CN114798591A - Air pressure regulating and controlling device and method based on wafer cleaning bin - Google Patents
Air pressure regulating and controlling device and method based on wafer cleaning bin Download PDFInfo
- Publication number
- CN114798591A CN114798591A CN202110113769.4A CN202110113769A CN114798591A CN 114798591 A CN114798591 A CN 114798591A CN 202110113769 A CN202110113769 A CN 202110113769A CN 114798591 A CN114798591 A CN 114798591A
- Authority
- CN
- China
- Prior art keywords
- air pressure
- unit
- controlling
- exhaust pipeline
- cleaning bin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001105 regulatory effect Effects 0.000 title claims abstract description 117
- 238000004140 cleaning Methods 0.000 title claims abstract description 101
- 230000001276 controlling effect Effects 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004891 communication Methods 0.000 claims abstract description 14
- 238000012544 monitoring process Methods 0.000 claims abstract description 11
- 230000009123 feedback regulation Effects 0.000 claims abstract description 7
- 230000033228 biological regulation Effects 0.000 claims description 4
- 239000007789 gas Substances 0.000 description 26
- 235000012431 wafers Nutrition 0.000 description 22
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides an air pressure regulating device and method based on a wafer cleaning bin, wherein the air pressure regulating device based on the wafer cleaning bin comprises: the device comprises a cleaning bin, an exhaust pipeline and a first air pressure feedback adjusting module; the cleaning bin is provided with an exhaust port which is communicated with an exhaust pipeline; the first barometric feedback regulation module includes: the first pressure measuring unit, the first air pressure regulating unit and the first feedback control unit; the first pressure measuring unit and the first air pressure regulating and controlling unit are in communication connection with the first feedback control unit; the first pressure measuring unit is used for monitoring the air pressure in the exhaust pipeline; the first air pressure regulating and controlling unit is used for regulating and controlling the air pressure in the exhaust pipeline; the first feedback control unit is used for controlling the first air pressure regulating and controlling unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to regulate and control the air pressure in the exhaust pipeline to a preset target value. The invention can prevent the gas in the exhaust pipeline from flowing back to the cleaning bin.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to an air pressure regulating device and method based on a wafer cleaning bin.
Background
In the process of cleaning the existing wafer in the cleaning bin, different types of gases are generally required to be used for cleaning, and after the cleaning is completed, the gases are discharged from the cleaning bin or other types of gases are converted to continue cleaning the wafer.
However, when the cleaning bin exhausts or converts gas, the pressure difference between the cleaning bin and the external environment is usually fluctuated, so that the gas in the exhaust pipeline flows back to the cleaning bin easily, the wafer in the cleaning bin is damaged, and the cleaning effect of the wafer is reduced.
Disclosure of Invention
In order to solve the problems, according to the air pressure regulating device and method based on the wafer cleaning bin, the first air pressure feedback regulating module is arranged, so that the air pressure in the exhaust pipeline can be regulated independently, the gas in the exhaust pipeline can be prevented from flowing back into the cleaning bin, the wafer in the cleaning bin is prevented from being damaged, and the wafer cleaning effect is reduced.
In a first aspect, the present invention provides an air pressure control device based on a wafer cleaning chamber, comprising: the device comprises a cleaning bin, an exhaust pipeline and a first air pressure feedback adjusting module;
the cleaning bin is provided with an air outlet which is communicated with the air exhaust pipeline;
the first barometric feedback regulation module includes: the first pressure measuring unit, the first air pressure regulating unit and the first feedback control unit;
the first pressure measuring unit and the first air pressure regulating and controlling unit are in communication connection with a first feedback control unit;
the first pressure measuring unit is used for monitoring the air pressure in the exhaust pipeline;
the first air pressure regulating and controlling unit is used for regulating and controlling the air pressure in the exhaust pipeline;
the first feedback control unit is used for controlling the first air pressure regulating and controlling unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to regulate and control the air pressure in the exhaust pipeline to a preset target value.
Optionally, the air pressure regulating device further comprises: a first control switch unit;
the first air pressure regulating and controlling unit and the first feedback control unit are in communication connection with the first control switch unit;
the first control switch unit is used for controlling the on-off relation between the first air pressure regulating and controlling unit and the exhaust pipeline;
the first feedback control unit is further used for controlling the first control switch unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to control whether the first air pressure regulating and controlling unit is communicated with the exhaust pipeline.
Optionally, the air pressure regulating device further comprises: a communicating pipe and a control valve;
one end of the communicating pipe is communicated with the exhaust port, the other end of the communicating pipe is communicated with the exhaust pipeline, and the control valve is fixedly arranged on the communicating pipe;
the control valve is used for controlling the on-off of the communicating pipe.
Optionally, the air pressure regulating device further comprises: a second air pressure feedback adjusting module;
the second air pressure feedback adjustment module comprises: the second pressure measuring unit, the second air pressure regulating unit and the second feedback control unit;
the second pressure measuring unit and the second air pressure regulating and controlling unit are in communication connection with a second feedback control unit;
the second pressure measuring unit is used for monitoring the air pressure in the cleaning bin;
the second air pressure regulating and controlling unit is used for regulating and controlling the size of an effective aperture in the communicating pipe, and the effective aperture is the smallest circulation aperture in the communicating pipe;
the second feedback control unit is used for controlling the second air pressure regulating and controlling unit according to the air pressure in the cleaning bin monitored by the second pressure measuring unit so as to regulate and control the size of the effective aperture in the communicating pipe.
Optionally, the second air pressure feedback adjustment module further comprises: a third pressure measuring unit;
the third pressure measuring unit is in communication connection with the second feedback control unit;
the third pressure measuring unit is used for monitoring the air pressure in the communicating pipe on one side of the second air pressure regulating unit facing the air outlet;
the second feedback control unit is used for controlling the second air pressure regulating and controlling unit according to the air pressure monitored by the third pressure measuring unit so as to regulate and control the size of the effective aperture in the communicating pipe.
Optionally, the number of the cleaning bins is multiple, and each cleaning bin is connected with one communicating pipe.
Optionally, the number of the exhaust ducts is plural;
each exhaust duct is used for exhausting different kinds of gas from the cleaning bin respectively.
Optionally, the communicating pipe comprises a plurality of air outlets, each air outlet is communicated with one exhaust pipeline, and each air outlet is fixedly connected with one control valve;
the control valve is further used for controlling the on-off of the corresponding air outlet.
Optionally, the first air pressure regulating unit comprises: a fan assembly;
the fan assembly is fixedly arranged on the exhaust pipeline and used for adjusting the exhaust volume of the exhaust pipeline.
In a second aspect, the present invention provides a method for regulating and controlling air pressure based on a wafer cleaning chamber, comprising:
providing a cleaning bin and an exhaust pipeline, wherein an exhaust port of the cleaning bin is communicated with the exhaust pipeline;
acquiring the air pressure in the exhaust pipeline;
and regulating and controlling the air pressure in the exhaust pipeline to a preset target value according to the air pressure in the exhaust pipeline.
Optionally, the method further comprises:
providing a communicating pipe, wherein one end of the communicating pipe is communicated with the exhaust port, and the other end of the communicating pipe is communicated with the exhaust pipeline;
acquiring the air pressure in the cleaning bin;
and regulating and controlling the size of the effective aperture in the communicating pipe according to the air pressure in the cleaning bin, wherein the effective aperture is the smallest circulation aperture in the communicating pipe.
Optionally, the air pressure regulating device further comprises: the first control switch unit is used for controlling the on-off relation between the first air pressure regulating unit and the exhaust pipeline, and the first feedback control unit is also used for controlling the first control switch unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to control whether the first air pressure regulating unit is communicated with the exhaust pipeline;
after the obtaining of the air pressure level within the exhaust conduit, the method further comprises:
providing a first air pressure regulating unit, wherein the first air pressure regulating unit is used for regulating and controlling the air pressure in the exhaust pipeline;
and controlling the on-off relation between the first air pressure regulating and controlling unit and the exhaust pipeline according to the air pressure in the exhaust pipeline.
According to the air pressure regulating device and method based on the wafer cleaning bin, provided by the embodiment of the invention, the first air pressure regulating unit is controlled by the first feedback control unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit through the first air pressure feedback regulating module, so that the air pressure in the exhaust pipeline is regulated to the preset target value, the stability of the air pressure in the exhaust pipeline can be ensured by automatically regulating the air pressure in the exhaust pipeline, the gas in the exhaust pipeline can be prevented from flowing back into the cleaning bin, the wafer in the cleaning bin is prevented from being damaged, and the cleaning effect of the wafer is reduced.
Drawings
Fig. 1 is a schematic structural diagram of an air pressure regulating device according to an embodiment of the present application.
Reference numerals
1. Cleaning a bin; 2. an exhaust duct; 21. a first exhaust pipe; 22. a second exhaust pipe; 23. a third exhaust pipe; 3. a first air pressure feedback regulation module; 31. a first pressure measuring unit; 32. a first air pressure regulating unit; 33. a first feedback control unit; 4. a second air pressure feedback adjusting module; 41. a second pressure measuring unit; 42. a third pressure measuring unit; 43. a second air pressure regulating unit; 44. a second feedback control unit; 5. a communicating pipe; 51. a control valve; 6. a first control switch unit.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
In a first aspect, the present invention provides an air pressure regulating device based on a wafer cleaning chamber 1, and with reference to fig. 1, the air pressure regulating device includes: the device comprises a cleaning bin 1, an exhaust pipeline 2, a first air pressure feedback adjusting module 3, a second air pressure feedback adjusting module 4, a communicating pipe 5 and a control valve 51. The number of the cleaning bin 1, the exhaust pipeline 2, the first air pressure feedback adjusting module 3, the second air pressure feedback adjusting module 4, the communicating pipe 5 and the control valve 51 can be one or more.
In the present embodiment, the number of the cleaning bins 1 is three; the number of the exhaust ducts 2 is three; the number of the first air pressure feedback adjusting modules 3 is three, the number of the second air pressure feedback adjusting modules 4 is three, the number of the communicating pipes 5 is three, and the number of the control valves 51 is nine. Wherein, each cleaning bin 1 is provided with an air outlet, and each air outlet is respectively communicated with a communicating pipe 5; each first air pressure feedback adjusting die is respectively connected with one exhaust pipeline 2, and each communicating pipe 5 is simultaneously communicated with three exhaust pipelines 2; each second air pressure feedback adjusting module 4 is respectively connected with one cleaning bin 1 and a communicating pipe 5 connected with the corresponding cleaning bin 1.
Furthermore, each communicating pipe 5 comprises three air outlets, each air outlet is communicated with one exhaust pipeline 2, nine control valves 51 are fixedly arranged at nine different air outlets respectively, and each control valve 51 can control the on-off of the corresponding air outlet, so that the three cleaning bins 1 can be communicated with the corresponding exhaust pipelines 2 selectively according to the needs of the internal wafer cleaning process to exhaust. The three exhaust pipelines 2 are respectively a first exhaust pipe 21, a second exhaust pipe 22 and a third exhaust pipe 23; the first exhaust pipe 21 is used for discharging alkaline gas; the second exhaust pipe 22 is used for discharging acidic gas; the third exhaust pipe 23 is used to exhaust organic gases including IPA (isopropyl alcohol) gas for drying and NMP (N-Methyl pyrrolidone) gas for stripping photoresist.
Further, each first air pressure feedback regulation module 3 includes: a first pressure measuring unit 31, a first air pressure regulating unit 32 and a first feedback control unit 33. Each exhaust pipeline 2 is also fixedly provided with a first control switch unit 6, and the first pressure measuring unit 31 and the first air pressure regulating and controlling unit 32 are both in communication connection with a first feedback control unit 33; the first air pressure regulating and controlling unit 32 and the first feedback control unit 33 are both in communication connection with the first control switch unit 6; the first pressure measuring unit 31 is configured to monitor the air pressure in the exhaust pipe 2, and the first pressure measuring unit 31 is further configured to monitor the air flow rate in the exhaust pipe 2, and determine the air pressure in the exhaust pipe 2 according to the air flow rate and the cross-sectional size of the exhaust pipe 2; the first air pressure regulating unit 32 is used for regulating and controlling the air pressure in the exhaust pipeline 2; the first feedback control unit 33 is configured to control the first air pressure regulating and controlling unit 32 according to the air pressure in the exhaust pipeline 2 monitored by the first pressure measuring unit 31, so as to regulate and control the air pressure in the exhaust pipeline 2 to a preset target value; the first control switch unit 6 is used for controlling the on-off relation between the first air pressure regulating unit 32 and the exhaust pipeline 2; the first feedback control unit 33 is further configured to control the first control switch unit 6 according to the air pressure in the exhaust pipeline 2 monitored by the first pressure measuring unit 31, so as to control whether the first air pressure regulating and controlling unit 32 is communicated with the exhaust pipeline 2. In the present embodiment, the first pressure measuring unit 31 is a manometer; the first air pressure regulating unit 32 is a fan assembly fixedly disposed on the exhaust duct 2, and the fan assembly is configured to adjust an exhaust amount of the exhaust duct 2.
The preset target value is an air displacement reference value of the air pressure regulating device, namely, the air displacement required by any one of the exhaust pipelines 2 when all the cleaning bins 1 are communicated. Specifically, for example, the exhaust volume of each cleaning bin 1 in the exhaust process is 1000m 3 H, the first air pressure regulating unit 32 ensures that the exhaust volume of the corresponding exhaust pipeline 2 is 3000m all the time 3 And h, each cleaning bin 1 can be stably exhausted. The air pressure regulating device monitors the pressure intensity or the air flow intensity in the exhaust pipeline 2 through the first pressure measuring unit 31, and sends the monitoring result to the first feedback control unit 33, so that the first feedback control unit 33 controls the first air pressure regulating unit 32 or the first control switch unit 6 according to the monitoring result, and the exhaust volume of the exhaust pipeline 2 is 3000m all the time 3 The cleaning bin 1 is not stably exhausted, and meanwhile, when gas is converted, the gas in the exhaust pipeline 2 is prevented from flowing back to the cleaning bin 1, so that the cleaning effect on the wafer is influenced.
In the present embodiment, the exhaust modes of the three cleaning bins 1 include 27 types in total, specifically as table one:
The cleaning bin 1, the cleaning bin 2 and the cleaning bin 3 in the first table correspond to the three cleaning bins 1 from left to right in fig. 1 respectively, and the exhaust pipeline 1, the exhaust pipeline 2 and the exhaust pipeline 3 in the first table correspond to the first exhaust pipe 21, the second exhaust pipe 22 and the third exhaust pipe 23 in fig. 1 respectively. Taking the exhaust scheme 6 as an example, with reference to fig. 1, if the cleaning bin 1 is selectively communicated with the exhaust pipeline 1, the corresponding control valve 51 is opened, the first control switch unit 6 connected with the first exhaust pipe is opened, and the corresponding first air pressure feedback adjusting module 3 is opened, specifically, the first air pressure adjusting and controlling unit 32 connected with the first exhaust pipe 21 is 2000m in size 3 The exhaust gas amount of/h is to supply gas into the first exhaust pipe 21; if the cleaning bin 2 is selectively communicated with the exhaust pipeline 2, the corresponding control valve 51 is opened, the first control switch unit 6 connected with the second exhaust pipe 22 is opened, the corresponding first air pressure feedback regulation module 3 is opened, and specifically, the first air pressure regulation and control unit 32 connected with the second exhaust pipe 22 is opened at 2000m 3 The exhaust gas quantity of/h is to convey gas into the second exhaust pipe 22; if the cleaning bin 3 is selectively communicated with the exhaust pipeline 3, the corresponding control valve 51 is opened, the first control switch unit 6 connected with the third exhaust pipe 23 is opened, the corresponding first air pressure feedback regulation module 3 is opened, and specifically, the first air pressure regulation and control unit 32 connected with the third exhaust pipe 23 is opened at 2000m 3 The exhaust gas amount of/h transports the gas into the third exhaust pipe 23.
Further, the second air pressure feedback adjusting module 4 includes: a second pressure measuring unit 41, a third pressure measuring unit 42, a second air pressure regulating unit 43, and a second feedback control unit 44. The second pressure measuring unit 41 and the second air pressure regulating and controlling unit 43 are both in communication connection with a second feedback control unit 44; the third pressure measuring unit 42 is in communication connection with the second feedback control unit 44; the second pressure measuring unit 41 is used for monitoring the air pressure in the cleaning bin 1; the second air pressure regulating and controlling unit 43 is configured to regulate and control the size of an effective aperture in the communicating pipe 5, where the effective aperture is the smallest flow aperture in the communicating pipe 5; the second feedback control unit 44 is configured to control the second air pressure regulating and controlling unit 43 according to the air pressure in the cleaning bin 1 monitored by the second pressure measuring unit 41, so as to regulate and control the size of the effective aperture in the communicating pipe 5; the third pressure measuring unit 42 is used for monitoring the air pressure in the communicating pipe 5 at the side of the second air pressure regulating unit 43 facing the air outlet; the second feedback control unit 44 is further configured to control the second air pressure regulating and controlling unit 43 according to the air pressure monitored by the third pressure measuring unit 42, so as to regulate and control the size of the effective aperture in the communicating pipe 5.
In this embodiment, the second air pressure control unit 43 is a gas damper, and the gas damper changes the flow rate of the gas in the communicating pipe 5 by changing the size of the effective aperture of the communicating pipe 5. Through setting up second feedback control module can make the stable exhaust of going on in clearance storehouse 1 to further prevent the gas reflux in the exhaust duct 2 to in clearance storehouse 1, thereby reduce the effect of clearance storehouse 1 to the wafer clearance, cause the damage even to the wafer.
Further, the three first feedback control units 33 and the three second feedback control units 44 may be the same total feedback control unit, and the total feedback working medium unit is simultaneously in communication connection with other unit devices in the three first air pressure feedback regulating modules 3 and the three second air pressure feedback regulating modules 4 to correspondingly control the same.
In a second aspect, the present invention provides a method for regulating and controlling air pressure based on a wafer cleaning chamber 1, comprising: providing a cleaning bin and an exhaust pipeline 2, wherein an exhaust port of the cleaning bin is communicated with the exhaust pipeline 2; acquiring the air pressure in the exhaust pipeline 2; and regulating and controlling the air pressure in the exhaust pipeline 2 to a preset target value according to the air pressure in the exhaust pipeline 2.
The method further comprises the following steps: providing a communicating pipe 5, wherein one end of the communicating pipe 5 is communicated with the exhaust port, and the other end of the communicating pipe 5 is communicated with the exhaust pipeline 2; acquiring the air pressure in the cleaning bin 1; and regulating and controlling the size of the effective aperture in the communicating pipe 5 according to the air pressure in the cleaning bin 1, wherein the effective aperture is the smallest circulation aperture in the communicating pipe 5.
The method further comprises the following steps: and regulating and controlling the size of the effective aperture in the communicating pipe 5 according to the pressure intensity in the communicating pipe 5 positioned at one side of the effective aperture facing the cleaning bin 1.
Further, after the obtaining of the air pressure inside the exhaust duct 2, the method further includes: providing a first air pressure regulating unit 32, wherein the first air pressure regulating unit 32 is used for regulating and controlling the air pressure in the exhaust pipeline 2; and controlling the on-off relation between the first air pressure regulating and controlling unit 32 and the exhaust pipeline 2 according to the air pressure in the exhaust pipeline 2. Specifically, when one exhaust duct 2 is communicated with all the cleaning bins 1, the exhaust duct 2 is controlled to be disconnected from the corresponding first air pressure regulating and controlling unit 32; when one exhaust pipeline 2 is communicated with part of the cleaning bins 1 or is not communicated with any cleaning bin 1, the exhaust pipeline 2 is controlled to be communicated with the corresponding first air pressure regulating and controlling unit 32, and the air pressure in the exhaust pipeline 2 is regulated according to the number of the cleaning bins 1 connected with the exhaust pipeline 2.
The method can automatically regulate and control the air pressure in the exhaust pipeline 2 to a preset target value, so that the air pressure in the exhaust pipeline 2 can be automatically regulated, the stability of the air pressure in the exhaust pipeline 2 is ensured, the gas in the exhaust pipeline 2 can be prevented from flowing back to the cleaning bin 1, the wafers in the cleaning bin 1 are prevented from being damaged, and the cleaning effect of the wafers is reduced.
The above description is only for the specific embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (12)
1. The utility model provides an atmospheric pressure regulation and control device based on wafer clearance storehouse which characterized in that includes: the device comprises a cleaning bin, an exhaust pipeline and a first air pressure feedback adjusting module;
the cleaning bin is provided with an air outlet which is communicated with the air exhaust pipeline;
the first barometric feedback regulation module includes: the first pressure measuring unit, the first air pressure regulating unit and the first feedback control unit;
the first pressure measuring unit and the first air pressure regulating and controlling unit are in communication connection with a first feedback control unit;
the first pressure measuring unit is used for monitoring the air pressure in the exhaust pipeline;
the first air pressure regulating and controlling unit is used for regulating and controlling the air pressure in the exhaust pipeline;
the first feedback control unit is used for controlling the first air pressure regulating and controlling unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to regulate and control the air pressure in the exhaust pipeline to a preset target value.
2. The wafer cleaning bin based air pressure regulating device as claimed in claim 1, further comprising: a first control switch unit;
the first air pressure regulating and controlling unit and the first feedback control unit are in communication connection with the first control switch unit;
the first control switch unit is used for controlling the on-off relation between the first air pressure regulating and controlling unit and the exhaust pipeline;
the first feedback control unit is further used for controlling the first control switch unit according to the air pressure in the exhaust pipeline monitored by the first pressure measuring unit so as to control whether the first air pressure regulating and controlling unit is communicated with the exhaust pipeline.
3. The wafer cleaning bin based air pressure regulating device as claimed in claim 1, further comprising: a communicating pipe and a control valve;
one end of the communicating pipe is communicated with the exhaust port, the other end of the communicating pipe is communicated with the exhaust pipeline, and the control valve is fixedly arranged on the communicating pipe;
the control valve is used for controlling the on-off of the communicating pipe.
4. The wafer cleaning bin based air pressure regulating device as claimed in claim 3, further comprising: a second air pressure feedback adjusting module;
the second air pressure feedback adjustment module comprises: the second pressure measuring unit, the second air pressure regulating unit and the second feedback control unit;
the second pressure measuring unit and the second air pressure regulating and controlling unit are in communication connection with a second feedback control unit;
the second pressure measuring unit is used for monitoring the air pressure in the cleaning bin;
the second air pressure regulating and controlling unit is used for regulating and controlling the size of an effective aperture in the communicating pipe, and the effective aperture is the smallest circulation aperture in the communicating pipe;
the second feedback control unit is used for controlling the second air pressure regulating and controlling unit according to the air pressure in the cleaning bin monitored by the second pressure measuring unit so as to regulate and control the size of the effective aperture in the communicating pipe.
5. The wafer cleaning bin based air pressure regulating device according to claim 4, wherein the second air pressure feedback adjusting module further comprises: a third pressure measuring unit;
the third pressure measuring unit is in communication connection with the second feedback control unit;
the third pressure measuring unit is used for monitoring the air pressure in the communicating pipe on one side of the second air pressure regulating unit facing the air outlet;
the second feedback control unit is used for controlling the second air pressure regulating and controlling unit according to the air pressure monitored by the third pressure measuring unit so as to regulate and control the size of the effective aperture in the communicating pipe.
6. The wafer cleaning bin-based air pressure regulating and controlling device as claimed in claim 3, wherein the number of the cleaning bins is multiple, and each cleaning bin is connected with a communicating pipe.
7. The wafer cleaning bin based air pressure regulating device according to any one of claims 3 to 6, wherein the number of the exhaust pipelines is multiple;
each exhaust duct is used for exhausting different kinds of gas from the cleaning bin respectively.
8. The wafer cleaning bin-based air pressure regulating device according to claim 7, wherein the communicating pipe comprises a plurality of air outlets, each air outlet is communicated with one exhaust pipeline, and each air outlet is fixedly connected with one control valve;
the control valve is further used for controlling the on-off of the corresponding air outlet.
9. The wafer cleaning chamber-based air pressure regulating device according to claim 1, wherein the first air pressure regulating unit comprises: a fan assembly;
the fan assembly is fixedly arranged on the exhaust pipeline and used for adjusting the exhaust volume of the exhaust pipeline.
10. A method for regulating and controlling air pressure based on a wafer cleaning bin is characterized by comprising the following steps:
providing a cleaning bin and an exhaust pipeline, wherein an exhaust port of the cleaning bin is communicated with the exhaust pipeline;
acquiring the air pressure in the exhaust pipeline;
and regulating and controlling the air pressure in the exhaust pipeline to a preset target value according to the air pressure in the exhaust pipeline.
11. The wafer cleaning bin based air pressure regulation method of claim 10, further comprising:
providing a communicating pipe, wherein one end of the communicating pipe is communicated with the exhaust port, and the other end of the communicating pipe is communicated with the exhaust pipeline;
acquiring the air pressure in the cleaning bin;
and regulating and controlling the size of the effective aperture in the communicating pipe according to the air pressure in the cleaning bin, wherein the effective aperture is the smallest circulation aperture in the communicating pipe.
12. The wafer cleaning bin based air pressure regulating method according to claim 10, wherein after said obtaining the air pressure level in the exhaust duct, the method further comprises:
providing a first air pressure regulating unit, wherein the first air pressure regulating unit is used for regulating and controlling the air pressure in the exhaust pipeline;
and controlling the on-off relation between the first air pressure regulating and controlling unit and the exhaust pipeline according to the air pressure in the exhaust pipeline.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110113769.4A CN114798591B (en) | 2021-01-27 | 2021-01-27 | Air pressure regulating device and method based on wafer cleaning bin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110113769.4A CN114798591B (en) | 2021-01-27 | 2021-01-27 | Air pressure regulating device and method based on wafer cleaning bin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114798591A true CN114798591A (en) | 2022-07-29 |
| CN114798591B CN114798591B (en) | 2023-08-18 |
Family
ID=82525263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110113769.4A Active CN114798591B (en) | 2021-01-27 | 2021-01-27 | Air pressure regulating device and method based on wafer cleaning bin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114798591B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5616208A (en) * | 1993-09-17 | 1997-04-01 | Tokyo Electron Limited | Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
| CN1215764A (en) * | 1997-10-29 | 1999-05-05 | 三星电子株式会社 | Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method |
| WO2004042487A1 (en) * | 2002-11-08 | 2004-05-21 | Tokyo Electron Limited | Fluid treatment apparatus and fluid treatment method |
| CN1630934A (en) * | 2001-08-31 | 2005-06-22 | 株式会社东芝 | Manufacturing apparatus and method for a semiconductor device, and cleaning method for a semiconductor manufacturing device |
| CN1804114A (en) * | 2004-08-25 | 2006-07-19 | 东京毅力科创株式会社 | Thin film forming device and cleaning method thereof |
| CN101268542A (en) * | 2005-09-19 | 2008-09-17 | 美国阿可利技术有限公司 | Method and apparatus for isolative substrate edge area processing |
| CN104882360A (en) * | 2014-02-27 | 2015-09-02 | 东京毅力科创株式会社 | Cleaning method for plasma processing apparatus |
| CN106575602A (en) * | 2014-08-06 | 2017-04-19 | 应用材料公司 | Post-chamber abatement using upstream plasma sources |
| CN109290321A (en) * | 2017-07-25 | 2019-02-01 | 春田科技顾问股份有限公司 | Blowing-out device and blowing-out method for loading port |
| WO2019156317A1 (en) * | 2018-02-08 | 2019-08-15 | 비에스티(주) | Contaminant discharge device |
| US20200303219A1 (en) * | 2019-03-20 | 2020-09-24 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium |
-
2021
- 2021-01-27 CN CN202110113769.4A patent/CN114798591B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5616208A (en) * | 1993-09-17 | 1997-04-01 | Tokyo Electron Limited | Vacuum processing apparatus, vacuum processing method, and method for cleaning the vacuum processing apparatus |
| CN1215764A (en) * | 1997-10-29 | 1999-05-05 | 三星电子株式会社 | Chemical vapor deposition apparatus for manufacturing semiconductor devices, its driving method |
| CN1630934A (en) * | 2001-08-31 | 2005-06-22 | 株式会社东芝 | Manufacturing apparatus and method for a semiconductor device, and cleaning method for a semiconductor manufacturing device |
| WO2004042487A1 (en) * | 2002-11-08 | 2004-05-21 | Tokyo Electron Limited | Fluid treatment apparatus and fluid treatment method |
| CN1804114A (en) * | 2004-08-25 | 2006-07-19 | 东京毅力科创株式会社 | Thin film forming device and cleaning method thereof |
| CN101268542A (en) * | 2005-09-19 | 2008-09-17 | 美国阿可利技术有限公司 | Method and apparatus for isolative substrate edge area processing |
| CN104882360A (en) * | 2014-02-27 | 2015-09-02 | 东京毅力科创株式会社 | Cleaning method for plasma processing apparatus |
| CN106575602A (en) * | 2014-08-06 | 2017-04-19 | 应用材料公司 | Post-chamber abatement using upstream plasma sources |
| CN109290321A (en) * | 2017-07-25 | 2019-02-01 | 春田科技顾问股份有限公司 | Blowing-out device and blowing-out method for loading port |
| WO2019156317A1 (en) * | 2018-02-08 | 2019-08-15 | 비에스티(주) | Contaminant discharge device |
| US20200303219A1 (en) * | 2019-03-20 | 2020-09-24 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114798591B (en) | 2023-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5986988B2 (en) | Method and apparatus for calibrating a flow control device of a substrate processing system | |
| CN114798591A (en) | Air pressure regulating and controlling device and method based on wafer cleaning bin | |
| KR20220024074A (en) | Multiple vacuum chamber evacuation system and multiple vacuum chamber evacuation method | |
| CN110797278B (en) | Microenvironment pressure control system, semiconductor processing equipment and microenvironment pressure control method | |
| CN112786499B (en) | Liquid supply device | |
| US20240213039A1 (en) | Semiconductor processing system | |
| US20240213042A1 (en) | A fluid routing for a vacuum pumping system | |
| CN211635936U (en) | Drying system for compressed air dew point temperature adjustment | |
| JP4926347B2 (en) | Compressed air supply equipment | |
| CN219309633U (en) | Waste gas treatment device for semiconductor wet process | |
| TWI829872B (en) | Vacuum pumping apparatus and method | |
| CN215831239U (en) | Pressure regulating valve | |
| CN221566369U (en) | Wafer transfer system and epitaxy process equipment | |
| CN210272273U (en) | Heating structure and semiconductor processing apparatus | |
| CN220149658U (en) | Backfill pipeline mechanism for transmission cavity and semiconductor process equipment | |
| CN221407247U (en) | Semiconductor device and discharging device thereof | |
| KR20000003263A (en) | Semiconductor bake installation | |
| JPS614875A (en) | Vacuum exhaust of plasma etching apparatus | |
| CN113565801A (en) | Low-temperature compressor sealing and heat-preserving device and control method thereof | |
| CN112420544A (en) | Heating structure, semiconductor processing apparatus and heating method | |
| GB2606193A (en) | A valve module for a vacuum pumping system | |
| JP2024520040A (en) | Fluid Control Systems | |
| CN114083426A (en) | Pressure control device, polishing head device and chemical mechanical polishing equipment | |
| CN116305905A (en) | Reasonable monitoring and setting method for semiconductor factory data | |
| CN117672947A (en) | Wafer vacuum adsorption protection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |