CN114800578B - Wafer transmission equipment and control method thereof - Google Patents
Wafer transmission equipment and control method thereof Download PDFInfo
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- CN114800578B CN114800578B CN202210738264.1A CN202210738264A CN114800578B CN 114800578 B CN114800578 B CN 114800578B CN 202210738264 A CN202210738264 A CN 202210738264A CN 114800578 B CN114800578 B CN 114800578B
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- arm
- transmission
- wafer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/025—Arms extensible telescopic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The embodiment of the invention provides wafer transmission equipment and a control method thereof, and relates to the technical field of semiconductors. The wafer transmission equipment comprises a transmission cavity and a mechanical arm, wherein the transmission cavity is of a box structure, an accommodating cavity is formed in the transmission cavity, and connecting ports are formed in the middle parts of four side walls of the transmission cavity; the mechanical arm is arranged in the accommodating cavity and connected to a central position O at the bottom of the transmission cavity, the rotation range of the mechanical arm around the central position O is a circular area Q, the diameter of the circular area Q is larger than the length or width of the transmission cavity, and four connectors extend out of the part of the circular area Q. The wafer transmission equipment can meet the motion requirement of the mechanical arm, is small and compact in size, and greatly saves the occupied space.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a wafer transmission device and a control method thereof.
Background
Currently, in semiconductor processing equipment, wafers are gradually transferred from an atmospheric environment to a process chamber for processing. In the process, the wafer is transferred by a transfer module consisting of a series of atmospheric equipment, vacuum equipment and the like. A robot arm is typically disposed in the transfer module to transfer the wafer into the process chamber through stretching, lifting, and the like. The transmission chamber in the transmission module is designed to avoid the movements of stretching and retracting, lifting and the like of the mechanical arm, so that the size is large, the occupied area of the whole equipment is large, and the semiconductor equipment with high size requirement is not suitable.
Disclosure of Invention
The invention aims to provide a wafer conveying device and a control method thereof, which can meet the motion requirements of a mechanical arm, have small and compact volume and greatly save the occupied space.
Embodiments of the invention may be implemented as follows:
in a first aspect, the present invention provides a wafer transfer apparatus, which includes:
the transmission cavity is of a box structure, an accommodating cavity is formed inside the transmission cavity, and connecting ports are formed in the middle parts of four side walls of the transmission cavity;
and the mechanical arm is arranged in the accommodating cavity and connected to the central position O at the bottom of the transmission cavity, the rotating range of the mechanical arm around the central position O is a circular area Q, the diameter of the circular area Q is greater than the length or width of the transmission cavity, and four connectors extend out of the part of the circular area Q.
The wafer transmission equipment provided by the embodiment of the invention has the beneficial effects that:
the parts of the circular area Q extend out of the connectors on the four side walls of the transmission cavity, and the length and the width of the transmission cavity are equivalent to the diameter 2R of the circular area Q, so that the transmission cavity is small and compact in size, the occupied space is greatly saved, and meanwhile, the movement requirement of the mechanical arm in the accommodating cavity for rotation is met.
In an alternative embodiment, the distance L1 from the two sides of the connection port to the central position O is greater than the radius R of the circular region Q.
Thus, two sides of the connecting port are the nearest parts to the central position O on the side wall of the transmission cavity, and when the distance L1 is greater than the radius R of the circular area Q, the mechanical arm does not interfere with the side wall of the transmission cavity in the rotating process.
In an alternative embodiment, the robot arm comprises a first transmission arm, a second transmission arm and a manipulator arm connected in sequence, wherein the first transmission arm is connected at the central position O, and the end of the manipulator arm is used for clamping or releasing the wafer.
In an alternative embodiment, where the manipulator arm holds the wafer, the overall length L2 of the manipulator arm and wafer is less than the diameter 2R of the circular region Q.
Therefore, the risk that the handling arm clamps the wafer and then collides with the transmission cavity can be reduced.
In an alternative embodiment, in the case of a rotation of the manipulator arm about the central position O, the angle a between the first and second transmission arms and the angle b between the second transmission arm and the manipulator arm are both kept constant and both the angle a and the angle b are smaller than 90 °.
Therefore, the space occupied by the mechanical arm is small, the mechanical arm cannot interfere with the side wall of the transmission cavity in the process of rotating around the central position O, and the volume of the transmission cavity can be designed to be smaller.
In an alternative embodiment, the angle a is 70 °, and the length of the first drive arm is equal to the length of the second drive arm.
In an alternative embodiment, the centre line of the manipulator arm is in the same vertical plane as the centre position O, in case the manipulator arm is rotated around the centre position O.
In this way, the manipulator arm can be designed to be longer, and the transfer chamber can be designed to be smaller, corresponding to the centre line of the manipulator arm coinciding with the diameter of the circular area Q.
In an alternative embodiment, the manipulator arm does not rotate relative to the central position O during extension of the manipulator arm out of the connection port, the angle between the first transmission arm and the second transmission arm gradually increases, the manipulator arm does not rotate relative to the central position O during retraction of the manipulator arm from the connection port, and the angle between the first transmission arm and the second transmission arm gradually decreases.
Therefore, the robot arm occupies a smaller space in the process of extending or retracting, and the transmission cavity can be designed to be smaller.
In an alternative embodiment, a detachable cover plate is arranged on the top of the transmission cavity, and the detachable cover plate is used for disassembling the mechanical arm from the accommodating cavity after being opened.
Therefore, the mechanical arm and the robot can be integrally disassembled and assembled from the top of the transmission cavity without disassembling the mechanical arm.
In a second aspect, the present invention provides a method for controlling a wafer transfer apparatus, where the method is applied to the wafer transfer apparatus of the foregoing embodiment, and the method includes:
in the process of controlling the rotation of the mechanical arm around the central position O, the rotation range of the mechanical arm is a circular area Q, the diameter of the circular area Q is larger than the length or the width of the transmission cavity, and four connecting ports extend out of the part of the circular area Q.
In an alternative embodiment, the mechanical arm includes a first transmission arm, a second transmission arm and an operation arm which are connected in sequence, and under the condition that the mechanical arm is controlled to rotate around the central position O, an included angle a between the first transmission arm and the second transmission arm and an included angle b between the second transmission arm and the operation arm are kept unchanged, and the included angle a and the included angle b are both smaller than 90 °.
In an alternative embodiment, in the case where the robot arm is controlled to rotate about the center position O, the center line of the manipulator arm is located in the same vertical plane as the center position O.
In an alternative embodiment, the manipulator arm does not rotate relative to the central position O during extension of the control robot arm out of the connection port, the angle between the first transmission arm and the second transmission arm gradually increases, and the manipulator arm does not rotate relative to the central position O during retraction of the control robot arm from the connection port, the angle between the first transmission arm and the second transmission arm gradually decreases.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a first view angle of a wafer transfer apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a second view angle of the wafer transmission apparatus according to the embodiment of the present invention;
FIG. 3 is a top schematic view of a transfer chamber;
FIG. 4 is a schematic view of the rotation range of the robot arm;
fig. 5 to 11 are schematic views illustrating the operation of the wafer transferring apparatus.
An icon: 100-wafer transfer equipment; 110-a transmission cavity; 111-a containment cavity; 112-connection port; 113-square mouth; 114-an arcuate mouth; 120-a robot; 130-a robot arm; 131-a first transmission arm; 132-a second drive arm; 133-a manipulator arm; 140-a removable cover plate; 141-quartz glass; 150-placing a bracket; 160-gate valve; 170-sealing cover plate; 180-cover safety interlock switch; 190-wafer detection sensor; 200-a vacuum switch; 210-a vacuum gauge; 220-wafer; 230-a process chamber; 240-positioning the cavity; 250-lifting cavity of wafer box.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or a positional relationship based on that shown in the drawings or that the product of the present invention is used as it is, this is only for convenience of description and simplification of the description, and it does not indicate or imply that the device or the element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
First embodiment
Referring to fig. 1 and 2, the present embodiment provides a wafer transfer apparatus 100, wherein the wafer transfer apparatus 100 includes a transfer chamber 110, a robot 120, a robot arm 130, a removable cover plate 140, a placing support 150, a gate valve 160, a sealing cover plate 170, a cover plate safety interlock switch 180, and a wafer detection sensor 190.
The transmission cavity 110 is a box structure, the transmission cavity 110 is internally provided with a receiving cavity 111, the middle parts of the four side walls of the transmission cavity 110 are provided with connecting ports 112, and the four connecting ports 112 can be used for connecting with other cavities, for example, in the embodiment, two oppositely arranged connecting ports 112 are sealed by a sealing cover plate 170, one connecting port 112 is connected with a process cavity 230 (please refer to fig. 5) by a gate valve 160, and the last connecting port 112 is connected with a positioning cavity 240 (please refer to fig. 5). Wherein, the sealing cover plate 170 can be switched to the gate valve 160 according to the number of the process chambers, and the chamber adaptability is flexible.
The main body of the robot 120 is installed at the bottom of the transmission chamber 110, the robot arm 130 is installed in the accommodating cavity 111 and connected to the central position O at the bottom of the transmission chamber 110, and the robot 120 is used for driving the robot arm 130 (please refer to fig. 3) to rotate and move up and down.
Referring to fig. 3, the top of the transfer chamber 110 is opened with a mounting opening, which includes a square opening 113 and an arc opening 114 connected to an angular position of the square opening 113, so that the robot 120 including the robot arm 130 can be integrally disassembled from the top of the transfer chamber 110 through the mounting opening without disassembling the robot arm.
Referring to fig. 2, a detachable cover plate 140 is disposed on the top of the transmission chamber 110, and the detachable cover plate 140 is used for detaching the robot arm 130 from the accommodating cavity 111 after opening the mounting opening. The middle of the detachable cover plate 140 is provided with quartz glass 141, which is convenient for an operator to observe the condition in the transmission cavity 110 at any time. The edge of the top of the transfer chamber 110 is provided with a placement bracket 150 to facilitate the securing of the removable cover plate 140.
The cover plate safety interlock switch 180 is installed on the detachable cover plate 140, and after the detachable cover plate 140 is opened, the cover plate safety interlock switch 180 controls the moving parts such as the robot 120 and the robot arm 130 to stop moving, thereby improving safety.
The wafer detecting sensor 190 is installed between the gate valve 160 and the transfer chamber 110, and the wafer detecting sensor 190 is used for detecting whether the wafer 220 exists or not, so as to prevent the wafer 220 from being crushed by the gate valve 160 and even damaging the gate valve 160 when the gate valve 160 is closed, thereby improving the stability of the process and reducing the cost.
The vacuum switch 200 and the vacuum gauge 210 are installed at the bottom of the transmission cavity 110, which does not occupy space and is beautiful, the vacuum gauge 210 can monitor the internal pressure of the accommodating cavity 111 in real time, and the vacuum switch 200 can adjust the vacuum degree in the accommodating cavity 111.
Referring to fig. 4, the rotation range of the robot 130 around the center position O is a circular area Q, the diameter of the circular area Q is larger than the length or width of the transmission cavity 110, and four connection ports 112 extend from a portion of the circular area Q. In this way, the length and width of the transmission cavity 110 are both smaller than the diameter 2R of the circular area Q, so that the transmission cavity 110 has a small and compact size, the occupied space is greatly saved, and the motion requirement of the mechanical arm 130 rotating in the accommodating cavity 111 is met.
The distance L1 from the two sides of the connection port 112 to the center position O is larger than the radius R of the circular region Q. Thus, the two side edges of the connection port 112 are the nearest parts to the central position O on the side wall of the transfer chamber 110, and when the distance L1 is greater than the radius R of the circular region Q, the robot arm 130 does not interfere with the side wall of the transfer chamber 110 during the rotation movement.
