CN114839804B - Display panel, preparation method of display panel and display device - Google Patents
Display panel, preparation method of display panel and display device Download PDFInfo
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- CN114839804B CN114839804B CN202210403793.6A CN202210403793A CN114839804B CN 114839804 B CN114839804 B CN 114839804B CN 202210403793 A CN202210403793 A CN 202210403793A CN 114839804 B CN114839804 B CN 114839804B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
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Abstract
The embodiment of the application discloses a display panel, a preparation method of the display panel and a display device, wherein the display panel comprises a substrate base plate; the black matrix layer is arranged on the substrate base plate and comprises a plurality of sub-black matrixes, and each sub-black matrix is provided with a first via hole; the color resistance layer is arranged on the substrate and comprises a plurality of color resistances, every two adjacent color resistances are arranged at intervals, a sub-black matrix is arranged between every two adjacent color resistances, and each first via hole extends to the surfaces of the two adjacent color resistances respectively; the insulating layer is arranged on the black matrix layer and covers a part of the color resistance layer, and is provided with at least one second via hole, and each second via hole extends from the upper surface of the insulating layer to the upper surface of the color resistance layer. According to the display panel, the first through holes are formed in the black matrix layer between the two adjacent color resistors, and the second through holes are formed in the insulating layer, so that the gas separated out of the color resistors is discharged, liquid crystal bubbles are prevented from being generated, and the yield of the display panel is improved.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a display panel, a preparation method of the display panel and a display device.
Background
With the development of display technology, flat panel display devices such as liquid crystal display devices (Liquid Crystal Display, LCD) have been widely used in various consumer electronic products such as mobile phones, televisions, personal digital assistants, digital cameras, notebook computers, and desktop computers, and have become the mainstream of display devices, because of their advantages such as high image quality, power saving, thin body, and wide application range.
However, liquid crystal bubbles are generated in the liquid crystal display device, thereby affecting the yield of the liquid crystal display device.
Disclosure of Invention
The embodiment of the application provides a display panel, a preparation method of the display panel and a display device, which avoid generating liquid crystal bubbles, thereby improving the yield of the display panel.
In a first aspect, embodiments of the present application provide a display panel, including:
a substrate base;
the black matrix layer is arranged on the substrate base plate and comprises a plurality of sub-black matrixes, and each sub-black matrix is provided with a first via hole;
the color resistance layer is arranged on the substrate and comprises a plurality of color resistances, every two adjacent color resistances are arranged at intervals, one sub-black matrix is arranged between every two adjacent color resistances, and each first via hole extends to the surfaces of two adjacent color resistances respectively;
and the insulating layer is arranged on the black matrix layer and covers a part of the color resistance layer, and is provided with at least one second via hole, and each second via hole extends from the upper surface of the insulating layer to the upper surface of the color resistance layer.
Optionally, in some embodiments, each of the sub-black matrices includes a first portion and a second portion, the first portion is provided with a first groove wall, the second portion is provided with a second groove wall, the first via hole is formed between the first groove wall and the second groove wall, and at least one support pillar is provided between the first groove wall and the second groove wall.
Optionally, in some embodiments, the material of the sub-black matrix and the material of the support columns are both resin materials.
Optionally, in some embodiments, the upper surface of each color resistor disposed at the edge of the display panel is provided with one second via hole.
Optionally, in some embodiments, the number of second vias is less than the number of color resistors.
In a second aspect, an embodiment of the present application further provides a method for manufacturing a display panel, including:
providing a substrate base plate;
forming a color resistance layer on the substrate, forming a plurality of color resistances through a patterning process, wherein every two adjacent color resistances are arranged at intervals;
forming a black matrix layer on the substrate, wherein the black matrix layer comprises a plurality of sub-black matrixes, and one sub-black matrix is arranged between every two adjacent color resistors;
forming a first via hole on each sub-black matrix, wherein each first via hole extends to the surfaces of two adjacent color resistors respectively;
forming an insulating layer on the black matrix layer, the insulating layer covering a portion of the color resist layer;
at least one second via hole is formed on the insulating layer, and each second via hole extends from the upper surface of the insulating layer to the upper surface of the color resistance layer.
