CN114786398A

CN114786398A - Sealing structure and electronic device

Info

Publication number: CN114786398A
Application number: CN202210219820.4A
Authority: CN
Inventors: 易海平
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2022-03-08
Filing date: 2022-03-08
Publication date: 2022-07-22
Also published as: WO2023169358A1

Abstract

The application discloses seal structure and electronic equipment belongs to waterproof seal technical field. This seal structure includes: the baffle piece is provided with latticed through holes; the sealing support comprises a support body and a first sealing ring, a first through hole penetrating through two end faces of the support body is formed in the support body, an annular groove is formed in the side face of the support body, the first sealing ring is formed on the support body in an injection molding mode, and part of the first sealing ring is accommodated in the annular groove; the first end face of the bracket body close to the annular groove is connected with the edge area of the baffle piece in a sealing way; and the sealing component is in sealing connection with a second end face, deviating from the baffle piece, of the bracket body, and is provided with a second through hole communicated with the first through hole.

Description

Sealing structure and electronic device

Technical Field

This application belongs to communication technology field, concretely relates to seal structure and electronic equipment.

Background

With the increasing popularity of electronic products in daily life, people have increasingly high requirements for the appearance of electronic products.

For example, in order to meet the different aesthetic requirements of users, a plurality of small holes can be formed in the area of the shell of the electronic device corresponding to the loudspeaker, and a plurality of large holes can be formed in the area of the shell corresponding to the loudspeaker.

However, the solution of forming a large hole in the housing of the electronic device can only achieve the conventional waterproof performance, resulting in poor waterproof performance of the electronic device.

Disclosure of Invention

The embodiment of the application aims to provide a sealing structure and electronic equipment, and the problem that the waterproof performance of the electronic equipment is poor can be solved.

In a first aspect, an embodiment of the present application provides a sealing structure, including: the baffle piece is provided with latticed through holes; the sealing support comprises a support body and a first sealing ring, wherein a first through hole penetrating through two end faces of the support body is formed in the support body, an annular groove is formed in the side face of the support body, the first sealing ring is formed on the support body in an injection molding mode, and part of the first sealing ring is accommodated in the annular groove; the first end surface of the bracket body close to the annular groove is connected with the edge area of the baffle piece in a sealing way; and the sealing component is in sealing connection with the second end face, deviating from the baffle piece, of the support body, and a second through hole communicated with the first through hole is formed in the sealing component. In a second aspect, embodiments of the present application provide an electronic device, including a sealing structure as described in the first aspect.

In an embodiment of the present application, the sealing structure may include: the sealing device comprises a baffle piece, a sealing bracket and a sealing component, wherein the baffle piece is provided with a latticed through hole; the sealing support comprises a support body and a first sealing ring, wherein a first through hole penetrating through two end faces of the support body is formed in the support body, an annular groove is formed in the side face of the support body, the first sealing ring is formed on the support body in an injection molding mode, and part of the first sealing ring is accommodated in the annular groove; the first end surface of the bracket body close to the annular groove is connected with the edge area of the baffle piece in a sealing way; the sealing component is connected with a second end face, deviating from the baffle piece, of the support body in a sealing mode, and a second through hole communicated with the first through hole is formed in the sealing component. Therefore, when the sealing structure is installed in the equipment, the first waterproof of the electronic equipment can be realized through the sealing connection between the baffle piece and the equipment shell and between the sealing structure and relevant devices in the equipment, and the second waterproof of the electronic equipment can be realized through the interference between the first sealing ring and the shell, so that the waterproof performance of the electronic equipment can be improved.

Drawings

Fig. 1 is a schematic structural diagram of a sealing structure provided in an embodiment of the present application;

FIG. 2 is a schematic structural view of a seal holder in a seal structure provided by an embodiment of the present application;

FIG. 3 is an exploded view of a seal holder in a seal configuration provided by an embodiment of the present application;

FIG. 4 is a schematic structural view of a seal member in a seal structure provided by an embodiment of the present application;

FIG. 5 is an exploded view of a seal member in a seal configuration provided by an embodiment of the present application;

FIG. 6 is a schematic diagram of a barrier, a third solid adhesive, and a fourth solid adhesive in a seal configuration provided by an embodiment of the present application;

fig. 7 is an exploded view of a barrier, a third solid adhesive, and a fourth solid adhesive in a seal configuration according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 9 is a second schematic structural diagram of an electronic device according to a second embodiment of the present disclosure;

fig. 10 is an enlarged schematic view of the structure shown in B in fig. 9;

wherein the reference numerals in figures 1 to 10 are respectively:

1000-an electronic device;

100-a sealing structure;

110-a barrier;

120-a sealed support; 121-a stent body; 122-a first seal ring; 123-a first via;

130-a sealing member; 131-a second seal ring; 132-a support; 133-a first solid state adhesive; 134-dust screens; 135-a second solid state adhesive; 136-a second via;

140-a third solid state adhesive;

150-a fourth solid state adhesive;

200-a housing; 210-a target via;

300-target device.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments that can be derived by one of ordinary skill in the art from the embodiments given herein are intended to be within the scope of the present disclosure.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/", and generally means that the former and latter related objects are in an "or" relationship.

The sealing structure provided by the embodiment of the application can be applied to electronic equipment, and particularly can be applied to the electronic equipment in a scene where a hole opening device is required to be arranged on a shell of the electronic equipment.

The electronic device in the embodiment of the present application may be a mobile electronic device, and may also be a non-mobile electronic device. By way of example, the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palm top computer, an in-vehicle electronic device, a wearable device (e.g., a smart watch), an ultra-mobile personal computer (UMPC), a netbook or a Personal Digital Assistant (PDA), and the like, and the non-mobile electronic device may be a Personal Computer (PC), a Television (TV), a teller machine, a self-service machine, and the like, and the embodiments of the present application are not limited in particular.

The sealing structure and the electronic device provided by the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

The embodiment of the present application provides a sealing structure, and fig. 1 shows a schematic structural diagram of a possible sealing structure 100 provided in the embodiment of the present application. As shown in fig. 1, a sealing structure 100 provided in an embodiment of the present application may include: the baffle 110, the sealing bracket 120 and the sealing component 130, wherein the baffle 110 is provided with a grid-shaped through hole; referring to fig. 1, as shown in fig. 2 and 3, the sealing bracket 120 includes a bracket body 121 and a first sealing ring 122, the bracket body 121 is provided with a first through hole 123 penetrating two end surfaces of the body, a side surface of the bracket body 121 is provided with an annular groove, the first sealing ring 122 is injection molded on the bracket body 121, and a part of the first sealing ring 122 is accommodated in the annular groove.

In the embodiment of the present application, the first end surface of the bracket body 121 close to the annular groove is connected with the edge region of the baffle 110 in a sealing manner; the sealing member 130 is connected to a second end surface of the bracket body 121 facing away from the baffle 110 in a sealing manner, and as shown in fig. 4, the sealing member 130 is provided with a second through hole 136 communicating with the first through hole 123.

It should be noted that, in this application embodiment, compare in the traditional art between support body and the sealing washer through the mode of gluing to seal, the seal structure that this application embodiment provided can simplify equipment and maintenance between support body and the sealing washer through moulding plastics first sealing washer in the annular groove on the support body to can improve the degree of tightness between support body and the sealing washer, realize that IP68 is sealed. Wherein, IP68 is the highest grade of the standard of the dustproof and waterproof grade in the GB/T4208-2017 shell protection grade.

In the embodiment of the present application, when the sealing structure is disposed in the electronic device, the first sealing ring may be in close contact with/abut against an inner wall of the electronic device housing to achieve an interference seal with the housing, thereby achieving an IP68 seal. The sealing member is used for sealing connection with a device provided corresponding to the sealing structure in the electronic apparatus.

Optionally, in this application embodiment, the support body may be a plastic body. The first sealing ring can be formed by injection molding of liquid silica gel on the plastic body. In practical implementation, the first sealing ring can be made of other materials with better elasticity after injection molding.

So, on the one hand the support body can play the effect of support and spacing first sealing washer to ensure that first sealing washer can realize the interference seal with the inner wall of electronic equipment's casing. On the other hand, the support body can realize the sound/light guiding function through the first through hole.

In the embodiment of the present application, the barrier member needs to have a certain rigidity.

Optionally, in the embodiment of the present application, the material of the blocking member may be metal or nonmetal.

Further alternatively, in the embodiment of the present application, when the material of the barrier member is metal, the metal may be steel, iron, platinum, or the like. The grid-like through holes in the barrier may be achieved by etching techniques.

When the barrier is made of steel, the barrier may also be referred to as a steel mesh structure.

It can be understood that, in the embodiment of the present application, on one hand, the grid-shaped through holes of the blocking member can block the first through holes on the bracket body, so as to avoid elements arranged in the first through holes or opposite to the through holes; the internal features in the first through hole can be prevented from being seen from the outside by the user, and appearance experience is improved. On the other hand, the latticed through holes of the baffle piece can prevent foreign matters in the external environment from entering the first through holes, and the structure and the function of the device arranged on one side, away from the baffle piece, of the first through holes are protected.

Optionally, in this embodiment, the grid-shaped through holes are distributed on the whole barrier. Alternatively, as shown in fig. 1 and 7, the grid-shaped through holes may be distributed in the middle area of the barrier 130, i.e., the edge area of the barrier 130 is not provided with through holes. This can increase the contact area between the barrier 130 and the holder body, so that the sealing strength can be improved.

For example, the edge of the barrier is not etched in the 0.9-1.0mm region.

Alternatively, in the embodiment of the present application, in combination with fig. 1, as shown in fig. 4 and 5, the sealing member 130 may include: and the second sealing ring 131 is connected with a second end face, deviating from the baffle 110, of the bracket body 121 in a sealing manner.

Alternatively, in the embodiment of the present application, as shown in fig. 4 and 5, the sealing member 130 may include a second sealing ring 131 and a support 132, and the second sealing ring 131 is injection-molded on one surface of the support 132.

The second through hole 136 penetrates through the second sealing ring 131 and the support 132, and the target surface of the support 132, which faces away from the second sealing ring 131, is in sealing connection with the second end surface of the bracket body, which faces away from the barrier member.

Further optionally, in this embodiment of the present application, the second sealing ring may be injection molded on the support member by using an in-mold injection molding method.

Optionally, in the embodiment of the present application, the material of the supporting member may be plastic, such as Polycarbonate (PC), or any other material that is hard and has good surface adhesion.

Optionally, in this application embodiment, the second sealing washer can be the silica gel material, and is concrete, can adopt liquid silica gel, carries out the mode of moulding plastics in the mould, moulds plastics the second sealing washer on the supporter.

Optionally, in this embodiment of the application, the number of the second through holes is the same as the number of the first through holes.

So, through add the supporter in sealing member, can avoid the second sealing washer receiving its axis direction's of perpendicular to extrusion force and along the problem that the direction of perpendicular to axis takes place the displacement to can further improve waterproof sealing effect.

Optionally, in the embodiment of the present application, as shown in fig. 4 and 5, the sealing member 130 may further include: and a first solid adhesive member 133 disposed between the support member 132 and the holder body 121, and sealingly connecting the target surface (the surface of the support member 132 facing away from the second seal ring 131) and the second end surface (the end surface of the holder body 121 facing away from the barrier member 110). Therefore, the solid adhesive member can avoid dispensing operation, and the assembly process of the sealing assembly can be simplified.

Optionally, in this embodiment of the application, as shown in fig. 4 and 5, the sealing member 130 may further include: a dust screen 134 and a second solid adhesive 135.

The dust screen 134 is disposed between the first solid adhesive 133 and the bracket body 121, and the first solid adhesive 133 connects the dust screen 134 and the support body in a sealing manner. The second solid adhesive 135 is disposed between the dust screen 134 and the bracket body 121, and hermetically connects the dust screen 134 and the bracket body 121.

Optionally, in this embodiment of the application, the dust screen may further prevent foreign matters in the environment from entering the inside of the electronic device.

Optionally, in this embodiment of the application, with reference to fig. 1, as shown in fig. 6 and 7, the sealing structure 100 may further include: a third solid adhesive 140 and a fourth solid adhesive 150.

The third solid adhesive member 140 is disposed between the barrier member 110 and the frame body 121, and hermetically connects the barrier member 110 and the seal frame 120. The fourth solid adhesive 150 is disposed on a surface of the barrier 110 facing away from the sealing bracket 120, and hermetically connects the barrier 110 with the housing 200 of the electronic device 1000.

It should be noted that, in the embodiment of the present application, the barrier member, the third solid adhesive member, and the fourth solid adhesive member may be assembled together to form the barrier assembly, and then the barrier assembly is connected to the bracket body.

It should be noted that the fourth solid adhesive member is used for sealing and connecting the barrier member and the housing of the electronic device, so as to realize a first IP68 sealing structure between the sealing structure and the electronic device.

In the sealing structure provided by the embodiment of the application, when the sealing structure is installed in equipment, the first waterproof of the electronic equipment can be realized through the sealing connection between the baffle piece and the equipment shell and between the related devices in the sealing structure and the equipment, and the second waterproof of the electronic equipment can be realized through the interference between the first sealing ring and the shell, so that the waterproof performance of the electronic equipment can be improved.

An electronic device 1000 is further provided in the embodiment of the present application, and fig. 1 illustrates a schematic structural diagram of the electronic device 1000 provided in the embodiment of the present application. As shown in fig. 1, an electronic device 1000 provided in an embodiment of the present application may include: the seal structure 100 described above.

Optionally, in this embodiment of the application, as shown in fig. 1, fig. 8 to fig. 10, the electronic device 1000 may further include a housing 200, and the target through hole 210 is disposed on a first side wall of the housing 200.

In the present embodiment, the sealing structure 100 is provided in the housing 200, and the first through-hole 123 is aligned with the target through-hole 210; the barrier 110 of the sealing structure 100 is sealingly connected to the first sidewall and the first sealing ring 122 of the sealing structure 110 abuts against the second sidewall of the housing.

The second side wall is arranged around the first side wall and is perpendicular to the first side wall.

It is understood that, in the embodiment of the present application, the numbers of the target through holes, the first through holes, and the second through holes are all the same. For example, both are two.

In the embodiment of the present application, the first sealing ring abuts against the second sidewall of the housing, that is, the first sealing ring and the second sidewall are sealed in an interference manner.

Optionally, in this embodiment of the application, the barrier may be connected to the first sidewall by a fourth solid adhesive in a sealing manner.

In this way, the barrier in the sealing structure is connected with the first side wall of the shell in a sealing manner, so that the first IP68 sealing of the electronic equipment can be realized; because the first sealing ring in the sealing structure is in interference sealing with the second side wall of the shell, the second IP68 sealing of the electronic equipment can be realized, and thus, the sealing performance of the electronic equipment can be improved.

Optionally, in this embodiment of the application, as shown in fig. 1, fig. 8 to fig. 10, the electronic device 1000 may further include: the target device 300 is disposed in the housing 200 corresponding to the target through-hole 210, and the sealing structure 100 is located between the target through-hole 210 and the target device 300.

Wherein the second sealing ring 131 in the sealing structure 100 abuts on the surface of the target device 300 facing the target through hole 210.

It can be understood that in the embodiment of the present application, the second sealing ring abuts on the surface of the target device facing the target through hole, that is, the second sealing ring is in interference sealing with the surface of the target device facing the target through hole.

Optionally, in this embodiment of the present application, the target device may include any one of: and any devices needing to be provided with holes on the shell of the electronic equipment, such as a loudspeaker, a sound outlet, a receiver and the like.

In the embodiment of the present application, the sealing between the sealing bracket and the target device in the sealing structure is achieved by the sealing member, and the sealing member is connected with the bracket body by the solid adhesive in a sealing manner. Therefore, after the supporting piece is additionally arranged in the sealing component, when the sealing support is in close contact with the sealing component, the second sealing ring and the solid bonding piece can be prevented from being displaced, and therefore the sealing performance of the sealing structure can be improved.

The following describes in detail the advantageous effects of the electronic device provided in the embodiments of the present application.

1) Appearance embodiment of opening a hole of a target device in the electronic equipment is realized through the baffle piece, the third solid-state bonding piece and the fourth solid-state bonding piece (hereinafter, referred to as a baffle component), and meanwhile, the problems that the inner structure is seen and foreign matters enter the whole machine due to the large hole opening are solved, namely, the appearance embodiment problem is solved, and the use reliability problem is also improved.

2) The first IP68 seal of the electronic equipment is realized through the sealed connection of the fourth solid adhesive piece in the barrier assembly and the first side wall of the shell; and a second IP68 seal of the electronic equipment is realized through the interference seal of the first sealing ring and the second side wall of the shell. The sealing is more reliable.

3) First sealing washer is moulded plastics on the support body, has solved equipment and the difficult problem of maintenance of conventional support point glue sealing mode, and is more excellent in the design.

4) The sealing support is sealed with the target device through the sealing component, specifically, through the interference of a second sealing ring in the sealing component and the surface of the target device, which faces the first side wall. Specifically, the second sealing washer among the sealing member has increased the support piece of moulding plastics in the mould towards the surface of first lateral wall to make support piece and solid-state bonding piece sealing connection, then make solid-state bonding piece and support body bond, because the support piece texture is harder, consequently can avoid second sealing washer and solid-state bonding piece to produce circumference dislocation when receiving the extrusion, thereby make the sealed between support body and the second sealing washer more reliable.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element identified by the phrase "comprising an … …" does not exclude the presence of other identical elements in the process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatuses in the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions recited, e.g., the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A seal structure, characterized in that the seal structure comprises:

the baffle piece is provided with latticed through holes;

the sealing support comprises a support body and a first sealing ring, wherein a first through hole penetrating through two end faces of the support body is formed in the support body, an annular groove is formed in the side face of the support body, the first sealing ring is formed on the support body in an injection molding mode, and part of the first sealing ring is accommodated in the annular groove; the first end surface of the bracket body close to the annular groove is in sealing connection with the edge area of the baffle piece;

and the sealing component is in sealing connection with a second end face, deviating from the baffle piece, of the bracket body, and a second through hole communicated with the first through hole is formed in the sealing component.

2. The seal structure of claim 1, wherein the grid-like through-holes are distributed in a middle region of the barrier.

3. The seal structure of claim 1, wherein the seal member includes: the second sealing ring is formed on one surface of the supporting piece in an injection molding mode;

wherein the second through-hole extends through the second seal ring and the support, the support being in sealing connection with the second end face away from a target surface of the second seal ring.

4. The seal structure of claim 3, wherein the seal member further comprises:

and the first solid bonding piece is arranged between the support piece and the bracket body and is used for hermetically connecting the target surface and the second end surface.

5. The seal structure of claim 4, wherein the seal member further comprises:

the dust screen is arranged between the first solid bonding piece and the support body, and the first solid bonding piece is connected with the dust screen and the support body in a sealing mode;

and the second solid-state bonding piece is arranged between the dust screen and the support body and is connected with the dust screen and the support body in a sealing manner.

6. The seal structure of any one of claims 1 to 5, further comprising:

the third solid bonding piece is arranged between the baffle piece and the support body and hermetically connects the baffle piece and the sealed support;

and the fourth solid bonding piece is arranged on the surface of the baffle piece, which is deviated from the sealing support, and is used for sealing and connecting the baffle piece and the shell of the electronic equipment.

7. The seal structure of claim 1, wherein the bracket body is a plastic body; the first sealing ring is formed by injection molding of liquid silica gel on the plastic body.

8. An electronic device characterized by comprising a sealing structure according to any one of claims 1 to 7.

9. The electronic device of claim 8, further comprising:

the device comprises a shell, a first side wall of the shell is provided with a target through hole;

the sealing structure is arranged in the shell, and the first through hole is aligned with the target through hole; a baffle piece in the sealing structure is connected with the first side wall in a sealing mode, and a first sealing ring in the sealing structure abuts against the second side wall of the shell;

wherein the second sidewall is disposed around the first sidewall, and the second sidewall is perpendicular to the first sidewall.

10. The electronic device of claim 9, further comprising:

a target device disposed within the housing corresponding to the target through hole, the sealing structure being located between the target through hole and the target device;

wherein the second sealing ring in the sealing structure abuts on the surface of the target device facing the target through hole.