CN113009735A - Color film substrate and display panel - Google Patents
Color film substrate and display panel Download PDFInfo
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- CN113009735A CN113009735A CN202110404329.4A CN202110404329A CN113009735A CN 113009735 A CN113009735 A CN 113009735A CN 202110404329 A CN202110404329 A CN 202110404329A CN 113009735 A CN113009735 A CN 113009735A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
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- G—PHYSICS
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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Abstract
The application is suitable for the technical field of display, and provides a color film substrate and a display panel. The color film substrate comprises a substrate and a color filter layer, wherein the substrate comprises a shading area and a plurality of sub-pixel areas, and the shading area divides the substrate into the plurality of sub-pixel areas which are arranged at intervals; the color filter layer is arranged on one side of the substrate and comprises a red color resistance layer and a blue color resistance layer, the red color resistance layer is arranged in the corresponding sub-pixel area and the shading area, and the blue color resistance layer is arranged in the corresponding sub-pixel area and the shading area; the red color resistance layer is arranged on the part of the light-shielding area and the blue color resistance layer is arranged on the part of the light-shielding area in a stacking mode, and the total thickness of the red color resistance layer and the blue color resistance layer in the light-shielding area is 3.2-5.7 mu m. According to the color film substrate, the red color resistance layer and the blue color resistance layer are stacked in the shading area of the substrate to replace a black matrix, so that the manufacturing process of the black matrix is omitted, the production efficiency of the color film substrate is improved, and the production cost of the color film substrate is greatly reduced.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to a color film substrate and a display panel.
Background
With the development of the photoelectric Display technology and the semiconductor manufacturing technology, a Thin Film Transistor-Liquid Crystal Display (TFT-LCD) has the advantages of lightness, thinness, energy saving, high Display quality and the like, and the manufacturing process is mature and stable, so that the TFT-LCD has replaced the traditional CRT Display and becomes the mainstream of the Display device. The TFT-LCD mainly includes an Array (Array) substrate, a Color Filter (CF) substrate, and a Liquid Crystal Layer (LCL) disposed between the Array substrate and the Color Filter substrate, wherein the CF substrate is a main device for realizing Color display.
With the development of display technology, flat panel display devices such as liquid crystal displays have advantages such as high image quality, power saving, thin body, and no radiation, and thus are widely used in various consumer electronics products such as mobile phones, televisions, personal digital assistants, digital cameras, notebook computers, and desktop computers, and are becoming the mainstream of display devices.
The conventional color filter substrate manufacturing process generally includes 6 processes, which are a black matrix manufacturing process, a red/green/blue resist manufacturing process, a common electrode manufacturing process and a spacer manufacturing process, wherein a Mask (Mask) exposure process is required to be performed when the black matrix manufacturing process, the red/green/blue resist manufacturing process and the spacer manufacturing process are manufactured, and 5 Mask exposure processes are performed in total. The existing color film substrate manufacturing process has many mask plate exposure processes and many photoresist layer structures, and the mask plate exposure equipment used in the color film substrate manufacturing process has high price, the photoresist material is expensive, the production efficiency is low, and the cost is high.
Disclosure of Invention
An object of the application is to provide a color film substrate and a display panel, and the technical problems of low production efficiency and high production cost of the existing color film substrate are solved.
The present application is realized as such, a color filter substrate, including:
the substrate comprises a light shielding area and a plurality of sub-pixel areas, and the light shielding area divides the substrate into the sub-pixel areas which are arranged at intervals;
the color filter layer is arranged on one side of the substrate and comprises a red color resistance layer and a blue color resistance layer, the red color resistance layer is arranged in the corresponding sub-pixel area and the shading area, and the blue color resistance layer is arranged in the corresponding sub-pixel area and the shading area;
the red color resistance layer is arranged on the light shielding area, the blue color resistance layer is arranged on the light shielding area, and the total thickness of the red color resistance layer and the blue color resistance layer in the light shielding area is 3.2-5.7 mu m.
In one embodiment, in the light-shielding region, the red color resistance layer is arranged on one side of the substrate, and the blue color resistance layer is arranged on one side of the red color resistance layer far away from the substrate; alternatively, the first and second electrodes may be,
in the shading area, the blue color resistance layer is arranged on one side of the substrate, and the red color resistance layer is arranged on one side of the blue color resistance layer far away from the substrate.
In one embodiment, the thickness of the red color resist layer in the light shielding region is 1.0 μm to 2.5 μm.
In one embodiment, the thickness of the blue color resist layer in the light-shielding region is 2.2 μm to 3.2 μm.
In one embodiment, the thickness of the blue color resist layer in the sub-pixel region is the same as the thickness of the blue color resist layer in the light-shielding region.
In one embodiment, the thickness of the red color resist layer in the sub-pixel region is greater than the thickness of the blue color resist layer in the light-shielding region.
In one embodiment, the color filter layer further includes a green color resist layer disposed in the corresponding sub-pixel region, and the red color resist layer, the blue color resist layer and the blue color resist layer are stacked in the light-shielding region.
In one embodiment, the total thickness of the red color resist layer, the blue color resist layer and the green color resist layer in the light shielding region is 4.2 μm to 8.2 μm.
In one embodiment, in the light-shielding region, the red color resistance layer is arranged on one side of the substrate, the blue color resistance layer is arranged on one side of the red color resistance layer far away from the substrate, and the green color resistance layer is arranged on one side of the blue color resistance layer far away from the red color resistance layer; alternatively, the first and second electrodes may be,
in the shading area, the red color resistance layer is arranged on one side of the substrate, the green color resistance layer is arranged on one side of the red color resistance layer, which is far away from the substrate, and the blue color resistance layer is arranged on one side of the green color resistance layer, which is far away from the red color resistance layer; alternatively, the first and second electrodes may be,
in the light shielding area, the blue color resistance layer is arranged on one side of the substrate, the green color resistance layer is arranged on one side of the blue color resistance layer, which is far away from the substrate, and the red color resistance layer is arranged on one side of the green color resistance layer, which is far away from the blue color resistance layer; alternatively, the first and second electrodes may be,
in the light shielding area, the blue color resistance layer is arranged on one side of the substrate, the red color resistance layer is arranged on one side of the blue color resistance layer, which is far away from the substrate, and the green color resistance layer is arranged on one side of the red color resistance layer, which is far away from the blue color resistance layer; alternatively, the first and second electrodes may be,
in the light shielding area, the green color resistance layer is arranged on one side of the substrate, the blue color resistance layer is arranged on one side of the green color resistance layer, which is far away from the substrate, and the red color resistance layer is arranged on one side of the blue color resistance layer, which is far away from the green color resistance layer; alternatively, the first and second electrodes may be,
in the shading area, the green color resistance layer is arranged on one side of the substrate, the red color resistance layer is arranged on one side of the green color resistance layer, which is far away from the substrate, and the blue color resistance layer is arranged on one side of the red color resistance layer, which is far away from the green color resistance layer.
Another objective of the present application is to provide a display panel, which includes an array substrate, a liquid crystal layer and the color film substrate as described above, wherein the array substrate and the color film substrate are disposed opposite to each other, and the liquid crystal layer is disposed between the array substrate and the color film substrate.
The embodiment of the application provides a color film substrate, a red color resistance layer and a blue color resistance layer are stacked in a shading area of the substrate to replace a black matrix, so that a black matrix manufacturing process is omitted, the production efficiency of the color film substrate is improved, and the production cost of the color film substrate is greatly reduced.
The embodiment of the application provides a display panel, has the advantage that production efficiency is high and low in production cost.
Drawings
Fig. 1 is a first schematic structural diagram of a color film substrate provided in an embodiment of the present application;
fig. 2 is a schematic top view of a substrate according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a color filter substrate according to an embodiment of the present disclosure.
Wherein, in the figures, the respective reference numerals:
100-a substrate; 110-a light-shielding area; 111-a first light-shielding region; 112-a second light-shielding area; 120-subpixel areas; 200-a color filter layer; 210-a red color resist layer; 220-blue color resist layer; 230-green color resist layer; 300-a common electrode; 400-spacers; 410-a main spacer; 420-auxiliary spacers; x-a first direction; y-second direction.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
The description and claims of this invention and the word "comprise" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, or system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
In order to explain the technical solutions of the present application, the following detailed descriptions are made with reference to specific drawings and examples.
Referring to fig. 1 and fig. 2, an embodiment of the present disclosure provides a color filter substrate 100, including a substrate 100 and a color filter layer 200, where the substrate 100 includes a light-shielding region 110 and a plurality of sub-pixel regions 120, and the light-shielding region 110 divides the substrate 100 into the plurality of sub-pixel regions 120 arranged at intervals; the color filter layer 200 is disposed on one side of the substrate 100, the color filter layer 200 includes a red color resist layer 210 and a blue color resist layer 220, the red color resist layer 210 is disposed in the corresponding sub-pixel region 120 and the light-shielding region 110, and the blue color resist layer 220 is disposed in the corresponding sub-pixel region 120 and the light-shielding region 110; the red color resist layer 210 is stacked on the light-shielding region 110 and the blue color resist layer 220 is stacked on the light-shielding region 110; the light-shielding region 110 is stacked with a red color resist layer 210 and a blue color resist layer 220, and the total thickness of the red color resist layer 210 and the blue color resist layer 220 in the light-shielding region 110 is 3.2 μm to 5.7 μm. In this embodiment, the light transmittance of the blue color resist layer 220 and the red color resist layer 210 is relatively low, and an effect similar to a black matrix is caused by a manner of overlapping (color mixing) the blue color resist layer 220 and the red color resist layer 210, so as to achieve a function of shielding light.
It should be noted that the light-shielding region 110 is used to divide and define the setting region of the substrate 100, and has no functionality, that is, the light-shielding region 110 of the substrate 100 itself has no light-shielding effect, and the light-shielding effect of the color filter substrate 100 corresponding to the light-shielding region 110 is realized by stacking the red color resist layer 210, the portion provided in the light-shielding region 110, and the portion provided in the light-shielding region 110 of the blue color resist layer 220.
As an embodiment of the present application, as shown in fig. 1 and fig. 2, the light-shielding region 110 includes a first light-shielding region 111 and a second light-shielding region 112, the second light-shielding region 112 is disposed at the periphery of the first light-shielding region 111 and the plurality of sub-pixels, the second light-shielding region 112 is used for being bonded to the array substrate 100 by the frame glue, that is, the second light-shielding region 112 is a frame region, and the first light-shielding region 111 and the second light-shielding region 112 cooperate to divide the substrate 100 into the plurality of sub-pixel regions 120. In this embodiment, the first and second light- shielding regions 111 and 112 have a red color resist layer 210 and a blue color resist layer 220 stacked therein.
As one embodiment of the present application, as shown in fig. 1 and 2, in the light-shielding region 110, the blue resist layer 220 is disposed on one side of the substrate 100, and the red resist layer 210 is disposed on one side of the blue resist layer 220 away from the substrate 100, so that the blue resist layer 220 and the red resist layer 210 disposed corresponding to the light-shielding region 110 can shield light. Of course, according to the choice of actual situations and specific requirements, in the light-shielding region 110, the red color resist layer 210 is disposed on one side of the substrate 100, and the blue color resist layer 220 is disposed on one side of the red color resist layer 210 far from the substrate 100, which can also achieve the same effect, and is not limited herein.
As a specific embodiment of the present application, the thickness of the red photoresist layer 210 in the light-shielding region 110 affects the light-shielding effect thereof, and if the thickness of the red photoresist layer 210 in the light-shielding region 110 is smaller, the light-shielding capability of the red photoresist layer 210 in the light-shielding region 110 is reduced, in this embodiment, the thickness of the red photoresist layer 210 in the light-shielding region 110 is 1.0 μm to 2.5 μm, so that the blue photoresist layer 220 and the red photoresist layer 210 disposed corresponding to the light-shielding region 110 can perform the light-shielding effect. It is understood that the thickness of the red resist layer 210 in the light-shielding region 110 can be adjusted according to the choice of actual conditions and specific requirements, and is not limited herein.
As a specific embodiment of the present application, the thickness of the blue resist layer 220 in the light-shielding region 110 affects the light-shielding effect thereof, and if the thickness of the blue resist layer 220 in the light-shielding region 110 is smaller, the light-shielding capability of the blue resist layer 220 in the light-shielding region 110 is reduced, in this embodiment, the thickness of the blue resist layer 220 in the light-shielding region 110 is 2.2 μm to 3.2 μm, so that the blue resist layer 220 and the red resist layer 210 disposed corresponding to the light-shielding region 110 can perform the light-shielding effect. It is understood that the thickness of the blue color resist layer 220 in the light-shielding region 110 can be adjusted according to the choice of actual conditions and specific requirements, and is not limited herein.
In the embodiment of the present application, the thickness of the red photoresist layer 210 in the light-shielding region 110 is 1.6 μm, and the thickness of the blue photoresist layer 220 in the light-shielding region 110 is 2.43 μm, and in this structure, the blue photoresist layer 220 and the red photoresist layer 210, which are disposed corresponding to the light-shielding region 110, can cooperate to block light.
In an embodiment of the present application, the CD Bias (Critical Dimension Bias) of the red color resist layer 210 is-14.5 μm to-16.5 μm, and the CD Bias of the blue color resist layer 220 is-15.7 μm to-19.7 μm, so that the manufacturing accuracy of the red color resist layer 210 and the blue color resist layer 220 can be ensured, and the widths of the red color resist layer 210 and the blue color resist layer 220 can be easily controlled.
As one embodiment of the present application, as shown in fig. 1 and 2, the red resist layer 210 and the blue resist layer 220 are stacked on the light-shielding region 110, the width of the portion of the red resist layer 210 and the blue resist layer 220 stacked on the light-shielding region 110 in the first direction X is 45 μm to 55 μm, and the width of the portion of the red resist layer 210 and the blue resist layer 220 stacked on the light-shielding region 110 in the second direction Y is 25 μm to 35 μm, so that the blue resist layer 220 and the red resist layer 210 disposed corresponding to the light-shielding region 110 can perform a light-shielding function. In this embodiment, the width of the portion of the light-shielding region 110 where the red and blue resist layers 210 and 220 are stacked is 50 μm in the first direction X, and the width of the portion of the light-shielding region 110 where the red and blue resist layers 210 and 220 are stacked is 31 μm in the second direction Y. It should be noted that, as shown in fig. 2, the first direction X and the second direction Y intersect and are disposed at a predetermined included angle, the predetermined included angle may be 90 °, and both the first direction X and the second direction Y are parallel to the substrate 100.
As an embodiment of the present application, as shown in fig. 1, the thickness of the blue-color resist layer 220 in the sub-pixel region 120 is the same as the thickness of the blue-color resist layer 220 in the light-shielding region 110, and in this structure, when the blue-color resist layer 220 is fabricated through the same mask process, the blue-color resist layer 220 in the sub-pixel region 120 and the light-shielding region 110 can be etched at the same time to obtain the blue-color resist layer 220 with the same thickness, thereby simplifying the fabrication process.
As an embodiment of the present application, as shown in fig. 1, since the filtering effect of the red color resist layer 210 is not high, in order to ensure the filtering effect of the red color resist layer 210 in the sub-pixel region 120, the thickness of the red color resist layer 210 is greater than that of the blue color resist layer 220 in the light-shielding region 110, and at the same time, the overall thickness of the color filter substrate 100 can be prevented from being too large.
As an embodiment of the present application, the thickness of the red color resist layer 210 in the light-shielding region 110 is 1.0 μm to 2.5 μm, and the thickness of the red color resist layer 210 in the sub-pixel region 120 is 1.5 μm to 2.5 μm, so that the light-filtering effect of the red color resist layer 210 in the sub-pixel region 120, the light-shielding effect of the red color resist layer 210 and the blue color resist layer 220 in the light-shielding region 110, and the excessive thickness of the entire color filter substrate 100 can be avoided.
As an embodiment of the present disclosure, as shown in fig. 2 and 3, the color filter layer 200 further includes a green photoresist layer 230, the green photoresist layer 230 is disposed in the corresponding sub-pixel region 120, and the red photoresist layer 210, the blue photoresist layer 220, and the blue photoresist layer 220 are stacked in the light-shielding region 110. In this embodiment, the red color resist layer 210 may block green light and blue light, the blue color resist layer 220 may block red light and green light, and the green color resist layer 230 may block red light and blue light, so that the red color resist layer 210, the green color resist layer 230, and the blue color resist layer 220 stacked in the light-shielding region 110 may block all light, in this embodiment, the red color resist layer 210, the green color resist layer 230, and the blue color resist layer 220 stacked in the light-shielding region 110 of the substrate 100 may be used to replace a black matrix, so that a black matrix manufacturing process may be omitted, the production efficiency of the color filter substrate 100 may be improved, and the production cost of the color filter substrate 100 may be greatly reduced.
As a specific embodiment of the present application, the total thickness of the red, blue and green resists 210, 220 and 230 in the light-shielding region 110 is 4.2 μm to 8.2 μm, so as to ensure the light-shielding effect of the red, green and blue resists 210, 230 and 220 stacked in the light-shielding region 110. It is understood that the total thickness of the red color resist layer 210, the blue color resist layer 220 and the blue color resist layer 220 in the light shielding region 110 can be properly adjusted according to the choice of the actual situation and the specific requirement, which is not limited herein.
In one embodiment of the present application, the thickness of the red photoresist layer 210 in the light-shielding region 110 is 1.0 μm to 2.5 μm, the thickness of the green photoresist layer 230 in the light-shielding region 110 is 1.0 μm to 2.5 μm, and the thickness of the blue photoresist layer 220 in the light-shielding region 110 is 2.2 μm to 3.2 μm, so that the blue photoresist layer 220, the green photoresist layer 230, and the red photoresist layer 210 provided corresponding to the light-shielding region 110 can perform a light-shielding function. It is understood that the thicknesses of the red color resist layer 210, the green color resist layer 230, and the blue color resist layer 220 in the light-shielding region 110 may be adjusted according to the choice of the actual situation and the specific requirements, and are not limited herein.
As one embodiment of the present application, as shown in fig. 3, in the light-shielding region 110, the red-color-resist layer 210 is disposed on one side of the substrate 100, the blue-color-resist layer 220 is disposed on one side of the red-color-resist layer 210 away from the substrate 100, and the green-color-resist layer 230 is disposed on one side of the blue-color-resist layer 220 away from the red-color-resist layer 210. With this structure, the red, blue, and green color resists 210, 220, and 230 provided corresponding to the light-shielding region 110 can shield light.
It is understood that, according to the selection of the actual situation and the specific requirement, the stacking sequence of the red color resist layer 210, the blue color resist layer 220 and the green color resist layer 230 disposed corresponding to the light-shielding region 110 may be modified as appropriate, for example, in the light-shielding region 110, the red color resist layer 210 is disposed on one side of the substrate 100, the green color resist layer 230 is disposed on one side of the red color resist layer 210 away from the substrate 100, and the blue color resist layer 220 is disposed on one side of the green color resist layer 230 away from the red color resist layer 210; alternatively, the first and second electrodes may be,
in the light-shielding region 110, the blue color resist layer 220 is disposed on one side of the substrate 100, the green color resist layer 230 is disposed on one side of the blue color resist layer 220 away from the substrate 100, and the red color resist layer 210 is disposed on one side of the green color resist layer 230 away from the blue color resist layer 220; alternatively, the first and second electrodes may be,
in the light-shielding region 110, the blue color resist layer 220 is disposed on one side of the substrate 100, the red color resist layer 210 is disposed on one side of the blue color resist layer 220 away from the substrate 100, and the green color resist layer 230 is disposed on one side of the red color resist layer 210 away from the blue color resist layer 220; alternatively, the first and second electrodes may be,
in the light-shielding region 110, the green color resist layer 230 is disposed on one side of the substrate 100, the blue color resist layer 220 is disposed on one side of the green color resist layer 230 away from the substrate 100, and the red color resist layer 210 is disposed on one side of the blue color resist layer 220 away from the green color resist layer 230; alternatively, the first and second electrodes may be,
in the light-shielding region 110, the green resist layer 230 is disposed on one side of the substrate 100, the red resist layer 210 is disposed on one side of the green resist layer 230 away from the substrate 100, and the blue resist layer 220 is disposed on one side of the red resist layer 210 away from the green resist layer 230.
As one embodiment of the present application, as shown in fig. 1 to fig. 3, the color filter layer 100 further includes a common electrode 300 disposed on a side of the color filter layer 200 away from the substrate 100, in this embodiment, the common electrode 300 is a transparent conductive layer, and specifically, the common electrode 300 may be, but not limited to, an ITO (Indium tin oxide) layer. Of course, the common electrode 300 may be made of other materials according to the choice and specific requirements of the actual situation, and is not limited herein.
As an embodiment of the present application, as shown in fig. 1 to fig. 3, the color filter substrate 100 further includes a spacer 400 disposed on a side of the common electrode 300 away from the color filter layer 200, and the spacer 400 is used for maintaining a distance between the color filter substrate 100 and the array substrate 100. In this embodiment, the spacers 400 include a main spacer 410 and a sub spacer 420, the main spacer 410 being higher than the sub spacer 420, specifically, the main spacer 410 is 0.48 μm to 0.55 μm higher than the sub spacer 420, for example, the main spacer 410 is 0.53 μm higher than the sub spacer 420.
The embodiment of the present application further provides a display panel, which includes an array substrate 100, a liquid crystal layer and the color film substrate 100 as described above, where the array substrate 100 and the color film substrate 100 are arranged oppositely, and the liquid crystal layer is disposed between the array substrate 100 and the color film substrate 100.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. A color film substrate is characterized by comprising:
the substrate comprises a light shielding area and a plurality of sub-pixel areas, and the light shielding area divides the substrate into the sub-pixel areas which are arranged at intervals;
the color filter layer is arranged on one side of the substrate and comprises a red color resistance layer and a blue color resistance layer, the red color resistance layer is arranged in the corresponding sub-pixel area and the shading area, and the blue color resistance layer is arranged in the corresponding sub-pixel area and the shading area;
the red color resistance layer is arranged on the light shielding area, the blue color resistance layer is arranged on the light shielding area, and the total thickness of the red color resistance layer and the blue color resistance layer in the light shielding area is 3.2-5.7 mu m.
2. The color filter substrate according to claim 1, wherein in the light-shielding region, the red color resist layer is disposed on one side of the substrate, and the blue color resist layer is disposed on one side of the red color resist layer away from the substrate; alternatively, the first and second electrodes may be,
in the shading area, the blue color resistance layer is arranged on one side of the substrate, and the red color resistance layer is arranged on one side of the blue color resistance layer far away from the substrate.
3. The color filter substrate of claim 1, wherein the thickness of the red color resist layer in the light-shielding region is 1.0 μm to 2.5 μm.
4. The color filter substrate of claim 1, wherein the thickness of the blue color resist layer in the light-shielding region is 2.2 μm to 3.2 μm.
5. The color filter substrate of claim 1, wherein the thickness of the blue color resist layer in the sub-pixel region is the same as the thickness of the blue color resist layer in the light-shielding region.
6. The color filter substrate of claim 1, wherein the thickness of the red color resist layer in the sub-pixel region is greater than the thickness of the blue color resist layer in the light-shielding region.
7. The color filter substrate according to any one of claims 1 to 6, wherein the color filter layer further comprises a green color resist layer, the green color resist layer is disposed in the corresponding sub-pixel region, and the red color resist layer, the blue color resist layer, and the blue color resist layer are stacked in the light-shielding region.
8. The color filter substrate of claim 7, wherein a total thickness of the red color resist layer, the blue color resist layer and the green color resist layer in the light shielding region is 4.2 μm to 8.2 μm.
9. The color filter substrate according to claim 7, wherein in the light-shielding region, the red color resist layer is disposed on one side of the substrate, the blue color resist layer is disposed on one side of the red color resist layer away from the substrate, and the green color resist layer is disposed on one side of the blue color resist layer away from the red color resist layer; alternatively, the first and second electrodes may be,
in the shading area, the red color resistance layer is arranged on one side of the substrate, the green color resistance layer is arranged on one side of the red color resistance layer, which is far away from the substrate, and the blue color resistance layer is arranged on one side of the green color resistance layer, which is far away from the red color resistance layer; alternatively, the first and second electrodes may be,
in the light shielding area, the blue color resistance layer is arranged on one side of the substrate, the green color resistance layer is arranged on one side of the blue color resistance layer, which is far away from the substrate, and the red color resistance layer is arranged on one side of the green color resistance layer, which is far away from the blue color resistance layer; alternatively, the first and second electrodes may be,
in the light shielding area, the blue color resistance layer is arranged on one side of the substrate, the red color resistance layer is arranged on one side of the blue color resistance layer, which is far away from the substrate, and the green color resistance layer is arranged on one side of the red color resistance layer, which is far away from the blue color resistance layer; alternatively, the first and second electrodes may be,
in the light shielding area, the green color resistance layer is arranged on one side of the substrate, the blue color resistance layer is arranged on one side of the green color resistance layer, which is far away from the substrate, and the red color resistance layer is arranged on one side of the blue color resistance layer, which is far away from the green color resistance layer; alternatively, the first and second electrodes may be,
in the shading area, the green color resistance layer is arranged on one side of the substrate, the red color resistance layer is arranged on one side of the green color resistance layer, which is far away from the substrate, and the blue color resistance layer is arranged on one side of the red color resistance layer, which is far away from the green color resistance layer.
10. A display panel, comprising an array substrate, a liquid crystal layer and the color filter substrate according to any one of claims 1 to 9, wherein the array substrate and the color filter substrate are disposed opposite to each other, and the liquid crystal layer is disposed between the array substrate and the color filter substrate.
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