CN114824035A - LED display module and manufacturing method thereof - Google Patents
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- CN114824035A CN114824035A CN202110071133.8A CN202110071133A CN114824035A CN 114824035 A CN114824035 A CN 114824035A CN 202110071133 A CN202110071133 A CN 202110071133A CN 114824035 A CN114824035 A CN 114824035A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The invention discloses an LED display module and a manufacturing method thereof, wherein the LED display module comprises: a substrate provided with an LED chip; an ink encapsulation layer covering the substrate and the LED chip; the surface roughness Ra of one side, back to the substrate, of the ink color packaging layer is less than 1 micrometer, and Rz is less than 2 micrometers. According to the LED display module and the manufacturing method thereof, provided by the invention, the optical principle is fully utilized, the ink consistency of the LED display module can be improved by controlling the roughness of the ink packaging layer, the ink height consistency of the upper screen can be realized without picking, the display chromatic aberration at different angles is eliminated, and the display module with high contrast is presented.
Description
Technical Field
The invention belongs to the technical field of display, and particularly relates to an LED display module and a manufacturing method thereof.
Background
The LED indoor display application technology is developed vigorously, and currently, there are more or less technical bottlenecks in adopting display technologies such as projection, LCD and OLED. Mini & micro led display has attracted much attention as a novel small-space high-definition display technology, especially in indoor large-screen high-definition display applications, such as application scenarios in command centers, conference centers, security monitoring, household large-screen televisions, and the like.
The Mini & MicroLED small-space display screen module is mainly manufactured by three technical schemes: 1. SMD; 2. IMDs (2in 1,4in1, etc.); 3. chip On Board (COB). The COB is more attractive due to its good display effect, high integration level, simple structure and fine-pitch (currently, IMD and SMD are difficult to achieve below pitch 1). Current COB module mainly has 3 defects: 1. a large amount of manual picking sheets are required before screen installation, and even a large display screen formed by modules with good ink color consistency is selected, the problem of poor overall ink color consistency also exists, and the problems of ink color difference, white frames, black frames and the like appear at different positions, different viewing angles and different light rays are specifically reflected; 2. the front side and the side surface have color difference, which is mainly caused by non-uniform light emitting effect of the packaging body; 3. the prior display screens such as computers, mobile phones, spliced LCD screens and the like are all in a mirror mode, namely, images outside the world can be clearly seen through the display screens and can be used as mirror surfaces.
In the actual production process, the inconsistent ink colors of the LED display modules bring huge loss to enterprises, so that a large amount of manpower is needed for sorting, the labor cost is greatly improved, and the production efficiency is reduced; meanwhile, the inconsistent ink color easily causes the difference of display screen products, which is not favorable for market promotion.
In the prior art, chinese patent with patent publication No. CN112018226A and invention name of a display module and a method for manufacturing the same discloses a similar technology, but the technology still has some defects, and although the consistency of ink colors is greatly improved, the problem of inconsistent ink colors still exists. Also, although some layers in the package structure are ground or polished in the prior art, this is only a routine practice in the industry and there is no substantial improvement in achieving the full ink color uniformity.
In view of the above, research and development personnel of the applicant make more intensive research to overcome the technical problems which plague enterprises for a long time.
Disclosure of Invention
The invention aims to provide an LED display module and a manufacturing method thereof, which are used for solving or at least partially solving the problem of inconsistent ink colors.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, there is provided an LED display module comprising:
a substrate provided with an LED chip;
the ink packaging layer is used for shading and packaging the LED chip and covers the substrate and the LED chip; the surface roughness Ra of one side, back to the substrate, of the ink color packaging layer is less than 1 micrometer, and Rz is less than 2 micrometers.
Optionally, the method further comprises:
the imaging layer covers the ink color packaging layer, the surface roughness Ra of one side, back to the ink color packaging layer, of the imaging layer is less than 2 micrometers, and Rz is less than 4 micrometers.
Optionally, the ink encapsulation layer comprises a mixture of black pigment and at least one of epoxy resin, silica gel and polyurethane;
diffusion powder and matting powder are added in the ink color packaging layer;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
Optionally, the imaging layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel and polyurethane and a diffusion powder or matting powder;
the thickness of the imaging layer is 1-200 microns, the imaging layer is a transparent layer, and the transparency is 50% -100%.
In a second aspect, a method for manufacturing an LED display module is provided, including:
forming an ink color packaging layer for shading and packaging the LED chip on a substrate and the LED chip on the substrate;
flattening the surface of the ink color packaging layer; the surface roughness Ra of one side, back to the substrate, of the ink color packaging layer is less than 1 micrometer, and Rz is less than 2 micrometers.
