CN114864434A - Substrate processing apparatus, substrate processing method, and computer-readable recording medium - Google Patents

Substrate processing apparatus, substrate processing method, and computer-readable recording medium Download PDF

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Publication number
CN114864434A
CN114864434A CN202210093060.7A CN202210093060A CN114864434A CN 114864434 A CN114864434 A CN 114864434A CN 202210093060 A CN202210093060 A CN 202210093060A CN 114864434 A CN114864434 A CN 114864434A
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Prior art keywords
nozzle
detection
liquid
unit
substrate processing
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CN202210093060.7A
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Chinese (zh)
Inventor
饭野正
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/004—Arrangements for controlling delivery; Arrangements for controlling the spray area comprising sensors for monitoring the delivery, e.g. by displaying the sensed value or generating an alarm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1007—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to condition of liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
    • B05C5/0275—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The invention provides a substrate processing apparatus, a substrate processing method and a computer-readable recording medium, which can detect the abnormality of a nozzle. The substrate processing apparatus includes: a supply section including a nozzle; a liquid receiving portion including an opening for receiving the processing liquid pseudo-ejected from the nozzle; a driving unit configured to drive a nozzle arm supporting a nozzle; a detection unit disposed in the liquid receiving unit; and a control section. The detection unit is configured to detect whether or not the processing liquid discharged from the nozzle in a pseudo manner passes through a detection space in the vicinity of the inner peripheral surface of the liquid receiving unit. The control unit is configured to execute: a first process of controlling the driving unit so that the nozzle arm is positioned at an origin position preset inside the opening; and a second process of determining that the nozzle is in an abnormal state when the detection unit detects that the processing liquid discharged from the nozzle in a pseudo manner has passed through the detection space in a state where the nozzle arm is located at the origin position.

Description

Substrate processing apparatus, substrate processing method, and computer-readable recording medium
Technical Field
The present disclosure relates to a substrate processing apparatus, a substrate processing method, and a computer-readable recording medium.
Background
Patent document 1 discloses a substrate processing apparatus. The substrate processing apparatus includes: a suction type spin chuck configured to hold a substrate in rotation; a nozzle configured to supply a processing liquid to a surface of the substrate held by the spin chuck; and a moving mechanism configured to move the nozzle above the substrate.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open No. 11-005056
Disclosure of Invention
Problems to be solved by the invention
There is a case where an operator accidentally touches the nozzle during maintenance of the apparatus or the nozzle accidentally touches another element of the apparatus along with movement of the nozzle, thereby causing an abnormality in the nozzle (for example, deformation of the nozzle, change in the posture of the nozzle, or the like). In this case, the processing liquid discharged from the nozzle may be displaced from the landing position of the substrate, and the substrate processing different from the setting may be performed.
Accordingly, a substrate processing apparatus, a substrate processing method, and a computer-readable recording medium capable of detecting an abnormality of a nozzle are described in the present disclosure.
Means for solving the problems
An example of the substrate processing apparatus includes: a holding portion configured to hold a substrate; a supply unit including a nozzle configured to supply the treatment liquid to the surface of the substrate held by the holding unit; a liquid receiving portion including an opening that opens upward so as to receive the processing liquid pseudo-ejected from the nozzle; a driving unit configured to move the nozzle between a position above the substrate held by the holding unit and the liquid receiving unit by driving a nozzle arm supporting the nozzle; a detection unit disposed in the liquid receiving unit; a control unit. The detection unit is configured to detect whether or not the processing liquid discharged from the nozzle in a pseudo manner passes through a detection space in the vicinity of the inner peripheral surface of the liquid receiving unit. The control unit is configured to execute: a first process of controlling the driving unit so that the nozzle arm is positioned at an origin position preset inside the opening; and a second process of determining that the nozzle is in an abnormal state when the detection unit detects that the processing liquid spurted from the nozzle in a pseudo-state passes through the detection space in a state where the nozzle arm is located at the origin position.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the substrate processing apparatus, the substrate processing method, and the computer-readable recording medium according to the present disclosure, it is possible to detect an abnormality of the nozzle.
Drawings
Fig. 1 is a diagram schematically showing an example of a substrate processing apparatus.
Fig. 2 is a plan view schematically showing an example of the processing unit.
Fig. 3 is a perspective view schematically showing an example of the liquid receiving portion.
FIG. 4 (a) is a sectional view taken along line IVA-IVA of FIG. 3, and FIG. 4 (b) is a sectional view taken along line IVB-IVB of FIG. 3.
Fig. 5 is a block diagram showing an example of a main part of the substrate processing apparatus.
Fig. 6 is a schematic diagram showing an example of the hardware configuration of the controller.
Fig. 7 is a flowchart showing an example of the procedure of the initial measurement processing.
Fig. 8 is a diagram for explaining an example of the procedure of the initial measurement processing.
Fig. 9 is a flowchart showing an example of a procedure of the detection processing of the abnormal state.
Fig. 10 is a diagram for explaining an example of a procedure of the abnormal state detection processing.
Fig. 11 is a diagram for explaining a method of calculating an angle of the treatment liquid obliquely discharged from the nozzle.
Fig. 12 is a diagram showing another example of the detection unit.
Detailed Description
In the following description, the same reference numerals are used for the same elements or elements having the same functions, and redundant description is omitted. In the present specification, the directions of reference numerals in the drawings are referred to when referring to the upper, lower, right, and left sides of the drawings.
[ substrate processing apparatus ]
First, the structure of the substrate processing apparatus 1 will be described with reference to fig. 1 to 5. The substrate processing apparatus 1 is configured to process a substrate W by supplying a processing liquid L to the substrate W, for example. The processing liquid L may be, for example, a cleaning liquid for cleaning the surface of the substrate W, a rinse liquid for rinsing off a liquid, a dissolved component, a residue, or the like remaining on the surface of the substrate W, a coating liquid for forming a film on the surface of the substrate W, or a developer for developing a resist film. That is, the substrate processing apparatus 1 may be a substrate cleaning apparatus or a coating and developing apparatus.
