CN114779964A - Touch panel manufacturing method based on ultrathin glass and touch panel thereof - Google Patents
Touch panel manufacturing method based on ultrathin glass and touch panel thereof Download PDFInfo
- Publication number
- CN114779964A CN114779964A CN202210549498.1A CN202210549498A CN114779964A CN 114779964 A CN114779964 A CN 114779964A CN 202210549498 A CN202210549498 A CN 202210549498A CN 114779964 A CN114779964 A CN 114779964A
- Authority
- CN
- China
- Prior art keywords
- release layer
- glass body
- ultra
- touch
- touch panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 title claims abstract description 145
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 claims abstract description 43
- 238000005530 etching Methods 0.000 claims abstract description 10
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 238000005286 illumination Methods 0.000 claims description 12
- 238000010030 laminating Methods 0.000 claims description 9
- 238000000354 decomposition reaction Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000003795 desorption Methods 0.000 claims 1
- 238000010494 dissociation reaction Methods 0.000 claims 1
- 230000005593 dissociations Effects 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 abstract description 6
- 238000000926 separation method Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 88
- 239000000758 substrate Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 239000002346 layers by function Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The invention provides a method for manufacturing a touch panel based on ultrathin glass and the touch panel, wherein the method comprises the following steps: providing a carrier medium; arranging a release layer on one side of the carrier plate medium, wherein the release layer is provided with a first side attached to the carrier plate medium and an exposed second side, and the second release force of the second side is smaller than the first release force of the first side; attaching an ultrathin glass body to the second side of the release layer, wherein the thickness of the ultrathin glass body is smaller than that of the carrier medium; arranging a first touch electrode and/or a first touch circuit on a first side of the ultrathin glass body, which is far away from the release layer; releasing the ultrathin glass body from the release layer; and (4) cutting the ultrathin glass body to obtain a plurality of touch panels. The invention can prevent the breakage of the ultrathin glass in the process of manufacturing through the combination and separation of the ultrathin glass and the carrier medium, avoids the step of thinning the glass, improves the yield, reduces the use of an etching process and enhances the environmental protection property of the process.
Description
Technical Field
The invention relates to the field of panel processing technology, in particular to a touch panel manufacturing method based on ultrathin glass and a touch panel thereof.
Background
The quality of the ultra-thin glass substrate (UTG substrate) is critical as an important component of the foldable cover sheet to achieve the effect of smaller or even 2mm bend radius. Particularly, after the UTG substrate is cut into a specific size, special treatment of the edge part of the substrate, namely, removing defects such as edge breakage and microcracks generated by cutting is needed, so as to avoid the breakage of glass caused by microcracks and the like when the substrate is bent.
However, in the process of manufacturing the ultrathin glass substrate, because the ultrathin glass substrate is too thin and easy to bend, the edge is easy to tear under the environment of repeated bottom intersection of evaporation and etching, and the yield of products is very low. In order to overcome the defects, the prior art firstly carries out evaporation, etching and arrangement of various functional layers through glass with conventional thickness, and then thins the glass on one side to form the ultrathin glass after completing a touch control part and a display part.
The prior art has the following problems:
(1) after finishing each functional layer, the functional layer is easy to damage by thinning glass;
(2) due to the existence of the functional layer, the process requirement on thinning the glass is higher, more special acid-base solution can be consumed, and the environmental protection requirement of a product line cannot reach the standard easily.
(3) Because one side needs to be thinned, the prior art can only carry out single-side wiring, which is not beneficial to the thickness reduction of the panel.
Therefore, a method for manufacturing a touch panel based on ultra-thin glass and a touch panel thereof are needed.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide a method for manufacturing a touch panel based on ultrathin glass and the touch panel, which overcome the difficulties in the prior art, can prevent the ultrathin glass from breaking in the process of manufacturing through the combination and separation of the ultrathin glass and a carrier medium, avoid the step of thinning the glass, improve the yield, reduce the use of an etching process and enhance the environmental protection property of the process.
The embodiment of the invention also provides a method for manufacturing the touch panel based on the ultrathin glass, which comprises the following steps:
providing a carrier medium;
arranging a release layer on one side of the carrier medium, wherein the release layer is provided with a first side attached to the carrier medium and an exposed second side, and the second release force of the second side is smaller than the first release force of the first side;
attaching an ultrathin glass body to the second side of the release layer, wherein the thickness of the ultrathin glass body is smaller than that of the carrier medium;
arranging a first touch electrode and/or a first touch circuit on a first side of the ultrathin glass body, which is far away from the release layer;
releasing the second side of the ultrathin glass body from the release layer;
and cutting the ultrathin glass body to obtain a plurality of touch panels.
Preferably, the second side of the release layer is attached with an ultra-thin glass body, and the thickness of the ultra-thin glass body is smaller than that of the carrier medium, and the carrier medium further includes:
a plurality of through holes are formed in the range area of the preset touch panel of the ultrathin glass body, and a first stress dissipation edge is formed at the edge of the ultrathin glass body.
Preferably, the through-hole and the first stress relief edge are obtained based on the same etching process.
Preferably, the separating the second side of the ultra-thin glass body from the release layer before the ultra-thin glass body is separated to obtain a plurality of touch panels, further includes:
attaching the first side of the ultrathin glass body to the second side of the release layer;
arranging a second touch electrode and/or a second touch circuit on a second side of the ultrathin glass body, which is far away from the release layer;
and releasing the first side of the ultrathin glass body from the release layer.
Preferably, the releasing the first side of the ultra-thin glass body from the release layer further includes:
and forming a second stress dissipation edge along a cutting line between the range areas of the preset touch panel, wherein the divided touch panel is provided with a frame-shaped stress dissipation edge formed by a part of the first stress dissipation edge and a part of the second stress dissipation edge.
Preferably, in the first side that the ultra-thin glass body deviates from the release layer sets up first touch-control electrode and/or first touch-control circuit, still include:
and depositing a touch electrode layer and a lead layer penetrating through the through hole on the first side of the ultrathin glass body, which is far away from the release layer.
Preferably, the method further comprises the following steps: in the ultra-thin glass body deviates from the second side of type layer sets up second touch-control electrode and/or second touch-control circuit, still include: and the second touch electrode and/or the second touch circuit positioned on the second side are/is communicated with the first touch electrode and/or the first touch circuit positioned on the first side through the through hole of the ultrathin glass body.
Preferably, the thickness range of ultra-thin glass body is 30um to 150um, the thickness range of carrier plate medium is 300um to 1100 um.
Preferably, the second side of the release layer is a heating thermal release layer, and the first side of the release layer is a heat-resistant release layer; or alternatively
The second side of the release layer is a cooling cold release layer, and the first side of the release layer is a cold release resistant laminating layer; or alternatively
The second side of the release layer is UV illumination decomposition release layer, and the first side of the release layer is UV illumination resistant laminating layer.
Preferably, the rigidity of the carrier plate medium is greater than that of the ultrathin glass.
Preferably, the flexibility of the carrier plate medium is greater than that of the ultra-thin glass.
Preferably, the material of the carrier plate medium is at least one or a combination of plastic, glass and metal.
The embodiment of the invention provides another touch panel manufactured by the manufacturing method.
The invention aims to provide a touch panel manufacturing method based on ultrathin glass and a touch panel thereof, which can prevent the ultrathin glass from breaking in the process of manufacturing through the combination and separation of the ultrathin glass and a carrier medium, avoid the step of thinning the glass, improve the yield, reduce the use of an etching process and enhance the environmental protection property of the process.
Drawings
Other features, objects and advantages of the present invention will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, with reference to the accompanying drawings.
Fig. 1 is a flowchart of a manufacturing method of an embodiment of a manufacturing method of an ultra-thin glass-based touch panel according to the present invention.
Fig. 2 to 13 are schematic views illustrating a manufacturing process of a manufacturing method of an ultra-thin glass-based touch panel according to an embodiment of the present invention.
Reference numerals
1 Carrier Medium
2 Release layer
21 first side
22 second side
3 ultra-thin glass body
31 first side
32 second side
33 first stress dissipating edge
34 second stress dissipating edge
4 first touch control electrode and/or first touch control circuit
5 second touch electrode and/or second touch circuit
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted.
Fig. 1 is a flowchart of a manufacturing method of an embodiment of a manufacturing method of an ultra-thin glass-based touch panel according to the present invention. As shown in fig. 1, the method for manufacturing an ultra-thin glass-based touch panel of the present invention includes the following steps:
s110, providing a carrier medium.
And S120, arranging a release layer on one side of the carrier plate medium, wherein the release layer is provided with a first side attached to the carrier plate medium and an exposed second side, and the second release force of the second side is smaller than the first release force of the first side.
S130, attaching an ultrathin glass body to the second side of the release layer, wherein the thickness of the ultrathin glass body is smaller than that of the carrier medium.
S140, arranging a first touch electrode and/or a first touch circuit on the first side of the ultrathin glass body, which is far away from the release layer.
S150, releasing the second side of the ultrathin glass body from the release layer.
And S190, cutting the ultrathin glass body to obtain a plurality of touch panels.
In a preferred embodiment, step S130 further includes:
the through holes are formed in the range area of the preset touch panel of the ultrathin glass body, and the first stress dissipation edge is formed at the edge of the ultrathin glass body, so that the stress dissipation effect of the ultrathin glass body serving as a process middleware is improved, and the ultrathin glass body is prevented from being torn, but the invention is not limited to this.
In a preferred embodiment, the through hole and the first stress relief edge are obtained based on the same etching process, but not limited thereto.
In a preferred embodiment, after step S150 and before step S190, the method further includes:
and S160, attaching the first side of the ultrathin glass body to the second side of the release layer.
S170, arranging a second touch electrode and/or a second touch circuit on a second side, away from the release layer, of the ultrathin glass body.
S180, the first side of the ultrathin glass body is separated from the release layer, so that double-layer wiring based on two sides of the ultrathin glass body is achieved, but the ultrathin glass body is not limited by the double-layer wiring.
In a preferred embodiment, further comprising:
in step S190, the method further includes: the second stress dissipation edge is formed along a cutting line between the range areas of the preset touch panel, and the divided touch panel has a frame-shaped stress dissipation edge formed by a part of the first stress dissipation edge and a part of the second stress dissipation edge, so that the stress dissipation effect of the touch panel body serving as a product is improved, and tearing is prevented, but not limited to.
In a preferred embodiment, step S140 further includes: and depositing a touch electrode layer and a lead layer penetrating through the through hole on the first side of the ultrathin glass body, which is far away from the release layer. In step S170, the method further includes: the second touch electrode and/or the second touch circuit on the second side are/is connected with the first touch electrode and/or the first touch circuit on the first side through the through hole of the ultrathin glass body, and the wire layer penetrating through the through hole is synchronously completed when the touch electrode layer is deposited on the first side of the ultrathin glass body, so that the subsequent first touch electrode and/or the first touch circuit can be connected with the second touch electrode and/or the second touch circuit, but not limited to this.
In a preferred embodiment, the thickness of the ultra-thin glass body ranges from 30um to 150um, and the thickness of the carrier medium ranges from 300um to 1100um, so that the combination of the two has a sufficient thickness during the manufacturing process, the ultra-thin glass body will not be torn during the manufacturing process, and after separation, the ultra-thin glass body can be ensured to have sufficient flexibility and be freely bent, but not limited thereto.
In a preferred embodiment, the second side of the release layer is a temperature-rising pyrolytic release layer, and the first side of the release layer is a heat-resistant release layer, but not limited thereto.
The second side of the release layer is a cooling cold release layer, and the first side of the release layer is a cold release resistant adhesive layer, but not limited thereto.
