CN114752888B - Film forming apparatus, conveying method, film forming method, and electronic device manufacturing method - Google Patents
Film forming apparatus, conveying method, film forming method, and electronic device manufacturing method Download PDFInfo
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- CN114752888B CN114752888B CN202111642733.1A CN202111642733A CN114752888B CN 114752888 B CN114752888 B CN 114752888B CN 202111642733 A CN202111642733 A CN 202111642733A CN 114752888 B CN114752888 B CN 114752888B
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- 238000000034 method Methods 0.000 title claims description 31
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims description 263
- 239000000463 material Substances 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 9
- 238000004378 air conditioning Methods 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 238000009529 body temperature measurement Methods 0.000 claims description 2
- 230000032258 transport Effects 0.000 claims 35
- 230000007723 transport mechanism Effects 0.000 claims 5
- 238000000151 deposition Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 18
- 238000004804 winding Methods 0.000 description 17
- 238000006073 displacement reaction Methods 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000005855 radiation Effects 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010436 fluorite Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/568—Transferring the substrates through a series of coating stations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a tandem type film forming apparatus capable of properly conveying bodies with different sizes. The film forming apparatus includes a conveying mechanism that conveys a conveying body in a conveying direction, a guide portion that restricts a position of the conveying body in a width direction intersecting the conveying direction, a guide portion moving mechanism that moves the guide portion in the width direction, and an obtaining mechanism that obtains size information related to a size of the conveying body, wherein the guide portion moving mechanism changes a position of the guide portion based on the size information obtained by the obtaining mechanism.
Description
Technical Field
The invention relates to a film forming apparatus, a conveying method, a film forming method, and an electronic device manufacturing method.
Background
As a film forming method used in manufacturing an organic EL display or the like, a mask film forming method is known in which a film forming material is formed on a substrate through a mask having openings formed in a predetermined pattern, thereby forming a film of the predetermined pattern on the substrate. As a film forming apparatus for performing such film formation, patent document 1 discloses a tandem type film forming apparatus that performs film formation while conveying a substrate and a mask.
[ Prior Art literature ]
[ patent literature ]
Japanese patent application laid-open No. 2005-248249
Disclosure of Invention
[ problem ] to be solved by the invention
In the tandem type film forming apparatus described in patent document 1, the aligned substrate and mask are placed on a transfer tray and transferred. Patent document 1 describes a conveying guide mechanism for a conveying tray having a guide roller that can advance and retract to a retracted position and a guide position by a driving unit. However, there is no mention of how the position of the guide roller is determined, in particular how the guide position is determined.
Among the conveyers to be transported in the tandem type film forming apparatus, various sizes of conveyers are included according to differences in design dimensions of substrates to be formed, differences in states of the conveyers such as temperature, and the like. If the apparatus is adapted to a large-sized carrier, it is difficult to define the position of the carrier when the size of the carrier is small. On the other hand, if the size of the transport body is larger than the expected size, the transport body is pressed by the guide roller, and deformation or breakage may occur.
Further, there is also a method of forcibly positioning a carrier such as a substrate at a predetermined position by pressing the carrier with a movable guide mechanism. However, in a large substrate, the weight of the substrate carrier and the mask may be 300kg or more, respectively, and therefore, waste is generated due to abrasion with members such as rollers supporting the substrate carrier and the mask. In an organic EL display manufacturing apparatus, the generation of waste material is a factor of degradation of quality, and further a factor of degradation of yield of the apparatus.
The purpose of the present invention is to provide a tandem type film forming device capable of properly conveying bodies having different sizes.
[ solution ] to solve the problem
The film forming apparatus according to the embodiment is characterized in that,
the film forming apparatus includes:
a conveying mechanism that conveys the conveying body in a conveying direction;
a guide portion that restricts a position of the conveying body in a width direction intersecting the conveying direction;
a guide portion moving mechanism that moves the guide portion in the width direction; a kind of electronic device with high-pressure air-conditioning system
An acquisition means for acquiring size information related to the size of the transport body,
the guide moving means changes the position of the guide based on the size information acquired by the acquiring means.
[ Effect of the invention ]
According to the present invention, the transport bodies having different sizes can be appropriately transported.
Drawings
Fig. 1 is a schematic view of an overall production line 1 of a vacuum film forming apparatus according to an embodiment of the present invention.
Fig. 2 (a) to 2 (e) are schematic views showing an embodiment of the alignment chamber 200.
Fig. 3 (a) to 3 (d) are schematic views showing an embodiment of the alignment front chamber 100.
Fig. 4 is a graph of the temperature rise of the substrate carrier 3 and the mask 4.
Fig. 5 is a control block diagram for controlling the advance and retreat of the mask frame guide roller and the substrate guide roller.
Fig. 6 (a) to 6 (c) are another control block diagrams for controlling the advance and retreat of the mask frame guide roller and the substrate guide roller.
[ reference numerals description ]
3: substrate carrier, 4: mask, 104G: substrate carrier transport guide portion, 104M: mask conveyance guide portion, 202: mask conveying section, 203: substrate carrier transport section, 204G: substrate carrier transport guide portion, 204M: mask conveyance guide portion, 230M: mask frame guide roller, 230G: substrate carrier guide roller, 231M: mask guide roller advance and retreat driving portion, 231G: substrate guiding roller advance and retreat driving part
Detailed Description
In the tandem type film forming apparatus, the mask and the substrate carrier circulate in the production line, and thus receive heat every time they pass through the film forming process. When the mask and the substrate carrier are returned in vacuum, heat is less likely to escape, and the next film formation step is started before the completion of the rising temperature drop of the substrate carrier and the mask. Therefore, the temperature of the substrate carrier and the mask rises every round as shown in fig. 4, and in some cases, a temperature rise of 60 ℃ or higher occurs.
In recent years, the size of substrates has been increased, for example, G8 substrates have a size of 2200×2500mm or more, and masks and substrate carriers corresponding thereto have a size of about 3000 mm. The thermal expansion of the mask or substrate carrier is 3mm or more in the case of SUS, and 4mm or more in the case of aluminum.
When the conveyance mechanism of the tandem type film forming apparatus is configured by roller conveyance, the conveyance guide is set with a predetermined gap for guiding the mask and the substrate carrier. If the gap is too large, the conveyance positioning accuracy is lowered, and therefore it is desirable to set the gap as small as possible, but if the thermal expansion of the substrate carrier and the mask is taken into consideration, the gap needs to be increased. However, if the gap is set to be large, the gap between the substrate carrier and the transfer guide when transferring the mask is excessively large in a state where the temperature is not raised, and the transfer positioning accuracy is lowered.
On the other hand, in an alignment process for aligning and overlapping a mask and a substrate carrier with high accuracy, camera alignment using a camera and a precision stage is often used. In the camera alignment, since the marks of the mask and the substrate are photographed by the camera, each mark needs to be brought into one camera field of view. Here, when the conveyance positioning accuracy is low, the distance between the marks of the mask and the substrate increases, and therefore, it is necessary to estimate the distance between the marks to select a camera having a large camera field of view. However, if the camera field of view is set to be large, the camera resolution and the lens resolution decrease, and therefore, the camera field of view becomes a factor of decreasing the positioning accuracy. Further, the larger the amount of movement at the time of alignment, the lower the final positioning accuracy, and therefore the number of retries increases to improve the alignment accuracy, resulting in a decrease in the device tact.
When the amount of movement during alignment increases, a large load acts on the bellows sealing the introduction portion that transmits the driving force from the driving source outside the vacuum chamber to the alignment stage inside the vacuum chamber. When the bellows is broken, the vacuum in the vacuum chamber cannot be maintained, and the production is stopped, so that it is important to reduce the load acting on the bellows in order to stabilize the production. Therefore, in order to reduce the amount of deviation of the mask before alignment with the substrate carrier, it is important to improve the conveyance positioning accuracy.
Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1 to 3 are explanatory views schematically showing a tandem vacuum film forming apparatus according to the present embodiment. The following description also includes a conveying method of a conveying body in a film forming apparatus, a film forming method of forming a film of a film forming material on a conveying body by using the conveying method, and an electronic device manufacturing method of manufacturing an electronic device by using the film forming method.
Fig. 1 is a schematic view of an overall production line 1 of the vacuum film forming apparatus according to the present embodiment. The substrate carrier 3 holding the substrate 2, the mask frame 4 to which the mask 4a (see fig. 2) is fixed, the loading chamber 5 to which the substrate 2 is supplied, the loading chamber 6 to which the substrate 2 is loaded into the substrate carrier 3, the alignment chamber 200 to which the position of the substrate 2 and the mask 4a on the mask frame 4 are aligned, the alignment chamber 100 disposed upstream of the alignment chamber 200, the film forming chamber 7 to deposit the film forming material on the substrate 2 after the position alignment via the mask 4a, the separation chamber 8 to separate the film formed substrate 2 from the mask 4a, the disassembly chamber 9 to disassemble the substrate 2 from the substrate carrier 3, and the discharge chamber 10 to discharge the substrate 2. Each room of the entire production line 1 has a substrate carrier transport section 203 and a substrate carrier transport guide section 204G for transporting the substrate carrier 3 and the mask frame 4, respectively, and a mask transport section 202 and a mask transport guide section 204M (see fig. 2). The mask 4a separated from the substrate 2 in the separation chamber 8 and the substrate carrier 3 separated from the substrate 2 in the separation chamber 9 are again transferred to the pre-alignment chamber 100 and the loading chamber 6, respectively, through different paths. Then, the mask 4a and the substrate carrier 3 used in the film formation process are again delivered to a conveying mechanism having a mask conveying portion 202 and a substrate carrier conveying portion 203. This allows the substrate carrier 3 and the mask 4a to be continuously used for the film formation process repeatedly.
The alignment chamber 200 in the vacuum film forming apparatus shown in fig. 2 a includes a vacuum chamber 201, a mask conveying section 202 that conveys the mask frame 4 in the conveying direction, a substrate carrier conveying section 203 that conveys the substrate carrier 3 on which the substrate 2 is mounted in the conveying direction, a substrate carrier conveying guide section 204G that guides both sides of the substrate carrier 3 (first conveying body) to regulate the position of the substrate carrier 3 in the width direction intersecting the conveying direction when conveying the substrate carrier 3, a mask conveying guide section 204M that guides the mask or a conveying object (second conveying body) that combines the substrate and the mask to regulate the position of the conveying object in the width direction intersecting the conveying direction, and an alignment section 210 that aligns the substrate 2 and the mask 4 a. The substrate carrier conveyance guide 204G forms a first guide for restricting the position of the substrate carrier 3 (or the substrate 2) as the first conveyance body, and the mask conveyance guide 204M forms a second guide for restricting the position of the mask frame 4 (or the mask 4 a) as the second conveyance body. The substrate carrier 3 and the mask frame 4 are examples of a carrier.
The alignment section 210 includes an alignment driving section 211, and the alignment driving section 211 is composed of an alignment stage 205 that precisely moves in the xyθ direction and a substrate carrier lifting section 206 that lifts and lowers the substrate carrier 3. The substrate carrier lifting/lowering section 206 includes rods 206a, and a substrate carrier support section 207 for supporting both side sections of the substrate carrier 3 when the substrate carrier is lowered is formed at the lower ends thereof. The conveyance direction of the substrate is referred to as the X direction, the direction perpendicular to the conveyance direction (X direction) in a plane parallel to the substrate surface (the plane of the conveyance body) is referred to as the Y direction (hereinafter, also referred to as the width direction), and the rotation direction rotating around the Z direction perpendicular to the substrate surface is referred to as the θ direction.
The alignment unit 210 includes an alignment camera 208 for capturing alignment marks (not shown) of the substrate 2 and the mask 4a and detecting positional deviations of the substrate 2 and the mask 4 a. Based on the image captured by the alignment camera 208, a relative distance (positional deviation) between the alignment marks is obtained, and based on the relative distance, the relative positional relationship between the substrate and the mask is controlled, thereby performing highly accurate positional alignment.
The alignment driving unit 211 is provided outside the vacuum chamber 201, and is connected to the rods 206a and 206a by a substrate carrier support 207 disposed inside the vacuum chamber 201. In order to transmit the driving force of the alignment driving portion 211 to the inside of the vacuum chamber 201, a bellows 209 is disposed at a chamber introduction portion around the rods 206a, 206 a. The chamber introduction portion is hermetically held by a bellows 209, and the vacuum degree of the vacuum chamber 201 is maintained.
Fig. 2 (b) and 2 (c) show details of the mask conveying section 202 and the substrate carrier conveying section 203. The mask conveying section 202 is configured by a mask conveying roller 220M that supports the mask frame 4, a rotation driving section 222M that is a driving source disposed outside, and a vacuum introducing section 221M that introduces the rotation driving section 222M into the vacuum chamber. The mask frame 4 is conveyed by driving the mask conveying roller 220M to rotate by the rotation driving portion 222M.
Similarly, the substrate carrier transport section 203 is configured by a substrate carrier transport roller 220G that supports the substrate carrier 3, a rotation drive section 222G that is a drive source disposed outside, and a vacuum introduction section 221G that introduces the rotation drive section 222G into the vacuum chamber. Then, the substrate carrier 3 is conveyed by driving the substrate carrier conveyance roller 220G to rotate by the rotation driving section 222G.
In addition, the substrate carrier transport roller 220G interferes with the substrate carrier 3 when it is lowered during alignment. Therefore, as shown by an arrow in fig. 2 (c), the substrate carrier transport roller 220G can be retracted from the position at the time of transport by the roller advance/retreat driving portion 223.
The circumference of the substrate carrier transport roller 220G is sealed by a bellows 224, and the vacuum of the vacuum chamber is maintained.
Fig. 2 (b) shows a state in which the substrate carrier 3 and the mask frame 4 are transported. The substrate carrier 3 and the mask frame 4 are conveyed in the X direction perpendicular to the paper surface by the mask conveying roller 220M and the substrate carrier conveying roller 220G driven to rotate by the rotary driving units 222M and 222G, respectively.
Fig. 2 (c) shows a state in which alignment is performed. The substrate 2 is superimposed on the mask 4a on the mask frame 4 while performing an alignment operation. At this time, the substrate carrier transport roller 220G of the substrate carrier transport section 203 that supports the substrate carrier 3 on which the substrate 2 is placed is retracted rightward by the roller advance and retreat driving section 223. Here, the Y direction (width direction) and the direction separating from the substrate carrier 3 and approaching the side wall of the vacuum chamber 201 are right directions. Then, the substrate carrier 3 is supported by the substrate carrier support 207 fixed to the substrate carrier lifting/lowering unit 206. Thereby, the substrate 2 can be lowered onto the mask 4a held by the mask conveying section 202 by the substrate carrier lifting section 206.
Then, in a state where the substrate 2 is close to the mask 4a, an alignment mark (not shown) of the substrate 2 and the mask 4a is photographed by the alignment camera 208 to detect the amount of positional deviation. In order to eliminate this positional deviation, the alignment stage 205 is minutely driven in the xyθ direction, whereby the alignment of the substrate 2 and the mask 4a can be performed with high accuracy.
After the substrate 2 is superimposed on the mask 4a, only the substrate carrier 3 is lifted up by the substrate carrier lifting/lowering unit 206. When the substrate carrier 3 is raised to the position shown in fig. 2 (a), the substrate carrier transport roller 220G of the substrate carrier transport section 203 is moved from the retracted position to the transport position by the roller advance/retreat driving section 223 again, and the substrate carrier 3 is supported at the transport position.
Fig. 2 (d) shows details of the mask conveyance guide 204M and the substrate carrier conveyance guide 204G. The mask conveyance guide 204M is composed of a mask frame guide roller 230M that contacts the mask frame 4, a mask guide roller advance and retreat driving portion 231M that advances and retreats the mask frame guide roller 230M, and a mask guide roller bellows 232M. The mask frame guide rollers 230M are disposed on both sides of the mask frame 4 in the width direction intersecting the conveyance direction of the mask frame 4, and are disposed so as to be capable of contact with both sides (sides in the X direction) parallel to the conveyance direction. The mask frame guide roller 230M is a mask guide portion supported by a mask guide support portion 233M connected to the mask guide roller advance and retreat driving portion 231M. The mask guide roller advancing and retreating driving part 231 is a mask guide driving part that advances and retreats the mask guide supporting part 233M in the Y direction (width direction) to move the mask frame guide roller 230M in the Y direction (width direction). The mask guide support 233M and the mask guide roller advance and retreat driving portion 231M constitute a guide portion moving mechanism that moves the mask frame 4 in the Y direction (width direction).
