CN114798701A - Waste integrated circuit board pretreatment device - Google Patents

Abstract

This application belongs to integrated circuit board processing technology field, especially, relate to abandonment integrated circuit board preprocessing device, this application is through high temperature room and low temperature room cooperation, make high temperature room and low temperature room handle abandonment circuit board respectively, the cylinder in the high temperature room separates into tin with integrated circuit board, electronic components and parts and mainboard, and with tin under the effect of cylinder, electronic components separates to the low temperature room, and then realize classification, not only can realize tin, electronic components's low temperature is retrieved, also can realize the high temperature treatment of mainboard.

Description

Waste integrated circuit board pretreatment device

Technical Field

The application belongs to the technical field of integrated circuit board processing, and particularly relates to a waste integrated circuit board preprocessing device.

Background

The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.

At present, integrated circuit board's handling capacity is bigger and bigger, and dumped integrated circuit board is its mainboard, electronic components and weld part mainly, and the weld part is through tin this kind of more noble metal with electronic components welding on the mainboard, and present dumped circuit board is concentrated the packing, and the treatment method is too coarse, does not carry out separation treatment or recovery to tin, electronic components, mainboard wherein.

Disclosure of Invention

In order to solve the above problems, the present application provides a waste integrated circuit board preprocessing device.

The utility model provides a first purpose provides abandonment integrated circuit board preprocessing device, through high temperature room and low temperature room cooperation, make high temperature room and low temperature room handle waste circuit board respectively, the cylinder in the high temperature room separates into tin, electronic components and parts and mainboard with integrated circuit board, and with tin, electronic components separation to low temperature room under the effect of cylinder, and then realize classification, not only can realize tin, electronic components's low temperature is retrieved, also can realize the high temperature treatment of mainboard.

In order to achieve the first purpose of the present application, the technical solution of the present application is:

the pretreatment device for the waste integrated circuit board comprises a high-temperature chamber and a low-temperature chamber which are connected together, a connecting chamber is arranged between the high-temperature chamber and the low-temperature chamber, separation treatment devices are arranged in the high-temperature chamber, the low-temperature chamber and the connecting chamber, the separation treatment devices are slope surfaces, the bottom height of the separation treatment device positioned in the high-temperature chamber is higher than that of the separation treatment device positioned in the low-temperature chamber, bottom frames are arranged at the lower ends of the high-temperature chamber and the low-temperature chamber and used for providing required heat for the high-temperature chamber and the low-temperature chamber, a roller is hinged in the separation treatment devices and comprises a first treatment cabin, a second treatment cabin and a third treatment cabin, a feeding port is arranged on the first treatment cabin, a second cover plate is arranged on the feeding port, a first discharge port is arranged on the second treatment cabin, a second discharge port is arranged on the third treatment cabin, and the size of the first discharge port is larger than that of the second discharge port, the first processing bin is connected with the second processing bin through the first communicating port, the first processing bin is connected with the third processing bin through the second communicating port, and the size of the first communicating port is larger than that of the second communicating port.

Further, the bottom frame includes the frame, be provided with the baffle in the middle of the frame, the baffle divide into low temperature chamber and high temperature chamber with the frame, the low temperature chamber is located the low temperature room lower extreme, the high temperature chamber is located the high temperature chamber lower extreme, the bottom frame periphery is provided with the fluid pump, the high temperature chamber is through leading to the heat pipe and connecting the heater, the fluid pump passes through the blast pipe and connects the high temperature chamber, the fluid pump passes through intake-tube connection low temperature chamber, the intake pipe is interconnect's multistage return bend and straight tube, bottom frame upper end is provided with the closing plate, be provided with the louvre on being provided with fin or the closing plate on the closing plate.

Furthermore, the high-temperature chamber, the low-temperature chamber and the connecting chamber comprise an upper shell and a lower shell, an upper wing plate is arranged at the upper end of the lower shell, a lower wing plate is arranged at the lower end of the lower shell, the lower wing plate is fixedly installed on the bottom framework through bolts, the upper wing plate is fixedly connected with the upper shell through bolts, a blow-off pipe and a first cover plate are arranged on the upper shell, the high-temperature chamber is correspondingly provided with a blow-off pipe and a first cover plate, the low-temperature chamber is correspondingly provided with a blow-off pipe and a first cover plate, and a hanging ring is further arranged on the upper shell.

Further, the lower end of the lower shell is provided with a bottom plate, the bottom plate is located above the lower wing plate to enable the bottom plate and the lower shell to form a cavity, the radiating fins of the sealing plate are located in the cavity, the two ends of the connecting plate of the lower shell are respectively provided with a first limiting plate and a second limiting plate, a first matching plate and a second matching plate are arranged on the separation processing device, and the first matching plate and the second matching plate are located between the first limiting plate and the second limiting plate.

Further, the separation processing apparatus includes high temperature separation storehouse and low temperature separation storehouse, be provided with the connecting plate between high temperature separation storehouse and the low temperature separation storehouse, first cooperation board and second cooperation board set up on the connecting plate, first cooperation board is close to the high temperature separation storehouse, the second cooperation board is close to the low temperature separation storehouse, the cylinder is located the high temperature separation storehouse, the separation processing apparatus lower extreme is provided with the gyro wheel, the bottom plate upper end is provided with the guide rail, the gyro wheel sets up in the guide rail, the low temperature separation storehouse periphery is provided with the fixed plate, the through-hole has been seted up on the lower casing, the outer week of lower casing is provided with the cylinder, the push rod of cylinder passes behind the through-hole with fixed plate fixed connection, the cylinder drives the motion of separation processing apparatus on the guide rail.

Further, the outer gear is arranged on the periphery of the roller, the first speed reduction motor is arranged on the upper shell, the gear is arranged on an output shaft of the first speed reduction motor and located in the upper shell, and when the second matching plate is abutted to the second limiting plate, the gear on the output shaft of the first speed reduction motor is meshed with the outer gear.

Furthermore, one end, away from the first cooperation board, of the second cooperation board is provided with a groove, a spring is installed in the groove, one end, away from the groove, of the spring is provided with a movable board, and when the movable board is in contact with the second limiting board, the spring is extruded to enable the movable board to enter the groove.

Furthermore, a separating plate is arranged in the low-temperature separation bin, the separating plate divides the low-temperature separation bin into two chambers, a bent pipe is arranged in one chamber, the bent pipe comprises at least one U-shaped pipe, a filter is arranged on the bent pipe, a straight pipe is arranged in the other chamber, a tin collecting chamber and a material collecting chamber are arranged at the lower end of the low-temperature chamber, when a second matching plate is abutted against a second limiting plate, the bent pipe is aligned with the tin collecting chamber, the straight pipe is aligned with the material collecting chamber, a rotating plate is arranged on the separating plate, a rotating shaft of the rotating plate is hinged with the separating plate, a rotating disc is arranged at the upper end of the rotating shaft, a notch is arranged on the rotating disc, the notch is shaped like a sector, the central angle corresponding to the sector is smaller than 90 degrees, a second speed reducing motor is arranged on the upper shell, a sector matched with the notch is arranged on the output shaft of the second speed reducing motor, when the second matching plate is abutted against the second limiting plate, the sector is positioned in the notch, the second gear motor drives the rotating plate to rotate.

Further, be provided with the support column in high temperature chamber and the low temperature intracavity, support column upper end and closing plate butt.

The second purpose of this application is to provide abandonment integrated circuit board preprocessing method, through carrying out low temperature treatment to integrated circuit board earlier, the rotation of cooperation cylinder, and then make integrated circuit board's tin, electronic components and mainboard separate to make tin, electronic components collect respectively under the effect of rotor plate and handle, carry out high temperature treatment to integrated circuit board again, and then make the mainboard obtain high temperature treatment, and then accomplish the preliminary treatment of abandonment circuit board.

In order to achieve the second objective of the present application, the technical solution of the present application is:

the pretreatment method of the waste integrated circuit board adopts the pretreatment device of the waste integrated circuit board, and comprises the following steps:

s1, feeding: enabling the roller to be located at an initial position through a controller, opening a first cover plate corresponding to the high-temperature chamber, then opening a second cover plate on the roller, placing the waste integrated circuit board in a first treatment bin of the roller, and closing the first cover plate and the second cover plate;

s2, heating: controlling the heat supplier to increase the temperature of the high-temperature cavity, controlling the temperature of the high-temperature cavity to be 285-;

s3, separation: the controller is utilized to turn on the fluid pump, the fluid pump transfers heat from the high-temperature cavity to the low-temperature cavity, the temperature of the low-temperature cavity is controlled to be 285 plus 315 ℃, the controller is utilized to control the first speed reducing motor to rotate, the roller rotates to enable tin in the first processing bin to enter the third processing bin through the second connecting port, the tin flows out of the high-temperature separation bin from the second discharging port, meanwhile, the controller controls the cylinder to drive the separation processing device to move and enable the second matching plate to be in contact with the second limiting plate, the controller controls the second speed reducing motor to drive the rotating plate to move, and therefore the cavity with the bent pipe arranged in the low-temperature separation bin is communicated with the high-temperature separation bin, the tin flows into the low-temperature separation bin, and the tin flows into the tin collecting chamber after being filtered by the bent pipe on the bent pipe;

after the set time, the controller controls the first speed reducing motor to rotate, so that the roller rotates in the opposite direction, the electronic components enter the second processing bin through the first connecting port, the electronic components fall from the first discharging port and slide out of the high-temperature separation bin along the slope, meanwhile, the controller controls the second speed reducing motor to drive the rotating plate to move, so that a cavity in the low-temperature separation bin, which is provided with the straight pipe, is communicated with the high-temperature separation bin, the electronic components roll into the straight pipe of the low-temperature separation bin, and the electronic components fall into the material collecting chamber after passing through the straight pipe;

s4, reheating: the control heater increases the temperature for the high temperature chamber, closes the fluid pump simultaneously for the temperature control in high temperature chamber is 750 + 950 degrees centigrade, makes the mainboard of the abandonment integrated circuit board in the first processing storehouse by high temperature treatment, handles the settlement time after, closes the heater to make the high temperature chamber cool down, after the cooling is accomplished, takes out the mainboard of high temperature treatment, and the preliminary treatment is accomplished.

Compared with the prior art, the beneficial effect of this application is:

1. this application uses through high temperature room and low temperature room cooperation, and the high temperature room provides required heat for the low temperature room, and the cylinder in the high temperature room is used for separating into mainboard, tin and electronic components with abandonment integrated circuit board, and electronic components and tin and mainboard separation under the low temperature state, can not produce great influence and then make tin and electronic components can be collected to the mainboard at the low temperature.

2. The cylinder of this application divide into first processing storehouse, storehouse and third processing storehouse are handled to the second, hold abandonment integrated circuit board by first processing storehouse, abandonment integrated circuit board also can be through first apron, the second apron department is put into first processing storehouse in, first processing storehouse and second processing storehouse, the third is handled the storehouse and is connected respectively, but storehouse and third processing storehouse are handled to the second and do not communicate, therefore, this application makes tin and electronic components in the first processing storehouse get into the third respectively through the rotation of cylinder and handles the storehouse, the second is handled the storehouse, and the mainboard then can stay in first processing storehouse, and along with the rising of high temperature indoor temperature, mainboard in the first processing storehouse can be handled by high temperature, accomplish the classification of integrated circuit board's different parts.

3. The utility model provides an integrated device includes the bottom frame, go up the casing, the casing down, under the cooperation of bottom frame and casing down, this application can put into the separation processing apparatus on the guide rail of casing down, install the casing and can accomplish its overall function on casing down, drive the motion of separation processing apparatus on the guide rail by the cylinder, and then make the external gear on the cylinder can with gear engagement, and then make the cylinder can realize the separation function, in addition, because the removal of separation processing apparatus, make return bend and straight tube can be connected with collection tin room and collection material room respectively, and then make tin and electronic components can directly get into collection tin room and collection material room, and the cooperation of cooperation board and limiting plate makes high-temperature room and low-temperature room relatively independent, also can produce the positioning action to the removal of separation processing apparatus.

4. The utility model provides a return bend is used for the tin of discharge fluid state, has a small amount of impurity in the tin, and the return bend can slow down the flow velocity of tin, and the filter on the return bend can filter the impurity in the slow tin of flow velocity.

5. This application utilizes the breach cooperation on the carousel on segment and the rotor plate, when separation processing apparatus is driven by the cylinder for segment and breach cooperation, and then make second gear motor can drive the rotor plate and rotate, and then make the low temperature chamber can separate into two independent cavitys, and tin and electronic components in the high temperature chamber can flow into two independent cavitys respectively, accomplish and collect and handle.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application.

FIG. 1 is a schematic overall structure of the present application;

FIG. 2 is a front view structural schematic of the present application;

FIG. 3 is a schematic top view of the present application;

FIG. 4 is a side view structural schematic of the present application;

FIG. 5 is a rear view structural schematic of the present application;

FIG. 6 is a schematic view of the internal structure of the bottom frame of the present application;

FIG. 7 is a schematic top view of the structure of FIG. 6;

FIG. 8 is a schematic view showing the overall structure of the separation treatment apparatus according to the present application in one direction;

FIG. 9 is a schematic view showing the overall structure of the separation treatment apparatus according to the present application in another direction;

FIG. 10 is a schematic top view of the separation apparatus of the present application;

FIG. 11 is a schematic front view of the separation apparatus of the present application;

FIG. 12 is a schematic view of the overall structure of the lower housing of the present application in one orientation;

FIG. 13 is a schematic view of the overall structure of the lower housing of the present application in another orientation;

FIG. 14 is a schematic top view of a lower housing of the present application;

fig. 15 is a schematic view of the entire structure of the drum of the present application.

In the figure: 1. a bottom frame, 2, a lower shell, 3, a low-temperature chamber, 4, a high-temperature chamber, 5, a connecting chamber, 6, a sewage discharge pipe, 7, a ladder stand, 8, a butterfly valve, 9, a first cover plate, 10, a hanging ring, 11, a controller, 12, a partition plate, 13, a fluid pump, 14, an exhaust pipe, 15, an air inlet pipe, 16, a heat conduction pipe, 17, a support column, 18, a low-temperature separation chamber, 19, a high-temperature separation chamber, 20, a roller, 21, a connecting plate, 22, a first matching plate, 23, a second matching plate, 24, a movable plate, 25, a rotating plate, 26, a rotating disc, 27, a fixed plate, 28, a roller, 29, a straight pipe, 31, a filter, 32, a bottom plate, 33, a first limiting plate, 34, a second limiting plate, 35, an upper wing plate, 36, a lower wing plate, 37, a through hole, 38, a guide rail, 39, a side baffle, 40, a first processing chamber, 41, a feed inlet, 42, and a second cover plate, 43. a second processing bin 44, a first discharge port 45, a third processing bin 46, a second discharge port 47 and an external gear.

The specific implementation mode is as follows:

the present application will be further described with reference to the following drawings and examples.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

In the present disclosure, terms such as "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "side", "bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only relational terms determined for convenience in describing structural relationships of the parts or elements of the present disclosure, and do not refer to any parts or elements of the present disclosure, and are not to be construed as limiting the present disclosure.

Example 1

A waste integrated circuit board pretreatment device comprises a high-temperature chamber 4 and a low-temperature chamber 3, wherein the high-temperature chamber 4 and the low-temperature chamber 3 are cavities surrounded by iron, heat-insulating cotton and aluminum heat-insulating shells, a connecting chamber 5 is arranged between the high-temperature chamber 4 and the low-temperature chamber 3, the high-temperature chamber 4 and the low-temperature chamber 3 are communicated by the connecting chamber 5, separation treatment devices are arranged in the high-temperature chamber 4, the low-temperature chamber 3 and the connecting chamber 5, the separation treatment devices are core components of the embodiment, the bottom of the separation treatment devices is a slope surface, specifically, the bottom of the separation treatment devices in the high-temperature chamber 4 is higher than that of the separation treatment devices in the low-temperature chamber 3, so that fluid and components in the separation treatment devices in the high-temperature chamber 4 can flow to the separation treatment devices in the low-temperature chamber 3, the components in the high-temperature chamber are electronic components separated from a mainboard, the fluid is tin separated from the mainboard and the electronic components, the bottom frame 1 is installed at the lower ends of the high-temperature chamber 4 and the low-temperature chamber 3, the bottom frame 1 is used for providing required heat for the high-temperature chamber 4 and the low-temperature chamber 3, and the specific structure of the bottom frame 1 is explained in detail here: bottom frame 1 includes the frame, and the frame is the composite bed structure of inlayer iron plate, middle heat preservation and outside aluminium system shell, is baffle 12 in the middle of the frame, and baffle 12 divide into low temperature chamber and high temperature chamber with the frame, and the low temperature chamber is located 3 lower extremes in low temperature chamber, and the high temperature chamber is located the high temperature chamber lower extreme, and intercommunication, the heat transfer mode in low temperature chamber and high temperature chamber are: the periphery of the bottom frame 1 of this embodiment is installed with a fluid pump 13, such as a plunger pump, the high temperature chamber is connected with a heater through a heat conduction pipe 16, the heater provides the required heat for the high temperature chamber, the fluid pump 13 is connected with the high temperature chamber through an exhaust pipe 14, the fluid pump 13 is connected with the low temperature chamber through an air inlet pipe 15, the air inlet pipe 15 is a multi-section bent pipe 29 and a straight pipe 30 which are connected with each other, so that the heat exchange area of the low temperature chamber is increased, the heat exchange effect is improved, when the low temperature chamber needs to exchange heat with the high temperature chamber, the fluid pump 13 is started, so that the air inlet pipe 15 absorbs heat from the high temperature chamber, in this embodiment, a sealing plate is fixedly installed at the upper end of the bottom frame 1, the sealing plate is fixedly connected with the bottom frame 1 through bolts, when the bottom frame 1 needs to be opened, the sealing plate can be disassembled, heat dissipation holes are installed on the sealing plate, so that the heat in the bottom frame 1 can enter the high temperature chamber 4 or the low temperature chamber 3, in this embodiment, install the fin on the closing plate, not only can guarantee heat exchange efficiency, can also avoid debris to get into bottom frame 1, reduce bottom frame 1's maintenance, as more preferred embodiment, high temperature chamber and low temperature intracavity fixed mounting have support column 17, support column 17 is the welding with bottom frame 1's fixed connection mode, support column 17 upper end and closing plate butt, the bolt can be with support column 17, bottom frame 1's edge links together with bottom frame 1, make the leakproofness of closing plate better, bottom frame 1 in this embodiment also adopts heat preservation and aluminium system shell.

The separation processing device of the embodiment is a core component of the application, a roller 20 is hinged in the separation processing device, one end of the roller 20 is a side baffle 39, two sides of the roller 20 are respectively provided with a hinge shaft to be hinged with the side of the separation processing device, the side baffle 39 is fixedly connected with the hinge shaft, the roller 20 of the embodiment comprises a first processing bin 40, a second processing bin 43 and a third processing bin 45, wherein the volume of the first processing bin 40 is larger than that of the second processing bin 43 and the third processing bin 45, so that more waste integrated circuit boards can be contained, the first processing bin 40 is provided with a feed inlet 41, the feed inlet 41 is a cylinder, the feed inlet 41 is provided with a second cover plate 42, the second cover plate 42 is hinged with the feed inlet 41, the edge of the second cover plate is fixedly connected with the feed inlet 41 through a buckle, the second processing bin 43 is provided with a first discharge outlet 44, the third processing bin 45 is provided with a second discharge hole 46, the first discharge hole 44 is larger than the second discharge hole 46, the first processing bin 40 is connected with the second processing bin 43 through a first communicating port, the first processing bin 40 is connected with the third processing bin 45 through a second communicating port, and the first communicating port is larger than the second communicating port in size, so that the roller 20 is divided into the first processing bin 40, the second processing bin 43 and the third processing bin 45, the first processing bin 40 is used for containing the waste integrated circuit board, the waste integrated circuit board can be placed into the first processing bin 40 through the first cover plate 9 and the second cover plate 42, the first processing bin 40, the second processing bin 43 and the third processing bin 45 are respectively connected, but the second processing bin 43 and the third processing bin 45 are not communicated, so that tin and electronic components in the first processing bin 40 respectively enter the third processing bin 45 through rotation of the roller 20, The second processing chamber 43 and the main board will remain in the first processing chamber 40, and with the temperature increase in the high temperature chamber 4, the main board in the first processing chamber 40 will be processed by high temperature, completing the classification of different components of the integrated circuit board, and the rotation mode of the roller 20 is: the periphery of cylinder 20 is external gear 47, go up fixed mounting and have first gear motor on the casing, it is concrete, go up the casing and install the motor mounting panel, first gear motor installs on the motor mounting panel, want to reach easier speed reduction purpose, the reduction gear can also be installed to this embodiment, first gear motor connects the reduction gear, the reduction gear is reconnected the gear, therefore, here can describe as installing the gear on first gear motor's the output shaft, the gear is located the upper casing, when second cooperation board 23 and second limiting plate 34 butt, gear and the external gear 47 meshing on first gear motor's the output shaft, utilize first gear motor to drive cylinder 20 and rotate.

Continuing to describe the separation processing device, the separation processing device includes a high temperature separation chamber 19 and a low temperature separation chamber 18, a connecting plate 21 is disposed between the high temperature separation chamber 19 and the low temperature separation chamber 18, one end of the connecting plate 21 is welded to the high temperature separation chamber 19, the other end of the connecting plate 21 is welded to the low temperature separation chamber 18, so as to form three cavities, a cavity corresponding to the high temperature separation chamber 19, a cavity corresponding to the low temperature separation chamber 18, and a cavity enclosed by the connecting plate 21, a first matching plate 22 and a second matching plate 23 are disposed on the connecting plate 21, the first matching plate 22 is close to the high temperature separation chamber 19, the second matching plate 23 is close to the low temperature separation chamber 18, the above-mentioned roller 20 is located in the high temperature separation chamber 19, the separation processing device of this embodiment needs to be moved, specifically, a roller 28 is hinged to a lower end of the separation processing device, a guide rail 38 is mounted on an upper end of the bottom plate 32, the guide rail 38 adopts the I-steel of keeping flat can, perhaps the breach steel is better, and the upper end is the track that gyro wheel 28 used, and gyro wheel 28 sets up in guide rail 38, and low temperature separation storehouse 18 periphery fixed mounting fixed plate 27 has seted up through-hole 37 on the casing 2 down, and the cylinder is installed to casing 2 periphery down, and the push rod of cylinder passes behind the through-hole 37 with fixed plate 27 fixed connection, and the cylinder drives the motion of separation processing apparatus on guide rail 38.

More specifically, the one end that first cooperation board 22 is kept away from to second cooperation board 23 is seted up flutedly, install the spring in the recess, the one end fixed mounting fly leaf 24 of recess is kept away from to the spring, when fly leaf 24 and the contact of second limiting plate 34, the spring is extrudeed and is made fly leaf 24 get into in the recess, bottom plate 32 is installed to 2 lower extremes of lower casing, the louvre has been seted up on the bottom plate 32, make bottom plate 32 be located 36 tops of lower pterygoid lamina and then make bottom plate 32 and lower casing 2 vacuole formation, the fin of closing plate is located the cavity, first limiting plate 33 and second limiting plate 34 have been welded respectively at the both ends of the connecting plate 21 of casing 2 down, the last welding of separation processing apparatus has first cooperation board 22 and second cooperation board 23, first cooperation board 22 and second cooperation board 23 are located between first limiting plate 33 and the second limiting plate 34.

The low-temperature separation bin 18 of the present embodiment has the following structure and functions: be provided with the separation plate in the low temperature separation storehouse 18, the separation plate is divided into two cavities with low temperature separation storehouse 18, install return bend 29 in the cavity, return bend 29 includes at least one "U" type pipe, install filter 31 on the return bend 29, filter 31 adopts microporous filter 31, install straight tube 30 in another cavity, 3 lower extremes in low temperature chamber are tin collection room and material collection room, when second cooperation board 23 and the 34 butt of second limiting plate, tin collection room is aimed at to return bend 29, material collection room is aimed at to straight tube 30, tin flows into in the tin collection room, and electronic components then gets into in the material collection room.

In addition, still need install rotor plate 25 on the separation plate of this application, rotor plate 25's effect is two cavities of formation that make low temperature separation storehouse 18 can be independent, rotor plate 25's rotation axis and separation plate are articulated to be connected, this embodiment is for making rotor plate 25 can rotate, simultaneously, avoid second gear motor to be located inside low temperature chamber 3 again, therefore, this embodiment installs carousel 26 on the rotation axis, set up the breach on the carousel 26, the breach becomes fan-shaped, fan-shaped corresponding central angle is less than 90 degrees, and install second gear motor on last casing, and install on second gear motor's output shaft with breach complex sector, when second cooperation board 23 and second limiting plate 34 butt, sector is located the breach, drive rotor plate 25 by second gear motor and rotate.

The embodiment describes the external structure of the application, the high temperature chamber 4, the low temperature chamber 3 and the connection chamber 5 comprise an upper shell and a lower shell 2, wherein an upper wing plate 35 is welded on the upper end of the lower shell 2, a lower wing plate 36 is welded on the lower end of the lower shell 2, a wing plate is also welded on the lower end of the upper shell for cooperating with the upper wing plate 35 on the upper end of the lower shell 2, the lower wing plate 36 is fixedly mounted on the bottom frame 1 through bolts, the upper wing plate 35 is fixedly connected with the upper shell through bolts, a sewage discharge pipe 6 and a first cover plate 9 are mounted on the upper shell, a first cover plate 9 and a first sewage discharge pipe 6 are correspondingly mounted on the high temperature chamber 4, a first cover plate 9 and a hanging ring 10 are correspondingly mounted on the low temperature chamber 3, the hanging ring 10 is also mounted on the upper shell for cooperating with a crane to lift the upper shell, and similarly, the hanging ring 10 is also mounted on the separation processing device, and the two functions are the same, this embodiment still installs butterfly valve 8 on blow off pipe 6, and butterfly valve 8 adopts pneumatic butterfly valve 8, and when high temperature chamber 4 or low temperature chamber 3 during operation, open pneumatic butterfly valve 8 for 6 work of blow off pipe, in addition, this embodiment still installs cat ladder 7 in upper casing or the 2 outside of lower casing, installs handrail, stand, footboard etc. on the cat ladder 7, makes the operator can climb cat ladder 7 and then open first apron 9.

Example 2

A method for pre-treating a waste integrated circuit board, which uses the device disclosed in embodiment 1, includes the following steps:

s1, feeding: the controller 11 makes the roller 20 at the initial position, opens the first cover plate 9 corresponding to the high temperature chamber 4, then opens the second cover plate 42 on the roller 20, places the waste ic board in the first treating chamber 40 of the roller 20, closes the first cover plate 9 and the second cover plate 42;

s2, heating: controlling the heat supplier to increase the temperature of the high-temperature cavity, controlling the temperature of the high-temperature cavity to be 285-;

s3, separation: the fluid pump 13 is turned on by the controller 11, the fluid pump 13 transfers heat from the high-temperature cavity to the low-temperature cavity, so that the temperature of the low-temperature cavity is controlled to be 285-315 ℃, the controller 11 controls the first speed reducing motor to rotate, the roller 20 rotates, tin in the first processing bin 40 enters the third processing bin 45 through the second connecting port, the tin flows out of the high-temperature separation bin 19 from the second discharging port 46, meanwhile, the controller 11 controls the cylinder to drive the separation processing device to move, the second matching plate 23 is in contact with the second limiting plate 34, the controller 11 controls the second speed reducing motor to drive the rotating plate 25 to move, the cavity in the elbow 29 of the low-temperature separation bin 18 is communicated with the high-temperature separation bin 19, the tin flows into the elbow 29 of the low-temperature separation bin 18, and the tin flows into the tin collecting chamber after being filtered by the filter 31 on the elbow 29;

after a set time, the controller 11 controls the first speed reducing motor to rotate, so that the roller 20 rotates in the opposite direction, the electronic components enter the second processing bin 43 through the first connecting port, the electronic components fall from the first discharging port 44 and slide out of the high-temperature separation bin 19 along a slope, meanwhile, the controller 11 controls the second speed reducing motor to drive the rotating plate 25 to move, so that a cavity in the low-temperature separation bin 18, provided with the straight pipe 30, is communicated with the high-temperature separation bin 19, the electronic components roll into the straight pipe 30 of the low-temperature separation bin 18, and the electronic components fall into the material collecting chamber after passing through the straight pipe 30;

s4, reheating: the control heat supplier increases the temperature for the high temperature chamber, closes fluid pump 13 simultaneously for the temperature control in high temperature chamber is in 750-.

The controller 11 in this embodiment is connected to the equipment components for controlling the activation or deactivation thereof, such as pumps, cylinders, motors, heaters, etc.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Although the embodiments of the present application have been described with reference to the accompanying drawings, it is not intended to limit the scope of the present application, and it should be understood by those skilled in the art that various modifications and variations can be made without inventive effort by those skilled in the art.

Claims (10)

1. The pretreatment device for the waste integrated circuit boards is characterized by comprising a high-temperature chamber (4) and a low-temperature chamber (3) which are connected together, wherein a connecting chamber (5) is arranged between the high-temperature chamber (4) and the low-temperature chamber (3), separation treatment devices are arranged in the high-temperature chamber (4), the low-temperature chamber (3) and the connecting chamber (5), the bottoms of the separation treatment devices are slope surfaces, the bottom height of the separation treatment device in the high-temperature chamber (4) is higher than that of the separation treatment device in the low-temperature chamber (3), bottom frames (1) are arranged at the lower ends of the high-temperature chamber (4) and the low-temperature chamber (3), and the bottom frames (1) are used for providing required heat for the high-temperature chamber (4) and the low-temperature chamber (3);

the separation processing device is internally hinged with a roller (20), the roller (20) comprises a first processing bin (40), a second processing bin (43) and a third processing bin (45), a feeding hole (41) is formed in the first processing bin (40), a second cover plate (42) is arranged on the feeding hole (41), a first discharging hole (44) is formed in the second processing bin (43), a second discharging hole (46) is formed in the third processing bin (45), the size of the first discharging hole (44) is larger than that of the second discharging hole (46), the first processing bin (40) is connected with the second processing bin (43) through a first communicating port, the first processing bin (40) is connected with the third processing bin (45) through a second communicating port, and the size of the first communicating port is larger than that of the second communicating port.

2. The pretreatment apparatus for waste integrated circuit boards according to claim 1, wherein the bottom frame (1) comprises an outer frame, a partition plate (12) is provided in the middle of the outer frame, the outer frame is divided into a low temperature chamber and a high temperature chamber by the partition plate (12), the low temperature chamber is located at the lower end of the low temperature chamber (3), and the high temperature chamber is located at the lower end of the high temperature chamber;

the bottom frame (1) is provided with a fluid pump (13) at the periphery, the high-temperature cavity is connected with a heat supply device through a heat conduction pipe (16), the fluid pump (13) is connected with the high-temperature cavity through an exhaust pipe (14), the fluid pump (13) is connected with the low-temperature cavity through an air inlet pipe (15), and the air inlet pipe (15) is a multi-section bent pipe (29) and a straight pipe (30) which are connected with each other;

the upper end of the bottom frame (1) is provided with a sealing plate, and the sealing plate is provided with radiating fins or radiating holes.

3. The pretreatment device for the waste integrated circuit boards according to claim 2, wherein the high temperature chamber (4), the low temperature chamber (3) and the connection chamber (5) comprise an upper shell and a lower shell (2), an upper wing plate (35) is arranged at the upper end of the lower shell (2), a lower wing plate (36) is arranged at the lower end of the lower shell (2), the lower wing plate (36) is fixedly installed on the bottom frame (1) through bolts, and the upper wing plate (35) is fixedly connected with the upper shell through bolts;

the upper shell is provided with a blow-off pipe (6) and a first cover plate (9), the high-temperature chamber (4) is correspondingly provided with a blow-off pipe (6) and a first cover plate (9), the low-temperature chamber (3) is correspondingly provided with a blow-off pipe (6) and a first cover plate (9), and the upper shell is further provided with a hanging ring (10).

4. The waste integrated circuit board pretreatment device according to claim 3, wherein a bottom plate (32) is provided at a lower end of the lower housing (2), the bottom plate (32) is positioned above the lower wing plate (36) such that the bottom plate (32) and the lower housing (2) form a cavity, and the heat sink of the sealing plate is positioned in the cavity;

the two ends of the connecting plate (21) of the lower shell (2) are respectively provided with a first limiting plate (33) and a second limiting plate (34), the separation processing device is provided with a first matching plate (22) and a second matching plate (23), and the first matching plate (22) and the second matching plate (23) are located between the first limiting plate (33) and the second limiting plate (34).

5. The waste integrated circuit board pretreatment device according to claim 4, wherein the separation treatment device comprises a high-temperature separation bin (19) and a low-temperature separation bin (18), a connection plate (21) is arranged between the high-temperature separation bin (19) and the low-temperature separation bin (18), the first matching plate (22) and the second matching plate (23) are arranged on the connection plate (21), the first matching plate (22) is close to the high-temperature separation bin (19), the second matching plate (23) is close to the low-temperature separation bin (18), and the roller (20) is located in the high-temperature separation bin (19);

the lower end of the separation treatment device is provided with a roller (28), the upper end of the bottom plate (32) is provided with a guide rail (38), the roller (28) is arranged in the guide rail (38), the periphery of the low-temperature separation bin (18) is provided with a fixing plate (27), a through hole (37) is formed in the lower shell (2), the periphery of the lower shell (2) is provided with an air cylinder, a push rod of the air cylinder penetrates through the through hole (37) and then is fixedly connected with the fixing plate (27), and the air cylinder drives the separation treatment device to move on the guide rail (38).

6. The waste integrated circuit board pretreatment device according to claim 4, wherein the outer gear (47) is provided on an outer circumference of the drum (20), the first reduction motor is provided on the upper housing, the gear is provided on an output shaft of the first reduction motor, the gear is located in the upper housing, and when the second engagement plate (23) abuts against the second restriction plate (34), the gear on the output shaft of the first reduction motor is engaged with the outer gear (47).

7. The waste integrated circuit board pretreatment device according to claim 4, wherein a groove is formed at an end of the second engagement plate (23) away from the first engagement plate (22), a spring is installed in the groove, a movable plate (24) is disposed at an end of the spring away from the groove, and the spring is pressed to allow the movable plate (24) to enter the groove when the movable plate (24) contacts the second restriction plate (34).

8. The pretreatment device for the waste integrated circuit boards according to claim 4, wherein a separation plate is arranged in the low-temperature separation bin (18), the separation plate divides the low-temperature separation bin (18) into two chambers, one chamber is provided with a bent pipe (29), the bent pipe (29) comprises at least one U-shaped pipe, the bent pipe (29) is provided with a filter (31), the other chamber is provided with a straight pipe (30), the lower end of the low-temperature chamber (3) is provided with a tin collecting chamber and a material collecting chamber, when the second matching plate (23) abuts against the second limiting plate (34), the bent pipe (29) is aligned with the tin collecting chamber, and the straight pipe (30) is aligned with the material collecting chamber;

the separation plate is provided with a rotating plate (25), a rotating shaft of the rotating plate (25) is hinged with the separation plate, a turntable (26) is arranged at the upper end of the rotating shaft, a notch is formed in the turntable (26), the notch is in a fan shape, and the central angle corresponding to the fan shape is smaller than 90 degrees;

go up to be provided with second gear motor on the casing, be provided with on second gear motor's the output shaft with breach complex sector, when second cooperation board (23) and second limiting plate (34) butt, the sector is located the breach, drives rotor plate (25) by second gear motor and rotates.

9. The pretreatment device for waste integrated circuit boards according to claim 2, wherein a support column (17) is provided in the high-temperature chamber and the low-temperature chamber, and an upper end of the support column (17) abuts against the sealing plate.

10. A method for preprocessing a waste integrated circuit board, using the apparatus for preprocessing a waste integrated circuit board according to any one of claims 1 to 9, comprising the steps of:

s1, feeding: enabling the roller (20) to be located at an initial position through the controller (11), opening a first cover plate (9) corresponding to the high-temperature chamber (4), then opening a second cover plate (42) on the roller (20), placing the waste integrated circuit board in a first processing bin (40) of the roller (20), and closing the first cover plate (9) and the second cover plate (42);

s2, heating: the temperature of the high-temperature cavity is increased by controlling the heat supplier, so that the temperature of the high-temperature cavity is controlled to be 285-;

s3, separation: the fluid pump (13) is opened by the controller (11), the fluid pump (13) transfers heat from the high-temperature cavity to the low-temperature cavity, so that the temperature of the low-temperature cavity is controlled to be 285-, the tin flows into the tin collecting chamber after being filtered by a filter (31) on the bent pipe (29);

after the set time, the controller (11) controls the first speed reducing motor to rotate, so that the roller (20) rotates in the opposite direction and further enables the electronic components to enter the second processing bin (43) through the first connecting port, the electronic components drop from the first discharging port (44) and slide out of the high-temperature separation bin (19) along the slope, meanwhile, the controller (11) controls the second speed reducing motor to drive the rotating plate (25) to move so that the cavity in which the straight pipe (30) is arranged in the low-temperature separation bin (18) is communicated with the high-temperature separation bin (19), so that the electronic components roll into the straight pipe (30) of the low-temperature separation bin (18), and the electronic components drop into the collecting chamber after passing through the straight pipe (30);

s4, reheating: the control heat supplier increases the temperature for the high temperature chamber, closes fluid pump (13) simultaneously for the temperature control in high temperature chamber is in 750-.

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