CN114858054A - Device and method for measuring emergent position of optical chip - Google Patents
Device and method for measuring emergent position of optical chip Download PDFInfo
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- CN114858054A CN114858054A CN202210455193.4A CN202210455193A CN114858054A CN 114858054 A CN114858054 A CN 114858054A CN 202210455193 A CN202210455193 A CN 202210455193A CN 114858054 A CN114858054 A CN 114858054A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
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Abstract
The invention provides a device and a method for measuring the emergent position of an optical chip, which comprises two optical chips to be measured, an amplifying lens component and a plane detector, wherein each optical chip to be measured is provided with at least two optical waveguides, the emergent ends of the optical waveguides on the same optical chip to be measured are positioned on the same side and are spaced at preset intervals, the waveguide surfaces of the two optical chips to be measured are jointed, and the emergent light of at least two optical waveguides of each optical chip to be measured is subjected to imaging amplification by the amplifying lens component and then enters the plane detector. The calibration is carried out by the distance between the chip waveguides, the problem that the magnification of the lens group is difficult to calculate is solved, the trouble caused by selecting other calibration objects is avoided, two chips manufactured by the same process are attached together, and the distance between the light spot and the surface of the chip can be effectively calculated by utilizing the distance between the emergent ends of the upper chip and the lower chip.
Description
Technical Field
The invention relates to the field of optical chips, in particular to an emergent position measuring device and method of an optical chip.
Background
The optical chip is a chip that performs information transmission or data operation by using light waves via an optical waveguide, and integrates modulation, transmission, demodulation, and the like of optical signals and electrical signals on the same integrated optical medium. In designing an electro-optic modulator, in order to improve the efficiency of electro-optic modulation, it is necessary to increase the overlap integral of the optical field and the electric field as much as possible, and for this reason, it is very important to determine the position of the mode field of the optical waveguide, and particularly, in the case of a waveguide formed by a gradient refractive index profile, it is difficult to determine the position of the mode field because the mode field in the optical waveguide and the distance between the mode field and the surface of the waveguide are generally in the order of several micrometers.
The existing mode field position measurement generally adopts an estimation mode, and the estimation has the defect that the overlapping integral of a light field and an electric field cannot be calculated, so that an electrode is accurately designed.
Disclosure of Invention
A first object of the present invention is to provide an emission position measuring device that measures an emission position easily and accurately.
A second object of the present invention is to provide a measuring method of the emission position measuring apparatus.
In order to achieve the first object of the present invention, the present invention provides an exit position measuring device of an optical chip, comprising two optical chips to be measured, an amplifying lens assembly and a planar detector, wherein each optical chip to be measured is provided with at least two optical waveguides, the exit ends of the optical waveguides on the same optical chip to be measured are located on the same side and spaced at preset intervals, and the waveguide surfaces of the two optical chips to be measured are attached; emergent light of at least two optical waveguides of each optical chip to be detected enters the plane detector after being imaged and amplified by the amplifying lens component.
As can be seen from the above solution, since the optical chip is generally provided with at least two optical waveguides and at least two exit ends, the distance between the adjacent waveguide emergent ends of the chips is a known calibration distance, the two optical chips to be tested are overlapped by the waveguide surfaces of the two optical chips to be tested, and then the optical chips to be tested are incident to the plane detector after being imaged and amplified by the amplifying lens component, thereby obtaining four amplified imaging light spots, and then obtaining the space between the imaging light spots and the connection line space between the two groups of light spots, the distance between the connecting lines at the emergent end can be calculated according to the equal proportion relation, and then the emergent edge distance between the emergent end and the waveguide surface can be obtained, the calibration is carried out by the distance between the chip waveguides, so that the problem of difficulty in calculating the magnification of the lens is solved, and the trouble caused by selecting other calibration objects is avoided, and the emergent position of the emergent end is simply and accurately determined.
In a further scheme, the optical chip to be tested is a Y-type waveguide optical chip or a coupler type optical chip.
According to a further scheme, the emergent mode field measuring device further comprises an input optical fiber, and the input optical fiber is connected with the incident end of the optical waveguide.
Therefore, through the arrangement of the Y-shaped waveguide optical chip or the coupler type optical chip, two imaging light spots can be obtained through one-time coupling of the input optical fiber, and the measurement efficiency can be further improved.
In a further scheme, the optical chip to be tested is a parallel waveguide type optical chip.
According to a further scheme, the emergent mode field measuring device further comprises a plurality of input optical fibers, and one input optical fiber is connected with the incident end of one optical waveguide.
From the above, it can be seen that parallel waveguide type optical chips can also be adopted, and besides the two imaging spots are obtained by adopting the transverse movement of a single input optical fiber, two input optical fibers can also be adopted to simultaneously input adjacent optical waveguides, so that the two imaging spots are obtained simultaneously.
Further, the two waveguide surfaces are bonded by glue or matching fluid.
The plane where the emergent ends of the two optical chips to be detected are located is located on the same plane and is parallel to the receiving surface of the plane detector.
The two optical chips to be tested are bonded by glue or matching fluid, so that the purpose of protecting the optical waveguide can be achieved.
In order to achieve the second object of the present invention, the present invention provides an outgoing position measuring method of an optical chip, which is applied to the outgoing position measuring apparatus according to the above-mentioned aspect;
the emission position measurement method includes:
emergent light of two optical waveguides of each optical chip to be detected is respectively incident to the amplifying lens assembly, is incident to the plane detector after being subjected to imaging amplification of the amplifying lens assembly, and the plane detector obtains four imaging light spots;
two emergent ends of the same optical chip to be tested are spaced at a preset interval L1, two imaging light spots output by the same optical chip to be tested are spaced at an imaging interval L2 and form light spot connecting lines, and the connecting line interval between the two light spot connecting lines is H2;
emergent connecting lines are formed between the emergent ends of the same optical chip to be tested, the connecting line distance between the two emergent connecting lines is H1, and the connecting line distance H1 meets the equal proportion relation:
an emergent edge distance D is formed between the emergent end of the optical chip to be measured and the waveguide surface, and D is H1/2.
In a further aspect, the emission position measuring method further includes:
obtaining a gap S between waveguide surfaces of two optical chips to be tested;
and the emission margin D is (H1-S)/2.
The further scheme is that when the plane detector obtains an imaging light spot, the plane where the emergent end is located on the object plane of the amplifying lens assembly, and the receiving surface of the plane detector is located on the image plane of the amplifying lens assembly. .
Therefore, the distance between the connecting lines at the two groups of optical waveguide emergent ends of the two chips can be calculated according to the equal proportion relation, and then the emergent edge distance between the emergent end of the optical waveguide and the waveguide surface can be obtained. The calibration is carried out by the distance between the chip waveguides, so that the problem of difficulty in calculating the magnification of the lens group is solved, and the trouble caused by selecting other calibration objects is avoided, and the emergent position of the emergent end is simply and accurately determined. In addition, due to the connection or bonding of the waveguide surfaces, a gap S exists, and then the gap S can be obtained through a microscope, and then a more accurate emergent edge distance D can be calculated. When the imaging light spot is obtained, the position of the plane detector is adjusted, and then the imaging light spot is minimized, namely the imaging light spot is positioned at the position of the object plane and is used as a fixed receiving position, so that the measurement is more accurate.
Drawings
FIG. 1 is a schematic view of an optical path of an embodiment of the exit position measuring apparatus according to the present invention.
The invention is further explained with reference to the drawings and the embodiments.
Detailed Description
Referring to fig. 1, the outgoing position measuring device for measuring the position of the outgoing light spot of the optical waveguide includes two optical chips 12 to be measured, an amplifying lens assembly 13 and a plane detector 14, and the optical chips 12 to be measured, the amplifying lens assembly 13 and the plane detector 14 are sequentially arranged along a light path. The waveguide surfaces 124 of the two optical chips 12 to be tested are bonded, the optical chips are generally arranged flatly, the waveguide surfaces can be the surfaces of the optical chips, the two optical chips 12 to be tested are stacked flatly together, glue or matching liquid can be used in the bonding mode, the gap S between the two waveguide surfaces 124 can be observed and measured through a microscope, and in addition, the flat waveguide surfaces can be pressed together in a pressing mode, so that the gap S approaches to 0.
Each optical chip 12 to be measured is provided with at least two optical waveguides, the emergent ends of the optical waveguides 121 are located on the same side and are spaced at a preset distance D, the amplifying lens assembly 13 comprises at least one convex lens or a lens assembly combined by convex lenses or concave lenses, so that light spots can be amplified, and emergent light of the optical waveguides 121 of each optical chip 12 to be measured enters the plane detector 14 after being subjected to imaging amplification by the amplifying lens assembly 13.
And the plane where the emergent end is located is the emergent end face 121, so that the emergent end faces 121 of the two optical chips 12 to be measured are located on the same plane, the emergent end faces 121 are parallel to the receiving face 141 of the plane detector 14, and then four imaging light spots 142 can be obtained on the plane detector 14.
When the position of the emergent end of the optical chip 12 to be measured is measured by adopting the emergent position measuring device, the emergent position measuring method comprises the following steps:
firstly, the emergent light of the two optical waveguides of each optical chip 12 to be measured is respectively incident to the amplifying lens assembly 13, and is incident to the plane detector 14 after being imaged and amplified by the amplifying lens assembly 13, and then the plane detector 14 obtains four imaging light spots 142 of the two optical chips. When the imaging light spots 142 are obtained, the four imaging light spots 142 can be obtained sequentially and respectively, that is, the input optical fiber is adopted to move, then the signal light is output to the four waveguides sequentially, then the four imaging light spots are obtained sequentially, or the four imaging light spots 142 can be obtained simultaneously, that is, the four input optical fibers 11 are adopted, and one input optical fiber 11 is coupled with the incident end of one optical waveguide 121, so that the four imaging light spots can be obtained simultaneously.
The emergent ends of the same optical chips 12 to be measured are spaced apart by a preset distance L1, which is a known and accurate calibration parameter of the optical chip.
Then, as can be seen from the observation of the plane detector 14, the two imaging light spots 142 output by the same optical chip 12 to be measured are spaced apart by an imaging interval L2, and the two imaging light spots 142 form a light spot connecting line 143, when the light spot connecting line 143 is formed, the central points of the imaging light spots 142 are generally taken for connecting the lines, and the line connecting interval between the two light spot connecting lines 143 is H2.
An emergent connecting line 123 is formed between the emergent ends of the same optical chip 12 to be tested, the connecting line distance between the two emergent connecting lines 123 is H1, and the connecting line distance H1 meets the equal proportion relation:
the length of the link pitch H1 can be calculated.
An exit margin D is formed between the exit end of the optical chip 12 to be measured and the waveguide surface 124, and since a gap S exists between the waveguide surfaces 124 of the two optical chips 12 to be measured, the exit margin D is (H1-S)/2, and when the gap S is 0, the exit margin D is H1/2.
In addition, when the plane detector 14 obtains the imaging spot 142, the position of the plane detector 14 is adjusted so that the size of the imaging spot 142 is minimized, and the imaging spot 142 of the minimum size is obtained.
The above-mentioned embodiment is only a preferred embodiment of the present invention, and may have more variations in practical applications, for example, the optical chip 12 to be measured is a Y-type waveguide optical chip or a coupler type optical chip, and then two imaging spots can be obtained by one-time coupling of one input optical fiber, so as to further improve the measurement efficiency. For another example, the optical chip to be tested may be provided with two or more optical waveguides, and then two or more exit ends are formed on the exit end surface, or the optical waveguides include at least one auxiliary waveguide and one or more waveguides to be tested, where the exit ends of the auxiliary waveguide and the exit ends of the waveguides to be tested are located on the same side and spaced at a preset interval, so that the interval between the auxiliary waveguide and the waveguides to be tested is used as a preset calibration interval, and the exit positions of different exit ends can be obtained simply and quickly.
Therefore, the calibration is carried out by the distance between the waveguides of the chips, the problem that the magnification of the lens is difficult to calculate is solved, the trouble caused by selecting other calibration objects is avoided, two chips manufactured by the same process are attached together, and the distance between the emergent ends of the upper chip and the emergent end of the lower chip is utilized to effectively calculate the distance between the emergent facula of the waveguides and the surface of the chip.
Claims (10)
1. The device for measuring the emergent position of the optical chip is characterized by comprising two optical chips to be measured, an amplifying lens component and a plane detector, wherein each optical chip to be measured is provided with at least two optical waveguides;
emergent light of at least two optical waveguides of each optical chip to be detected enters the plane detector after being imaged and amplified by the amplifying lens assembly.
2. The emission position measurement device according to claim 1, characterized in that:
the optical chip to be tested is a Y-shaped waveguide optical chip or a coupler type optical chip.
3. The emission position measurement device according to claim 2, characterized in that:
the emergent mode field measuring device also comprises an input optical fiber, and the input optical fiber is connected with the incident end of the optical waveguide.
4. The emission position measurement device according to claim 1, characterized in that:
the optical chip to be tested is a parallel waveguide type optical chip.
5. The emission position measurement device according to claim 4, characterized in that:
the emergent mode field measuring device also comprises a plurality of input optical fibers, and one input optical fiber is connected with the incident end of one optical waveguide.
6. The exit position measurement device according to any one of claims 1 to 5, characterized in that:
the two waveguide surfaces are bonded through glue or matching fluid.
7. The exit position measurement device according to any one of claims 1 to 5, characterized in that:
the plane where the emergent end is located on the object plane of the amplifying lens assembly, and the receiving surface of the plane detector is located on the image plane of the amplifying lens assembly.
8. An outgoing position measuring method of an optical chip, characterized in that the outgoing position measuring method is applied to an outgoing position measuring apparatus according to any one of claims 1 to 7;
the emission position measurement method includes:
emergent light of the two optical waveguides of each optical chip to be detected is incident to the amplifying lens assembly, is incident to the plane detector after being imaged and amplified by the amplifying lens assembly, and the plane detector obtains four imaging light spots;
two emergent ends of the same optical chip to be tested are spaced at a preset interval L1, two imaging light spots output by the same optical chip to be tested are spaced at an imaging interval L2 and form light spot connecting lines, and the connecting line interval between the two light spot connecting lines is H2;
an emergent connecting line is formed between emergent ends of the same optical chip to be detected, the connecting line distance between the two emergent connecting lines is H1, and the connecting line distance H1 meets the equal proportion relation:
and an emergent edge distance D is formed between the emergent end of the optical chip to be tested and the waveguide surface, wherein D is H1/2.
9. The emission position measurement method according to claim 8, characterized in that:
the emission position measurement method further includes:
obtaining a gap S between the waveguide surfaces of the two optical chips to be tested;
and the emergent edge distance D is (H1-S)/2.
10. The exit mode field measuring method of claim 8, characterized in that:
when the plane detector obtains the imaging light spot, the plane where the emergent end is located on the object plane of the amplifying lens assembly, and the receiving surface of the plane detector is located on the image plane of the amplifying lens assembly.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210455193.4A CN114858054B (en) | 2022-04-26 | 2022-04-26 | Light chip emergent position measuring device and measuring method thereof |
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| CN202210455193.4A CN114858054B (en) | 2022-04-26 | 2022-04-26 | Light chip emergent position measuring device and measuring method thereof |
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| CN114858054B CN114858054B (en) | 2023-06-16 |
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| CN109445037A (en) * | 2018-11-19 | 2019-03-08 | 华中科技大学 | A kind of 1 × N-port photoswitch based on array optical waveguide and MEMS micromirror |
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2022
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Patent Citations (8)
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|---|---|---|---|---|
| CN101093183A (en) * | 2006-06-21 | 2007-12-26 | 中国科学院半导体研究所 | Method for measuring smallish chip of light waveguide |
| CN102778196A (en) * | 2011-05-10 | 2012-11-14 | 长春理工大学 | Image size measuring method based on laser calibration |
| JP2015117947A (en) * | 2013-12-16 | 2015-06-25 | 日本電信電話株式会社 | Spot size measuring method and device |
| CN106969719A (en) * | 2017-03-28 | 2017-07-21 | 南京理工大学 | A kind of detection method and device of fiber array fibre core spacing |
| CN106840008A (en) * | 2017-04-07 | 2017-06-13 | 上海汇珏网络通信设备有限公司 | A kind of optical fiber distance measurement system and measuring method |
| CN110741294A (en) * | 2017-06-07 | 2020-01-31 | 日本电信电话株式会社 | Connection structure of optical waveguide chip |
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