CN114729459A - Chemical polishing agent and chemical polishing method - Google Patents
Chemical polishing agent and chemical polishing method Download PDFInfo
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- CN114729459A CN114729459A CN202080080247.2A CN202080080247A CN114729459A CN 114729459 A CN114729459 A CN 114729459A CN 202080080247 A CN202080080247 A CN 202080080247A CN 114729459 A CN114729459 A CN 114729459A
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- chemical polishing
- water
- polishing agent
- alkali metal
- aluminum
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/36—Alkaline compositions for etching aluminium or alloys thereof
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/02—Light metals
Abstract
The invention provides a novel chemical polishing agent and a chemical polishing method. Specifically disclosed is a chemical polishing agent for aluminum or aluminum alloys, which comprises (A) water, (B) an alkali metal salt, and (C) a water-soluble organic solvent or a sugar alcohol having 4-9 hydroxyl groups, wherein the mass ratio of the alkali metal salt to the water (alkali metal salt/water) is 0.075 or more. Also provided is a chemical polishing method for aluminum or an aluminum alloy, comprising a step of immersing the aluminum or the aluminum alloy in a chemical polishing agent for aluminum or the aluminum alloy, which agent comprises (A) water, (B) an alkali metal salt, and (C) a water-soluble organic solvent or a sugar alcohol having 4 to 9 hydroxyl groups, wherein the mass ratio of the alkali metal salt to the water (alkali metal salt/water) is 0.075 or more.
Description
Technical Field
The present invention relates to a chemical polishing agent for aluminum or aluminum alloy and a chemical polishing method.
Background
Aluminum or aluminum alloys are processed to produce a wide variety of articles. Since an oxide film is formed on the surface of aluminum or the like, an etching treatment is performed to remove the oxide film. As a chemical polishing method for aluminum or an aluminum alloy, a method using an acidic polishing agent containing phosphoric acid is mainstream (patent documents 1 and 2).
Hitherto, in order to enhance the discharge limitation of phosphorus and to improve the performance of a chemical polishing agent, a chemical polishing agent not mainly composed of phosphoric acid has been developed, but the performance (chemical polishing property and polishing property) is not satisfactory (patent documents 3 to 5).
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2002-187398
Patent document 2: japanese examined patent publication No. 55-44116
Patent document 3: japanese examined patent publication (Kokoku) No. 50-9732
Patent document 4: japanese examined patent publication No. 59-45756
Patent document 5: japanese examined patent publication (Kokoku) No. 5-30914
Disclosure of Invention
Technical problem to be solved by the invention
The purpose of the present invention is to provide a chemical polishing agent and a chemical polishing method which are excellent in chemical polishing properties and polishing properties for aluminum or an aluminum alloy.
Technical solution for solving technical problem
The present inventors have conducted extensive studies and, as a result, have found that the use of a chemical polishing agent comprising (a) water, (B) an alkali metal salt, and (C) a water-soluble organic solvent or a sugar alcohol having 4 to 9 hydroxyl groups can increase the glossiness of aluminum or an aluminum alloy and further improve the glossiness, and have completed the present invention.
The present invention includes, for example, the subject matters described in the following items.
The chemical polishing agent according to item 1 is a chemical polishing agent for aluminum or an aluminum alloy, comprising (A) water, (B) an alkali metal salt, and (C) a water-soluble organic solvent or a sugar alcohol having 4 to 9 hydroxyl groups, wherein the mass ratio of the alkali metal salt to the water (alkali metal salt/water) is 0.075 or more.
The chemical polishing agent according to claim 1, wherein the concentration of the alkali metal salt in the chemical polishing agent is 30g/L or more.
The chemical polishing agent according to item 1 or 2, wherein the volume ratio of the water to the water-soluble organic solvent (water: water-soluble organic solvent) is 10:90 to 90: 10.
The chemical polishing agent according to item 1 or 2, wherein the concentration of the sugar alcohol in the chemical polishing agent is 100g/L or more.
The chemical polishing agent according to any one of claims 1 to 4, wherein the alkali metal salt is an alkali metal hydroxide.
The chemical polishing agent according to any one of claims 1 to 5, wherein the water-soluble organic solvent is at least 1 selected from the group consisting of water-soluble organic solvents having 1 to 4 hydroxyl groups and polyglycerin.
The chemical polishing method according to item 7 is a chemical polishing method for aluminum or an aluminum alloy, including a step of immersing aluminum or an aluminum alloy in a chemical polishing agent for aluminum or an aluminum alloy, the chemical polishing agent for aluminum or an aluminum alloy containing (a) water, (B) an alkali metal salt, and (C) a water-soluble organic solvent or a sugar alcohol having 4 to 9 hydroxyl groups, wherein the mass ratio of the alkali metal salt to the water (alkali metal salt/water) is 0.075 or more.
The chemical polishing method according to item 7, wherein the chemical polishing agent has a concentration of the alkali metal salt of 30g/L or more.
The chemical polishing method according to item 7 or 8, wherein a volume ratio of the water to the water-soluble organic solvent (water: water-soluble organic solvent) is 10:90 to 90: 10.
The chemical polishing method according to item 7 or 8, wherein the chemical polishing agent has a sugar alcohol concentration of 100g/L or more.
The chemical polishing method according to any one of claims 7 to 10, wherein the alkali metal salt is an alkali metal hydroxide.
The chemical polishing method according to any one of claims 7 to 11, wherein the water-soluble organic solvent is at least 1 selected from the group consisting of water-soluble organic solvents having 1 to 4 hydroxyl groups and polyglycerin.
ADVANTAGEOUS EFFECTS OF INVENTION
The chemical polishing agent of the present invention is excellent in chemical polishing properties (also referred to as "polishing properties") for aluminum or an aluminum alloy. In addition, the chemical polishing method of the present invention can impart excellent glitter to aluminum or an aluminum alloy.
Detailed Description
Hereinafter, the embodiments included in the present invention will be described in more detail.
1. Chemical abrasive
The chemical polishing agent of the present invention is characterized by comprising (A) water, (B) an alkali metal salt, (C) a water-soluble organic solvent or a sugar alcohol having 4 to 9 hydroxyl groups. Hereinafter, the chemical polishing slurry may be referred to as "the chemical polishing slurry of the present invention". Further, the chemical polishing agent is also sometimes referred to as a brightener.
The chemical polishing agent of the present invention contains (a) water, (B) an alkali metal salt, and (C) a water-soluble organic solvent or a sugar alcohol having 4 to 9 hydroxyl groups, and thus can promote the smoothing of the surface of aluminum or an aluminum alloy, and is excellent in chemical polishing properties (polishing properties) for aluminum or an aluminum alloy. Therefore, aluminum or an aluminum alloy treated with the chemical polishing agent of the present invention has excellent brightness.
Examples of the alkali metal salt (B) include alkali metal hydroxides such as sodium hydroxide, potassium hydroxide, and lithium hydroxide; alkali metal carbonates such as sodium carbonate, potassium carbonate, and lithium carbonate; and alkali metal bicarbonates such as sodium bicarbonate, potassium bicarbonate, and lithium bicarbonate. In addition, hydrates thereof are also possible. Among them, alkali metal hydroxides such as sodium hydroxide, potassium hydroxide, and lithium hydroxide are preferable in terms of excellent chemical polishing properties (polishing properties). The alkali metal salt (B) may be used alone in 1 kind, or in combination of 2 or more kinds.
The chemical polishing agent of the present invention contains (B) an alkali metal salt in a mass ratio (alkali metal salt/water) of 0.075 or more with respect to (a) water. If the above mass ratio is less than 0.075, the brightness is poor. The mass ratio is preferably 0.5 or more, and more preferably 0.7 or more. The mass ratio is preferably 1.0 or less, for example.
In the chemical polishing agent of the present invention, the concentration of (B) the alkali metal salt (alkali metal salt/water and water-soluble organic solvent) is preferably 30g/L or more. (B) The concentration of the alkali metal salt is preferably 200g/L or more, more preferably 280g/L or more. The upper limit is not particularly limited, and may be, for example, 1000g/L or less. (B) The concentration of the alkali metal salt is preferably 500g/L or less.
Examples of the water-soluble organic solvent (C) include water-soluble organic solvents having 1 to 4 hydroxyl groups, polyglycerols, and the like. The water-soluble organic solvent having 1 to 4 hydroxyl groups is not particularly limited as long as the number of hydroxyl groups is 1 to 4, and a known water-soluble organic solvent can be used. Examples thereof include monohydric alcohols such as methanol, ethanol, and 1-propanol; glycols such as ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, 1, 3-propanediol, and 1, 4-butanediol; trihydric alcohols such as glycerin; polyethylene glycol; polypropylene glycol; diglycerol, and the like. From the viewpoint of the properties of the chemical polishing agent (e.g., absence of separation, stability, etc.), the water-soluble organic solvent other than polyethylene glycol, polypropylene glycol, and polyglycerol is preferably one having, for example, 1 to 6 carbon atoms, more preferably 1 to 5 carbon atoms, and still more preferably 1 to 4 carbon atoms. In addition, the molecular weight of the polyethylene glycol is preferably about 200 to 400, more preferably about 200 to 300, from the viewpoint of the properties of the chemical polishing agent (e.g., absence of separation, stability, etc.). The molecular weight of the polyglycerol is preferably, for example, about 150 to 800, and more preferably about 150 to 350, from the viewpoint of the properties of the chemical polishing agent (e.g., absence of separation, stability, etc.). From the viewpoint of the properties of the chemical polishing agent (e.g., absence of separation, stability, etc.), the molecular weight of the polypropylene glycol is preferably, for example, about 130 to 700, and more preferably about 130 to 400. These may be used alone in 1 kind or in combination of 2 or more kinds.
(C) The sugar alcohol having 4 to 9 hydroxyl groups is not particularly limited as long as the number of hydroxyl groups is 4 to 9, and known sugar alcohols can be used. Examples thereof include sorbitol having 6 hydroxyl groups, xylitol having 5 hydroxyl groups, lactitol having 9 hydroxyl groups, and the like. The sugar alcohol is preferably one having 4 to 12 carbon atoms, and more preferably one having 4 to 6 carbon atoms, from the viewpoint of the properties of the chemical polishing agent (e.g., absence of separation, stability, etc.). These may be used alone in 1 kind or in combination of 2 or more kinds.
The volume ratio of (A) water to (C) a water-soluble organic solvent (water: water-soluble organic solvent) contained in the chemical polishing agent of the present invention is preferably 10:90 to 90: 10. The upper limit of the range may be, for example, 20:80, 30:70, 40:60, 50:50, 60:40, 70:30, or 80: 20. The lower limit of the range may be, for example, 20:80, 30:70, 40:60, 50:50, 60:40, 70:30, or 80: 20. For example, in the case of the blasting material (a1050, a5052, or the like), when the water-soluble organic solvent is ethylene glycol, the volume ratio of water to ethylene glycol is preferably 40: 60. For example, when the water-soluble organic solvent is glycerin, the volume ratio of water to glycerin is preferably 60: 40.
(C) The content of the water-soluble organic solvent is not particularly limited, and may be, for example, 100ml or more per 1L of the total amount of the (a) water and the (C) water-soluble organic solvent. (C) The content of the water-soluble organic solvent is preferably about 500 to 900ml, and more preferably about 600 to 800ml in the case of the blasting material (a1050, a5052, etc.). In the case of the water hair line material (A1050, etc.), it is preferably about 300 to 600ml, and more preferably about 400 to 500 ml. The upper limit is not particularly limited, and may be 900ml or less, for example.
In the chemical polishing agent of the present invention, the concentration of the sugar alcohol (C) (sugar alcohol/water and water-soluble organic solvent) is not particularly limited, and is preferably 100g/L or more. (C) The concentration of the sugar alcohol is more preferably 300g/L or more. The upper limit is not particularly limited, and may be, for example, 1000g/L or less. (C) The concentration of the sugar alcohol is preferably 700g/L or less.
(A) The content of water is not particularly limited, and may be, for example, 100ml or more per 1L of the total amount of (a) water and (C) water-soluble organic solvent. The water content is preferably about 100 to 500ml, and more preferably 200 to 400ml, in the case of a blasting material (A1050, A5052, etc.), for example. In the case of the water hair line material (A1050, etc.), it is preferably about 400 to 700ml, more preferably about 500 to 600 ml. The upper limit is not particularly limited, and may be 900ml or less, for example.
The chemical polishing agent of the present invention may contain other components such as a caking Inhibitor (Clinker Inhibitor) as necessary. Examples of the other components include organic acids such as tartaric acid and gluconic acid, salts thereof, and sorbitol. The chemical polishing agent of the present invention may or may not contain phosphorus.
The chemical polishing agent of the present invention is suitably used as a chemical polishing agent for aluminum or aluminum alloys. The aluminum alloy is not particularly limited, and various aluminum-based alloys can be exemplified. Specific examples of the aluminum alloy include, for example, an alloy of a drawable material system represented by JIS-a 1-7 k series specified in JIS, a cast material represented by AC and ADC series, and various alloy groups of an aluminum body represented by a die cast material. As the aluminum or aluminum alloy, for example, aluminum or aluminum alloy subjected to a treatment such as a sand blast treatment or a water line treatment can be used.
2. Chemical polishing method
The present invention preferably includes a method for chemically polishing aluminum or an aluminum alloy, which comprises the step of immersing the aluminum or the aluminum alloy in a chemical polishing agent containing (a) water, (B) an alkali metal salt, and (C) a water-soluble organic solvent or a sugar alcohol having 4 to 9 hydroxyl groups. Hereinafter, the chemical polishing method may be referred to as "the chemical polishing method of the present invention". In addition, the chemical polishing method is also sometimes referred to as a brightening method.
The chemical polishing method of the present invention can chemically polish (polish) aluminum or an aluminum alloy by immersing the aluminum or the aluminum alloy in a chemical polishing agent for aluminum or the aluminum alloy containing (a) water, (B) an alkali metal salt, and (C) a water-soluble organic solvent or a sugar alcohol having 4 to 9 hydroxyl groups, and can impart a desired polishing property to the aluminum or the aluminum alloy. Therefore, the aluminum or aluminum alloy treated by the chemical polishing method of the present invention is excellent in the brightness.
The chemical polishing agent can be applied as described in the above 1.
In the step of immersing the aluminum or aluminum alloy in the chemical polishing agent, the chemical polishing agent may be stirred or the aluminum or aluminum alloy may be shaken, as necessary. The stirring method and the shaking method are not particularly limited, and conventionally known stirring methods and shaking methods can be performed.
In the step of immersing aluminum or an aluminum alloy in the chemical polishing agent, the bath temperature of the chemical polishing agent can be appropriately adjusted. For example, the temperature can be 40 to 80 ℃ or 40 to 60 ℃.
In the step of immersing the aluminum or aluminum alloy in the chemical polishing agent, the time for immersing the aluminum or aluminum alloy in the chemical polishing agent may be appropriately set according to the desired degree of brightness. For example, 30 seconds to 30 minutes, 30 seconds to 5 minutes, and the like can be set.
By the chemical polishing treatment of the present invention, the film thickness of the dissolved aluminum or aluminum alloy (dissolved film thickness) can be appropriately adjusted depending on the material of the aluminum or aluminum alloy to be subjected to the chemical polishing treatment, the purpose of use after the chemical polishing treatment, and the like. For example, about 5 to 25 μm can be exemplified in the case of A1050 (sandblasting material), and about 1 to 5 μm can be exemplified in the case of A7075.
The gloss was evaluated by measuring the gloss with a gloss meter (GMX-202, manufactured by color technology research, Kyowa K.K.). The higher the value of the gloss, the higher the gloss. The higher the glossiness, the more excellent the chemical polishing property (polishing property) of the chemical polishing agent. The gloss can be appropriately adjusted depending on the material of the aluminum or aluminum alloy to be subjected to the chemical polishing treatment, the purpose of use after the chemical polishing treatment, and the like. For example, in the case of A1050 (sandblasting material), when the dissolved film thickness is about 5 to 25 μm, the glossiness is preferably 50 or more. In the case of A7075, the gloss is preferably 400 or more when the dissolved film thickness is about 1 to 5 μm.
The chemical polishing method of the present invention may include a degreasing step before the step of immersing the aluminum or aluminum alloy in the chemical polishing agent. The purpose of the degreasing treatment is, for example, to remove dirt and oil adhering to the surface of aluminum. The degreasing method is not particularly limited, and a known degreasing method can be performed.
The chemical polishing method of the present invention may further include an etching treatment step before the step of immersing the aluminum or the aluminum alloy in the chemical polishing agent. The purpose of the etching treatment is, for example, to remove a natural oxide film formed on the surface of aluminum. The etching method is not particularly limited, and a conventionally known etching method can be performed.
The chemical polishing method of the present invention may include a desmear treatment after the etching treatment and/or the chemical polishing treatment. The purpose of the desmear treatment is, for example, to remove dirt generated by etching or chemical polishing. The desmear treatment method is not particularly limited, and a conventionally known desmear treatment method can be performed.
Examples
The present invention will be described in detail with reference to the following examples and comparative examples. However, the present invention is not limited to these examples. Hereinafter, the experiments were carried out under atmospheric pressure and normal temperature conditions, except for the case where specifically mentioned. In addition, "%" means "% by mass" unless otherwise mentioned. The amounts of the components shown in the tables are "mass%" unless otherwise specified.
An aluminum test piece (blast-processed a1050) used in the following examples and comparative examples was prepared under the following conditions.
Degreasing was performed with Top ADD-100 (manufactured by Olympic pharmaceutical industries, Ltd.) at 55 ℃ for 2 minutes. The etching treatment after the degreasing treatment was carried out at 55 ℃ for 30 seconds with 100g/L of sodium hydroxide and 5ml/L of Alsatin SK (manufactured by Orye pharmaceutical industries Co., Ltd.). Further, desmutting treatment is performed after the etching treatment and after the chemical polishing treatment. The decontamination treatment is carried out at 20 to 25 ℃ for 1 to 2 minutes using Top Desmut N-20 (manufactured by Oye pharmaceutical industries Co., Ltd.).
Comparative examples 1 to 2
The test piece subjected to the degreasing treatment and the etching treatment by the above-described method was immersed in a chemical polishing agent containing sodium hydroxide as an alkali metal salt and water, and subjected to a chemical polishing treatment. The bath temperature of the chemical polishing agent was set at 55 ℃. Table 1 shows the contents of sodium hydroxide and water contained in the chemical polishing agent and the immersion time of the test piece in the chemical polishing agent.
Analytical method (thickness of dissolved film, dissolution speed and gloss)
The weight of the test piece before and after the chemical polishing treatment was measured, and the thickness (μm) of the dissolved film and the dissolution rate (μm/min) were calculated from the weight difference and the specific gravity of aluminum. The gloss was measured by a gloss meter (GMX-202, manufactured by COLOUR TECHNOLOGY, KONKOMU CORPORATION). The results are also shown in table 1. The glossiness of the test piece subjected to only the degreasing treatment or the etching treatment is shown in table 1 as reference examples 1 and 2. Since the glossiness is increased with the increase in the thickness of the dissolved film, the performances of the chemical polishing agents were compared by comparing the glossiness of the test pieces having the same thickness of the dissolved film (particularly, the thickness of the dissolved film of about 15 to 25 μm).
[ Table 1]
As shown in table 1, in the case where the water-soluble organic solvent and the sugar alcohol were not contained, no significant increase in the glossiness was observed even when the amount of sodium hydroxide contained in the chemical polishing agent was changed.
(examples 1 to 6)
The test piece subjected to the degreasing treatment and the etching treatment by the above-described method was immersed in a chemical polishing agent containing sodium hydroxide as an alkali metal salt, ethylene glycol having 2 hydroxyl groups as a water-soluble organic solvent, and water, and subjected to a chemical polishing treatment. The bath temperature during the chemical polishing treatment was set at 55 ℃. Table 2 shows the contents of sodium hydroxide, ethylene glycol, and water contained in the chemical polishing agent, and the immersion time of the test piece in the chemical polishing agent. The results obtained by the analysis according to the above analysis method are also shown in table 2.
[ Table 2]
It is known that gloss can be obtained by treatment with a chemical polishing agent containing a water-soluble organic solvent (ethylene glycol). It is also found that the gloss is increased by increasing the amount of the water-soluble organic solvent (ethylene glycol) (examples 1 to 4). Further, from the results of examples 3 and 5 or examples 2 and 6, it is understood that the gloss is increased as the amount of sodium hydroxide contained in the chemical polishing agent is increased.
(examples 7 and 8, comparative example 3)
The test pieces subjected to the chemical polishing treatment by the same method as in examples 1 to 6 were evaluated. Table 3 shows the contents of sodium hydroxide, ethylene glycol, and water contained in the chemical polishing agent, and the immersion time of the test piece in the chemical polishing agent.
[ Table 3]
It is found that when water and a water-soluble organic solvent are used in combination, the gloss is increased as the amount of sodium hydroxide is increased. Further, it was found that when the concentration of sodium hydroxide was 25g/L, the increase rate of the gloss was small even if the dipping time was prolonged (comparative example 3). From the results of comparative examples 2 and 3, it was found that when the concentration of sodium hydroxide was 25g/L, the difference in gloss was not observed depending on the presence or absence of the organic solvent, and therefore, when the concentration of sodium hydroxide in the chemical polishing agent was 25g/L or less, the shine imparted thereto was insufficient.
(examples 9 to 11)
The test piece subjected to the degreasing treatment and the etching treatment by the above-described method was immersed in a chemical polishing agent containing sodium hydroxide as an alkali metal salt, polyethylene glycol-200 (average molecular weight 200) having 2 hydroxyl groups as a water-soluble organic solvent, and water, and subjected to a chemical polishing treatment. Wherein the bath temperature during the chemical polishing treatment is set to 55 ℃ or 80 ℃. Table 4 shows the contents of sodium hydroxide, polyethylene glycol-200 and water contained in the chemical polishing agent, the immersion time of the test piece in the chemical polishing agent and the bath temperature. The results obtained by the analysis according to the above analysis method are also shown in table 4.
[ Table 4]
It is found that gloss can be obtained by using polyethylene glycol-200 having 2 hydroxyl groups as a water-soluble organic solvent, similarly to ethylene glycol.
Example 12 to 31
The test piece was evaluated by performing chemical polishing treatment in the same manner as in examples 9 to 11. Among them, as the water-soluble organic solvent, diethylene glycol, 1, 3-propanediol, 1, 4-butanediol, dipropylene glycol, glycerin, diglycerin, polyglycerin (average molecular weight 310), and polypropylene glycol (average molecular weight 300) were used in place of polyethylene glycol-200. The contents of sodium hydroxide, a water-soluble organic solvent and water contained in the chemical polishing agent, the immersion time of the test piece in the chemical polishing agent and the bath temperature are shown in tables 5 to 12.
[ Table 5]
[ Table 6]
[ Table 7]
[ Table 8]
[ Table 9]
[ Table 10]
[ Table 11]
[ Table 12]
It is known that diethylene glycol, polypropylene glycol, 1, 3-propanediol, 1, 4-butanediol, and dipropylene glycol are used as water-soluble organic solvents having 2 hydroxyl groups; glycerin as a water-soluble organic solvent having 3 hydroxyl groups; diglycerin as a water-soluble organic solvent having 4 hydroxyl groups; in the case of polyglycerin, gloss can be obtained.
It is also found that when methanol, ethanol, or 1-propanol, which is a water-soluble organic solvent having 1 hydroxyl group, is used as the water-soluble organic solvent, gloss can be obtained. On the other hand, it is known that when DMSO which is a water-soluble organic solvent having no hydroxyl group is used, phase separation occurs in the presence of sodium oxide, and it is difficult to perform experiments and practical use.
(example 32)
The test piece subjected to the degreasing treatment and the etching treatment by the above-described method was immersed in a chemical polishing agent containing sodium hydroxide as an alkali metal salt, sorbitol as a sugar alcohol, and water, and subjected to a chemical polishing treatment. The bath temperature during the chemical polishing treatment was set at 70 ℃. Table 13 shows the contents of sodium hydroxide, sorbitol, and water contained in the chemical polishing agent, and the immersion time of the test piece in the chemical polishing agent. The results of the analysis by the above analysis method are also shown in table 13.
[ Table 13]
It is known that gloss can be obtained by treatment with a chemical polishing agent containing sorbitol as a sugar alcohol having 6 hydroxyl groups.
(examples 33 to 37, comparative examples 4 to 5)
The test piece was evaluated by performing chemical polishing treatment in the same manner as in example 32. In these examples, lactitol and xylitol were used as sugar alcohols instead of sorbitol. In addition, glucose and carboxymethyl cellulose sodium salt (not sugar alcohol) were used instead of sugar alcohol for comparison. The contents of sodium hydroxide, sugar alcohol, glucose and water contained in the chemical polishing agent and the immersion time of the test piece in the chemical polishing agent are shown in tables 14 to 16.
It is found that gloss can be obtained by treatment with a chemical polishing agent containing lactitol which is a sugar alcohol having 9 hydroxyl groups or xylitol which is a sugar alcohol having 5 hydroxyl groups. It is also known that by increasing the amount of sugar alcohol, the glossiness is increased. In addition, when glucose is used, carbonization occurs, and thus it is found that it is difficult to put it into practical use. In addition, even in the case of using carboxymethyl cellulose sodium salt, no significant increase in glossiness was observed.
[ Table 14]
[ Table 15]
[ Table 16]
(examples 38 and 39 and comparative examples 6 and 7)
The test piece subjected to the degreasing treatment and the etching treatment by the above-described method was immersed in a chemical polishing agent containing potassium hydroxide or lithium hydroxide 1 hydrate as an alkali metal salt, ethylene glycol as a water-soluble organic solvent, and water, and subjected to a chemical polishing treatment. The bath temperature during the chemical polishing treatment was set at 55 ℃. The contents of potassium hydroxide or lithium hydroxide 1 hydrate, ethylene glycol and water contained in the chemical polishing agent and the immersion time of the test piece in the chemical polishing agent are shown in tables 17 and 18, respectively. The results obtained by the analysis according to the above analysis method are shown in tables 17 and 18.
[ Table 17]
[ Table 18]
It was confirmed that when potassium hydroxide and lithium hydroxide-1 hydrate were used as the alkali metal salt in place of sodium hydroxide, the gloss was also increased by using water and a water-soluble organic solvent in combination.
Examples 40 to 46, reference examples 3 to 8
The test piece was evaluated by performing chemical polishing treatment under the same conditions as in example 5. Table 19 shows the contents of sodium hydroxide, ethylene glycol, and water contained in the chemical polishing agent, and the immersion time of the test piece in the chemical polishing agent. Further, the effects of differences in the material of the test piece were confirmed using a1050 processed by water spray line, a5052 processed by blast line, or a raw a7075 instead of a1050 processed by blast processing of the test piece, and the results are shown in tables 20 to 22. The contents of sodium hydroxide, ethylene glycol and water contained in the chemical polishing agent and the immersion time of the test piece in the chemical polishing agent are shown in tables 20 to 22. The gloss of the test pieces subjected only to the degreasing treatment or the etching treatment is shown in tables 20 to 22 as reference examples 3 to 8.
[ Table 19]
[ Table 20]
[ Table 21]
[ Table 22]
From the results of examples 40 to 46, it is understood that the chemical polishing agent containing water, an alkali metal salt and a water-soluble organic solvent can impart a glitter to aluminum or an aluminum alloy regardless of the type of aluminum or an aluminum alloy and the method of processing the aluminum or the aluminum alloy.
Comparative examples 8 to 11
The test piece subjected to the degreasing treatment and the etching treatment by the above-described method was immersed in a chemical polishing agent containing 98% sulfuric acid and ethylene glycol as a water-soluble organic solvent to perform a chemical polishing treatment. Wherein the bath temperature during the chemical polishing treatment was set at 80 ℃. Table 23 shows the contents of 98% sulfuric acid and ethylene glycol contained in the chemical polishing agent, and the immersion time of the test piece in the chemical polishing agent. Table 23 also shows the results of the analysis according to the above analysis method.
[ Table 23]
As shown in Table 23, it was found that the gloss was not increased by using 98% sulfuric acid in place of the alkali metal salt. In addition, even when 98% sulfuric acid and a water-soluble organic solvent were used in combination, no increase in glossiness was observed.
Claims (12)
1. A chemical abrasive, characterized in that:
which is a chemical polishing agent for aluminum or aluminum alloy comprising (A) water, (B) an alkali metal salt, and (C) a water-soluble organic solvent or a sugar alcohol having 4 to 9 hydroxyl groups,
the mass ratio of the alkali metal salt to the water (alkali metal salt/water) is 0.075 or more.
2. The chemical abrasive of claim 1, wherein:
in the chemical polishing agent, the concentration of the alkali metal salt is 30g/L or more.
3. The chemical abrasive according to claim 1 or 2, wherein:
the volume ratio of the water to the water-soluble organic solvent (water: water-soluble organic solvent) is 10: 90-90: 10.
4. The chemical abrasive according to claim 1 or 2, wherein:
in the chemical polishing agent, the concentration of the sugar alcohol is 100g/L or more.
5. The chemical polishing agent according to any one of claims 1 to 4, wherein:
the alkali metal salt is an alkali metal hydroxide.
6. The chemical polishing agent according to any one of claims 1 to 5, wherein:
the water-soluble organic solvent is more than 1 selected from water-soluble organic solvents with 1-4 hydroxyl groups and polyglycerol.
7. A chemical polishing method is characterized in that:
a chemical polishing method for aluminum or an aluminum alloy, comprising the step of immersing aluminum or an aluminum alloy in a chemical polishing agent for aluminum or an aluminum alloy,
the chemical polishing agent for aluminum or aluminum alloy comprises (A) water, (B) an alkali metal salt, and (C) a water-soluble organic solvent or a sugar alcohol having 4 to 9 hydroxyl groups,
the mass ratio of the alkali metal salt to the water (alkali metal salt/water) is 0.075 or more.
8. A chemical polishing method as defined in claim 7, wherein:
in the chemical polishing agent, the concentration of the alkali metal salt is 30g/L or more.
9. A chemical polishing method as claimed in claim 7 or 8, wherein:
the volume ratio of the water to the water-soluble organic solvent (water: water-soluble organic solvent) is 10: 90-90: 10.
10. The chemical polishing method according to claim 7 or 8, wherein:
in the chemical polishing agent, the concentration of the sugar alcohol is 100g/L or more.
11. The chemical polishing method according to any one of claims 7 to 10, wherein:
the alkali metal salt is an alkali metal hydroxide.
12. The chemical polishing method as claimed in any one of claims 7 to 11, wherein:
the water-soluble organic solvent is more than 1 selected from water-soluble organic solvents with 1-4 hydroxyl groups and polyglycerol.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2019210612 | 2019-11-21 | ||
| JP2019-210612 | 2019-11-21 | ||
| PCT/JP2020/038853 WO2021100369A1 (en) | 2019-11-21 | 2020-10-15 | Chemical polishing agent and chemical polishing method |
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| CN114729459A true CN114729459A (en) | 2022-07-08 |
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| JP (1) | JPWO2021100369A1 (en) |
| CN (1) | CN114729459A (en) |
| WO (1) | WO2021100369A1 (en) |
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| WO2021100369A1 (en) | 2021-05-27 |
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