CN114755899B - High-resolution developer and developing method for fine circuit of circuit board and application of high-resolution developer and developing method - Google Patents
High-resolution developer and developing method for fine circuit of circuit board and application of high-resolution developer and developing method Download PDFInfo
- Publication number
- CN114755899B CN114755899B CN202210675389.4A CN202210675389A CN114755899B CN 114755899 B CN114755899 B CN 114755899B CN 202210675389 A CN202210675389 A CN 202210675389A CN 114755899 B CN114755899 B CN 114755899B
- Authority
- CN
- China
- Prior art keywords
- developing
- resolution
- mass
- developer
- fine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G9/00—Developers
- G03G9/08—Developers with toner particles
- G03G9/12—Developers with toner particles in liquid developer mixtures
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The invention discloses a high-resolution developer for fine circuits of a circuit board, a developing method and application thereof, and relates to the technical field of printed circuit board production. A high-resolution developer for fine circuits of circuit boards comprises the following components in percentage by mass: 5-30% by mass of an organic amine; 0.5-3% of accelerator by mass fraction; 5-100ppm of foam inhibitor; a developing enhancer with a mass concentration of 50-1000 ppm; the balance being water. In the invention, under an organic amine system, the generation of foam can be inhibited and stopped by combining the interaction among the accelerator, the foam inhibitor and the development enhancer; the quality problems of more foams, short circuit, gaps, open circuit and the like generated in the production process of the printed circuit board can be obviously improved, and the developing speed and the quality yield of the production board can be improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board production, in particular to a high-resolution developer and a developing method for fine circuits of a circuit board and application thereof.
Background
With the increase of the integration level of printed circuits, electronic products have been developed to be light, thin, short, small, and digital. At the present stage, miniaturization, multiple functions, high performance and high reliability have become the mainstream development direction, products of printed circuit boards have moved to fine circuits, high density and high multilayering, the line width spacing of HDI products is smaller and smaller, and the traditional 127um/127um of fine line routing is reduced to 50um/50um, even smaller. The pattern on the circuit board is a circuit image formed by changing the hardness, adhesive force, solubility and physical properties through a photoinduced imaging process and then through a developing process.
The traditional developing solution is an l-2% anhydrous sodium carbonate solution, and the temperature of the solution is 20-40 ℃. The developing speed increases with the temperature within the range, and the dry film becomes brittle due to the lack of toughness caused by the excessively high temperature. The developer contains a surfactant, and when the developer is used, a large amount of air is involved by the vibration and the stirring of mechanical equipment, so that foams are easily generated. The foam is liable to cause the deterioration of the quality of the developer, which leads to the deterioration of the image forming effect, and also causes the defective blackening treatment of the inner layer wiring or the surface contamination due to the blackening. At the same time, the foam can also interfere with the reaction of the reactive groups with the dilute alkaline solution, resulting in incomplete dissolution of the residue of the unexposed parts. In order to solve various foaming problems in the developing process, developing defoaming agents are selected by a plurality of manufacturers, but various silicon polyether compound defoaming agents are easy to be stuck on the plate surface and the cylinder wall, so that the product quality is influenced and the production cost is increased.
The developing bath solution used at present is low in developing speed and high in solution foam under normal developing parameters, and an antifoaming agent is required to be additionally added to improve foam generation. The fine line is difficult to resolve frequently, the quality problems of film scrap reverse sticking, more gaps, unclean development and the like are easy to occur in the production, and the production cost is high; the solution contains ammonia nitrogen substances, which are harmful to the environment.
Disclosure of Invention
The invention aims to solve the technical problem of rapidly analyzing fine lines and improving the developing resolution. The problems of more foams, reverse adhesion of film scraps, more gaps and incomplete development of the developing solution are solved, and the developing speed and the quality yield can be improved.
In order to solve the above problems, the present invention proposes the following technical solutions:
a high-resolution developer for fine circuits of circuit boards comprises the following components in percentage by mass: organic amine with the mass fraction of 5-30%; 0.5-3% of accelerator by mass; 5-100ppm of foam inhibitor; a developing enhancer with a mass concentration of 50-1000 ppm; the balance of water;
the organic amine is at least one selected from triethylene diamine, triisopropanolamine and cyclohexylamine;
the accelerant is selected from at least one of fatty alcohol-polyoxyethylene ether, polyether L64 and sodium dibutyl naphthalene sulfonate; the fatty alcohol in the fatty alcohol-polyoxyethylene ether is C7-C9 fatty alcohol, and the polymerization degree n of polyoxyethylene in the fatty alcohol-polyoxyethylene ether is 5 or 6;
the foam inhibitor is selected from at least one of palmitic acid, lauric acid and n-octanol;
the developing intensifier is at least one of trimethylolethane, pentaerythritol and sorbitol.
Preferably, the mass fraction of the organic amine is 12-20%.
Preferably, the mass fraction of the accelerator is 1-2%.
Preferably, the mass concentration of the foam inhibitor is 40-60 ppm.
Preferably, the mass concentration of the development enhancer is 400-600 ppm.
Preferably, the high-resolution developer for the fine circuit of the circuit board comprises the following components in percentage by mass: 12-20% by mass of organic amine; 1-2% of accelerator by mass; a foam inhibitor with a mass concentration of 40-60 ppm; a developing enhancer with a mass concentration of 400-600 ppm; the balance being water.
The preparation method of the high-resolution developer for the fine circuit of the circuit board comprises the following steps: weighing organic amine, an accelerator, a foam inhibitor, a development enhancer and water according to the required proportion, stirring and mixing for 20-60min to obtain the high-resolution developer.
The invention also provides a fine circuit high-resolution developing method, wherein the developing line of the fine circuit high-resolution developer sequentially comprises a developing section I, a developing section II and a replenishing developing section; the developing section I adopts inorganic alkali with the mass concentration of 0.5-2%, the developing temperature is 20-40 ℃, the developing time is 15-30s, and the developing speed is 3-4 m/min; the developing section II adopts the fine line high-resolution developer with the mass concentration of 1-2%, the developing temperature is 20-40 ℃, the developing time is 15-30s, and the developing speed is 3-4 m/min; the supplementary development section adopts inorganic alkali with the mass concentration of 0.5-2%, the development temperature is 20-40 ℃, the film stripping time is 5-10s, and the development speed is 3-4 m/min.
Specifically, the dry film developing process of the circuit board comprises the following steps: the method comprises the steps of an upper plate, a developing section I, a developing section II, a complementary developing section, water washing, drying and a lower plate.
Preferably, the developing section I adopts a sodium carbonate or potassium carbonate solution with a mass concentration of 0.5-2%.
Preferably, the supplementary development section adopts sodium carbonate or potassium carbonate solution with mass concentration of 0.5-2%.
The invention also provides the application of the high-resolution developer for the fine circuit of the circuit board in the production and processing of the printed circuit board.
Has the advantages that:
(1) the high-resolution developer for the fine circuit of the circuit board can inhibit and prevent the generation of foam by combining the interaction among the accelerator, the foam inhibitor and the development enhancer under an organic amine system. The accelerant reduces the surface tension of the dry film, quickly permeates into the gap of the dry film lines, and accelerates the resolution between the dry film lines; meanwhile, the enhancement factor in the reinforcing agent has a high resolution function, the unexposed active group organic carboxyl-COOH in the fine line photoresist and Na ions of a Na2CO3 solution are subjected to repeated decomposition reaction rapidly to generate soluble organic salt-COONa, a dry film which is not polymerized through exposure is removed, and bottom copper is exposed, so that the purpose of rapidly and thoroughly analyzing the fine line dry film is achieved.
(2) The circuit board fine circuit high-resolution developer has simple components and convenient manufacture; the method for developing the dry film of the fine circuit by using the high-resolution developer can rapidly and thoroughly analyze the dry film on the fine circuit aiming at the fine circuit of 50um/50um or even smaller, can obviously improve the quality problems of more foams, short circuit, gaps, open circuit and the like generated in the production process of the printed circuit board, can improve the developing speed and the quality yield of the production board, and has low cost, no ammonia nitrogen in the components and environmental friendliness.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a 10-fold magnification of the conditions of the two-copper and tin plating test in the plating resistance test of example 1;
FIG. 2 is a schematic view of example 1 at 10 times magnification under the immersion tin test conditions;
FIG. 3 is a schematic diagram showing the effect of the beaker test of example 1 after development;
FIG. 4 is a graph showing the effect of comparative example 5 after development of beaker test;
FIG. 5 is a graph showing the effect of a blank comparative example beaker test after development.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
The embodiment of the invention relates to a high-resolution developer for fine circuits of circuit boards, which comprises the following components in percentage by mass: organic amine with the mass fraction of 5-30%; 0.5-3% of accelerator by mass; 5-100ppm of foam inhibitor; a developing enhancer with a mass concentration of 50-1000 ppm; the balance of water;
the organic amine is at least one selected from triethylene diamine, triisopropanolamine and cyclohexylamine;
the accelerant is selected from at least one of fatty alcohol-polyoxyethylene ether, polyether L64 and sodium dibutyl naphthalene sulfonate; the fatty alcohol in the fatty alcohol-polyoxyethylene ether is C7-C9 fatty alcohol, and the polymerization degree n of polyoxyethylene in the fatty alcohol-polyoxyethylene ether is 5 or 6;
the foam inhibitor is selected from at least one of palmitic acid, lauric acid and n-octanol;
the developing intensifier is at least one of trimethylolethane, pentaerythritol and sorbitol.
In the specification, the fatty alcohol (C7-9) polyoxyethylene (n5-6) ether is used as another expression of the fatty alcohol-polyoxyethylene ether promoter.
As a preferred embodiment, the mass fraction of the organic amine is 12-20%.
In a preferred embodiment, the mass fraction of the accelerator is 1 to 2%.
As a preferred embodiment, the mass concentration of the foam inhibitor is 40-60 ppm.
As a preferred embodiment, the mass concentration of the development enhancer is 400-600 ppm.
The invention relates to a process of a high-resolution developing process for fine circuits of a circuit board, which comprises the following steps: the method comprises the steps of an upper plate, a developing section I, a developing section II, a complementary developing section, water washing, drying and a lower plate.
The developing section I adopts inorganic developing solution with the mass concentration of 1-2%, the developing temperature is 20-40 ℃, the developing time is 15-30s, and the developing speed is 3-4 m/min; the inorganic developer is preferably a sodium carbonate solution.
The supplementary development section adopts inorganic developing solution with the mass concentration of 0.5-2%, the development temperature is 20-40 ℃, the development time is 5-10s, and the development speed is 3-4 m/min; the inorganic developer is preferably a sodium carbonate solution.
The developing section II adopts a high-resolution developer with the mass concentration of 1-2% for the fine circuit of the printed circuit board, the developing temperature is 20-40 ℃, the developing time is 15-30s, and the developing speed is 3-4 m/min;
preferably, the fine line high resolution developing method of the present invention employs the process parameters as shown in table 1 below.
TABLE 1 Fine line high resolution development method parameters of the present invention
The following are specific examples and effect verification tests.
Organic amine, an accelerator, a foam inhibitor, a development enhancer and water were weighed according to the components and mass percentages shown in table 2, and after mixing, stirred and mixed for 30min to obtain the fine line high-resolution developers of examples 1 to 12.
TABLE 2 examples 1-12 Fine line high resolution developers of different composition ratios
Weighing organic amine, an accelerator, a foam inhibitor, a development enhancer and water according to the components and mass percentages shown in Table 3, mixing, stirring and mixing for 30min to obtain the developers of comparative examples 1-6.
TABLE 3 bath solution for comparative examples 1-6 with different component ratios
1) Beaker test
500ml of each of the fine line high-resolution developers of examples 1 to 12 was prepared in a beaker in a manner corresponding to 500ml of a bath solution containing 1 to 2 mass% of the fine line high-resolution developer; another group of beakers are taken, and 500ml of the bath solution of comparative examples 1 to 6 shown in the table 3 are correspondingly prepared in the beakers; adding 50 percent (mass fraction) of sulfuric acid into the bath solution in each beaker, fully stirring and heating to 30 ℃, taking the fine circuit boards in the same batch, respectively putting the fine circuit boards into the beakers corresponding to the bath solutions in the examples 1-12 and the comparative examples 1-6, observing for 3-5 minutes, and visually observing whether the dry film is separated out, the liquid medicine is turbid, the developing is not clean, the liquid medicine is layered and the copper surface is corroded. The test results are shown in Table 4.
TABLE 4 beaker test results for examples 1-12 and comparative examples 1-6
Wherein, the blank comparative example is that a beaker contains 100ml of developing bath solution, 50 percent (mass fraction) of sulfuric acid and no fine line high-resolution developer is added.
Example 1 the effect of the beaker test after development is shown in figure 3; comparative example 5 beaker test the effect after development is shown in figure 4; blank comparative example beaker test the effect after development is shown in figure 5.
2) Corrosion testing
Using exposed and unexposed dry films and ink attached to the board surface, 10cm x 10cm of a fine line test board with ink or dry film was placed in a beaker, 50ml of the 100% fine line high resolution developer solution of example 1 was poured into the beaker with the test board placed therein, and after standing for 60min the test board was removed and the appearance of the board surface was observed, and the board surface was observed for the presence of corrosion, the results are shown in table 5.
TABLE 5 Corrosion test results
3) Plating resistance test
Test method 1: the fine circuit high resolution developer of example 1 was uniformly applied to the test board at a concentration of 1%, and then washed with water and then electroplated or tinned to confirm the electroplating and tinning conditions of the test board, the tin surface required no copper exposure, and the tin surface was uniform, and the results are shown in table 6.
TABLE 6 plating resistance test result 1
The test method 2: the fine line high resolution developer of example 1 was uniformly applied to the test board at a concentration of 1-2%, and then washed with water and then electroplated or tin-dipped, thereby confirming the electroplating and tin-dipping condition of the test board, the tin surface required no copper exposure and the tin surface required uniform, and the results are shown in table 7.
TABLE 7 plating resistance test result 2
As is clear from Table 7, the effect of no copper exposure on the tin surface and uniformity of the tin surface was obtained when the developing solution was added in example 1 at an addition concentration of 1 to 2%.
4) Foam test
500ml of each of the fine line high resolution developers of examples 1 to 12 was prepared in a beaker corresponding to 1 to 2% by mass of the fine line high resolution developer; another group of beakers are taken, and 500ml of the bath solution of comparative examples 1 to 6 shown in the table 3 are correspondingly prepared in the beakers; the bath solution was heated to 30 ℃ and the beakers corresponding to examples 1 to 12 and comparative examples 1 to 6 were each inflated with an inflation pump for 10 minutes, and the foam of the bath solution was observed, and the results are shown in Table 8.
TABLE 8 foam results of examples 1-12 and comparative examples 1-6 beaker test
5) On-line testing
5.1 developing section I and supplementing developing section adopt inorganic alkali developing solution
The group 1, group 2 developing sections i and the replenishment developing section all adopt the process parameters shown in table 9.
TABLE 9 Process parameters of group 1, group 2 developing section I, and replenishment developing section
Group 1 chemical 1 in the developing tank of development stage ii was prepared in the proportions shown in table 10.
Group 2 the fine line high resolution developer of example 1 was used and the chemical 2 in the developing tank of development stage ii was formulated in the proportions shown in table 10.
TABLE 10 liquid medicine proportioning process for group 1 and group 2 developing stage II
At the same time, sets 3-4 are set. The difference between the group 3 and the group 2 is that the process of the group 3 does not include the developing section I; the difference between the group 4 and the group 2 is that the process sequence of the developing section i and the developing section ii in the group 4 is different, the developing is performed by the processes of the liquid medicine 2 and the developing section ii in the group 4 first, then the developing is performed by the processes of the 1% sodium carbonate solution and the developing section i, and finally the complementary developing is performed.
Group 1, group 2, group 3, group 4 all processed (development section II temperature 30 ℃, development speed 4m/min, development time 30 s) different line width/line distance fine line dry film test board, produced through (30 pnl) in batches, after developing, checked whether there is the development incomplete problem, after electroplating and etching process, checked the face on the film scrap reverse sticking, open circuit, short circuit and gap situation, the test results are shown in Table 11. Specifically, the fine line specification that fine line dry film test board was selected is 25um/25 um.
TABLE 11 on-line test results for group 1 and group 2
Remarking: the developing speed of group 1 was 2.8m/min, the developing speed of group 2 was 4m/min, the developing speed of group 3 was 2.8m/min, and the developing speed of group 4 was 4 m/min.
5.2 high resolution developer composition and ratio using different fine lines
The groups 5-12 developing section I, developing section II and replenishing developing section all adopt the process parameters as shown in Table 12.
Table 12 sets 5-12 of Process parameters of the developing section I, the developing section II and the replenishing developing section
The formulation of the developing stage II in each of the groups 3 to 10 is shown in Table 13.
Liquid medicine ratio of 3-10 developing stages II in Table 13 groups
Groups 5-12 all processed fine line test boards of different line widths/line distances, were produced in bulk (30 pnl), and after being over-developed, the board was inspected for developing problems, and after the plating and etching processes, the board was inspected for film chip adhesion, open circuits, short circuits, and chipping conditions, and the test results are shown in table 14. Specifically, the fine line specification that fine line dry film test board was selected is 25um/25 um.
TABLE 14 line test results for group 2 and groups 5-12
The circuit board with the specification of 50um/50um or even smaller is a fine circuit board.
As can be seen from table 14, group 2 can develop fine wiring boards with good results; namely, the fine circuit high-resolution developing method can be used for developing a fine circuit board and has a good effect.
In conclusion, the high-resolution developer for the fine circuit of the circuit board can rapidly and thoroughly resolve the fine circuit of the dry film in the using process, and has ultra-strong high resolution. Can inhibit the generation of foam, does not need to additionally add a defoaming agent, and achieves the purpose of saving cost. Experiments prove that the developing speed can be improved by 30-50%, and the quality problems of film scrap reverse sticking, gaps, incomplete developing and the like can be effectively improved.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (3)
1. The high-resolution developer for the fine circuit of the circuit board is characterized by comprising the following components in percentage by mass: 12-20% by mass of organic amine; 1-2% of accelerator by mass; a foam inhibitor with a mass concentration of 40-60 ppm; a developing enhancer with a mass concentration of 400-600 ppm; the balance of water;
the organic amine is selected from one of triethylene diamine, triisopropanolamine and cyclohexylamine;
the accelerant is selected from one of fatty alcohol-polyoxyethylene ether, polyether L64 and sodium dibutyl naphthalene sulfonate; the fatty alcohol in the fatty alcohol-polyoxyethylene ether is C7-C9 fatty alcohol, and the polymerization degree n of polyoxyethylene in the fatty alcohol-polyoxyethylene ether is 5 or 6;
the foam inhibitor is selected from one of palmitic acid, lauric acid and n-octanol;
the developing intensifier is one of trimethylolethane, pentaerythritol and sorbitol.
2. A fine line high-resolution developing method is characterized in that a developing line of a fine line high-resolution developer sequentially comprises a developing section I, a developing section II and a replenishing developing section; the developing section I adopts a sodium carbonate solution with the mass concentration of 0.5-2%, the developing temperature is 20-40 ℃, the developing time is 15-30s, and the developing speed is 3-4 m/min; the developing section II adopts the fine line high-resolution developer as claimed in claim 1 with the mass concentration of 1-2%, the developing temperature is 20-40 ℃, the developing time is 15-30s, and the developing speed is 3-4 m/min; the supplementary developing section adopts a sodium carbonate solution with the mass concentration of 0.5-2%, the developing temperature is 20-40 ℃, the film removing time is 5-10s, and the developing speed is 3-4 m/min.
3. The use of the high resolution developer for fine circuit of circuit board according to claim 1 in the production and processing of printed circuit boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210675389.4A CN114755899B (en) | 2022-06-15 | 2022-06-15 | High-resolution developer and developing method for fine circuit of circuit board and application of high-resolution developer and developing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210675389.4A CN114755899B (en) | 2022-06-15 | 2022-06-15 | High-resolution developer and developing method for fine circuit of circuit board and application of high-resolution developer and developing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114755899A CN114755899A (en) | 2022-07-15 |
| CN114755899B true CN114755899B (en) | 2022-09-16 |
Family
ID=82337213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210675389.4A Active CN114755899B (en) | 2022-06-15 | 2022-06-15 | High-resolution developer and developing method for fine circuit of circuit board and application of high-resolution developer and developing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114755899B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5206113A (en) * | 1989-08-31 | 1993-04-27 | Hoechst Aktiengesellschaft | Graft polymer with unsaturated lateral chains, photosensitive mixture containing said graft polymer and recording material produced therefrom |
| CN102466986A (en) * | 2010-11-09 | 2012-05-23 | 苏州瑞红电子化学品有限公司 | Anticorrosion alkaline developing composition |
| CN102608867A (en) * | 2012-03-27 | 2012-07-25 | 惠州联大电子材料有限公司 | Photosensitive water developing corrosion-resistant composition and photosensitive water developing corrosion-resistant dry film |
| CN109880699A (en) * | 2019-02-23 | 2019-06-14 | 上海富柏化工有限公司 | A kind of development neutralizer |
| CN113504715A (en) * | 2021-09-10 | 2021-10-15 | 深圳市板明科技股份有限公司 | Printed circuit board developing additive |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008015754A1 (en) * | 2006-08-04 | 2008-02-07 | Chiyoda Chemical Co., Ltd. | Photosensitive resin composition |
| CN106332460A (en) * | 2016-08-15 | 2017-01-11 | 中国科学院化学研究所 | High-precision circuit and preparation method thereof |
-
2022
- 2022-06-15 CN CN202210675389.4A patent/CN114755899B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5206113A (en) * | 1989-08-31 | 1993-04-27 | Hoechst Aktiengesellschaft | Graft polymer with unsaturated lateral chains, photosensitive mixture containing said graft polymer and recording material produced therefrom |
| CN102466986A (en) * | 2010-11-09 | 2012-05-23 | 苏州瑞红电子化学品有限公司 | Anticorrosion alkaline developing composition |
| CN102608867A (en) * | 2012-03-27 | 2012-07-25 | 惠州联大电子材料有限公司 | Photosensitive water developing corrosion-resistant composition and photosensitive water developing corrosion-resistant dry film |
| CN109880699A (en) * | 2019-02-23 | 2019-06-14 | 上海富柏化工有限公司 | A kind of development neutralizer |
| CN113504715A (en) * | 2021-09-10 | 2021-10-15 | 深圳市板明科技股份有限公司 | Printed circuit board developing additive |
Non-Patent Citations (2)
| Title |
|---|
| "The characterization of commercal artists" alkyd paints";Shan Jiang等;《Journal of Cultural Heritage》;20081231;第9卷(第4期);第412-419页 * |
| "水性聚氨酯及其应用于纺织助剂";陈荣圻;《印染助剂》;20140228;第31卷(第2期);第1-9页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114755899A (en) | 2022-07-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100822683B1 (en) | Cleaning solution used in photolithography and a method of treating substrate | |
| KR20030067507A (en) | Cleaning composition | |
| US6900003B2 (en) | Photoresist processing aid and method | |
| KR20000008103A (en) | Stripper compound for photoresist | |
| JP7057653B2 (en) | Detergent composition for removing resin mask | |
| CN114554707A (en) | Film removing process of high-precision fine circuit board | |
| CN114755899B (en) | High-resolution developer and developing method for fine circuit of circuit board and application of high-resolution developer and developing method | |
| CN116607149B (en) | Copper surface microetching roughening solution for IC carrier plate and preparation method and application thereof | |
| CN113504715B (en) | Printed circuit board developing additive | |
| US6887654B2 (en) | Residue and scum reducing composition and method | |
| KR102029442B1 (en) | Stripping composition for removing dryfilm resist and stripping method using the same | |
| CN115287130A (en) | PCB (printed circuit board) ion pollution cleaning agent | |
| CN114940884A (en) | Adhesive for increasing binding force between copper surface and dielectric material of printed circuit board | |
| US11092895B2 (en) | Peeling solution composition for dry film resist | |
| KR100862988B1 (en) | Photoresist remover composition | |
| KR100357292B1 (en) | Developing solution for printed wiring board and manufacturing method of printed wiring board | |
| WO2022162972A1 (en) | Resist redisue removal liquid and method for forming substrate with conductor pattern using same | |
| WO2022114110A1 (en) | Cleaning agent composition for detaching resin mask | |
| CN111880384B (en) | Environment-friendly degumming agent for removing photoresist on surface of wafer | |
| EP0364895B1 (en) | Positive type photoresist developer | |
| KR20040083157A (en) | Stripper composition for photoresist | |
| CN114980550A (en) | Circuit board ink stripping agent and circuit board ink stripping method | |
| CN115198279A (en) | Degreasing agent suitable for IC carrier plate flash etching method and application thereof | |
| JP4431641B2 (en) | Developer composition for photosensitive resist | |
| CN115052430A (en) | Reworking method for poor dry film of PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |