CN114777658A - Alignment detection method and alignment detection equipment for semiconductor device - Google Patents
Alignment detection method and alignment detection equipment for semiconductor device Download PDFInfo
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Abstract
The application discloses a method and equipment for detecting alignment of a semiconductor device, wherein the method comprises the following steps: moving a semiconductor device to a calibration position according to a preset sequence, wherein the semiconductor device comprises a substrate and a semiconductor element; when the semiconductor device moves to the calibration position, shooting the semiconductor device from a first visual angle and a second visual angle to acquire a first mark coordinate of the substrate mark in the first visual angle and a second mark coordinate in the second visual angle; determining a coordinate conversion relation according to the first mark coordinate and the second mark coordinate; moving the semiconductor device to a detection position, shooting the semiconductor device from a first visual angle and a second visual angle, and acquiring a semiconductor element mark coordinate in the first visual angle and a substrate mark coordinate in the second visual angle; the actual offset distance between the substrate mark and the semiconductor element mark is determined according to the coordinate of the semiconductor element mark, the coordinate of the substrate mark and the coordinate conversion relation, the actual offset between the semiconductor element mark and the substrate mark can be accurately detected, and the detection accuracy is improved.
Description
Technical Field
The application relates to the technical field of semiconductor assembly detection, in particular to a semiconductor device alignment detection method and device.
Background
Currently, in a manufacturing process of a semiconductor device such as a liquid crystal screen, it is necessary to mount a semiconductor element for driving a display on a glass substrate and align a semiconductor element mark on the semiconductor element with a substrate mark on the glass substrate. When the quality of the liquid crystal screen and the related products is inspected, the distance between the semiconductor element mark and the substrate mark is generally detected to determine the mounting offset of the semiconductor element on the glass substrate.
However, the conventional technology is difficult to accurately detect the actual offset distance between the semiconductor element mark and the substrate mark, so that the quality inspection result of the liquid crystal screen is not accurate enough.
Disclosure of Invention
The application provides a semiconductor device alignment detection method and semiconductor device alignment detection equipment, aiming at accurately detecting the actual offset distance between a semiconductor element mark and a substrate mark so as to improve the detection precision of the semiconductor device.
In a first aspect, an embodiment of the present application provides a method for detecting alignment of a semiconductor device, where the method is applied to an alignment detection apparatus, and includes:
moving the semiconductor devices to calibration positions corresponding to the alignment detection equipment according to a preset sequence, wherein the calibration positions are at least two, the semiconductor devices comprise substrates and semiconductor elements stacked on the substrates, the substrates are provided with substrate marks, and the semiconductor elements are provided with semiconductor element marks;
when the semiconductor device moves to each calibration position, acquiring images of the semiconductor device from a preset first visual angle and a preset second visual angle so as to acquire a first mark coordinate of the substrate mark in the first visual angle and a second mark coordinate in the second visual angle;
determining a coordinate conversion relation between the first visual angle and the second visual angle according to the first mark coordinate and the second mark coordinate;
moving the semiconductor device to a preset detection position, and shooting the semiconductor device from a first visual angle and a second visual angle to acquire a semiconductor element mark coordinate of the semiconductor element mark in the first visual angle and a substrate mark coordinate of the substrate mark in the second visual angle;
and determining the actual offset distance between the substrate mark and the semiconductor element mark according to the coordinates of the semiconductor element mark, the coordinates of the substrate mark and the coordinate conversion relation.
In some embodiments, the alignment detection apparatus is provided with a first shooting device and a second shooting device, a component placement area is arranged between the first shooting device and the second shooting device, and the component placement area is provided with a calibration position;
the method for acquiring the image of the semiconductor device from the preset first visual angle and the preset second visual angle so as to acquire a first mark coordinate of the substrate mark in the first visual angle and a second mark coordinate in the second visual angle comprises the following steps:
controlling a first shooting device to carry out image acquisition from a first visual angle to an element placing area so as to acquire a first mark coordinate of the substrate mark in the first visual angle;
and controlling a second shooting device to acquire an image from a second visual angle to the component placing area so as to acquire second mark coordinates of the substrate mark in the second visual angle.
In some embodiments, the first viewing angle is near a side of the semiconductor element;
controlling a first shooting device to acquire an image from a first view angle to a component placement area so as to acquire first mark coordinates of a semiconductor component mark in the first view angle, and the method comprises the following steps:
controlling a first shooting device to shoot a first visual angle image of the semiconductor device from a first visual angle, wherein the first shooting device can shoot the substrate mark through the semiconductor element;
acquiring a first substrate mark image corresponding to a substrate mark in the first visual angle image;
and establishing a first coordinate system corresponding to the first visual angle, and determining a first mark coordinate in the first coordinate system according to the first visual angle mark image.
In some embodiments, the second viewing angle is near one side of the substrate;
controlling a second camera to capture an image of the component placement area from a second viewing angle to acquire second mark coordinates of the semiconductor component mark in the second viewing angle, comprising:
controlling a second photographing device to photograph a second viewing angle image of the semiconductor device from a second viewing angle;
acquiring a second substrate mark image corresponding to the substrate mark in the second visual angle image;
and establishing a second coordinate system corresponding to the second visual angle, and determining a second mark coordinate in the second coordinate system according to the second visual angle mark image.
In some embodiments, determining the offset distance of the substrate mark from the semiconductor element mark based on the semiconductor element mark coordinates, the substrate mark coordinates, and the coordinate conversion relationship comprises:
converting the semiconductor element mark coordinates in the first view angle into conversion mark coordinates in the second view angle based on the coordinate conversion relationship;
and determining the actual offset distance between the substrate mark and the semiconductor element mark according to the substrate mark coordinate, the conversion mark coordinate and the detection position.
In some embodiments, determining the actual offset distance of the substrate mark from the semiconductor element mark based on the substrate mark coordinates, the conversion mark coordinates, and the inspection position includes:
determining the object distance between the second acquisition device and the detection position in the direction of the central line of the second visual angle;
acquiring device parameters of a second shooting device, and determining shooting precision corresponding to the object distance according to the device parameters;
obtaining coordinate offset according to the substrate mark coordinates and the conversion mark coordinates;
and calculating the actual offset distance between the substrate mark and the semiconductor element mark according to the shooting precision and the coordinate offset.
In some embodiments, before moving the semiconductor device to the calibration position corresponding to the alignment detection apparatus according to the preset sequence, the method further includes:
acquiring a focal length parameter of a second shooting device;
and determining a calibration plane in the element placing area according to the focal length parameters, and determining a calibration position and a detection position on the calibration plane.
In some embodiments, the alignment detection apparatus is provided with a movable support to which the semiconductor device can be mounted;
moving the semiconductor device to a calibration position corresponding to the alignment detection equipment according to a preset sequence, comprising:
mounting the semiconductor device on a movable support;
controlling the movable support to move the semiconductor device to the calibration plane;
controlling the semiconductor device to translate on a calibration plane through the movable support so as to enable the semiconductor device to move to a calibration position corresponding to the alignment detection equipment according to a preset sequence;
moving the semiconductor device to a preset detection position, comprising:
and controlling the semiconductor device to translate on the calibration plane through the movable support so as to move the semiconductor device to a preset detection position.
In some embodiments, determining a coordinate transformation relationship between the first perspective and the second perspective from the first marker coordinates and the second marker coordinates comprises:
establishing a first coordinate matrix according to a first mark coordinate corresponding to the calibration position;
establishing a second coordinate matrix according to a second mark coordinate corresponding to the calibration position;
acquiring a corresponding relation between a first mark coordinate in a first coordinate matrix and a second mark coordinate in a second coordinate matrix according to a preset sequence;
and determining a coordinate conversion relation between the first visual angle and the second visual angle according to the corresponding relation.
In a second aspect, an embodiment of the present application further provides an alignment detection apparatus for a semiconductor device, including:
a memory and a processor;
the memory is used for storing a computer program;
and a processor for executing the computer program and realizing the alignment detection method of the semiconductor device as described above when the computer program is executed.
The embodiment of the application provides a counterpoint detection method and counterpoint detection equipment of a semiconductor device, wherein the counterpoint detection method is applied to the counterpoint detection equipment, and the method comprises the following steps: moving the semiconductor devices to calibration positions corresponding to the alignment detection equipment according to a preset sequence, wherein the number of the calibration positions is at least two, each semiconductor device comprises a substrate and a semiconductor element stacked on the substrate, the substrate is provided with a substrate mark, and the semiconductor element is provided with a semiconductor element mark; when the semiconductor device moves to each calibration position, acquiring images of the semiconductor device from a preset first visual angle and a preset second visual angle so as to acquire a first mark coordinate of the substrate mark in the first visual angle and a second mark coordinate in the second visual angle; determining a coordinate conversion relation between the first visual angle and the second visual angle according to the first mark coordinate and the second mark coordinate; moving the semiconductor device to a preset detection position, and shooting the semiconductor device from a first visual angle and a second visual angle to acquire a semiconductor element mark coordinate of the semiconductor element mark in the first visual angle and a substrate mark coordinate of the substrate mark in the second visual angle; and determining the actual offset distance between the substrate mark and the semiconductor element mark according to the coordinates of the semiconductor element mark, the coordinates of the substrate mark and the coordinate conversion relation. The method can accurately detect the actual offset distance between the semiconductor element mark and the substrate mark so as to improve the detection precision of the semiconductor device.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view of a scenario of a method for detecting alignment of a semiconductor device according to an embodiment of the present invention;
fig. 2 is a schematic block diagram of a structure of a control component of a semiconductor device according to an embodiment of the present invention;
fig. 3 is a schematic flowchart of a method for detecting alignment of a semiconductor device according to an embodiment of the present invention;
fig. 4 is a schematic view of a scenario of a semiconductor device moving step in a method for detecting alignment of a semiconductor device according to an embodiment of the present invention;
fig. 5 is a schematic view of another alignment detection method for a semiconductor device according to an embodiment of the present invention;
fig. 6 is a schematic diagram illustrating a process of determining a coordinate transformation relationship in a method for detecting alignment of a semiconductor device according to an embodiment of the present invention;
reference numerals:
1. a semiconductor device alignment detection device; 11. a control component; 111. a memory; 112. a processor; 12. a movable support; 121. an assembling portion; 122. a drive section; 13. a first photographing device; 14. a second photographing device; 2. a semiconductor device; 21. a semiconductor element; 211. a semiconductor element mark; 22. a substrate; 221. marking a substrate; v1, first viewing angle; v2, second viewing angle.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The flow diagrams depicted in the figures are merely illustrative and do not necessarily include all of the elements and operations/steps, nor do they necessarily have to be performed in the order depicted. For example, some operations/steps may be decomposed, combined or partially combined, so that the actual execution order may be changed according to the actual situation.
It is to be understood that the terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should also be understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments and features of the embodiments described below can be combined with each other without conflict.
Currently, in a manufacturing process of a semiconductor device such as a liquid crystal screen, it is necessary to mount a semiconductor element for driving a display on a glass substrate and align a semiconductor element mark on the semiconductor element with a substrate mark on the glass substrate. When the quality of the liquid crystal screen and the related products is inspected, the distance between the semiconductor element mark and the substrate mark is generally detected to determine the mounting offset of the semiconductor element on the glass substrate. However, in the prior art, it is difficult to accurately detect the actual offset distance between the semiconductor element mark and the substrate mark, so that the quality inspection result of the liquid crystal screen is not accurate enough.
The embodiment of the application provides an alignment detection method of a semiconductor device and an alignment detection device of the semiconductor device, wherein the alignment detection method can be applied to the alignment detection device, the method is used for detecting the actual offset distance of a semiconductor element mark of a semiconductor element and a substrate mark of a substrate on a bonding plane in the semiconductor device, and the bonding plane is a plane where the semiconductor element and the substrate are bonded with each other.
Taking a liquid crystal display or a related product comprising a display driving chip and a glass substrate as an example of a semiconductor device, the method is used for detecting the actual offset distance between a semiconductor element mark on the display driving chip and a substrate mark on the glass substrate on a bonding plane.
Referring to fig. 1, fig. 1 is a schematic view of a scenario of a method for detecting alignment of a semiconductor device according to an embodiment of the present invention.
As shown in fig. 1, the alignment detection method is applicable to the alignment detection apparatus 1 for detecting an actual offset distance d of the semiconductor element mark 211 of the semiconductor element 21 and the substrate mark 221 of the substrate 22 on the bonding plane in the semiconductor device 2. The semiconductor device 2 may be a liquid crystal display or a related product, the semiconductor element 21 is a display driving chip, and the substrate 22 is a glass substrate.
It should be noted that the scenario in fig. 1 is only used to explain the alignment detection method for the semiconductor device provided in the embodiment of the present application, but does not constitute a specific limitation to the application scenario of the alignment detection method for the semiconductor device provided in the embodiment of the present application.
As shown in fig. 1 and fig. 2, in particular, the alignment detection apparatus 1 includes a control component 11, the control component 11 includes a memory 111 and a processor 112, the memory 111 and the processor 112 are connected by a bus 113, and the bus 113 is, for example, an I2C (Inter-integrated Circuit) bus.
In particular, the processor 112 is used to provide computational and control capabilities to support the operation of the overall alignment detection apparatus. The Processor 112 may be a Central Processing Unit (CPU), and the Processor 112 may also be other general purpose Processor, a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field Programmable Gate Array (FPGA) or other Programmable logic device, discrete Gate or transistor logic, discrete hardware components, etc. Wherein a general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
Specifically, the Memory 111 may be a Flash chip, a Read-Only Memory (ROM) magnetic disk, an optical disk, a usb disk, or a removable hard disk.
Those skilled in the art will appreciate that the structure shown in fig. 2 is only a block diagram of a part of the structure related to the embodiment of the present application, and does not constitute a limitation to the application of the embodiment of the present application to the alignment detection apparatus, and a control assembly of a specific alignment detection apparatus may include more or less components than those shown in the figure, or combine some components, or have a different arrangement of components.
The processor is configured to run the computer program stored in the memory, and when the computer program is executed, implement any one of the methods for detecting alignment of a semiconductor device provided in the embodiments of the present application.
In one embodiment, the processor 112 is configured to run a computer program stored in the memory 111, and when executing the computer program, implement the following steps:
moving the semiconductor devices to calibration positions corresponding to the alignment detection equipment according to a preset sequence, wherein the calibration positions are at least two, the semiconductor devices comprise substrates and semiconductor elements stacked on the substrates, the substrates are provided with substrate marks, and the semiconductor elements are provided with semiconductor element marks;
when the semiconductor device moves to each calibration position, acquiring images of the semiconductor device from a preset first visual angle and a preset second visual angle so as to acquire a first mark coordinate of the substrate mark in the first visual angle and a second mark coordinate in the second visual angle;
determining a coordinate conversion relation between the first visual angle and the second visual angle according to the first mark coordinate and the second mark coordinate;
moving the semiconductor device to a preset detection position, and shooting the semiconductor device from a first visual angle and a second visual angle to acquire a semiconductor element mark coordinate of the semiconductor element mark in the first visual angle and a substrate mark coordinate of the substrate mark in the second visual angle;
and determining the actual offset distance between the substrate mark and the semiconductor element mark according to the coordinates of the semiconductor element mark, the coordinates of the substrate mark and the coordinate conversion relation.
In some embodiments, the alignment detection apparatus 1 is provided with a first shooting device 13 and a second shooting device 14, a component placement area 12 is provided between the first shooting device 13 and the second shooting device 14, and the component placement area 12 is provided with a calibration position 15, and the processor 112 specifically includes, when performing image acquisition on the semiconductor device from a preset first viewing angle and a preset second viewing angle to acquire a first mark coordinate of the substrate mark in the first viewing angle and a second mark coordinate in the second viewing angle:
controlling a first shooting device to carry out image acquisition from a first visual angle to an element placing area so as to obtain a first mark coordinate of the substrate mark in the first visual angle;
and controlling a second shooting device to acquire an image from a second visual angle to the component placing area so as to acquire a second mark coordinate of the substrate mark in the second visual angle.
In some embodiments, the first viewing angle is close to the semiconductor component 21 side, and the processor 112 specifically includes, when controlling the first camera to perform image capture on the component placement area from the first viewing angle to acquire a first mark coordinate of the semiconductor component mark in the first viewing angle:
controlling a first shooting device to shoot a first visual angle image of the semiconductor device from a first visual angle, wherein the first shooting device can shoot the substrate mark through the semiconductor element;
acquiring a first substrate mark image corresponding to a substrate mark in the first visual angle image;
and establishing a first coordinate system corresponding to the first visual angle, and determining a first mark coordinate in the first coordinate system according to the first visual angle mark image.
In some embodiments, the second viewing angle is close to the substrate 22 side, and the processor 112 specifically includes, when controlling the second camera to perform image capture from the second viewing angle to the component placement area to obtain a second mark coordinate of the semiconductor component mark in the second viewing angle:
controlling a second photographing device to photograph a second viewing angle image of the semiconductor device from a second viewing angle;
acquiring a second substrate mark image corresponding to the substrate mark in the second visual angle image;
and establishing a second coordinate system corresponding to the second visual angle, and determining a second mark coordinate in the second coordinate system according to the second visual angle mark image.
In some embodiments, the processor 112, when determining the offset distance between the substrate mark and the semiconductor element mark according to the coordinates of the semiconductor element mark, the coordinates of the substrate mark, and the coordinate transformation relationship, specifically includes:
converting the semiconductor element mark coordinates in the first view angle into conversion mark coordinates in the second view angle based on the coordinate conversion relationship;
and determining the actual offset distance of the substrate mark and the semiconductor element mark according to the substrate mark coordinate, the conversion mark coordinate and the detection position.
In some embodiments, the processor 112 specifically includes, when determining the actual offset distance between the substrate mark and the semiconductor element mark according to the substrate mark coordinate, the converted mark coordinate and the detection position:
determining the object distance between the second acquisition device and the detection position in the direction of the central line of the second visual angle;
acquiring device parameters of a second shooting device, and determining shooting precision corresponding to the object distance according to the device parameters;
acquiring coordinate offset according to the substrate mark coordinate and the conversion mark coordinate;
and calculating the actual offset distance between the substrate mark and the semiconductor element mark according to the shooting precision and the coordinate offset.
In some embodiments, before moving the semiconductor device to the calibration position corresponding to the alignment detection apparatus according to the preset sequence, the processor 112 further specifically includes:
acquiring a focal length parameter of a second shooting device;
and determining a calibration plane in the element placing area according to the focal length parameters, and determining a calibration position and a detection position on the calibration plane.
In some embodiments, the alignment detecting apparatus 1 is provided with a movable support 12, and the semiconductor device 2 may be mounted on the movable support 12;
when the processor 112 moves the semiconductor device to the calibration position corresponding to the alignment detection device according to the preset sequence, the method specifically includes:
mounting the semiconductor device to a movable support;
controlling the movable support to move the semiconductor device to the calibration plane;
controlling the semiconductor device to translate on the calibration plane through the movable support so that the semiconductor device moves to a calibration position corresponding to the alignment detection equipment according to a preset sequence;
when the processor 112 moves the semiconductor device to the preset detection position, the method specifically includes:
and controlling the semiconductor device to translate on the calibration plane through the movable support so as to move the semiconductor device to a preset detection position.
In some embodiments, when determining the coordinate transformation relationship between the first viewing angle and the second viewing angle according to the first marker coordinate and the second marker coordinate, the processor 112 specifically includes:
establishing a first coordinate matrix according to a first mark coordinate corresponding to the calibration position;
establishing a second coordinate matrix according to a second mark coordinate corresponding to the calibration position;
acquiring a corresponding relation between a first mark coordinate in the first coordinate matrix and a second mark coordinate in the second coordinate matrix according to a preset sequence;
and determining the coordinate conversion relation between the first visual angle and the second visual angle according to the corresponding relation.
The method for detecting the alignment of the semiconductor device according to the embodiment of the present application is described in detail below with reference to the operating principle of the alignment detection apparatus.
Referring to fig. 3, fig. 3 is a schematic flowchart illustrating a method for detecting alignment of a semiconductor device according to an embodiment of the present disclosure.
As shown in fig. 3, the method for manufacturing the alignment detection apparatus of the semiconductor device specifically includes steps S31-S35:
step S31: and moving the semiconductor devices to calibration positions corresponding to the alignment detection equipment according to a preset sequence, wherein the number of the calibration positions is at least two, the semiconductor devices comprise substrates and semiconductor elements stacked on the substrates, the substrates are provided with substrate marks, and the semiconductor elements are provided with semiconductor element marks.
The semiconductor device includes a substrate provided with a substrate mark and a semiconductor element stacked on the substrate and provided with a semiconductor element mark.
The alignment detection equipment moves the semiconductor device to be detected to calibration positions corresponding to the alignment detection equipment according to a preset sequence, wherein the number of the calibration positions is at least two.
As shown in fig. 4, in some embodiments, the number of calibration positions is multiple, and the multiple calibration positions are arranged in an array on a preset calibration plane. Illustratively, the number of calibration positions may be 9, and 9 calibration positions P1, P2, P3, P4, P5, P6, P7, P8, and P9 are arranged in an array on a preset calibration plane F1.
As shown in fig. 1, in some embodiments, the semiconductor component alignment inspection apparatus is provided with a first camera 13 and a second camera 14 connected to the control module 11, a component placement area is provided between the first camera 13 and the second camera 14, and the component placement area is provided with a calibration position, wherein the first camera 13 corresponds to the first view angle V1, and the second camera 14 corresponds to the second view angle V2.
In some embodiments, the calibration positions corresponding to the alignment detection apparatus are a plurality of preset positions and the alignment detection apparatus stores a preset sequence of moving to the plurality of calibration positions in advance, for example, the preset sequence may be from P1, P2, P3, P4, P5, P6, P7, P8 to P9.
In other embodiments, before the alignment detection apparatus moves the semiconductor device to the calibration position corresponding to the alignment detection apparatus according to the preset sequence, the calibration position needs to be determined in the component placement area according to the focal length parameter of the second camera.
Specifically, before moving the semiconductor device to the calibration position corresponding to the alignment detection device according to the preset sequence, the method further includes:
acquiring a focal length parameter of a second shooting device;
and determining a calibration plane in the element placing area according to the focal length parameters, and determining a calibration position and a detection position on the calibration plane.
It can be understood that the imaging effect of the semiconductor device in the second photographing apparatus is related to the numerical relationship between the object distance between the semiconductor device and the second photographing apparatus in the direction of the center line of the second viewing angle and the focal length parameter of the second capturing apparatus, so that before the semiconductor device is moved to the calibration position corresponding to the alignment detection apparatus according to the preset sequence, the apparatus executing the method obtains the focal length parameter of the second photographing apparatus, determines the calibration plane in the component placement region according to the focal length parameter, and determines the calibration position and the detection position on the calibration plane, wherein the apparatus executing the method can determine the calibration position according to the relative positional relationship of the preset calibration position on the calibration plane. Illustratively, the number of the calibration positions is 9, the 9 calibration positions are arranged on a preset calibration plane in an array, an intersection point of the center of the second viewing angle and the calibration plane is used as a central calibration position in the 9 calibration positions arranged in the array, and the other 8 calibration positions are determined on the calibration plane based on the central calibration position and a preset distance.
The calibration position and the detection position are determined according to the focal length parameter, so that the imaging effect which can be obtained when the second shooting device shoots the semiconductor device is improved, and the actual offset distance between the substrate mark and the semiconductor element mark is convenient to detect.
As shown in fig. 5, in some embodiments, the alignment detection apparatus 1 is provided with a movable support 12 connected to the control component 11, the semiconductor device may be mounted on the movable support 12, and in step S1, the moving the semiconductor device to the corresponding calibration position of the alignment detection apparatus according to the preset sequence specifically includes:
mounting the semiconductor device to a movable support;
controlling the movable support to move the semiconductor device to the calibration plane;
and controlling the semiconductor device to translate on the calibration plane through the movable support so that the semiconductor device moves to the calibration position corresponding to the alignment detection equipment according to a preset sequence.
Specifically, the movable support 12 includes a mounting portion 121 and a driving portion 122, the driving portion 122 can drive the mounting portion 121 to move, the semiconductor device 2 can be mounted on the mounting portion 121 and can be detached from the mounting portion 121, when the semiconductor device 2 is mounted on the mounting portion 121, the semiconductor device 2 is fixed relative to the mounting portion 121, the driving portion 122 can be controlled to drive the mounting portion 121 to move so as to drive the semiconductor device 2 to move to the calibration plane, then the semiconductor device 2 is controlled to be fixed in the direction of the center line of the second viewing angle, and the driving portion 122 can drive the mounting portion 121 to move so as to drive the semiconductor device 2 to translate on the calibration plane, so that the semiconductor device 2 can move to the calibration position 15 corresponding to the alignment detection apparatus 1 according to the preset sequence.
The movable support is controlled to move the semiconductor device to the calibration plane firstly, and then the semiconductor device is controlled to translate to the calibration position on the calibration plane, so that the distance between the semiconductor device and the second shooting device in the direction of the central line of the second visual angle is fixed, and the second shooting device can stably and effectively shoot images of the semiconductor device at a plurality of calibration positions.
Step S32: when the semiconductor device moves to each calibration position, image acquisition is carried out on the semiconductor device from a preset first visual angle and a preset second visual angle so as to acquire a first mark coordinate of the substrate mark in the first visual angle and a second mark coordinate in the second visual angle.
When the semiconductor device moves to each calibration position, image acquisition is carried out on the semiconductor device from a preset first visual angle and a preset second visual angle so as to acquire a first mark coordinate of the substrate mark in the first visual angle and a second mark coordinate in the second visual angle.
As shown in fig. 1, in some embodiments, the semiconductor component alignment detection apparatus is provided with a first camera 13 and a second camera 14, a component placement area 12 is provided between the first camera 13 and the second camera 14, and the component placement area is provided with a calibration position 15, wherein the first camera 13 corresponds to a first viewing angle and the second camera 14 corresponds to a second viewing angle.
Specifically, the step S32 of acquiring an image of the semiconductor device from a preset first viewing angle and a preset second viewing angle to obtain a first mark coordinate of the substrate mark in the first viewing angle and a second mark coordinate in the second viewing angle includes:
controlling a first shooting device to carry out image acquisition from a first visual angle to an element placing area so as to acquire a first mark coordinate of the substrate mark in the first visual angle;
and controlling a second shooting device to acquire an image from a second visual angle to the component placing area so as to acquire second mark coordinates of the substrate mark in the second visual angle.
The device for implementing the method controls the first shooting device to carry out image acquisition from a first visual angle to the direction of the component placement area so as to acquire a first mark coordinate of the substrate mark in the first visual angle, and controls the second shooting device to carry out image acquisition from a second visual angle to the direction of the component placement area so as to acquire a second mark coordinate of the substrate mark in the second visual angle.
As shown in fig. 1, in some embodiments, the first viewing angle V1 is close to the side of the semiconductor device 21, and the controlling the first camera to capture an image of the device placement area from the first viewing angle to acquire first mark coordinates of the semiconductor device mark in the first viewing angle includes:
controlling a first shooting device to shoot a first visual angle image of the semiconductor device from a first visual angle, wherein the first shooting device can shoot the substrate mark through the semiconductor element;
acquiring a first substrate mark image corresponding to a substrate mark in the first visual angle image;
and establishing a first coordinate system corresponding to the first visual angle, and determining a first mark coordinate in the first coordinate system according to the first visual angle mark image.
Specifically, the first photographing device may be an infrared camera, the first photographing device may photograph the substrate mark through the semiconductor element, the apparatus implementing the method controls the first photographing device to photograph a first view angle image of the semiconductor device from a first view angle, then performs image recognition on the collected first view angle image to obtain a first substrate mark image corresponding to the substrate mark in the first view angle image, establishes a first coordinate system corresponding to the first view angle, and determines a first mark coordinate in the first coordinate system according to the first view angle mark image, thereby obtaining a first mark coordinate of the substrate mark in the first coordinate system when the semiconductor device is at different calibration positions, and stores a plurality of first mark coordinates in association with the calibration positions.
Preferably, the first photographing device may photograph by using short-wave infrared light with a wavelength of 1200nm to 1300nm, and it is understood that the short-wave infrared light has a good penetrating effect on a semiconductor element in a semiconductor device and can directly collect a first substrate mark image corresponding to a substrate mark, for example, a housing of a display driving chip is generally a silicon wafer housing, and the short-wave infrared light with a wavelength of 1200nm to 1300nm can penetrate through the semiconductor element to photograph the substrate mark to obtain the first substrate mark image.
As shown in FIG. 1, in some embodiments, the second viewing angle V2 is closer to the side of the substrate 22;
controlling a second camera to capture an image of the component placement area from a second viewing angle to acquire second mark coordinates of the semiconductor component mark in the second viewing angle, comprising:
controlling a second photographing device to photograph a second viewing angle image of the semiconductor device from a second viewing angle;
acquiring a second substrate mark image corresponding to the substrate mark in the second visual angle image;
and establishing a second coordinate system corresponding to the second visual angle, and determining a second mark coordinate in the second coordinate system according to the second visual angle mark image.
Specifically, the equipment executing the method controls the second shooting device to shoot a second visual angle image of the semiconductor device from a second visual angle, then performs image recognition on the collected second visual angle image to obtain a second substrate mark image corresponding to the substrate mark in the second visual angle image, establishes a second coordinate system corresponding to the second visual angle, and determines a second mark coordinate in the second coordinate system according to the second visual angle mark image, so that when the semiconductor device is at different calibration positions, a second mark coordinate of the substrate mark in the second coordinate system is obtained, and the plurality of second mark coordinates and the calibration positions are stored in an associated manner.
Step S33: and determining a coordinate conversion relation between the first visual angle and the second visual angle according to the first mark coordinate and the second mark coordinate.
And calling the first mark coordinates and the second mark coordinates which are stored in association with the calibration positions, and determining the coordinate conversion relation between the first visual angle and the second visual angle according to the first mark coordinates and the second mark coordinates which respectively correspond to the plurality of calibration positions. It can be understood that, for the same calibration position, the first mark coordinate in the first coordinate system and the second mark coordinate in the second coordinate system correspond to each other, that is, the position coordinates of the substrate mark coordinate at the first view angle and the second view angle respectively correspond to each other, and according to the first mark coordinate and the second mark coordinate corresponding to a plurality of calibration positions, the coordinate conversion relationship between the first view angle and the second view angle can be determined.
As shown in fig. 6, in some embodiments, step S33 specifically includes steps S331-S334:
step S331: establishing a first coordinate matrix according to a first mark coordinate corresponding to the calibration position;
step S332: establishing a second coordinate matrix according to a second mark coordinate corresponding to the calibration position;
step S333: acquiring a corresponding relation between a first mark coordinate in the first coordinate matrix and a second mark coordinate in the second coordinate matrix according to a preset sequence;
step S334: and determining the coordinate conversion relation between the first visual angle and the second visual angle according to the corresponding relation.
The equipment executing the method establishes a first coordinate matrix according to first mark coordinates corresponding to a plurality of calibration positions, establishes a second coordinate matrix according to second mark coordinates corresponding to the calibration positions, wherein the first coordinate matrix takes the first mark coordinates corresponding to the plurality of mark positions as matrix elements, the second coordinate matrix takes the second mark coordinates corresponding to the plurality of mark positions as matrix elements, then obtains the corresponding relation between the first mark coordinates in the first coordinate matrix and the second mark coordinates in the second coordinate matrix according to a preset sequence, calculates a conversion matrix between the first coordinate matrix and the second coordinate matrix according to the corresponding relation, and determines the coordinate conversion relation between the first visual angle and the second visual angle based on the conversion matrix.
Exemplarily, assuming that the first mark coordinates corresponding to the calibration positions P1-P9 at the first viewing angle are a1, a2, a3, a4, a5, a6, a7, a8, a9, respectively, and the first mark coordinates corresponding to the calibration positions P1-P9 at the first viewing angle are b1, b2, b3, b4, b5, b6, b7, b8, b9, respectively, the following first coordinate matrix M1 and second coordinate matrix M2 can be obtained:
based on the obtained first coordinate matrix M1 and the second coordinate matrix M2, according to the one-to-one correspondence relationship between the first mark coordinate a1-a9 in the first coordinate matrix M1 and the second mark coordinate b1-b9 in the second coordinate matrix M2 in the preset sequence, the conversion matrix between the first coordinate matrix M1 and the second coordinate matrix M2 is calculated according to the correspondence relationship, and the coordinate conversion relationship between the first visual angle and the second visual angle is determined based on the conversion matrix.
Step S34: and moving the semiconductor device to a preset detection position, and shooting the semiconductor device from the first visual angle and the second visual angle to acquire the semiconductor element mark coordinates of the semiconductor element mark in the first visual angle and the substrate mark coordinates of the substrate mark in the second visual angle.
The apparatus executing the method moves the semiconductor device to a preset detection position and photographs the semiconductor device from a first view angle and a second view angle to acquire a semiconductor element mark coordinate of the semiconductor element mark in the first view angle and a substrate mark coordinate of the substrate mark in the second view angle.
As shown in fig. 5, in some embodiments, the alignment inspection apparatus 1 is provided with a movable support 12, and the semiconductor device may be mounted on the movable support 12 to move the semiconductor device to a preset inspection position, including:
and controlling the semiconductor device to translate on the calibration plane through the movable support so as to move the semiconductor device to a preset detection position.
Specifically, when the semiconductor device 2 is mounted on the mounting portion 121, the semiconductor device 2 is fixed relative to the mounting portion 121, the movable support 12 can control the semiconductor device 2 to be fixed in the direction of the center line of the second viewing angle V2, that is, the semiconductor device 2 is controlled to be kept on the calibration plane, and the driving portion 122 drives the mounting portion 121 to move so as to drive the semiconductor device 2 to translate to the detection position on the calibration plane, wherein the detection position is arranged on the calibration plane.
The movable support is controlled to translate the semiconductor device to the detection position on the calibration plane, so that the distance between the semiconductor device and the second shooting device in the direction of the center line of the second visual angle is fixed in the process of moving the semiconductor device, the second shooting device enables the image shot by the semiconductor device on the detection position to be stable and effective, and the coordinate conversion relation between the first visual angle and the second visual angle of the semiconductor device at the moment is in accordance with the coordinate conversion relation between the first visual angle and the second visual angle determined when the semiconductor device is moved to the calibration plane in the previous step.
After the semiconductor device is moved to a preset detection position, on one hand, the equipment controls a first shooting device to shoot the semiconductor device from a first visual angle and carries out image recognition on a shot image so as to acquire a semiconductor element mark coordinate of a semiconductor element mark in the first visual angle; on the other hand, the apparatus controls the second photographing device to photograph the semiconductor device from the second angle of view and performs image recognition on the photographed image to acquire substrate mark coordinates of the substrate mark in the second angle of view.
Step S35: and determining the actual offset distance between the substrate mark and the semiconductor element mark according to the semiconductor element mark coordinate, the substrate mark coordinate and the coordinate conversion relation.
The apparatus for carrying out the method determines the actual offset distance of the substrate mark from the semiconductor element mark on the basis of the semiconductor element mark coordinates, the substrate mark coordinates and the coordinate conversion relationship.
In some embodiments, determining the offset distance of the substrate mark from the semiconductor element mark based on the semiconductor element mark coordinates, the substrate mark coordinates, and the coordinate conversion relationship includes:
converting the semiconductor element mark coordinates in the first view angle into conversion mark coordinates in the second view angle based on the coordinate conversion relationship;
and determining the actual offset distance of the substrate mark and the semiconductor element mark according to the substrate mark coordinate, the conversion mark coordinate and the detection position.
Specifically, the coordinates of the semiconductor element mark in a first coordinate system corresponding to a first visual angle are converted based on a coordinate conversion relation, so that the converted mark coordinates of the semiconductor element mark in a second coordinate system corresponding to a second visual angle are obtained, and then the actual offset distance between the substrate mark and the semiconductor element mark is determined according to the deviation of the substrate mark coordinates and the converted mark coordinates and the detection position.
In some embodiments, determining the actual offset distance of the substrate mark from the semiconductor element mark from the substrate mark coordinates, the converted mark coordinates, and the detection position includes:
determining the object distance between the second acquisition device and the detection position in the direction of the central line of the second visual angle;
acquiring device parameters of a second shooting device, and determining shooting precision corresponding to the object distance according to the device parameters;
acquiring coordinate offset according to the substrate mark coordinate and the conversion mark coordinate;
and calculating the actual offset distance between the substrate mark and the semiconductor element mark according to the shooting precision and the coordinate offset.
It can be understood that the shooting accuracy of the second shooting device, that is, the actual length corresponding to a pixel in the image captured by the second shooting device is related to the distance from the second capturing device to the object to be shot, based on which, the apparatus implementing the method first determines the object distance between the second capturing device and the detection position in the direction of the center line of the second viewing angle, obtains the device parameters of the second shooting device, and determines the shooting accuracy of the second shooting device at the current object distance according to the device parameters, then obtaining coordinate deviation according to the substrate mark coordinates and the conversion mark coordinates, calculating the actual deviation distance between the substrate mark and the semiconductor element mark according to the shooting precision and the coordinate deviation, the acquired device parameters of the second shooting device comprise a field angle, and the equipment can determine the shooting precision of the second shooting device at the current object distance according to the field angle of the second shooting device.
Specifically, calculating the actual offset distance between the substrate mark and the semiconductor element mark based on the photographing accuracy and the coordinate offset includes: the pixel value of the deviation between the substrate mark and the semiconductor element mark is determined according to the coordinate deviation, and the actual deviation distance between the substrate mark and the semiconductor element mark is determined according to the shooting precision and the pixel value of the deviation. In some embodiments, the first coordinate system and the second coordinate system are both pixel coordinate systems, that is, each unit length corresponds to a side length of one pixel, and the coordinate offset can be directly used as a pixel value of the deviation between the substrate mark and the semiconductor element mark.
The shooting precision is determined according to the device parameters, the actual offset distance between the substrate mark and the semiconductor element mark is calculated according to the shooting precision and the coordinate offset, the actual offset distance between the semiconductor element mark and the substrate mark can be accurately detected by combining the device parameters of the second shooting device, the device parameters of the second shooting device are generally preset when the second shooting device leaves a factory, the calculation process is greatly reduced, and the detection speed and precision are improved.
In summary, the present application provides a method for detecting an alignment of a semiconductor device and an apparatus for detecting an alignment of a semiconductor device, where the method for detecting an alignment can be applied to the apparatus for detecting an alignment, and the method includes: moving the semiconductor devices to calibration positions corresponding to the alignment detection equipment according to a preset sequence, wherein the calibration positions are at least two, the semiconductor devices comprise substrates and semiconductor elements stacked on the substrates, the substrates are provided with substrate marks, and the semiconductor elements are provided with semiconductor element marks; when the semiconductor device moves to each calibration position, acquiring images of the semiconductor device from a preset first visual angle and a preset second visual angle so as to acquire a first mark coordinate of the substrate mark in the first visual angle and a second mark coordinate in the second visual angle; determining a coordinate conversion relation between the first visual angle and the second visual angle according to the first mark coordinate and the second mark coordinate; moving the semiconductor device to a preset detection position, and shooting the semiconductor device from a first visual angle and a second visual angle to acquire a semiconductor element mark coordinate of the semiconductor element mark in the first visual angle and a substrate mark coordinate of the substrate mark in the second visual angle; and determining the actual offset distance between the substrate mark and the semiconductor element mark according to the coordinates of the semiconductor element mark, the coordinates of the substrate mark and the coordinate conversion relation. The method can accurately detect the actual offset distance between the semiconductor element mark and the substrate mark so as to improve the detection precision of the semiconductor device.
It is to be understood that the terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification of the present application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should also be understood that the term "and/or" as used in this specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items and includes such combinations. It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The above-mentioned serial numbers of the embodiments of the present application are merely for description, and do not represent the advantages and disadvantages of the embodiments. While the invention has been described with reference to specific embodiments, the scope of the invention is not limited thereto, and various equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A counterpoint detection method of a semiconductor device is applied to counterpoint detection equipment and is characterized by comprising the following steps:
moving the semiconductor devices to calibration positions corresponding to the alignment detection equipment according to a preset sequence, wherein the number of the calibration positions is at least two, the semiconductor devices comprise substrates and semiconductor elements stacked on the substrates, the substrates are provided with substrate marks, and the semiconductor elements are provided with semiconductor element marks;
when the semiconductor device moves to each calibration position, carrying out image acquisition on the semiconductor device from a preset first visual angle and a preset second visual angle so as to acquire a first mark coordinate of the substrate mark in the first visual angle and a second mark coordinate in the second visual angle;
determining a coordinate conversion relation between the first visual angle and the second visual angle according to the first mark coordinate and the second mark coordinate;
moving the semiconductor device to a preset detection position, and shooting the semiconductor device from the first visual angle and the second visual angle to acquire a semiconductor element mark coordinate of the semiconductor element mark in the first visual angle and a substrate mark coordinate of the substrate mark in the second visual angle;
and determining the actual offset distance between the substrate mark and the semiconductor element mark according to the semiconductor element mark coordinate, the substrate mark coordinate and the coordinate conversion relation.
2. The method according to claim 1, wherein the alignment detection apparatus is provided with a first camera and a second camera, a component placement area is provided between the first camera and the second camera, and the component placement area is provided with the calibration position;
the image acquisition of the semiconductor device from a preset first viewing angle and a preset second viewing angle to acquire a first mark coordinate of the substrate mark in the first viewing angle and a second mark coordinate in the second viewing angle comprises:
controlling the first shooting device to carry out image acquisition on the component placing area from the first visual angle so as to acquire a first mark coordinate of the substrate mark in the first visual angle;
and controlling the second shooting device to acquire an image from the second visual angle to the component placement area so as to acquire second mark coordinates of the substrate mark in the second visual angle.
3. The method of claim 2, wherein the first viewing angle is near a side of the semiconductor element;
the controlling the first photographing device to perform image capturing from the first view angle to the component placement area to acquire first mark coordinates of the semiconductor component mark in the first view angle includes:
controlling the first shooting device to shoot a first visual angle image of the semiconductor device from the first visual angle, wherein the first shooting device can shoot the substrate mark through the semiconductor element;
acquiring a first substrate mark image corresponding to the substrate mark in the first visual angle image;
and establishing a first coordinate system corresponding to the first visual angle, and determining the first mark coordinate in the first coordinate system according to the first visual angle mark image.
4. The method of claim 2, wherein the second viewing angle is proximate to the substrate side;
the controlling the second photographing device to perform image capturing from the second view angle to the component placement area to acquire second mark coordinates of the semiconductor component mark in the second view angle includes:
controlling the second photographing device to photograph a second viewing angle image of the semiconductor device from the second viewing angle;
acquiring a second substrate mark image corresponding to the substrate mark in the second visual angle image;
and establishing a second coordinate system corresponding to the second visual angle, and determining the second mark coordinate in the second coordinate system according to the second visual angle mark image.
5. The method of claim 2, wherein determining the offset distance of the substrate mark from the semiconductor component mark based on the semiconductor component mark coordinates, the substrate mark coordinates, and the coordinate transformation relationship comprises:
converting the semiconductor element mark coordinates in the first view angle into conversion mark coordinates in the second view angle based on the coordinate conversion relationship;
and determining the actual offset distance between the substrate mark and the semiconductor element mark according to the substrate mark coordinate, the conversion mark coordinate and the detection position.
6. The method of claim 5, wherein determining the actual offset distance of the substrate mark from the semiconductor element mark based on the substrate mark coordinates, the converted mark coordinates, and the inspection position comprises:
determining the object distance between the second acquisition device and the detection position in the direction of the central line of the second visual angle;
acquiring device parameters of the second shooting device, and determining shooting precision corresponding to the object distance according to the device parameters;
obtaining coordinate offset according to the substrate mark coordinates and the conversion mark coordinates;
and calculating the actual offset distance between the substrate mark and the semiconductor element mark according to the shooting precision and the coordinate offset.
7. The method according to any one of claim 2, wherein before moving the semiconductor device to the corresponding calibration position of the alignment detection apparatus according to the predetermined sequence, the method further comprises:
acquiring a focal length parameter of the second shooting device;
and determining a calibration plane in the element placing area according to the focal length parameter, and determining the calibration position and the detection position on the calibration plane.
8. The method according to claim 7, wherein the alignment detection apparatus is provided with a movable stand to which the semiconductor device can be mounted;
the moving the semiconductor device to the calibration position corresponding to the alignment detection device according to the preset sequence comprises:
mounting the semiconductor device to the movable support;
controlling the movable support to move the semiconductor device to the calibration plane;
controlling the semiconductor device to translate on the calibration plane through the movable support so as to enable the semiconductor device to move to a calibration position corresponding to the alignment detection equipment according to a preset sequence;
the moving the semiconductor device to a preset detection position includes:
and controlling the semiconductor device to translate on the calibration plane through the movable support so as to move the semiconductor device to a preset detection position.
9. The method according to any one of claims 1-8, wherein said determining a coordinate transformation relationship between said first perspective and said second perspective from said first marker coordinates and said second marker coordinates comprises:
establishing a first coordinate matrix according to the first mark coordinate corresponding to the calibration position;
establishing a second coordinate matrix according to the second mark coordinate corresponding to the calibration position;
acquiring the corresponding relation between the first mark coordinate in the first coordinate matrix and the second mark coordinate in the second coordinate matrix according to the preset sequence;
and determining the coordinate conversion relation between the first visual angle and the second visual angle according to the corresponding relation.
10. An alignment detecting apparatus of a semiconductor device, comprising:
a memory and a processor;
the memory is used for storing a computer program;
the processor is configured to execute the computer program and, when executing the computer program, implement the alignment detection method for the semiconductor device according to any one of claims 1 to 9.
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