CN114833494B - Process reactive solder for realizing low-temperature welding high-temperature service and joint preparation method - Google Patents
Process reactive solder for realizing low-temperature welding high-temperature service and joint preparation method Download PDFInfo
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- CN114833494B CN114833494B CN202210532550.2A CN202210532550A CN114833494B CN 114833494 B CN114833494 B CN 114833494B CN 202210532550 A CN202210532550 A CN 202210532550A CN 114833494 B CN114833494 B CN 114833494B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Abstract
The invention discloses a method for preparing reactive solder and a joint in a process of realizing low-temperature welding high-temperature service, wherein the method for preparing the solder comprises the following steps: the method comprises the following steps: preparing metal powder with the diameter of 100nm-50 mu m as reaction powder by a mechanical crushing method, a gas phase synthesis method or a liquid phase synthesis method; step two: mixing the reaction powder prepared in the step one with a dispersant, a binder, a diluent and a soldering flux to obtain a reaction paste; the reaction paste comprises, by weight, 80-90 parts of reaction powder, 2-8 parts of a dispersant, 2-8 parts of a binder, 2-8 parts of a diluent and 2-8 parts of a soldering flux; step three: and (3) mixing the reaction paste prepared in the second step with the existing SnBi eutectic soldering paste to form mixed soldering paste, namely filling the SnBi-based solder with micro-nano metal particles, wherein the mass percentage of the reaction powder in the mixed soldering paste is 3-30%. The melting temperature of the solder is similar to that of SnBi solder, and the soldering can use a process curve which is close to the temperature of the SnBi solder.
Description
Technical Field
The invention belongs to the technical field of electronic packaging interconnection, relates to an electronic component, a module packaging and interconnection method, and particularly relates to a process reactive solder for realizing low-temperature welding high-temperature service and a joint preparation method.
Background
The electronic packaging micro-interconnection technology is one of the core technologies for packaging various electronic components, modules and assemblies. With the continuous rising of the high-power and high-density packaging requirements and indexes of electronic components, modules and assemblies in the electronic industry, the advanced packaging manufacturing fields such as three-dimensional packaging, laminated packaging, system packaging and the like need multiple and multistage interconnection welding, and welding materials with various melting points are also needed. High lead (Pb 90Sn10, pb95Sn10, etc.) and gold tin solder (Au 80Sn 20) are mostly adopted at 280-310 ℃; tin-lead (Sn 63Pb 37) and tin-silver-copper solder (Sn96.5Ag3Cu0.5, etc.) are used at 180-240 deg.C; however, the tin bismuth eutectic (Sn 57Bi43, melting point 149 ℃) solder currently used between 150 and 170 has serious problems. Firstly, after the SnBi solder is melted and welded, bi is seriously segregated and gathered in a crystal boundary, so that an interconnection joint is very fragile; secondly, the melting point of the SnBi eutectic solder is only 149 ℃, and the working temperature does not exceed 70 ℃. Therefore, the temperature resistance and the mechanical strength are the links with the lowest reliability in the whole electronic module, and the reliability of the whole module is reduced to a very low level.
In order to solve the above problems, a method of adding nanoparticles (nanometal, nanoceramic, carbon nanotube, etc.) to the SnBi alloy solder has appeared, and it is desired to improve the strength of the joint by the dispersion strengthening effect of the nanoparticles on the SnBi solder alloy. However, because the fusion of the nano particles and SnBi is not good, the nano particles are easy to float out in the welding process, and air holes are generated at the same time, so that the strengthening effect is not realized, and the negative effect is caused. Meanwhile, the solder matrix still keeps the SnBi eutectic composition, the melting point of the solder matrix is not increased, the segregation of Bi is not changed, and the defects of low service temperature and low strength still exist.
Disclosure of Invention
In order to solve the problems, the invention discloses a process reactive solder for realizing low-temperature welding high-temperature service and a joint preparation method. In the brazing process, bi and micro-nano metal particles react strongly to form stable intermetallic compounds in the molten solder in a dispersion distribution manner, and a compact and high-strength welding spot is formed after solidification. Meanwhile, most Bi and micro-nano metal particles form intermetallic compounds, so that the segregation of Bi in a crystal boundary can not occur after a welding spot is solidified, and the strength is further improved; in addition, the Sn Bi eutectic crystal of the substrate is changed into the Sn-rich solid solution containing a small amount of Bi, the melting point of the Sn-rich solid solution is close to the melting point (237 ℃) of pure Sn, the service temperature can be increased to above 140 ℃, and the Sn-rich solid solution is increased by nearly 1 time compared with SnBi.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a method for preparing reactive solder in the process of realizing low-temperature welding high-temperature service comprises the following steps:
the method comprises the following steps: preparing metal powder with the diameter of 100nm-50 μm as reaction powder by a mechanical crushing method, a gas phase synthesis method or a liquid phase synthesis method;
step two: mixing the reaction powder prepared in the step one with a dispersant, a binder, a diluent and a soldering flux to form a reaction paste; the reaction paste comprises, by weight, 80-90 parts of reaction powder, 2-8 parts of a dispersant, 2-8 parts of a binder, 2-8 parts of a diluent and 2-8 parts of a soldering flux;
step three: and (3) mixing the reaction paste prepared in the second step with the existing SnBi eutectic soldering paste to form mixed soldering paste, namely filling the SnBi-based solder with micro-nano metal particles, wherein the mass percentage of the reaction powder in the mixed soldering paste is 3-30%.
Further, in the first step, the metal powder is selected from one of Zr, pt, te, ca, ce, cs, gd, I, la, mg, nd, pd and Au.
Further, in the first step, the metal powder is preferably Zr.
Further, the process of preparing the mixed soldering paste in the third step adopts a method of ultrasonic oscillation, manual stirring or mechanical stirring.
The process reactive solder for realizing low-temperature welding high-temperature service is a SnBi-based solder filled with micro-nano metal particles prepared by the method.
The method for realizing the joint connection of the electronic component in low-temperature welding and high-temperature service by filling the SnBi-based solder with the micro-nano metal particles comprises the following steps:
firstly, filling the obtained micro-nano metal particles with SnBi-based solder by adopting a screen printing or dispensing method, placing the SnBi-based solder on a substrate, finishing the alignment process of a component to be welded, and applying pressure of 1-20Mpa;
and then putting the obtained system into a reflow furnace, and performing a preheating stage, a heat preservation stage, a reflow stage and a cooling stage to finish volatilization of organic matters, reaction of metal powder and Bi in SnBi soldering paste, wetting and interface reaction of mixed soldering paste alloy and a bonding pad.
Further, the heating rate of the preheating stage is 1 to 5 ℃/s; the heating rate of the heat preservation stage is 1 to 3 ℃/s, and the time duration is 40 to 110s; the peak temperature in the reflow stage is 30 to 60 ℃ above the melting point of the matrix SnBi eutectic solder paste; the cooling rate of the cooling stage is 1 to 6 ℃/s.
The invention has the beneficial effects that:
the micro-nano metal particles Xx are mixed in the SnBi eutectic solder, the connection and the assembly of a microelectronic device or a component can be realized under the process condition compatible with the low-temperature reflow soldering of the SnBi solder paste, the micro-nano metal particles Xx and Bi in the solder alloy gradually complete the reaction in the reflow soldering process to generate a Bi-Xx intermetallic compound, and strong Bi is segregated to the grain boundary when the solder is solidified, thereby effectively inhibiting the brittleness of a welding point. Due to the generation of Bi-Xx intermetallic compounds, bi in a solder matrix is reduced, the melting point of the matrix is increased, and the service temperature of a welding spot is higher than that of SnBi eutectic and is close to or even higher than that of SnPb and SnAgCu soldering paste. In addition, the dispersed Bi-Xx intermetallic compound improves the strength of the solder alloy and the joint.
Drawings
Fig. 1 is a schematic diagram of the process and structure of the reaction powder micro-nano metal particle filled Sn-based solder paste structure and interconnect joint formation, wherein: (1) The micro-nano metal particles are filled with Sn-based solder paste; (2) coating/assembling/welding structures; and (3) forming a joint structure after solidification.
Detailed Description
The present invention will be further illustrated with reference to the accompanying drawings and specific embodiments, which are to be understood as merely illustrative of the invention and not as limiting the scope of the invention.
Example 1:
firstly, preparing a micro-nano metal particle filled SnBi-based solder:
as shown in fig. 1, the preparation method of the SnBi-based solder filled with micro-nano-scale metal particles comprises the following steps:
the method comprises the following steps: preparing Zr metal particles with the diameter of about 20 mu m;
step two: mixing the micron-sized metal particles with a proper amount of dispersant methyl amyl alcohol, a binder alpha-terpineol, a diluent terpineol and soldering flux rosin, wherein the mixing mass ratio is 80;
step three: mixing the metal particle mixture with Sn43at.% Bi solder paste, wherein the metal particle mixture accounts for 30% of the total mass of the final solder paste mixture;
step four: performing ultrasonic oscillation at 200W for 80min to uniformly disperse the metal particles in the mixture prepared in the third step to prepare micron-sized metal particles filled with Sn-based solder paste;
the method for realizing the joint connection of the electronic component in low-temperature welding high-temperature service by filling the SnBi-based solder with the micro-nano metal particles comprises the following steps:
step five: placing the solder paste filled with the Sn-based solder by the micron-sized metal particles on a substrate by adopting a screen printing method to finish the alignment of a pad of a component to be welded and a pad of the substrate, and applying 8MPa pressure;
step six: the above system was placed in a reflow oven and the following actions were continued: heating to 80-120 ℃ at the speed of 2-5 ℃/s to complete a preheating stage, completing a heat preservation stage of 40-60s at the heating rate of 1 ℃/s, rapidly heating to the peak temperature (30-60 ℃ above the melting point (149 ℃) of the SnBi eutectic alloy) at the rate of 1-3 ℃/s, preserving heat to realize a reflow stage (50-80s is needed), and finally cooling to below 80 ℃ at the rate of 1-4 ℃/s. This soldering process is consistent with that of conventional Sn-Bi solder, but the melting point of the soldered joint alloy is raised by 51 deg.C (200-149).
In this example, zr was used as the metal particles.
Example 2:
the method for forming the interconnection joint of the SnBi eutectic solder paste filled with the nano metal particles comprises the following steps:
the method comprises the following steps: preparing Pt metal particles with the diameter of about 100 nm;
step two: mixing the nano metal particles with proper amounts of dispersing agent triethylhexyl phosphoric acid, adhesive alpha-terpineol, diluent alcohol and soldering flux rosin, wherein the mixing ratio is 85;
step three: mixing the nanoscale metal particle mixture with Sn47at.% Bi solder paste, wherein the metal particle mixture accounts for 10% of the total mass of the final solder paste mixture;
step four: performing ultrasonic oscillation at 150W for 120min to uniformly disperse the metal particles in the mixture prepared in the third step to prepare the nano-scale Pt metal particles filled Sn-based solder paste;
step five: filling the Sn-based solder paste with the nanoscale Pt metal particles by adopting a dispensing method to complete alignment of a pad of a component to be welded and a pad of a substrate, and applying 15MPa pressure;
step six: the above system was placed in a reflow oven and the following actions were continued: heating to 110 ℃ at the speed of 2-4 ℃/s to complete a preheating stage, completing a heat preservation stage of 80s at the heating rate of 1 ℃/s, rapidly heating to the peak temperature (30-60 ℃ above the melting point (149 ℃) of the Sn47at.% Bi eutectic alloy) at the speed of 3 ℃/s, preserving heat to realize a reflow stage (70 s is needed), and finally cooling to below 80 ℃ at the speed of 3 ℃/s. This soldering process is consistent with that of conventional Sn-Bi solder, but the melting point of the soldered joint alloy is raised by 51 deg.C (200-149 deg.C).
The metal particles in this example were Pt.
The above-described embodiments are merely illustrative of the present patent and do not limit the scope of the patent, which is defined by the claims, and further modifications and equivalents thereof may be suggested to those skilled in the art and are included within the spirit and purview of this patent.