Optionally, the ink encapsulation layer comprises a mixture of black pigment and at least one of epoxy resin, silica gel and polyurethane;
diffusion powder and matting powder are added in the ink color packaging layer;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
Optionally, after the planarizing the surface of the ink color encapsulation layer, the method further includes:
forming an imaging layer on the ink encapsulation layer;
carrying out flattening treatment on the surface of the imaging layer; the surface roughness Ra of one side of the imaging layer, which is back to the ink color packaging layer, is less than 2 micrometers, and Rz is less than 4 micrometers.
Optionally, the imaging layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel and polyurethane and a diffusion powder or matting powder;
the thickness of the imaging layer is 1-200 microns, the imaging layer is a transparent layer, and the transparency is 50% -100%.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
according to the LED display module and the manufacturing method thereof provided by the embodiment of the invention, the optical principle is fully utilized, the ink consistency of the LED display module is improved by controlling the roughness of the surface of the ink packaging layer, the ink height consistency of the upper screen can be realized without picking up the sheet, the display chromatic aberration at different angles is eliminated, and the display module with high contrast is presented.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope covered by the contents disclosed in the present invention.
Fig. 1 is a structural diagram of an LED display module according to an embodiment of the present invention;
fig. 2 is a flowchart of a method for manufacturing an LED display module according to an embodiment of the present invention;
fig. 3 is a structural diagram of an LED display module according to an embodiment of the present invention;
fig. 4 is a structural diagram of an LED display module according to an embodiment of the present invention.
Illustration of the drawings:
10. a substrate; 11. an LED chip; 12. patterning the light blocking layer; 13. a black matrix; 40. an imaging layer; 50. and an ink color packaging layer.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present embodiment provides an LED display module, respectively, which makes full use of the optical principle, and by controlling the surface roughness, different black areas of the same display module are continuously reflected inside, so that human eyes can see the black areas more uniformly, the ink color consistency of the LED display module is improved, the ink color height of the upper screen can be consistent without selecting a sheet, and meanwhile, the display module with high contrast is presented by eliminating the display color difference at different angles.
Specifically, the LED display module includes a substrate 10, an LED chip 11 flip-chip mounted on the substrate 10, and an ink encapsulation layer 50 covering the substrate 10 and the LED chip 11 for shielding light and encapsulating the LED chip 11.
The height of the ink encapsulation layer 50 is higher than the height of the LED chip 11.
Optionally, the substrate 10 is a PCB, glass, ceramic or other substrate.
In this embodiment, in order to improve the ink consistency of the LED display module, the surface of the ink encapsulation layer 50 is planarized, so that the surface of the ink encapsulation layer 50 opposite to the substrate 10 (i.e., the upper surface of the ink encapsulation layer in fig. 1) is a mirror surface. Alternatively, the planarization process may be implemented by polishing, grinding, or smooth release film lamination.
Furthermore, in order to enable the LED display module to have higher ink color consistency, the roughness Ra of the mirror surface can be controlled to be less than 1 micrometer, and the Rz of the mirror surface can be controlled to be less than 2 micrometers. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively.
It should be noted that the ink color sealing layer 50 includes a mixture of black pigment and at least one of epoxy resin, silicone, and polyurethane; diffusion powder and matting powder are added into the ink color packaging layer 50; the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
As a further aspect of this embodiment, the LED display module further includes an imaging layer 40 overlying the ink encapsulation layer 50. Similarly, the surface of the imaging layer 40 opposite to the ink color packaging layer 30 can be made to be a mirror surface through planarization treatment, and the mirror surface roughness Ra can be controlled to be less than 2 micrometers, and Rz can be controlled to be less than 4 micrometers. In a preferred embodiment, the roughness Ra may be 1.5 micrometers or less, 0.5 micrometers or less, or 0.1 micrometers or less, and Rz may be 3 micrometers or less, 1 micrometer or less, or 0.2 micrometers or less, respectively, to improve the ink color consistency of the LED display module.
It should be noted that the image forming layer 40 includes a mixture of at least one of fluorocarbon resin, epoxy resin, silicone, and polyurethane, and a diffusing powder or matting powder. Optionally, the thickness of the imaging layer 40 is 1-200 micrometers, the imaging layer 40 is a transparent layer, and the transparency is 50% -100%. Optionally, the imaging layer 40 has a thickness of 1-100 microns. Further, the imaging layer 40 may include functions of fingerprint prevention, bump prevention, and static electricity discharge.
Referring to fig. 2, another embodiment of the present application provides a manufacturing method, which can manufacture the LED display module provided in the above embodiment. Specifically, the manufacturing method comprises the following steps:
s101, forming an ink color packaging layer 50 for shading and packaging the LED chip 11 on the substrate 10 and the LED chip 11 on the substrate 10, wherein the ink color packaging layer can be formed by processes such as spraying or film pressing; carrying out flattening treatment on the surface of the ink color packaging layer 50; the surface of the ink color packaging layer 50, which is opposite to one side of the substrate 10, is a mirror surface, the roughness Ra of the mirror surface is less than 1 micrometer, and the Rz of the mirror surface is less than 2 micrometers;
s102, forming an imaging layer 40 on the ink color packaging layer 50, wherein the imaging layer can be formed by processes such as spraying or film pressing; planarizing the surface of the imaging layer 40; the surface of the imaging layer 40 opposite to the ink color packaging layer 50 is a mirror surface, the roughness Ra is less than 2 micrometers, and the Rz is less than 4 micrometers.
Since the components of the ink encapsulation layer 50 and the imaging layer 40 are specifically described in the above embodiments, they are not described in detail here.
Optionally, the planarization process may be implemented by polishing, grinding, or smooth release film lamination.
The manufacturing method provided by the embodiment makes full use of the optical principle, can obviously improve the ink color consistency of the LED display module by controlling the surface roughness, can realize the consistent ink color height of the upper screen without picking the sheet, simultaneously eliminates the display color difference at different angles, and presents the display module with high contrast.
Referring to fig. 3 and 4, the ink encapsulation layer 50 includes a base coat layer and a matte layer. The undercoat layer may form a black matrix 13, distributed between the LED chips 11 in the LED array. A matte layer is over the primer layer. Alternatively, the undercoat layer is a resin material mixed with a melanin pigment (carbon powder, iron black, etc.), and the matte layer is a resin material mixed with a scattering powder, a diffusing powder, or a matting powder. The resin material is epoxy resin, silica gel or polyurethane.
As an alternative implementation manner of any of the above embodiments, the LED chip 11 includes a LED chip group, and a QD layer is disposed on the LED chip group.
The substrate 10 is provided with a patterned light-blocking layer 12, LED chip units in an LED chip group are limited in a light-limiting unit of the patterned light-blocking layer 12, the LED chip units may be one pixel (three RGB chips) or a single LED chip, and the size of the light-limiting unit matches with that of the LED chip units.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. An LED display module, comprising:
a substrate provided with an LED chip;
the ink packaging layer is used for shading and packaging the LED chip and covers the substrate and the LED chip; the surface roughness Ra of one side, back to the substrate, of the ink color packaging layer is less than 1 micrometer, and Rz is less than 2 micrometers.
2. The LED display module of claim 1, further comprising:
the imaging layer covers the ink color packaging layer, the surface roughness Ra of one side, back to the ink color packaging layer, of the imaging layer is less than 2 micrometers, and Rz is less than 4 micrometers.
3. The LED display module of claim 1 or 2, wherein the ink encapsulation layer comprises a mixture of black pigment and at least one of epoxy, silicone and polyurethane;
diffusion powder and matting powder are added in the ink color packaging layer;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
4. The LED display module of claim 2, wherein the imaging layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel, and polyurethane with a diffusing powder or matting powder;
the thickness of the imaging layer is 1-200 microns, the imaging layer is a transparent layer, and the transparency is 50% -100%.
5. A manufacturing method of an LED display module is characterized by comprising the following steps:
forming an ink color packaging layer for shading and packaging the LED chip on a substrate and the LED chip on the substrate;
carrying out flattening treatment on the surface of the ink color packaging layer; the surface roughness Ra of one side, back to the substrate, of the ink color packaging layer is less than 1 micrometer, and Rz is less than 2 micrometers.
6. The method of manufacturing according to claim 5, wherein the ink color encapsulation layer includes a mixture of black pigment and at least one of epoxy resin, silicone, and polyurethane;
diffusion powder and matting powder are added in the ink color packaging layer;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
7. The method of claim 5, wherein after the planarizing the surface of the ink encapsulation layer, further comprising:
forming an imaging layer on the ink encapsulation layer;
carrying out flattening treatment on the surface of the imaging layer; the surface roughness Ra of one side of the imaging layer, which is back to the ink color packaging layer, is less than 2 micrometers, and Rz is less than 4 micrometers.
8. The manufacturing method according to claim 7, wherein the imaging layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel, and polyurethane, and a diffusing powder or matting powder;
the thickness of the imaging layer is 1-200 microns, the imaging layer is a transparent layer, and the transparency is 50% -100%.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115598748A (en) * | 2022-10-17 | 2023-01-13 | 长春希龙显示技术有限公司（Cn） | Display screen nano light modulation film, LED display module and packaging method thereof |
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| US20200409215A1 (en) * | 2019-06-28 | 2020-12-31 | Foshan Nationstar Optoelectronics Co., Ltd | LED Device, Backlight Module and Display Device |
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| CN111341219A (en) * | 2020-03-13 | 2020-06-26 | 东莞市中麒光电技术有限公司 | LED display screen module and preparation method thereof |
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