CN114750478B - Concentric double-impedance combined flying piece and preparation process and application thereof - Google Patents
Concentric double-impedance combined flying piece and preparation process and application thereof Download PDFInfo
- Publication number
- CN114750478B CN114750478B CN202210394625.5A CN202210394625A CN114750478B CN 114750478 B CN114750478 B CN 114750478B CN 202210394625 A CN202210394625 A CN 202210394625A CN 114750478 B CN114750478 B CN 114750478B
- Authority
- CN
- China
- Prior art keywords
- impedance
- flyer
- combined
- pad
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/043—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
Abstract
The invention discloses a concentric double-impedance combined flyer, which is formed by sequentially bonding a high-rigidity combined supporting pad, a combined liner and a flyer into a laminated structure; micron-sized bonding layers are formed among the high-rigidity combined supporting pad, the combined liner and the flying sheet; the combined gasket is composed of a low-impedance inner gasket and a high-impedance outer gasket which are concentrically arranged, the wave impedance of the low-impedance inner gasket is smaller than that of the flyer, the wave impedance of the high-impedance outer gasket is larger than that of the flyer, and the diameter of the low-impedance inner gasket is 1/4-1/3 of that of the flyer. The invention can effectively solve the problems of non-uniform bending deformation of the material and separation of the flying piece and the liner in an impact experiment, realizes simultaneous measurement of an impact loading and unloading speed profile and an impact loading and reloading speed profile in a single-shot impact experiment, and has the characteristics of low cost and high measurement precision of high-pressure strength of the material.
Description
Technical Field
The invention relates to the physical field of shock waves, in particular to a concentric double-impedance combined flyer.
Background
The high-pressure strength characteristic of the material refers to the capability of the material to resist shear deformation under the action of impact load, and is one of the basic core problems in the fields of high-pressure physics, material science and impact dynamics. The method for measuring the high-pressure strength of the material mainly comprises a double-yield-surface method (AC method for short), a transverse stress meter method, a pressure-shear method and the like, the loading pressure level of the high-pressure strength measurement of the material and the technical maturity of the measuring method are comprehensively considered, and the AC method is the most mature method for measuring the strength under the wide-area loading pressure at present.
Under single impact compression, the stress-strain state of the material is not necessarily on the yielding surface due to the hardening effect, in order to determine the position of the yielding surface, the AC method adopts a method of reloading and unloading the initial impact loading state (hereinafter referred to as a pre-impact state), so that the material enters the upper yielding surface and the lower yielding surface respectively after quasi-elastic reloading or quasi-elastic unloading from the pre-impact state, and the yield strength is obtained by utilizing the relationship between the yield strength Y and the axial stress of the upper yielding surface and the axial stress of the lower yielding surface:
wherein
In order to achieve the upper yield surface axial stress,
the lower flexor axial stress.
The key of the complete AC method for measuring the high-pressure strength is to simultaneously obtain impact loading-unloading and impact loading-reloading speed profiles under the same pre-impact pressure, so that since the method is proposed in the seventies of the last century, the material high-pressure strength measurement based on the AC method always adopts two independent dynamic experiments to respectively measure the impact loading-unloading and impact loading-reloading speed profiles, namely, one dynamic experiment independently measures the impact loading-unloading, and then another dynamic experiment independently measures the impact loading-reloading speed profile, and although the method can also realize the measurement of the impact loading-unloading and impact loading-reloading speed profiles, more problems exist: the first problem is that with the technology, one data point needs two independent dynamic experiments for measurement, which not only increases the measurement cost, but also prolongs the measurement time; the second problem is that the two dynamic experiments are completely independent, so that the pre-impact state pressure of the two dynamic experiments is difficult to ensure complete consistency, and the conditions of the two dynamic experiments cannot reach the ideal state required by the experiments, thereby reducing the precision of measuring the high-pressure strength of the material.
Disclosure of Invention
The invention aims to provide a concentric double-impedance combined flying sheet which can effectively solve the problems of non-uniform bending deformation of materials and separation of the flying sheet and a liner in an impact experiment, and can realize simultaneous measurement of an impact loading and unloading speed profile and an impact loading and reloading speed profile under a single-shot impact experiment by using a double-impedance structure of a low-impedance inner liner and a high-impedance outer liner, and has the characteristics of low cost and high material high-pressure strength measurement accuracy.
The purpose of the invention is mainly realized by the following technical scheme: a concentric double-impedance combined flying piece is characterized in that a high-rigidity combined supporting pad, a combined liner and a flying piece are sequentially bonded to form a laminated structure;
wherein, the first and the second end of the pipe are connected with each other,
micron-sized bonding layers are formed among the high-rigidity combined supporting pad, the combined liner and the flying sheet;
the combined gasket is composed of a low-impedance inner gasket and a high-impedance outer gasket which are concentrically arranged, the wave impedance of the low-impedance inner gasket is smaller than that of the flyer, the wave impedance of the high-impedance outer gasket is larger than that of the flyer, and the diameter of the low-impedance inner gasket is 1/4-1/3 of that of the flyer.
Based on the technical scheme, the wave impedance of the low-impedance inner liner is less than or equal to 1/5 of the wave impedance of the flyer, and the wave impedance of the high-impedance outer liner is 1.1-1.5 times of the wave impedance of the flyer.
Based on the technical scheme, the low-impedance inner liner is made of polycarbonate, and the high-impedance outer liner is made of copper.
Based on above technical scheme, high rigidity combination supporting pad comprises first high rigidity supporting pad and the high rigidity supporting pad of second that bonds in order, the high rigidity supporting pad of second bonds with the combination liner, wherein, the wave impedance of first high rigidity supporting pad and the high rigidity supporting pad of second reduces in proper order.
Based on above technical scheme, the material of first high rigidity supporting pad is 45 # steel, the material of second high rigidity supporting pad is TC4 titanium alloy.
Based on the technical scheme, the thicknesses of the first high-rigidity supporting pad, the second high-rigidity supporting pad, the low-impedance inner liner and the high-impedance outer liner are all 2-3 mm.
Based on the technical scheme, the thickness of the micron-sized bonding layer is less than or equal to 5 microns.
Compared with the prior art, the invention has the following beneficial effects: the concentric double-impedance combined flyer of the invention utilizes the concentrically arranged low-impedance inner liner and high-impedance outer liner to form a combined liner structure, and limits the wave impedance and size relation of the low-impedance inner liner, the high-impedance outer liner and the flyer under the structure, thereby realizing the impact loading and unloading step in the impact experiment by utilizing the low-impedance inner liner in the central area, and realizing the impact loading and reloading step in the impact experiment by utilizing the high-impedance outer liner at the outer side, thereby simultaneously measuring the speed profile of the impact loading and unloading step and the impact loading and reloading speed profile by utilizing the combined flyer under the single-shot impact experiment, saving the cost and time of the impact experiment, and effectively solving the technical problem that the consistency of the pre-impact state pressure in the two-shot impact experiment is difficult to ensure by the single-shot experiment, in the concentric double-impedance combined flying piece, the problem that the non-uniform bending deformation of the flying piece is easy to occur due to the fact that the wave impedance of a low-impedance inner liner and a high-impedance outer liner is not uniform is considered, a high-rigidity combined supporting pad is formed by designing a first high-rigidity supporting pad and a second high-rigidity supporting pad which have high rigidity and high hardness and gradually increase the wave impedance, the overall deformation resistance of the concentric double-impedance combined flying piece is improved by utilizing the relation between the high rigidity and the wave impedance of the high-rigidity combined supporting pad, the problems of bending deformation and separation of the combined liner and the flying piece in the concentric double-impedance combined flying piece are further solved, micron-sized bonding layers (the thickness is less than or equal to 5 mu m) are formed among the first high-rigidity supporting pad, the second high-rigidity supporting pad, the low-impedance inner liner and the high-impedance outer liner, interfaces of the bonding layers can bear high-elastic-speed emission of kilometers per second without being separated, and the influence of the bonding layers on the wave system function can be ignored, the stability and the reliability of the concentric double-impedance combined flying piece are further ensured.
The invention also discloses a preparation process of the concentric double-impedance combined flyer based on the concentric double-impedance combined flyer, which comprises the following steps:
the method comprises the following steps of S1, sequentially bonding a first high-rigidity supporting pad, a second high-rigidity supporting pad, a low-impedance inner pad and a high-impedance outer pad, wherein low-viscosity epoxy glue is adopted for bonding, and is compressed after bonding for primary curing to form an assembly, the exposed side surface of the first high-rigidity supporting pad is taken as a reference surface during primary curing, and the primary curing time is more than or equal to 48h;
s2, taking the exposed side surface of the first high-rigidity supporting pad as a reference surface, taking the exposed side surfaces of the low-impedance inner liner and the high-impedance outer liner as grinding surfaces, and grinding the grinding surfaces on one side to enable the grinding surfaces to be coplanar, wherein the planeness of the grinding surfaces is less than or equal to 5 microns after grinding;
and S3, sequentially bonding the ground assembly and the flying sheet, wherein the bonding also adopts low-viscosity epoxy glue, and the assembly bonded with the flying sheet is pressed for secondary curing to form the concentric dual-impedance combined flying sheet by taking the exposed side surface of the first high-rigidity supporting pad as a reference surface, and the secondary curing time is more than or equal to 24 hours by taking the exposed side surface of the first high-rigidity supporting pad as the reference surface.
Based on the above preparation process, in step S1, two sides of the first high-rigidity supporting pad, the second high-rigidity supporting pad, the low-impedance inner pad and the high-impedance outer pad all satisfy: the flatness is less than or equal to 5 μm, and the roughness is less than or equal to 0.4 μm.
The preparation process of the concentric double-impedance combined flyer can effectively eliminate the thickness differential between the low-impedance inner liner and the high-impedance outer liner in the combined liner, so that a uniform and controllable contact surface is formed between the side surface of the combined liner and the flyer, the structural nonuniformity of the combined flyer is reduced, meanwhile, the influence of the wave system action on the combined flyer can be reduced while the effective and stable connection of each layer is realized by uniformly distributed micron-sized adhesive layers, the interface of each adhesive layer can bear high-elastic-speed emission of kilometers per second without separation, and the prepared combined flyer has good non-uniform bending deformation resistance and liner flyer separation resistance, and can ensure that the combined flyer is simultaneously used for high-precision measurement of an impact loading and unloading speed profile and an impact loading and reloading speed profile of materials.
The invention finally discloses an application technology of the concentric double-impedance combined flyer, which is specifically a material high-pressure strength measurement technology based on a single-shot impact experiment, wherein the material high-pressure strength measurement technology is used for simultaneously measuring an impact unloading speed profile and an impact reloading speed profile of a material in the single-shot impact experiment; the flyer in the single-shot impact experiment is prepared by the concentric double-impedance combined flyer or the preparation process.
According to the material high-pressure strength measurement technology based on the single-shot impact experiment, the concentric double-impedance combined flyer or the concentric double-impedance combined flyer prepared by the preparation process is adopted, so that the structural characteristics of the concentric double-impedance combined flyer are based, the liner and the flyer are prevented from being greatly deformed under the condition of high overload, the problems of non-uniform deformation of the liner and separation of the liner and the flyer are reduced, the influence of the bonding layer on the propagation of a follow-up added carrier is reduced to the maximum extent through the micron-sized bonding layer, the interface of each bonding layer can bear high-elastic-speed emission of kilometers per second without separation, and compared with a traditional double-yield-surface strength measurement method, the material high-pressure strength measurement technology based on the single-shot impact experiment solves the problem that the consistency of pre-impact pressures of the two-shot experiments is difficult to guarantee, the material high-pressure strength measurement precision is improved, compared with the traditional measurement method, the material high-pressure strength measurement technology based on the single-shot impact experiment can simultaneously complete the effective and accurate measurement of the impact loading speed profile, the effective measurement of the single-shot impact experiment quantity is reduced by at least half of the experimental quantity, the effective measurement method, and the high measurement cost is reduced by half of the experimental quantity compared with the traditional measurement method, and the high-cost of the high-intensity measurement method.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic structural diagram of a concentric dual impedance combination flyer in some embodiments of the present invention;
FIG. 2 is a flow chart of a process for fabricating a concentric dual impedance combination flyer in some embodiments of the invention;
FIG. 3 is a schematic illustration of the effect of step 21 of a process for fabricating a concentric dual impedance composite flyer according to some embodiments of the present invention;
FIG. 4 is a schematic illustration of the effect of step 22 in the process for manufacturing a concentric dual impedance combination flyer in some embodiments of the present invention;
FIG. 5 is a flow chart of a process for preparing an epoxy glue having low tack in accordance with some embodiments of the present invention;
the names corresponding to the reference numbers in the drawings are as follows:
10. a concentric dual impedance combination flyer;
11. a high-rigidity combined supporting pad; 111. a first high stiffness support pad; 112. a second high stiffness support pad;
12. a combination liner; 121. a low impedance inner liner; 122. a high impedance outer liner;
13. flying sheets;
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
As shown in fig. 1, a first embodiment of the present invention provides a concentric dual-impedance combined flying sheet 10, which is composed of a high-rigidity combined supporting pad 11, a combined gasket 12 and a flying sheet 13, which are sequentially laminated and bonded, wherein micron-scale bonding layers are formed among the high-rigidity combined supporting pad 11, the combined gasket 12 and the flying sheet 13; the combined gasket 12 is composed of a low-impedance inner gasket 121 and a high-impedance outer gasket 122 which are concentrically arranged, the wave impedance of the low-impedance inner gasket 121 is smaller than that of the flyer 13, the wave impedance of the high-impedance outer gasket 122 is larger than that of the flyer 13, and the diameter of the low-impedance inner gasket 121 is 1/4-1/3 of the diameter of the flyer 13.
In the process of measuring the high-pressure strength of a material, the most critical technical point of the AC measurement method is how to simultaneously obtain an impact loading and unloading speed profile and an impact loading and reloading speed profile under the same pre-impact pressure, in the prior art, due to various limitations of a flyer structure, a material, experimental conditions and the like, the prior AC measurement method always adopts two independent dynamic experiments in the measurement of the high-pressure strength of the material to respectively measure the impact loading and unloading speed profile and the impact loading and reloading speed profile, that is, the two experiments are independently performed, one experiment independently measures the impact loading and unloading, the other experiment independently measures the impact loading and reloading speed profile, so that the two dynamic experiments respectively and independently obtain the impact loading and unloading speed profile and the impact loading and reloading speed profile, although the method can also realize the measurement of the impact loading and unloading and the impact loading and reloading speed profile, the most obvious disadvantages exist, wherein: the method has the advantages that firstly, by utilizing the technology, one data point needs two independent dynamic experiments for measurement, so that the measurement cost is increased, and the measurement time is prolonged; and the two dynamic experiments are completely independent, so that the pre-impact state pressure of the two experiments is difficult to ensure complete consistency, the conditions of the two experiments cannot reach the ideal state required by the experiments, and the precision of measuring the high-pressure strength of the material is reduced.
The concentric dual-impedance combined flying piece 10 of the embodiment comprehensively considers the disadvantages of the prior art, the low-impedance inner pad 121 and the high-impedance outer pad 122 which are concentrically arranged are used to form the combined pad 12, the wave impedance of the low-impedance inner pad 121 is smaller than that of the flying piece 13, the wave impedance of the high-impedance outer pad 122 is larger than that of the flying piece 13, and on the premise of meeting the requirements of effective test time and one-dimensional strain, the diameter of the low-impedance inner pad 121 is limited to be 1/4-1/3 of that of the flying piece 13, through the combined pad structure with low inner impedance and high outer impedance, the design is carried out by combining the size of the flying piece 13, so that the low-impedance inner pad 121 in the central area can be used to realize the impact loading and unloading step in the impact experiment, and simultaneously through the high-impedance outer pad 122 on the outer side to realize the impact loading and reloading step in the impact experiment, furthermore, the concentric dual-impedance combined flying piece 10 can be used for simultaneously measuring the speed profile of the impact loading and unloading step and the impact loading and reloading speed profile under the single-shot impact experiment, the cost and the time of the impact experiment are saved, the technical difficulty that the consistency of the pre-impact state pressure in the two-shot impact experiment is difficult to ensure can be effectively solved through the single-shot experiment, on the basis, the concentric dual-impedance combined flying piece 10 considers the problem that the non-uniform bending deformation of the flying piece 13 is easy to cause due to the inconsistent wave impedance of the low-impedance inner liner 121 and the high-impedance outer liner 122, through designing the high-rigidity combined supporting pad 11, the integral deformation resistance of the concentric dual-impedance combined flying piece 10 is increased by utilizing the relationship among the high rigidity, the high rigidity and the wave impedance of the high-rigidity combined supporting pad 11, the bending deformation and the separation problems of the combined liner 12 and the flying piece 13 in the concentric dual-impedance combined flying piece 10 are further solved, micron-sized adhesive layers with the thickness of less than or equal to 5 micrometers are formed among the high-rigidity combined supporting pad 11, the low-impedance inner pad 121 and the high-impedance outer pad 122, interfaces of the adhesive layers can bear high-elastic-speed emission of kilometers per second without separation, influence of the adhesive layers on wave system action can be ignored, and stability and reliability of the concentric dual-impedance combined flyer 10 are further guaranteed.
It should be noted that the micron-sized adhesive layer is mainly used for reliably and stably connecting the high-rigidity combined supporting pad 11, the combined pad 12 and the flying sheet 13, so that each layer structure of the concentric dual-impedance combined flying sheet 10 can bear high-elastic-speed emission of kilometers per second without separation by using the micron-sized adhesive layer, and the influence of the micron-sized adhesive layer on the wave system effect can be ignored due to micron-sized, so that the experimental measurement result and the accuracy cannot be influenced. Specifically, in practical application, the thickness of the micron-sized adhesive layer is less than or equal to 5 μm.
With continued reference to fig. 1, the high stiffness composite support pad 11 is primarily used to provide sufficient stiffness support for the composite pad 12 and flyer 13. The rigidity refers to the capability of resisting elastic deformation of the material under the action of load, the higher the rigidity is, the more the material is not easy to deform, the high-rigidity supporting pad 11 is used as a supporting structure, and the deformation amount of the pad 12 and the flying sheets 13 can be reduced by utilizing the characteristics of high rigidity and difficult deformation, so that the connection stability of the pad 12 and the flying sheets is ensured.
In the process of high-speed movement of the flyer composed of the combination liner 12 and the flyer 13, due to a high overload condition and inconsistency of wave impedances of materials of the low-impedance inner liner 121 and the high-impedance outer liner 122, the flyer 13 is easily subjected to non-uniform bending deformation, so that the combination liner 12 is separated from the flyer 13, effective impact loading and reloading cannot be realized, and the experiment is disabled.
Based on this, in order to solve the problem of separation of the composite pad 12 from the flyer 13, in the present embodiment, the high-rigidity composite support pad 11 is composed of the first high-rigidity support pad 111 and the second high-rigidity support pad 112 which are sequentially bonded, and the second high-rigidity support pad 112 is bonded to the composite pad 12, wherein the wave impedances of the first high-rigidity support pad 111 and the second high-rigidity support pad 112 are sequentially reduced. Therefore, through a combined design, the first high-rigidity supporting pad 111 and the second high-rigidity supporting pad 112 which accord with a wave impedance relation are utilized to form the high-rigidity combined supporting pad 11, so that the deformation resistance of the combined flyer is increased, and the bending and separation problems of a liner layer in the combined flyer are effectively avoided.
In specific application, because the wave impedance of the first high-rigidity support pad 111 is greater than the wave impedance of the second high-rigidity support pad 112, when materials are selected, the first high-rigidity support pad 111 may be made of 45 # steel, and the second high-rigidity support pad 112 may be made of TC4 titanium alloy, so that the decreasing relation of the wave impedances of the two materials is satisfied on the premise of high rigidity and high hardness. Further, the thickness of the first high-rigidity support pad 111 and the second high-rigidity support pad 112 is between 2mm and 3mm, so as to meet the design requirements and experimental requirements. Specifically, the thicknesses of the first high-rigidity support pad 111 and the second high-rigidity support pad 112 are 2.5 mm.
It should be noted that after the first high-rigidity support pad 111 and the second high-rigidity support pad 112 are bonded together, the formed bonding layer is also a micron-scale bonding layer.
With continued reference to fig. 1, the composite liner 12 is primarily used in conjunction with the flyer 13 to simultaneously perform the shock loading unloading step and the shock loading reload step. On the premise of meeting the physical requirements of unloading and reloading amplitudes, the combined gasket 12 is formed by the low-impedance inner gasket 121 and the high-impedance outer gasket 122, so that the wave impedances of the low-impedance inner gasket 121, the high-impedance outer gasket 122 and the flying sheet 13 meet a certain relation, an impact loading and unloading step can be realized through the low-impedance inner gasket 121, an impact loading and reloading step can be realized through the high-impedance outer gasket 122, and the diameter of the low-impedance inner gasket 121 is 1/4-1/3 of the diameter of the flying sheet on the premise of meeting the requirements of effective test time and one-dimensional strain.
In a specific application, the wave impedance of the low-impedance inner pad 121 is equal to or less than 1/5 of the wave impedance of the flying piece 13 with the wave impedance of the flying piece 13 as a reference value, and the wave impedance of the high-impedance outer pad 122 is 1.1 to 1.5 times of the wave impedance of the flying piece 13. Specifically, taking the metallic Sn strength measurement experiment as an example, the low-impedance inner pad 121 may be made of polycarbonate, and the high-impedance outer pad 122 may be made of copper Cu. Further, the thickness of the low impedance inner pad 121 and the high impedance outer pad 122 is also between 2mm and 3mm. Specifically, the thicknesses of the low-impedance inner liner 121 and the high-impedance outer liner 122 are 2.5 mm.
As shown in fig. 2 to 4, based on the above concentric dual-impedance combined flyer 10, a second embodiment of the present invention provides a process 20 for preparing a concentric dual-impedance combined flyer, where the process 20 includes:
and 21, sequentially bonding the first high-rigidity supporting pad 111, the second high-rigidity supporting pad 112, the low-impedance inner pad 121 and the high-impedance outer pad 122, wherein low-viscosity epoxy glue is used for bonding, the bonding is performed by pressing after bonding, and primary curing is performed to form an assembly, wherein the exposed side surface of the first high-rigidity supporting pad 111 is used as a reference surface during primary curing, and the primary curing time is more than or equal to 48 hours.
In this step 21, referring to fig. 3, the exposed side surface of the first high-rigidity support pad 111 refers to a surface a in fig. 3, in order to ensure the preparation accuracy during the bonding and curing, a device or an instrument with a high-flatness working surface may be selected as a support, and the surface a is used as a reference surface to contact with the high-flatness working surface, so that the flatness of each layer during the bonding may be ensured, and during the pressing, the pressing force is limited to the static compression strength of the material not exceeding that of the first high-rigidity support pad 111, the second high-rigidity support pad 112, the low-impedance inner pad 121, or the high-impedance outer pad 122, and during the pressing, the pressing may be performed in a manner of vertical pressing by a weight, that is, the bonded assembly is horizontally placed with the reference surface, and then an object whose gravity does not exceed that of the static compression strength of the material is placed on the top side surface of the high-impedance outer pad 122, so that the curing process may be performed.
Simultaneously, in order to ensure the structural homogeneity of concentric two impedance combination flyer 10, two sides of first high rigidity supporting pad, second high rigidity supporting pad, low impedance inner liner and high impedance outer liner all satisfy: the flatness is less than or equal to 5 μm, and the roughness is less than or equal to 0.4 μm.
In step 22, referring to fig. 4, the grinding surface is the surface B in fig. 4, after the low-impedance inner pad 121 and the high-impedance outer pad 122 are bonded, the surface B is ground by a lapping process, and the same surface of the two pads can form a coplanar surface after grinding, so as to eliminate the small difference in thickness between the inner low-impedance pad and the outer annular high-impedance pad caused by the processing precision.
And 23, sequentially bonding the ground assembly and the flyer 13, wherein the bonding also adopts low-viscosity epoxy glue, and the assembly bonded with the flyer 13 is compressed for secondary curing to form the concentric dual-impedance combined flyer 10 by taking the exposed side surface (A surface) of the first high-rigidity support pad 111 as a reference surface, and the secondary curing time is more than or equal to 24 hours by taking the exposed side surface (A surface) of the first high-rigidity support pad 111 as the reference surface.
In step 23, the bonding and curing process and conditions can be performed with reference to step 21.
It should be noted that, during the bonding, it is necessary to ensure the uniformity of the bonding layer and also ensure the bonding thickness, so that, taking step 21 as an example, this embodiment further provides a bonding method capable of conveniently forming a uniform micron-sized bonding layer, where the bonding method specifically includes:
the first high-rigidity supporting pad 111, the second high-rigidity supporting pad 112, the low-impedance inner pad 121 and the high-impedance outer pad 122 are sequentially bonded according to a laminated structure, when each layer of structure is bonded, bonding glue is dripped to the central area of the next layer by a glue injection container, after the bonding glue is dripped, the previous layer is put in, and the previous layer is pressed to enable the previous layer to rotate 360 degrees in a circumferential direction for one to two times, so that bonding is completed.
Similarly, in addition to the above bonding method, the flying chip 13 can be bonded by the same bonding method in step 23.
In specific application, the glue injection container can adopt a conventional medical injector. Specifically, when the overall diameter of the concentric dual-impedance combined flying piece 10 is about 56mm, a standard medical 10ml injector can be adopted, 2-3 drops of adhesive glue are dropped between each layer of structure, and the total amount of the adhesive glue is 0.02ml, so that the adhesive injection amount is ensured while the micron-sized adhesive requirement is met.
As shown in fig. 5, in a specific application, in order to ensure the bonding effect and the requirement of thickness and uniformity of the bonding layer, the epoxy glue with low viscosity can be prepared by the following steps:
q1, selecting bisphenol A epoxy glue as an adhesive and a normal-temperature ammonia curing agent as a curing agent, and mixing the adhesive and the curing agent according to a ratio of 2;
in step Q1, the bisphenol a type epoxy adhesive has a high adhesive strength, and can satisfy the adhesive demand, and the normal temperature ammonia curing agent has a low heat release in the curing process, and can avoid affecting the physical properties of the first high-rigidity support pad 111, the second high-rigidity support pad 112, the low-impedance inner pad 121, the high-impedance outer pad 122, and the flyer 13.
And Q2, stirring the mixed solution by adopting a stirrer, wherein the stirring speed is 500 revolutions per minute, the stirring time is 30 minutes, and obtaining the low-viscosity epoxy adhesive after the stirring is finished.
In the step Q2, the stirrer can be selected to be an electric stirrer for stirring, during stirring, a stirring head of the electric stirrer is inserted into a position 2/3 of the height of the liquid level of the mixture, the mixed liquid can be stirred well and sufficiently, after stirring is completed, whether the mixed liquid has good fluidity or not can be observed, whether bubbles exist or not can be observed visually, and when the glue liquid has good fluidity and no bubbles are observed visually, the stirring requirement can be met, so that the required low-viscosity epoxy glue is obtained.
To sum up, the preparation process of the concentric double-impedance combined flyer can effectively eliminate the thickness slight difference between the low-impedance inner liner 121 and the high-impedance outer liner 122 in the combined liner 12, so that a uniform and controllable contact surface is formed between the side surface of the combined liner 12 and the flyer 13, the structural nonuniformity of the combined flyer is reduced, meanwhile, the influence of the wave system action on the combined flyer can be reduced while the uniformly distributed micron-sized bonding layers are effectively and stably connected, the interface of each bonding layer can bear high-elastic-speed emission of kilometers per second without separation, and the prepared combined flyer has good non-uniform bending deformation resistance and liner flyer separation resistance, and can ensure that the combined flyer is simultaneously used for high-precision measurement of an impact loading unloading speed profile and an impact loading reloading speed profile of materials.
Finally, the third embodiment of the present invention provides an application of the concentric dual-impedance combined flyer 10, which is specifically a material high-pressure strength measurement technology 30 based on a single-shot impact test, and the material high-pressure strength measurement technology is used for simultaneously measuring an impact unloading speed profile and an impact reloading speed profile of a material in the single-shot impact test; the flyer in the single-shot impact test is prepared by the concentric dual-impedance combined flyer 10 or the concentric dual-impedance combined flyer preparation process 20.
Based on this, the material high pressure strength measurement technology 30 based on the single-shot impact experiment adopts the concentric double-impedance combined flyer 10 or the concentric double-impedance combined flyer prepared by the preparation process, so that based on the structural characteristics of the concentric double-impedance combined flyer 10, the liner and the flyer are prevented from generating large deformation under the condition of high overload, the problems of non-uniform deformation of the liner and separation of the liner and the flyer are reduced, the influence of the adhesive layer on the transmission of the follow-up and added carrier wave is reduced to the maximum extent through the micron-sized adhesive layer, the interface of each adhesive layer can bear high-elastic-speed emission of kilometers per second without being disengaged, and thus compared with the traditional double-yield-surface strength measurement method, the material high pressure strength measurement technology 30 based on the single-shot impact experiment solves the problem that the consistency of pre-impact pressure of the two-shot experiments is difficult to guarantee, the measurement precision of the material high pressure strength is improved, and compared with the traditional measurement method, the material high pressure strength measurement technology 30 based on the single-shot impact experiment can simultaneously complete the impact loading speed and the unloading experiments, thereby reducing the effective measurement cost of the material loading and the effective measurement technology by half of the high-shot-load unloading experiments.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A concentric double-impedance combined flyer is characterized in that a high-rigidity combined supporting pad, a combined liner and a flyer are sequentially bonded to form a laminated structure;
wherein the content of the first and second substances,
micron-sized bonding layers are formed among the high-rigidity combined supporting pad, the combined gasket and the flying sheet;
the combined liner is composed of a low-impedance inner liner and a high-impedance outer liner which are concentrically arranged, the wave impedance of the low-impedance inner liner is smaller than that of a flyer, the wave impedance of the high-impedance outer liner is larger than that of the flyer, and the diameter of the low-impedance inner liner is 1/4 to 1/3 of that of the flyer.
2. The concentric dual-impedance combined flying piece as claimed in claim 1, wherein the wave impedance of the low-impedance inner lining is less than or equal to 1/5 of the wave impedance of the flying piece, and the wave impedance of the high-impedance outer lining is 1.1 to 1.5 times of the wave impedance of the flying piece.
3. The concentric dual impedance combination flyer of claim 1, wherein the low impedance inner liner is polycarbonate and the high impedance outer liner is copper.
4. The concentric dual impedance combination flyer according to any one of claims 1 to 3, wherein the high stiffness combination support pad consists of a first high stiffness support pad and a second high stiffness support pad bonded in sequence, the second high stiffness support pad being bonded to a combination liner, wherein the wave impedances of the first and second high stiffness support pads are in sequence.
5. The concentric dual-impedance combination flyer of claim 4, wherein the first high-stiffness support pad is 45 gauge steel and the second high-stiffness support pad is TC4 titanium alloy.
6. The concentric dual-impedance combined flyer according to claim 5, wherein the first high-stiffness support pad, the second high-stiffness support pad, the low-impedance inner lining and the high-impedance outer lining are 2mm to 3mm thick.
7. The concentric dual impedance combination flyer of claim 1, wherein the micron-scale bond layer has a thickness of 5 mm or less.
8. A process for preparing a concentric dual impedance composite flyer as claimed in any one of claims 1 to 7, comprising the steps of:
the method comprises the following steps of S1, sequentially bonding a first high-rigidity supporting pad, a second high-rigidity supporting pad, a low-impedance inner pad and a high-impedance outer pad, wherein low-viscosity epoxy glue is adopted for bonding, and is compressed after bonding for primary curing to form an assembly, the exposed side surface of the first high-rigidity supporting pad is taken as a reference surface during primary curing, and the primary curing time is more than or equal to 48h;
s2, taking the exposed side face of the first high-rigidity supporting pad as a reference face, taking the exposed side faces of the low-impedance inner liner and the high-impedance outer liner as grinding faces, and grinding the grinding faces on a single face to enable the grinding faces to be coplanar, wherein the planeness of the grinding faces is less than or equal to 5 mm after grinding;
and S3, sequentially bonding the ground assembly and the flying sheet, wherein the bonding also adopts low-viscosity epoxy glue, and the assembly bonded with the flying sheet is pressed for secondary curing to form the concentric dual-impedance combined flying sheet by taking the exposed side surface of the first high-rigidity supporting pad as a reference surface, and the secondary curing time is more than or equal to 24 hours by taking the exposed side surface of the first high-rigidity supporting pad as the reference surface.
9. The manufacturing process according to claim 8, wherein in step S1, both side surfaces of the first high-rigidity support pad, the second high-rigidity support pad, the low-impedance inner pad, and the high-impedance outer pad satisfy: the flatness is less than or equal to 5 mm, and the roughness is less than or equal to 0.4 mm.
10. A material high-pressure strength measurement technology based on single-shot impact experiment is characterized in that the material high-pressure strength measurement technology is used for simultaneously measuring an impact unloading speed profile and an impact reloading speed profile of a material in the single-shot impact experiment;
wherein, the flyer in the single impact test is prepared by the concentric double-impedance combined flyer of any one of claims 1 to 7 or the preparation process of any one of claims 8 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210394625.5A CN114750478B (en) | 2022-04-14 | 2022-04-14 | Concentric double-impedance combined flying piece and preparation process and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210394625.5A CN114750478B (en) | 2022-04-14 | 2022-04-14 | Concentric double-impedance combined flying piece and preparation process and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114750478A CN114750478A (en) | 2022-07-15 |
| CN114750478B true CN114750478B (en) | 2023-03-14 |
Family
ID=82331419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210394625.5A Active CN114750478B (en) | 2022-04-14 | 2022-04-14 | Concentric double-impedance combined flying piece and preparation process and application thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114750478B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE67946T1 (en) * | 1987-12-16 | 1991-10-15 | Ici Plc | METHOD OF MAKING AN EXPLOSION-BONDED MULTI-LAMINATE COMPOSITE METAL PANEL. |
| US5826160A (en) * | 1995-08-14 | 1998-10-20 | The United States Of America As Represented By The Secretary Of The Army | Hot explosive consolidation of refractory metal and alloys |
| CN100449029C (en) * | 2006-09-15 | 2009-01-07 | 济南大学 | Ti/Al2O3 composite material for wave impedance gradient flying plate and manufacture thereof |
| US20100028190A1 (en) * | 2008-07-31 | 2010-02-04 | Gm Global Technology Operations, Inc. | Method of making powder metal parts using shock loading |
| JP5527696B2 (en) * | 2010-09-27 | 2014-06-18 | 地方独立行政法人大阪府立産業技術総合研究所 | Impact strength evaluation apparatus, method and program |
| US9974155B2 (en) * | 2013-08-05 | 2018-05-15 | National Technology & Engineering Solutions Of Sandia, Llc | Variable-pulse-shape pulsed-power accelerator |
-
2022
- 2022-04-14 CN CN202210394625.5A patent/CN114750478B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN114750478A (en) | 2022-07-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI553088B (en) | A light reflective anisotropic conductive adhesive and a light emitting device | |
| US10429257B2 (en) | High-damping rubber isolation bearing, intelligent bearing and bearing monitoring system | |
| JPWO2009050881A1 (en) | Ultrasonic probe | |
| CN101341432B (en) | Optical fiber core and process for producing the same | |
| SUZUKI | Adhesive tensile strengths of scarf and butt joints of steel plates (relation between adhesive layer thicknesses and adhesive strengths of joints): Solid-mechanics, strength of materials | |
| US8822036B1 (en) | Sintered silver joints via controlled topography of electronic packaging subcomponents | |
| CN114750478B (en) | Concentric double-impedance combined flying piece and preparation process and application thereof | |
| WO2019160004A1 (en) | Heat-conductive sheet | |
| CN201355343Y (en) | Tensile specimen for testing bonding strength of coating | |
| CN103273417A (en) | Diamond resin grinding plate and manufacturing method thereof | |
| CN102822956A (en) | Electrostatic chuck | |
| JP2001283637A (en) | Anisotropic conductive bonding material and its connecting method | |
| CN114474896B (en) | Combined flying tablet and preparation method and application thereof | |
| Lin et al. | Effects of hygrothermal aging on anisotropic conductive adhesive joints: experiments and theoretical analysis | |
| US7868435B2 (en) | Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same | |
| CN113376032A (en) | Double-glue-layer shear test die and operation method thereof | |
| CN104074852B (en) | A kind of titanium self-plugging rivet rivet sleeve and preparation method thereof | |
| CN102581779A (en) | Cubic boron nitride grinding wheel for carrying out double-sided grinding processing on oil pump and oil nozzle plunger part and manufacturing method thereof | |
| CN107118706A (en) | Anisotropic conductive film and the display device by its connection | |
| CN219709398U (en) | High-strength AB glue | |
| CN114158213A (en) | Adhesive, bonding method and electronic product | |
| CN210579497U (en) | Combined backing board | |
| CN117915750A (en) | Method for improving electrical insulation performance of piezoelectric wafer assembly in silicone oil at 240 ℃ and above | |
| CN219996764U (en) | Sample structure for testing shear strength of bonding resin steel wire | |
| CN112525063B (en) | Paster pressurizing device and method for sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |