CN114744136A - Flexible display panel and manufacturing method thereof - Google Patents
Flexible display panel and manufacturing method thereof Download PDFInfo
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- CN114744136A CN114744136A CN202210494591.7A CN202210494591A CN114744136A CN 114744136 A CN114744136 A CN 114744136A CN 202210494591 A CN202210494591 A CN 202210494591A CN 114744136 A CN114744136 A CN 114744136A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention provides a flexible display panel and a manufacturing method thereof, wherein the manufacturing method of the flexible display panel comprises the following steps: providing a carrier substrate; forming a flexible substrate on a carrier substrate; forming a metal layer on a flexible substrate; forming a barrier layer on the metal layer; and irradiating laser to the carrier substrate to peel the flexible substrate from the carrier substrate. Through set up latticed metal level between flexible substrate and barrier layer, utilize the good heat conduction characteristic of latticed metal level, conduct away the heat that the laser was peeled off the in-process and produce uniformly, avoid because local high temperature leads to the laser to peel off the back and produce black spot or rete and peel off defect scheduling problem to improve the yield and the reliability of panel.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of display, in particular to a flexible display panel and a manufacturing method thereof.
[ background ] A method for producing a semiconductor device
Currently, a flexible display panel is an important development trend, and generally, a flexible display panel includes a flexible substrate and a display device formed on the flexible substrate. In general, a display device may include a thin film transistor array layer, an anode layer, an organic light emitting layer, a cathode layer, an encapsulation layer, and the like, which are sequentially disposed on a flexible substrate.
In the manufacturing process of the flexible display panel, a Laser Lift Off (LLO) technology is required to separate a flexible substrate (such as a polyimide film (PI)) from a rigid carrier substrate (such as glass, which is also called a glass substrate), and Laser can process the flexible substrate through the carrier substrate to eliminate an adhesive force between the flexible substrate and the carrier substrate, thereby separating the flexible substrate from the carrier substrate. However, during the laser irradiation process, there is a problem of heat conduction between the film layers, which causes Peeling (Peeling) defects, black spots, and the like to be formed in the flexible display panel, thereby affecting the light emitting effect of the device.
Therefore, the prior art has defects and needs to be improved and developed.
[ summary of the invention ]
The invention provides a display panel and a manufacturing method thereof, which are used for improving a laser irradiation process so as to improve the yield and the reliability of the panel.
In order to solve the above problems, the present invention provides a method for manufacturing a flexible display panel, including: providing a carrier substrate; forming a flexible substrate on a carrier substrate; forming a metal layer on a flexible substrate; forming a barrier layer on the metal layer; the carrier substrate is subjected to laser irradiation to peel the flexible substrate from the carrier substrate.
Wherein, the metal level is latticed metal level, forms the metal level on flexible substrate, specifically includes:
respectively forming a metal material layer and a photoresist layer on a flexible substrate;
patterning the photoresist layer to form a patterned photoresist layer;
and removing part of the metal material layer according to the patterned photoresist layer to form a metal layer.
The manufacturing method of the flexible display panel further comprises the following steps:
a display device is formed on the barrier layer.
In order to solve the above problems, the present invention provides a flexible display panel including: a flexible substrate; a metal layer on the flexible substrate; a barrier layer on the metal layer.
Wherein, the metal layer is a latticed metal layer.
Wherein the cross-sectional shape of the latticed metal layer along a plane parallel to the flexible substrate includes a quadrangle, a triangle, or a trapezoid.
Wherein, the display panel still includes:
a display device on the barrier layer.
Wherein the display device comprises an OLED device.
Wherein, the material of the metal layer comprises silver, aluminum, copper, molybdenum or titanium.
Wherein the width of the metal layer is less than or equal to 500um, and/or the thickness of the metal layer is less than or equal to 500 nm.
The invention has the beneficial effects that: different from the prior art, the invention provides a flexible display panel and a manufacturing method thereof, wherein the manufacturing method of the flexible display panel comprises the following steps: providing a carrier substrate; forming a flexible substrate on a carrier substrate; forming a metal layer on a flexible substrate; forming a barrier layer on the metal layer; the carrier substrate is subjected to laser irradiation to peel the flexible substrate from the carrier substrate. Through set up the metal level between flexible substrate and barrier layer, utilize the good heat conduction characteristic of metal level, conduct away the heat that the laser stripping in-process produced uniformly, avoid because local high temperature leads to the laser to strip the back and produce black spot or rete and peel off the defect scheduling problem to improve the yield and the reliability of panel.
[ description of the drawings ]
Fig. 1 is a schematic flowchart of a method for manufacturing a flexible display panel according to an embodiment of the present invention;
fig. 2a to 2e are schematic structural diagrams corresponding to steps in the manufacturing method provided in the embodiment of the present invention;
fig. 3 is a schematic structural diagram of a grid-shaped metal layer according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram including a flexible substrate, a metal layer and a barrier layer according to an embodiment of the present invention;
FIG. 5a is a prior art flexible display panel with peeling defects;
FIG. 5b is a prior art flexible display panel with black dot defects;
fig. 6 is a schematic structural diagram of a flexible display panel according to an embodiment of the present invention.
[ detailed description ] embodiments
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Likewise, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive step are within the scope of the present invention.
Furthermore, the terms first, second, third, etc. as used herein may be used to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first species may be termed a second species, and, similarly, a second species may be termed a first species, without departing from the scope of the present application. Accordingly, the terminology used is for the purpose of describing and understanding the invention and is not intended to be limiting of the invention. In the various figures, elements of similar structure are identified by the same reference numerals. For purposes of clarity, the various features in the drawings are not necessarily drawn to scale. Moreover, some well-known elements may not be shown in the figures.
In addition, in the various figures, elements of similar structure are identified by the same reference numerals. When an element is described as being "connected to" another element, it can be directly "connected" or indirectly "connected" to the other element through an intermediate element.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings.
As shown in fig. 1, the present invention provides a method for manufacturing a flexible display panel, which is compared with the structure diagrams of fig. 2a to 2e, and the specific process is as follows:
s101, a step: a carrier substrate 110 is provided.
S102, a step: a flexible substrate 120 is formed on the carrier substrate 110.
In addition, it should be noted that fig. 2a to 2e only show the structures related to the content of the embodiments of the present invention, and the flexible display panel of the present invention may further include other components and/or structures for realizing the complete functions of the flexible display panel.
Fig. 2a shows the structure formed from step S101 to step S102, which includes: a carrier substrate 110, a flexible substrate 120 on the carrier substrate 110. The flexible substrate 120 may be formed on the carrier substrate 110 through a coating (coating) process, which may be selected from a slot coating process or a spin coating process or a spray coating process, and is preferably used in this embodiment. The material of the flexible substrate 120 may be a polymer material such as Polyimide (PI), Polycarbonate (PC), Polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyarylate (PAR), or glass Fiber Reinforced Plastic (FRP).
Most of the manufacturing processes of the flexible display device 160 are to manufacture the flexible display device 160 to be peeled off on the carrier substrate 110. The flexible display device 160 to be peeled includes a flexible substrate 120 and a functional layer having a flexible display, the carrier substrate 110 and the functional layer having the flexible display are bonded together by the flexible substrate 120, and after the flexible substrate 120 is irradiated by Laser with a specific wavelength, the viscosity is greatly changed, and the flexible display device 160 to be peeled and the carrier substrate 110 can be separated by a Laser Lift Off technology (LLO), so as to obtain the flexible display device 160. The obtained flexible display device 160 may be a flexible display panel, among others.
In particular, the carrier substrate 110 may be a transparent rigid glass. The flexible substrate 120 may be any material whose viscosity changes with the laser irradiation, and is not particularly limited. Preferably, the material of the flexible substrate 120 may be Polyimide (PI), and when laser is irradiated on the Polyimide layer, the Polyimide may be charred and decomposed due to absorption of light, so that the adhesiveness between the carrier substrate 110 and the flexible substrate 120 is reduced, thereby achieving separation of the carrier substrate 110 and the flexible substrate 120. Meanwhile, polyimide is an excellent flexible material, can realize that flexible display device 160 is bent freely at a certain angle, promotes flexible display device 160's pliability, also can avoid stress concentration when buckling simultaneously, produces local fracture's problem.
S103, a step: a metal layer 131 is formed on the flexible substrate 120.
The metal layer 131 is a grid-shaped metal layer 131, and the forming of the metal layer 131 on the flexible substrate 120 specifically includes:
respectively forming a metal material layer 130 and a photoresist layer on the flexible substrate 120;
patterning the photoresist layer to form a patterned photoresist layer 140;
according to the patterned photoresist layer 140, a portion of the metal material layer 130 is removed to form a metal layer 131.
Fig. 2b shows a structure for forming the metal material layer 130, which includes: a carrier substrate 110, a flexible substrate 120 on the carrier substrate 110, and a metallic material layer 130 on the flexible substrate 120. The layer of metallic material 130 may be formed on the flexible substrate 120 by a deposition process, such as sputtering deposition (sputtering deposition), in which atoms in a target are sputtered by bombarding the target with energetic particles. Here, the material of the metal material layer 130 is not particularly limited, and for example, the material of the metal material layer 130 may include silver, aluminum, copper, molybdenum, titanium, or the like.
Fig. 2c shows a structure for forming a patterned photoresist layer 140, comprising: the flexible printed circuit board includes a carrier substrate 110, a flexible substrate 120 on the carrier substrate 110, a metal material layer 130 and a patterned photoresist layer 140 sequentially on the flexible substrate 120. A photoresist layer (not shown) may be formed on the formed metal material layer 130 through a coating process, and the photoresist layer of the exposed portion or the unexposed portion may be removed through a developing process to form the patterned photoresist layer 140.
Fig. 2d shows a structure of the metal layer 131 formed in a grid shape, including: the flexible printed circuit board comprises a carrier substrate 110, a flexible substrate 120, a grid-shaped metal layer 131 and a patterned photoresist layer 140, wherein the grid-shaped metal layer 131 and the patterned photoresist layer 140 are sequentially arranged on the flexible substrate 120. Portions of the metal material layer 130 may be removed by wet etching according to the patterned photoresist layer 140 to transfer the pattern on the patterned photoresist layer 140 to the metal material layer 130, thereby forming the metal layer 131 in a grid shape. Fig. 3 is a schematic structural diagram of a grid-shaped metal layer 131 according to an embodiment of the present invention. Wherein the cross-sectional shape a1 of the metal layer 131 in a grid shape along a plane (XY plane) parallel to the flexible substrate 120 includes a quadrangle, a triangle, or a trapezoid. The cross section a1 of the mesh-like metal layer 131 in the XY plane may have another shape or any combination of a quadrangle, a triangle, and a trapezoid, and is not particularly limited. Wherein the width W of the metal layer 131 is less than or equal to 500um, and/or the thickness (dimension perpendicular to the XY plane) of the metal layer 131 is less than or equal to 500 nm.
FIG. 2e shows the structure for removing the patterned photoresist layer 140, including: a carrier substrate 110, a flexible substrate 120, and a grid-shaped metal layer 131 on the flexible substrate 120. The patterned photoresist layer 140 can be removed by a cleaning method, such as DRY plasma stripping (DRY O)2ashing), removing the patterned photoresist layer 140, and removing residues after the reaction using a WET clean (WET) method. After the grid-shaped metal layer 131 is formed, a general process of the display panel may be performed, for example, as shown in fig. 6, a thin film transistor Array layer 161(Array), an anode layer 162, an organic light emitting layer 163, a cathode layer 164, an encapsulation layer 165, and the like are formed on the flexible substrate 120.
And S104: a barrier layer 150 is formed on the metal layer 131.
Specifically, after the mesh-shaped metal layer 131 is formed, the Barrier layer 150 may be formed on the mesh-shaped metal layer 131 (Barrier). The material of the barrier layer 150 may be an inorganic material, and is typically silicon oxide (SiOx). As shown in fig. 4, a schematic structural diagram including a flexible substrate 120, a metal layer 131 and a barrier layer 150 is provided for the embodiment of the present invention. As can be seen from fig. 4, the latticed metal layer 131 is located between the flexible substrate 120 and the barrier layer 150. The flexible substrate (not shown in the figures) generally comprises polyimide films and inorganic barrier layers 150 which are alternately stacked, and the barrier layers 150 are usually made of SiOx, but SiOx has high brittleness, is not easy to bend, and is easy to crack, and after cracks appear, the original film layer cannot be repaired, so that water and oxygen easily enter the light-emitting element, and the device structure fails. By disposing a latticed metal layer 131 between the flexible substrate 120 and the barrier layer 150, heat transfer during laser irradiation is improved and water and oxygen intrusion from the bottom of the TFT side of the flexible display panel is prevented, thereby improving the yield and reliability of the panel.
And S105: the carrier substrate 110 is subjected to laser irradiation to peel the flexible substrate 120 from the carrier substrate 110.
The manufacturing method of the flexible display panel further comprises the following steps:
a display device 160 is formed on the barrier layer 150.
Specifically, after the barrier layer 150 is formed, other functional film layer or layers may be formed on the barrier layer 150, for example, a display device 160 may be formed on the barrier layer 150. Here, the display device 160 is not particularly limited, and the display device 160 may be an OLED device, a Micro LED device, a Mini LED device, or the like. Preferably, the display device 160 may be an OLED device. Among them, Organic light-emitting diodes (OLEDs) have the advantages of self-luminescence, high contrast, thin thickness, wide viewing angle, and fast response speed, and are the representatives of the new generation of flat panel display technologies and are increasingly popular in the industry. The display device 160 may include a thin film transistor array layer 161, an anode layer 162, an organic light emitting layer 163, a cathode layer 164, an encapsulation layer 165, and the like, which are sequentially disposed on the flexible substrate 120. After the encapsulation layer 165 is formed, other film layers may be formed on the encapsulation layer 165. After the barrier layer 150 is formed, the carrier substrate 110 may be irradiated with laser on a side away from the flexible substrate 120, so that the viscosity between the carrier substrate 110 and the flexible substrate 120 is reduced, thereby separating the carrier substrate 110 and the flexible substrate 120, and further obtaining the flexible display panel with the flexible substrate 120. The flexible display panel may be a flexible OLED display panel.
As can be seen from the above, in the manufacturing process of the flexible substrate, an llo (laser lift off) technology is required to separate the flexible substrate 120 and the carrier substrate 110, and the laser can process the flexible substrate 120 through the carrier substrate 110, so as to eliminate the adhesion between the flexible substrate 120 and the carrier substrate 110, and separate the flexible substrate 120 and the carrier substrate 110. However, during the laser irradiation process, there are defects such as heat conduction between films, Peeling (a defect of Peeling off a film as shown in fig. 5 a), and black dots (a defect of black dots as shown in a black box in fig. 5 b), which affect the light emitting effect of the device.
In the embodiment of the present application, the metal layer 131 is disposed between the flexible substrate 120 and the barrier layer 150, and the good heat conduction property of the metal layer 131 is utilized to uniformly conduct heat generated in the laser lift-off process, so as to avoid the problems of black spots or film layer lift-off defects after laser lift-off due to over-high local temperature, thereby improving the yield and reliability of the panel.
Specifically, metal level 131 can be latticed metal level 131, because the metal is hot good conductor, latticed routing layout can release the heat that produces when the laser is peeled off effectively, will show that the concentrated heat in (Active Area, AA) regional laser head position can evenly distribute away, avoids local high temperature to lead to the laser to peel off back and take place defects such as black spot or reteling, and then leads to water oxygen to follow bottom corrosion device. In addition, because the metal material has good ductility, flexibility and anti-fatigue capability, only plastic deformation can occur when the panel is bent, and the anti-bending capability of the panel can be effectively improved. In addition, the flexible substrate 120 can be attached to the barrier layer 150 more tightly by the latticed metal layer 131, and the film layer Peeling can be prevented more favorably by adding the keel structure in the middle of the latticed metal layer 131, so that the corrosion of the device caused by the invasion of water and oxygen from the bottom of the flexible display panel can be prevented.
In addition, the flexible substrate (not shown in the figures) generally comprises polyimide films and inorganic barrier layers 150 which are alternately stacked, and the barrier layers 150 are usually made of SiOx, but SiOx has high brittleness, is not easy to bend, and is very easy to crack, and after cracks appear, the original film layers cannot be repaired, so that water and oxygen easily enter the light-emitting element, and the device structure fails.
Based on the manufacturing method of the flexible display panel described in the above embodiment of the present invention, the present invention further provides a flexible display panel, as shown in fig. 6, including: a flexible substrate 120; a metal layer 131 on the flexible substrate 120; and a barrier layer 150 on the metal layer 131.
Specifically, the flexible substrate 120 may be any material whose viscosity changes with the laser irradiation, and is not particularly limited. Preferably, the material of the flexible substrate 120 may be Polyimide (PI), and when laser is irradiated on the Polyimide layer, the Polyimide may be charred and decomposed due to absorption of light, so that the adhesiveness between the carrier substrate 110 and the flexible substrate 120 is reduced, thereby achieving separation of the carrier substrate 110 and the flexible substrate 120. Meanwhile, polyimide is an excellent flexible material, so that the flexible display device 160 can be freely bent at a certain angle, the flexibility of the flexible display device 160 is improved, and the problem of local fracture caused by stress concentration during bending can be avoided.
As can be seen from the above, the flexible substrate generally comprises polyimide films and inorganic barrier layers 150 which are alternately stacked, and the barrier layer 150 is usually made of silicon oxide (SiOx), but the silicon oxide (SiOx) is relatively brittle and not easy to bend and is very easy to crack, and after the cracks appear, the original film layer cannot be repaired, so that water and oxygen easily enter the light emitting device, and the device structure fails.
Based on this, by adopting the flexible display panel in the embodiment of the present application, the metal layer 131 is disposed between the flexible substrate 120 and the barrier layer 150, and the good heat conduction characteristic of the metal layer 131 is utilized to uniformly conduct away the heat generated in the laser lift-off process, thereby avoiding the problems of black spots or film layer lift-off defects and the like generated after laser lift-off due to over-high local temperature, and further improving the yield and reliability of the panel.
The metal layer 131 is a grid-shaped metal layer 131.
Specifically, metal level 131 can be latticed metal level 131, because the metal is hot good conductor, latticed routing layout can release the heat that produces when the laser is peeled off effectively, will show that the concentrated heat in (Active Area, AA) regional laser head position can evenly distribute away, avoids local high temperature to lead to the laser to peel off the back and take place black spot or reteling, and then leads to water oxygen to follow bottom corrosion device. In addition, because the metal material has good ductility, flexibility and anti-fatigue capability, only plastic deformation can occur when the panel is bent, and the anti-bending capability of the panel can be effectively improved. In addition, the flexible substrate 120 can be attached to the barrier layer 150 more tightly by the latticed metal layer 131, and the film layer Peeling can be prevented more favorably by adding the keel structure in the middle of the latticed metal layer 131, so that the corrosion of the device caused by the invasion of water and oxygen from the bottom can be prevented.
The material of the metal layer 131 includes silver, aluminum, copper, molybdenum, or titanium.
Wherein, the width of the metal layer 131 is less than or equal to 500um, and/or the thickness of the metal layer 131 is less than or equal to 500 nm.
Wherein the cross-sectional shape a1 of the metal layer 131 in a grid shape along a plane (XY plane) parallel to the flexible substrate 120 includes a quadrangle, a triangle, or a trapezoid.
Fig. 3 is a schematic structural diagram of a latticed metal layer 131 according to an embodiment of the present invention. Wherein a cross-sectional shape of the metal layer 131 in a plane (XY plane) parallel to the flexible substrate 120 includes a quadrangle, a triangle, or a trapezoid. The cross-sectional shape of the metal layer 131 in the mesh shape in the XY plane may be other shapes, or may be any combination of a quadrangle shape, a triangle shape, and a trapezoid shape, and is not particularly limited. Wherein the width W of the metal layer 131 is less than or equal to 500um, and/or the thickness (dimension perpendicular to the XY plane) of the metal layer 131 is less than or equal to 500 nm.
Wherein, the display panel still includes:
a display device 160 on the barrier layer 150.
Specifically, after the barrier layer 150 is formed, other functional film layer or layers may be formed on the barrier layer 150, for example, a display device 160 may be formed on the barrier layer 150. The display device 160 may include a thin film transistor array layer 161, an anode layer 162, an organic light emitting layer 163, a cathode layer 164, an encapsulation layer 165, and the like, which are sequentially disposed on the flexible substrate 120. After the encapsulation layer 165 is formed, other film layers may be formed on the encapsulation layer 165.
Among them, the display device 160 includes an OLED device.
Specifically, the display device 160 is not particularly limited, and the display device 160 may be an OLED device, a Micro LED device, or a Mini LED device, or the like. Preferably, the display device 160 may be an OLED device. Among them, Organic light-emitting diodes (OLEDs) have the advantages of self-luminescence, high contrast, thin thickness, wide viewing angle, and fast response speed, and are representative of a new generation of flat panel display technology and are increasingly popular in the industry.
The flexible display panel can be thinner and thinner in size, and power consumption can be reduced, so that cruising ability of corresponding products can be improved. Meanwhile, due to the flexibility and the flexibility of the flexible display panel, the durability of the flexible display panel is higher than that of a common hard display panel. The flexible display panel can be widely applied to various products with display functions, such as tablet computers, televisions, mobile terminals and various wearable devices.
However, the flexible display panel has a series of advantages and also has its own defects, and the flexible substrate has problems of flexibility, thermal expansion and the like, which makes it difficult to process the display device 160, and the substrate is prone to sag, even wrinkle or fracture, and it is difficult to precisely perform the subsequent film layer preparation process. To solve this problem, it is necessary to attach the flexible substrate 120 to a rigid carrier substrate 110 such as a glass substrate for supporting and fixing the flexible substrate 120 to facilitate the formation of a thin film. After each layer of elements forming the display panel is prepared on the flexible substrate 120, the rigid substrate is peeled from the flexible substrate by a peeling process, thereby completing the preparation of the flexible display panel.
Fig. 6 exemplarily shows a structural schematic diagram of one of the flexible display panels, wherein the flexible display panel is a flexible OLED display panel. As shown in fig. 6, the flexible OLED display panel includes a thin film transistor array layer 161, an anode layer 162, an organic light emitting layer 163, a cathode layer 164, an encapsulation layer 165, and the like, which are sequentially disposed on a flexible substrate 120. After the encapsulation layer 165 is formed, other film layers may be formed on the encapsulation layer 165. The thin film transistor array is provided with thin film transistors, data lines, scanning lines and other structural film layers. The organic light emitting Layer includes a Hole Transport Layer (HTL) made of an organic material, an Emissive Material Layer (EML), an Electron Transport Layer (ETL), and the like (all not shown in the drawings). Furthermore, other functional structure film layers such as a Touch Panel (TP), a polarizer, a protective cover plate and the like can be sequentially arranged on the flexible OLED display panel. By arranging the metal layer 131 between the flexible substrate 120 and the barrier layer 150, heat generated in the laser peeling process is uniformly conducted out by utilizing the good heat conduction characteristic of the metal layer 131, so that the problems of black spots or film layer peeling defects and the like generated after laser peeling due to over-high local temperature are avoided, and the yield and the reliability of the panel are improved.
It should be understood that, in the embodiments of the present invention, reference may be made to the above-described embodiments of the method for manufacturing a flexible display panel for structures and manufacturing processes of each component of the flexible display panel, and details are not described here.
According to the above, the present invention provides a flexible display panel and a method for manufacturing the same, the method for manufacturing the flexible display panel includes: providing a carrier substrate; forming a flexible substrate on a carrier substrate; forming a metal layer on a flexible substrate; forming a barrier layer on the metal layer; the carrier substrate is subjected to laser irradiation to peel the flexible substrate from the carrier substrate. Through set up the metal level between flexible substrate and barrier layer, utilize the good heat conduction characteristic of metal level, conduct away the heat that the laser stripping in-process produced uniformly, avoid because local high temperature leads to the laser to strip the back and produce black spot or rete and peel off the defect scheduling problem to improve the yield and the reliability of panel.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. A method for manufacturing a flexible display panel is characterized by comprising the following steps:
providing a carrier substrate;
forming a flexible substrate on the carrier substrate;
forming a metal layer on the flexible substrate;
forming a barrier layer on the metal layer;
and carrying out laser irradiation on the carrier substrate to strip the flexible substrate from the carrier substrate.
2. The method for manufacturing a flexible display panel according to claim 1, wherein the metal layer is a grid-shaped metal layer, and the forming of the metal layer on the flexible substrate specifically includes:
respectively forming a metal material layer and a photoresist layer on the flexible substrate;
patterning the photoresist layer to form a patterned photoresist layer;
and removing part of the metal material layer according to the patterned photoresist layer to form the metal layer.
3. The method of manufacturing a flexible display panel according to claim 1, further comprising:
forming a display device on the barrier layer.
4. A flexible display panel, comprising:
a flexible substrate;
a metal layer on the flexible substrate;
a barrier layer on the metal layer.
5. The flexible display panel of claim 4, wherein the metal layer is a grid-like metal layer.
6. The flexible display panel of claim 5, wherein a cross-sectional shape of the mesh-like metal layer along a plane parallel to the flexible substrate comprises a quadrilateral, a triangle, or a trapezoid.
7. The flexible display panel of claim 4, wherein the display panel further comprises:
a display device on the barrier layer.
8. The flexible display panel of claim 7, wherein the display device comprises an OLED device.
9. The flexible display panel of claim 4, wherein the material of the metal layer comprises silver, aluminum, copper, molybdenum, or titanium.
10. The flexible display panel of claim 4, wherein the metal layer has a width of less than or equal to 500um and/or a thickness of less than or equal to 500 nm.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107623087A (en) * | 2017-10-30 | 2018-01-23 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED display panel and preparation method thereof |
| CN107978687A (en) * | 2017-11-22 | 2018-05-01 | 武汉华星光电半导体显示技术有限公司 | The preparation method of flexible OLED display panel |
| CN208608200U (en) * | 2018-05-31 | 2019-03-15 | 云谷（固安）科技有限公司 | A kind of display screen and display device |
| CN110335970A (en) * | 2019-07-15 | 2019-10-15 | 京东方科技集团股份有限公司 | Flexible display substrates and its manufacturing method, flexible display apparatus |
-
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- 2022-05-07 CN CN202210494591.7A patent/CN114744136A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107623087A (en) * | 2017-10-30 | 2018-01-23 | 武汉华星光电半导体显示技术有限公司 | Flexible OLED display panel and preparation method thereof |
| CN107978687A (en) * | 2017-11-22 | 2018-05-01 | 武汉华星光电半导体显示技术有限公司 | The preparation method of flexible OLED display panel |
| CN208608200U (en) * | 2018-05-31 | 2019-03-15 | 云谷（固安）科技有限公司 | A kind of display screen and display device |
| CN110335970A (en) * | 2019-07-15 | 2019-10-15 | 京东方科技集团股份有限公司 | Flexible display substrates and its manufacturing method, flexible display apparatus |
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