CN114824805B - Built-in antenna applied to carrier communication module - Google Patents
Built-in antenna applied to carrier communication module Download PDFInfo
- Publication number
- CN114824805B CN114824805B CN202210485491.8A CN202210485491A CN114824805B CN 114824805 B CN114824805 B CN 114824805B CN 202210485491 A CN202210485491 A CN 202210485491A CN 114824805 B CN114824805 B CN 114824805B
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- Prior art keywords
- antenna
- built
- microstrip
- communication module
- carrier communication
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- 230000005855 radiation Effects 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 11
- 230000000694 effects Effects 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims 1
- 238000004088 simulation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/48—Earthing means; Earth screens; Counterpoises
Abstract
The invention relates to the technical field of antennas and wireless communication, and discloses a built-in antenna applied to a carrier communication module. And placing microstrip radiation patches on the front and back surfaces of the PCB dielectric substrate, connecting the microstrip radiation patches through metallized via holes to form a PCB spiral antenna main body, and enabling the antenna to resonate in a target frequency band by adjusting the length and the width of the microstrip radiation patches on two sides of the PCB dielectric substrate. The antenna body is connected with the metal ground through a microstrip feeder line, and a symmetrical C-shaped defected ground structure is etched on the metal ground. The invention mainly solves the problems of narrow bandwidth and unstable performance of the built-in low-frequency antenna, expands the bandwidth of the built-in antenna, improves the stability of the built-in antenna, and can realize miniaturization of the antenna.
Description
Technical Field
The present invention relates to the field of antennas and wireless communications technologies, and in particular, to a built-in antenna applied to a carrier communication module.
Background
At present, the national power grid has been planned to gradually switch from high-speed power line carrier communication to a dual-mode communication mode of high-speed power line carrier communication plus wireless communication, so as to promote the access threshold of a communication module, increase the applicable capability of the low-voltage local communication technology, and expand the application scenario of the low-voltage local communication technical scheme, such as: photovoltaic three, terminal sensing equipment access, electric vehicle charging stake etc.. The wireless communication is used as a new communication mode, so that the dependence of the power line carrier communication on a power line is solved, and the requirement that communication is not interrupted when the line fails can be met.
The performance of an antenna as a core device in a wireless communication system directly affects the quality of wireless communication. The built-in antenna of the carrier communication module is generally a PCB board antenna or a spring antenna, and the performance is unstable due to the limitation of application environment. The invention provides a built-in antenna applied to a carrier communication module, which is characterized in that wires are arranged on two sides of a PCB dielectric substrate, microstrip radiation patches on two sides of the PCB dielectric substrate are connected in a punching mode, a defective ground structure is applied to a grounding plate, and a slow wave effect and a band-stop effect of the defective ground structure are utilized to influence a current path on a metal ground, so that the bandwidth of the antenna can be expanded, the stability of the antenna is improved, and the miniaturization of the antenna is realized.
Disclosure of Invention
Aiming at the defects of narrow bandwidth and unstable performance of the existing built-in antenna, the invention provides the built-in antenna applied to a carrier communication module.
The invention solves the problems by the following technical proposal:
the built-in antenna applied to the carrier communication module is characterized by comprising a PCB dielectric substrate, a microstrip radiation patch, a microstrip feeder line, a metallized via hole, a C-shaped defected ground structure and a metal ground. The microstrip radiation patch, the microstrip feeder, the C-shaped defected ground structure and the metal ground are both arranged on the PCB dielectric substrate. The microstrip radiation patch comprises a microstrip radiation patch placed on the front surface of the PCB dielectric substrate and a microstrip radiation patch placed on the back surface of the PCB dielectric substrate, and the microstrip radiation patches are connected through the metallized via holes.
Preferably, the front microstrip radiation patch and the back microstrip radiation patch are arranged in a spiral structure on two sides of the PCB dielectric substrate.
Preferably, the C-shaped defected ground structure is symmetrically placed on the metal ground.
Preferably, the length of the front microstrip radiation patch is 5-8mm, the width of the front microstrip radiation patch is 0.55-1.55mm, the length of the back microstrip radiation patch is 6-10mm, and the width of the back microstrip radiation patch is 0.55-1.55mm.
Preferably, the double-side length of the C-shaped defect ground structure is 6-8mm, and the single-side length is 5-8mm.
Preferably, the C-shaped defected ground structure is symmetrically placed at a position of 6-10mm from the center of the metal ground.
Preferably, the included angle between the front microstrip radiation patch and the bottom edge of the PCB dielectric substrate is 5-30 degrees, and the included angle between the back microstrip radiation patch and the bottom edge of the PCB dielectric substrate is 10-40 degrees.
Compared with the prior art, the invention has the advantages that: the antenna can be integrated on a circuit board, double-sided wiring can effectively shorten the size of the antenna, and space is reasonably utilized. The defect ground structure is introduced, the band-stop effect and the slow wave effect generated by the structure are utilized, the symmetrical C-shaped structure is etched on the ground plate, the current distribution on the ground plate is effectively changed, and a new current path is formed, so that the equivalent inductance and the equivalent capacitance on the ground plate are changed, the bandwidth of the antenna at a target frequency point can be widened, and the antenna performance is more stable.
Drawings
Fig. 1 is a schematic structural diagram of a built-in antenna applied to a carrier communication module.
Fig. 2 is a front plan view of a built-in antenna applied to a carrier communication module.
Fig. 3 is a rear plan view of a built-in antenna applied to a carrier communication module.
Fig. 4 is a diagram of simulation results of return loss of a built-in antenna applied to a carrier communication module.
Fig. 5 is a diagram of simulation results of voltage standing wave ratio of a built-in antenna applied to a carrier communication module.
Fig. 6 is a simulation result of a gain pattern applied to a built-in antenna of a carrier communication module.
Description of the embodiments
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
The frequency band required by the national power grid for wireless communication is 470MHz-510MHz, the PCB dielectric substrate is made of FR4 material with a dielectric constant of 4.4, the thickness is 1.6mm, the copper-clad thickness is 0.035mm, the wiring width is 1mm, and the effective dielectric constant is 2.97. The corresponding wavelengths in the range 470MHz to 510MHz are 588mm to 638mm. The wavelength on the PCB substrate is 340mm-370mm, and the average value of the two is 484mm, and the corresponding quarter wavelength is 121mm. The PCB spiral antenna is arranged on the top layer and the bottom layer of the PCB substrate, the diameter of the antenna coil is related to the working bandwidth, and the theoretical radius of the coil can be found to be 7mm according to the relation between the quality factor of the antenna and the bandwidth and efficiency.
As shown in fig. 1, a built-in antenna applied to a carrier communication module has a structure including a PCB dielectric substrate 1, a metal ground 2, a c-shaped defected ground structure 3, a microstrip feed line 4, a metallized via 5, a front microstrip radiation patch 6 and a back microstrip radiation patch 7. The front microstrip radiation patch 6 and the back microstrip radiation patch 7 are arranged on the PCB dielectric substrate 1, the microstrip feeder 4 and the grounding plate 2 are arranged at the left side of the PCB dielectric substrate 1, the front microstrip radiation patch 6 and the back microstrip radiation patch 7 are connected through the metallized via hole 5, and the C-shaped defected ground structure 3 is symmetrically arranged on the grounding plate 2. The microstrip feed line 4 connects the front microstrip radiating patch 6 and the ground plate 2.
As shown in figure 2, the microstrip radiating patches on the front side are arranged in parallel, the distance is 2-5mm, and the included angle between the microstrip radiating patches and the bottom edge of the PCB dielectric substrate is 5-30 degrees.
As shown in FIG. 3, the microstrip radiating patches on the back are arranged in parallel, the distance is 2-5mm, and the included angle between the microstrip radiating patches and the bottom edge of the PCB dielectric substrate is 10-40 degrees.
Embodiments of the present invention are further described by way of specific examples in connection with software simulations.
Fig. 4 is a graph of simulation results of return loss of a built-in antenna applied to a carrier communication module, the return loss of the antenna being less than-6 dB in a frequency band of 450MHz-510 MHz. Fig. 5 is a diagram of simulation results of a voltage standing wave ratio of a built-in antenna applied to a carrier communication module, wherein the standing wave ratio of the antenna at 480MHz of a resonance frequency point is 1.52. Fig. 6 is a simulation result of a gain pattern of a built-in antenna applied to a carrier communication module, and it can be seen that the radiation capability of the antenna is good.
Compared with the existing built-in antenna, the invention has the advantages of small size, large bandwidth, stable performance and easy integration.
The above embodiments are illustrative of the specific embodiments of the present invention, and not restrictive, and various changes and modifications may be made by those skilled in the relevant art without departing from the spirit and scope of the invention, so that all such equivalent embodiments are intended to be within the scope of the invention.
Claims (5)
1. The built-in antenna applied to the carrier communication module is characterized by comprising a PCB dielectric substrate, a microstrip radiation patch, a microstrip feeder, a metallized via hole, a C-type defected ground structure and a metal ground; the microstrip radiation patch, the microstrip feeder, the C-shaped defected ground structure and the metal ground are both arranged on the PCB dielectric substrate; the microstrip radiation patch comprises a microstrip radiation patch placed on the front surface of the PCB dielectric substrate and a microstrip radiation patch placed on the back surface of the PCB dielectric substrate, and the microstrip radiation patches are connected through the metallized via holes; the front microstrip radiation patch and the back microstrip radiation patch are arranged on two sides of the PCB dielectric substrate in a spiral structure.
2. A built-in antenna for a carrier communication module according to claim 1, wherein said C-shaped defected ground structure is symmetrically placed on a metal ground.
3. A built-in antenna for a carrier communication module according to claim 1, wherein said built-in antenna is integrated on a circuit board for a compact design.
4. A built-in antenna for a carrier communication module according to claim 1, wherein said built-in antenna is double-sided wiring effective to shorten the size of the antenna.
5. The built-in antenna for a carrier communication module according to claim 1, wherein the built-in antenna introduces a C-type defected ground structure, and uses a band-stop effect and a slow wave effect generated by the built-in antenna to effectively change current distribution on a ground plate by etching a symmetrical C-type structure on the ground plate to form a new current path, thereby changing equivalent inductance and equivalent capacitance on the ground plate and widening bandwidth of the antenna at a target frequency point.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202210485491.8A CN114824805B (en) | 2022-05-06 | 2022-05-06 | Built-in antenna applied to carrier communication module |
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CN202210485491.8A CN114824805B (en) | 2022-05-06 | 2022-05-06 | Built-in antenna applied to carrier communication module |
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CN114824805A CN114824805A (en) | 2022-07-29 |
CN114824805B true CN114824805B (en) | 2024-02-27 |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1828999A (en) * | 2006-03-24 | 2006-09-06 | 厦门大学 | GSM three frequency microstrip antenna |
CN104701623A (en) * | 2015-03-25 | 2015-06-10 | 电子科技大学 | High-isolation MIMO (Multiple Input Multiple Output) antenna |
CN105071030A (en) * | 2015-07-17 | 2015-11-18 | 安徽建筑大学 | Defected ground structure (DGS) asymmetrical coplanar waveguide type tri-band antenna |
CN205583134U (en) * | 2016-04-29 | 2016-09-14 | 东莞信恒电子科技有限公司 | Three trapped wave ultra -wideband antenna on defect ground |
CN108336491A (en) * | 2018-04-02 | 2018-07-27 | 安徽大学 | Dual-band and dual-polarization laminated patch antenna and its design method based on microstrip balun feed |
CN108923125A (en) * | 2018-06-27 | 2018-11-30 | 河南安伏众电子科技有限公司 | Low radar scattering cross section micro-strip paster antenna based on frequency-selective surfaces |
CN112688076A (en) * | 2020-12-22 | 2021-04-20 | 北京邮电大学 | Planar multi-port multi-band common-ground small-spacing high-isolation MIMO antenna |
CN113937488A (en) * | 2021-09-11 | 2022-01-14 | 中国人民武装警察部队工程大学 | High-isolation low-profile broadband base station antenna, control method and application |
-
2022
- 2022-05-06 CN CN202210485491.8A patent/CN114824805B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1828999A (en) * | 2006-03-24 | 2006-09-06 | 厦门大学 | GSM three frequency microstrip antenna |
CN104701623A (en) * | 2015-03-25 | 2015-06-10 | 电子科技大学 | High-isolation MIMO (Multiple Input Multiple Output) antenna |
CN105071030A (en) * | 2015-07-17 | 2015-11-18 | 安徽建筑大学 | Defected ground structure (DGS) asymmetrical coplanar waveguide type tri-band antenna |
CN205583134U (en) * | 2016-04-29 | 2016-09-14 | 东莞信恒电子科技有限公司 | Three trapped wave ultra -wideband antenna on defect ground |
CN108336491A (en) * | 2018-04-02 | 2018-07-27 | 安徽大学 | Dual-band and dual-polarization laminated patch antenna and its design method based on microstrip balun feed |
CN108923125A (en) * | 2018-06-27 | 2018-11-30 | 河南安伏众电子科技有限公司 | Low radar scattering cross section micro-strip paster antenna based on frequency-selective surfaces |
CN112688076A (en) * | 2020-12-22 | 2021-04-20 | 北京邮电大学 | Planar multi-port multi-band common-ground small-spacing high-isolation MIMO antenna |
CN113937488A (en) * | 2021-09-11 | 2022-01-14 | 中国人民武装警察部队工程大学 | High-isolation low-profile broadband base station antenna, control method and application |
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CN114824805A (en) | 2022-07-29 |
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