CN114822291B - Display panel and display device - Google Patents
Display panel and display device Download PDFInfo
- Publication number
- CN114822291B CN114822291B CN202210485619.0A CN202210485619A CN114822291B CN 114822291 B CN114822291 B CN 114822291B CN 202210485619 A CN202210485619 A CN 202210485619A CN 114822291 B CN114822291 B CN 114822291B
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- Prior art keywords
- substrate
- display panel
- chip film
- display
- layer
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- 239000000758 substrate Substances 0.000 claims abstract description 55
- 239000000463 material Substances 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 50
- 239000010409 thin film Substances 0.000 description 5
- 230000009194 climbing Effects 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000003685 thermal hair damage Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
Abstract
The invention provides a display panel and a display device. The display panel comprises a substrate, a flip chip film, a first heat conduction layer and a heat sink. The flip chip film is arranged on the substrate. The first heat conduction layer is arranged on the substrate and is positioned at the corner of the substrate and the flip-chip film. The radiating fin is arranged on the substrate and covers the flip chip film and the first heat conduction layer.
Description
Technical Field
The invention relates to the field of display equipment, in particular to a display panel and a display device.
Background
The current panel presents a plurality of types, wherein the resolution and the color degree of a Mini-LED (micro Light Emitting Diode) display screen are superior to those of an LCD (Liquid Crystal Display ) and are close to the display effect of an OLED (Organic Light-Emitting Diode) display screen. The Mini-LED display screen has the advantages of low power consumption, lighter weight and thinner weight and the like. And the Mini-LED display screen can be spliced into a required size through a plurality of small display panels, can be flexibly assembled and disassembled, and is easy to maintain.
Unlike LCD products, mini-LEDs are current driven, and after a period of lighting, the temperature of the display panel at the input end of the signal, i.e., the end near the COF (Chip On Film) will increase, so that a heating phenomenon will occur. In practical tests, the temperature of the display panel near the end of the COF is higher by more than 40 ℃ than the temperature of the display panel far from the COF after the display panel is lighted for a long time. When heat is accumulated to a certain temperature, power consumption of the display panel is increased, and circuits in the display panel are burned out.
Disclosure of Invention
The invention aims to provide a display panel and a display device, which are used for solving the problems that in the prior art, the power consumption of the panel is increased and circuits in the panel are burnt out due to incapacity of technical heat dissipation.
In order to achieve the above object, the present invention provides a display panel, which includes a substrate, a flip chip film, a first heat conductive layer, and a heat sink. The flip chip film is arranged on the substrate. The first heat conduction layer is arranged on the substrate and is positioned at the corner of the substrate and the flip-chip film. The radiating fin is arranged on the substrate and covers the flip chip film and the first heat conduction layer.
Further, the display panel further comprises a moisture-proof layer, and the moisture-proof layer is arranged on one surface of the flip chip film far away from the substrate.
Further, the display panel is provided with a display area and a binding area connected with the display area. The flip chip film is provided with a first connecting end, and the first connecting end is arranged on the substrate in the binding area. The heat sink extends from the substrate to a surface of the first connection end away from the substrate. The moisture-proof layer is arranged between the first connecting end and the radiating fin.
Further, the display panel further comprises a second heat conduction layer, wherein the second heat conduction layer is arranged on one surface of the first connecting end far away from the substrate and is positioned at the corner of the first connecting end and the moisture-proof layer.
Further, an included angle is formed between a surface of the first heat conduction layer, which faces the radiating fin, and a horizontal plane, and the included angle is smaller than 90 degrees. Wherein the horizontal plane is parallel to the top surface of the substrate.
Further, the thickness of the first heat conduction layer is equal to or less than the sum of the thicknesses of the flip chip film and the moisture-proof layer. The thickness of the second heat conduction layer is equal to or less than the thickness of the moisture-proof layer.
Further, the materials of the first heat conduction layer and the second heat conduction layer comprise insulating materials.
Further, the display panel further includes a display layer and a printed circuit board. The display layer is arranged on the substrate and is positioned in the display area. The printed circuit board is connected with one end of the flip chip film far away from the display layer.
Further, the heat sink has a thickness of less than 200 microns. The material of the radiating fin comprises at least one of metal, graphite, carbon nano tube and resin.
The invention also provides a display device comprising the display panel.
The invention has the advantages that: according to the display panel and the display device, the heat conducting structure is arranged at the edge of the flip chip film, so that the climbing difficulty of the radiating fin is reduced, the heat generated by the flip chip film is conducted, the heat is prevented from being accumulated at the edge of the flip chip film, the risk of short circuit of a panel circuit is reduced, the stability of the panel is improved, and meanwhile, the power consumption of the display panel is also reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a front view of a display panel according to an embodiment of the present invention;
FIG. 2 is a schematic view of the layered structure of the display panel of FIG. 1 taken along line AA';
fig. 3 is a schematic diagram of a layered structure of a display panel after bending a flip chip film according to an embodiment of the invention.
The components in the figure are shown as follows:
a display panel 1; a display area 1A;
binding area 1B; a substrate 10;
a display layer 20; a light emitting device 21;
an encapsulation layer 22; a flip chip film 30;
a first connection end 31; a second connection end 32;
a printed circuit board 40; a moisture barrier 50;
a heat sink 60; a first heat conductive layer 71;
a first incline 711; a second thermally conductive layer 72;
and a second inclined surface 721.
Detailed Description
The following description of the preferred embodiments of the present invention, which will be described in sufficient detail to enable those skilled in the art to practice the invention, is provided with a further understanding of the invention, and is made clear to a person skilled in the art by reference to the accompanying drawings. The present invention may be embodied in many different forms of embodiments of the invention, the scope of which is not limited to only the embodiments described herein.
In the drawings, like structural elements are referred to by like reference numerals and components having similar structure or function are referred to by like reference numerals. The dimensions and thicknesses of each component shown in the drawings are arbitrarily shown, and the present invention is not limited to the dimensions and thicknesses of each component. The thickness of the components is exaggerated in some places in the drawings for clarity of illustration.
Furthermore, the following description of various inventive embodiments is provided with reference to the accompanying drawings, which illustrate specific inventive embodiments in which the invention may be practiced. Directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., in the present invention are merely referring to the directions of the attached drawings, and thus, directional terms are used for better, more clear explanation and understanding of the present invention, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
When some element is described as being "on" another element, the element may be directly on the other element; there may also be an intermediate member that is placed on the intermediate member and the intermediate member is placed on another member. When an element is referred to as being "mounted to" or "connected to" another element, it can be directly "mounted to" or "connected to" the other element or be indirectly "mounted to" or "connected to" the other element via an intervening element.
The embodiment of the invention provides a display device, which can be a Mini-LED display device, and comprises a plurality of display panels 1, wherein the display panels 1 are spliced to form a large display panel 1, so that a better display effect is provided for the display device. The display device can be any display device with a display function, such as a mobile phone, a notebook computer, a tablet computer and the like.
As shown in fig. 1 and 2, the display panel 1 has a display area 1A and a binding area 1B connected to the display area 1A. The display panel 1 includes a substrate 10, a display layer 20, a flip chip film 30, and a printed circuit board 40.
The substrate 10 is an array substrate, and is provided with a plurality of thin film transistors and a plurality of connection pins. The thin film transistor array is arranged in the display area 1A, the connection pins are located in the binding area 1B, and the thin film transistors are electrically connected with the connection pins located in the binding area 1B through signal wires.
The display layer 20 is disposed on a surface of the substrate 10 and is located in the display area 1A. The display layer 20 includes a plurality of light emitting devices 21 and an encapsulation layer 22. The light emitting devices 21 are arranged in the display area 1A and electrically connected to the thin film transistors in the display area 1A. The encapsulation layer 22 covers the light emitting device 21, and encapsulates and protects the light emitting device 21. In the embodiment of the present invention, the light emitting device 21 is a Mini-LED (Mini light emitting diode). In other embodiments of the invention, micro-LEDs (Micro light emitting diodes) or OLEDs (organic semiconductors) may also be selected.
As shown in fig. 2, the flip-chip film 30 has two connection ends, a first connection end 31 and a second connection end 32, which are respectively located at two sides of the flip-chip film 30. The first connection terminal 31 is disposed on the substrate 10 in the binding area 1B and is electrically connected to a connection pin in the binding area 1B. The second connection terminal 32 is located on a side of the flip chip film 30 away from the display layer 20 and is electrically connected to the printed circuit board 40.
As shown in fig. 3, the printed circuit board 40 may be bent to the back surface of the substrate 10 through the flip chip film 30, so as to reduce the area of the binding area 1B where the display panel 1 cannot display a picture, increase the area of the display area 1A of the display panel 1, and achieve a display effect with a narrow frame and no frame.
The printed circuit board 40 is provided therein with an IC chip for processing display data and transmitting a display signal according to the display data. The display signal is transmitted into the substrate 10 through the flip-chip film 30, and the thin film transistor in the substrate 10 turns on or off the light emitting device 21 according to the received display signal, so as to control the light emission of each light emitting device 21, and form a display picture.
As shown in fig. 1 and 2, the display panel 1 further includes a moisture barrier 50 and a heat sink 60.
The moisture-proof layer 50 is disposed on a surface of the flip-chip film 30 remote from the substrate 10, and is used for protecting the conductive structures in the flip-chip film 30 from short-circuiting due to water-oxygen corrosion. The moisture-proof layer 50 is a glue layer structure, which can be prepared on the surface of the flip chip film 30 by coating and curing. Specifically, the thickness of the moisture-proof layer 50 is 200-300 micrometers, and the moisture-proof layer 50 correspondingly covers the first connection end 31 of the flip chip film 30.
The heat sink 60 covers the moisture-proof layer 50 and the flip chip film 30 and is used for dissipating heat from the flip chip film 30 to lower the operating temperature of the substrate 10 and the flip chip film 30 in the bonding area 1B, thereby reducing the accumulation of heat, further reducing the panel power consumption increased by the temperature rise, and preventing the circuit in the display panel 1 from burning out. As shown in fig. 2, the heat sink 60 extends from the substrate 10 to the moisture-proof layer 50 on the flip chip film 30 until covering the first connection end 31 of the flip chip film 30, so as to precisely reduce the temperature of the COF end of the display panel 1. Specifically, the material of the heat sink 60 includes at least one of metal, graphite, carbon nanotubes, and resin, and the thickness thereof is less than 200 micrometers. Preferably, the heat sink 60 has a thickness of 100 microns.
Since the flip chip film 30 is laminated on the surface of the substrate 10, a height difference is caused between the flip chip film 30 and the substrate 10. The height difference is further increased with the arrangement of the moisture-proof layer 50, so that the heat sink 60 cannot be attached to the sides of the flip-chip film 30 and the moisture-proof layer 50, and a gap is formed at the edges of the flip-chip film 30 and the moisture-proof layer 50 (i.e. at the corners of the substrate 10 and the flip-chip film 30). Moreover, because the formed gaps are relatively airtight, air cannot circulate, and heat accumulation occurs in the gaps. Similarly, a gap is formed at the corner between the first connection end 31 of the flip chip film 30 and the moisture-proof layer 50, and heat is accumulated in the gap, thereby causing thermal damage to the display device.
Accordingly, the display panel further includes a first heat conductive layer 71 and a second heat conductive layer 72.
The first heat conductive layer 71 is disposed on the substrate 10 and located at the edges of the first connection terminal 31 and the moisture-proof layer 50. The first heat conductive layer 71 fills the corner between the flip chip film 30 and the substrate 10, and has a first inclined surface 711, and the first inclined surface 711 faces the heat sink 60. The first inclined surface 711 has a first angle with the top surface of the substrate 10 (i.e., a surface of the substrate 10 facing the display layer 20), and the angle of the first angle is smaller than 90 °, so that a chamfer structure is formed at the corner of the flip chip film 30 and the substrate 10, so that the heat sink 60 can climb from the substrate 10 to above the flip chip film 30 and the moisture-proof layer 50. Specifically, the thickness of the first heat conductive layer 71 is equal to or less than the sum of the thicknesses of the flip chip film 30 and the moisture-proof layer 50, and preferably, the thickness of the first heat conductive layer 71 is equal to the sum of the thicknesses of the flip chip film 30 and the moisture-proof layer 50.
The second heat conductive layer 72 is disposed on a surface of the first connection end 31 remote from the substrate 10 and at an edge of the moisture-proof layer 50. The second thermally conductive layer 72 fills the corners between the flip chip film 30 and the moisture barrier 50, having a second slope 721, the second slope 721 also facing the heat sink 60. The second inclined plane 721 forms a second angle with a horizontal plane parallel to the top surface of the substrate 10, and the second angle is smaller than 90 °, so that a chamfer structure is formed at the corner of the flip chip film 30 and the moisture-proof layer 50, so that the heat sink 60 extends from the top surface of the moisture-proof layer 50 to a surface of the flip chip film 30 away from the substrate 10. Specifically, the thickness of the second heat conductive layer 72 is equal to or less than the thickness of the moisture-proof layer 50, and preferably, the thickness of the second heat conductive layer 72 is equal to the thickness of the moisture-proof layer 50.
As shown in fig. 2, the heat sink 60 is attached to the first inclined surface 711 of the first heat conductive layer 71 and the second inclined surface 721 of the second heat conductive layer 72, so that the difficulty in climbing the heat sink 60 is reduced, and no gap is generated at the edges of the flip chip film 30 and the moisture-proof layer 50.
Further, the materials of the first heat conducting layer 71 and the second heat conducting layer 72 are insulating materials with excellent heat conducting performance, so as to reduce the difficulty of climbing the heat sink 60 and conduct the heat generated at the first connection end 31 of the flip chip film 30, and timely dissipate the heat, thereby preventing the thermal damage of the device in the binding area 1B of the display panel 1. The insulating material may be silica gel, rubber, etc., which is coated on the substrate 10 and the flip chip film 50 by a preparation method such as air pressure extrusion, spray printing, etc., and fills the gap of the heat sink 60 generated at the edges of the flip chip film 30 and the moisture-proof layer 50.
In the display panel provided by the embodiment of the invention, the first heat conduction layer and the second heat conduction layer are arranged at the edges of the flip chip film and the moisture-proof layer, so that the climbing difficulty of the radiating fin is reduced, the heat generated by the flip chip film is conducted, the heat is timely radiated, the heat is prevented from being accumulated at the edges of the flip chip film, the risk of short circuit of a panel circuit is reduced, the stability of the panel is improved, and the power consumption of the display panel is also reduced.
Although the invention herein has been described with reference to particular embodiments, it is to be understood that these embodiments are merely illustrative of the principles and applications of the present invention. It is therefore to be understood that numerous modifications may be made to the illustrative embodiments and that other arrangements may be devised without departing from the spirit and scope of the present invention as defined by the appended claims. It should be understood that the different dependent claims and the features described herein may be combined in ways other than as described in the original claims. It is also to be understood that features described in connection with separate embodiments may be used in other described embodiments.
Claims (8)
1. A display panel, wherein the display panel is a Mini-LED display panel, having a display area and a binding area connected to the display area, the display panel comprising:
a substrate;
the flip chip film is arranged on the substrate and is provided with a first connecting end, and the first connecting end is arranged on the substrate in the binding area;
the first heat conduction layer is arranged on the substrate and is positioned at the corner of the substrate and the flip-chip film, and the material of the first heat conduction layer comprises an insulating material which is coated on the substrate and the flip-chip film so as to fill gaps generated by the cooling fin at the edges of the flip-chip film and the moisture-proof layer;
the radiating fin is arranged on the substrate and covers the flip chip film and the first heat conduction layer, and the radiating fin extends from the substrate to a surface of the first connecting end far away from the substrate;
the moistureproof layer is arranged on one surface of the flip chip film, which is far away from the substrate, and is arranged between the first connecting end and the radiating fin.
2. The display panel of claim 1, further comprising:
the second heat conduction layer is arranged on one surface of the first connecting end far away from the substrate and is positioned at the corner of the first connecting end and the moisture-proof layer.
3. The display panel of claim 2, wherein a surface of the first and second heat conductive layers facing the heat sink each has an included angle with a horizontal plane, the included angle being less than 90 °;
wherein the horizontal plane is parallel to the top surface of the substrate.
4. The display panel of claim 2, wherein,
the thickness of the first heat conduction layer is equal to or less than the sum of the thicknesses of the flip chip film and the moisture-proof layer;
the thickness of the second heat conduction layer is equal to or less than the thickness of the moisture-proof layer.
5. The display panel of claim 2, wherein the material of the second thermally conductive layer comprises an insulating material.
6. The display panel of claim 1, further comprising:
the display layer is arranged on the substrate and is positioned in the display area;
and the printed circuit board is connected with one end of the flip chip film, which is far away from the display layer.
7. The display panel of claim 1, wherein,
the thickness of the heat sink is less than 200 microns;
the material of the radiating fin comprises at least one of metal, graphite, carbon nano tube and resin.
8. A display device comprising a display panel as claimed in any one of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210485619.0A CN114822291B (en) | 2022-05-06 | 2022-05-06 | Display panel and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210485619.0A CN114822291B (en) | 2022-05-06 | 2022-05-06 | Display panel and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114822291A CN114822291A (en) | 2022-07-29 |
| CN114822291B true CN114822291B (en) | 2023-12-08 |
Family
ID=82510997
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210485619.0A Active CN114822291B (en) | 2022-05-06 | 2022-05-06 | Display panel and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114822291B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005217031A (en) * | 2004-01-28 | 2005-08-11 | Optrex Corp | Mounting flexible wiring plate and electro-optical device |
| WO2020168492A1 (en) * | 2019-02-20 | 2020-08-27 | 京东方科技集团股份有限公司 | Display device and preparation method therefor |
| CN112634764A (en) * | 2021-01-06 | 2021-04-09 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN215730596U (en) * | 2021-08-30 | 2022-02-01 | 惠科股份有限公司 | Display module and display device |
| CN114068438A (en) * | 2020-07-31 | 2022-02-18 | 河南烯力新材料科技有限公司 | Thin film flip chip packaging structure and display device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102583781B1 (en) * | 2016-11-30 | 2023-10-05 | 엘지디스플레이 주식회사 | Chip on film and display device comprising the same |
-
2022
- 2022-05-06 CN CN202210485619.0A patent/CN114822291B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005217031A (en) * | 2004-01-28 | 2005-08-11 | Optrex Corp | Mounting flexible wiring plate and electro-optical device |
| WO2020168492A1 (en) * | 2019-02-20 | 2020-08-27 | 京东方科技集团股份有限公司 | Display device and preparation method therefor |
| CN114068438A (en) * | 2020-07-31 | 2022-02-18 | 河南烯力新材料科技有限公司 | Thin film flip chip packaging structure and display device |
| CN112634764A (en) * | 2021-01-06 | 2021-04-09 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN215730596U (en) * | 2021-08-30 | 2022-02-01 | 惠科股份有限公司 | Display module and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114822291A (en) | 2022-07-29 |
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