CN114824036A - Display module and manufacturing method thereof - Google Patents
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract
The invention discloses a display module and a manufacturing method thereof, wherein the display module comprises: a substrate provided with an LED chip; the packaging layer is used for packaging the LED chip and covers the substrate and the LED chip; the surface roughness Ra of one side, back to the substrate, of the packaging layer is less than 3 micrometers, and Rz is less than 6 micrometers. According to the display module and the manufacturing method thereof provided by the invention, the optical principle is fully utilized, the ink color consistency of the display module is improved by controlling the surface roughness of the packaging layer, the ink color height consistency of the upper screen can be realized without picking the sheet, the display color difference at different angles is eliminated, and the display module with high contrast is presented.
Description
Technical Field
The invention belongs to the technical field of display, and particularly relates to a display module and a manufacturing method thereof.
Background
The LED indoor display application technology is developed vigorously, and currently, there are more or less technical bottlenecks in the adoption of display technologies such as projection, LCD and OLED. Mini & micro led display has attracted much attention as a novel small-space high-definition display technology, especially in indoor large-screen high-definition display applications, such as application scenarios in command centers, conference centers, security monitoring, household large-screen televisions, and the like.
The Mini & MicroLED small-space display screen module is mainly manufactured by three technical schemes: 1. SMD; 2. IMDs (2in 1,4in1, etc.); 3. chip On Board (COB). The COB is more attractive due to its good display effect, high integration level, simple structure and fine-pitch (currently, IMD and SMD are difficult to achieve below pitch 1). Current COB module mainly has 3 defects: 1. a large amount of manual picking sheets are required before screen installation, and even a large display screen formed by modules with good ink color consistency is selected, the problem of poor overall ink color consistency also exists, and the problems of ink color difference, white frames, black frames and the like appear at different positions, different viewing angles and different light rays are specifically reflected; 2. the front side and the side surface have color difference, which is mainly caused by non-uniform light emitting effect of the packaging body; 3. the prior display screens such as computers, mobile phones, spliced LCD screens and the like are all in a mirror mode, namely, images outside the world can be clearly seen through the display screens and can be used as mirror surfaces.
In the actual production process, the inconsistent color of the display module brings huge loss to enterprises, and a large amount of manpower is needed to sort, so that the labor cost is greatly improved, and the production efficiency is reduced; meanwhile, the inconsistent ink color easily causes the difference of display screen products, which is not favorable for market promotion.
In the prior art, chinese patent with patent publication No. CN112018226A and invention name of a display module and a method for manufacturing the same discloses a similar technology, but the technology still has some defects, and although the consistency of ink colors is greatly improved, the problem of inconsistent ink colors still exists. Also, although some layers in the package structure are ground or polished in the prior art, this is only a routine practice in the industry and there is no substantial improvement in achieving the full ink color uniformity.
In view of the above, research and development personnel of the applicant make more intensive research to overcome the technical problems which plague enterprises for a long time.
Disclosure of Invention
The present invention is directed to a display module and a method for manufacturing the same, which solves or at least partially solves the above-mentioned problem of inconsistent ink color.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, a display module is provided, comprising:
a substrate provided with an LED chip;
an encapsulation layer covering the substrate and the LED chip; the surface roughness Ra of one side, back to the substrate, of the packaging layer is less than 3 micrometers, and Rz is less than 6 micrometers.
Optionally, the method further comprises:
the ink color layer covers the packaging layer, the surface roughness Ra of one side, back to the packaging layer, of the ink color layer is less than 1 micrometer, and Rz is less than 2 micrometers.
Optionally, the method further comprises:
the imaging layer covers the ink color layer, the surface roughness Ra of one side, back to the ink color layer, of the imaging layer is less than 2 micrometers, and Rz is less than 4 micrometers.
Optionally, the encapsulation layer comprises epoxy, silicone or polyurethane;
the packaging layer is added with diffusion powder, black pigment and matting powder;
the mass ratio of the black pigment to the packaging layer is 0.1-5%, and the mass ratio of the extinction powder to the packaging layer is 0.1-5%;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
Optionally, the ink color layer comprises a mixture of a black pigment and at least one of fluorocarbon resin, epoxy resin, silicone, and polyurethane;
diffusion powder or matting powder is also added into the ink color layer;
the mass ratio of the black pigment to the ink layer is 3-80%.
Optionally, the imaging layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel and polyurethane and a diffusion powder or matting powder;
the thickness of the imaging layer is 1-200 microns, the imaging layer is a transparent layer, and the transparency is 50% -100%.
In a second aspect, a method for manufacturing a display module is provided, including:
forming a packaging layer on a substrate and an LED chip on the substrate;
carrying out flattening treatment on the surface of the packaging layer; the surface roughness Ra of one side, back to the substrate, of the packaging layer is less than 3 micrometers, and Rz is less than 6 micrometers.
Optionally, the packaging material of the packaging layer is epoxy resin, silica gel or polyurethane;
the packaging material is added with diffusion powder, black pigment and matting powder;
the mass ratio of the black pigment to the packaging material is 0.1-5%, and the mass ratio of the extinction powder to the packaging material is 0.1-5%;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
Optionally, after the planarizing the surface of the encapsulation layer, the method further includes:
forming an ink layer on the encapsulation layer;
carrying out flattening treatment on the surface of the ink color layer; the surface roughness Ra of one side of the ink color layer, which is opposite to the packaging layer, is less than 1 micrometer, and Rz is less than 2 micrometers.
Optionally, after the planarizing the surface of the ink color layer, the method further includes:
forming an imaging layer on the ink layer;
carrying out flattening treatment on the surface of the imaging layer; the surface roughness Ra of one side of the imaging layer, which is back to the ink layer, is less than 2 micrometers, and Rz is less than 4 micrometers.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
according to the display module and the manufacturing method thereof provided by the embodiment of the invention, the optical principle is fully utilized, the ink color consistency of the display module is improved by controlling the roughness of the surface of the packaging layer, the ink color height consistency of the upper screen can be realized without selecting the sheet, the display color difference at different angles is eliminated, and the display module with high contrast is presented.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope covered by the contents disclosed in the present invention.
Fig. 1 is a structural diagram of a display module according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing a display module according to an embodiment of the present invention;
FIG. 3 is a block diagram of another display module according to an embodiment of the present invention;
fig. 4 is a structural diagram of another display module according to an embodiment of the present invention.
Illustration of the drawings:
10. a substrate; 11. an LED chip; 12. patterning the light blocking layer; 13. a black matrix; 20. a packaging layer; 30. an ink layer; 40. and an imaging layer.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present embodiment provides a display module, respectively, which makes full use of the optical principle, and continuously reflects different black regions of the same display module by controlling the surface roughness, so that the black regions are more uniform for human eyes to see, the ink uniformity of the display module is improved, the height of the upper screen ink is consistent without selecting a sheet, and meanwhile, the display module with high contrast is presented by eliminating the display color difference at different angles.
Specifically, the display module comprises a substrate 10, an LED chip 11 is flipped on the substrate 10, and an encapsulation layer 20 covers the substrate 10 and the LED chip 11, wherein the height of the encapsulation layer 20 is higher than that of the LED chip 11.
Optionally, the substrate 10 is a PCB, glass, ceramic or other material substrate.
In this embodiment, in order to improve the ink color consistency of the display module, the surface of the encapsulation layer 20 is planarized, so that the surface of the encapsulation layer 20 opposite to the substrate 10 (the upper surface of the encapsulation layer in fig. 1) is a mirror surface. Alternatively, the planarization process may be implemented by polishing, grinding, or smooth release film lamination.
Furthermore, in order to make the display module have higher ink color consistency, the roughness Ra of the mirror surface is controlled to be less than 3 micrometers, and Rz of the mirror surface is controlled to be less than 6 micrometers. Alternatively, the values of Ra and Rz may be measured using a step tester. In a preferred embodiment, the roughness Ra may be 2 micrometers or less, 1 micrometer or less, or 0.5 micrometers or less, and the Rz may be 1 micrometer or less, 0.5 micrometer or less, or 0.25 micrometer or less, respectively.
Note that the encapsulating layer 20 includes epoxy resin, silicone rubber, or polyurethane. Optionally, a diffusing powder, a black pigment and a matting powder are added in the encapsulating layer 20. Optionally, the mass ratio of the black pigment to the packaging layer 20 is 0.1-5%, and the mass ratio of the matting powder to the packaging layer 20 is 0.1-5%; optionally, the black pigment includes at least one of graphite powder, carbon powder, iron black, and black resin. Optionally, the thickness of the encapsulation layer 20 is 30-400 microns.
As a further aspect of the present embodiment, an ink color layer 30 is further provided on the encapsulation layer 20, and the ink color layer 30 covers the encapsulation layer 20.
The surface of the ink color layer 30 can be planarized, so that the surface of the ink color layer 30 opposite to the encapsulation layer 20 is a mirror surface, and the ink color consistency of the display module is improved by controlling the roughness of the mirror surface. Optionally, the roughness Ra is controlled to be less than 1 micron, and Rz is controlled to be less than 2 microns. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively. The ink layer 30 includes a mixture of black pigment and at least one of fluorocarbon resin, epoxy resin, silicone, and urethane. Optionally, a diffusing powder or a matting powder is further added to the ink color layer 30. Optionally, the mass ratio of the black pigment to the ink layer 30 is 3-80%. Optionally, the black pigment includes at least one of graphite powder, carbon powder, iron black, and black resin. Optionally, the ink color layer 30 has a thickness of 1-100 microns.
As a further aspect of this embodiment, the display module further includes an imaging layer 40 overlying the ink color layer 30. Similarly, the surface of the imaging layer 40 opposite to the ink color layer 30 can be made to be a mirror surface by planarization, and the mirror surface roughness Ra can be controlled to be less than 2 micrometers, and Rz can be controlled to be less than 4 micrometers. As a preferred embodiment, the roughness Ra may be 1.5 micrometers or less, 0.5 micrometers or less, or 0.1 micrometers or less, respectively, and the Rz may be 3 micrometers or less, 1 micrometer or less, or 0.2 micrometers or less, respectively, to improve the ink color consistency of the display module.
It should be noted that the image forming layer 40 includes a mixture of at least one of fluorocarbon resin, epoxy resin, silicone, and polyurethane, and a diffusing powder or matting powder. Optionally, the thickness of the imaging layer 40 is 1-200 micrometers, the imaging layer 40 is a transparent layer, and the transparency is 50% -100%. Optionally, the imaging layer 40 has a thickness of 1-100 microns. Further, the imaging layer 40 may include functions of fingerprint prevention, bump prevention, and static electricity discharge.
Referring to fig. 2, another embodiment of the present application provides a manufacturing method for manufacturing the display module provided in the above embodiment. Specifically, the manufacturing method comprises the following steps:
s101, forming a packaging layer 20 on the substrate 10 and the LED chip 11 on the substrate 10, wherein the packaging layer can be formed by processes such as spraying or film pressing; carrying out planarization treatment on the surface of the packaging layer 20; optionally, the surface of the encapsulation layer 20 opposite to the substrate 10 is a mirror surface, and the roughness Ra is less than 3 micrometers, and Rz is less than 6 micrometers;
s102, forming an ink layer 30 on the packaging layer 20, wherein the ink layer can be formed through processes such as spraying or film pressing; carrying out flattening treatment on the surface of the ink color layer 30; optionally, the surface of the ink layer 30 opposite to the side of the encapsulation layer 20 is a mirror surface, and the roughness Ra is less than 1 micron, and Rz is less than 2 microns;
s103, forming an imaging layer 40 on the ink color layer 30, wherein the imaging layer can be formed by processes such as spraying or film pressing; planarizing the surface of the imaging layer 40; optionally, the surface of the imaging layer 40 opposite the ink layer 30 is a mirror surface with a roughness Ra < 2 microns and Rz < 4 microns.
Since the components of the encapsulation layer 20, the ink layer 30 and the imaging layer 40 are specifically described in the above embodiments, they are not described again here.
Optionally, the planarization process may be implemented by polishing, grinding, or smooth release film lamination.
The manufacturing method provided by the embodiment makes full use of the optical principle, can obviously improve the ink color consistency of the display module by controlling the surface roughness, can realize the ink color height consistency of the upper screen without picking the sheet, simultaneously eliminates the display color difference at different angles, and presents the display module with high contrast.
As an alternative to any of the above embodiments, the encapsulating layer 20 is divided into two parts, a primer layer and a matte layer.
Referring to fig. 3 and 4, the undercoat layer may form a black matrix 13, which is distributed between the LED chips 11 in the LED array. A matte layer is over the primer layer. Alternatively, the undercoat layer is a resin material mixed with a melanin pigment (carbon powder, iron black, etc.), and the matte layer is a resin material mixed with a scattering powder, a diffusing powder, or a matting powder. The resin material is epoxy resin, silica gel or polyurethane.
As an alternative implementation manner of any of the above embodiments, the LED chip 11 includes a LED chip group, and a QD layer is disposed on the LED chip group.
The substrate 10 is provided with a patterned light-blocking layer 12, LED chip units in an LED chip group are limited in a light-limiting unit of the patterned light-blocking layer 12, the LED chip units may be one pixel (three RGB chips) or a single LED chip, and the size of the light-limiting unit matches with that of the LED chip units.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A display module, comprising:
a substrate provided with an LED chip;
an encapsulation layer covering the substrate and the LED chip; the surface roughness Ra of one side, back to the substrate, of the packaging layer is less than 3 micrometers, and Rz is less than 6 micrometers.
2. The display module of claim 1, further comprising:
the ink color layer covers the packaging layer, the surface roughness Ra of one side, back to the packaging layer, of the ink color layer is less than 1 micrometer, and Rz is less than 2 micrometers.
3. The display module of claim 2, further comprising:
the imaging layer covers the ink color layer, the surface roughness Ra of one side, back to the ink color layer, of the imaging layer is less than 2 micrometers, and Rz is less than 4 micrometers.
4. A display module according to any one of claims 1 to 3, wherein the encapsulation layer comprises epoxy, silicone or polyurethane;
the packaging layer is added with diffusion powder, black pigment and matting powder;
the mass ratio of the black pigment to the packaging layer is 0.1-5%, and the mass ratio of the extinction powder to the packaging layer is 0.1-5%;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
5. The display module according to claim 2 or 3, wherein the ink color layer comprises a mixture of a black pigment and at least one of fluorocarbon resin, epoxy resin, silicone, and polyurethane;
diffusion powder or matting powder is also added into the ink color layer;
the mass ratio of the black pigment to the ink layer is 3-80%.
6. The display module of claim 3, wherein the imaging layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel, and polyurethane with a diffusing powder or matting powder;
the thickness of the imaging layer is 1-200 microns, the imaging layer is a transparent layer, and the transparency is 50% -100%.
7. A method for manufacturing a display module is characterized by comprising the following steps:
forming a packaging layer on a substrate and an LED chip on the substrate;
carrying out flattening treatment on the surface of the packaging layer; the surface roughness Ra of one side, back to the substrate, of the packaging layer is less than 3 micrometers, and Rz is less than 6 micrometers.
8. The manufacturing method according to claim 7, wherein the packaging material of the packaging layer is epoxy resin, silica gel or polyurethane;
the packaging material is added with diffusion powder, black pigment and matting powder;
the mass ratio of the black pigment to the packaging material is 0.1-5%, and the mass ratio of the extinction powder to the packaging material is 0.1-5%;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
9. The method of claim 7, wherein after the planarizing the surface of the encapsulation layer, further comprising:
forming an ink layer on the encapsulation layer;
carrying out flattening treatment on the surface of the ink color layer; the surface roughness Ra of one side of the ink color layer, which is opposite to the packaging layer, is less than 1 micrometer, and Rz is less than 2 micrometers.
10. The method of manufacturing according to claim 9, further comprising, after the planarizing the surface of the ink color layer:
forming an imaging layer on the ink layer;
carrying out flattening treatment on the surface of the imaging layer; the surface roughness Ra of one side of the imaging layer, which is back to the ink layer, is less than 2 micrometers, and Rz is less than 4 micrometers.
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| CN202110071135.7A CN114824036A (en) | 2021-01-19 | 2021-01-19 | Display module and manufacturing method thereof |
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| CN209344074U (en) * | 2018-11-14 | 2019-09-03 | 易美芯光（北京）科技有限公司 | A kind of quantum dot LED encapsulation module structure |
| CN110707078A (en) * | 2019-09-12 | 2020-01-17 | 武汉华星光电技术有限公司 | Backlight module, preparation method thereof and display device |
| CN211555890U (en) * | 2019-12-02 | 2020-09-22 | 深圳市绎立锐光科技开发有限公司 | LED display device |
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| CN111816649A (en) * | 2020-07-29 | 2020-10-23 | 杭州美卡乐光电有限公司 | LED display module and manufacturing method thereof, LED display screen and manufacturing method thereof |
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