CN114783910A - Transfer device of LED chip, chip assembly process and display screen - Google Patents

Transfer device of LED chip, chip assembly process and display screen Download PDF

Info

Publication number
CN114783910A
CN114783910A CN202210350221.6A CN202210350221A CN114783910A CN 114783910 A CN114783910 A CN 114783910A CN 202210350221 A CN202210350221 A CN 202210350221A CN 114783910 A CN114783910 A CN 114783910A
Authority
CN
China
Prior art keywords
chip
electrode
led chip
led
transfer device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210350221.6A
Other languages
Chinese (zh)
Inventor
李林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority to CN202210350221.6A priority Critical patent/CN114783910A/en
Publication of CN114783910A publication Critical patent/CN114783910A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The application provides transfer device, assembly process and display screen of chip of LED chip, transfer device of LED chip includes: a transfer head having a mounting side with a chip mounting location, the transfer head configured to secure the chip to the chip mounting location and move the LED chip; a drive device mounted on the mounting side; the isolator is connected with the driving device and is arranged close to the chip mounting position; the isolator has an idle state and an isolated state; in an isolation state, the isolator is arranged corresponding to the chip mounting position and is positioned between the P electrode and the N electrode so as to separate the P electrode from the N electrode; in the idle state, the isolator is far away from the chip mounting position. The application provides a transfer device of LED chip is favorable to improving the yield of product.

Description

Transfer device of LED chip, chip assembly process and display screen
Technical Field
The application belongs to the technical field of display, and particularly relates to a transfer device of an LED chip, an assembly process of the chip and a display screen.
Background
With the development of technology, micro leds (micro light emitting diodes) are more and more widely used. During its assembly, the LED chip needs to be transferred onto a circuit substrate. In the transferring and mounting process, solder paste is required to be arranged on the P pole and the N pole of the LED chip, and the LED chip is mounted on the circuit substrate after the solder paste is melted. Because the P pole and the N pole are very close to each other, the melted solder paste is easily connected together, and the P pole and the N pole are short-circuited. The yield of the product cannot be guaranteed, and the use of the MicroLED is not facilitated.
Disclosure of Invention
The embodiment of the application provides a transfer device of an LED chip, an assembly process of the chip and a display screen, and aims to solve the problem that existing solder paste on a P pole and an N pole is easy to connect.
In a first aspect, an embodiment of the present application provides a transfer device for an LED chip, where the LED chip has a P electrode and an N electrode that are disposed adjacently, the transfer device for an LED chip includes:
a transfer head having a mounting side with a chip mounting location, the transfer head configured to secure a chip to the chip mounting location and move the LED chip;
a drive device mounted on the mounting side;
the isolator is connected with the driving device and is arranged close to the chip mounting position;
the isolator has an idle state and an isolated state; under the isolation state, the isolator is arranged corresponding to the chip mounting position and is positioned between the P electrode and the N electrode to separate the P electrode from the N electrode; in the idle state, the isolator is far away from the chip mounting position.
Optionally, the driving device includes a first driving body and a telescopic assembly, the first driving body is mounted on the mounting side, and one end of the telescopic assembly is connected with the first driving body;
the isolation piece is connected with the telescopic assembly, so that the isolation piece can move along with the telescopic assembly to realize the switching between the idle state and the isolation state.
Optionally, the telescopic assembly comprises any one of an electric telescopic rod, a telescopic cylinder and a telescopic hydraulic cylinder.
Optionally, the driving device includes a second driving body and a swing assembly, the second driving body is mounted on the mounting side, and one end of the swing assembly is connected to the second driving body; the separator has elasticity;
the isolator swings with the swing assembly, so that the isolator can move along with the swing assembly to realize the switching between the idle state and the isolation state.
Optionally, the swing assembly comprises a swing arm, and a distance between a free end of the swing arm and the mounting side in the idle state is larger than a distance between the free end of the swing arm and the mounting side in the isolation state.
Optionally, in an isolated state, one side of the isolator abuts against the chip body of the LED chip; and/or the presence of a gas in the gas,
under the isolation state, one side of the isolating piece, which is back to the circuit substrate of the LED chip, protrudes out of one side of the P electrode and the N electrode, which are provided with the solder paste.
Optionally, the separator is sheet-like and has elasticity.
Optionally, the transfer device of the LED chip further includes a detection sensor and a control circuit electrically connected to each other, the detection sensor is configured to detect whether the LED chip is mounted on the chip mounting position, and the control circuit controls the driving device to switch the idle state and the isolation state of the isolator according to a detection result of the detection chip.
In a second aspect, an embodiment of the present application further provides a chip assembly process, where the chip assembly process uses the transfer device for LED chips as described in any one of the above, and the chip assembly process includes:
the transfer head grabs the LED chip so that the LED chip is positioned at the chip mounting position;
the driving device controls the separator to move between the P electrode and the N electrode so as to separate the P electrode from the N electrode;
arranging solder paste on the P electrode and the N electrode, and/or arranging solder paste on the circuit substrate at positions corresponding to the P electrode and the N electrode;
and melting the solder paste and attaching the LED chip to the circuit substrate.
In a third aspect, an embodiment of the present application further provides a display screen, where the display screen includes an LED chip, and the transfer of the LED chip is completed by the transfer device of the LED chip in the foregoing embodiment; and/or the presence of a gas in the atmosphere,
the mounting of the LED chip is completed according to the assembly process of the chip in the above embodiment.
According to the LED chip transfer device provided by the embodiment of the application, the chip mounting position is arranged on the mounting side of the transfer head, so that the position of the LED chip on the transfer head is relatively fixed, and the spacer can move to the position between the P electrode and the N electrode to separate the P electrode from the N electrode or move to the position far away from the chip mounting position through the arrangement of the driving device and the spacer; therefore, in the transferring process of the LED chip, the transferring head firstly adsorbs the LED chip and fixes the LED chip at the chip mounting position, and the isolating piece is in an idle state at the moment; before melting the solder paste (being used for being fixed in circuit substrate with the LED chip), drive arrangement drive separator enters into isolated state to separate P electrode and N electrode, thereby the phenomenon that the solder paste that appears on P electrode and the N electrode when avoiding the solder paste to melt flows together appears, thereby has avoided the short circuit of P electrode and N electrode, is favorable to improving the yield of product.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be derived from these drawings by a person skilled in the art without inventive effort.
For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.
Fig. 1 is a schematic flow chart of a chip assembly process according to an embodiment of the present disclosure.
Fig. 2 is a schematic view of a first structure idle state of a transfer device for LED chips according to an embodiment of the present disclosure.
Fig. 3 is a schematic structural view of an isolation state of the transfer device of the LED chip shown in fig. 2.
Fig. 4 is a schematic view of an idle state of a second structure of a transfer device for LED chips according to an embodiment of the present disclosure.
Fig. 5 is a schematic structural view of an isolation state of the transfer device of the LED chip shown in fig. 4.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a transfer device of an LED chip 300, a chip assembly process and a display screen, so as to solve the problem that a P pole and an N pole are easily conducted when the LED chip 300 is transferred by the existing transfer device of the LED chip 300. The LED is exemplified by a micro LED (micro light emitting diode), which can be widely used in the display field, especially in the display screen. The following description will be made with reference to the accompanying drawings.
The transfer device of the LED chip 300 provided in the embodiment of the present application can be applied to a chip assembly process, for example, please refer to fig. 1, and fig. 1 is a schematic flow chart of the chip assembly process provided in the embodiment of the present application. The assembly process of the chip can be applied to the production of display screens such as mobile phone display screens, computer display screens, television display screens and the like.
In order to more clearly illustrate the structure of the transferring device of the LED chip 300, the transferring device of the LED chip 300 will be described below with reference to the accompanying drawings.
For example, please refer to fig. 2 to 5, fig. 2 is a schematic diagram of a first structure idle state of a transfer device of an LED chip 300 according to an embodiment of the present disclosure. Fig. 3 is a schematic structural diagram of the isolated state of the transfer device of the LED chip 300 shown in fig. 2. Fig. 4 is a schematic diagram of an idle state of a second structure of a transfer device of an LED chip 300 according to an embodiment of the present disclosure. Fig. 5 is a schematic structural diagram of an isolation state of the transfer device of the LED chip 300 shown in fig. 4.
The LED chip 300 has a P electrode 320 and an N electrode 330 adjacently disposed, and the transferring means of the LED chip 300 includes: a transfer head 100, the transfer head 100 having a mounting side with a chip mounting location, the transfer head 100 configured to secure a chip to the chip mounting location and move the LED chip 300; a driving device 600 mounted on the mounting side; a spacer 700, the spacer 700 being connected to the driving device 600 and disposed adjacent to the chip mounting site; the barrier 700 has an idle state and a barrier state; in the isolated state, the spacer 700 is disposed corresponding to the chip mounting site and located between the P electrode 320 and the N electrode 330 to separate the P electrode 320 from the N electrode 330; in the idle state, the spacer 700 is disposed away from the chip mounting site.
Specifically, in the present embodiment, the transfer head 100 may have various forms, such as suction by negative pressure, clamping by a clamp, and the like. The transfer head 100 may have various shapes such as a cylinder shape, a square column shape, etc., and one side thereof is connected to a transfer drive, so that the transfer head 100 may move to a predetermined station and move according to a predetermined trajectory. For example, the swing mechanism may be any one of or a combination of a plurality of ways of rotation, up, down, left and right movement, left and right swing, and front and back swing. The mounting side 110 of the transfer head 100 is used for mounting the LED chip 300 (for example, a micrometer light emitting diode), and in some embodiments, for better positioning of the LED chip 300, a chip mounting site may be provided on the mounting side 110, so that the position of the LED chip 300 on the mounting side 110 is fixed, and thus the positions of the P-electrode 320 and the N-electrode 330 of the LED chip 300 are also fixed. In this manner, the spacer 700 can be more accurately moved between the P electrode 320 and the N electrode 330.
The driving unit 600 may have many forms, such as a rotary shaft motor, a linear driving motor, a driving cylinder, a driving hydraulic cylinder, etc., and the driving unit 600 may directly drive the spacer 700 to move between the P electrode 320 and the N electrode 330. Of course, in some embodiments, the driving device 600 may include a driving body and a transmission assembly (e.g., a rotation assembly, a swing assembly 640, etc.), and the driving of the partition 700 may be achieved through a combination of the driving body and the transmission assembly. The spacer 700 may have various forms, such as a rod, a plate, a sheet, and the like. Under the action of the driving device 600, the spacer 700 may move relative to the transfer head 100, so that the spacer 700 has a spaced state and an idle state.
In this embodiment, by providing a chip mounting location on the mounting side of the transfer head 100, the position of the LED chip 300 on the transfer head 100 is relatively fixed, and by providing the driving device 600 and the spacer 700, the spacer 700 can be moved to a position between the P electrode 320 and the N electrode 330 to separate the P electrode 320 and the N electrode 330, and can also be moved to a position away from the chip mounting location; thus, in the transferring process of the LED chip 300, the transferring head 100 firstly adsorbs the LED chip 300, and fixes the LED chip 300 at the chip mounting position, and at this time, the spacer 700 is in an idle state; before melting the solder paste 500 (for fixing the LED chip 300 to the circuit substrate), the driving device 600 drives the spacer 700 to enter the isolation state to separate the P electrode 320 and the N electrode 330, so as to avoid the phenomenon that the solder paste 500 on the P electrode 320 and the N electrode 330 flows together when the solder paste 500 is melted, thereby avoiding the short circuit of the P electrode 320 and the N electrode 330, and being beneficial to improving the yield of the product.
In various embodiments, the driving of the spacer 700 may be performed by various driving devices 600, as will be described in more detail below.
In some embodiments, the driving device 600 includes a first driving body 610 and a telescopic assembly 620, the first driving body 610 is mounted on the mounting side, and one end of the telescopic assembly 620 is connected with the first driving body 610; isolator 700 is coupled to telescoping assembly 620 such that isolator 700 can move with telescoping assembly 620 to effect a switch between an idle state and an isolated state. Specifically, in this embodiment, the first driving body 610 may be a driving motor, and the telescopic assembly 620 is configured to cooperate with the first driving body 610 to achieve a linear reciprocating motion of the spacer 700 in a preset direction through extension and contraction. Wherein, flexible subassembly 620 includes any one in electric telescopic handle, flexible cylinder and flexible pneumatic cylinder.
In other embodiments, the driving device 600 includes a second driving body 630 and a swing assembly 640, the second driving body 630 is mounted on the mounting side, and one end of the swing assembly 640 is connected to the first driving body; the isolator 700 oscillates with the oscillating assembly 640 such that the isolator 700 can move with the oscillating assembly 640 to achieve a switch between an idle state and an isolated state. The spacer 700 has elasticity. Wherein the swing assembly 640 comprises a swing arm having a free end at a greater distance from the mounting side in the idle state than in the isolation state. When the isolation is needed, under the action of the driving device 600, the isolator 700 swings to isolate the P electrode 320 from the N electrode 330; when the LED chip 300 is attached and the spacer 700 needs to be moved, the swing rod rotates, and the spacer 700 is extruded with the circuit substrate or the chip body 310 under the action of the swing rod to deform, so that the spacer 700 is separated from the chip and the circuit substrate.
In some embodiments, in order to improve the isolation effect of the spacer 700, in the isolated state, one side of the spacer 700 abuts against the chip body 310 of the LED chip 300; and/or, in the isolated state, the side of the spacer 700 facing away from the circuit substrate of the LED chip 300 protrudes from the side of the P-electrode 320 and the N-electrode 330 on which the solder paste 500 is disposed. Specifically, in the present embodiment, one side of the spacer 700 abuts against the chip body 310, so that the solder paste 500 cannot directly flow through the spacer 700 and the chip body 310, and the blocking effect of the spacer 700 on the solder paste 500 is ensured. In some embodiments, the spacers 700 are disposed to protrude from the side of the P-electrode 320 and the N-electrode 330 where the solder paste 500 is disposed, so that the solder paste 500 cannot flow through the side of the spacers 700 away from the chip body 310, thereby ensuring the shielding effect of the spacers 700 on the solder paste 500.
In some embodiments, in order to facilitate the mounting of the LED chip 300 and the circuit substrate, and avoid the influence on the mounting of the LED chip 300 and the circuit substrate due to the too high height of the spacer 700, the spacer 700 is thin and flexible. Here, when the LED chip 300 is mounted on the circuit substrate, the P-electrode 320 and the N-electrode 330 can be very adhered and fixed to the circuit substrate, and the spacer 700 can be deformed by compression during the mounting process, so that the mounting of the LED chip 300 is not affected.
In some embodiments, in order to improve the work efficiency and work accuracy of the transfer of the LED chip 300, the transfer device of the LED chip 300 further includes a detection sensor and a control circuit, which are electrically connected to each other, the detection sensor is used to detect whether the LED chip 300 is mounted on the chip mounting position, and the control circuit controls the driving device 600 to switch the idle state and the isolation state of the isolator 700 according to the detection result of the detection chip. Specifically, in the present embodiment, when the detection sensor detects that the chip is mounted on the chip mounting location, the control circuit controls the driving device 600 according to the detection result, and the driving device 600 drives the spacer 700 to move and switch to the isolation state. After the LED chip 300 is mounted, the driving device 600 is controlled to move the spacer 700 away from the chip mounting position.
In order to better solve the problem of providing the solder paste 500500 on the P-electrode 320 and the N-electrode 330, the present application discloses a chip assembly process, which uses the transfer device of the LED chip 300 in the above embodiment, and the chip assembly process includes:
s100, the transfer head 100 grabs the LED chip 300, so that the LED chip 300 is positioned at a chip mounting position;
s200, the driving device 600 controls the separator 700 to move between the P electrode 320 and the N electrode 330 to separate the P electrode 320 and the N electrode 330;
s300, arranging solder paste 500 on the P electrode 320 and the N electrode 330, and/or arranging solder paste 500 on the circuit substrate at the positions corresponding to the P electrode 320 and the N electrode 330;
s400, melting the solder paste 500 and attaching the LED chip 300 to the circuit substrate.
Specifically, in this embodiment, the transfer head 100 captures the LED chip 300, and may capture the LED chip through a clamping structure, or may capture the LED chip 300 through negative pressure adsorption, so that the LED chip 300 is located at the chip mounting position. After determining that the LED chip 300 is located at the chip mounting position, the driving apparatus 600 controls the spacer 700 to switch to the isolation state, that is, moves the spacer 700 to separate the P electrode 320 and the N electrode 330. The solder paste 500 is disposed on the P-electrode 320 and the N-electrode 330, and/or the solder paste 500 is disposed on the circuit substrate at positions corresponding to the P-electrode 320 and the N-electrode 330. It should be noted that the sequence between the steps S200 and S300 can be adjusted, that is, the solder paste 500 can be set first, and then the state of the spacer 700 can be switched, and the spacer 700 can be switched to the isolation state before the solder paste 500 is melted. After it is determined that the spacer 700 is in the spaced state, the solder paste 500 is melted and the LED chip 300 is soldered to the circuit substrate. Therefore, when the solder paste 500 is melted, the solder paste 500 on the P electrode 320 and the N electrode 330 are not connected together due to the close distance therebetween, thereby avoiding the occurrence of a short circuit phenomenon and being beneficial to improving the yield of products.
The present application further proposes a display screen, which comprises an LED chip 300, wherein the transfer of the LED chip 300 is accomplished by the transfer device of the LED chip 300 in the above embodiment. The mounting of the LED chip 300 is done according to the assembly process of the chip as set forth in the above embodiments.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. The above-mentioned detailed description is provided for the transferring apparatus of the LED chip 300 provided in the embodiments of the present application, and the principle and the embodiments of the present application are described herein by applying specific examples, and the description of the above-mentioned embodiments is only used to help understanding the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. A transfer device of an LED chip, the LED chip is provided with a P electrode and an N electrode which are adjacently arranged, and the transfer device of the LED chip is characterized by comprising:
a transfer head having a mounting side with a chip mounting location, the transfer head configured to secure a chip to the chip mounting location and move the LED chip;
a drive device mounted on the mounting side;
the isolator is connected with the driving device and is arranged close to the chip mounting position;
the isolator has an idle state and an isolated state; under the isolation state, the isolator is arranged corresponding to the chip mounting position and is positioned between the P electrode and the N electrode to separate the P electrode from the N electrode; in an idle state, the spacer is arranged away from the chip mounting position.
2. The LED chip transfer device according to claim 1, wherein the driving device comprises a first driving body and a telescopic assembly, the first driving body is mounted on the mounting side, and one end of the telescopic assembly is connected with the first driving body;
the isolation piece is connected with the telescopic assembly, so that the isolation piece can move along with the telescopic assembly to realize the switching between the idle state and the isolation state.
3. The transfer device of LED chips of claim 2, wherein said telescoping assembly comprises any one of an electric telescopic rod, a telescopic cylinder and a telescopic hydraulic cylinder.
4. The LED chip transfer device according to claim 1, wherein the driving device comprises a second driving body and a swing assembly, the second driving body is mounted on the mounting side, and one end of the swing assembly is connected with the second driving body; the separator has elasticity;
the isolator swings with the swing assembly, so that the isolator can move along with the swing assembly to realize the switching between the idle state and the isolation state.
5. The LED chip transfer device of claim 4, wherein said swing assembly comprises a swing arm, and a free end of said swing arm is spaced from the mounting side in a rest state by a distance greater than a distance from the mounting side in an isolation state.
6. The device for transferring LED chips according to claim 1, wherein in the isolated state, one side of the spacer abuts against the chip body of the LED chip; and/or the presence of a gas in the gas,
under the isolation state, the side of the isolator, which is back to the circuit substrate of the LED chip, protrudes out of the side, provided with the solder paste, of the P electrode and the N electrode.
7. The transfer device of LED chips of claim 1, wherein the spacer is in the shape of a sheet and has elasticity.
8. The LED chip transfer device according to any one of claims 1 to 7, further comprising a detection sensor and a control circuit electrically connected to each other, wherein the detection sensor is used for detecting whether the LED chip is mounted on the chip mounting position, and the control circuit controls the driving device to switch the idle state and the isolation state of the isolator according to the detection result of the detection chip.
9. A chip assembly process using the transfer apparatus for LED chips according to any one of claims 1 to 8, the chip assembly process comprising:
the transfer head grabs the LED chip so that the LED chip is positioned at the chip mounting position;
the driving device controls the separator to move between the P electrode and the N electrode so as to separate the P electrode from the N electrode;
arranging solder paste on the P electrode and the N electrode, and/or arranging solder paste on the circuit substrate at positions corresponding to the P electrode and the N electrode;
and melting the solder paste and attaching the LED chip to the circuit substrate.
10. A display screen, characterized in that the display screen comprises LED chips, and the transfer of the LED chips is completed by the transfer device of the LED chips in any one of claims 1 to 8; and/or the mounting of the LED chip is done according to the assembly process of the chip of claim 9.
CN202210350221.6A 2022-04-02 2022-04-02 Transfer device of LED chip, chip assembly process and display screen Pending CN114783910A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210350221.6A CN114783910A (en) 2022-04-02 2022-04-02 Transfer device of LED chip, chip assembly process and display screen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210350221.6A CN114783910A (en) 2022-04-02 2022-04-02 Transfer device of LED chip, chip assembly process and display screen

Publications (1)

Publication Number Publication Date
CN114783910A true CN114783910A (en) 2022-07-22

Family

ID=82427431

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210350221.6A Pending CN114783910A (en) 2022-04-02 2022-04-02 Transfer device of LED chip, chip assembly process and display screen

Country Status (1)

Country Link
CN (1) CN114783910A (en)

Similar Documents

Publication Publication Date Title
CN105252251A (en) Device and method for achieving automatic grabbing and accurate attaching of aircraft thermal insulation piece
CN102905477A (en) Cantilever type efficient chip mounter
CN202988262U (en) IC (integrated circuit) double-suction device
CN105173814A (en) Conveying, width-adjusting and clamping device for printed circuit boards (PCB) of chip mounter
WO2016140488A1 (en) Led chip mounting device for manufacturing transparent electronic display board
CN104320505A (en) Touch screen separating device and touch screen separating method
CN114783910A (en) Transfer device of LED chip, chip assembly process and display screen
CN104714615A (en) Tablet computer screen pasting jig
CN110446424A (en) Multi-functional double-station flexibility Welding head mechanism
CN203659823U (en) Chip positioning supply mechanism
JP6427813B2 (en) Wire bonding equipment
CN210587768U (en) Multifunctional label welding device
CN102573317B (en) Automatic control method of double-arm multi-head chip mounting of light-emitting diode (LED) chip mounter
CN214477423U (en) IPM module using ultrasonic welding lead frame
CN207606397U (en) A kind of tablet computer erection welding automatic production line
CN110112170A (en) A kind of microchip transfer equipment and transfer method
KR20190063366A (en) Film drawing device and method
CN215582531U (en) Automatic change SMT chip mounter adsorption equipment
CN107934558A (en) A kind of light guide plate push-and-pull upset transfer mechanism
CN211920248U (en) Get piece device and lithium cell production facility
CN208047167U (en) A kind of high-speed paster mechanism
CN210579498U (en) Backlight unit FPC friction deviation correcting device
CN210489582U (en) Chip double-side alignment bonding machine
CN210923494U (en) Visual structure of automatic laminating device of FPC reinforcement piece
CN109038167A (en) A kind of electrical connector housing terminal assembly device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination