CN114833660B - Wafer thinning equipment and use method thereof - Google Patents
Wafer thinning equipment and use method thereof Download PDFInfo
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- CN114833660B CN114833660B CN202210556391.XA CN202210556391A CN114833660B CN 114833660 B CN114833660 B CN 114833660B CN 202210556391 A CN202210556391 A CN 202210556391A CN 114833660 B CN114833660 B CN 114833660B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The invention discloses wafer thinning equipment and a using method thereof, and relates to the technical field of wafer processing. According to the invention, the wafer is thinned and ground through the work of the grinding mechanism, the liquid suction mechanism can be driven to work during grinding, so that polishing liquid and waste generated during grinding enter the liquid suction assembly under the centrifugal force generated by rotation of the grinding mechanism and the rotary table and the suction force of the liquid suction mechanism during thinning and grinding, damage to the top of the wafer caused by waste generated during grinding is prevented, the wafer obtained after grinding cannot be used, resource waste is caused, the flow rate of the polishing liquid can be increased to a certain extent, grinding products can be separated from a processing surface in time, the temperature of the processing area can be reduced, and the temperature of the processing surface is relatively consistent, so that better surface quality is obtained, the quality of the thinned wafer is ensured, and the wafer is convenient for personnel to use.
Description
Technical Field
The invention relates to the technical field of wafer processing, in particular to wafer thinning equipment and a using method thereof.
Background
Advances in integrated circuit fabrication technology originate first from market demand requirements and second from competing requirements. In the manufacture of integrated circuits, the semiconductor silicon material is an important base material of the integrated circuits due to the abundant resources, low manufacturing cost and good manufacturability. From the cross-sectional view of integrated circuits, most integrated circuits are fabricated on a shallow surface layer of silicon substrate material. Because of the requirements of the manufacturing process, high requirements are put on the dimensional accuracy, geometric accuracy, surface cleanliness and surface micro-lattice structure of the wafer. Therefore, in hundreds of technological processes, thinner wafers cannot be adopted, and only wafers with certain thickness can be adopted for transferring and wafer flowing in the technological process. It is often necessary to remove some thickness of the excess substrate material from the back side of the wafer prior to packaging the integrated circuit. This process is called wafer backside thinning process, and the corresponding equipment is a wafer thinning machine. And the wafer substrate is thinned in a thinning/grinding mode, so that the heat dissipation effect of the chip is improved. Thinning to a certain thickness is beneficial to the later packaging process.
At present, the existing wafer thinning equipment cannot purge the surface of a wafer when in use, so that the surface of the wafer is damaged by residual dust particles during thinning operation, waste liquid generated by grinding cannot be effectively sucked during grinding, and the wafer is damaged by impurities generated by grinding, so that unnecessary loss is caused.
Disclosure of Invention
The invention aims to solve the problems that in the prior art, purging treatment cannot be carried out on the surface of a wafer, so that the surface of the wafer and residual dust particles damage the wafer during thinning operation, waste liquid generated by grinding cannot be effectively sucked during grinding, and impurities generated by grinding damage the wafer and cause unnecessary loss.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a wafer thinning apparatus comprising:
the wafer polishing device comprises a base, support legs are fixedly connected to four corners of the bottom of the base, a rotating motor is fixedly connected to the middle of the bottom of the inner side wall of the top of the base, a rotary table is fixedly connected to an output shaft of the rotating motor, guide rails are symmetrically and fixedly connected to the top of the base, electric lifting plates are connected to opposite side sliding of the guide rails, a polishing mechanism is fixedly connected to the top of each electric lifting plate, and the polishing mechanism is used for polishing wafers and providing partial power for the operation of the device;
the liquid suction mechanism is arranged in the electric lifting plate, is driven by the grinding mechanism and is used for providing power for liquid suction during grinding;
the clamping mechanism is arranged at the top of the base and is used for clamping and purging the wafer;
the liquid suction assembly is arranged in the base and is communicated with the liquid suction mechanism.
