CN114850162A - Automatic process design method and system for FOUP Clean in semiconductor 12-inch MES system - Google Patents
Automatic process design method and system for FOUP Clean in semiconductor 12-inch MES system Download PDFInfo
- Publication number
- CN114850162A CN114850162A CN202210335275.5A CN202210335275A CN114850162A CN 114850162 A CN114850162 A CN 114850162A CN 202210335275 A CN202210335275 A CN 202210335275A CN 114850162 A CN114850162 A CN 114850162A
- Authority
- CN
- China
- Prior art keywords
- carrier
- mes
- eap
- cleaning
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000013461 design Methods 0.000 title claims abstract description 25
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 238000004140 cleaning Methods 0.000 claims abstract description 43
- 238000012545 processing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 3
- 230000002159 abnormal effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 5
- 239000000969 carrier Substances 0.000 description 4
- 230000005856 abnormality Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a FOUP Clean automatic flow design system based on a semiconductor 12-inch MES system, which comprises a carrier management module (CMS), a carrying module (GTM) and an automatic module (AUTO), wherein the carrier management module manages the state of a carrier and comprises the using times of the carrier and the using time of the carrier, the carrying module is responsible for driving the carrier to carry when the carrier is in a Dirty state (needing cleaning) in cooperation with the carrier management module (CMS), and the automatic module is responsible for automatically executing the cleaning of the carrier on equipment in cooperation with automatic software (EAP). The invention adopts the automatic exception handling process design taking the carrier as the center, and can reach the automatic cleaning process standard by 100 percent. After the invention is used, the 12-inch semiconductor production clean room can achieve the effect of turning off the lamp, and operators are not needed in the clean room.
Description
Technical Field
The invention relates to the field of semiconductor device cleaning, in particular to a FOUP Clean automatic flow design method based on a semiconductor 12-inch MES system.
Background
During semiconductor 12 "wafer production, FOUP Clean is a tool (e.g., EET VFC301& PSTH MTCM-830) that cleans the carrier. Before cleaning the carrier, it is necessary to ensure that there are no wafers in the carrier, so the carrier is empty during the cleaning process. In a 12 "manufacturing system, all processes need to be fully automated, and in most scenarios, the carriers contain lots of wafers, the automation process is controlled around the lots, and the FOUP Clean without lots cannot be controlled using the lots scenario. The Corayleigh software corporation designs a process using a carrier as a control to automate the FOUP Clean control of 12 inch wafer factories.
The existing 12-inch wafer production system takes batches as a management center, the automatic cleaning process of an empty carrier has no corresponding standard, and some factories keep manual cleaning operation, so that the mode cannot achieve the standard of a 100% Full-automatic (Full Auto) light-off factory.
Disclosure of Invention
The invention provides an automatic process design method of FOUP Clean based on a semiconductor 12-inch MES system, which is an automatic exception handling process taking a carrier as a center.
An automatic process design system of FOUP Clean based on a semiconductor 12-inch MES system comprises a carrier management module (CMS), a carrying module (GTM) and an automation module (AUTO), wherein the carrier management module manages the state of a carrier, the carrier state comprises the using times of the carrier and the using time of the carrier, the carrying module is responsible for cooperating with the carrier management module (CMS) to drive the carrier to carry when the carrier state Dirty (needing cleaning), and the automation module is responsible for cooperating with automation software (EAP) to automatically execute the carrier cleaning on equipment.
As a preferred embodiment, the automation module contains an interface for FOUP CLEAN for EAP use.
A FOUP Clean automatic flow design method based on a semiconductor 12-inch MES system comprises the following steps:
(1) after the carrier is put on the port, EAP sends STARTCLEAN to the MES automation module, which acts to synchronize the initial cleaning of the carrier to the MES system;
(2) the MES changes the carrier status to cleaning, which acts to present the carrier status to the user;
(3) after the cleaning is finished, the equipment informs EAP of the cleaning completion, and the EAP sends ENDCLEAN to an automatic module of the MES, and the step is used for synchronizing the cleaning completion of the carrier to the MES system;
(4) when an abnormality occurs, the carrier is subjected to pause processing, and the step is used for automatically carrying out pause management on the abnormal cleaning of the carrier and preventing the abnormal carrier from being repeatedly cleaned;
(5) with the interface details of the MES system and the EAP system, the role of the interface details is to fix the protocol content between the systems.
As a preferred embodiment, the EAP sends MES · startclean to MES (EAP- > MES) using the interface details of the MES system and the EAP system.
As a preferred embodiment, the EAP sends mes.endclean to MES (EAP- > MES) using the interface details of the MES system and the EAP system.
As a preferred embodiment, the EAP sends mes.holdcarrier to MES (EAP- > MES) using the interface details of the MES system and the EAP system.
A design method of an automatic process of FOUP Clean based on a semiconductor 12-inch MES system adopts the system.
Has the beneficial effects that: the invention relates to a Wildfly platform-based distributed MES system, which adopts an automatic exception handling flow design taking a carrier as a center and can reach the automatic cleaning flow standard by 100 percent. In the traditional batch-centered management design, no empty carriers of a batch can be automatically managed by 100 percent, and manual intervention is needed in the cleaning process. After the invention is used, the 12-inch semiconductor production clean room can achieve the effect of turning off the lamp, and operators are not needed in the clean room.
Drawings
Fig. 1 is a schematic view of a conventional semiconductor manufacturing process.
FIG. 2 is a schematic diagram of an MES system module according to an embodiment of the present invention.
FIG. 3 is a flow chart illustrating a cleaning management process according to an embodiment of the present invention.
FIG. 4 is a timing diagram illustrating an exemplary auto-purge management scheme according to an embodiment of the present invention.
FIG. 5 is a flow chart of the design of STARTCLEAN in one embodiment of the present invention.
Fig. 6 is a flow chart of the design of ENDCLEAN in one embodiment of the present invention.
Fig. 7 is a flow chart of the design of HOLDCARRIER in an embodiment of the invention.
Detailed Description
The embodiments of the present invention will be described in detail below with reference to the accompanying drawings: the present embodiment is implemented on the premise of the technical solution of the present invention, and a detailed implementation manner and a specific operation process are given, but the protection scope of the present invention is not limited to the following embodiments.
As shown in fig. 1 to 7, an automatic process design system for FOUP Clean based on semiconductor 12 inch MES system includes a carrier management module (CMS), a transport module (GTM) and an automation module (AUTO), wherein the carrier management module manages carrier states including the number of times a carrier is used and the time of use of the carrier, the transport module is responsible for cooperating with the carrier management module (CMS) to drive carrier transport when the carrier state Dirty (cleaning is needed), and the automation module is responsible for cooperating with automation software (EAP) to automatically perform carrier cleaning on the equipment. The automation module contains an interface for FOUP CLEAN for EAP use.
A FOUP Clean automatic flow design method based on a semiconductor 12-inch MES system comprises the following steps:
(1) after the carrier is put on the port, EAP sends STARTCLEAN to the MES automation module, which acts to synchronize the initial cleaning of the carrier to the MES system;
(2) the MES changes the carrier status to cleaning, which acts to present the carrier status to the user;
(3) after the cleaning is finished, the equipment informs EAP of the cleaning completion, and the EAP sends ENDCLEAN to an automatic module of the MES, and the step is used for synchronizing the cleaning completion of the carrier to the MES system;
(4) when an abnormality occurs, the carrier is subjected to pause processing, and the step is used for automatically carrying out pause management on the abnormal cleaning of the carrier and preventing the abnormal carrier from being repeatedly cleaned;
(5) with the interface details of the MES system and the EAP system, the role of the interface details is to fix the protocol content between the systems.
The EAP sends MES.
Using interface details of the MES system and the EAP system, the EAP sends MES.
Using interface details of the MES system and the EAP system, EAP sends MES.
A design method of an automatic process of FOUP Clean based on a semiconductor 12-inch MES system adopts the system.
As shown in fig. 1, a semiconductor manufacturing flow diagram generally includes three stages:
(1) preparation from the start of raw material to an offline operation;
(2) front-stage and back-stage processes in the production process;
(3) and testing and warehousing after the manufacturing is finished.
FIG. 2 is a schematic diagram of the MES system module structure of the present application:
(1) the external interface can communicate with EAP and ERP through RTI, BPM and ESB modules;
(2) the application modules comprise CMS, AUTO, GTM and other modules;
(3) the basic service comprises modules such as MSG, TSK, ARC and the like;
(4) the development module comprises an automation module for construction and deployment;
(5) the operation and maintenance comprises a technical billboard, monitoring and notification and log management.
As shown in fig. 3, it is a flow chart of the cleaning management in the present application:
(1) there are two factors that trigger the vehicle to be cleaned: time and number of uses;
(2) ensuring that the carrier is empty prior to cleaning;
(3) after the carrier is placed on the equipment, EAP starts to drive automatic cleaning;
(4) the MES system is notified after the cleaning is complete.
As shown in fig. 4, it is a sequence diagram of automatic cleaning management in the present application:
(1) after the carrier is put on the device, a series of device action notifications are sent to the EAP;
(2) EAP informs MES that cleaning starts (abnormal condition is to suspend carrier);
(3) cleaning is started;
(4) automatically sending a result to an MES system after cleaning is finished (if abnormal conditions exist, the carrier is paused);
(5) after the cleaning is complete, a series of device action notifications are sent to the EAP.
As shown in fig. 5, it is STARTCLEAN design method in the present application:
(1) the Request Header is the general sending content;
(2) request Body is STARTCLEAN unique content, including type, device, port, carrier;
(3) reply Header is the general Reply content.
As shown in fig. 6, it is the ENDCLEAN design method in the present application:
(1) the Request Header is the universal sending content;
(2) the Request Body is the unique content of the ENDCLEAN and comprises types, equipment and carriers;
(3) reply Header is the general Reply content.
As shown in fig. 7, is the HOLDCARRIER design method in the present application:
(1) the Request Header is the general sending content;
(2) the Request Body is the unique content of the ENDCLEAN and comprises a type, equipment, a pause code, a pause reason and a pause remark;
(3) reply Header is the general Reply content.
The invention relates to a Wildfly platform-based distributed MES system, which adopts an automatic exception handling flow design taking a carrier as a center and can reach the automatic cleaning flow standard by 100 percent. In the traditional batch-centered management design, no empty carriers of a batch can be automatically managed by 100 percent, and manual intervention is needed in the cleaning process. After the invention is used, the 12-inch semiconductor production clean room can achieve the effect of turning off the lamp, and operators are not needed in the clean room.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The system is characterized by comprising a carrier management module, a carrying module and an automation module, wherein the carrier management module is used for managing the state of a carrier and comprises the using times of the carrier and the using time of the carrier, the carrying module is used for driving the carrier to carry when the carrier is in a Dirty state in cooperation with the carrier management module, and the automation module is used for cleaning the carrier on equipment to automatically execute the cleaning of the carrier in cooperation with automation software.
2. The system as claimed in claim 1, wherein the automation module comprises an interface of the FOUP Clean for EAP.
3. A FOUP Clean automatic flow design method based on a semiconductor 12-inch MES system is characterized by comprising the following steps:
(1) after the carrier is put on port, EAP sends STARTCLEAN to the MES's automation module;
(2) the MES changes the carrier status to cleaning;
(3) after the cleaning is finished, the equipment informs EAP of finishing the cleaning, and the EAP sends ENDCLEAN to an automation module of the MES;
(4) when the abnormity happens, the carrier is subjected to pause processing;
(5) interface details of the MES system and the EAP system are utilized.
4. The method as claimed in claim 3, wherein the interface details of the MES system and the EAP system are used to send MES.
5. The method as claimed in claim 3, wherein the interface details of the MES system and the EAP system are used to send MES.
6. The method as claimed in claim 3, wherein the interface details of the MES system and the EAP system are used to send message handling equipment (MES).
7. An automated process design method for FOUP Clean based on semiconductor 12 inch MES system, characterized in that the system of claim 1 is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210335275.5A CN114850162B (en) | 2022-03-31 | 2022-03-31 | Method and system for designing automatic flow of FOUP Clean in semiconductor 12-inch MES system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210335275.5A CN114850162B (en) | 2022-03-31 | 2022-03-31 | Method and system for designing automatic flow of FOUP Clean in semiconductor 12-inch MES system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114850162A true CN114850162A (en) | 2022-08-05 |
| CN114850162B CN114850162B (en) | 2024-02-20 |
Family
ID=82628564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210335275.5A Active CN114850162B (en) | 2022-03-31 | 2022-03-31 | Method and system for designing automatic flow of FOUP Clean in semiconductor 12-inch MES system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114850162B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024082598A1 (en) * | 2022-10-16 | 2024-04-25 | 上海哥瑞利软件股份有限公司223 | Method for monitoring gas concentration and air pressure data of semiconductor 12-inch n2stk |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050096784A1 (en) * | 2003-11-05 | 2005-05-05 | Samson Lai | Control method and system for an automated material handling system |
| US20060271223A1 (en) * | 2005-05-27 | 2006-11-30 | International Business Machines Corporation | Method and system for integrating equipment integration software, equipment events, mes and rules databases |
| KR100835177B1 (en) * | 2007-01-23 | 2008-06-04 | (주)인터노바 | A transportation system for processing semiconductor material |
| CN103846262A (en) * | 2012-12-06 | 2014-06-11 | 台湾积体电路制造股份有限公司 | System and method of cleaning foup |
| CN106647667A (en) * | 2016-12-29 | 2017-05-10 | 武汉华星光电技术有限公司 | Carrier management method and computer integrated manufacturing equipment |
| CN108470708A (en) * | 2018-04-10 | 2018-08-31 | 华进半导体封装先导技术研发中心有限公司 | A kind of wafer carrier, wafer cleaning system and method |
| CN211791553U (en) * | 2020-05-20 | 2020-10-27 | 中芯集成电路制造(绍兴)有限公司 | Communication direct-connection device, communication system and semiconductor automatic production system |
| US20210358784A1 (en) * | 2020-04-21 | 2021-11-18 | Changxin Memory Technologies, Inc. | Fault monitoring system and method for semiconductor manufacturing process |
| CN114548708A (en) * | 2022-01-30 | 2022-05-27 | 弥费实业(上海)有限公司 | Empty wafer box management method and device, computer equipment and storage medium |
-
2022
- 2022-03-31 CN CN202210335275.5A patent/CN114850162B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050096784A1 (en) * | 2003-11-05 | 2005-05-05 | Samson Lai | Control method and system for an automated material handling system |
| US20060271223A1 (en) * | 2005-05-27 | 2006-11-30 | International Business Machines Corporation | Method and system for integrating equipment integration software, equipment events, mes and rules databases |
| KR100835177B1 (en) * | 2007-01-23 | 2008-06-04 | (주)인터노바 | A transportation system for processing semiconductor material |
| CN103846262A (en) * | 2012-12-06 | 2014-06-11 | 台湾积体电路制造股份有限公司 | System and method of cleaning foup |
| CN106647667A (en) * | 2016-12-29 | 2017-05-10 | 武汉华星光电技术有限公司 | Carrier management method and computer integrated manufacturing equipment |
| CN108470708A (en) * | 2018-04-10 | 2018-08-31 | 华进半导体封装先导技术研发中心有限公司 | A kind of wafer carrier, wafer cleaning system and method |
| US20210358784A1 (en) * | 2020-04-21 | 2021-11-18 | Changxin Memory Technologies, Inc. | Fault monitoring system and method for semiconductor manufacturing process |
| CN211791553U (en) * | 2020-05-20 | 2020-10-27 | 中芯集成电路制造(绍兴)有限公司 | Communication direct-connection device, communication system and semiconductor automatic production system |
| CN114548708A (en) * | 2022-01-30 | 2022-05-27 | 弥费实业(上海)有限公司 | Empty wafer box management method and device, computer equipment and storage medium |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024082598A1 (en) * | 2022-10-16 | 2024-04-25 | 上海哥瑞利软件股份有限公司223 | Method for monitoring gas concentration and air pressure data of semiconductor 12-inch n2stk |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114850162B (en) | 2024-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100745529B1 (en) | Method and system for automating issue resolution in manufacturing execution and material control systems | |
| CN100454480C (en) | Mfg. method of semiconductor device | |
| KR100303321B1 (en) | Appratus for controlling abnormal lot in automization system to produce semiconductor and control method using the same | |
| CN114850162A (en) | Automatic process design method and system for FOUP Clean in semiconductor 12-inch MES system | |
| US8994545B2 (en) | Systems and methods for alert device removal | |
| JP4592878B2 (en) | Semiconductor factory automation system, control method for automatic conveyance vehicle, and recording medium | |
| CN104601668B (en) | Data push method, device and system based on condition managing | |
| CN110618864A (en) | Interrupt task recovery method and device | |
| US20050216115A1 (en) | Transport management system and method thereorf | |
| US20060095153A1 (en) | Wafer carrier transport management method and system thereof | |
| CN112349616A (en) | Automatic control wafer replacing system and automatic control wafer replacing method | |
| WO2021213425A1 (en) | Fault monitoring system and method used during semiconductor manufacturing process | |
| CN106328569B (en) | Monitoring system and detection method for working state of semiconductor cleaning equipment | |
| CN111783172A (en) | Semiconductor process execution method and semiconductor process equipment | |
| CN106647667B (en) | The management method and computer integrated manufacturing system equipment of carrier | |
| CN116453974A (en) | Matching method and device for wafer furnace tube processing and electronic equipment | |
| JPH10256342A (en) | Transfer control method | |
| CN105791345A (en) | Communication system of server and industrial personal computer in semiconductor technological device | |
| CN112802773B (en) | Semiconductor system and semiconductor processing method | |
| CN111901214B (en) | Power monitoring serial communication method and system based on optimized polling mechanism | |
| CN115705259A (en) | Fault processing method, related device and storage medium | |
| US6823229B2 (en) | Substrate carrier management system and program | |
| CN110429057B (en) | Wafer taking and delivering method for dry etching machine | |
| CN115305461B (en) | Automatic control method and device for wafer long film under abnormal working condition | |
| CN116541312B (en) | Continuous integration test method and system for automobile software |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |