CN114824035B - LED display module and manufacturing method thereof - Google Patents
LED display module and manufacturing method thereof Download PDFInfo
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- CN114824035B CN114824035B CN202110071133.8A CN202110071133A CN114824035B CN 114824035 B CN114824035 B CN 114824035B CN 202110071133 A CN202110071133 A CN 202110071133A CN 114824035 B CN114824035 B CN 114824035B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Abstract
The application discloses an LED display module and a manufacturing method thereof, wherein the LED display module comprises: a substrate provided with an LED chip; an ink encapsulation layer covering the substrate and the LED chip; the surface roughness Ra of the ink packaging layer on the side opposite to the substrate is less than 1 micron, and Rz is less than 2 microns. According to the LED display module and the manufacturing method thereof, the optical principle is fully utilized, the ink color consistency of the LED display module can be improved by controlling the roughness of the ink color packaging layer, the ink color height consistency of the upper screen can be realized without picking a piece, meanwhile, the display color difference at different angles is eliminated, and the display module with high contrast is presented.
Description
Technical Field
The application belongs to the technical field of display, and particularly relates to an LED display module and a manufacturing method thereof.
Background
The technology of LED indoor display application is vigorously developed, and more or less technical bottlenecks exist in the current display technologies such as projection, LCD and OLED. The Mini & micro LED display has been paid attention to as a novel small-space high-definition display technology, and especially in indoor large-screen high-definition display applications, such as command centers, conference centers, security monitoring, household large-screen televisions and other application scenes.
The manufacturing of Mini & micro LED small-space display screen module mainly has three technical schemes: 1. SMD; 2. IMD (2 in1, 4in1, etc.); 3. chip On Board (COB). The COB is more hot because of good display effect, high integration level, simple structure and micro-spacing (the current IMD and SMD are difficult to be below pitch 1). The existing COB module has 3 main defects: 1. the large-scale display screen has the advantages that a large amount of manpower is required to be wasted before the screen is arranged, the problem of poor overall ink consistency exists even if a large display screen composed of modules with good ink consistency is selected, and the problems of ink color difference, white frames, black frames and the like are particularly solved at different positions, at different visual angles and under different light rays; 2. the chromatic aberration exists between the front surface and the side surface, which is mainly caused by the non-uniform light emitting effect of the package body; 3. the display screens of the current computer, the mobile phone, the spliced LCD screen and the like are in a mirror mode, namely images outside the boundary can be clearly seen through the display screen, and the display screens can be used as mirror surfaces.
In the actual production process, the inconsistent ink color of the LED display module brings huge loss to enterprises, so that a large amount of manpower is needed for sorting, the manpower cost is greatly increased, and the production efficiency is reduced; meanwhile, the inconsistent ink colors easily cause the difference of display screen products, which is unfavorable for market popularization.
In the prior art, the Chinese patent with the publication number of CN112018226A and the application name of a display module and a manufacturing method thereof disclose similar technologies, but the technology of the patent still has some defects, and although the consistency of ink colors is greatly improved, the technology still has the problem of certain inconsistent ink colors. Meanwhile, although part of layers in the packaging structure are ground or polished in the prior art, the method is a common practice in the industry, and has no substantial improvement in achieving the consistency of all ink colors.
In view of this, the present inventors have made intensive studies to overcome the technical problems that have long plagued the enterprise.
Disclosure of Invention
The application aims to provide an LED display module and a manufacturing method thereof, which are used for solving or at least partially solving the problem of inconsistent ink colors.
To achieve the purpose, the application adopts the following technical scheme:
in a first aspect, there is provided an LED display module comprising:
a substrate provided with an LED chip;
an ink packaging layer for shading and packaging the LED chip, wherein the ink packaging layer covers the substrate and the LED chip; the surface roughness Ra of the ink packaging layer on the side opposite to the substrate is less than 1 micron, and Rz is less than 2 microns.
Optionally, the method further comprises:
the imaging layer is covered on the ink packaging layer, and the surface roughness Ra of one side of the imaging layer, which faces away from the ink packaging layer, is less than 2 microns, and Rz is less than 4 microns.
Optionally, the ink encapsulation layer comprises a mixture of black pigment and at least one of epoxy, silicone, and polyurethane;
the ink packaging layer is added with diffusion powder and extinction powder;
the black pigment includes at least one of graphite powder, carbon powder, iron black and black resin.
Optionally, the imaging layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel, and polyurethane with a diffusion powder or matting powder;
the thickness of the imaging layer is 1-200 micrometers, the imaging layer is a transparent layer, and the transparency is 50% -100%.
In a second aspect, a method for manufacturing an LED display module is provided, including:
forming an ink packaging layer for shading and packaging the LED chips on a substrate and the LED chips on the substrate;
flattening the surface of the ink color packaging layer; the surface roughness Ra of the ink packaging layer on the side opposite to the substrate is less than 1 micron, and Rz is less than 2 microns.
Optionally, the ink encapsulation layer comprises a mixture of black pigment and at least one of epoxy, silicone, and polyurethane;
the ink packaging layer is added with diffusion powder and extinction powder;
the black pigment includes at least one of graphite powder, carbon powder, iron black and black resin.
Optionally, after the flattening treatment is performed on the surface of the ink color packaging layer, the method further includes:
forming an imaging layer on the ink packaging layer;
flattening the surface of the imaging layer; the surface roughness Ra of the side of the imaging layer, which faces away from the ink packaging layer, is less than 2 microns, and Rz is less than 4 microns.
Optionally, the imaging layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel, and polyurethane with a diffusion powder or matting powder;
the thickness of the imaging layer is 1-200 micrometers, the imaging layer is a transparent layer, and the transparency is 50% -100%.
Compared with the prior art, the embodiment of the application has the following beneficial effects:
according to the LED display module and the manufacturing method thereof provided by the embodiment of the application, the optical principle is fully utilized, the ink color consistency of the LED display module is improved by controlling the surface roughness of the ink color packaging layer, the ink color height consistency of the upper screen can be realized without picking a piece, meanwhile, the display color difference at different angles is eliminated, and the display module with high contrast is presented.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
The structures, proportions, sizes, etc. shown in the present specification are shown only for the purposes of illustration and description, and are not intended to limit the scope of the application, which is defined by the claims, so that any structural modifications, changes in proportions, or adjustments of sizes, which do not affect the efficacy or the achievement of the present application, should fall within the scope of the application.
Fig. 1 is a block diagram of an LED display module according to an embodiment of the present application;
fig. 2 is a flowchart of a method for manufacturing an LED display module according to an embodiment of the present application;
fig. 3 is a block diagram of an LED display module according to an embodiment of the present application;
fig. 4 is a block diagram of an LED display module according to an embodiment of the present application.
Illustration of:
10. a substrate; 11. an LED chip; 12. patterning the light blocking layer; 13. a black matrix; 40. an imaging layer; 50. an ink color encapsulation layer.
Detailed Description
In order to make the objects, features and advantages of the present application more obvious and understandable, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the embodiments described below are only some embodiments of the present application, not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1, the present embodiment provides an LED display module, which makes full use of the optical principle, and makes different black areas of the same display module continuously reflect inside by controlling the surface roughness, so that human eyes look more uniform, the consistency of ink colors of the LED display module is improved, the consistency of ink colors of the upper screen can be realized without picking a piece, and meanwhile, the display module with different angles, color differences, and high contrast, is eliminated.
Specifically, the LED display module includes a substrate 10, an LED chip 11 is flip-chip mounted on the substrate 10, and an ink encapsulation layer 50 for shielding light and encapsulating the LED chip 11 is coated on the substrate 10 and the LED chip 11.
The ink encapsulation layer 50 has a height higher than that of the LED chip 11.
Alternatively, the substrate 10 is a substrate of PCB, glass, ceramic or other material.
In this embodiment, in order to improve the consistency of the ink color of the LED display module, the surface of the ink color encapsulation layer 50 is flattened, so that the surface of the ink color encapsulation layer 50 facing away from the substrate 10 (i.e., the upper surface of the ink color encapsulation layer in fig. 1) is a mirror surface. Optionally, flattening treatment can be realized by adopting processes such as polishing, grinding or smooth release film pressing molding.
Furthermore, in order to enable the LED display module to have higher ink consistency, the roughness Ra of the mirror surface can be controlled to be less than 1 micron, and Rz is controlled to be less than 2 microns. As a preferred embodiment, the roughness Ra may be 0.5 microns or less, 0.1 microns or less, or 0.01 microns or less, and Rz may be 0.1 microns or less, 0.05 microns or less, or 0.02 microns or less, respectively.
It should be noted that, the ink color encapsulation layer 50 includes a mixture of at least one of epoxy resin, silica gel and polyurethane and black pigment; the ink color packaging layer 50 is added with diffusion powder and extinction powder; the black pigment includes at least one of graphite powder, carbon powder, iron black and black resin.
As a further aspect of this embodiment, the LED display module further includes an imaging layer 40 overlying the ink encapsulation layer 50. In the same way, the surface of the imaging layer 40 facing away from the ink encapsulation layer 30 may be made mirror by planarization, and the mirror roughness Ra < 2 μm and Rz < 4 μm may be controlled. As a preferred embodiment, the roughness Ra may be 1.5 microns or less, 0.5 microns or less, or 0.1 microns or less, and Rz may be 3 microns or less, 1 micron or 0.2 microns or less, respectively, to improve the ink color uniformity of the LED display module.
The imaging layer 40 includes a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel, and polyurethane, and a diffusion powder or matting powder. Optionally, imaging layer 40 has a thickness of 1-200 microns, imaging layer 40 is a transparent layer, and the transparency is 50% -100%. Alternatively, imaging layer 40 has a thickness of 1-100 microns. Further, the imaging layer 40 may include fingerprint prevention, bump prevention, electrostatic discharge prevention, and the like.
Referring to fig. 2, another embodiment of the present application provides a manufacturing method, which can manufacture the LED display module provided in the above embodiment. Specifically, the manufacturing method comprises the following steps:
s101, forming an ink packaging layer 50 for shading and packaging the LED chip 11 on the substrate 10 and the LED chip 11 on the substrate 10, wherein the ink packaging layer can be formed by spraying or film pressing and other processes; leveling the surface of the ink packaging layer 50; the surface of the ink packaging layer 50 facing away from the substrate 10 is a mirror surface, and the roughness Ra is less than 1 micron and Rz is less than 2 microns;
s102, forming an imaging layer 40 on the ink packaging layer 50, which can be formed by spraying or film pressing and other processes; planarizing the surface of the imaging layer 40; the surface of imaging layer 40 facing away from ink encapsulant layer 50 is mirrored with a roughness Ra < 2 microns and Rz < 4 microns.
Since the constituent parts of the ink color encapsulation layer 50 and the imaging layer 40 have been specifically described in the above embodiments, a detailed description is omitted here.
Optionally, the planarization treatment can be realized by adopting processes such as polishing, grinding or smooth release film pressing and forming.
According to the manufacturing method provided by the embodiment, an optical principle is fully utilized, the consistency of ink colors of the LED display module can be obviously improved by controlling the surface roughness, the consistency of ink colors of the upper screen can be realized without picking, meanwhile, the display color difference at different angles is eliminated, and the display module with high contrast is displayed.
Referring to fig. 3 and 4, the ink encapsulation layer 50 includes a base coat layer and a matte layer. The primer layer may form a black matrix 13, which is distributed between the LED chips 11 in the LED array. A matte layer is over the basecoat layer. Alternatively, the undercoat layer is a resin material mixed with melanin (carbon powder, iron black, etc.), and the matte layer is a resin material mixed with scattering powder, diffusion powder or matting powder. The resin material is epoxy resin, silica gel or polyurethane, etc.
As an alternative to any of the above embodiments, the LED chip 11 comprises a group of LED chips, on which the QD layer is provided.
The patterned light blocking layer 12 is arranged on the substrate 10, and the LED chip units in the LED chip group are limited in the light limiting unit of the patterned light blocking layer 12, and the LED chip units can be one pixel (three RGB chips) or a single LED chip, and the size of the light limiting unit is matched with that of the LED chip units.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims (6)
1. An LED display module, comprising:
a substrate provided with an LED chip;
an ink packaging layer for shading and packaging the LED chip, wherein the ink packaging layer covers the substrate and the LED chip; the surface roughness Ra of the ink packaging layer on the side opposite to the substrate is less than 1 micron, and Rz is less than 2 microns;
the black packaging layer comprises an undercoat layer and a matte layer, wherein the undercoat layer is provided with a black matrix, the black matrix is distributed among the LED chips, and the matte layer is positioned on the undercoat layer;
the imaging layer is covered on the ink packaging layer, and the surface roughness Ra of one side of the imaging layer, which faces away from the ink packaging layer, is less than 2 microns, and Rz is less than 4 microns.
2. The LED display module of claim 1, wherein the ink encapsulant layer comprises a mixture of black pigment and at least one of epoxy, silicone, and polyurethane;
the ink packaging layer is added with diffusion powder and extinction powder;
the black pigment includes at least one of graphite powder, carbon powder, iron black and black resin.
3. The LED display module of claim 1, wherein the imaging layer comprises a mixture of a diffusion powder or matting powder and at least one of fluorocarbon resin, epoxy resin, silicone gel, and polyurethane;
the thickness of the imaging layer is 1-200 micrometers, the imaging layer is a transparent layer, and the transparency is 50% -100%.
4. A method for manufacturing an LED display module, comprising:
forming an ink packaging layer for shading and packaging the LED chips on a substrate and the LED chips on the substrate;
flattening the surface of the ink color packaging layer; the surface roughness Ra of the ink packaging layer on the side opposite to the substrate is less than 1 micron, and Rz is less than 2 microns;
forming an imaging layer on the ink packaging layer;
flattening the surface of the imaging layer; the surface roughness Ra of one side of the imaging layer, which is opposite to the ink packaging layer, is less than 2 micrometers, and Rz is less than 4 micrometers;
the flattening treatment is realized by polishing, grinding or smooth release film pressing molding.
5. The method of claim 4, wherein the ink encapsulation layer comprises a mixture of black pigment and at least one of epoxy, silicone, and polyurethane;
the ink packaging layer is added with diffusion powder and extinction powder;
the black pigment includes at least one of graphite powder, carbon powder, iron black and black resin.
6. The method of claim 4, wherein the imaging layer comprises a mixture of a diffusion powder or matting powder and at least one of fluorocarbon resin, epoxy resin, silica gel, and polyurethane;
the thickness of the imaging layer is 1-200 micrometers, the imaging layer is a transparent layer, and the transparency is 50% -100%.
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| CN202110071133.8A CN114824035B (en) | 2021-01-19 | 2021-01-19 | LED display module and manufacturing method thereof |
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| CN202110071133.8A CN114824035B (en) | 2021-01-19 | 2021-01-19 | LED display module and manufacturing method thereof |
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| CN115598748B (en) * | 2022-10-17 | 2023-09-19 | 长春希龙显示技术有限公司 | Display screen nano dimming film, LED display module and packaging method of LED display module |
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