Preferably, the grinding mechanism comprises a driving motor, a rotating shaft, a grinding disc, a liquid tank, a liquid injection hole and a guide groove; the output end of the driving motor is fixedly connected with the top of the rotating shaft, the bottom of the rotating shaft is fixedly connected with the middle part of the top of the grinding disc, the top of the grinding disc is fixedly connected with the bottom of the liquid tank, the liquid injection Kong Kaishe is arranged at the bottom of the liquid tank, the liquid injection hole penetrates through the top of the grinding disc and extends to the bottom of the grinding disc, and the guide groove is formed in the bottom of the grinding disc.
Preferably, the liquid pumping mechanism comprises a fan blade, an exhaust pipe, a filter screen, a connecting groove, a connecting pipe and an inserting pipe; the fan blade is arranged in the exhaust pipe, the top of the exhaust pipe is fixedly connected with the bottom of the filter screen, the opposite ends of the connecting grooves are fixedly connected with the inner side walls of the exhaust pipe, the top of the connecting pipe is fixedly connected with the bottom of the connecting groove, and the outer side wall of one end of the plug-in pipe is matched with the inner side wall of one end of the connecting pipe, which is far away from the connecting groove, of the connecting pipe.
Preferably, the clamping mechanism comprises an electric chute, an electric sliding block, a clamping ring, an air bag, an air blowing pipe, an air bin and a blowing hole; the inside wall of electronic spout with electric slider's lateral wall sliding connection, electric slider's opposite side with clamping ring's opposite side fixed connection, the lateral wall of gasbag with electric slider's opposite side fixed connection, the one end of gas blowing pipe with the gasbag is close to electric slider's one side fixed connection, the inside wall of gas storehouse with the gas blowing pipe is kept away from the other end fixed connection of gasbag, it is in clamping ring's opposite side to sweep Kong Kaishe, the sweep hole runs through clamping ring's lateral wall and extends to the inside of gas storehouse.
Preferably, the liquid sucking assembly comprises a liquid sucking hole, a liquid sucking pipe, a liquid storing ring and a liquid discharging pipe; the end of the liquid suction hole is fixedly connected with one end of the liquid suction pipe, the other end of the liquid suction pipe away from the liquid suction hole is fixedly connected with the top of the liquid storage ring, and the bottom of the liquid storage ring is fixedly connected with the bottom of the liquid discharge pipe.
Preferably, the rotating shaft penetrates through the top of the electric lifting plate and extends to the bottom of the grinding disc, the grinding disc is opposite to the top of the rotating disc, the bottom of the rotating disc is rotationally connected with the top of the base, and the rotation directions of the driving motor and the rotating motor are opposite.
Preferably, the inside wall of flabellum with the lateral wall fixed connection of pivot, the middle part position of filter screen with the lateral wall of pivot rotates to be connected, the top of filter screen with driving motor's bottom fixed connection, the spread groove is seted up electric lift plate's inside, connecting pipe fixed connection is in electric lift plate's bottom both ends.
Preferably, the electric sliding groove is formed in the top of the base, the opposite sides of the clamping ring are fixedly connected with rubber cushions, the bottom of the clamping ring is attached to the top of the rotary table and can slide, the air blowing pipe is fixedly connected in the electric sliding block, and the air bag is far away from the other side of the electric sliding block and the inner side wall of the electric sliding groove.
Preferably, the liquid suction hole penetrates through the clamping ring and the electric sliding block, one end, close to the liquid suction hole, of the liquid suction pipe is fixedly connected with the bottom of the electric sliding block, the liquid storage ring is fixedly connected inside the base, and the outer side wall of the liquid storage ring is fixedly connected with the other end, far away from the connecting pipe, of the plug-in pipe.
The application method of the wafer thinning equipment comprises the following steps:
firstly, placing a wafer on the top of a turntable, and then starting a clamping mechanism to clamp and purge the wafer;
after the wafer is clamped, the electric lifting plate can be started to drive the grinding mechanism and the liquid pumping mechanism to move downwards;
until the bottom of the grinding mechanism is attached to the top of the wafer, the liquid pumping mechanism is assembled;
then, the grinding mechanism can be started to thin the top of the wafer, and the rotating motor is started to drive the turntable while thinning the top of the wafer, so that the rotation directions of the wafer and the grinding mechanism are opposite;
the grinding mechanism drives the liquid suction mechanism to work, so that the liquid suction assembly sucks waste liquid generated by grinding of the grinding mechanism into the liquid suction assembly under the action of the liquid suction mechanism;
in the thinning process, the electric lifting plate slowly moves downwards until the electric lifting plate is ground to a specified position;
after the thinning is finished, waste liquid sucked in the liquid suction assembly can be discharged, so that the grinding mechanism and the clamping mechanism are reset, and the thinned wafer is taken down.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, when the wafer is thinned and ground, the thinning and grinding operation is carried out on the wafer through the work of the grinding mechanism, the liquid suction mechanism can be driven to work during grinding, so that polishing liquid and waste generated during grinding enter the liquid suction assembly under the action of centrifugal force generated by rotation of the grinding mechanism and the rotary table during thinning and grinding, the liquid suction assembly pumps the polishing liquid and the waste generated during grinding into the liquid suction assembly under the work of the liquid suction mechanism, the damage of the waste generated during grinding to the top of the wafer is prevented, the wafer obtained after grinding cannot be used, resource waste is caused, the flow rate of the polishing liquid can be increased to a certain extent, the temperature of a processing area can be reduced, the temperature of the processing surface is relatively consistent, the quality of the thinned wafer is ensured, and the wafer is convenient for personnel to use.
2. When the wafer polishing device is used, the clamping mechanism is used for clamping the wafer, dust particles on the surface of the wafer can be effectively purged, the dust particles on the surface of the wafer are prevented from being damaged when the wafer is polished and thinned, the wafer obtained by polishing and thinning cannot meet the requirements, unnecessary loss is caused, the wafer is well protected, the quality of the thinned wafer is guaranteed, and the wafer polishing device is convenient for personnel to use.
Drawings
FIG. 1 is a schematic three-dimensional schematic diagram of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 2 is a schematic view of a three-dimensional front-side middle-cut structure of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 3 is a schematic view of a three-dimensional side-view middle-cut structure of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 4 is a schematic three-dimensional schematic diagram of a clamping mechanism and a flow guiding assembly of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 5 is a schematic view of a three-dimensional bottom structure of a polishing mechanism of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 6 is a schematic three-dimensional schematic view of a polishing mechanism of a wafer thinning apparatus and a method for using the same according to the present invention;
FIG. 7 is an enlarged schematic view of the structure of the wafer thinning apparatus and the method of using the same in FIG. 2 according to the present invention;
fig. 8 is an enlarged schematic view of a wafer thinning apparatus and a method for using the same according to the present invention shown in fig. 3 at B.
In the figure: 1. a base; 2. a support leg; 3. a guide rail; 4. an electric lifting plate; 5. a grinding mechanism; 51. a driving motor; 52. a rotating shaft; 53. a grinding disc; 54. a liquid tank; 55. a liquid injection hole; 56. a guide groove; 6. a liquid pumping mechanism; 61. a fan blade; 62. an exhaust pipe; 63. a filter screen; 64. a connecting groove; 65. a connecting pipe; 66. a connecting pipe is inserted; 7. a clamping mechanism; 71. an electric chute; 72. an electric slide block; 73. a clamping ring; 74. an air bag; 75. an air blowing pipe; 76. a gas bin; 77. a purge hole; 8. a liquid-absorbing assembly; 81. a liquid suction hole; 82. a pipette; 83. a liquid storage ring; 84. a liquid discharge pipe; 9. a rotating electric machine; 10. a turntable.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1-8, a wafer thinning apparatus includes:
the wafer polishing device comprises a base 1, four corners of the bottom of the base 1 are fixedly connected with supporting legs 2, a rotating motor 9 is fixedly connected to the middle position of the bottom of the inner side wall of the top of the base 1, a rotary table 10 is fixedly connected to an output shaft of the rotating motor 9, guide rails 3 are symmetrically and fixedly connected to the top of the base 1, electric lifting plates 4 are slidably connected to opposite sides of the guide rails 3, a polishing mechanism 5 is fixedly connected to the top of each electric lifting plate 4, and the polishing mechanism 5 is used for polishing wafers and providing partial power for the operation of the device;
the liquid suction mechanism 6 is arranged in the electric lifting plate 4, the liquid suction mechanism 6 is driven by the grinding mechanism 5, and the liquid suction mechanism 6 is used for providing power for liquid suction during grinding;
the clamping mechanism 7 is arranged at the top of the base 1, and the clamping mechanism 7 is used for clamping and purging the wafer;
the liquid suction assembly 8 is arranged in the base 1, and the liquid suction assembly 8 is communicated with the liquid suction mechanism 6;
through the arrangement of the structure, the purging operation of dust particles on the surface of the wafer is realized, polishing liquid and waste generated during thinning and grinding can be treated, and the thinning quality is ensured.
Wherein the grinding mechanism 5 comprises a driving motor 51, a rotating shaft 52, a grinding disc 53, a liquid tank 54, a liquid injection hole 55 and a guide groove 56; the output end of the driving motor 51 is fixedly connected with the top of the rotating shaft 52, the bottom of the rotating shaft 52 is fixedly connected with the middle part of the top of the grinding disc 53, the top of the grinding disc 53 is fixedly connected with the bottom of the liquid tank 54, the liquid injection hole 55 is formed in the bottom of the liquid tank 54, the liquid injection hole 55 penetrates through the top of the grinding disc 53 and extends to the bottom of the grinding disc 53, and the guide groove 56 is formed in the bottom of the grinding disc 53;
through the arrangement of the structure, the thinning operation of the wafer is realized, and through the arrangement of the guide groove 56, polishing liquid and waste generated by grinding can be discharged in time, and the quality of the thinning operation is ensured.
The liquid suction mechanism 6 comprises fan blades 61, an exhaust pipe 62, a filter screen 63, a connecting groove 64, a connecting pipe 65 and an inserting pipe 66; the fan blade 61 is arranged in the exhaust pipe 62, the top of the exhaust pipe 62 is fixedly connected with the bottom of the filter screen 63, the opposite ends of the connecting groove 64 are fixedly connected with the inner side wall of the exhaust pipe 62, the top of the connecting pipe 65 is fixedly connected with the bottom of the connecting groove 64, and the outer side wall of one end of the plugging pipe 66 is matched with the inner side wall of one end of the connecting pipe 65 far away from the connecting groove 64;
through the arrangement of the structure, the polishing solution and the waste generated by grinding are treated, and the driving motor 51 can be radiated to a certain extent, so that the service life of the driving motor 51 is prolonged.
The clamping mechanism 7 comprises an electric sliding chute 71, an electric sliding block 72, a clamping ring 73, an air bag 74, an air blowing pipe 75, an air bin 76 and a blowing hole 77; the inner side wall of the electric sliding chute 71 is in sliding connection with the outer side wall of the electric sliding chute 72, the opposite side of the electric sliding chute 72 is fixedly connected with the opposite side of the clamping ring 73, the outer side wall of the air bag 74 is fixedly connected with the opposite side of the electric sliding chute 72, one end of the air blowing pipe 75 is fixedly connected with one side of the air bag 74, which is close to the electric sliding chute 72, the inner side wall of the air bin 76 is fixedly connected with the other end of the air blowing pipe 75, which is far away from the air bag 74, the blowing hole 77 is formed on the opposite side of the clamping ring 73, and the blowing hole 77 penetrates through the side wall of the clamping ring 73 and extends into the air bin 76;
through the arrangement of the structure, the centering clamping operation of the wafer is realized, and dust particles on the surface of the wafer can be effectively purged while clamping, so that the influence of the dust particles on the wafer is prevented when the wafer is ground and thinned.
Wherein, the liquid sucking component 8 comprises a liquid sucking hole 81, a liquid sucking pipe 82, a liquid storing ring 83 and a liquid discharging pipe 84; the end of the liquid suction hole 81 is fixedly connected with one end of the liquid suction pipe 82, the other end of the liquid suction pipe 82, which is far away from the liquid suction hole 81, is fixedly connected with the top of the liquid storage ring 83, the bottom of the liquid storage ring 83 is fixedly connected with the bottom of the liquid discharge pipe 84, and an electric valve is arranged on the inner side wall of the liquid discharge pipe 84;
through the setting of above-mentioned structure for polishing liquid and waste material that the attenuate grinding produced can get into in the imbibition subassembly 8 under the effect of centrifugal force, and can the velocity of flow of certain increase polishing liquid, can break away from the processing surface when making the grinding product, can also reduce the temperature in processing region, make processing surface temperature unanimous relatively, thereby obtain better surface quality.
The rotating shaft 52 penetrates through the top of the electric lifting plate 4 and extends to the bottom of the grinding disc 53, the grinding disc 53 is arranged opposite to the top of the rotary disc 10, the bottom of the rotary disc 10 is rotationally connected with the top of the base 1, and the rotation directions of the driving motor 51 and the rotating motor 9 are opposite.
Wherein, the inside wall of flabellum 61 and the lateral wall fixed connection of pivot 52, the middle part position of filter screen 63 and the lateral wall rotation of pivot 52 are connected, the top of filter screen 63 and the bottom fixed connection of driving motor 51, and the inside at electric lift plate 4 is seted up to spread groove 64, and connecting pipe 65 fixed connection is at electric lift plate 4's bottom both ends.
Wherein, electronic spout 71 is offered at the top of base 1, and the opposite side fixedly connected with rubber cushion of clamp ring 73, the bottom of clamp ring 73 is laminated mutually and slidable with the top of carousel 10, and the blowing pipe 75 fixed connection is in the inside of electronic slider 72, and the opposite side that electronic slider 72 was kept away from to gasbag 74 is fixed connection with the inside wall of electronic spout 71.
The liquid suction hole 81 penetrates through the clamping ring 73 and the electric sliding block 72, one end of the liquid suction pipe 82, which is close to the liquid suction hole 81, is fixedly connected with the bottom of the electric sliding block 72, the liquid storage ring 83 is fixedly connected inside the base 1, and the outer side wall of the liquid storage ring 83 is fixedly connected with the other end of the plugging tube 66, which is far away from the connecting tube 65.
The application method of the wafer thinning equipment comprises the following steps:
s1: firstly, placing a wafer on the top of a turntable 10, and then starting a clamping mechanism 7 to clamp and purge the wafer;
s2: after the wafer is clamped, the electric lifting plate 4 can be started to drive the grinding mechanism 5 and the liquid pumping mechanism 6 to move downwards;
s3: until the bottom of the grinding mechanism 5 is attached to the top of the wafer, the liquid pumping mechanism 6 is assembled;
s4: then, the grinding mechanism 5 can be started to thin the top of the wafer, and the rotating motor 9 is started to drive the turntable 10 during thinning, so that the rotation directions of the wafer and the grinding mechanism 5 are opposite;
s5: the grinding mechanism 5 drives the liquid suction mechanism 6 to work, so that the liquid suction assembly 8 sucks waste liquid generated by grinding of the grinding mechanism 5 into the liquid suction assembly 8 under the action of the liquid suction mechanism 6;
s6: in the thinning process, the electric lifting plate 4 slowly moves downwards until the electric lifting plate is ground to a specified position;
s7: after the thinning is finished, the waste liquid sucked in the liquid suction assembly 8 can be discharged, so that the grinding mechanism 5 and the clamping mechanism 7 are reset, and the thinned wafer is taken down.
In the invention, when the polishing device is used, a wafer is firstly placed on the top of the turntable 10, then the electric lifting plate 4 is started to enable the grinding mechanism 5 to move downwards to contact the top of the wafer, at the moment, the inner side wall of the connecting pipe 65 is attached to the outer side wall of the inserting pipe 66, the electric sliding block 72 and the electric sliding chute 71 can be started to enable the electric sliding block 72 to slide in opposite directions, the air bag 74 is extruded in the sliding process, when the clamping ring 73 moves in opposite directions, the air in the air bag 74 enters the air bin 76 through the air blowing pipe 75, then the air bag is blown to the upper surface of the wafer through the blowing hole 77, dust particles on the upper surface of the wafer are blown to be operated until the opposite sides of the clamping ring 73 are attached to the outer surface of the wafer, and the wafer surface is sealed by the clamping rings 73, so that polishing liquid and waste can only enter the liquid suction hole 81 through the guide groove 56, and the polishing liquid and waste are prevented from being discharged to the outside to cause pollution when the polishing disc 53 is subjected to polishing and thinning operation;
then, the driving motor 51 is started to rotate the motor 9 so that the rotation directions of the grinding disc 53 and the turntable 10 are opposite, then polishing liquid in the liquid tank 54 enters the surfaces of the grinding disc 53 and the wafer through the liquid injection hole 55, so that the polishing liquid uniformly covers the surfaces of the wafer, the rotating shaft 52 is driven to rotate under the rotation of the driving motor 51, the fan blades 61 rotate to enter the connecting groove 64, the connecting pipe 65 and the inserting pipe 66 to extract gas in the liquid storage ring 83, polishing liquid generated by grinding and waste liquid generated by grinding enter the liquid suction hole 81 through the guide groove 56 under the action of centrifugal force generated by the grinding disc 53 and the turntable 10, at the moment, due to the operation of the liquid suction mechanism 6, the polishing liquid and the waste liquid generated by grinding enter the liquid storage ring 83 through the liquid suction hole 81 and the liquid suction pipe 82 until the grinding is completed, the flow rate of the polishing liquid can be accelerated to a certain extent while the polishing liquid is sucked, the temperature of a processing area can be reduced when a grinding product is separated from the processing surface, the processing surface temperature is relatively consistent, so that the processing surface temperature is relatively consistent, the better surface quality is obtained, the quality is ensured, and the electric lifting and the grinding plate is slowly lifted to a specified position in the grinding process 4;
as one of the key points of the scheme, the matching work of the grinding mechanism and the liquid suction mechanism is further expressed, the grinding mechanism drives the grinding disc 53 to rotate by utilizing the driving motor 51, and simultaneously, the suction force generated by the rotation of the fan blades 61 arranged on the outer side wall of the rotating shaft 52 provides a negative pressure basis for the liquid storage ring 83 on the liquid suction mechanism, so that the cleaning work of waste liquid generated in the grinding process is realized;
it should be noted that in the scheme, the negative pressure generated by the fan blade 61 realizes the extraction of the waste liquid, and in the implementation process, the extraction of the waste liquid after polishing is synchronously realized on the basis of polishing, and in the synchronous extraction process, the waste liquid can be transported and treated more quickly, so that the doping rate of the waste liquid to the polishing liquid is effectively reduced, the polishing quality of the wafer is prevented from being influenced, the purity of the polishing liquid in the polishing process is higher, and the polishing quality of the wafer product is further improved;
after finishing grinding, the driving motor 51 and the rotating motor 9 can be closed, the electric lifting plate 4 is started to move upwards, so that the electric lifting plate 4 is restored to the original position, at the moment, the grinding mechanism 5 is completely separated from the surface of the wafer, then the electric sliding chute 71 and the electric sliding block 72 are started again, so that the electric sliding block 72 slides relatively, the original position is restored, the air bag 74 is enabled to extract air through the blowing hole 77, the air bin 76 and the air blowing pipe 75, the air bag 74 is restored to the original position, then the thinned wafer can be removed, the electric valve of the liquid discharge pipe 84 is opened, the waste liquid is discharged, and the whole operation is finished.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (4)
1. A wafer thinning apparatus, comprising:
the wafer polishing device comprises a base (1), wherein the four corners of the bottom of the base (1) are fixedly connected with supporting legs (2), a rotating motor (9) is fixedly connected to the middle position of the inner side wall of the top of the base (1), a turntable (10) is fixedly connected to an output shaft of the rotating motor (9), a guide rail (3) is symmetrically and fixedly connected to the top of the base (1), an electric lifting plate (4) is connected to the opposite side sliding of the guide rail (3), a polishing mechanism (5) is fixedly connected to the top of the electric lifting plate (4), and the polishing mechanism (5) is used for polishing wafers and provides partial power for the operation of the device;
the grinding mechanism (5) comprises a driving motor (51), a rotating shaft (52), a grinding disc (53), a liquid tank (54), a liquid injection hole (55) and a guide groove (56); the output end of the driving motor (51) is fixedly connected with the top of the rotating shaft (52), the bottom of the rotating shaft (52) is fixedly connected with the middle part of the top of the grinding disc (53), the top of the grinding disc (53) is fixedly connected with the bottom of the liquid tank (54), the liquid injection hole (55) is formed in the bottom of the liquid tank (54), the liquid injection hole (55) penetrates through the top of the grinding disc (53) and extends to the bottom of the grinding disc (53), and the guide groove (56) is formed in the bottom of the grinding disc (53);
the rotating shaft (52) penetrates through the top of the electric lifting plate (4) and extends to the bottom of the grinding disc (53), the grinding disc (53) is arranged opposite to the top of the rotary disc (10), the bottom of the rotary disc (10) is rotationally connected with the top of the base (1), and the rotation directions of the driving motor (51) and the rotating motor (9) are opposite;
the liquid suction mechanism (6), the liquid suction mechanism (6) is arranged in the electric lifting plate (4), the liquid suction mechanism (6) is driven by the grinding mechanism (5), and the liquid suction mechanism (6) is used for providing power for liquid suction during grinding;
the liquid suction mechanism (6) comprises fan blades (61), an exhaust pipe (62), a filter screen (63), a connecting groove (64), a connecting pipe (65) and an inserting pipe (66); the fan blade (61) is arranged in the exhaust pipe (62), the top of the exhaust pipe (62) is fixedly connected with the bottom of the filter screen (63), the opposite ends of the connecting groove (64) are fixedly connected with the inner side wall of the exhaust pipe (62), the top of the connecting pipe (65) is fixedly connected with the bottom of the connecting groove (64), and the outer side wall of one end of the plug-in pipe (66) is matched with the inner side wall of one end of the connecting pipe (65) far away from the connecting groove (64);
the inner side wall of the fan blade (61) is fixedly connected with the outer side wall of the rotating shaft (52), the middle position of the filter screen (63) is rotationally connected with the outer side wall of the rotating shaft (52), the top of the filter screen (63) is fixedly connected with the bottom of the driving motor (51), the connecting groove (64) is formed in the electric lifting plate (4), and the connecting pipes (65) are fixedly connected with two ends of the bottom of the electric lifting plate (4);
the clamping mechanism (7) is arranged at the top of the base (1), and the clamping mechanism (7) is used for clamping and purging the wafer;
the clamping mechanism (7) comprises an electric sliding groove (71), an electric sliding block (72), a clamping ring (73), an air bag (74), an air blowing pipe (75), an air bin (76) and a blowing hole (77);
the liquid suction assembly (8) is arranged in the base (1), and the liquid suction assembly (8) is communicated with the liquid suction mechanism (6);
the liquid sucking component (8) comprises a liquid sucking hole (81), a liquid sucking pipe (82), a liquid storing ring (83) and a liquid discharging pipe (84); the end part of the liquid suction hole (81) is fixedly connected with one end of the liquid suction pipe (82), the other end of the liquid suction pipe (82) far away from the liquid suction hole (81) is fixedly connected with the top of the liquid storage ring (83), and the bottom of the liquid storage ring (83) is fixedly connected with the bottom of the liquid discharge pipe (84);
the liquid suction hole (81) penetrates through the clamping ring (73) and the electric sliding block (72), one end, close to the liquid suction hole (81), of the liquid suction pipe (82) is fixedly connected with the bottom of the electric sliding block (72), the liquid storage ring (83) is fixedly connected with the inside of the base (1), and the outer side wall of the liquid storage ring (83) is fixedly connected with the other end, far away from the connecting pipe (65), of the plug-in pipe (66).
2. The wafer thinning equipment according to claim 1, wherein the inner side wall of the electric chute (71) is in sliding connection with the outer side wall of the electric slide block (72), the opposite side of the electric slide block (72) is fixedly connected with the opposite side of the clamping ring (73), the outer side wall of the air bag (74) is fixedly connected with the opposite side of the electric slide block (72), one end of the air blowing pipe (75) is fixedly connected with one side of the air bag (74) close to the electric slide block (72), the inner side wall of the air bin (76) is fixedly connected with the other end of the air blowing pipe (75) far away from the air bag (74), the blowing hole (77) is formed in the opposite side of the clamping ring (73), and the blowing hole (77) penetrates through the side wall of the clamping ring (73) and extends into the air bin (76).
3. The wafer thinning equipment according to claim 2, wherein the electric sliding chute (71) is formed at the top of the base (1), rubber cushions are fixedly connected to opposite sides of the clamping ring (73), the bottom of the clamping ring (73) is attached to the top of the turntable (10) and can slide, the air blowing pipe (75) is fixedly connected to the inside of the electric sliding chute (72), and the other side, away from the electric sliding chute (72), of the air bag (74) is fixedly connected to the inner side wall of the electric sliding chute (71).
4. The method for using the wafer thinning equipment based on the claims 1-3 is characterized by comprising the following steps:
firstly, placing a wafer on the top of a turntable (10), and then starting a clamping mechanism (7) to clamp and purge the wafer;
after the wafer is clamped, the electric lifting plate (4) can be started to drive the grinding mechanism (5) and the liquid pumping mechanism (6) to move downwards;
until the bottom of the grinding mechanism (5) is attached to the top of the wafer, the liquid pumping mechanism (6) is assembled;
then, the grinding mechanism (5) can be started to thin the top of the wafer, and the rotating motor (9) is started to drive the turntable (10) while thinning the top of the wafer, so that the rotation directions of the wafer and the grinding mechanism (5) are opposite;
the grinding mechanism (5) drives the liquid suction mechanism (6) to work, so that the liquid suction assembly (8) sucks waste liquid generated by grinding the grinding mechanism (5) into the liquid suction assembly (8) under the action of the liquid suction mechanism (6);
in the thinning process, the electric lifting plate (4) slowly moves downwards until the electric lifting plate is ground to a specified position;
after the thinning is finished, waste liquid sucked in the liquid suction assembly (8) can be discharged, so that the grinding mechanism (5) and the clamping mechanism (7) are reset, and the thinned wafer is taken down.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115284163A (en) * | 2022-09-05 | 2022-11-04 | 黄树生 | Full-automatic wafer grinding machine |
| CN116276406B (en) * | 2023-05-23 | 2023-08-11 | 江苏爱矽半导体科技有限公司 | Semiconductor wafer polishing device for removing annular oxide layer |
| CN116652725B (en) * | 2023-07-21 | 2023-10-27 | 苏州博宏源机械制造有限公司 | Wafer grinding and polishing equipment |
| CN117124163B (en) * | 2023-10-27 | 2024-01-26 | 南通恒锐半导体有限公司 | IGBT wafer back polishing machine |
| CN117161950B (en) * | 2023-11-02 | 2023-12-26 | 南通海鹰机电集团有限公司 | Polishing device for manufacturing pressure vessel |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN202592202U (en) * | 2012-05-09 | 2012-12-12 | 中芯国际集成电路制造(上海)有限公司 | Grinding head with grinding fluid supply function and grinding device |
| CN202668308U (en) * | 2012-05-30 | 2013-01-16 | 昆山明本光电有限公司 | Polisher |
| CN102873647B (en) * | 2012-11-01 | 2015-03-04 | 昆山市大金机械设备厂 | Polishing plate |
| US10105812B2 (en) * | 2014-07-17 | 2018-10-23 | Applied Materials, Inc. | Polishing pad configuration and polishing pad support |
| CN106808380B (en) * | 2017-03-29 | 2023-07-28 | 中国工程物理研究院激光聚变研究中心 | Numerical control polishing disc and polishing process |
| CN107180778A (en) * | 2017-07-17 | 2017-09-19 | 广东工业大学 | A kind of wafer jig for capillary processing |
| CN207326708U (en) * | 2017-08-18 | 2018-05-08 | 福建兆元光电有限公司 | A kind of efficient soft throwing machine |
| CN107775506A (en) * | 2017-09-28 | 2018-03-09 | 瑞声科技(新加坡)有限公司 | Polishing disk |
| CN209466076U (en) * | 2019-01-22 | 2019-10-08 | 深圳市鑫胜都模具科技有限公司 | A kind of burr remover produced for forming mold base |
| CN111002205B (en) * | 2019-12-19 | 2022-02-01 | 山东欧思特新材料科技有限公司 | Wafer polishing equipment for semiconductor |
| CN214054716U (en) * | 2020-11-13 | 2021-08-27 | 秦山英 | Be used for miniature lens to grind processingequipment angle adjusting disk |
| CN215317544U (en) * | 2021-03-15 | 2021-12-28 | 常州森美特微电子有限公司 | Wafer thinning equipment |
| CN214559980U (en) * | 2021-04-01 | 2021-11-02 | 东莞市译码半导体有限公司 | Grinding device for semiconductor plane |
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