Optionally, in some embodiments, each of the sub-black matrices includes a first portion and a second portion, the first portion is provided with a first groove wall, the second portion is provided with a second groove wall, the first via is formed between the first groove wall and the second groove wall, and after forming a first via on each of the sub-black matrices, the method further includes:
at least one support column is arranged between the first groove wall and the second groove wall.
Optionally, in some embodiments, the material of the sub-black matrix and the material of the support columns are both resin materials.
Optionally, in some embodiments, the forming at least one second via on the insulating layer, each of the second vias extending from an upper surface of the insulating layer to an upper surface of the color resist layer includes:
and forming a second via hole on the upper surface of each color resistor arranged at the edge of the display panel.
Optionally, in some embodiments, the number of second vias is less than the number of color resistors.
In a third aspect, embodiments of the present application further provide a display device including a display panel as set forth in any one of the above.
The display panel provided by the embodiment of the application comprises a substrate base plate; the black matrix layer is arranged on the substrate base plate and comprises a plurality of sub-black matrixes, and each sub-black matrix is provided with a first via hole; the color resistance layer is arranged on the substrate and comprises a plurality of color resistances, every two adjacent color resistances are arranged at intervals, a sub-black matrix is arranged between every two adjacent color resistances, and each first via hole extends to the surfaces of the two adjacent color resistances respectively; the insulating layer is arranged on the black matrix layer and covers a part of the color resistance layer, and is provided with at least one second via hole, and each second via hole extends from the upper surface of the insulating layer to the upper surface of the color resistance layer. This application is through setting up first via hole at the black matrix layer between two adjacent color resistances, with the color resistance layer because external environment changes the produced gas of organic matter sublimation flow to the color resistance that is provided with the second via hole through first via hole to through setting up the second via hole at the insulating layer with gaseous discharge, avoid producing the liquid crystal bubble, thereby promote display panel's yield.
Drawings
The technical solution of the present application and the advantageous effects thereof will be made apparent from the following detailed description of the specific embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a schematic diagram of a first structure of a display panel according to an embodiment of the present application.
Fig. 2 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a second structure of the display panel according to the embodiment of the present application.
Fig. 4 is a schematic diagram of a third structure of a display panel according to an embodiment of the present application.
Fig. 5 is a schematic diagram of a fourth structure of a display panel according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the terms "a," "an," or "the" and similar terms do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
In the prior art, air bubbles caused by insufficient vacuum degree, sealing, coating, glue breaking and cutting in a liquid crystal layer are usually generated by increasing debugging and control of equipment, so that the generation of bubbles caused by the equipment is avoided as much as possible. However, the liquid crystal bubbles formed by the gas generated by the sublimation of the organic material in the color resist layer due to the change of the external environment cannot be effectively improved.
In order to solve the technical problem of liquid crystal bubbles caused by precipitation of organic matters such as color resistance, the embodiment of the application provides a display panel, a preparation method of the display panel and a display device. Referring to fig. 1, fig. 1 is a schematic diagram of a first structure of a display panel according to an embodiment of the disclosure. The display panel 100 may be a liquid crystal display panel, and is applied to a liquid crystal display device. The display panel 100 may include a substrate 110, a black matrix layer 120, a color resist layer 130, and an insulating layer 140.
The substrate 110 may be a glass substrate, a metal substrate, a quartz substrate, an organic substrate, or the like. A black matrix layer 120 is formed on one side surface of the substrate 110, and the black matrix layer 120 is arranged in an array on the substrate 110.
The color resist layer 130 is disposed on the same side of the substrate 110 and the black matrix layer 120, where the color resist layer 130 may include a plurality of color resists 131, and the plurality of color resists 131 may include a plurality of red resists, a plurality of green resists, and a plurality of blue resists, and each red resist, each green resist, and each blue resist are sequentially arranged, that is, a red resist-green resist-blue resist-red resist-green resist-blue resist, although the arrangement manner among the plurality of color resists 131 may be other manners, which is not limited herein. Every two adjacent color resistors 131 are arranged at intervals, namely, adjacent red color resistors and green color resistors are arranged at intervals, adjacent green color resistors and blue color resistors are arranged at intervals, and adjacent blue color resistors and red color resistors are arranged at intervals.
Every two adjacent color resistors are arranged at intervals to form a plurality of gaps. The black matrix layer 120 may include a plurality of sub-black matrices 121, and each sub-black matrix 121 may be disposed in a gap formed between two adjacent color resistors to function as a light shield. It can be understood that, since the black matrix layer 120 is arranged in an array, a plurality of openings corresponding to the plurality of color resists 131 of the color resist layer 130 one by one may be formed, a sub-black matrix 121 is disposed between two adjacent openings, and then the plurality of color resists 131 may be formed in the openings by means of inkjet printing.
The insulating layer 140 is disposed on the black matrix layer 120, and the insulating layer 140 may cover a portion of the color resist layer 130, i.e., a portion of the color resist layer 130 extends to the inside of the insulating layer 140. The insulating layer 140 may be an OC film layer made of a negative photoresist material, and the thickness thereof may be between 1.3 and 2.5 nanometers.
It should be noted that, when the plurality of color resists 131 in the color resist layer 130 are subjected to a change of the external environment, the organic matter may sublimate to generate gas, and in order to avoid the gas remaining in the color resist layer to generate liquid crystal bubbles, the gas needs to be exhausted. For this reason, in the present embodiment, at least one second via hole 32 is disposed on the insulating layer 140, and each second via hole 32 extends from the upper surface of the insulating layer 140 to the upper surface of the color blocking layer 130, wherein the upper surface of the insulating layer 140 is a side away from the contact surface with the black matrix layer 120, and the upper surface of the color blocking layer 130 is a side of the contact surface with the insulating layer 140. The size of the second via hole 32 is larger than that of the liquid crystal bubble, and the shape of the second via hole 32 may be cylindrical, funnel-shaped, or the like. Therefore, the gas generated in the color resist layer 130 can be discharged through the second via hole 32 extending to the upper surface of the color resist layer 130, and the formation of liquid crystal bubbles can be avoided.
Specifically, since the plurality of color resistors 131 in the color resistor layer 130 have the possibility of generating gas, the contact surface between each color resistor 131 and the insulating layer 140 needs to be provided with the second through holes 32 and extend to the upper surface of the insulating layer 140, so as to realize the discharge of the gas in all the color resistors 131 in the color resistor layer 130, i.e. the number of the second through holes 32 is the same as the number of the color resistors 131.
However, this method requires opening the second via holes 32 in the regions of the plurality of color resistors 131 corresponding to the insulating layer 140, which increases the process difficulty and affects the display effect of the display panel 100. In order to solve this problem, in this embodiment, a first via hole 31 is disposed in each sub-black matrix 121, and the first via hole 31 extends to the surfaces of two adjacent color resistors 131, and since each sub-black matrix 121 is disposed between two adjacent color resistors 131, the surface of the two color resistors 131 to which the first via hole 31 extends is the contact surface between the color resistor 131 and the sub-black matrix 121, i.e. the side surface of the color resistor 131.
The size of the first via hole 31 is larger than that of the liquid crystal bubble, and the shape of the first via hole 31 may be cylindrical, funnel-shaped, or the like. Communication is formed between two adjacent color resistors 131 through the first through hole 31, so that bubbles in one color resistor 131 can flow into the color resistor 131 adjacent to the first through hole 31. It can be understood that a first via hole 31 is disposed between every two adjacent color resistors 131 in the color resistor layer 130, so as to form a plurality of first via holes 31, and the plurality of color resistors 131 can be communicated through the plurality of first via holes 31. Then, the second via holes 32 are not required to be disposed in the region of each color resistor 131 corresponding to the insulating layer 140 to exhaust the gas, and only the second via holes 32 are required to be disposed in the region of a portion of the color resistor 131 corresponding to the insulating layer 140, and the bubbles generated in the color resistor 131 without the second via holes 32 flow into the color resistor 131 with the second via holes 32 through the plurality of first via holes 31, so as to exhaust the bubbles in all the color resistors 131 in the color resistor layer 130, thereby simplifying the process and not affecting the display effect of the display panel 100.
Since the edge area of the display panel 100 has a smaller influence on the display effect of the display panel 100, a second via hole 32 may be disposed on the upper surface of each color resistor 131 in the edge area of the display panel 100, specifically, a second via hole 32 may be disposed on each color resistor 131 around the display panel 100, the color resistors 131 in the middle area of the display panel 100 do not need to be disposed with the second via holes 32, and air bubbles flow into the color resistors 131 disposed in the edge area only through the first via holes 31, and are discharged through the second via holes 32 corresponding to the color resistors 131 in the edge area, that is, the number of the second via holes 32 is smaller than the number of the color resistors 131.
In addition, since the first via hole 31 is formed in each of the sub-black matrices 121, each of the sub-black matrices 121 is divided into a first portion 1211 and a second portion 1212, wherein the first portion 1211 may be a portion contacting the insulating layer 140, the second portion 1212 may be a portion contacting the substrate 110, the first portion 1211 is provided with a first groove wall, the second portion 1212 is provided with a second groove wall, and the first via hole 31 is formed between the first groove wall and the second groove wall. However, the contact area between the first portion 1211 and the second portion 1212 does not exist due to the first via hole 31, and the first portion 1211 is fixed only by the contact of the two color resists 131 adjacent thereto, so that the structural strength of the first portion 1211 is poor.
To solve this problem, the present embodiment supports the first portion 1211 by providing at least one support column 40 between the first portion 1211 and the second portion 1212, the support column 40 functioning to improve the structural strength of the sub-black matrix 121. The number of the support columns 40 may be set correspondingly according to the size of the sub-black matrix 121, such as 1, 2, 3, etc., which is not particularly limited herein. The material of the sub-black matrix 121 is the same as that of the support columns 40, and may be a resin material, such as an epoxy acrylate copolymer material.
As can be seen from the above, in this embodiment, the first via holes 31 are disposed in the black matrix layer 120, i.e. the sub-black matrix 121, between the two adjacent color resists 131, so that the gas generated by sublimating the organic matters caused by the change of the external environment of the color resists 130 flows to the color resists 131 with the second via holes 32 through the first via holes 31, and the gas is discharged through the second via holes 32 disposed in the insulating layer 140, so as to avoid generating liquid crystal bubbles, thereby improving the yield of the display panel and further improving the display effect of the display panel. In addition, the overall structural strength of the display panel 100 is improved by providing the support columns 40 in the sub-black matrixes 121 of the black matrix layer 120.
To further illustrate the display panel 100, the embodiment of the present application further provides a method for manufacturing the display panel 100. Referring to fig. 2 to 5, fig. 2 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present application, fig. 3 is a schematic second structural diagram of the display panel according to an embodiment of the present application, fig. 4 is a schematic third structural diagram of the display panel according to an embodiment of the present application, and fig. 5 is a schematic fourth structural diagram of the display panel according to an embodiment of the present application. The display panel 100 may be a liquid crystal display panel, and is applied to a liquid crystal display device. The preparation method of the display panel specifically comprises the following steps:
201, a substrate base plate is provided.
The substrate 110 may be a glass substrate, a metal substrate, a quartz substrate, an organic substrate, or the like.
202, forming a color resistance layer on a substrate, and forming a plurality of color resistances through a patterning process, wherein every two adjacent color resistances are arranged at intervals.
Referring to fig. 3, a color resist layer 130 is formed on one side surface of a substrate 110, and a plurality of color resists 131 are formed through a patterning process. The plurality of color resistors 131 may include a plurality of red color resistors, a plurality of green color resistors, and a plurality of blue color resistors, where each red color resistor, each green color resistor, and each blue color resistor are sequentially arranged, that is, red color resistor-green color resistor-blue color resistor-red color resistor-green color resistor-blue color resistor, although the arrangement manner among the plurality of color resistors 131 may be other manners, which is not limited herein. Every two adjacent color resistors 131 are arranged at intervals, namely, adjacent red color resistors and green color resistors are arranged at intervals, adjacent green color resistors and blue color resistors are arranged at intervals, and adjacent blue color resistors and red color resistors are arranged at intervals.
203, forming a black matrix layer on the substrate, wherein the black matrix layer comprises a plurality of sub-black matrixes, and a sub-black matrix is arranged between every two adjacent color resistors.
Referring to fig. 4, a black matrix layer 120 is formed on the same side of the substrate 110 and the color resist layer 130, and the black matrix layer 120 is arranged in an array on the substrate 110. Every two adjacent color resistors are arranged at intervals to form a plurality of gaps. The black matrix layer 120 may include a plurality of sub-black matrices 121, and each sub-black matrix 121 may be disposed in a gap formed between two adjacent color resistors to perform a light shielding function, i.e., a sub-black matrix 121 is disposed between two adjacent color resistors 131. It can be understood that, since the black matrix layer 120 is arranged in an array, a plurality of openings corresponding to the plurality of color resists 131 of the color resist layer 130 one by one may be formed, a sub-black matrix 121 is disposed between two adjacent openings, and then the plurality of color resists 131 may be formed in the openings by means of inkjet printing.
204, forming a first via hole on each sub-black matrix, wherein each first via hole extends to the surfaces of two adjacent color resistors respectively.
Each sub-black matrix 121 is formed with a first via hole 31, and the first via hole 31 extends to the surfaces of two adjacent color resistors 131, and since each sub-black matrix 121 is disposed between two adjacent color resistors 131, the surface of the two color resistors 131 extending to the first via hole 31 is the contact surface between the color resistor 131 and the sub-black matrix 121, i.e. the side surface of the color resistor 131.
In addition, since the first via hole 31 is formed in each of the sub-black matrices 121, each of the sub-black matrices 121 is divided into a first portion 1211 and a second portion 1212, wherein the first portion 1211 may be a portion contacting the insulating layer 140, the second portion 1212 may be a portion contacting the substrate 110, the first portion 1211 is provided with a first groove wall, the second portion 1212 is provided with a second groove wall, and the first via hole 31 is formed between the first groove wall and the second groove wall. However, the contact area between the first portion 1211 and the second portion 1212 does not exist due to the first via hole 31, and the first portion 1211 is fixed only by the contact of the two color resists 131 adjacent thereto, so that the structural strength of the first portion 1211 is poor.
To solve this problem, the present embodiment supports the first portion 1211 by providing at least one support column 40 between the first portion 1211 and the second portion 1212, the support column 40 functioning to improve the structural strength of the sub-black matrix 121. The number of the support columns 40 may be set correspondingly according to the size of the sub-black matrix 121, such as 1, 2, 3, etc., which is not particularly limited herein. The material of the sub-black matrix 121 is the same as that of the support columns 40, and may be a resin material, such as an epoxy acrylate copolymer material.
An insulating layer is formed on the black matrix layer, the insulating layer covering a portion of the color resist layer 205.
Referring to fig. 5, an insulating layer 140 is disposed on the black matrix layer 120, and the insulating layer 140 may cover a portion of the color resist layer 130, i.e., a portion of the color resist layer 130 extends into the insulating layer 140. The insulating layer 140 may be an OC film layer made of a negative photoresist material, and the thickness thereof may be between 1.3 and 2.5 nanometers.
At least one second via is formed in the insulating layer, each second via extending from the upper surface of the insulating layer to the upper surface of the color resist layer 206.
With continued reference to fig. 1, in this embodiment, at least one second via hole 32 is disposed on the insulating layer 140, and each second via hole 32 extends from an upper surface of the insulating layer 140 to an upper surface of the color resist layer 130, wherein the upper surface of the insulating layer 140 is a side away from a contact surface with the black matrix layer 120, and the upper surface of the color resist layer 130 is a contact surface side with the insulating layer 140. The size of the second via hole 32 is larger than that of the liquid crystal bubble, and the shape of the second via hole 32 may be cylindrical, funnel-shaped, or the like. Therefore, the gas generated in the color resist layer 130 can be discharged through the second via hole 32 extending to the upper surface of the color resist layer 130, and the formation of liquid crystal bubbles can be avoided.
The size of the first via hole 31 is larger than that of the liquid crystal bubble, and the shape of the first via hole 31 may be cylindrical, funnel-shaped, or the like. Communication is formed between two adjacent color resistors 131 through the first through hole 31, so that bubbles in one color resistor 131 can flow into the color resistor 131 adjacent to the first through hole 31. It can be understood that a first via hole 31 is disposed between every two adjacent color resistors 131 in the color resistor layer 130, so as to form a plurality of first via holes 31, and the plurality of color resistors 131 can be communicated through the plurality of first via holes 31. Then, the second via holes 32 are not required to be disposed in the region of each color resistor 131 corresponding to the insulating layer 140 to exhaust the gas, and only the second via holes 32 are required to be disposed in the region of a portion of the color resistor 131 corresponding to the insulating layer 140, and the bubbles generated in the color resistor 131 without the second via holes 32 flow into the color resistor 131 with the second via holes 32 through the plurality of first via holes 31, so as to exhaust the bubbles in all the color resistors 131 in the color resistor layer 130, thereby simplifying the process and not affecting the display effect of the display panel 100.
Since the edge area of the display panel 100 has a smaller influence on the display effect of the display panel 100, a second via hole 32 may be disposed on the upper surface of each color resistor 131 in the edge area of the display panel 100, specifically, a second via hole 32 may be disposed on each color resistor 131 around the display panel 100, the color resistors 131 in the middle area of the display panel 100 do not need to be disposed with the second via holes 32, and air bubbles flow into the color resistors 131 disposed in the edge area only through the first via holes 31, and are discharged through the second via holes 32 corresponding to the color resistors 131 in the edge area, that is, the number of the second via holes 32 is smaller than the number of the color resistors 131.
As can be seen from the above, in this embodiment, the first via holes 31 are disposed in the black matrix layer 120, i.e. the sub-black matrix 121, between the two adjacent color resists 131, so that the gas generated by sublimating the organic matters caused by the change of the external environment of the color resists 130 flows to the color resists 131 with the second via holes 32 through the first via holes 31, and the gas is discharged through the second via holes 32 disposed in the insulating layer 140, so as to avoid generating liquid crystal bubbles, thereby improving the yield of the display panel and further improving the display effect of the display panel. In addition, the overall structural strength of the display panel 100 is improved by providing the support columns 40 in the sub-black matrixes 121 of the black matrix layer 120.
The embodiment of the application also provides a display device, which includes the display panel 100 provided by the embodiment. The display device may be a full-screen display device, for example, the display device may be a wearable device such as a watch, a bracelet, or the display device may be an electronic device such as a mobile phone or a tablet computer, or the display device may be a product or a component with a display function such as a television, a display, a notebook computer, a digital photo frame, a navigator, or the like.
It should be noted that, the display panel 100 may further include a backlight assembly, and the backlight assembly may include a backlight substrate on which a backlight device and a backlight encapsulation layer are sequentially disposed. The backlight device is a thin film transistor device, and the backlight packaging layer is a packaging film. The side of the substrate 110 away from the black matrix layer 120 is bonded to the backlight encapsulation layer by an adhesive.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.
The display panel, the method for manufacturing the display panel and the display device provided by the embodiments of the present application are described in detail, and specific examples are applied to the description of the principles and the embodiments of the present application, where the description of the above examples is only used to help understand the method and the core idea of the present application; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present application, the contents of the present specification should not be construed as limiting the present application in summary.
Claims (9)
1. A display panel, comprising:
a substrate base;
the black matrix layer is arranged on the substrate base plate and comprises a plurality of sub-black matrixes, and each sub-black matrix is provided with a first via hole;
the color resistance layer is arranged on the substrate and comprises a plurality of color resistances, every two adjacent color resistances are arranged at intervals, one sub-black matrix is arranged between every two adjacent color resistances, and each first via hole extends to the surfaces of two adjacent color resistances respectively;
an insulating layer disposed on the black matrix layer and covering a portion of the color resist layer, the insulating layer being provided with at least one second via hole, each of the second via holes extending from an upper surface of the insulating layer to an upper surface of the color resist layer;
each sub-black matrix comprises a first part and a second part, wherein the first part is provided with a first groove wall, the second part is provided with a second groove wall, a first through hole is formed between the first groove wall and the second groove wall, and at least one supporting column is arranged between the first groove wall and the second groove wall.
2. The display panel according to claim 1, wherein the material of the sub-black matrix and the material of the support columns are both resin materials.
3. The display panel according to claim 1, wherein the second via hole is formed on the upper surface of each color resistor disposed on the edge of the display panel.
4. The display panel of claim 3, wherein the number of second vias is less than the number of color resistors.
5. A method for manufacturing a display panel, comprising:
providing a substrate base plate;
forming a color resistance layer on the substrate, forming a plurality of color resistances through a patterning process, wherein every two adjacent color resistances are arranged at intervals;
forming a black matrix layer on the substrate, wherein the black matrix layer comprises a plurality of sub-black matrixes, and one sub-black matrix is arranged between every two adjacent color resistors;
forming a first via hole on each sub-black matrix, wherein each first via hole extends to the surfaces of two adjacent color resistors respectively;
forming an insulating layer on the black matrix layer, the insulating layer covering a portion of the color resist layer;
forming at least one second via hole on the insulating layer, wherein each second via hole extends from the upper surface of the insulating layer to the upper surface of the color resistance layer;
each sub-black matrix comprises a first part and a second part, the first part is provided with a first groove wall, the second part is provided with a second groove wall, the first through hole is formed between the first groove wall and the second groove wall, and at least one supporting column is arranged between the first groove wall and the second groove wall after the first through hole is formed in each sub-black matrix.
6. The method of claim 5, wherein the material of the sub-black matrix and the material of the support columns are both resin materials.
7. The method of claim 5, wherein forming at least one second via hole in the insulating layer, each second via hole extending from an upper surface of the insulating layer to an upper surface of the color resist layer, comprises:
and forming a second via hole on the upper surface of each color resistor arranged at the edge of the display panel.
8. The method of claim 7, wherein the number of second vias is less than the number of color resistors.
9. A display device comprising the display panel according to any one of claims 1 to 4.
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| WO2006035621A1 (en) * | 2004-09-29 | 2006-04-06 | Sharp Kabushiki Kaisha | Color filter substrate, liquid crystal display device, color filter substrate manufacturing method and liquid crystal display device manufacturing method |
| KR20070063056A (en) * | 2005-12-14 | 2007-06-19 | 삼성전자주식회사 | Color filter substrate for liquid crystal display and fabricating method thereof |
| KR101159089B1 (en) * | 2006-02-04 | 2012-06-22 | 삼성전자주식회사 | Method of fabricating black matrix of color filter |
| JP2010091670A (en) * | 2008-10-06 | 2010-04-22 | Sumitomo Rubber Ind Ltd | Method for manufacturing color filter |
| TWI418858B (en) * | 2009-09-23 | 2013-12-11 | Prime View Int Co Ltd | Color filter substrate and color display apparatus |
| CN108594499B (en) * | 2017-03-16 | 2020-11-13 | 京东方科技集团股份有限公司 | Opposed substrate for curved surface display panel, curved surface display panel and curved surface display device |
| CN207817366U (en) * | 2018-02-12 | 2018-09-04 | 京东方科技集团股份有限公司 | A kind of color membrane substrates, display panel and display device |
| CN111474756B (en) * | 2020-05-27 | 2022-11-08 | 成都中电熊猫显示科技有限公司 | Display panel and method for manufacturing the same |
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