The second side from the type layer is UV illumination decomposition from the type layer, and the first side from the type layer is anti UV illumination laminating layer for be difficult to by from the type after the laminating of the first side on type layer, and can relatively easily leave the type and paste from the second side on type layer, make things convenient for ultra-thin glass body and carry out at least once from the type between the type layer, or paste many times and leave the type many times.
In a preferred embodiment, the first stress-dissipating edge, the second stress-dissipating edge, or the first stress-dissipating edge is a rounded edge, a blade edge, or a polygonal edge, and the blade edge or the polygonal edge includes at least one bevel or a rounded bevel, and the bevel is at an angle (15 °, 90 °) to the glass parent material, but not limited thereto.
In a preferred embodiment, the rigidity of the carrier medium is greater than that of the ultra-thin glass, and the carrier medium with higher rigidity can support the ultra-thin glass in the form of a rigid substrate, so as to ensure that the ultra-thin glass does not deform during the manufacturing process, but not limited thereto.
In a preferred embodiment, the carrier medium has a flexibility greater than that of the ultra-thin glass, and the carrier medium with a higher flexibility can also protect the ultra-thin glass in the form of a flexible substrate, so as to ensure that the deformation of the ultra-thin glass during the manufacturing process is a constraint deformation quantity and prevent the edge from being broken, but not limited thereto.
In a preferred embodiment, the material of the carrier medium is at least one or a combination of plastic, glass and metal, but not limited thereto.
Based on the technical characteristics, the invention has the following technical effects:
(1) the glass does not need to be thinned, and the processing time is shortened.
(2) The use of acid and alkali solution is reduced, and the environmental protection effect of a product line is improved.
(3) Can realize the double-deck wiring based on ultra-thin glass both sides, be favorable to the thickness attenuate of panel very much.
The specific implementation process of the invention is as follows:
fig. 2 to 13 are schematic views illustrating a manufacturing process of a manufacturing method of an ultra-thin glass-based touch panel according to an embodiment of the present invention.
As shown in fig. 2, 3 and 4, a carrier medium 1 is provided. One side of the carrier medium 1 is provided with a release layer 2, the release layer 2 has a first side 21 attached to the carrier medium 1 and an exposed second side 22, and the second release force of the second side 22 is smaller than the first release force of the first side 21. For UV illumination decomposition from type layer 2 (decompose easily under UV illumination, lose viscidity) from type layer 2 second side 22 of type layer 2, first side 21 from type layer 2 is anti UV illumination laminating layer (also can not decompose under UV illumination), make to be difficult to from the type after 21 laminating from type layer 2 first side, and second side 22 from type layer 2 can be comparatively easily from type and paste, make things convenient for follow-up ultra-thin glass body 3 and carry out at least once from type between type layer 2 from the type, or paste many times and leave type many times. An ultra-thin glass body 3 is attached to the second side 22 of the release layer 2, the thickness of the ultra-thin glass body 3 is smaller than that of the carrier medium 1, and in this embodiment, glass is used as the material of the carrier medium 1. Wherein, the thickness scope of ultra-thin glass body 3 is 30um to 150um, and the thickness scope of carrier plate medium 1 is 300um to 1100um for in-process, the combination of both has sufficient thickness, can not tear ultra-thin glass body 3 in-process, and after the separation, can guarantee that ultra-thin glass body 3 has sufficient flexibility, can bend at will. A plurality of through holes are formed in the area of the ultra-thin glass body 3 within the range of the preset touch panel, and a first stress dissipation edge 33 is formed at the edge of the ultra-thin glass body 3, so that the overall stress dissipation effect of the ultra-thin glass body 3 as a process middleware is improved, and tearing is prevented. The through-holes (the through-hole diameter is very fine and thus not shown in the drawing) and the first stress-dissipating edge 33 are obtained on the basis of the same etching process.
