CN114813778A - Chip production automatic detection system based on optics CCD module - Google Patents
Chip production automatic detection system based on optics CCD module Download PDFInfo
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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- G06T2207/30148—Semiconductor; IC; Wafer
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Abstract
The invention discloses an automatic chip production detection system based on an optical CCD module, which belongs to the technical field of intelligent detection control and comprises an image acquisition module, a signal processing module, a main control module, a display module and an alarm module; the invention collects and identifies the IC image through the optical CCD module, and greatly improves the collection quality of the IC image by virtue of the performance of high stability and definition, thereby being beneficial to improving the accuracy of chip abnormity detection; in addition, the invention adopts group comparison logic to detect whether the IC placement state in the target area is normal or not, thereby preventing the IC from being damaged in the pick-and-place process due to abnormal IC placement.
Description
Technical Field
The invention relates to the technical field of intelligent detection control, in particular to an automatic chip production detection system based on an optical CCD module.
Background
A chip, generally referred to as a semiconductor product manufactured on the basis of silicon wafer materials, also referred to as integrated circuit, microchip; since the birth of the middle of the twentieth century, chips have been ubiquitous, widely applied to computers, mobile phones, intelligent terminals, other digital electrical appliances and other devices, and are an important component of the modern information social structure; the chip manufacturing process is complex, including: in the production and manufacturing process, a plurality of links such as chip design, wafer manufacturing, packaging manufacturing, cost testing and the like can cause defects which influence the functions and reliability of the chips in each stage of production and manufacturing; therefore, the real-time detection of the chip production and manufacturing process is very important; at present, chips are taken and placed mainly through a mechanical arm in the chip production and manufacturing process, and if the chips are taken and placed abnormally, the chips are easy to be directly or indirectly damaged; the optical CCD can sense optical signals and convert the optical signals into electric signals, has higher resolution and changeable resolution, has the advantages of small volume, light weight, long service life, strong impact resistance, low power consumption and the like, can automatically identify the color, the graph, the character and the like of a product, and has wide application scenes; at present, a detection system which can be used in the chip production and manufacturing process is lacked to carry out real-time detection on the state of an IC (integrated circuit) placed in a jig for loading the IC, so that damage caused when a mechanical arm takes and places the IC due to abnormal position of the IC is prevented; therefore, how to apply the CCD technology to the chip production and manufacturing process, detect the production process in real time, and find out abnormal behaviors and correct them, so as to reduce the chip damage rate has become the key point of research; therefore, an automatic chip production detection system based on the optical CCD module is provided.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides an automatic chip production detection system based on an optical CCD module.
In order to achieve the purpose, the invention adopts the following technical scheme:
an automatic chip production detection system based on an optical CCD module comprises an image acquisition module, a signal processing module, a main control module, a display module and an alarm module;
the image acquisition module, the signal processing module, the main control module and the alarm module are electrically connected through a communication bus; the image acquisition module is arranged on a carrying object, and the carrying object is specifically a mechanical arm;
the signal processing module is specifically a signal acquisition card and comprises a vacuum value reading unit and a Motor stepping value reading unit;
the vacuum value reading unit is used for reading a vacuum value of the carrying object, wherein the vacuum value refers to a generated high-low level change caused by the air pressure change of the vacuum suction nozzle of the carrying equipment, and further generates a digital signal;
the Motor step value reading unit is used for reading a Motor step value of a carrying object;
the image acquisition module is used for acquiring IC images and other information in real time;
the signal processing module is used for performing signal conversion on the collected vacuum value, the collected Motor step value and the collected IC image and transmitting the signals to the main control module for processing;
the main control module is used for judging an IC target, determining and controlling photographing time and detecting and controlling abnormity according to the collected vacuum value, the collected Motor step value and the collected IC image;
the display module is used for displaying an IC image in real time, providing a system operation entrance and displaying other information;
and the alarm module is used for carrying out abnormity alarm according to the corresponding detection result of the abnormity detection.
Furthermore, the image acquisition module is specifically a group of high-definition image acquisition and identification lenses containing 8 optical CCDs, and the optical CCDs can adjust focal length and light source brightness and have high stability and definition.
Further, the communication bus comprises a data bus of the CDD, a CCD power line, an encoder line, a light source extension line, a 32-path signal line, a host power line, a signal line and a keyboard and mouse line.
Further, the signal processing module further comprises an encoder card, and the encoder card is used for reading, identifying and converting the vacuum value, the Motor step value and the IC image, and transmitting the vacuum value, the Motor step value and the IC image to the main control module for processing and identifying.
Further, the main control module further comprises a storage unit, and the storage unit is used for storing the IC image, the system program, the detection parameters, the light source parameters, various signals and the abnormal detection record.
Further, the IC target determination is used to determine whether the corresponding area has an IC target by a vacuum value IC determination technique, and generate an IC target determination result, and the specific process is as follows:
s1: acquiring high and low level change information generated by the air pressure change of a vacuum suction nozzle of the carrying equipment;
s2: and judging whether each suction nozzle has an IC according to the high-low level change information generated by the air pressure change:
if the suction nozzle is low-voltage, namely low level is generated, judging that the IC target exists on the vacuum suction nozzle at this time;
and if the suction nozzle is high-voltage, namely high level is generated, judging that no IC target exists on the vacuum suction nozzle at the moment.
Further, the photo opportunity determination and control adopts a principle that a Motor step value is used for determining the photo opportunity, whether the IC is photographed or not is judged based on an IC target judgment result, and the IC photo opportunity is determined, wherein the specific process is as follows:
SS 1: obtaining an IC target judgment result, and calling a Motor step value if the IC target judgment result is that the IC target is judged to be on the corresponding suction nozzle;
SS 2: comparing and judging the Motor step value with a Motor step value threshold value set in a storage unit:
if the Motor stepping value is within the set Motor stepping value threshold, judging that the mechanical arm has moved to the position where the IC is placed;
otherwise, judging that the mechanical arm is not moved to the position where the IC is placed;
SS 3: and taking the corresponding moment as a photographing opportunity according to the judgment that the mechanical arm is moved to the position where the IC is placed and the detection result of the IC target is abnormal, and controlling the image acquisition module to photograph the abnormal IC by the system.
Further, the abnormality detection and control is used for detecting whether the placement of the IC is normal by using group comparison logic, further judging whether the chip picking and placing actions of the robot arm are abnormal, and preventing the chip from being damaged by the abnormal actions in time, and the specific process is as follows:
SSS 1: selecting a normally placed IC by frames, setting a green detection frame for placing the IC in a standard manner, and synchronously setting the surface brightness characteristics of the IC placed in the standard manner as a detection standard;
SSS 2: acquiring an IC image acquired in real time, and comparing and judging the IC image with the detection standard:
if all the parts of the IC in the IC image are in the green frame area and the brightness characteristics of the surface of the IC are consistent with the brightness of the set detection template, judging that the detected IC is not abnormal;
if any part of the ICs in the IC image or a tiny point of IC edge exceeds the detection frame, judging that the detected ICs are abnormal and generating abnormal information;
SSS 3: and generating an abnormal alarm according to the abnormal information, and automatically stopping the control equipment by the system to wait for personnel to process.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the chip production automatic detection system based on the optical CCD module, IC image acquisition and identification are carried out through a group of high-definition image acquisition and identification lenses containing 8 optical CCDs, and the quality of the acquired IC image is greatly improved by virtue of the high-definition image acquisition and identification lenses with the functions of adjusting the focal length and the light source brightness and the performances of high stability and definition, so that the chip abnormity detection accuracy is improved;
2. the chip production automatic detection system based on the optical CCD module is provided with a vacuum value reading unit, level change information generated by the air pressure change of a vacuum suction nozzle of carrying equipment is obtained, and high and low level judgment is carried out based on a main control module, so that whether an IC target exists on the corresponding suction nozzle or not is judged, and the IC target to be monitored is accurately identified and collected;
3. the automatic chip production detection system based on the optical CCD module is provided with a Motor step value reading unit, and the Motor step value reading unit reads the Motor step value of a carrying object and compares the Motor step value with a Motor step value threshold value in a main control module for judgment, so that the shooting time of an IC target can be accurately identified and determined;
4. this chip production automatic check out system based on optics CCD module, adopt the group to compare logic detection examined IC target and then judge that the action of getting of manipulator to chip is unusual, it carries out the frame selection through the IC of placing a standard, set for the green of IC and detect the frame that a standard placed IC, and set for the detection standard with the surperficial luminance characteristic of the IC that this standard placed also synchronous, thereby be favorable to in time discovering the action of getting of manipulator to chip unusual, carry out unusual action and in time prevent based on host system simultaneously, thereby be favorable to avoiding the direct or indirect damage of chip, and then be favorable to reducing the chip spoilage.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
Fig. 1 is a schematic view of an overall structure of an automatic chip production detection system based on an optical CCD module according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1, the embodiment discloses an automatic detection system for chip production based on an optical CCD module, which comprises an image acquisition module, a signal processing module, a main control module, a display module and an alarm module;
the image acquisition module, the signal processing module, the main control module and the alarm module are electrically connected through a communication bus; the image acquisition module is arranged on a carrying object, and the carrying object is specifically a mechanical arm;
specifically, the communication bus comprises a data bus of the CDD, a CCD power line, an encoder line, a light source extension line, a 32-path signal line, a host power line, a signal line and a keyboard and mouse line.
The signal processing module is specifically a signal acquisition card and comprises a vacuum value reading unit and a Motor stepping value reading unit;
the vacuum value reading unit is used for reading a vacuum value of a carrying object, wherein the vacuum value refers to a high-low level change caused by the air pressure change of a vacuum suction nozzle of carrying equipment, and further generates a digital signal;
the Motor step value reading unit is used for reading a Motor step value of the carrying object;
the image acquisition module is used for acquiring IC images and other information in real time;
specifically, the image acquisition module is a group of high-definition image acquisition and identification lenses comprising 8 optical CCDs, and the optical CCDs can adjust focal length and light source brightness and have high stability and definition;
the points to be explained here are: the module supports the increase or decrease of the CCD lens according to the requirement, and can carry out light source brightness compensation and mechanical focusing.
The signal processing module is used for carrying out signal conversion on the collected vacuum value, the collected Motor step value and the collected IC image and transmitting the signals to the main control module for processing;
specifically, the signal processing module further comprises an encoder card, and the encoder card is used for reading, identifying and converting the vacuum value, the Motor step value and the IC image, and transmitting the vacuum value, the Motor step value and the IC image to the main control module for identification and processing.
The main control module is used for judging an IC target, determining and controlling photographing time and detecting and controlling abnormity according to the collected vacuum value, the acquired Motor step value and the acquired IC image;
specifically, the main control module further comprises a storage unit, wherein the storage unit is used for storing an IC image, a system program, detection parameters, light source parameters, various signals and abnormal detection records;
specifically, the IC target determination is used for determining whether the corresponding area has an IC target by a vacuum value IC determination technique, and generating an IC target determination result, and the specific process is as follows: acquiring the air pressure change of a vacuum suction nozzle of the carrying equipment, and further generating high and low level change information; IC target judgment is carried out according to high-low level change information generated by air pressure change:
if the suction nozzle is low voltage, namely low level is generated, the IC target is judged to be on the corresponding vacuum suction nozzle;
if the suction nozzle is in high voltage, namely, high level is generated, the vacuum suction nozzle is judged to have no IC target at the moment.
Specifically, the photo opportunity determination and control is used for determining the photo opportunity technology by adopting a Motor step value, and determining the IC photo opportunity by judging whether to take a photo or not based on an IC target judgment result, and the specific process is as follows: obtaining an IC target judgment result, and calling a Motor step value if the IC target judgment result is that the IC target is judged to be in the corresponding area; comparing and judging the Motor step value with a Motor step value threshold value in a storage unit:
if the Motor stepping value is within the Motor stepping value threshold value, judging that the mechanical arm has moved to the position where the IC is placed;
otherwise, judging that the mechanical arm is not moved to the position where the IC is placed;
according to the judgment that the mechanical arm moves to the position where the IC is placed, taking the corresponding moment as a photographing time, and enabling the control module to identify the actual photographing and control the image acquisition module to photograph the IC;
specifically, the abnormality detection and control is used for detecting whether the chip picking and placing actions of the mechanical arm are abnormal or not by adopting group comparison logic and preventing the chip from being damaged by the abnormal actions in time, and the specific process is as follows: selecting a standard IC, setting a green detection frame of a normal IC, and synchronously setting the surface brightness characteristics of the standard IC as a detection standard; acquiring an IC image acquired in real time, and comparing and judging the IC image with a detection standard:
if all parts of the IC in the IC image are in the green frame area and the surface brightness of the IC is consistent with the brightness of the set detection template, judging that no abnormity exists;
if any part of the IC in the IC image or a tiny point of IC edge exceeds the detection frame, judging that the detected IC is abnormal and forming abnormal information;
and the control module stops the automatic control equipment and gives an abnormal alarm according to the abnormal information to remind technicians to process the abnormality.
The display module is used for displaying the IC image in real time, providing a system operation entrance and displaying other information;
and the alarm module is used for carrying out abnormity alarm according to a corresponding detection result of the abnormity detection.
The working principle of the automatic detection system for chip production based on the optical CCD module according to the present invention will be described in this embodiment with reference to specific situations, and the specific process is as follows:
in this embodiment, the signal processing module is specifically a signal acquisition card PCI-9111 DG; a vacuum value reading unit in the signal processing module reads a vacuum value of a carrying object, namely a suction nozzle on a mechanical arm, wherein the vacuum value refers to a high-low level change caused by the air pressure change of a vacuum suction nozzle of carrying equipment, and further generates a digital signal;
in the embodiment, the encoder card is specifically an encoder card DMC 3400A; the encoder card reads, identifies and converts the vacuum value and transmits the vacuum value to the main control module for processing and identification;
in this embodiment, the main control module is specifically a system main control host GKH6588SC, and the main control module performs IC target judgment according to the collected vacuum value: whether an IC exists on a corresponding suction nozzle is judged by acquiring the air pressure change of the vacuum suction nozzle of the carrying equipment and further generating high and low level change information.
If the suction nozzle is low voltage, namely low level is generated, judging that the corresponding suction nozzle has an IC target;
if the suction nozzle is high-voltage, namely high level is generated, judging that no IC target exists on the corresponding suction nozzle;
the Motor step value reading unit in the signal processing module reads the Motor step value of the carrying object according to the judgment result of the IC target in the corresponding area, and transmits the Motor step value to the system main control host GKH6588SC after the Motor step value is identified and signal converted by the encoder card;
the system main control host GKH6588SC determines the photo taking time and performs the control action of taking photo or not according to the judgment result of the IC on the corresponding suction nozzle and the matching result of the Motor step value and the Motor step value threshold set in the system, and the specific process is as follows: obtaining an IC target judgment result, and calling a Motor step value if the IC target judgment result is that the IC target is judged to be in the corresponding area; comparing and judging the Motor step value with a Motor step value threshold value in a storage unit:
if the Motor stepping value is within the Motor stepping value threshold value, judging that the mechanical arm has moved to the position where the IC is placed;
otherwise, judging that the mechanical arm does not move to the position where the IC is placed;
according to the judgment that the mechanical arm moves to the position where the IC is placed, taking the corresponding moment as a photographing opportunity, and if the detection result of the detected IC target is abnormal, controlling the image acquisition module to photograph the detected abnormal IC target by the system control module;
in this embodiment, the image capturing module is specifically a set of 8-unit CM130S-60BL type CCD modules, which can capture real-time images of the IC continuously and display the images in real time through the display module, and capture images of the abnormal IC targets according to a photographing instruction sent by the system main control module after detecting the abnormal IC targets.
The system main control host GKH6588SC judges whether the detected IC target is abnormal or not according to the IC image collected by the CCD module in real time and adopts group comparison logic to detect whether the picking and placing actions of the mechanical arm on the chip are abnormal or not, and the specific process is as follows: selecting a standard IC, setting a green detection frame of a normal IC, and synchronously setting the surface brightness characteristics of the standard IC as a detection standard; acquiring an IC image acquired in real time, and comparing and judging the IC image with a detection standard:
if all parts of the IC in the IC image are in the green frame area and the surface brightness of the IC is consistent with the brightness of the set detection template, judging that no abnormity exists;
if any part of the IC in the IC image or a tiny point of IC edge exceeds the detection frame, judging the abnormality and generating abnormal information;
the system main control host GKH6588SC will make automatic equipment switching and stopping actions according to the abnormal detection result, and send an abnormal alarm through an alarm module to remind technicians to handle the abnormality.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. An automatic chip production detection system based on an optical CCD module is characterized by comprising an image acquisition module, a signal processing module, a main control module, a display module and an alarm module;
the image acquisition module, the signal processing module, the main control module and the alarm module are electrically connected through a communication bus; the image acquisition module is arranged on a carrying object, and the carrying object is specifically a mechanical arm;
the signal processing module is specifically a signal acquisition card and comprises a vacuum value reading unit and a Motor stepping value reading unit;
the vacuum value reading unit is used for reading a vacuum value of the carrying object, wherein the vacuum value refers to a digital signal generated by high and low level changes caused by air pressure changes of a vacuum suction nozzle of the carrying equipment;
the Motor step value reading unit is used for reading a Motor step value of a carrying object;
the image acquisition module is used for acquiring IC images and other information in real time;
the signal processing module is used for performing signal conversion on the collected vacuum value, the collected Motor step value and the collected IC image and transmitting the signals to the main control module for processing;
the main control module is used for judging an IC target, determining and controlling photographing time and detecting and controlling abnormity according to the collected vacuum value, the collected Motor step value and the collected IC image;
the display module is used for displaying an IC image in real time, providing a system operation entrance and displaying other information;
and the alarm module is used for carrying out abnormity alarm according to the corresponding detection result of the abnormity detection.
2. The automatic chip production detection system based on the optical CCD module as claimed in claim 1, wherein the image acquisition module is a group of high-definition image acquisition recognition lenses comprising 8 optical CCDs, and the optical CCDs can adjust focal length and light source brightness and have high stability and definition.
3. The automatic chip production detection system based on the optical CCD module as claimed in claim 1, wherein the communication bus comprises CDD data bus, CCD power line, encoder line, light source extension line, 32 signal lines, host power line, signal line and keyboard and mouse line.
4. The automatic detection system for chip production based on optical CCD module of claim 1, wherein the signal processing module further comprises an encoder card, the encoder card is used for reading, identifying and signal converting the vacuum value, the Motor step value and the IC image, and transmitting to the main control module for processing and identifying, and compiling the output command of the main control module to generate photographing, not photographing and making an alarm action.
5. The automatic chip production detection system based on the optical CCD module as recited in claim 1, wherein the main control module further comprises a storage unit, and the storage unit is used for storing IC images, system programs, detection parameters, light source parameters, various signals and abnormal detection records.
6. The automatic chip production detection system based on the optical CCD module as recited in claim 1, wherein the IC target judgment is used for judging whether the corresponding area has an IC target by a vacuum value IC judgment technology to generate an IC target judgment result, and the specific process is as follows:
s1: acquiring high and low level change information generated by the air pressure change of a vacuum suction nozzle of the carrying equipment;
s2: and judging whether each suction nozzle has an IC according to the high-low level change information generated by the air pressure change:
if the suction nozzle is low-voltage, namely low level is generated, judging that the IC target exists on the vacuum suction nozzle at this time;
if the suction nozzle is high voltage, namely high level is generated, the vacuum suction nozzle is judged to have no IC target at the moment.
7. The automatic detection system for chip production based on optical CCD module of claim 1, wherein the photo opportunity determination and control adopts the principle of judging photo opportunity by Motor step value, and determines the photo opportunity of IC by judging whether to take a photo or not based on the IC target judgment result, and the specific process is as follows:
SS 1: obtaining an IC target judgment result, and calling a Motor step value if the IC target judgment result is that the IC target is judged to be on the corresponding suction nozzle;
SS 2: comparing and judging the Motor step value with a Motor step value threshold value set in a storage unit:
if the Motor stepping value is within the set Motor stepping value threshold, judging that the mechanical arm has moved to the position where the IC is placed;
otherwise, judging that the mechanical arm is not moved to the position where the IC is placed;
SS 3: and taking the corresponding moment as a photographing opportunity according to the judgment that the mechanical arm is moved to the position where the IC is placed and the detection result of the IC target is abnormal, and controlling the image acquisition module to photograph the abnormal IC by the system.
8. The automatic chip production detection system based on the optical CCD module as claimed in claim 1, wherein the abnormality detection and control is used for detecting whether the placement of the IC is normal by adopting a group comparison logic so as to judge whether the picking and placing actions of the mechanical arm on the chip are abnormal or not and prevent the chip from being damaged by the abnormal actions in time, and the specific process is as follows:
SSS 1: selecting a normally placed IC by frames, setting a green detection frame for placing the IC in a standard manner, and synchronously setting the surface brightness characteristics of the IC placed in the standard manner as a detection standard;
SSS 2: acquiring an IC image acquired in real time, and comparing and judging the IC image with the detection standard:
if all the parts of the IC in the IC image are in the green frame area and the brightness characteristics of the surface of the IC are consistent with the brightness of the set detection template, judging that the detected IC is not abnormal;
if any part of the ICs in the IC image or a tiny point of IC edge exceeds the detection frame, judging that the detected ICs are abnormal and generating abnormal information;
SSS 3: and generating an abnormal alarm according to the abnormal information, and automatically stopping the control equipment by the system to wait for personnel to process.
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| CN202210480007.2A CN114813778A (en) | 2022-05-05 | 2022-05-05 | Chip production automatic detection system based on optics CCD module |
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| CN202210480007.2A CN114813778A (en) | 2022-05-05 | 2022-05-05 | Chip production automatic detection system based on optics CCD module |
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