Preferably, the four angular portions of the receiving cavity 111 extend beyond the circular area Q to prevent the robot arm 130 and the wafer 220 from colliding with the walls of the receiving cavity.
The robot 130 includes a first transmission arm 131, a second transmission arm 132 and a manipulation arm 133 connected in sequence, the first transmission arm 131 is connected at the center position O, and an end of the manipulation arm 133 is used for clamping or releasing the wafer 220. In the case where the wafer 220 is held by the manipulating arm 133, the entire length L2 of the manipulating arm 133 and the wafer 220 is smaller than the diameter 2R of the circular region Q. In this way, the risk of the handling arm 133 hitting the transfer chamber 110 after gripping the wafer 220 can be reduced.
In the case where the robot arm 130 rotates around the center position O, the angle a between the first transmission arm 131 and the second transmission arm 132 and the angle b between the second transmission arm 132 and the operating arm 133 are both kept constant, and both the angle a and the angle b are smaller than 90 °. Where the angle a is preferably 70 °, and where the length of the first transmission arm 131 is equal to the length of the second transmission arm 132, b is 55 °. Thus, the space occupied by the robot 130 is small, and the robot 130 does not interfere with the sidewall of the transfer chamber 110 during the rotation process around the center position O, and the volume of the transfer chamber 110 can be designed to be smaller.
Preferably, in the case where the robot arm 130 rotates about the center position O, the center line of the manipulating arm 133 is located in the same vertical plane as the center position O. Thus, the manipulator arm 133 can be designed to be longer and the transfer chamber 110 can be designed to be smaller, corresponding to the center line of the manipulator arm 133 coinciding with the diameter of the circular area Q.
Referring to fig. 5 to 11, the right side of the wafer transfer apparatus 100 is connected to a process chamber 230, the left side of the wafer transfer apparatus 100 is connected to a positioning chamber 240, and the left side of the positioning chamber 240 is connected to a wafer cassette lifting chamber 250.
The wafer transfer apparatus 100 operates as follows:
1. starting the wafer transferring apparatus 100, and returning the robot arm 130 to the initial position, as shown in fig. 5, the center line of the handling arm 133 coincides with the diameter of the circular area Q, and the handling arm 133 faces the positioning cavity 240 and reaches the required height under the control of the robot 120;
2. the robot arm 130 extends towards the wafer cassette lifting cavity 250, as shown in fig. 6, in the process of extending the robot arm 130, the control arm 133 does not rotate relative to the central position O, the included angle between the first transmission arm 131 and the second transmission arm 132 gradually increases, so that the control arm 133 moves linearly to reach the inside of the wafer cassette lifting cavity 250 through the positioning cavity 240, and thus, in the process of extending the robot arm 130, the occupied space is small, and the transmission cavity 110 can be designed to be smaller;
3. the robot 130 grips the wafer 220 in the pod lift chamber 250, as shown in fig. 7;
4. as shown in fig. 8, in the retracting process of the robot 130, the manipulating arm 133 does not rotate relative to the central position O, and the included angle between the first transmission arm 131 and the second transmission arm 132 gradually decreases, so that the space occupied by the robot 130 is smaller in the retracting process, and the transmission cavity 110 can be designed to be smaller;
5. the robot 130 holds the wafer 220 and rotates in the wafer transfer apparatus 100 until the wafer 220 faces the process chamber 230, as shown in fig. 9 and 10, the robot 130 rotates counterclockwise around the center position O, and the robot 130 does not deform during the rotation until the manipulating arm 133 and the wafer 220 face the process chamber 230;
6. when the robot 130 transfers the wafer 220 into the process chamber 230, as shown in fig. 11, during the extension of the robot 130, the manipulating arm 133 does not rotate relative to the central position O, and the included angle between the first transmission arm 131 and the second transmission arm 132 gradually increases, so that the manipulating arm 133 moves linearly into the process chamber 230.
The wafer transmission device 100 provided by the embodiment of the invention has the beneficial effects that:
1. the part of the circular area Q extends out of the connection ports 112 on the four side walls of the transmission cavity 110, and the length and the width of the transmission cavity 110 are equivalent to the diameter 2R of the circular area Q, so that the transmission cavity 110 is small and compact in size, the occupied space is greatly saved, meanwhile, the movement route of the mechanical arm 130 is planned, the mechanical arm 130 does not interfere with other components, and the movement requirement of the mechanical arm 130 in rotation in the accommodating cavity 111 is met;
2. the detachable cover plate 140 is arranged at the top of the transmission cavity 110, so that the mechanical arm 130 and the robot 120 can be integrally disassembled from the top of the transmission cavity 110 without disassembling the mechanical arm, the quartz glass 141 is arranged on the detachable cover plate 140, an operator can conveniently observe the condition in the transmission cavity 110 at any time, and the cover plate safety interlocking switch 180 is arranged on the detachable cover plate 140, so that the safety is improved;
3. the wafer detection sensor 190 is installed between the gate valve 160 and the transfer chamber 110, so that the wafer 220 is prevented from being crushed by the gate valve 160 and even damaging the gate valve 160 when the gate valve 160 is closed, thereby improving the stability of the process and reducing the cost.
Second embodiment
The present embodiment provides a control method of a wafer transmission apparatus 100, which is applied to the wafer transmission apparatus 100 of the first embodiment, and the control method includes:
1) In the process of controlling the rotation of the robot arm 130 around the central position O, the rotation range of the robot arm 130 is a circular region Q, the diameter of the circular region Q is greater than the length or width of the transmission cavity 110, four connection ports 112 extend out of the circular region Q, an included angle a between the first transmission arm 131 and the second transmission arm 132 and an included angle b between the second transmission arm 132 and the operating arm 133 are kept unchanged, the included angle a and the included angle b are both smaller than 90 °, and the center line of the operating arm 133 and the central position O are located in the same vertical plane;
2) In the process of controlling the mechanical arm 130 to extend out of the connection port 112, the operating arm 133 does not rotate relative to the central position O, and the included angle between the first transmission arm 131 and the second transmission arm 132 gradually increases;
3) During the process of controlling the retraction of the robot arm 130 from the connection port 112, the manipulating arm 133 does not rotate with respect to the center position O, and the angle between the first transmission arm 131 and the second transmission arm 132 gradually decreases.
The beneficial effects of the control method of the wafer transmission equipment 100 provided by the embodiment include:
the robot arm 130 is controlled to clamp, transport and release the wafer 220 in the above manner, so that the requirement on the volume of the accommodating cavity 111 of the wafer transmission equipment 100 is low, the wafer transmission equipment 100 is designed to be small and compact, and the occupied space is saved.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are also within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (5)
1. A wafer transfer apparatus, comprising:
the transmission cavity (110) is of a box structure, an accommodating cavity (111) is formed in the transmission cavity (110), and connecting ports (112) are formed in the middles of four side walls of the transmission cavity (110);
the mechanical arm (130) is installed in the accommodating cavity (111) and connected to a central position O at the bottom of the transmission cavity (110), the rotation range of the mechanical arm (130) around the central position O is a circular area Q, the diameter of the circular area Q is larger than the length or the width of the transmission cavity (110), and four connecting ports (112) are exposed out of the circular area Q;
the mechanical arm (130) comprises a first transmission arm (131), a second transmission arm (132) and a control arm (133) which are connected in sequence, the first transmission arm (131) is connected at the central position O, the end part of the control arm (133) is used for clamping or releasing a wafer (220), and under the condition that the control arm (133) clamps the wafer (220), the integral length L2 of the control arm (133) and the wafer (220) is smaller than the diameter 2R of the circular area Q;
the top of the transmission cavity (110) is provided with a mounting port, the mounting port comprises a square port (113) and an arc port (114) connected to the angular position of the square port (113), and the mounting port is used for integrally dismounting the robot (120) comprising the mechanical arm (130) from the transmission cavity (110);
the distance L1 from the two side edges of the connecting port (112) to the central position O is greater than the radius R of the circular area Q;
under the condition that the mechanical arm (130) rotates around the central position O, an included angle a between the first transmission arm (131) and the second transmission arm (132) and an included angle b between the second transmission arm (132) and the operating arm (133) are kept unchanged;
the included angle a is 70 degrees, the included angle b is 55 degrees, and the length of the first transmission arm (131) is equal to that of the second transmission arm (132);
when the robot arm (130) rotates around the center position O, the center line of the control arm (133) is located in the same vertical plane as the center position O.
2. The wafer transfer apparatus according to claim 1, wherein the manipulating arm (133) does not rotate relative to the center position O during the process of extending the robot arm (130) out of the connection port (112), the included angle between the first driving arm (131) and the second driving arm (132) gradually increases, the manipulating arm (133) does not rotate relative to the center position O during the process of retracting the robot arm (130) from the connection port (112), and the included angle between the first driving arm (131) and the second driving arm (132) gradually decreases.
3. The wafer transferring apparatus according to claim 1, wherein a detachable cover plate (140) is disposed on a top of the transferring chamber (110), and the detachable cover plate (140) is used for disassembling the robot arm (130) from the accommodating cavity (111) after being opened.
4. A control method of a wafer transfer apparatus, wherein the control method is applied to the wafer transfer apparatus of claim 1, the control method comprising:
in the process of controlling the mechanical arm (130) to rotate around the central position O, the rotation range of the mechanical arm (130) is controlled to be a circular area Q, the diameter of the circular area Q is larger than the length or the width of the transmission cavity (110), and four connecting ports (112) extend out of the part of the circular area Q.
5. The method of claim 4, wherein the manipulating arm (133) does not rotate relative to the center position O during the process of controlling the robot arm (130) to extend out of the connection port (112), the included angle between the first transmission arm (131) and the second transmission arm (132) gradually increases, the manipulating arm (133) does not rotate relative to the center position O during the process of controlling the robot arm (130) to retract from the connection port (112), and the included angle between the first transmission arm (131) and the second transmission arm (132) gradually decreases.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210738264.1A CN114800578B (en) | 2022-06-28 | 2022-06-28 | Wafer transmission equipment and control method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210738264.1A CN114800578B (en) | 2022-06-28 | 2022-06-28 | Wafer transmission equipment and control method thereof |
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| CN114800578A CN114800578A (en) | 2022-07-29 |
| CN114800578B true CN114800578B (en) | 2022-10-25 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5934856A (en) * | 1994-05-23 | 1999-08-10 | Tokyo Electron Limited | Multi-chamber treatment system |
| CN106078676A (en) * | 2015-04-27 | 2016-11-09 | 日本电产三协株式会社 | Industrial robot and the system of manufacture |
| CN108122809A (en) * | 2016-11-30 | 2018-06-05 | 圆益Ips股份有限公司 | Base plate processing system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI298895B (en) * | 2004-06-02 | 2008-07-11 | Applied Materials Inc | Electronic device manufacturing chamber and methods of forming the same |
| CN201446534U (en) * | 2009-06-26 | 2010-05-05 | 东莞宏威数码机械有限公司 | Transmission equipment |
| CN212874467U (en) * | 2020-09-25 | 2021-04-02 | 上海微电子装备（集团）股份有限公司 | Transmission system |
-
2022
- 2022-06-28 CN CN202210738264.1A patent/CN114800578B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5934856A (en) * | 1994-05-23 | 1999-08-10 | Tokyo Electron Limited | Multi-chamber treatment system |
| CN106078676A (en) * | 2015-04-27 | 2016-11-09 | 日本电产三协株式会社 | Industrial robot and the system of manufacture |
| CN108122809A (en) * | 2016-11-30 | 2018-06-05 | 圆益Ips股份有限公司 | Base plate processing system |
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| CN114800578A (en) | 2022-07-29 |
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