The cleaning liquid may include, for example, an alkaline or acidic chemical liquid, or an organic solvent. The alkaline chemical solution may include, for example, an SC-1 solution (a mixed solution of ammonia, hydrogen peroxide, and pure water). The acidic chemical solution may include, for example, SC-2 solution (a mixture of hydrochloric acid, hydrogen peroxide and pure water), SPM (a mixture of sulfuric acid and hydrogen peroxide), HF/HNO 3 Liquid (mixed liquid of hydrofluoric acid and nitric acid), and the like. The organic solvent may also include IPA (isopropyl alcohol), for example. The rinse solution may also include, for example, deionized water (DIW), ozone water, and carbonated water (CO) 2 Water), ammonia, and the like. In the above examples, for example, SC-1 solution, SC-2 solution, SPM, carbonated water, and the like exhibit conductivity. On the other hand, IPA, pure water, and the like do not exhibit conductivity.
The substrate W may have a circular plate shape or a plate shape other than a circular shape such as a polygonal shape. The substrate W may have a notch portion formed by cutting a part thereof. The notch may be a notch (groove) or a linear portion (so-called orientation flat) extending linearly. The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or various other substrates. The diameter of the substrate W may be, for example, about 200mm to 450 mm.
As illustrated in fig. 1, the substrate processing apparatus 1 includes a processing unit 2 and a controller Ctr (control unit). The process unit 2 includes a holding portion 10, a supply portion 20, a driving portion 30, a liquid receiving portion 40, and a plurality of detection portions 50.
The holding portion 10 includes a rotation driving portion 11, a shaft 12, and an adsorption portion 13. The rotation driving unit 11 is configured to: the shaft 12 is rotated by operating based on an operation signal from the controller Ctr. The rotation driving unit 11 may be a power source such as an electric motor. The suction portion 13 is provided at the distal end of the shaft 12. The suction unit 13 is configured to: the controller Ctr operates based on an operation signal to suction-hold a part or all of the back surface of the substrate W. That is, the holding portion 10 may be configured to: the substrate W is held in a substantially horizontal posture and is rotated around a central axis (rotation axis) perpendicular to the surface of the substrate W.
The supply unit 20 is configured to supply the processing liquid L to the surface of the substrate W held by the holding unit 10. The supply section 20 includes a liquid source 21, a pump 22, a valve 23, a nozzle 24, and a pipe 25. The liquid source 21 is configured to store the treatment liquid L. The pump 22 is constituted: the controller Ctr operates based on an operation signal to send the treatment liquid L sucked from the liquid source 21 to the nozzle 24 via the pipe 25 and the valve 23.
The valve 23 is constituted: the controller Ctr operates based on an operation signal to switch between an open state in which the flow of fluid through the pipe 25 is allowed and a closed state in which the flow of fluid through the pipe 25 is prevented. The nozzle 24 has a discharge port opening downward. The nozzle 24 is constituted by: the processing liquid L sent by the pump 22 is discharged to the front surface of the substrate W, or the processing liquid L sent by the pump 22 is pseudo-discharged to the liquid receiving unit 40. A liquid source 21, a pump 22, a valve 23, and a nozzle 24 are connected to the pipe 25 in this order from the upstream side.
The driving unit 30 is configured to move the nozzle 24 between the liquid receiving unit 40 and the upper side of the substrate W held by the holding unit 10. As illustrated in fig. 1 and 2, the driving unit 30 includes a rotation driving unit 31, a swivel shaft 32, a nozzle arm 33, an encoder 34, and a position sensor 35.
The rotation driving unit 31 is configured to: the rotation shaft 32 is rotated by operating based on an operation signal from the controller Ctr. The rotation driving unit 31 may be a power source such as an electric motor. The swivel shaft 32 is a columnar member (for example, a columnar member) extending in the vertical direction, and is configured to rotate around a rotation shaft extending in the vertical direction.
The nozzle arm 33 is configured to support the nozzle 24. The base end of the nozzle arm 33 is connected to the outer peripheral surface of the swivel shaft 32. The nozzle 24 is supported by the front end of the nozzle arm 33. The nozzle arm 33 extends horizontally in the radial direction of the swivel shaft 32. As illustrated in fig. 2, the rotation driving unit 31 rotates the rotation shaft 32, thereby causing the nozzle 24 positioned at the tip end of the nozzle arm 33 to circularly rotate in an arc shape between above the substantially central portion of the substrate W held by the holding unit 10 and above the opening 41 (described later) of the liquid receiving unit 40. As illustrated in fig. 2, the revolving direction of the nozzle 24 when the nozzle 24 revolves above the liquid receiving portion 40 may be referred to as "X direction", and the longitudinal direction of the nozzle arm 33 may be referred to as "Y direction".
The encoder 34 is configured to detect a rotational position (rotational angle) of the rotary drive unit 31. The encoder 34 is configured to output the detected rotational position to the controller Ctr. The position sensor 35 is configured to detect an origin position (reference position) of the swivel shaft 32. The position sensor 35 may include, for example, a detection piece 35a and a photosensor 35 b. The detection piece 35a may be configured to: connected to the outer peripheral surface of the turning shaft 32 and rotated together with the turning shaft 32. The photosensor 35b may be a light emitter and receiver including a light receiving unit and a light emitter that irradiates light to the light receiving unit. When the detection piece 35a is rotated and the detection piece 35a is positioned between the light receiving section and the light projecting section, the light receiving section does not receive light from the light projecting section, and the presence of the detection piece 35a is detected. The rotational position of the rotary drive unit 31 when the photosensor 35b detects the presence of the detection piece 35a may be set to the origin position of the swivel shaft 32. When the rotation shaft 32 is at the origin position, the nozzle 24 may be positioned above the opening 41 of the liquid receiving portion 40.
The liquid receiving portion 40 functions as a liquid collecting container that receives the processing liquid L that is pseudo-discharged from the nozzle 24. As illustrated in fig. 3 and 4, the liquid receiving portion 40 is a bottomed cylindrical body having an open upper side, and the liquid receiving portion 40 includes an opening 41 for receiving the processing liquid L that is pseudo-discharged from the nozzle 24. A drain pipe, not shown, is provided on the bottom wall of the liquid receiving portion 40, and the processing liquid L discharged into the liquid receiving portion 40 is discharged from the drain pipe. The liquid receiving portion 40 may be disposed outside (at a position not overlapping with the cup in the vertical direction) a cup (not shown) surrounding the periphery of the substrate W held by the holding portion 10.
The plurality of detection units 50 are disposed in the liquid receiving unit 40. As illustrated in fig. 3 and 4, detection unit 50 includes a measurement device 52 and a pair of terminals 51. The pair of terminals 51 is made of a conductive material. The pair of terminals 51 may be made of, for example, a metal material having corrosion resistance against the processing liquid L, or may be made of a resin material containing a conductive material. In these cases, generation of particles accompanying corrosion of the terminal 51 can be suppressed. The resin material containing the conductive material may be, for example, a fluororesin (PTFE, PFA, or the like) containing a carbon material, a PEEK resin containing a carbon material, or the like.
The pair of terminals 51 are provided in the liquid receiving portion 40 in a state where their distal end portions protrude from the inner peripheral surface of the liquid receiving portion 40 and are spaced apart from each other. A screw thread may be provided on the outer peripheral surface of the base end portion of the terminal 51, and the terminal 51 may be attached to the liquid receiving portion 40 by screwing the screw thread into the peripheral wall of the liquid receiving portion 40. In this case, the position of the tip of the terminal 51 can be adjusted. Further, a seal member for preventing liquid leakage may be provided between the screw thread and the liquid receiving portion 40.
Proximal end portions of the pair of terminals 51 are electrically connected to the measuring instrument 52 via a lead wire or the like. Measurer 52 may be, for example, a resistance meter (tester). As illustrated in fig. 4, when the processing liquid L is a conductive liquid, a liquid column of the processing liquid L discharged from the nozzle 24 is brought into contact with the pair of terminals 51 to form a closed circuit, and a current is detected by the measuring device 52. Therefore, the detection unit 50 is configured to detect whether or not the processing liquid L is in contact with the distal end portions of the pair of terminals 51. That is, whether or not the processing liquid L has passed through the detection space near the inner peripheral surface of the liquid receiving portion 40 can be detected by the pair of terminals 51 whose tip portions are located near the inner peripheral surface of the liquid receiving portion 40.
As illustrated in fig. 3 and 4 (a), two detection units 50 are disposed above the liquid receiving unit 40. The two detection portions 50 (hereinafter, sometimes referred to as "detection portion 50A") face each other with respect to the center of the liquid receiving portion 40, and are arranged in the X direction (the revolving direction of the nozzle 24). The terminals 51 of the two detection portions 50A may be located at substantially the same height position on the inner circumferential surface of the liquid receiving portion 40. The two detection portions 50A can detect the deviation of the pseudo discharge position in the swirling direction of the nozzle 24.
As illustrated in fig. 3 and 4 (b), four detection units 50 are disposed below the liquid receiving unit 40. Two of the detection portions 50 (hereinafter, sometimes referred to as "detection portion 50B") are opposed to each other with respect to the center of the liquid receiving portion 40, and are arranged in the X direction (the swirling direction of the nozzle 24). The two detection portions 50B can detect the deviation of the pseudo discharge position in the swirling direction of the nozzle 24. On the other hand, the remaining two detection portions 50 (hereinafter, sometimes referred to as "detection portions 50C") are opposed to each other with respect to the center of the liquid receiving portion 40, and are arranged in the Y direction (longitudinal direction of the nozzle arm 33). The two detection portions 50C can detect the displacement of the dummy ejection position in the longitudinal direction of the nozzle arm 33. The terminals 51 of the four detection portions 50B and 50C may be located at substantially the same height position on the inner circumferential surface of the liquid receiving portion 40.
[ details of the controller ]
As shown in fig. 5, the controller Ctr has a reading section M1, a storage section M2, a processing section M3, and an instruction section M4 as functional modules. These functional blocks are simply for convenience sake to divide the function of the controller Ctr into a plurality of blocks, and do not necessarily mean to divide the hardware constituting the controller Ctr into such blocks. The functional blocks are not limited to being implemented by executing programs, and may be implemented by dedicated circuits (for example, logic circuits) or Integrated circuits (ASIC) obtained by integrating these circuits.
The reading unit M1 is configured to read a program from the computer-readable recording medium RM. The recording medium RM stores a program for operating each unit of the substrate processing apparatus 1 including the processing unit 2. The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, an optical magnetic recording disk. In addition, each part of the substrate processing apparatus 1 may include the holding unit 10, the supply unit 20, the drive unit 30, and the detection unit 50.
The storage unit M2 is configured to store various data. The storage unit M2 may store, for example, a program read from the recording medium RM in the reading unit M1, setting data input by an operator via an external input device (not shown), and the like. The storage unit M2 may store data on the rotational position from the encoder 34 of the drive unit 30, data on the origin position from the position sensor 35 of the drive unit 30, data detected by the processing liquid L from the detection unit 50, and the like. The storage unit M2 may store processing conditions for processing the substrate W.
The processing unit M3 is configured to process various data. The processing unit M3 may generate signals for operating the respective units of the substrate processing apparatus 1 based on various data stored in the storage unit M2, for example.
The instructing unit M4 is configured to transmit the operation signal generated by the processing unit M3 to each unit of the substrate processing apparatus 1.
The hardware of the controller Ctr may be constituted by one or more control computers, for example. As shown in fig. 6, the controller Ctr may include a circuit C1 as a hardware structure. The circuit C1 may be formed of a circuit element (circuit). The circuit C1 may also include, for example, a processor C2, a memory C3, a storage C4, a driver C5, and an input-output port C6.
The processor C2 may be configured to: the above-described functional blocks are realized by executing a program in cooperation with at least one of the memory C3 and the storage device C4 and performing input and output of signals via the input/output port C6. The memory C3 and the storage device C4 may also function as the storage unit M2. The driver C5 may be a circuit configured to drive each part of the substrate processing apparatus 1. The input/output port C6 may be configured to input and output signals between the driver C5 and each part of the substrate processing apparatus 1.
The substrate processing apparatus 1 may include one controller Ctr, or may include a controller group (control unit) including a plurality of controllers Ctr. When the substrate processing apparatus 1 includes the controller group, the above-described functional blocks may be realized by one controller Ctr, or may be realized by a combination of two or more controllers Ctr. When the controller Ctr is configured by a plurality of computers (circuit C1), the above-described functional blocks may be realized by one computer (circuit C1) or by a combination of two or more computers (circuit C1). The controller Ctr may also have a plurality of processors C2. In this case, the functional blocks may be implemented by one processor C2, or may be implemented by a combination of two or more processors C2.
[ initial measurement treatment ]
Next, the initial measurement process is explained with reference to fig. 7 and 8. At this time, the nozzle 24 is set to an initial state in which it is properly attached to the nozzle arm 33 by the operator. That is, it is assumed that no abnormality occurs in the nozzle 24.
First, the controller Ctr instructs the drive unit 30 to position the swivel axis 32 at the origin position (see step S11 in fig. 7). At this time, as illustrated in fig. 8 (a), the nozzle 24 is positioned above the opening 41 of the liquid receiving portion 40. Next, the controller Ctr instructs the supply unit 20 to spuriously discharge the processing liquid L from the nozzle 24 (see step S12 in fig. 7).
In this state, the controller Ctr instructs the drive unit 30 to rotate the nozzle arm 33 until the column of the processing liquid L being spuriously ejected from the nozzle 24 is detected by one of the detection units 50A (see step S13 of fig. 7 and arrow Ar1 of fig. 8 (b)). The controller Ctr calculates a distance a from the origin position to a detection position at which the liquid column of the processing liquid L is detected by one detection unit 50A, based on the data received from the encoder 34 (see step S13 in fig. 7). Similarly, the controller Ctr may calculate the distance b from the origin position to the detection position at which the liquid column of the processing liquid L is detected by the other detection unit 50A by rotating the nozzle arm 33 (see arrow Ar2 in fig. 8 (b)) for the other detection unit 50A. Instead of the detection position of the processing liquid L by the detection unit 50A, the distance from the origin position to the detection position of the processing liquid L by the detection unit 50B may be calculated.
[ method of detecting abnormality ]
Next, a method of detecting an abnormal state of the nozzle (substrate processing method) will be described with reference to fig. 9 and 10. At this time, as illustrated in fig. 10, it is assumed that an abnormality such as a change in the position and orientation of the nozzle 24 occurs in the nozzle 24, and the processing liquid L discharged from the nozzle 24 in a pseudo manner is inclined with respect to the vertical direction.
First, the controller Ctr instructs the drive unit 30 to position the swivel axis 32 at the origin position (see step S21 in fig. 9). As described above, since the nozzle 24 is in the abnormal state, even if the swivel axis 32 is located at the origin position, the pseudo discharge position of the processing liquid L from the nozzle 24 (see fig. 10 a) is different from the pseudo discharge position when the nozzle 24 is in the initial state (see fig. 8 a). Next, the controller Ctr instructs the supply unit 20 to pseudo-discharge the processing liquid L from the nozzle 24 (see step S22 in fig. 9).
In this state, the controller Ctr determines whether or not the detection unit 50C detects the processing liquid L (see step S23 in fig. 9). When the detection unit 50C detects the processing liquid L (see yes in step S23 of fig. 9), the pseudo discharge position is shifted in the longitudinal direction of the nozzle arm 33. That is, the controller Ctr determines that the nozzle 24 is in an abnormal state. In general, the nozzle arm 33 is not configured to be able to move forward and backward in the longitudinal direction thereof, and the displacement of the dummy ejection position in the Y direction cannot be corrected. Therefore, in this case, maintenance by an operator such as replacement of the nozzle 24 is performed (see step S24 in fig. 9), and the process of detecting an abnormal state is terminated.
On the other hand, when the detection unit 50C does not detect the processing liquid L (see no in step S23 in fig. 9), the controller Ctr instructs the drive unit 30 to rotate the nozzle arm 33 until the liquid column of the processing liquid L that is pseudo-discharged from the nozzle 24 is detected by one detection unit 50A (see step S25 in fig. 9 and arrow Ar3 in fig. 10 b). The controller Ctr calculates a distance a' from the origin position to a detection position at which the liquid column of the processing liquid L is detected by one detection unit 50A based on the data received from the encoder 34 (see step S26 in fig. 9). Similarly, the controller Ctr may calculate the distance b' from the origin position to the detection position at which the liquid column of the processing liquid L is detected by the other detection unit 50A by rotating the nozzle arm 33 (see arrow Ar4 in fig. 10 (b)) for the other detection unit 50A.
Next, the controller Ctr calculates a difference δ between the distance a calculated in step S13 and the distance a' calculated in step S26 (see step S27 in fig. 9). The closer the difference δ is to 0, the smaller the deviation from the pseudo discharge position in the initial state of the nozzle 24. Therefore, the controller Ctr determines whether the difference δ exceeds a predetermined allowable range (for example, whether the difference δ is out of the range of ± 3 mm) (refer to step S28 of fig. 9). If it is determined that the difference δ exceeds the predetermined allowable range (see yes in step S28 in fig. 9), the correction described later tends to be difficult. Therefore, in this case, maintenance by an operator such as replacement of the nozzle 24 is performed (see step S24 in fig. 9), and the process of detecting an abnormal state is terminated.
On the other hand, when determining that the difference δ is within the predetermined allowable range (see no in step S28 of fig. 9), the controller Ctr corrects the origin position based on the difference δ (see step S29 of fig. 9). Specifically, the controller Ctr regards the position shifted by the difference δ from the origin position as a new origin position, and performs the subsequent process (e.g., a process of supplying the processing liquid L to the substrate W). Through the above steps, the detection processing of the abnormal state is ended.
[ Effect ]
According to the above example, when the detection unit 50C detects the treatment liquid L that is pseudo-discharged from the nozzle 24 even though the nozzle arm 33 is located at the origin position, the controller Ctr can detect an abnormality of the nozzle 24.
According to the above example, detection unit 50 is constituted by measuring instrument 52 and a pair of terminals 51. Therefore, the abnormality of the nozzle 24 can be detected with high accuracy using the detection unit 50 having a simple configuration.
According to the above example, the liquid receiving portion 40 is provided with the pair of detection portions 50A, the pair of detection portions 50B, and the pair of detection portions 50C that are located at substantially the same height position on the inner peripheral surface of the liquid receiving portion 40. Therefore, the shift of the dummy ejection position in the plurality of horizontal directions (X direction and Y direction) can be detected. Therefore, the abnormality of the nozzle 24 can be detected with higher accuracy.
According to the above example, the state in which the degree of displacement of the dummy ejection position is large can be recognized as the abnormal state by comparing the difference δ with the predetermined allowable range. Therefore, the abnormality of the nozzle 24 can be detected with higher accuracy.