Claims (6)
1. A preparation method of reactive solder in a process of realizing low-temperature welding high-temperature service is characterized by comprising the following steps:
the method comprises the following steps: preparing metal powder with the diameter of 100nm-50 μm as reaction powder by a mechanical crushing method, a gas phase synthesis method or a liquid phase synthesis method;
step two: mixing the reaction powder prepared in the step one with a dispersant, a binder, a diluent and a soldering flux to obtain a reaction paste; the reaction paste comprises, by weight, 80-90 parts of reaction powder, 2-8 parts of a dispersant, 2-8 parts of a binder, 2-8 parts of a diluent and 2-8 parts of a soldering flux;
step three: mixing the reaction paste prepared in the second step with SnBi eutectic soldering paste to form mixed soldering paste, namely filling the SnBi-based soldering paste with micro-nano metal particles, wherein the mass percent of the reaction powder in the mixed soldering paste is 3-30%;
in the first step, the metal powder is Zr.
2. The method for preparing the process-reactive solder for realizing the low-temperature welding high-temperature service according to claim 1, wherein in the step one, the metal powder can also be one of Pt, te, ca, ce, cs, gd, la, mg, nd, pd and Au.
3. The method for preparing the process reactive solder for realizing the low-temperature welding high-temperature service according to claim 1, wherein the process of preparing the mixed solder paste in the third step adopts a method of ultrasonic oscillation, manual stirring or mechanical stirring.
4. A process reactive solder for realizing low-temperature welding high-temperature service is characterized in that the solder is a SnBi-based solder filled with micro-nano metal particles prepared by the preparation method of any one of claims 1 to 3.
5. A method of joining a joint for low temperature soldering of an electronic component for high temperature service using the solder of claim 4, the method comprising the steps of:
firstly, filling the obtained micro-nano metal particles with SnBi-based solder by adopting a screen printing or dispensing method, placing the SnBi-based solder on a substrate, finishing the alignment process of a component to be welded, and applying pressure of 1-20Mpa;
and then putting the obtained system into a reflow furnace, and completing volatilization of organic matters, reaction of metal powder and Bi in SnBi soldering paste, wetting and interface reaction of mixed soldering paste alloy and a bonding pad through a preheating stage, a heat preservation stage, a reflow stage and a cooling stage.
6. The joint connection method according to claim 5, wherein the temperature rise rate of the preheating stage is 1 to 5 ℃/s; the heating rate of the heat preservation stage is 1 to 3 ℃/s, and the time duration is 40 to 110s; the peak temperature in the reflow stage is 30 to 60 ℃ above the melting point of the matrix SnBi eutectic solder paste; the cooling rate of the cooling stage is 1 to 6 ℃/s.
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| CN105014255A (en) * | 2015-08-11 | 2015-11-04 | 哈尔滨职业技术学院 | SnBiNi low-temperature lead-free brazing filler metal and manufacturing method thereof |
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| JP2012523091A (en) * | 2009-04-02 | 2012-09-27 | オーメット サーキッツ インク | Conductive composition comprising mixed alloy filler |
| CN102896435B (en) * | 2011-07-28 | 2015-01-21 | 北京有色金属研究总院 | In-suit reaction type high-temperature lead-free solder paste |
| WO2014115798A1 (en) * | 2013-01-28 | 2014-07-31 | 株式会社村田製作所 | Solder bump formation method and solder bump |
| WO2014129006A1 (en) * | 2013-02-21 | 2014-08-28 | 株式会社村田製作所 | Curing agent, heat-curable resin composition containing said curing agent, joining method using said composition, and method for controlling curing temperature of heat-curable resin |
| CN104759725B (en) * | 2015-04-17 | 2016-10-05 | 哈尔滨工业大学 | A kind of method using micro/nano level metallic particles filling Sn parent metal to realize electronic building brick High-temperature Packaging |
| CN110961826B (en) * | 2019-12-25 | 2021-03-12 | 哈尔滨工业大学 | Preparation method of nano IMC (internal mold decoration) uniformly-reinforced tin-based alloy joint |
| CN112643241A (en) * | 2020-12-10 | 2021-04-13 | 昆明理工大学 | Sn-Bi-Cu-Ag-Ni-Sb low-temperature high-mechanical-property lead-free solder alloy |
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| CN105014255A (en) * | 2015-08-11 | 2015-11-04 | 哈尔滨职业技术学院 | SnBiNi low-temperature lead-free brazing filler metal and manufacturing method thereof |
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