylinder (201) is connected with a mounting plate (202).
3. The environment-friendly production equipment for semiconductor materials as claimed in claim 2, wherein a polishing motor (203) is mounted on the mounting plate (202), a polishing disk (204) is connected to an output shaft of the polishing motor (203), and the polishing disk (204) is used for polishing the wafer on the polishing plate (103).
4. The environment-friendly production equipment for the semiconductor material as recited in claim 3, wherein the sealing cover (301) is rotatably connected with a bearing (302) with an output shaft of the polishing motor (203), and the overall height of the sealing cover (301), the elastic member (303) and the contact member (304) is greater than the length of the output shaft of the polishing motor (203).
5. The environment-friendly production equipment for semiconductor materials as claimed in claim 4, wherein the elastic member (303) and the contact member (304) are made of rubber.
6. The environment-friendly production equipment for the semiconductor material as claimed in claim 4, wherein an intelligent shielding mechanism is installed on the side wall of the sealing cover (301), the intelligent shielding mechanism comprises a pair of glasses (308), a pair of conductive films (310) is arranged between the pair of glasses (308), an adhesive sandwiched film (309) is connected between the glasses (308) and the conductive films (310), and liquid crystal molecules are arranged between the pair of conductive films (310).
7. The environment-friendly production equipment for semiconductor materials as recited in claim 1, wherein the dust suction mechanism (4) comprises a getter pump (401) and a filter box (402), the getter pump (401) and the filter box (402) are both mounted on the sealed cover (301), and the filter box (402) is connected with a suction end of the getter pump (401).
8. An environmentally friendly manufacturing apparatus for semiconductor materials as defined in claim 7, wherein a plurality of filter elements (406) are provided in said filter box (402).
9. The environment-friendly production equipment for semiconductor materials as recited in claim 7, wherein an annular pipe (403) is disposed on an inner side of the sealing cover (301), the annular pipe (403) is disposed on an outer side of an output shaft of the polishing motor (203), a through groove (404) is cut on the annular pipe (403), a connecting pipe (405) is connected between the annular pipe (403) and the filter box (402), and the connecting pipe (405) and a suction end of the suction pump (401) are respectively disposed on two sides of the filter box (402).
10. A method for using the environmentally friendly manufacturing apparatus for semiconductor materials as claimed in any one of claims 1 to 9, comprising the steps of:
s1, placing the wafer on a polishing plate (103), controlling the cylinder (201) to extend, and driving the mounting plate (202), the polishing motor (203) and the polishing disc (204) to move downwards by the cylinder (201);
s2, the sealing cover (301) on the side wall of the output shaft of the polishing motor (203) also moves downwards synchronously along with the polishing motor (203), and because the integral height of the sealing cover (301), the elastic element (303) and the contact element (304) is greater than the length of the output shaft of the polishing motor (203), when the polishing motor (203) descends to a certain height, the contact element (304) is firstly contacted with the polishing plate (103), and at the moment, the elastic element (303) is squeezed and contracted;
s3, when the elastic part (303) is squeezed and contracted, filling liquid (305) in the elastic part (303) enters the telescopic part (307) to enable the telescopic part (307) to extend, the telescopic part (307) can drive the positioning arc plates (306) to move when extending, the wafer is positioned by utilizing the synchronous movement of the positioning arc plates (306), and the wafer is ensured to be positioned at the center of the polishing plate (103);
s4, controlling the polishing motor (203) to operate, driving the polishing disc (204) to rotate by the polishing motor (203), wherein the rotating polishing disc (204) is used for polishing the surface of the wafer, and fly ash generated during wafer polishing is sealed in the sealing cover (301);
s5, turning on a suction pump (401), wherein the suction pump (401) sucks the flying dust sealed in the sealing cover (301) through a suction end, a filter box (402), a connecting pipe (405) and an annular pipe (403) so as to intensively process the flying dust;
s6, when the flying dust enters the filter box (402), filtering the flying dust by a plurality of filter elements (406);
s7, when the situation in the sealing cover (301) needs to be observed, only the conductive film (310) needs to be electrified, the conductive film (310) enables the glass (308) and the adhesive film (309) to become transparent under the action of electric power, observation is convenient, and when the conductive film (310) is powered off, the glass (308), the adhesive film (309) and the conductive film (310) become opaque, so that the shielding effect is achieved, and meanwhile, the electric power is saved.
CN202210665066.7A 2022-06-13 2022-06-13 Environment-friendly production equipment for semiconductor material and use method thereof Pending CN114871932A (en)

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Application Number Priority Date Filing Date Title
CN202210665066.7A CN114871932A (en) 2022-06-13 2022-06-13 Environment-friendly production equipment for semiconductor material and use method thereof

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Application Number Priority Date Filing Date Title
CN202210665066.7A CN114871932A (en) 2022-06-13 2022-06-13 Environment-friendly production equipment for semiconductor material and use method thereof

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CN114871932A true CN114871932A (en) 2022-08-09

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CN204210279U (en) * 2014-10-31 2015-03-18 河南亚华安全玻璃有限公司 A kind of vehicle glass light modulating device based on ito thin film
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CN211073283U (en) * 2019-09-24 2020-07-24 惠安县易尚手新材料有限公司 Clamp device for wood processing
CN112414358A (en) * 2020-12-08 2021-02-26 安徽信息工程学院 High-precision leather measuring machine
CN112706101A (en) * 2021-01-12 2021-04-27 吴懋萱 Constant-pressure clamping device for processing strip-shaped optical glass
CN113601298A (en) * 2021-10-08 2021-11-05 邳州市欢乐木业有限公司 Intelligent grinding tool for plywood processing and grinding method thereof
CN216467084U (en) * 2021-12-19 2022-05-10 佛山市兰铭装饰材料有限公司 High-speed engraver is used in production of aluminium veneer
CN114536061A (en) * 2022-01-26 2022-05-27 嘉兴海格曼机械有限公司 Positioning tool for machining compressor crankcase and machining positioning method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001205557A (en) * 2000-01-26 2001-07-31 Fujikoshi Mach Corp Polishing device for wafer
JP2002059361A (en) * 2000-08-21 2002-02-26 Mitsubishi Electric Corp Semiconductor manufacturing device and its manufacturing method
CN204210279U (en) * 2014-10-31 2015-03-18 河南亚华安全玻璃有限公司 A kind of vehicle glass light modulating device based on ito thin film
CN105965372A (en) * 2016-06-24 2016-09-28 无锡欧诺锁业有限公司 Automatic correcting polisher
CN211073283U (en) * 2019-09-24 2020-07-24 惠安县易尚手新材料有限公司 Clamp device for wood processing
CN112414358A (en) * 2020-12-08 2021-02-26 安徽信息工程学院 High-precision leather measuring machine
CN112706101A (en) * 2021-01-12 2021-04-27 吴懋萱 Constant-pressure clamping device for processing strip-shaped optical glass
CN113601298A (en) * 2021-10-08 2021-11-05 邳州市欢乐木业有限公司 Intelligent grinding tool for plywood processing and grinding method thereof
CN216467084U (en) * 2021-12-19 2022-05-10 佛山市兰铭装饰材料有限公司 High-speed engraver is used in production of aluminium veneer
CN114536061A (en) * 2022-01-26 2022-05-27 嘉兴海格曼机械有限公司 Positioning tool for machining compressor crankcase and machining positioning method

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