CN114778963A - Device performance monitoring method and device - Google Patents
Device performance monitoring method and device Download PDFInfo
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- CN114778963A CN114778963A CN202210252332.3A CN202210252332A CN114778963A CN 114778963 A CN114778963 A CN 114778963A CN 202210252332 A CN202210252332 A CN 202210252332A CN 114778963 A CN114778963 A CN 114778963A
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Abstract
The application relates to a device performance monitoring method and device. The method comprises the following steps: placing a device to be tested on the surface of the test board, wherein the test board is provided with a golden finger, and the test device is electrically connected with the golden finger; providing a test slot, wherein an insertion through hole is formed in the test slot, and a conductive elastic sheet is arranged in the insertion through hole; inserting the test board into the insertion through hole, wherein the golden finger is in contact with the conductive elastic sheet; electrically connecting a test instrument with the conductive elastic sheet through a test cable; placing the test board and the test slot with the device to be tested on the surface in an environmental test chamber, and applying a test voltage to the device to be tested under a preset temperature condition through the environmental test chamber; and monitoring the device to be tested by using the test instrument. The method can be used for efficiently monitoring the performance of the device on line in real time.
Description
Technical Field
The present application relates to the field of electronic information industry technologies, and in particular, to a device performance monitoring method and apparatus.
Background
With the development of electronic information industry technology, the demand for miniaturization and portability of terminal requirements such as mobile phones and notebooks is becoming more and more obvious, the internal circuit of products is miniaturized, and the application of Surface Mounted Technology (SMT) technology is becoming generalized.
For SMT technology, Surface Mounted Devices (SMDs) are the key components, and the reliability of SMDs largely determines the service life of electronic products, and therefore, is very important for the life assessment of SMDs (e.g., chip capacitors, chip resistors, etc.).
In the existing industry test method, the life test of the patch device is normally a high-temperature high-pressure life acceleration test, that is, the device is put into a high-temperature test box, a certain voltage is applied, and the device is taken out at regular time (for example, according to the cycle of linear time 10h, 50h, 100h and 200h …) to measure relevant parameters (for example, resistance, capacitance and the like) until the test fails.
However, the conventional method cannot monitor whether the patch device functions normally in real time. Therefore, the problems to be solved currently when the normal function condition of the device can be monitored on line conveniently in real time.
Disclosure of Invention
In view of the foregoing, it is desirable to provide a device performance monitoring method and apparatus.
In a first aspect, the present application provides a device performance monitoring apparatus comprising:
the environmental test chamber is used for applying test voltage to the device to be tested under the condition of preset temperature;
the test slot is positioned in the environmental test chamber, an insertion through hole is formed in the test slot, and a conductive elastic sheet is arranged in the insertion through hole;
the test board is positioned in the environmental test chamber, and a golden finger is arranged on the test board; the test board is inserted into the insertion through hole, and the golden finger is in contact with the conductive elastic sheet; the device to be tested is positioned on the surface of the test board and is electrically connected with the conductive elastic sheet through the test board and the golden finger;
and the testing instrument is electrically connected with the conductive elastic sheet through a testing cable and is used for monitoring the device to be tested to which the testing voltage is applied.
In one embodiment, the gold fingers and the conductive elastic pieces are arranged in a one-to-one correspondence mode, and the width of the gold fingers is the same as that of the conductive elastic pieces.
In one embodiment, the test socket further comprises a circuit board, the test socket is fixed on the circuit board, and a welding pad connected with the conductive elastic sheet is arranged on the surface of the circuit board; the test instrument is connected to the pad via the test cable.
It can be seen that the test slot can be used repeatedly, and the test can be carried out only by replacing the test board, and the test can be carried out on the test cable without welding the test board provided with the device to be tested at each time, so that the flow of wiring required by each test is reduced, the test time is saved, and the test efficiency is improved.
In one embodiment, the test board comprises a double-sided circuit board.
In one embodiment, the apparatus further includes a determining module, connected to the testing instrument, for determining whether the device under test is abnormal according to a monitoring result of the testing instrument.
Therefore, the device can judge the monitoring result, so that the abnormal condition of the device to be tested can be monitored in real time.
In a second aspect, the application further provides a device performance monitoring method. The method comprises the following steps:
placing a device to be tested on the surface of the test board, wherein a golden finger is arranged on the test board, and the test device is electrically connected with the golden finger;
providing a test slot, wherein an insertion through hole is formed in the test slot, and a conductive elastic sheet is arranged in the insertion through hole; inserting the test board into the insertion through hole, wherein the golden finger is in contact with the conductive elastic sheet;
electrically connecting a test instrument with the conductive elastic sheet through a test cable;
placing the test board with the device to be tested on the surface and the test slot in an environmental test chamber, and applying a test voltage to the device to be tested under a preset temperature condition through the environmental test chamber; and monitoring the device to be tested by using the testing instrument.
In one embodiment, after the test board is inserted into the insertion through hole, the gold fingers and the conductive elastic pieces are arranged in a one-to-one correspondence manner, and the width of the gold fingers is the same as that of the conductive elastic pieces.
In one embodiment, before inserting the test board into the insertion through-hole, the method further comprises: fixing the test slot on a circuit board, wherein a bonding pad connected with the conductive elastic sheet is arranged on the surface of the circuit board; electrically connecting a test instrument with the conductive dome via a test cable comprises: the testing instrument is connected with the bonding pad through the testing cable so as to realize that the testing instrument is electrically connected with the conductive elastic sheet.
It can be seen that the test slot can be used repeatedly, and the test can be carried out only by replacing the test board, the test board provided with the device to be tested is not required to be welded on the test cable at each time for testing, the process that wiring is required for each test is reduced, the test time is saved, and the test efficiency is improved.
In one embodiment, the test board comprises a two-sided test board.
In one embodiment, after the monitoring of the device under test by the test instrument, the method further includes: and judging whether the device to be tested is abnormal or not according to the monitoring result of the testing instrument.
Therefore, the device can judge the monitoring result, so that the abnormal condition of the device to be tested can be monitored in real time.
According to the device performance monitoring device and the device performance monitoring method, the test board with the device to be tested is inserted into the test slot by adding the test slot, the device to be tested is connected with the conductive elastic sheet of the test board through the golden finger, and the conductive elastic sheet is connected with the test instrument through the test cable, so that the device to be tested does not need to be taken out at regular time for measuring relevant parameters, and real-time and efficient online monitoring can be realized.
Drawings
FIG. 1 is a schematic diagram showing the structure of a device performance monitoring apparatus according to an embodiment;
FIG. 2 is a schematic diagram of an embodiment of a test socket and a test board;
FIG. 3 is a schematic flow chart of a method for monitoring device performance in one embodiment;
FIG. 4 is a schematic diagram of a device performance monitoring apparatus in one embodiment;
FIG. 5 is a diagram illustrating an internal structure of a computer device according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The device performance monitoring device provided by the embodiment of the application can be applied to the structure schematic diagrams shown in fig. 1 and fig. 2. The schematic structural diagram of fig. 1 includes: environmental test chamber 101, test socket 102, test board 103, circuit board 104 and test instrument 105. The environmental test chamber 101 is used for applying test voltage to a device to be tested under the condition of preset temperature; a test slot 102 located in the environmental test chamber 101, wherein an insertion through hole is formed in the test slot 102, and a conductive elastic sheet is arranged in the insertion through hole; a test board 103 disposed in the environmental test chamber 101, the test board having gold fingers thereon; the test board is inserted into the insertion through hole, and the golden finger is contacted with the conductive elastic sheet; the device to be tested is positioned on the surface of the test board and is electrically connected with the conductive elastic sheet through the test board and the golden finger; the test instrument 105 is electrically connected to the conductive elastic piece through a test cable, and is configured to monitor the device under test to which the test voltage is applied.
In one embodiment, the gold fingers and the conductive elastic pieces are arranged in a one-to-one correspondence, and the width of the gold fingers can be the same as that of the conductive elastic pieces. Of course, in other examples, the width of the gold finger may be smaller or larger than the width of the conductive elastic piece, but it should be noted that no matter how the widths of the gold finger and the conductive elastic piece are set, it is required to ensure that the gold finger can be in one-to-one contact with the conductive elastic piece, and there is a space between adjacent gold fingers and adjacent conductive elastic pieces.
In one embodiment, the test socket further comprises a circuit board 104, the test socket 102 is fixed on the circuit board 104, and a pad connected with the conductive elastic piece is arranged on the surface of the circuit board 104; the test instrument 105 is connected to the pad via the test cable.
In one embodiment, the apparatus further includes a determining module 106, connected to the testing instrument 105, for determining whether the device under test is abnormal according to a monitoring result of the testing instrument 105.
Therefore, the device can judge the monitoring result, so that the abnormal condition of the device to be tested can be monitored in real time.
Referring to fig. 2, fig. 2 is a schematic structural diagram of a test socket 102 and a test board in an embodiment, the schematic structural diagram includes a conductive elastic piece 1021 in the test socket 102, and a device under test 1031 and a gold finger 1032 in the test board 103, where the width of the gold finger 1032 is the same as that of the conductive elastic piece 1021, and the test socket 102 and the test board 103 with the device under test 1031 are connected in a one-to-one correspondence.
In one embodiment, the apparatus further includes a circuit board 104, the test socket 102 is fixed on the circuit board 104, and a pad connected to the conductive spring 1021 is disposed on a surface of the circuit board 104; the test instrument 105 is connected to the pad via the test cable.
It can be seen that the test slot 102 can be used repeatedly, and the test can be performed only by replacing the test board 103, and the test can be performed without soldering the test board 103 with the device 1031 to be tested to the test cable each time, thereby reducing the wiring process required for each test, saving the test time, and improving the test efficiency.
In one embodiment, the test board 103 may include, but is not limited to, a double-sided circuit board.
In one embodiment, the system further includes a determining module 106, connected to the testing instrument 105, for determining whether the device under test 1031 is abnormal according to a monitoring result of the testing instrument 105.
It can be seen that the apparatus can determine the monitoring result, so as to monitor the abnormal condition of the device under test 1031 in real time.
The device performance monitoring device inserts the test board 103 with the device to be tested 1031 into the test slot 102 by adding the test slot 102, connects the device to be tested 1031 with the conductive elastic sheet 1021 of the test board 103 through 1032, and is connected with the test instrument 105 through the test cable through the conductive elastic sheet 1021, and the device performance monitoring device does not need to be taken out at regular time to measure related parameters and can carry out online monitoring in real time and efficiently.
In one embodiment, as shown in fig. 3, the present application further provides a device performance monitoring method, which may be, but is not limited to be, implemented based on the device performance monitoring system in the foregoing embodiment, where the device performance monitoring method specifically includes the following steps:
step S301, a device to be tested is placed on the surface of the test board, a golden finger is arranged on the test board, and the device to be tested is electrically connected with the golden finger.
The test board 103 includes a double-sided circuit board, which may be, but not limited to, a PCB. Referring to the structure diagram of the test board 103 in fig. 2, it can be seen that the device under test 1031 is electrically connected to the test board 103 and 1032 of the test board 103, so as to monitor the device performance of the device under test 1031.
Step S302, providing a test slot, wherein an insertion through hole is arranged in the test slot, and a conductive elastic sheet is arranged in the insertion through hole; and inserting the test board into the insertion through hole, wherein the golden finger is in contact with the conductive elastic sheet.
Specifically, referring to the schematic structural diagram of the test socket 102 in fig. 2, it can be seen that the test socket 102 can connect the test socket 102 and the test board 103 by contacting the conductive elastic pieces 1021 in the through holes with the gold fingers 1032.
Step S303, electrically connecting the test instrument with the conductive elastic sheet through the test cable.
Specifically, the test socket 102 is fixed on a circuit board 104, a pad connected to the conductive elastic piece 1021 is disposed on a surface of the circuit board 104, and the test instrument 105 is connected to the pad through the test cable, so that the test instrument 105 is electrically connected to the conductive elastic piece 1021 through the test cable.
Step S304, placing the test board with the device to be tested on the surface and the test slot in an environmental test chamber, and applying a test voltage to the device to be tested under a preset temperature condition through the environmental test chamber; and monitoring the device to be tested by using the testing instrument.
Specifically, referring to fig. 4, fig. 4 is a schematic view of a scenario of monitoring device performance in one embodiment, and as can be seen from the schematic view, the test board 103 is connected to the test socket 102 and is disposed in the environmental test chamber 101, the environmental test chamber 101 is used to set temperature conditions and test voltages, and the test instrument 105 is used to monitor the performance of the device 1031 to be tested (such as the capacitance, resistance or inductance of a transistor of the device), and the apparatus further includes a determination module 106 (the determination module 106 may be one module in the test instrument 105 or may be a module in a single device), the determining module 106 is connected to the testing instrument 105, and configured to determine whether the device under test 1031 is abnormal according to the monitoring result of the testing instrument 105, so as to monitor the abnormal condition of the device under test 1031 in real time.
The method related to the scene schematic diagram mainly judges whether the device fails or not through the performance parameter change of the test sample, and life test evaluation can be carried out on all the devices to be tested. For example, the resistance-capacitance device may be tested for resistance change by a resistance testing instrument to determine whether the device is out of order, and for other devices such as an inductance triode and the like, a monitoring effect may also be achieved by replacing a measuring instrument of an external monitoring system, and the detailed description is given by taking the resistance-capacitance device as an example.
(1) Mounting and welding a device to be tested 1031 on the customized test board 103;
(2) the test board 103 is inserted into the corresponding test slot 102;
(3) placing the test slot 102 and the test board 103 into the environmental test chamber 101 integrally, and connecting to an external resistance test instrument 105 through a test cable;
(4) testing the initial resistance;
(5) and starting the environment test box to perform a life test on the device 1031 to be tested, applying a corresponding test voltage in the test process, and testing and uninterruptedly monitoring the resistance of the device 1031 to be tested through the resistance testing instrument 105.
(6) The resistance during the test is compared with the initial resistance, and if the resistance change exceeds the set change rate, the device is damaged. And recording the test time, and taking down and replacing a new device.
The failure time can be accurately captured in the online monitoring process, the welding time of a sample can be reduced, the test flow is simplified, the sample does not need to be taken out at regular time for measuring related parameters, and online monitoring can be carried out efficiently in real time.
It should be understood that, although the steps in the flowcharts related to the embodiments described above are sequentially shown as indicated by the arrows, the steps are not necessarily performed sequentially in the order indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least a part of the steps in the flowcharts related to the above embodiments may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, and the execution order of the steps or stages is not necessarily sequential, but may be performed alternately or alternately with other steps or at least a part of the steps or stages in other steps.
The modules in the device performance monitoring apparatus may be wholly or partially implemented by software, hardware and a combination thereof. The modules can be embedded in a hardware form or independent from a processor in the computer device, and can also be stored in a memory in the computer device in a software form, so that the processor can call and execute operations corresponding to the modules.
In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as shown in fig. 5. The computer device includes a processor, a memory, a communication interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The communication interface of the computer device is used for communicating with an external terminal in a wired or wireless manner, and the wireless manner can be realized through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. The computer program is executed by a processor to implement a device performance monitoring method, the display screen of the computer device may be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device may be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on a casing of the computer device, or an external keyboard, a touch pad or a mouse, etc.
It will be appreciated by those skilled in the art that the configuration shown in fig. 5 is a block diagram of only a portion of the configuration associated with the present application, and is not intended to limit the computing device to which the present application may be applied, and that a particular computing device may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
In one embodiment, a computer device is provided, comprising a memory and a processor, the memory having a computer program stored therein, the processor implementing the following steps when executing the computer program:
placing a device to be tested on the surface of the test board, wherein the test board is provided with a golden finger, and the test device is electrically connected with the golden finger;
providing a test slot, wherein an insertion through hole is formed in the test slot, and a conductive elastic sheet is arranged in the insertion through hole; inserting the test board into the through hole, and contacting the gold finger with the conductive elastic sheet; electrically connecting a test instrument with the conductive elastic sheet through a test cable; placing the test board with the device to be tested on the surface and the test slot in an environmental test chamber, and applying a test voltage to the device to be tested under a preset temperature condition through the environmental test chamber; and monitoring the device to be tested by using the testing instrument.
In one embodiment, after the test board is inserted into the insertion through hole, the gold fingers and the conductive elastic pieces are arranged in a one-to-one correspondence manner, and the width of the gold fingers is the same as that of the conductive elastic pieces.
In one embodiment, before inserting the test board into the insertion through hole, the method further comprises: fixing the test slot on a circuit board, wherein a bonding pad connected with the conductive elastic sheet is arranged on the surface of the circuit board; electrically connecting a test instrument with the conductive spring plate via a test cable comprises: the testing instrument is connected with the bonding pad through the testing cable so as to realize the electric connection of the testing instrument and the conductive elastic sheet.
It can be seen that the test slot can be used repeatedly, the test can be carried out only by replacing the test board, the test board provided with the device to be tested is not required to be welded on the test cable at each time, the process that the wiring is required for each test is reduced, the test time is saved, and the test efficiency is improved.
In one embodiment, the test board comprises a double-sided test board.
In one embodiment, after the device under test is monitored by using the test instrument, the method further includes: and judging whether the device to be tested is abnormal or not according to the monitoring result of the testing instrument.
Therefore, the device can judge the monitoring result, so that the abnormal condition of the device to be tested can be monitored in real time.
According to the device performance monitoring device and method, the test slot is additionally arranged, the test board provided with the device to be tested is inserted into the test slot, the device to be tested is connected with the conductive elastic sheet of the test board through the golden finger, and the conductive elastic sheet is connected with the test instrument through the test cable, so that the device to be tested does not need to be taken out at regular time for measuring related parameters, and real-time and efficient online monitoring can be realized.
In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored which, when executed by a processor, performs the steps of:
placing a device to be tested on the surface of the test board, wherein a golden finger is arranged on the test board, and the test device is electrically connected with the golden finger;
providing a test slot, wherein an insertion through hole is formed in the test slot, and a conductive elastic sheet is arranged in the insertion through hole; inserting the test board into the through hole, and contacting the golden finger with the conductive elastic sheet; electrically connecting a test instrument with the conductive elastic sheet through a test cable; placing the test board with the device to be tested on the surface and the test slot in an environmental test chamber, and applying a test voltage to the device to be tested under a preset temperature condition through the environmental test chamber; and monitoring the device to be tested by using the testing instrument.
In one embodiment, after the test board is inserted into the insertion through hole, the gold fingers and the conductive elastic pieces are arranged in a one-to-one correspondence manner, and the width of the gold fingers is the same as that of the conductive elastic pieces.
In one embodiment, before inserting the test board into the insertion through hole, the method further comprises: fixing the test slot on a circuit board, wherein a bonding pad connected with the conductive elastic sheet is arranged on the surface of the circuit board; electrically connecting a test instrument with the conductive spring plate via a test cable comprises: the testing instrument is connected with the bonding pad through the testing cable so as to realize the electric connection of the testing instrument and the conductive elastic sheet.
It can be seen that the test slot can be used repeatedly, and the test can be carried out only by replacing the test board, the test board provided with the device to be tested is not required to be welded on the test cable at each time for testing, the process that wiring is required for each test is reduced, the test time is saved, and the test efficiency is improved.
In one embodiment, the test board comprises a double-sided test board.
In one embodiment, after the device under test is monitored by using the test instrument, the method further includes: and judging whether the device to be tested is abnormal or not according to the monitoring result of the testing instrument.
Therefore, the device can judge the monitoring result, so that the abnormal condition of the device to be tested can be monitored in real time.
According to the device performance monitoring device and method, the test slot is additionally arranged, the test board provided with the device to be tested is inserted into the test slot, the device to be tested is connected with the conductive elastic sheet of the test board through the golden finger, and the conductive elastic sheet is connected with the test instrument through the test cable, so that the device to be tested does not need to be taken out at regular time for measuring related parameters, and real-time and efficient online monitoring can be realized.
In one embodiment, a computer program product is provided, comprising a computer program which when executed by a processor performs the steps of:
placing a device to be tested on the surface of the test board, wherein the test board is provided with a golden finger, and the test device is electrically connected with the golden finger;
providing a test slot, wherein an insertion through hole is formed in the test slot, and a conductive elastic sheet is arranged in the insertion through hole; inserting the test board into the through hole, and contacting the gold finger with the conductive elastic sheet; electrically connecting a test instrument with the conductive elastic sheet through a test cable; placing the test board with the device to be tested on the surface and the test slot in an environmental test chamber, and applying a test voltage to the device to be tested under a preset temperature condition through the environmental test chamber; and monitoring the device to be tested by using the testing instrument.
In one embodiment, after the test board is inserted into the insertion through hole, the gold fingers and the conductive elastic pieces are arranged in a one-to-one correspondence manner, and the width of the gold fingers is the same as that of the conductive elastic pieces.
In one embodiment, before inserting the test board into the insertion through hole, the method further comprises: fixing the test slot on a circuit board, wherein a bonding pad connected with the conductive elastic sheet is arranged on the surface of the circuit board; electrically connecting a test instrument with the conductive spring via a test cable comprises: the testing instrument is connected with the bonding pad through the testing cable so as to realize the electric connection of the testing instrument and the conductive elastic sheet.
It can be seen that the test slot can be used repeatedly, and the test can be carried out only by replacing the test board, the test board provided with the device to be tested is not required to be welded on the test cable at each time for testing, the process that wiring is required for each test is reduced, the test time is saved, and the test efficiency is improved.
In one embodiment, the test board comprises a double-sided test board.
In one embodiment, after the device under test is monitored by using the test instrument, the method further includes: and judging whether the device to be tested is abnormal or not according to the monitoring result of the testing instrument.
Therefore, the device can judge the monitoring result, so that the abnormal condition of the device to be tested can be monitored in real time.
According to the device performance monitoring device and method, the test slot is additionally arranged, the test board provided with the device to be tested is inserted into the test slot, the device to be tested is connected with the conductive elastic sheet of the test board through the golden finger, and the conductive elastic sheet is connected with the test instrument through the test cable, so that the device to be tested does not need to be taken out at regular time for measuring related parameters, and real-time and efficient online monitoring can be realized.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, database, or other medium used in the embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include a Read-Only Memory (ROM), a magnetic tape, a floppy disk, a flash Memory, an optical Memory, a high-density embedded nonvolatile Memory, a resistive Random Access Memory (ReRAM), a Magnetic Random Access Memory (MRAM), a Ferroelectric Random Access Memory (FRAM), a Phase Change Memory (PCM), a graphene Memory, and the like. Volatile Memory can include Random Access Memory (RAM), external cache Memory, and the like. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), among others. The databases involved in the embodiments provided herein may include at least one of relational and non-relational databases. The non-relational database may include, but is not limited to, a block chain based distributed database, and the like. The processors referred to in the embodiments provided herein may be general purpose processors, central processing units, graphics processors, digital signal processors, programmable logic devices, quantum computing based data processing logic devices, etc., without limitation.
All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above examples only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present application. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, and these are all within the scope of protection of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.
Claims (10)
1. A device performance monitoring apparatus, comprising:
the environment test box is used for applying test voltage to the device to be tested under the condition of preset temperature;
the test slot is positioned in the environmental test chamber, an insertion through hole is formed in the test slot, and a conductive elastic sheet is arranged in the insertion through hole;
the test board is positioned in the environmental test chamber, and a golden finger is arranged on the test board; the test board is inserted into the insertion through hole, and the golden finger is in contact with the conductive elastic sheet; the device to be tested is positioned on the surface of the test board and is electrically connected with the conductive elastic sheet through the test board and the golden finger;
and the testing instrument is electrically connected with the conductive elastic sheet through a testing cable and is used for monitoring the device to be tested to which the testing voltage is applied.
2. The device performance monitoring apparatus of claim 1, wherein the gold fingers are arranged in one-to-one correspondence with the conductive spring pieces, and the width of the gold fingers is the same as the width of the conductive spring pieces.
3. The device performance monitoring apparatus of claim 1, further comprising a circuit board, wherein the test slot is fixed on the circuit board, and a pad connected to the conductive elastic sheet is disposed on the surface of the circuit board; the test instrument is connected to the pad via the test cable.
4. The device performance monitoring apparatus of claim 1, wherein the test board comprises a double-sided circuit board.
5. The device performance monitoring apparatus according to any one of claims 1 to 4, wherein the system further includes a determining module, connected to the testing instrument, for determining whether the device under test is abnormal according to the monitoring result of the testing instrument.
6. A device performance monitoring method, the method comprising:
placing a device to be tested on the surface of the test board, wherein a golden finger is arranged on the test board, and the test device is electrically connected with the golden finger;
providing a test slot, wherein an insertion through hole is arranged in the test slot, and a conductive elastic sheet is arranged in the insertion through hole; inserting the test board into the insertion through hole, wherein the golden finger is in contact with the conductive elastic sheet;
electrically connecting a test instrument with the conductive elastic sheet through a test cable;
placing the test board and the test slot with the device to be tested on the surface in an environmental test chamber, and applying a test voltage to the device to be tested under a preset temperature condition through the environmental test chamber; and monitoring the device to be tested by using the test instrument.
7. The device performance monitoring method according to claim 6, wherein after the test board is inserted into the insertion through hole, the gold fingers and the conductive elastic pieces are arranged in a one-to-one correspondence manner, and the width of the gold fingers is the same as that of the conductive elastic pieces.
8. The device performance monitoring method of claim 6, further comprising, prior to inserting the test board into the insertion via: fixing the test slot on a circuit board, wherein a bonding pad connected with the conductive elastic sheet is arranged on the surface of the circuit board;
electrically connecting a test instrument with the conductive dome via a test cable comprises: the testing instrument is connected with the bonding pad through the testing cable so as to realize that the testing instrument is electrically connected with the conductive elastic sheet.
9. The device performance monitoring method of claim 6, wherein the test board comprises a double-sided test board.
10. The device performance monitoring method according to any one of claims 6 to 9, further comprising, after monitoring the device under test using the test instrument: and judging whether the device to be tested is abnormal or not according to the monitoring result of the testing instrument.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210252332.3A CN114778963A (en) | 2022-03-15 | 2022-03-15 | Device performance monitoring method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210252332.3A CN114778963A (en) | 2022-03-15 | 2022-03-15 | Device performance monitoring method and device |
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