As shown in fig. 5 and 6, a first touch electrode and/or a first touch circuit 4 is disposed on a first side 31 of the ultra-thin glass body 3 away from the release layer 2. And depositing a touch electrode layer and a lead layer penetrating through the through hole on a first side 31 of the ultrathin glass body 3, which is far away from the release layer 2. The manufacturing process of the first touch electrode and/or the first touch circuit 4 can refer to the existing or future manufacturing process, and the present invention is not repeated herein.
As shown in fig. 7, the second side 22 of the release layer 2(UV light decomposition release layer) is easily decomposed and loses viscosity under UV light irradiation by using UV light irradiation, so that the ultra-thin glass body 3 is separated from the second side 22 of the release layer 2, and the second side 32 of the ultra-thin glass body 3 is easily dropped from the release layer 2 to be released (e.g., torn off). Simultaneously, because the first side 21 from type layer 2 is anti UV illumination laminating layer, also can not decompose under UV illumination, remains viscidity throughout, still firmly glues together from first side 21 of type layer 2 and support plate medium 1, ensures at ultra-thin glass body 3 and the in-process of leaving type from type layer 2, is not influenced from type layer 2 and support plate medium 1.
As shown in fig. 8 and 9, the first side 31 of the ultra-thin glass body 3 is attached to the second side 22 of the release layer 2. And arranging a second touch electrode and/or a second touch circuit 5 on a second side 32 of the ultrathin glass body 3, which is far away from the release layer 2, so as to realize the manufacture process of the touch functional layer on the second surface. The second touch electrode and/or the second touch circuit 5 on the second side 32 is/are electrically connected to the first touch electrode and/or the first touch circuit 4 on the first side 31 through the through hole of the ultra-thin glass body 3, and a wire layer passing through the through hole is synchronously completed when the touch electrode layer is deposited on the first side 31 of the ultra-thin glass body 3, so that the subsequent first touch electrode and/or the first touch circuit 4 can be electrically connected to the second touch electrode and/or the second touch circuit 5.
As shown in fig. 10, the first side 31 of the ultra-thin glass body 3 is released from the release layer 2, thereby realizing double-layer wiring based on both sides of the ultra-thin glass body 3.
As shown in fig. 11, 12 and 13, the ultra-thin glass body 3 is divided to obtain a plurality of touch panels. The second stress dissipation edge 34 is formed along a cutting line A, B between the area of the predetermined touch panel, and the divided touch panel has a frame-type stress dissipation edge formed by a portion of the first stress dissipation edge 33 (the cut first stress dissipation edge 33) and a portion of the second stress dissipation edge 34. In the manufacturing process of the present invention, the first stress dissipation edge 33 is reused, which can provide stress dissipation protection for the whole ultra-thin glass body 3 in the manufacturing process, and can form a frame-shaped stress dissipation edge for protecting a single touch panel in cooperation with the newly formed second stress dissipation edge 34 in the product form, thereby improving the stress dissipation effect of the touch panel body as a product and preventing tearing.
The invention also provides a touch panel manufactured by the manufacturing method, and related technical features are as before and are not repeated herein.
In summary, the present invention is directed to a method for manufacturing a touch panel based on ultra-thin glass and a touch panel thereof, which can prevent the ultra-thin glass from breaking during the manufacturing process by combining and separating the ultra-thin glass and a carrier medium, thereby avoiding the step of thinning the glass, improving the yield, reducing the use of the etching process, and enhancing the environmental protection property of the process.
The foregoing is a further detailed description of the invention in connection with specific preferred embodiments and it is not intended to limit the invention to the specific embodiments described. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A method for manufacturing a touch panel based on ultrathin glass is characterized by comprising the following steps:
providing a carrier medium;
arranging a release layer on one side of the carrier medium, wherein the release layer is provided with a first side attached to the carrier medium and an exposed second side, and the second release force of the second side is smaller than the first release force of the first side;
attaching an ultrathin glass body to the second side of the release layer, wherein the thickness of the ultrathin glass body is smaller than that of the carrier medium;
arranging a first touch electrode and/or a first touch circuit on a first side of the ultrathin glass body, which is far away from the release layer;
releasing the second side of the ultrathin glass body from the release layer;
and cutting the ultrathin glass body to obtain a plurality of touch panels.
2. The method for manufacturing an ultra-thin glass-based touch panel according to claim 1, wherein the step of attaching an ultra-thin glass body to the second side of the release layer, the ultra-thin glass body having a thickness smaller than that of the carrier medium, further comprises:
a plurality of through holes are formed in the range area of the preset touch panel of the ultrathin glass body, and a first stress dissipation edge is formed at the edge of the ultrathin glass body.
3. The method of claim 2, wherein the through via and the first stress-dissipating edge are obtained based on a same etching process.
4. The method for manufacturing an ultra-thin glass-based touch panel according to claim 2, wherein the step of separating the second side of the ultra-thin glass body from the release layer and the step of separating the ultra-thin glass body to obtain a plurality of touch panels further comprises:
attaching the first side of the ultrathin glass body to the second side of the release layer;
arranging a second touch electrode and/or a second touch circuit on a second side of the ultrathin glass body, which is far away from the release layer;
and releasing the first side of the ultrathin glass body from the release layer.
5. The method for manufacturing an ultra-thin glass-based touch panel according to claim 4, wherein the releasing the first side of the ultra-thin glass body from the release layer further comprises:
and forming a second stress dissipation edge along a cutting line between the range areas of the preset touch panel, wherein the divided touch panel is provided with a frame-shaped stress dissipation edge formed by a part of the first stress dissipation edge and a part of the second stress dissipation edge.
6. The method for manufacturing an ultra-thin glass-based touch panel according to claim 4, wherein the disposing a first touch electrode and/or a first touch circuit on a first side of the ultra-thin glass body facing away from the release layer further comprises:
and depositing a touch electrode layer and a lead layer penetrating through the through hole on the first side of the ultrathin glass body, which is far away from the release layer.
7. The method of claim 6, further comprising: in the ultra-thin glass body deviates from the second side of leaving the type layer sets up second touch-control electrode and/or second touch-control circuit, still include: and the second touch electrode and/or the second touch circuit positioned on the second side are/is conducted with the first touch electrode and/or the first touch circuit positioned on the first side through the through hole of the ultrathin glass body.
8. The method for manufacturing an ultra-thin glass-based touch panel according to claim 1, wherein the ultra-thin glass body has a thickness ranging from 30um to 150um, and the carrier medium has a thickness ranging from 300um to 1100 um.
9. The manufacturing method of the ultra-thin glass-based touch panel according to claim 1, wherein the second side of the release layer is a heating thermal dissociation layer, and the first side of the release layer is a thermal desorption-resistant layer; or
The second side of the release layer is a cooling cold release layer, and the first side of the release layer is a cold release resistant laminating layer; or
The second side of the release layer is UV illumination decomposition release layer, and the first side of the release layer is UV illumination resistant laminating layer.
10. A touch panel manufactured by the manufacturing method of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210549498.1A CN114779964A (en) | 2022-05-20 | 2022-05-20 | Touch panel manufacturing method based on ultrathin glass and touch panel thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210549498.1A CN114779964A (en) | 2022-05-20 | 2022-05-20 | Touch panel manufacturing method based on ultrathin glass and touch panel thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114779964A true CN114779964A (en) | 2022-07-22 |
Family
ID=82409587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210549498.1A Pending CN114779964A (en) | 2022-05-20 | 2022-05-20 | Touch panel manufacturing method based on ultrathin glass and touch panel thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114779964A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104777941A (en) * | 2015-05-06 | 2015-07-15 | 信利光电股份有限公司 | Touch screen preparation method |
| CN104793780A (en) * | 2014-01-16 | 2015-07-22 | 达鸿先进科技股份有限公司 | Touch panel process method and touch panel structure thereof |
| CN106527796A (en) * | 2016-10-31 | 2017-03-22 | 京东方科技集团股份有限公司 | Panel manufacturing method, touch control panel and display device |
| CN110413142A (en) * | 2018-04-26 | 2019-11-05 | 台虹科技股份有限公司 | Contact panel sensor structure and preparation method thereof |
| CN112174542A (en) * | 2020-09-28 | 2021-01-05 | 厦门天马微电子有限公司 | Glass cover plate and preparation method thereof, display panel and display device |
| CN112341004A (en) * | 2020-10-26 | 2021-02-09 | 恩利克(浙江)显示科技有限公司 | Ultra-thin glass substrate processing method and display panel processing method |
-
2022
- 2022-05-20 CN CN202210549498.1A patent/CN114779964A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104793780A (en) * | 2014-01-16 | 2015-07-22 | 达鸿先进科技股份有限公司 | Touch panel process method and touch panel structure thereof |
| CN104777941A (en) * | 2015-05-06 | 2015-07-15 | 信利光电股份有限公司 | Touch screen preparation method |
| CN106527796A (en) * | 2016-10-31 | 2017-03-22 | 京东方科技集团股份有限公司 | Panel manufacturing method, touch control panel and display device |
| CN110413142A (en) * | 2018-04-26 | 2019-11-05 | 台虹科技股份有限公司 | Contact panel sensor structure and preparation method thereof |
| CN112174542A (en) * | 2020-09-28 | 2021-01-05 | 厦门天马微电子有限公司 | Glass cover plate and preparation method thereof, display panel and display device |
| CN112341004A (en) * | 2020-10-26 | 2021-02-09 | 恩利克(浙江)显示科技有限公司 | Ultra-thin glass substrate processing method and display panel processing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108957880B (en) | Array substrate, display panel and manufacturing method thereof | |
| KR100657201B1 (en) | Parting method for fragile material substrate and parting device using the method | |
| KR101812606B1 (en) | Method for manufacturing transparent printed circuit and method for manufacturing transparent touch panel | |
| CN109379846B (en) | Novel flexible circuit board double-sided hollow circuit manufacturing method | |
| CN112897889B (en) | Glass single-side film-covering thinning method | |
| US9837610B2 (en) | Display module manufacturing method and display module | |
| CN111211251B (en) | Method of peeling mother protective film and method of manufacturing organic light emitting display device using the same | |
| CN111211252A (en) | Method of peeling mother protective film, organic light emitting display device, and method of manufacturing the same | |
| KR20130140707A (en) | Laminate body, panel for use in display device with support board, panel for use in display device, and display device | |
| CN112266176B (en) | Ultra-thin glass substrate processing method and display panel processing method | |
| CN110444697A (en) | Display panel and preparation method thereof | |
| CN112479596A (en) | Ultra-thin glass substrate processing method and display panel processing method | |
| CN114779964A (en) | Touch panel manufacturing method based on ultrathin glass and touch panel thereof | |
| TWI232851B (en) | Electro-optical panel, electronic appliance and production method of the electro-optical panel | |
| CN105097990B (en) | Method for manufacturing semiconductor structure | |
| CN105867668B (en) | Thin film processing method and touch panel manufacturing method | |
| US20060209224A1 (en) | Display device and manufacturing method of the same | |
| KR102133780B1 (en) | Method for processing laminated sheet and processed laminated sheet | |
| JP2019178018A (en) | Method for production of thin glass substrate | |
| US20140248817A1 (en) | Manufacturing method for display device provided with thin film electronic circuit | |
| CN110461131B (en) | Heat dissipation plate assembly, display module and assembling method thereof | |
| CN109980024B (en) | Technology for improving open hole hidden cracking of MWT photovoltaic module | |
| KR101064645B1 (en) | Method for manufacturing touch panel being capable of preventing pad of touch panel from contamination and touch panel manufactured thereby | |
| JP2010287590A (en) | Electromagnetic wave shield material, and grounding-wire takeout structure thereof | |
| CN218941664U (en) | Scratch-resistant electromagnetic shielding film and liquid crystal display screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |