CN114743460A - Display panel and display device - Google Patents
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- CN114743460A CN114743460A CN202210394714.XA CN202210394714A CN114743460A CN 114743460 A CN114743460 A CN 114743460A CN 202210394714 A CN202210394714 A CN 202210394714A CN 114743460 A CN114743460 A CN 114743460A
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- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G—PHYSICS
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- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The invention discloses a display panel and a display device, the display panel includes: the display substrate is provided with a display area, a bending area and a chip binding area, the bending area is arranged on one side of the display area and bends towards the side away from the light emitting side of the display area, and the chip binding area is connected with the display area through the bending area; the control chip is positioned on the chip binding area and positioned on one side of the chip binding area, which is deviated from the light emitting side of the display area; the binding composite layer is positioned between the bending area and the display area and at least comprises a support sub-layer and a function sub-layer, and the function sub-layer is arranged towards one side of the control chip. The display panel is provided with the binding composite layer, so that the panel based on the COP scheme can be better protected, and the impact resistance of the panel is improved.
Description
Technical Field
The present invention relates to the field of display, and in particular, to a display panel and a display device.
Background
With the development of display technology, especially flexible display technology based on OLED, products such as folding and sliding display screens have increased weight in the market. In the design of the display module, COP binding is adopted, namely a scheme that a drive IC is directly bound on a display panel (chip on panel) replaces a scheme of COF binding (chip on film, and the drive IC is bound on a chip on film) so as to achieve the purposes of increasing the occupation of a screen visual area and realizing curved surface display.
Nevertheless, display panels, especially those based on COP schemes, and display devices still need to be improved.
Disclosure of Invention
The present inventors have made a study based on the following findings:
the inventor finds that the display panel of the current COP binding scheme still has certain defects compared with the COF binding panel, such as: on products without rigid cover plates, such as folding and sliding rolls, the anti-falling performance of the panel, such as the falling ball and pen test performance, has certain weakness temporarily. In particular, when the ball-and-pen-drop test point is at the IC bonding position, the board is prone to fail under the IC.
The present invention aims to alleviate or even solve at least one of the above problems to some extent.
In one aspect of the present invention, a display panel is provided. The display panel includes: the display device comprises a display substrate, a bending area and a chip binding area, wherein the display substrate is provided with a display area, the bending area is arranged on one side of the display area and is bent towards the side away from the light emitting side of the display area, and the chip binding area is connected with the display area through the bending area; the control chip is positioned on the chip binding area and positioned on one side of the chip binding area, which is deviated from the light emitting side of the display area; the binding composite layer is positioned between the bending area and the display area and at least comprises a support sub-layer and a function sub-layer, and the function sub-layer faces one side of the control chip. The display panel is provided with the binding composite layer, so that the panel based on the COP scheme can be better protected, and the impact resistance of the panel is improved.
According to an embodiment of the invention, the support sublayer satisfies at least one of the following conditions: the hardness of the support sub-layer is greater than that of the rubber material; the support sublayer is selected from at least one of PET, inorganic carbon materials, and ceramics. Therefore, the overall mechanical strength of the binding composite layer can be improved.
According to an embodiment of the invention, the functional sublayer comprises at least one of the following structures: a heat conducting sublayer, wherein the material forming the heat conducting sublayer comprises graphite and at least one of Cu and Al; and the buffer sublayer is formed by a material comprising a high polymer material with elasticity. Therefore, the impact resistance, the heat conduction and other performances of the binding composite layer can be further improved.
According to an embodiment of the invention, the buffer sublayer is located on a side of the support sublayer facing away from the control chip. Therefore, the performance of the display panel can be further improved.
According to the embodiment of the invention, a first adhesive structure is arranged between the support sub-layer and the functional sub-layer, the binding composite layer comprises a plurality of the functional sub-layers, the functional sub-layers are arranged on two surfaces of the support sub-layer, and a second adhesive structure is further arranged on one side, away from the support sub-layer, of the functional sub-layer. Therefore, the performance of the display panel can be further improved.
According to an embodiment of the present invention, the bending region is located on a first side of the display substrate, the display panel has a second side connected to the first side, and the bonding composite layer has a step structure in a longitudinal section along the second side. Therefore, the impact resistance of the binding composite layer can be further improved.
According to an embodiment of the present invention, the bending region is located on a first side of the display substrate, the display panel has a second side connected to the first side, and the bonding composite layer has a trapezoidal shape in a longitudinal section along the second side. Therefore, the impact resistance of the binding composite layer can be further improved.
According to an embodiment of the present invention, the display panel further includes a cover film layer, the cover film layer is located on the light emitting side of the display substrate and at least covers the display area, and the cover film layer is made of a polymer material. Therefore, the display panel can realize the functions of folding and rolling.
According to an embodiment of the present invention, the display panel further includes at least one of the following structures: the back film is positioned on one side of the display panel, which is far away from the light emergent side, and the orthographic projection of the back film on the display substrate and the bending area are not overlapped; the first adhesive layer is positioned on one side, away from the display panel, of the back film; the reinforcing support layer is positioned on one side, away from the back membrane, of the bonding layer and is in contact with the binding composite layer; the polaroid is positioned on the light emitting side of the display panel; and the second bonding layer is positioned on one side of the polaroid, which deviates from the light-emitting side, and is in contact with the cover plate film layer. This can further improve the performance of the display panel.
In yet another aspect of the present invention, a display device is provided. The display device comprises the display panel described above. Therefore, the display device has all the features and advantages of the display panel, and the description thereof is omitted. In general, the display device can realize the functions of folding and rolling sliding and has better impact resistance.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic view showing a structure of a display panel in the related art;
FIG. 2 is a schematic diagram of a display panel according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a display panel according to another embodiment of the present invention;
FIG. 4 shows a schematic structural diagram of a binding composite layer according to one embodiment of the invention;
FIG. 5 is a schematic diagram of a display panel according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a display panel according to another embodiment of the present invention;
fig. 7 shows a schematic structural diagram of a display panel according to yet another embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, the terms "upper", "lower", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, which are merely for convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In one aspect of the present invention, a display panel is provided. Referring to fig. 2, the display panel includes: the display substrate 100 comprises a display area 110, a bending area 120 and a chip binding area 130, wherein the bending area 120 is arranged on one side of the display area 110 and bends towards the side away from the light emitting side of the display area, and the chip binding area 130 is connected with the display area through the bending area. The control chip 300 is located on the chip bonding region 130, and the control chip 300 is located on a side of the chip bonding region departing from the light emitting side of the display region. The binding composite layer 200 is located between the bending region and the display region, and the binding composite layer 200 includes at least a support sub-layer 210 and a functional sub-layer 220. Wherein the functional sub-layer 220 is disposed toward the side of the control chip 300. The display panel is provided with the binding composite layer, so that the panel based on the COP scheme can be better protected, and the impact resistance of the panel is improved.
For convenience of understanding, the following first briefly explains the principle that the display panel can achieve the above beneficial effects:
as described above, referring to fig. 1, the display panel of the current COF bonding scheme is bonded to the control chip 300 through the chip on film 20 connected to the display substrate 100. In this case, the display substrate 100 itself does not need to be bent, and therefore, the cover film layer 400 on the light emitting side of the display substrate 100 may be formed of a rigid structure, such as glass. The display panel has good overall impact resistance under the condition, and can pass through detection easily in ball drop and pen drop tests. However, in a display panel based on the COF bonding scheme, for example, the display panel proposed in the present application as shown in fig. 2, the display substrate 100 has a bending region, the control chip is directly bonded on the display substrate, the ratio of the visible area of the screen with a narrower lower Border (Down Border) is significantly increased, and curved surface display can be achieved, so that roll sliding and folding functions can be better achieved. The cover plate film layer of the display panel with the rolling, sliding and folding functions cannot be made of rigid materials, so the shock resistance of the current display panel, particularly the test results of ball falling and pen falling, are still not ideal. Especially, the position of the panel binding the chip is easy to have the defects of dent and the like on the film layer of the cover plate in the ball drop and pen drop tests.
According to the display panel provided by the embodiment of the invention, through the arrangement of the binding composite layer, positions such as the binding chip region can be protected on the premise of not remarkably improving the whole thickness of the panel, the shock resistance of the position is improved, and the phenomenon that when one side of the cover plate film layer corresponding to the position such as the control chip region is impacted, the surface of the flexible cover plate film layer is dented is avoided. Specifically, the binding composite layer includes a support sublayer and a functional sublayer, the support sublayer may have a certain mechanical strength and serve as a main sublayer structure for relieving stress, and the functional sublayer may realize additional functions such as enhancing thermal conductivity, so as to improve the mechanical strength and the impact resistance, and prevent the functions such as heat dissipation and the like of the panel from being reduced due to the arrangement of the film layer.
Hereinafter, the respective structures of the display panel are explained in detail according to the embodiment of the present invention:
according to an embodiment of the invention, referring to fig. 3, fig. 5 to fig. 7, the display panel further includes a cover film layer 400, the cover film layer 400 is located on the light-emitting side of the display substrate 100 and at least covers the display area, and the cover film layer is made of a polymer material. Therefore, the display panel can realize the functions of folding and rolling. The display panel may further include at least one of the following structures: the back film 700, the back film 700 is located on one side of the display panel 100 departing from the light-emitting side, and there is no overlap between the orthographic projection of the back film on the display substrate and the bending region. Therefore, the overall mechanical strength and the impact resistance of the display panel can be improved by utilizing the back film. The first adhesive layer 800 is located on a side of the back film 700 facing away from the display panel 100. The polarizer 600 is located at the light emitting side of the display panel 100, and the second adhesive layer 500 is located at the side of the polarizer 600 departing from the light emitting side of the display panel and contacts with the cover film 400, so as to fix the two structures. Referring to fig. 6, in some embodiments of the present invention, the display panel may further have a reinforcing support layer 240, the reinforcing support layer 240 being located on a side of the first adhesive layer facing away from the back film and contacting the binding composite layer 200. This can further improve the performance of the display panel. The performance of the display panel can be further improved by the reinforcing support layer, and the material of the reinforcing support layer can be a polymer material including, but not limited to, PET, and the like.
According to an embodiment of the present invention, the material of the support sub-layer 210 is not particularly limited as long as the impact resistance of the display panel can be improved and the stress can be dispersed. For example, the support sub-layer may have a hardness greater than the hardness of the glue. Thus, the support sub-layer can better prevent the flexible cover film layer 400 from being indented due to stress, compared to a solution in which the binding composite layer 200 is not provided, but the adhesive layer 21 (as shown in fig. 1) is directly used to fix the portion that needs to be bent. For example, the material of the support sub-layer 210 may be selected from at least one of PET, inorganic carbon material, and ceramic, in particular. Therefore, the overall mechanical strength of the binding composite layer can be improved.
The specific material of the functional sub-layer 220 and the function thereof are not particularly limited according to the embodiment of the present invention, and may be selected by one skilled in the art according to the specific structure and performance requirements of the display panel. For example, it may comprise at least one of the following structures: a thermally conductive sublayer and a buffer sublayer. Therefore, the heat dissipation and impact resistance of the display panel with the functional sub-layer can be improved. Specifically, the material forming the thermal conductive sub-layer may include graphite and at least one of Cu and Al. The specific thickness of the thermally conductive sublayer is not particularly limited, and may be, for example, not more than 40 μm. Therefore, the heat dissipation performance of the composite layer can be effectively improved on the premise of not increasing the overall thickness of the composite layer remarkably. The material forming the buffer sublayer comprises a high polymer material with elasticity, such as foam and the like. Similarly, the specific thickness of the buffer sublayer is also not particularly limited, and may be, for example, not more than 50 micrometers, or the like. Therefore, the impact resistance, the heat conduction and other performances of the binding composite layer can be further improved.
According to the embodiment of the invention, the thermal conductive sub-layer may be disposed on a side of the bonding composite layer close to the control chip. Therefore, the heat radiation performance of the chip can be enhanced, and the buffer sub-layer can be positioned on the side, away from the control chip, of the support sub-layer, so that stress caused by external impact can be relieved better.
According to an embodiment of the present invention, referring to fig. 3, the bending region is located at a side of a first edge of the display substrate, the display panel has a second edge connected to the first edge, and the bonding composite layer has a step structure in a longitudinal section (i.e., a viewing angle shown in the drawing) along a side of the second edge. Therefore, the impact resistance of the binding composite layer can be further improved. Specifically, the side of the stepped structure with the larger attachment area is disposed close to the first adhesive layer 800, that is, the side of the stepped structure with the smaller attachment area is closer to the control chip 300. Therefore, the impact buffering can be better enhanced, and the stress is more dispersed. According to further embodiments of the present invention, the binding composite layer has a trapezoidal shape in a longitudinal section along the aforementioned second side. Referring to fig. 4, a longer one of two bases of the trapezoid may be disposed near a display area side of the display panel. Therefore, the area of contact with the outer side of the display panel can be increased, impact can be better buffered, and stress is dispersed. Therefore, the impact resistance of the binding composite layer can be further improved. According to some embodiments of the invention, a "longitudinal section having a trapezoidal shape" is to be understood in a broad sense. As long as the longitudinal cross-section of one or several of the sublayer structures in the aforementioned binder-conforming layer is trapezoidal. For example, as illustrated in fig. 4, the aforementioned trapezoidal shape may be constituted only by the cross section of the second functional sub-layer 222. Alternatively, the side edges of the multiple sublayer structures shown in fig. 4 may together form the two side waists of a trapezoid according to further embodiments of the present invention.
According to an embodiment of the invention, the support sublayer and the functional sublayer have a first adhesive structure therebetween, and the binding composite layer comprises a plurality of functional sublayers. In some preferred embodiments, the two opposite surfaces of the support sub-layer are provided with functional sub-layers, and the side of the functional sub-layer away from the support sub-layer is further provided with a second adhesive structure to realize the adhesion and fixation of the binding composite layer and other structures. For example, referring to fig. 5 and 7, the second adhesive structure may include the first and third adhesive layers. Therefore, the performance of the display panel can be further improved. The specific composition, thickness and the like of the first adhesive structure and the second adhesive structure are not particularly limited as long as the adhesive fixing function can be realized. For example, the materials of the two can be the same or different, and can be respectively and independently selected from the group consisting of foam rubber and acrylic rubber. The thickness may be no greater than 50 microns.
For example, as shown in fig. 4, the binding composite layer may have a support sub-layer 210, and first adhesive structures 231 and 232 disposed at both sides of the support sub-layer. The support sub-layer 210 may have a first functional sub-layer 221 on a side thereof adjacent to the control chip (i.e., the third adhesive layer 900 shown in the figure), and a second functional sub-layer 222 on a side thereof adjacent to the display region of the display panel. And in order to realize the adhesive fixation of the bonding composite layer and other structures, a second adhesive structure, namely a third adhesive layer 900 (for fixing with a chip bonding area of the display panel) and a second adhesive layer 800 (for fixing with the back film 700), may be further provided at the outer sides of the first and second functional sub-layers. The material of the support sub-layer may be, as mentioned above, formed by a material including, but not limited to, PET, and the first adhesive structures 231 and 232, and the first and third adhesive layers may be formed by an adhesive material, such as a double-sided adhesive tape. The first and second functional sub-layers may be both heat conductive sub-layers, and are formed of metal or alloy, so as to improve the heat dissipation function of the bonding composite layer, for example, the bonding composite layer may be formed of metal or alloy including but not limited to Cu, Al, Ti, and the like, and the materials of the first and second functional sub-layers may be the same or different. For example, according to other embodiments of the present invention, one of the first and second functional sub-layers may be formed of an inorganic thermally conductive material, such as graphite, and the other may be a metal or an alloy. For example, the first functional sub-layer 221 may be formed of graphite, and in order to prevent the problem that the layered structure of the graphite falls off during use and falls on other circuits or conductive contacts such as terminals to cause short circuit, a waterproof adhesive or other structures may be covered on one side or both sides of the first functional sub-layer 221 to prevent the graphite from being exposed. The second functional sub-layer 222 may be formed using a metal, such as a Cu sheet, an Al sheet, or the like. According to other embodiments of the present invention, the positions of the graphite-formed functional sub-layer and the metal-formed functional sub-layer may be interchanged.
Alternatively, according to other embodiments of the present invention, one of the first and second functional sub-layers may be a buffer sub-layer, and the other may be a heat conductive sub-layer. In particular, the second functional sub-layer 222 facing the display region side of the display panel may be a buffer sub-layer formed of a polymer material having a buffering capacity including, but not limited to, foam. The first functional sub-layer 221 facing the control chip may be a thermal conductive sub-layer, and is formed of the inorganic material (such as graphite) with a heat dissipation function, or a metal, an alloy, or the like.
In yet another aspect of the present invention, a display device is provided. The display device comprises the display panel described above. Therefore, the display device has all the features and advantages of the display panel, and the description thereof is omitted. In general, the display device can realize the functions of folding and rolling sliding and has better impact resistance.
The scheme of the invention will be explained with reference to the examples. It will be appreciated by those skilled in the art that the following examples are illustrative of the invention only and should not be taken as limiting the scope of the invention. The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products commercially available.
Preparing a binding composite layer:
example 1
The support sub-layer is made of a PET film, glue layers are arranged on two sides of the PET film, the first functional sub-layer is made of a Cu sheet, and the second functional sub-layer is made of foam.
Example 2
The support sub-layer is made of foam, glue layers are arranged on two sides of the foam, the first functional sub-layer is made of Al sheets, and the second functional sub-layer is omitted (the side close to the display area).
Falling ball impact test:
the bonding composite layers formed in example 1 and example 2 were combined with the display panel 100 to form a test sample in which the cover film layer 400 was made of a flexible material, in the structure as shown in fig. 7. The falling ball impact conditions were as follows:
falling ball mass m is 36.25g
Diameter of the pellet: phi 20mm
Height of falling ball: 10mm
The test results show that no impact marks such as dents occur on the side of the cover plate film layer 400 containing the test samples of example 1 and example 2. Therefore, the bonding composite layer provided by the embodiment of the invention can effectively alleviate the defect of poor impact resistance of the display panel of the flexible cover plate film layer.
In the description herein, references to the description of "one embodiment," "another embodiment," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction. In addition, it should be noted that the terms "first" and "second" in this specification are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (10)
1. A display panel, comprising:
the display substrate is provided with a display area, a bending area and a chip binding area, the bending area is arranged on one side of the display area and bends towards the side away from the light emitting side of the display area, and the chip binding area is connected with the display area through the bending area;
the control chip is positioned on the chip binding area and positioned on one side of the chip binding area, which is deviated from the light emitting side of the display area;
the binding composite layer is positioned between the bending area and the display area and at least comprises a support sub-layer and a function sub-layer, and the function sub-layer is arranged towards one side of the control chip.
2. The display panel of claim 1, wherein the support sublayer satisfies at least one of the following conditions:
the hardness of the support sub-layer is greater than that of the rubber material;
the support sub-layer is selected from at least one of PET, inorganic carbon material, and ceramic.
3. The display panel of claim 1, wherein the functional sub-layer comprises at least one of the following structures:
a heat conducting sublayer, wherein the material forming the heat conducting sublayer comprises graphite and at least one of Cu and Al;
and the buffer sublayer is formed by a material comprising a high polymer material with elasticity.
4. The display panel of claim 3, wherein the buffer sub-layer is located on a side of the support sub-layer facing away from the control chip.
5. The display panel according to claim 3, wherein a first adhesive structure is provided between the support sub-layer and the functional sub-layer, the binding composite layer comprises a plurality of functional sub-layers, and the functional sub-layer is provided on both surfaces of the support sub-layer opposite to each other, and a second adhesive structure is further provided on a side of the functional sub-layer away from the support sub-layer.
6. The display panel according to claim 1, wherein the bending region is located on a side of a first edge of the display substrate, the display panel has a second edge connected to the first edge, and the bonding composite layer has a step structure in a longitudinal section along the side of the second edge.
7. The display panel according to claim 1, wherein the bending region is located on a side of a first edge of the display substrate, the display panel has a second edge connected to the first edge, and the bonding composite layer has a trapezoidal shape in a longitudinal section along the side of the second edge.
8. The display panel according to any one of claims 1 to 7, further comprising a cover film layer, wherein the cover film layer is located on the light-emitting side of the display substrate and covers at least the display region, and a material forming the cover film layer is a polymer material.
9. The display panel of claim 8, further comprising at least one of the following structures:
the back film is positioned on one side of the display panel, which is far away from the light emergent side, and the orthographic projection of the back film on the display substrate and the bending area are not overlapped;
the first adhesive layer is positioned on one side, away from the display panel, of the back film;
the reinforcing support layer is positioned on one side, away from the back membrane, of the bonding layer and is in contact with the binding composite layer;
the polaroid is positioned on the light emitting side of the display panel;
and the second bonding layer is positioned on one side of the polaroid, which deviates from the light emergent side, and is in contact with the cover plate film layer.
10. A display device characterized by comprising the display panel according to any one of claims 1 to 9.
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| JP2003167230A (en) * | 2001-11-29 | 2003-06-13 | Sharp Corp | Display device, and method for manufacturing the same |
| CN111462634A (en) * | 2020-05-14 | 2020-07-28 | 京东方科技集团股份有限公司 | Display device |
| CN112634764A (en) * | 2021-01-06 | 2021-04-09 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN113658517A (en) * | 2021-09-18 | 2021-11-16 | 京东方科技集团股份有限公司 | Display module, assembly method thereof and display device |
| WO2022056995A1 (en) * | 2020-09-15 | 2022-03-24 | 武汉华星光电半导体显示技术有限公司 | Display apparatus |
| CN114333597A (en) * | 2022-01-07 | 2022-04-12 | 京东方科技集团股份有限公司 | Display module and display device |
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| JP2003167230A (en) * | 2001-11-29 | 2003-06-13 | Sharp Corp | Display device, and method for manufacturing the same |
| CN111462634A (en) * | 2020-05-14 | 2020-07-28 | 京东方科技集团股份有限公司 | Display device |
| WO2022056995A1 (en) * | 2020-09-15 | 2022-03-24 | 武汉华星光电半导体显示技术有限公司 | Display apparatus |
| CN112634764A (en) * | 2021-01-06 | 2021-04-09 | 武汉华星光电半导体显示技术有限公司 | Display device |
| CN113658517A (en) * | 2021-09-18 | 2021-11-16 | 京东方科技集团股份有限公司 | Display module, assembly method thereof and display device |
| CN114333597A (en) * | 2022-01-07 | 2022-04-12 | 京东方科技集团股份有限公司 | Display module and display device |
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