The substrate carrier transport guide 204G is composed of a substrate carrier guide roller 230G that contacts the substrate carrier 3, a substrate guide roller advance and retreat driving portion 231G that advances and retreats the substrate carrier guide roller 230G, and a substrate guide roller bellows 232G. The substrate carrier guide rollers 230G are disposed on both sides of the substrate carrier 3 in the width direction intersecting the conveyance direction of the substrate carrier 3, and are disposed so as to be capable of contact with both sides (sides in the X direction) parallel to the conveyance direction. The substrate carrier guide roller 230G is a substrate guide portion supported by a substrate guide support portion 233G connected to the substrate guide roller advance and retreat driving portion 231G. The substrate guide roller advancing and retreating driving part 231G is a substrate guide driving part that advances and retreats the substrate guide supporting part 233G in the Y direction (width direction) to move the substrate carrier guide roller 230G in the Y direction (width direction). The substrate guide support portion 233G and the substrate guide roller advance and retreat driving portion 231G constitute a guide portion moving mechanism that moves the substrate carrier 3 in the Y direction (width direction).
Fig. 2 (d) shows a state in which the mask frame guide roller 230M and the substrate carrier guide roller 230G are separated by retreating from the mask frame 4 and the substrate carrier 3, respectively. Fig. 2 (e) shows a state in which the mask frame guide roller 230M and the substrate carrier guide roller 230G advance toward the mask frame 4 and the substrate carrier 3, respectively.
The mask frame guide roller 230M and the substrate carrier guide roller 230G are disposed with predetermined gaps dg and dm between the Y-direction side surface of the mask frame 4 and the Y-direction side surface of the substrate carrier 3, respectively. The Y-direction side surface is a side surface corresponding to both sides changed in the conveying direction. The mask frame guide roller 230M and the substrate carrier guide roller 230G are arranged at predetermined intervals in the conveyance direction (X direction in the drawing) of the mask frame 4 and the substrate carrier 3, respectively.
The mask frame guide roller 230M and the substrate carrier guide roller 230G are controlled to advance and retract in the Y direction (width direction) by a system control system described later based on dimension information indicating a dimensional change due to thermal expansion of the mask frame 4 and the substrate carrier 3 caused by a temperature rise. Even when the substrate carrier 3 has a dimensional change due to thermal expansion, the Y-direction position of the substrate carrier guide roller 230G is changed (controlled) so that the Y-direction (width direction) distance dg between the substrate carrier 3 and the substrate carrier guide roller 230G becomes a predetermined value (is maintained in a predetermined range). Even when the mask frame 4 has changed in size due to thermal expansion, the position of the mask frame guide roller 230M in the Y direction is changed (controlled) so that the Y-direction distance dm between the mask frame 4 and the mask frame guide roller 230M becomes a predetermined value (is maintained in a predetermined range). The predetermined values dg and dm of the gap are set so as to suppress an increase in the positional deviation between the substrate carrier 3 and the mask frame 4 in the Y direction when the gap is excessively large and the substrate carrier is conveyed. The predetermined values dg and dm of the gap are set so as to suppress the occurrence of wear and scraps caused by the contact of the mask frame guide roller 230M with the mask frame 4 or the contact of the substrate carrier guide roller 230G with the substrate carrier 3 due to the too small gap. Thereby, the Y-direction positions (width-direction positions) of the mask frame guide roller 230M and the substrate carrier guide roller 230G can be controlled so as to maintain the gap at a predetermined value (or a value within a predetermined range) as appropriate. A method of controlling the movement of the mask frame guide roller 230M and the substrate carrier guide roller 230G in the Y direction (width direction) will be described below.
As a method of acquiring dimensional information concerning dimensional changes of the substrate carrier 3 and the mask frame 4, there is a method based on the amount of thermal expansion of the substrate carrier 3 and the mask frame 4. The thermal expansion amount can be obtained by counting the number of times one transfer body is transferred to the film forming chamber (the number of times the substrate carrier 3 and the mask frame 4 are continuously used for film forming processing, also referred to as the number of windings), and based on the relationship between the number of windings and the temperature or the thermal expansion amount of the substrate carrier 3 and the mask frame 4, for example.
Specifically, identification numbers (IDs) are given to the substrate carrier 3 and the mask frame 4, and IDs given to the plurality of substrate carriers and the mask frame circulating in the production line are managed in association with information on the number of windings. The relationship between the number of windings of the substrate carrier and the mask frame and the amount of thermal expansion of the substrate carrier and the mask frame is measured in advance, and information thereof is stored in the storage means in advance as a data table or a function. The thermal expansion amounts of the substrate carrier 3 and the mask frame 4 are obtained based on the information of the number of windings, the relation between the number of windings and the temperature or the thermal expansion amount, which are associated with the IDs of the substrate carrier 3 and the mask frame 4 that enter the alignment chamber 200. The Y-directional dimensions of the substrate carrier 3 and the mask frame 4 are obtained from the amounts of thermal expansion of the substrate carrier 3 and the mask frame 4, and the Y-directional positions (movement) of the mask frame guide roller 230M and the substrate carrier guide roller 230G are controlled based on the dimensions.
The substrate carrier 3 and the mask frame 4 are repeatedly wound in a path shown in fig. 1 in a plurality of successive turns. The temperature of the substrate carrier 3 and the mask frame 4 increases due to the film formation process performed in the vacuum chamber. The temperature of the mask frame 4 and the substrate carrier 3 also decreases as the substrate is replaced every time the process ends for one turn, but the heat received in the film forming process is not completely dissipated and accumulated. In the course of repeating the mask frame 4 and the substrate carrier 3 several turns in the winding of the film forming process, the temperature of the mask frame 4 and the substrate carrier 3 approaches a substantially constant temperature T as shown in fig. 4.
The number of windings varies depending on the mask frame and the substrate carrier to be conveyed along the path. If the number of windings is different, the temperature is different, and therefore, information such as the number of windings is managed by giving an ID to the mask frame and the substrate carrier, and the current temperature is estimated from the number of windings, and the thermal expansion amount is estimated. As shown in fig. 4, the current thermal expansion amount is obtained based on the relationship between temperature and thermal expansion amount by referring to data representing the relationship between time (number of windings) and temperature, which is experimentally obtained in advance. The mask frame guide roller driving and advancing sections 231M and the substrate guide roller driving and advancing sections 231G are controlled based on the amounts of thermal expansion of the mask frame 4 and the substrate carrier 3, and the positions of the mask frame guide roller 230M and the substrate carrier guide roller 230G in the Y direction are controlled. Thereby, the gaps between the mask frame 4 and the substrate carrier 3 and the mask frame guide roller 230M and the substrate carrier guide roller 230G are appropriately maintained.
Fig. 5 is a block diagram showing control logic of the Y-direction positions of the mask frame guide roller 230M and the substrate carrier guide roller 230G according to the present embodiment. Thereby, the temperature and the thermal expansion amount of the substrate carrier 3 and the mask frame 4 are predicted based on the number of windings of the substrate carrier 3 and the mask frame 4, and the gaps dm and dg with respect to the respective side surfaces of the mask frame 4 and the substrate carrier 3 are controlled.
The number of windings (or time) of the paths shown in fig. 1 of the mask frame 4 and the substrate carrier 3 are counted by the mask counter 302M and the substrate carrier counter 302G, respectively, and managed in association with the IDs of the mask frame 4 and the substrate carrier 3. The information of the number of windings counted by the mask counter 302M and the substrate carrier counter 302G is output to the controller 300. The controller 300 is constituted by a microprocessor or the like. The thermal expansion amount data table 301 is a storage means for storing information indicating the relationship between the number of windings of the substrate carrier 3 and the mask frame 4 shown in the characteristic diagram of fig. 4 and the temperature or the thermal expansion amount, that is, a data table. The controller 300 refers to the thermal expansion amount data table 301, and obtains thermal expansion amounts, which are dimension information indicating the dimensional changes of the mask frame 4 and the substrate carrier 3, based on the number of windings of the substrate carrier 3 and the mask frame 4. The controller 300 calculates gaps dm and dg between the mask frame guide roller 230M and the mask frame 4 and gaps dm and dg between the substrate carrier guide roller 230G and the substrate carrier 3 in the thermally expanded state, respectively.
Next, the controller 300 controls the mask frame guide roller 230M and the substrate carrier guide roller 230G to move (change positions) in the Y direction so that the gap becomes an appropriate value by controlling the mask guide roller advance and retreat driving portion 231M and the substrate guide roller advance and retreat driving portion 231G. As a result, the guide rollers can always perform appropriate guiding according to the amount of thermal expansion without interfering with the conveyance by contacting the mask frame 4 and the substrate carrier 3 on the path of fig. 1, or without excessively leaving a gap to reduce the conveyance positioning accuracy. The substrate guide roller advancing and retreating driving section 231G and the mask guide roller advancing and retreating driving section 231M, which are guide section moving mechanisms, may be configured to change the position of at least one of the substrate carrier guide roller 230G, which is a first guide section, that restricts the position of the substrate carrier 3 (or the substrate 2), which is a first conveyance body, and the mask frame guide roller 230M, which is a second guide section, that restricts the position of the mask frame 4 (or the mask 4 a), which is a second conveyance body.
Further, another method of acquiring information on dimensional changes of the substrate carrier 3 and the mask frame 4 will be described with reference to fig. 3 (a). That is, the temperature of the substrate carrier 3 and the mask frame 4 in the pre-alignment chamber 100 is measured, and the thermal expansion amounts of the substrate carrier 3 and the mask frame 4 are obtained based on the temperature.
The alignment front chamber 100 in the vacuum film forming apparatus has a vacuum chamber 101, a mask conveying section 102 that conveys the mask frame 4, a substrate carrier conveying section 103 that conveys the substrate carrier 3, a mask conveying guide section 104M that guides the mask frame 4, a substrate carrier conveying guide section 104G that guides the substrate carrier 3, and a temperature measuring section 105 that measures the temperatures of the substrate carrier 3 and the mask frame 4, respectively. Since the alignment process is not performed in the pre-alignment chamber 100, the substrate carrier transport guide 104G does not need to be retracted and moved.
The temperature measuring unit 105 includes a view port 106 and a radiation thermometer. The radiation thermometer measures the intensity of heat radiation of infrared rays or visible rays radiated from a temperature measurement region (surface finishing) disposed on the side surface or upper surface of the substrate 3 or the mask frame 4 of the vacuum chamber 101 through the view port 106. However, in the case of measuring the heat radiation intensity of infrared rays, it is preferable to use an infrared ray transmitting glass (for example, germanium or fluorite) instead of quartz glass for the glass used for the view port 106. The amounts of thermal expansion of the substrate carrier 3 and the mask frame 4 are calculated from the measured temperatures, and the Y-direction positions of the mask frame guide roller 230M and the substrate carrier guide roller 230G in the alignment chamber 200 are determined based on the results.
Fig. 6 (a) shows a control block diagram of this case. The control block diagram shown in fig. 6 (a) is the same as the control block diagram of fig. 5, except that the temperature measuring unit 105 is provided instead of the mask counter 302M and the substrate carrier counter 302G in the control block diagram of fig. 5. The structure for advancing and retreating the guide roller is similar to the structure shown in fig. 2 (b) to 2 (e). The thermal expansion amount data table 301 in the control block diagram stores information indicating the relationship between the temperature of the substrate carrier 3 and the mask frame 4 and the thermal expansion amount. The controller 300 refers to the thermal expansion amount data table 301, and obtains the thermal expansion amount, which is information on the dimensional changes of the mask frame 4 and the substrate carrier 3, based on the temperatures of the substrate carrier 3 and the mask frame 4 measured by the temperature measuring unit 105.
Another method of acquiring information on dimensional changes of the substrate carrier 3 and the mask frame 4 will be described with reference to fig. 3 (b) and 3 (c). That is, the dimensions of the substrate carrier 3 and the mask frame 4 are directly measured. In the structures shown in fig. 3 (b) and 3 (c), a displacement measuring unit 110 is provided instead of the temperature measuring unit 105 of the alignment front chamber 100 in fig. 3 (a). The displacement measuring section 110 is a position measuring section that measures positions of ends in the width direction (Y-direction (width-direction) positions of both sides parallel to the conveyance direction) of the substrate carrier 3 and the mask frame 4 conveyed to the alignment chamber 200. The displacement measuring unit 110 is disposed on both side surfaces of the vacuum chamber 101 so as to be able to measure both side surfaces of the substrate carrier 3 and the mask frame 4. In the measurement with only one side, the change in value due to the Y-direction position at the time of conveyance of the substrate carrier 3 and the mask frame 4 and the change in value due to thermal expansion cannot be distinguished. Therefore, in order to measure the dimensional change in the Y direction of the substrate carrier 3 or the mask frame 4 with high accuracy, both side surfaces need to be measured. As the displacement measuring unit 110, for example, a noncontact laser displacement meter can be used.
When the displacement measuring section 110 is provided outside the vacuum chamber 101, the displacement measuring section 110 may be disposed in the vacuum chamber 101 in the atmosphere box 111 as shown in fig. 3 (c) when the measurement range is insufficient.
Fig. 6 (b) shows a control block diagram of this case. In the control block diagram shown in fig. 6 (b), the displacement measuring section 110 is provided instead of the mask counter 302M and the substrate carrier counter 302G in the control block diagram of fig. 5. Further, since the displacement measuring unit 110 directly obtains the dimensional information of the substrate carrier 3 and the mask frame 4, the data table 301 of the thermal expansion amount in the control block diagram of fig. 5 is not provided. Except for these points, the control block diagram of fig. 5 is the same. The structure for advancing and retreating the guide roller is the same as that shown in fig. 2 (b) to 2 (e).
Another method of acquiring information on dimensional changes of the substrate carrier 3 and the mask frame 4 is described with reference to fig. 3 (d). That is, the positions of the substrate carrier 3 and the mask frame 4 are acquired based on the captured image of the camera. In the configuration of fig. 3 (d), a camera 112 is disposed at an upper portion or a lower portion of the vacuum chamber 101 instead of the displacement measuring section 110 of fig. 3 (c). The camera 112 is an imaging mechanism that images the substrate carrier 3 and the mask frame 4 that are transferred to the alignment chamber 200. In the image processing unit 113, the captured image obtained by the camera 112 is subjected to image processing, whereby the positions of the ends of the substrate carrier 3 and the mask frame 4 in the width direction intersecting the conveyance direction (the positions of the two sides parallel to the conveyance direction in the Y direction) are obtained. Based on the obtained positions of the substrate carrier 3 and the mask frame 4, information of dimensional changes of the substrate carrier 3 and the mask frame 4 is obtained. The cameras 112 are disposed at positions capable of measuring both side surfaces of the substrate carrier 3 and the mask frame 4. In the example of fig. 3 (d), two cameras 112 are provided in the vicinity of the position corresponding to the position where the side of the substrate carrier 3 parallel to the transport direction passes through in the upper part of the vacuum chamber 101 at the time of transport. Further, two cameras 112 are provided in the vicinity of the position corresponding to the position where the side of the mask frame 4 parallel to the conveyance direction passes through in the conveyance, in the lower part of the vacuum chamber 101. The imaging data of each camera 112 is output to the image processing unit 113.
Fig. 6 (c) shows a control block diagram of this case. In the control block diagram of fig. 6 (c), a camera 112 and an image processing unit 113 for detecting the displacement amount by image processing are provided instead of the displacement measuring unit 110 in the control block diagram of fig. 6 (b). Otherwise, the control block diagram is the same as that of fig. 6 (b).
Claims (14)
1. A film forming apparatus, characterized in that,
the film forming apparatus includes:
a conveying mechanism that conveys the conveying body in a conveying direction;
a guide portion that restricts a position of the conveying body in a width direction intersecting the conveying direction;
a guide portion moving mechanism that moves the guide portion in the width direction;
an acquisition means for acquiring size information related to the size of the transport body;
an alignment chamber for aligning the substrate and the mask; a kind of electronic device with high-pressure air-conditioning system
A film forming chamber for forming a film of a film forming material on the substrate aligned in the alignment chamber via the mask,
the transport mechanism transports the substrate or a substrate carrier holding the substrate as a first transport body to the alignment chamber and transports the mask as a second transport body to the alignment chamber,
the guide part has a first guide part limiting the position of the first conveying body and a second guide part limiting the position of the second conveying body,
the acquisition means has temperature measurement means for measuring the temperature of the transport body,
the obtaining means obtains the size information based on the temperature of the transport body measured by the temperature measuring means and a relationship between the temperature of the transport body and a thermal expansion amount,
based on the size information acquired by the acquisition means, the guide movement means changes the position of the guide,
the guide moving mechanism changes a position of at least one of the first guide and the second guide.
2. A film forming apparatus, characterized in that,
the film forming apparatus includes:
a conveying mechanism that conveys the conveying body in a conveying direction;
a guide portion that restricts a position of the conveying body in a width direction intersecting the conveying direction;
a guide portion moving mechanism that moves the guide portion in the width direction;
an acquisition means for acquiring size information related to the size of the transport body;
an alignment chamber for aligning the substrate and the mask; a kind of electronic device with high-pressure air-conditioning system
A film forming chamber for forming a film of a film forming material on the substrate aligned in the alignment chamber via the mask,
the transport mechanism transports the substrate or a substrate carrier holding the substrate as a first transport body to the alignment chamber and transports the mask as a second transport body to the alignment chamber,
the guide part has a first guide part limiting the position of the first conveying body and a second guide part limiting the position of the second conveying body,
the acquisition means has position measurement means for measuring the position of the end portion of the transport body in the width direction,
the acquiring means acquires the size information based on the position of the end portion of the transport body measured by the position measuring means,
based on the size information acquired by the acquisition means, the guide movement means changes the position of the guide,
the guide moving mechanism changes a position of at least one of the first guide and the second guide.
3. A film forming apparatus, characterized in that,
the film forming apparatus includes:
a conveying mechanism that conveys the conveying body in a conveying direction;
a guide portion that restricts a position of the conveying body in a width direction intersecting the conveying direction;
a guide portion moving mechanism that moves the guide portion in the width direction;
an acquisition means for acquiring size information related to the size of the transport body;
an alignment chamber for aligning the substrate and the mask; a kind of electronic device with high-pressure air-conditioning system
A film forming chamber for forming a film of a film forming material on the substrate aligned in the alignment chamber via the mask,
the transport mechanism transports the substrate or a substrate carrier holding the substrate as a first transport body to the alignment chamber and transports the mask as a second transport body to the alignment chamber,
the guide part has a first guide part limiting the position of the first conveying body and a second guide part limiting the position of the second conveying body,
the acquisition mechanism includes:
a photographing mechanism that photographs the conveyance body; a kind of electronic device with high-pressure air-conditioning system
An image processing means for performing image processing on a captured image based on the imaging means to obtain a position of an end portion of the transport body in the width direction,
the acquiring means acquires the size information based on the position of the end portion of the transport body acquired by the image processing means,
based on the size information acquired by the acquisition means, the guide movement means changes the position of the guide,
the guide moving mechanism changes a position of at least one of the first guide and the second guide.
4. A film forming apparatus, characterized in that,
the film forming apparatus includes:
a conveying mechanism that conveys the conveying body in a conveying direction;
a guide portion that restricts a position of the conveying body in a width direction intersecting the conveying direction;
a guide portion moving mechanism that moves the guide portion in the width direction;
an acquisition means for acquiring size information related to the size of the transport body;
an alignment chamber for aligning the substrate and the mask; a kind of electronic device with high-pressure air-conditioning system
A film forming chamber for forming a film of a film forming material on the substrate aligned in the alignment chamber via the mask,
the transport mechanism transports the substrate or a substrate carrier holding the substrate as a first transport body to the alignment chamber and transports the mask as a second transport body to the alignment chamber,
the guide part has a first guide part limiting the position of the first conveying body and a second guide part limiting the position of the second conveying body,
the film forming apparatus includes a film forming chamber for depositing a film forming material onto the conveyor,
the obtaining means obtains the size information based on the number of times one of the transport bodies is transported to the film forming chamber by the transporting means and a relationship between the number of times and a thermal expansion amount of the transport body,
based on the size information acquired by the acquisition means, the guide movement means changes the position of the guide,
the guide moving mechanism changes a position of at least one of the first guide and the second guide.
5. A film forming apparatus, characterized in that,
the film forming apparatus includes:
a conveying mechanism that conveys the conveying body in a conveying direction;
a guide portion that restricts a position of the conveying body in a width direction intersecting the conveying direction;
a guide portion moving mechanism that moves the guide portion in the width direction;
an acquisition means for acquiring a temperature of the transport body;
an alignment chamber for aligning the substrate and the mask; a kind of electronic device with high-pressure air-conditioning system
A film forming chamber for forming a film of a film forming material on the substrate aligned in the alignment chamber via the mask,
the transport mechanism transports the substrate or a substrate carrier holding the substrate as a first transport body to the alignment chamber and transports the mask as a second transport body to the alignment chamber,
the guide part has a first guide part limiting the position of the first conveying body and a second guide part limiting the position of the second conveying body,
the guide portion moving means changes the position of the guide portion based on the temperature of the transport body acquired by the acquiring means,
the guide moving mechanism changes a position of at least one of the first guide and the second guide.
6. The film forming apparatus according to claim 5, wherein,
the guide portion moving mechanism changes the position of the guide portion based on the temperature and the relationship between the temperature of the conveyance body and the thermal expansion amount.
7. The film forming apparatus according to any one of claims 1 to 6, wherein,
the guide portion moving mechanism moves the guide portion to maintain a distance in the width direction between the conveying body and the guide portion within a prescribed range.
8. The film forming apparatus according to any one of claims 1 to 6, wherein,
the guide part is provided with guide rollers arranged at two sides of the conveying body in the width direction,
the guide portion moving mechanism includes a support portion that supports the guide roller and a driving portion that moves the support portion forward and backward in the width direction.
9. The film forming apparatus according to any one of claims 1 to 6, wherein,
the carrier is a substrate carrier for holding a substrate.
10. The film forming apparatus according to any one of claims 1 to 6, wherein,
the carrier is a mask used in a film forming process on a substrate.
11. The film forming apparatus according to any one of claims 1 to 6, wherein,
in the alignment chamber, alignment marks provided on the substrate and the mask are photographed, a relative distance between the alignment marks is obtained based on an image obtained by the photographing, and the substrate and the mask are aligned based on the relative distance.
12. The film forming apparatus according to any one of claims 1 to 6, wherein,
the alignment chamber has: a vacuum chamber; an alignment driving part disposed outside the vacuum chamber; an introduction part for transmitting the driving force of the alignment driving part to the substrate carrier in the vacuum chamber; and a bellows for maintaining the introduction portion airtight.
13. A film forming method comprising a film forming step of forming a film of a film forming material on the conveyor while conveying the conveyor by using the film forming apparatus according to any one of claims 1 to 12.
14. An electronic device manufacturing method, wherein the film forming method according to claim 13 is used to manufacture an electronic device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-002378 | 2021-01-08 | ||
| JP2021002378A JP7379396B2 (en) | 2021-01-08 | 2021-01-08 | Film forming equipment, transport method, film forming method, and electronic device manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114752888A CN114752888A (en) | 2022-07-15 |
| CN114752888B true CN114752888B (en) | 2023-11-10 |
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| CN202111642733.1A Active CN114752888B (en) | 2021-01-08 | 2021-12-30 | Film forming apparatus, conveying method, film forming method, and electronic device manufacturing method |
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| Country | Link |
|---|---|
| JP (1) | JP7379396B2 (en) |
| KR (1) | KR20220100532A (en) |
| CN (1) | CN114752888B (en) |
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| CN101631452A (en) * | 2008-07-17 | 2010-01-20 | Juki株式会社 | Substrate conveying device in component mounting device |
| JP2012235093A (en) * | 2011-04-22 | 2012-11-29 | Shibaura Mechatronics Corp | Transport device and transport method of substrate |
| KR20140021832A (en) * | 2012-08-10 | 2014-02-21 | 주식회사 원익아이피에스 | Substrate transfer module |
| WO2014097879A1 (en) * | 2012-12-18 | 2014-06-26 | キヤノントッキ株式会社 | Film formation device |
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| JP2004172321A (en) | 2002-11-19 | 2004-06-17 | Seiko Epson Corp | Work transporting table, work transporter, droplet discharger, electrooptic device, and method of manufacturing electrooptic device, and electronic equipment |
| JP4693347B2 (en) | 2003-11-05 | 2011-06-01 | 株式会社日立ハイテクノロジーズ | Exposure shutter, exposure apparatus, exposure method, and substrate manufacturing method |
| JP4549697B2 (en) | 2004-03-04 | 2010-09-22 | 株式会社アルバック | Film forming apparatus and film forming method |
| JP2011131156A (en) | 2009-12-24 | 2011-07-07 | Seiko Epson Corp | Method for correcting drawing data of drawing data correction device, drawing data correction device and liquid droplet discharge device equipped with drawing data correction device |
| JP2012140671A (en) | 2010-12-28 | 2012-07-26 | Canon Tokki Corp | Film-forming apparatus |
| KR20200049379A (en) | 2018-10-31 | 2020-05-08 | 캐논 톡키 가부시키가이샤 | Alignment apparatus, film forming apparatus, alignment method, film forming method, and manufacturing method of electronic device |
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2021
- 2021-01-08 JP JP2021002378A patent/JP7379396B2/en active Active
- 2021-12-30 CN CN202111642733.1A patent/CN114752888B/en active Active
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2022
- 2022-01-06 KR KR1020220002030A patent/KR20220100532A/en not_active Application Discontinuation
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| CN101631452A (en) * | 2008-07-17 | 2010-01-20 | Juki株式会社 | Substrate conveying device in component mounting device |
| JP2012235093A (en) * | 2011-04-22 | 2012-11-29 | Shibaura Mechatronics Corp | Transport device and transport method of substrate |
| KR20140021832A (en) * | 2012-08-10 | 2014-02-21 | 주식회사 원익아이피에스 | Substrate transfer module |
| WO2014097879A1 (en) * | 2012-12-18 | 2014-06-26 | キヤノントッキ株式会社 | Film formation device |
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| Publication number | Publication date |
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| JP7379396B2 (en) | 2023-11-14 |
| KR20220100532A (en) | 2022-07-15 |
| JP2022107430A (en) | 2022-07-21 |
| CN114752888A (en) | 2022-07-15 |
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