CN114759419B - 一种海底电缆焊接用铜铝梯度合金过渡接头的制备方法 - Google Patents
一种海底电缆焊接用铜铝梯度合金过渡接头的制备方法 Download PDFInfo
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- CN114759419B CN114759419B CN202210265924.9A CN202210265924A CN114759419B CN 114759419 B CN114759419 B CN 114759419B CN 202210265924 A CN202210265924 A CN 202210265924A CN 114759419 B CN114759419 B CN 114759419B
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- Prior art keywords
- copper
- aluminum
- powder
- layer
- gradient
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Links
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 title claims abstract description 73
- 239000000956 alloy Substances 0.000 title claims abstract description 46
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 41
- 238000003466 welding Methods 0.000 title claims abstract description 24
- 230000007704 transition Effects 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 20
- 239000000843 powder Substances 0.000 claims abstract description 110
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 54
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000000463 material Substances 0.000 claims abstract description 50
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 40
- 239000010949 copper Substances 0.000 claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 37
- 238000000151 deposition Methods 0.000 claims abstract description 35
- 239000002131 composite material Substances 0.000 claims abstract description 34
- 238000004070 electrodeposition Methods 0.000 claims abstract description 26
- 230000008021 deposition Effects 0.000 claims abstract description 21
- 230000008569 process Effects 0.000 claims abstract description 15
- 230000008859 change Effects 0.000 claims abstract description 11
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 11
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000005551 mechanical alloying Methods 0.000 claims abstract description 8
- 239000011148 porous material Substances 0.000 claims abstract description 8
- 238000011049 filling Methods 0.000 claims abstract description 5
- 229910000838 Al alloy Inorganic materials 0.000 claims description 20
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 15
- 238000000498 ball milling Methods 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 10
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 5
- 238000003892 spreading Methods 0.000 claims description 5
- 230000007480 spreading Effects 0.000 claims description 5
- 238000005275 alloying Methods 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000011812 mixed powder Substances 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 4
- CHLCPTJLUJHDBO-UHFFFAOYSA-M sodium;benzenesulfinate Chemical compound [Na+].[O-]S(=O)C1=CC=CC=C1 CHLCPTJLUJHDBO-UHFFFAOYSA-M 0.000 claims description 4
- 238000005056 compaction Methods 0.000 claims description 3
- 238000005137 deposition process Methods 0.000 claims description 3
- 230000033001 locomotion Effects 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 238000000280 densification Methods 0.000 claims description 2
- 239000002659 electrodeposit Substances 0.000 claims description 2
- 239000003792 electrolyte Substances 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 239000013589 supplement Substances 0.000 claims description 2
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 abstract 1
- 238000005245 sintering Methods 0.000 description 6
- 238000005336 cracking Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000005728 strengthening Methods 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000007750 plasma spraying Methods 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- 239000012691 Cu precursor Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- GQLSFFZMZXULSF-UHFFFAOYSA-N copper;oxotungsten Chemical compound [Cu].[W]=O GQLSFFZMZXULSF-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 235000019580 granularity Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/62—Connections between conductors of different materials; Connections between or with aluminium or steel-core aluminium conductors
- H01R4/625—Soldered or welded connections
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
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CN202210265924.9A CN114759419B (zh) | 2022-03-17 | 2022-03-17 | 一种海底电缆焊接用铜铝梯度合金过渡接头的制备方法 |
Applications Claiming Priority (1)
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CN202210265924.9A CN114759419B (zh) | 2022-03-17 | 2022-03-17 | 一种海底电缆焊接用铜铝梯度合金过渡接头的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN114759419A CN114759419A (zh) | 2022-07-15 |
CN114759419B true CN114759419B (zh) | 2024-01-09 |
Family
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Family Applications (1)
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CN202210265924.9A Active CN114759419B (zh) | 2022-03-17 | 2022-03-17 | 一种海底电缆焊接用铜铝梯度合金过渡接头的制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN114759419B (zh) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108251800A (zh) * | 2018-04-15 | 2018-07-06 | 山东建筑大学 | 一种Cu-Al梯度薄膜材料及其制备方法 |
CN110277668A (zh) * | 2018-03-13 | 2019-09-24 | 泰连德国有限公司 | 用于连接由铜和铝制成的电导体的触头针脚 |
CN110552030A (zh) * | 2019-07-24 | 2019-12-10 | 河南平高电气股份有限公司 | 一种铜铝电接触件及其制备方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7804172B2 (en) * | 2006-01-10 | 2010-09-28 | Halliburton Energy Services, Inc. | Electrical connections made with dissimilar metals |
CA2764968C (en) * | 2009-06-11 | 2018-03-06 | Modumetal Llc | Functionally graded coatings and claddings for corrosion and high temperature protection |
-
2022
- 2022-03-17 CN CN202210265924.9A patent/CN114759419B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110277668A (zh) * | 2018-03-13 | 2019-09-24 | 泰连德国有限公司 | 用于连接由铜和铝制成的电导体的触头针脚 |
CN108251800A (zh) * | 2018-04-15 | 2018-07-06 | 山东建筑大学 | 一种Cu-Al梯度薄膜材料及其制备方法 |
CN110552030A (zh) * | 2019-07-24 | 2019-12-10 | 河南平高电气股份有限公司 | 一种铜铝电接触件及其制备方法 |
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Publication number | Publication date |
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CN114759419A (zh) | 2022-07-15 |
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CB03 | Change of inventor or designer information |
Inventor after: He Yiqiang Inventor after: Huan Changbao Inventor after: Su Qianhang Inventor after: Yang Jun Inventor after: Zhang Yifan Inventor after: Mu Yuxue Inventor after: Guo Yongkang Inventor after: Zuo Lijie Inventor after: Shang Feng Inventor before: He Yiqiang Inventor before: Huan Changbao Inventor before: Su Qianxing Inventor before: Yang Jun Inventor before: Zhang Yifan Inventor before: Mu Yuxue Inventor before: Guo Yongkang Inventor before: Zuo Lijie Inventor before: Shang Feng |
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CB03 | Change of inventor or designer information |