According to the above example, since the origin position is corrected using the difference δ when the dummy ejection position does not deviate excessively, the substrate processing apparatus 1 does not need to be stopped to perform maintenance, and the substrate processing can be continued. Therefore, the productivity of substrate processing can be improved.
[ modified examples ]
The disclosure in this specification is to be considered in all respects as illustrative and not restrictive. Various omissions, substitutions, and changes may be made to the above examples without departing from the scope of the claims and their spirit.
(1) The technique of the present disclosure can be applied not only to a case where the treatment liquid L pseudo-discharged from the nozzle 24 is along the vertical direction but also to a case where the treatment liquid L is inclined with respect to the vertical direction. For example, as illustrated in fig. 3, it is possible to detect whether or not the processing liquid L spurted from the nozzle 24 is inclined with respect to the vertical direction by using the detecting portions 50A and 50B arranged in a vertical direction. Specifically, when one of the detection units 50A and 50B detects the processing liquid L but the other does not, it can be determined that the processing liquid L that has been pseudo-discharged from the nozzle 24 is inclined with respect to the vertical direction. Alternatively, it is possible to determine whether or not the treatment liquid L discharged from the nozzle 24 in a pseudo manner is at a predetermined angle by making the protrusion amounts of the terminals 51 of the detection portions 50A and 50B different.
(2) As shown in fig. 11, the angle θ in the case where the processing liquid L that is pseudo-discharged from the nozzle 24 is inclined with respect to the vertical direction may be calculated by using a pair of detection portions 50A and 50B that are vertically displaced and face each other when viewed from above. Specifically, the parameters A, B, Y are defined as:
a: the distance of movement of the nozzle arm 33 from the origin position to the detection of the processing liquid L by the detection unit 50A during an abnormality
B: the distance of movement of the nozzle arm 33 from the origin position to the detection of the processing liquid L by the detection unit 50B during an abnormality
Y: separation distance between detection units 50A and 50B
In this case, the angle θ is defined by the following equation.
[ number 1 ]
Figure BDA0003489945560000111
The controller Ctr may correct the position of the nozzle 24 by using the calculated angle θ so as to take into account the inclination of the treatment liquid L which is pseudo-discharged from the nozzle 24.
(3) In the above example, the nozzle 24 is configured to be rotated about the rotation shaft 32 as a center axis, but the nozzle 24 may be configured to be movable in any direction along the horizontal direction.
(4) Measuring device 52 may be, for example, an electrostatic capacitance meter. In this case, when the processing liquid L comes into contact with the pair of terminals 51, the electric charge stored in the capacitor in advance decreases. Therefore, whether or not the processing liquid L has passed through the detection space in the vicinity of the inner peripheral surface of the liquid receiving portion 40 can be detected based on whether or not a change in potential caused by a decrease in electric charge is detected.
(5) The detection unit 50 illustrated in fig. 12 (a) may be used. The detection unit 50 may include: a displacement member 53 that passes through a through hole 40a provided in the peripheral wall of the liquid receiving portion 40; an elastic film material 54 provided to seal the displacement member 53 and the through hole 40 a; and a mechanical switch 55. When the processing liquid L discharged from the nozzle 24 in a pseudo manner contacts the tip end portion of the displacement member 53, the displacement member 53 is pushed downward, and the mechanical switch 55 is switched between on and off. Thus, the detection unit 50 can detect whether or not the processing liquid L discharged from the nozzle 24 has passed through the detection space. The detection unit 50 may include a load sensor 56 instead of the mechanical switch 55, or may include the load sensor 56 in addition to the mechanical switch 55. When the processing liquid L discharged from the nozzle 24 in a pseudo manner comes into contact with the tip end portion of the displacement member 53, the displacement member 53 is pushed downward, and thus, an elastic member (spring member) 56a connecting the displacement member 53 and the load sensor 56 is stretched. Therefore, a load acts on the load sensor 56. Thus, the detection unit 50 can detect whether or not the processing liquid L discharged from the nozzle 24 has passed through the detection space, based on the change in the load detected by the load sensor 56.
(6) The detection unit 50 illustrated in fig. 12 (b) may be used. The detection unit 50 includes a projector 57 and a light receiver 58. When the light from the light projector 57 is blocked by the processing liquid L and cannot be detected by the light receiver 58, the detection unit 50 can detect whether or not the processing liquid L spurted from the nozzle 24 passes through the detection space.
(7) In the above example, the nozzle 24 is moved relative to the detection unit 50 by rotating the nozzle arm 33, but the liquid receiving unit 40 itself may be moved horizontally, or the detection unit 50 may be moved horizontally. In these cases, the degree of displacement of the pseudo discharge position can be accurately detected from a change in the amount of movement of the liquid receiving unit 40 or the detection unit 50.
(8) The controller Ctr may also store the difference δ as time-series data in association with the date and time at which the difference δ is calculated. The controller Ctr may estimate the type of the abnormal state of the nozzle 24 based on the time-series data. Specifically, in the case of time-series data in which the difference δ becomes larger in one direction with the passage of time, it is estimated that the pseudo discharge position gradually shifts due to, for example, deterioration of the nozzle 24, the nozzle arm 33, or the like, deformation of the nozzle 24, or the like. In the case where the difference δ increases or decreases (vibrates) with the passage of time, it is estimated that the nozzle 24, the nozzle arm 33, and the like vibrate due to loosening of screws and the like, for example. When the kind of these abnormal states can be estimated, the strategy of maintenance can be predicted. Therefore, the time required for maintenance of the substrate processing apparatus 1 can be shortened. Thus, the productivity of substrate processing can be improved.
(9) The process of detecting the abnormality of the nozzle 24 may be periodically executed (at least steps S21, S22, S24 to S29 in fig. 9). In this case, step S24 may be included in the regular processing. The regular period may be, for example, several to several tens of substrates W processed, or may be at predetermined time intervals. In this case, whether or not an abnormal state has occurred in the nozzle 24 can be continuously monitored. Therefore, the abnormal state of the nozzle 24 can be detected as soon as possible without significantly impairing the throughput of substrate processing.
(10) The controller Ctr may notify an alarm when determining that the nozzle 24 is in an abnormal state. Therefore, for example, the substrate processing apparatus 1 may further include a notification device for notifying by sound, character display on a screen, light, or the like. In this case, the operator can promptly recognize that an abnormal state has occurred in the nozzle 24.
[ other examples ]
Example 1 an example of a substrate processing apparatus includes: a holding portion configured to hold a substrate; a supply unit including a nozzle configured to supply the treatment liquid to the surface of the substrate held by the holding unit; a liquid receiving portion including an opening that opens upward so as to receive the processing liquid pseudo-ejected from the nozzle; a driving unit configured to move the nozzle between a position above the substrate held by the holding unit and the liquid receiving unit by driving a nozzle arm supporting the nozzle; a detection unit disposed in the liquid receiving unit; and a control section. The detection unit is configured to detect whether or not the processing liquid discharged from the nozzle in a pseudo manner passes through a detection space in the vicinity of the inner peripheral surface of the liquid receiving unit. The control unit is configured to execute: a first process of controlling the driving unit so that the nozzle arm is positioned at an origin position preset inside the opening; and a second process of determining that the nozzle is in an abnormal state when the detection unit detects that the processing liquid discharged from the nozzle in a pseudo manner has passed through the detection space in a state where the nozzle arm is located at the origin position. In general, in an initial state in which the nozzle is appropriately attached to the nozzle arm, the operator adjusts the origin position so that the processing liquid, which is pseudo-discharged from the nozzle when the nozzle arm is located at the origin position, passes through an inner space of the opening of the liquid receiving portion, the inner space being located inside the detection space. Therefore, when the detection unit detects that the processing liquid discharged from the nozzle in a pseudo manner has passed through the detection space even though the nozzle arm is located at the origin position, the pseudo discharge position of the processing liquid from the nozzle is shifted. That is, the discharge port of the nozzle faces a direction different from the initial state, or the discharge port of the nozzle is located at a position shifted from the initial state. Therefore, the control unit can determine the state of the nozzle based on the detection signal from the detection unit, thereby detecting the abnormality of the nozzle.
Example 2 in the apparatus of example 1, the detection unit may include: a pair of terminals provided on the liquid receiving portion so as to protrude from an inner peripheral surface of the liquid receiving portion and be spaced apart from each other; and a measuring instrument configured to measure a current or a voltage between the pair of terminals, the detecting unit being configured to: whether the processing liquid spurted from the nozzle in a false mode passes through the detection space is detected based on the change of the value in the measuring instrument when the processing liquid spurted from the nozzle in a false mode electrically connects the pair of terminals. In this case, the abnormality of the nozzle can be detected by using a detection unit having a simple configuration.
Example 3 in the apparatus of example 1, the detection unit may include: a displacement member provided in the liquid receiving portion so as to protrude from an inner peripheral surface of the liquid receiving portion and be displaceable in a vertical direction; and a displacement detector configured to detect a displacement of the displacement member, the detection unit being configured to: whether the processing liquid spurted from the nozzle in a false mode passes through the detection space is detected based on the detection result of the displacement detector when the processing liquid spurted from the nozzle in a false mode contacts with the displacement component. In this case, the same operational effects as those of the apparatus of example 2 are obtained.
Example 4 in the apparatus of example 1, the detection unit may include: a light projector configured to irradiate light into the liquid receiving portion; and a light receiver disposed at a position facing the light projector and capable of receiving light from the light projector, the detection unit being configured to: whether the processing liquid spurted from the nozzle passes through the detection space is detected based on whether the light receiver receives the light from the light projector. In this case, the same operational effects as those of the apparatus of example 2 are obtained.
Example 5 the device according to any one of examples 1 to 4 may further include another detection unit disposed in the liquid receiving unit so that an inner peripheral surface of the liquid receiving unit is located at substantially the same height as the detection unit. In this case, the plurality of detection units can be used to detect the shift of the dummy ejection position in a plurality of horizontal directions. Therefore, the abnormality of the nozzle can be detected with higher accuracy.
Example 6 the apparatus according to any one of examples 1 to 5, further comprising another driving unit configured to change a horizontal position of the liquid receiving unit or a protruding amount of the detecting unit from the inner circumferential surface of the liquid receiving unit. In this case, the liquid receiving portion is moved horizontally or the amount of protrusion of the detection portion is changed until the detection portion detects the treatment liquid that is discharged in a pseudo manner, whereby the shift of the pseudo discharge position can be detected. Therefore, the degree of displacement of the pseudo discharge position can be detected with high accuracy from the amount of movement of the liquid receiving portion or the change in the amount of projection of the detection portion.
Example 7 in the apparatus according to any one of examples 1 to 6, the control unit may be further configured to execute: a third process of controlling the supply unit to cause the nozzle to discharge the processing liquid and controlling the drive unit to cause the nozzle arm to move from the origin position to a detection position, the detection position being a position at which the detection unit detects that the processing liquid discharged from the nozzle has passed through the detection space; a fourth process of calculating a movement distance of the nozzle arm from the origin position to the detection position; a fifth process of calculating a difference between a distance from the origin position to the detection position when the nozzle is in the initial state and the movement distance; and a sixth process of determining that the nozzle is in an abnormal state when the difference exceeds a predetermined allowable range. In this case, by comparing the difference value with the allowable range, a state in which the degree of displacement of the dummy ejection position is large can be recognized as an abnormal state. Therefore, the abnormality of the nozzle can be detected with higher accuracy.
Example 8 in the apparatus of example 7, the control unit may be configured to further execute a seventh process in which the origin position is corrected based on the difference value when the movement distance is within the allowable range. By correcting the origin position without excessively deviating the dummy ejection position, the substrate processing can be continued without stopping the apparatus for maintenance. Therefore, the productivity of substrate processing can be improved.
Example 9 in the apparatus of example 8, the control unit may be further configured to: an eighth process of storing the difference as time-series data in association with a date and time at which the difference is calculated; and a ninth process of estimating the kind of the abnormal state of the nozzle based on the time-series data. In this case, the maintenance strategy can be predicted based on the type of the abnormal state of the nozzle. Therefore, the time required for maintenance of the apparatus can be shortened. Thus, the productivity of substrate processing can be improved.
Example 10 in the apparatus according to any one of examples 7 to 9, the control unit may be configured to periodically execute a series of processes including the first process, the third process, and the fourth process. In this case, whether or not an abnormal state has occurred in the nozzle can be continuously monitored. Therefore, the abnormal state of the nozzle can be detected as soon as possible without significantly impairing the throughput of substrate processing.
Example 11 in the apparatus according to any one of examples 1 to 10, the control unit may be configured to further execute a tenth process of notifying an alarm when it is determined that the nozzle is in the abnormal state. In this case, the operator can promptly recognize that an abnormal state has occurred in the nozzle.
Example 12 the apparatus according to any one of examples 1 to 11 may further include a further detecting portion disposed in the liquid receiving portion so that an inner peripheral surface of the liquid receiving portion is located at a different height position from the detecting portion. In this case, whether or not the processing liquid is inclined with respect to the vertical direction and the angle of the inclination can be grasped from the detection state of the processing liquid that is pseudo-discharged from the nozzle in the two detection portions.
Example 13 in the apparatus according to example 12, the detection unit and the further detection unit may be arranged in a vertical direction, and the control unit may be configured to further execute an eleventh process of determining that the treatment liquid spurted from the nozzle is inclined with respect to the vertical direction when one of the detection unit and the further detection unit detects that the treatment liquid spurted from the nozzle has passed through the detection space but the other one of the detection unit and the further detection unit does not detect that the treatment liquid spurted from the nozzle has passed through the detection space.
Example 14 an example of a substrate processing method includes: a first step of disposing a nozzle arm supporting a nozzle at a predetermined origin position preset inside an opening of a liquid receiving portion, the nozzle being configured to supply a processing liquid to a surface of a substrate held by a holding portion, the opening of the liquid receiving portion being opened upward so as to receive the processing liquid spurted out pseudo from the nozzle; and a second step of determining that the nozzle is in an abnormal state when the detection unit disposed in the liquid receiving unit detects that the processing liquid discharged from the nozzle in a pseudo manner has passed through the detection space near the inner peripheral surface of the liquid receiving unit in a state where the nozzle arm is located at the origin position. In this case, the same operational effects as those of the apparatus of example 1 are obtained.
Example 15 the method of example 14 may further comprise: a third step of moving the nozzle arm from the origin position to a detection position, which is a position where the detection unit detects that the processing liquid ejected from the nozzle has passed through the detection space, while ejecting the processing liquid from the nozzle; a fourth step of calculating a movement distance of the nozzle arm from the origin position to the detection position; a fifth step of calculating a difference between a distance from the origin position to the detection position when the nozzle is in the initial state and the movement distance; and a sixth step of determining that the nozzle is in an abnormal state when the difference exceeds a predetermined allowable range. In this case, the same operational effects as those of the apparatus of example 7 are obtained.
Example 16 the method of example 15 may further include a seventh step of correcting the origin position based on the difference value in a case where the movement distance is within the allowable range. In this case, the same operational effects as those of the apparatus of example 8 are obtained.
Example 17 the method of example 16 may further comprise: an eighth step of storing the difference value as time-series data in association with the date and time at which the difference value was calculated; and a ninth step of estimating the type of abnormal state of the nozzle based on the time-series data. In this case, the same operational effects as those of the apparatus of example 9 are obtained.
Example 18. the method of any one of examples 15 to 17 may be such that a series of steps including the first step, the third step, and the fourth step is periodically performed. In this case, the same operational effects as those of the apparatus of example 10 are obtained.
Example 19 the method according to any one of examples 14 to 18, further comprising a tenth step of notifying an alarm when it is determined that the nozzle is in the abnormal state. In this case, the same operational effects as those of the apparatus of example 11 are obtained.
Example 20 the method according to any one of examples 14 to 19 may further include an eleventh step of, when it is detected by one of the detection unit and the further detection unit that the processing liquid spurted out from the nozzle has passed through the detection space in a state where the nozzle arm is located at the origin position, but it is not detected by the other detection unit that the processing liquid spurted out from the nozzle has passed through the detection space, determining that the processing liquid spurted out from the nozzle is inclined with respect to the vertical direction, and the further detection unit may be disposed in the liquid receiving unit such that an inner peripheral surface of the liquid receiving unit is located at a different height position from the detection unit and is aligned with the detection unit in the vertical direction. In this case, the same operational effects as those of the apparatus of example 13 are obtained.
Example 21 an example of the computer-readable recording medium may have a program recorded thereon for causing the substrate processing apparatus to execute the method of any one of examples 14 to 20. In this case, the same operational effects as those of the apparatus of example 1 are obtained. In this specification, the computer-readable recording medium may also include a non-transitory tangible medium (non-transitory computer recording medium) (e.g., various main storage devices or auxiliary storage devices) or a propagated signal (transitory computer recording medium) (e.g., a data signal that can be provided via a network).
Description of the reference numerals
1: a substrate processing apparatus; 2: a processing unit; 10: a holding section; 20: a supply section; 24: a nozzle; 30: a drive section; 33: a nozzle arm; 40: a liquid receiving section; 41: an opening; 50: a detection unit; 51: a terminal; 52: a measurer; ctr: a controller (control unit); l: a treatment liquid; RM: a recording medium; w: a substrate.

Claims (21)

1. A substrate processing apparatus includes:
a holding portion configured to hold a substrate;
a supply unit including a nozzle configured to supply a treatment liquid to a surface of the substrate held by the holding unit;
a liquid receiving portion including an opening that opens upward so as to receive the processing liquid that is pseudo-ejected from the nozzle;
a driving unit configured to move the nozzle between a position above the substrate held by the holding unit and the liquid receiving unit by driving a nozzle arm supporting the nozzle;
a detection unit disposed in the liquid receiving unit; and
a control part for controlling the operation of the display device,
wherein the detection unit is configured to detect whether or not the processing liquid discharged from the nozzle in a pseudo manner has passed through a detection space in the vicinity of the inner peripheral surface of the liquid receiving unit,
the control unit is configured to execute:
a first process of controlling the driving unit so that the nozzle arm is positioned at an origin position preset inside the opening; and
and a second process of determining that the nozzle is in an abnormal state when the detection unit detects that the processing liquid that is pseudo-discharged from the nozzle has passed through the detection space with the nozzle arm positioned at the origin position.
2. The substrate processing apparatus according to claim 1,
the detection section includes:
a pair of terminals provided in the liquid receiving portion so as to protrude from an inner peripheral surface of the liquid receiving portion and be spaced apart from each other; and
a measuring instrument configured to measure a current or a voltage between the pair of terminals,
the detection unit is configured to: whether or not the processing liquid spurted out from the nozzle has passed through the detection space is detected based on a change in value in the measuring instrument when the processing liquid spurted out from the nozzle spurts out from the nozzle and electrically connects the pair of terminals.
3. The substrate processing apparatus according to claim 1,
the detection section includes:
a displacement member provided in the liquid receiving portion so as to protrude from an inner peripheral surface of the liquid receiving portion and be displaceable in a vertical direction; and
a displacement detector configured to detect a displacement of the displacement member,
the detection unit is configured to: whether or not the processing liquid spurted pseudo-from the nozzle has passed through the detection space is detected based on a detection result in the displacement detector when the processing liquid spurted pseudo-from the nozzle comes into contact with the displacement member.
4. The substrate processing apparatus according to claim 1,
the detection section includes:
a light projector configured to irradiate light into the liquid receiving portion; and
a light receiver disposed at a position facing the light projector and capable of receiving light from the light projector,
the detection unit is configured to: the detection unit detects whether the processing liquid discharged from the nozzle in a pseudo manner has passed through the detection space based on whether the light receiver receives the light from the light projector.
5. The substrate processing apparatus according to any one of claims 1 to 4,
the liquid detection device further includes another detection unit disposed in the liquid receiving unit so that an inner peripheral surface of the liquid receiving unit is located at substantially the same height as the detection unit.
6. The substrate processing apparatus according to any one of claims 1 to 5,
the liquid container further includes another driving unit configured to change a horizontal position of the liquid receiving unit or a protruding amount of the detection unit from an inner circumferential surface of the liquid receiving unit.
7. The substrate processing apparatus according to any one of claims 1 to 6,
the control unit is configured to further execute:
a third process of controlling the drive unit to move the nozzle arm from the origin position to a detection position at which the detection unit detects that the processing liquid ejected from the nozzle has passed through the detection space, while controlling the supply unit to cause the nozzle to eject the processing liquid;
a fourth process of calculating a movement distance of the nozzle arm from the origin position to the detection position;
a fifth process of calculating a difference between a distance from the origin position to the detection position when the nozzle is in an initial state and the movement distance; and
and a sixth process of determining that the nozzle is in an abnormal state when the difference exceeds a predetermined allowable range.
8. The substrate processing apparatus according to claim 7,
the control unit is configured to further execute a seventh process of correcting the origin position based on the difference value when the movement distance is within the allowable range.
9. The substrate processing apparatus according to claim 8,
the control unit is configured to further execute:
an eighth process of storing the difference as time-series data in association with a date and time at which the difference is calculated; and
ninth processing of estimating a kind of an abnormal state of the nozzle based on the time-series data.
10. The substrate processing apparatus according to any one of claims 7 to 9,
the control unit is configured to periodically execute a series of processes including the first process, the third process, and the fourth process.
11. The substrate processing apparatus according to any one of claims 1 to 10,
the control unit is configured to further execute a tenth process of notifying an alarm when it is determined that the nozzle is in an abnormal state.
12. The substrate processing apparatus according to any one of claims 1 to 11,
the liquid detection apparatus further includes a detection unit disposed in the liquid receiving unit so that an inner peripheral surface of the liquid receiving unit is located at a height position different from that of the detection unit.
13. The substrate processing apparatus according to claim 12,
the detection unit and the further detection unit are arranged in a vertical direction,
the control unit is configured to further execute an eleventh processing in which, when one of the detection unit and the further detection unit detects that the processing liquid spuriously discharged from the nozzle has passed through the detection space but the other one does not detect that the processing liquid has passed through the detection space, it is determined that the processing liquid spuriously discharged from the nozzle is inclined with respect to a vertical direction.
14. A substrate processing method includes the steps of:
a first step of disposing a nozzle arm supporting a nozzle at a predetermined origin position preset inside an opening of a liquid receiving portion, the nozzle being configured to supply a processing liquid to a surface of a substrate held by a holding portion, the opening of the liquid receiving portion being opened upward so as to receive the processing liquid spurted out pseudo from the nozzle; and
and a second step of determining that the nozzle is in an abnormal state when it is detected by a detection unit disposed in the liquid receiving unit that the processing liquid discharged from the nozzle in a pseudo manner has passed through a detection space near an inner peripheral surface of the liquid receiving unit in a state where the nozzle arm is located at the origin position.
15. The substrate processing method according to claim 14, further comprising:
a third step of moving the nozzle arm from the origin position to a detection position at which the detection unit detects that the processing liquid ejected from the nozzle has passed through the detection space, while ejecting the processing liquid from the nozzle;
a fourth step of calculating a movement distance of the nozzle arm from the origin position to the detection position;
a fifth step of calculating a difference between the distance from the origin position to the detection position when the nozzle is in the initial state and the movement distance; and
and a sixth step of determining that the nozzle is in an abnormal state when the difference exceeds a predetermined allowable range.
16. The substrate processing method according to claim 15,
further comprising a seventh step of correcting the origin position based on the difference when the movement distance is within the allowable range.
17. The substrate processing method according to claim 16, further comprising:
an eighth step of storing the difference value as time-series data in association with a date and time at which the difference value was calculated; and
a ninth step of estimating the type of the abnormal state of the nozzle based on the time-series data.
18. The substrate processing method according to any one of claims 15 to 17,
a series of steps including the first step, the third step, and the fourth step is periodically performed.
19. The substrate processing method according to any one of claims 14 to 18,
the method further includes a tenth step of notifying an alarm when it is determined that the nozzle is in an abnormal state.
20. The substrate processing method according to any one of claims 14 to 19,
further comprising an eleventh step of determining that the processing liquid spurted from the nozzle is inclined with respect to a vertical direction when one of the detection unit and the other detection unit detects that the processing liquid spurted from the nozzle has passed through the detection space while the other detection unit does not detect that the processing liquid spurted from the nozzle has passed through the detection space in a state where the nozzle arm is located at the origin position,
the further detection portion is disposed in the liquid receiving portion so as to be located at a height position different from that of the detection portion on an inner peripheral surface of the liquid receiving portion and to be vertically aligned with the detection portion.
21. A computer-readable recording medium on which a computer program is stored, characterized in that,
the computer program, when executed by a processor, implements a substrate processing method as recited in any one of claims 14 to 20.
CN202210093060.7A 2021-02-03 2022-01-26 Substrate processing apparatus, substrate processing method, and computer-readable recording medium Pending CN114864434A (en)

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