CN114724985A - Packaging transmission control system of photovoltaic module chip - Google Patents
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Abstract
The invention discloses a packaging transmission control system of a photovoltaic module chip, which belongs to the technical field of chip packaging and comprises a packaging module, a detection module and a server, wherein the packaging module and the detection module are in communication connection with the server; the server is also in communication connection with a tracking module, a data management module and an analysis module; the tracking module is used for tracking the packaging process of the chip and uploading the collected packaging monitoring data to the cloud for storage; the data management module is used for acquiring and managing data, acquiring analysis data and sending the analysis data to the analysis module; the analysis module is used for analyzing the received analysis data, and the specific method comprises the following steps: and setting a data extraction unit, wherein a data filling template is arranged in the data extraction unit, performing data extraction on the detection data through the data extraction unit, filling the extracted data into the data filling template, marking the data filling template filled with the data as the selected data, and performing coordinate transformation on the selected data.
Description
Technical Field
The invention belongs to the technical field of chip packaging, and particularly relates to a packaging transmission control system of a photovoltaic module chip.
Background
The photovoltaic module chip package is a shell for mounting a semiconductor integrated circuit chip, plays a role in placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit.
However, the existing photovoltaic module chip packaging can only detect whether the chip packaging is complete or not and whether the packaging is qualified or not, can not realize the subsequent precision improvement of the chip packaging, and still uses the original chip packaging method for packaging; the invention therefore provides a packaging transmission control system of a photovoltaic module chip, which is used for solving the problems.
Disclosure of Invention
In order to solve the problems existing in the scheme, the invention provides a packaging transmission control system of a photovoltaic module chip.
The purpose of the invention can be realized by the following technical scheme:
a packaging transmission control system of a photovoltaic module chip comprises a packaging module, a detection module and a server, wherein the packaging module and the detection module are in communication connection with the server; the server is also in communication connection with a tracking module, a data management module and an analysis module;
the tracking module is used for tracking the packaging process of the chip and uploading the collected packaging monitoring data to the cloud for storage; the data management module is used for carrying out data acquisition management, obtaining analysis data and sending the analysis data to the analysis module;
the analysis module is used for analyzing the received analysis data, and the specific method comprises the following steps:
setting a data extraction unit, wherein a data filling template is arranged in the data extraction unit, data extraction is carried out on the detection data through the data extraction unit, the extracted data is filled into the data filling template, the data filling template filled with the data is marked as selected data, and the selected data is coordinated to obtain matching coordinates;
establishing a reason analysis library, and inputting the matched coordinates into the reason analysis library to obtain corresponding unqualified reason classification data; and cutting the packaging monitoring data according to the unqualified reason classification data to obtain an analysis video, integrating the analysis video, the unqualified reason classification data and the selected data into analysis input data, establishing an analysis model, inputting the analysis input data into the analysis model to obtain packaging module adjustment data, and adjusting the packaging module according to the obtained packaging module adjustment data.
Further, the working method of the tracking module comprises the following steps:
setting a monitoring unit at a chip packaging position, monitoring the packaging process of a current chip in real time through the monitoring unit, and packaging monitoring data of the corresponding chip package by the monitoring unit after the chip package is finished, wherein the monitoring data is marked as package monitoring data;
the electronic tag device is arranged, an electronic tag is printed on a packaged chip through the electronic tag device, the packaged monitoring data corresponding to the packaged chip are matched, the matched packaged monitoring data are associated with the corresponding electronic tag, and the associated packaged monitoring data are uploaded to the cloud for storage.
Further, the working method of the data management module comprises the following steps:
acquiring detection data of a detection module on a packaged chip and a corresponding detection result in real time, wherein the detection result comprises qualified detection and unqualified detection; an electronic tag reading and writing device is arranged at the position where the packaged chip is detected, an electronic tag on the packaged chip is read through the electronic tag reading and writing device, corresponding packaged monitoring data are matched from a cloud according to the identified electronic tag, and when the detection result of the corresponding packaged chip is qualified, the matched packaged monitoring data are deleted from the cloud; and when the detection result of the corresponding packaged chip is unqualified, integrating the matched packaged monitoring data and the detection data of the corresponding packaged chip into analysis data.
Further, the working method of the data extraction unit comprises the following steps:
acquiring a large amount of unqualified detection data detected by a detection module, analyzing the acquired unqualified detection data, identifying unqualified detection items contained in the unqualified detection data, setting key words corresponding to the unqualified detection items, acquiring unqualified parameters corresponding to the key words, integrating a group of unqualified detection numbers, the key words and the corresponding unqualified parameters into training data, integrating a plurality of training data into a training set, and establishing an artificial intelligent model; training through a training set, and marking the successfully trained artificial intelligence model as an extraction model; and setting a data filling template according to the key words, and associating the data filling template with the output data of the extraction model.
Further, the method for establishing the reason analysis library comprises the following steps:
acquiring unqualified reasons of the chip package and selected data corresponding to the unqualified reasons, establishing a coordinate model, classifying the unqualified reasons, and acquiring unqualified reason classified data; establishing a first database, identifying the number of coordinate areas, setting a corresponding number of storage nodes in the first database according to the number of the coordinate areas, respectively storing unqualified reason classification data into each storage node, and associating the coordinate areas with the corresponding storage nodes; and storing the coordinate model into a first database, and marking the current first database as a reason analysis library.
Further, the method for establishing the coordinate model comprises the following steps:
and carrying out coordinate conversion on the selected data to form a range coordinate, marking the range coordinate with a corresponding unqualified reason label, setting a coordinate system, inputting the range coordinate into the coordinate system, integrating the range coordinates of the same unqualified reason label in the coordinate system to form a plurality of coordinate areas, marking the corresponding unqualified reason label, and integrating the coordinate system into a coordinate model.
Further, the working method of the reason analysis library comprises the following steps:
acquiring input matching coordinates in real time, inputting the acquired matching coordinates into a coordinate model, identifying a coordinate area where the matching coordinates are located, and matching corresponding unqualified reason classification data according to the identified coordinate area.
Further, the method for cutting the package monitoring data according to the unqualified reason classification data comprises the following steps:
the method comprises the steps of obtaining the packaging steps of chip packaging and the packaging actions corresponding to the packaging steps, establishing a video segmentation model according to the packaging steps and the corresponding packaging actions, identifying the packaging steps corresponding to unqualified reason classified data, obtaining packaging monitoring data needing segmentation, segmenting the packaging monitoring data, obtaining corresponding packaging monitoring videos according to the identified packaging steps, and marking the corresponding packaging monitoring videos as analysis videos.
Compared with the prior art, the invention has the beneficial effects that:
the packaging process of the chip is tracked through the tracking module, so that corresponding chip and packaging process data can be quickly found when detection is unqualified, subsequent data analysis is facilitated, and the phenomenon that a large amount of time is spent on finding the corresponding packaging process data due to too many packaged chips is avoided; by arranging the analysis module, the real-time adjustment of the packaging module in the subsequent production process is realized, and the packaging precision and the qualification rate of the packaging module are gradually improved; and classifying the unqualified reasons according to different coordinate areas, realizing the re-refinement of the unqualified reasons, reducing the corresponding range and facilitating the subsequent data analysis.
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In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic block diagram of the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, a packaging transmission control system of a photovoltaic module chip includes a packaging module, a detection module, a server, a tracking module, a data management module and an analysis module;
the packaging module, the detection module, the tracking module, the data management module and the analysis module are all in communication connection with the server;
the packaging module is used for packaging the chip, an existing chip packaging device can be directly used, the packaging module can adjust the packaging process according to needs, and the existing chip packaging device can adjust the packaging process according to subsequent needs.
The detection module is used for carrying out packaging detection after chip packaging, can directly use the existing chip packaging detection device to carry out detection, realizes the comprehensive utilization of the original chip packaging detection device of a manufacturer, and avoids the waste of resources.
The tracking module is used for tracking the packaging process of the chip, and the specific method comprises the following steps:
setting a monitoring unit at a chip packaging position, monitoring the packaging process of a current chip in real time through the monitoring unit, and after the chip packaging is finished, packaging monitoring data corresponding to the chip packaging by the monitoring unit, marking the monitoring data as packaging monitoring data, namely packaging process monitoring data of which one packaging monitoring data only comprises one chip;
setting an electronic tag device, such as an RFID tag device, printing an electronic tag, such as an RFID tag, on a packaged chip through the electronic tag device, matching the packaging monitoring data of the corresponding packaged chip, and associating the matched packaging monitoring data with the corresponding electronic tag, which means that the corresponding packaging monitoring data can be quickly found through the corresponding electronic tag; and uploading the associated packaging monitoring data to a cloud for storage.
The data management module is used for data acquisition management, and the specific method comprises the following steps:
acquiring detection data of a detection module on a packaged chip and a corresponding detection result in real time, wherein the detection result comprises qualified detection and unqualified detection; an electronic tag reading and writing device, such as an RFID tag reading and writing device, is arranged at the position where the detection of the packaged chip is carried out, the electronic tag reading and writing device can be arranged before, after or during the detection according to the detection process of the detection module, the electronic tag on the packaged chip is read through the electronic tag reading and writing device, corresponding packaged monitoring data are matched from the cloud end according to the identified electronic tag, and when the detection result of the corresponding packaged chip is qualified, the matched packaged monitoring data are deleted from the cloud end; and when the detection result of the corresponding packaged chip is unqualified, integrating the matched packaged monitoring data and the detection data of the corresponding packaged chip into analysis data, and sending the analysis data to the analysis module.
The analysis module is used for analyzing the received analysis data, and the specific method comprises the following steps:
setting a data extraction unit, wherein a data filling template is arranged in the data extraction unit, data extraction is carried out on the detection data through the data extraction unit, the extracted data is filled into the data filling template, the data filling template filled with the data is marked as refined data, and the refined data is coordinated to obtain matching coordinates;
establishing a reason analysis library, inputting the matched coordinates into the reason analysis library, and obtaining corresponding unqualified reason classification data; and cutting the packaging monitoring data according to the unqualified reason classification data to obtain an analysis video, integrating the analysis video, the unqualified reason classification data and the selected data into analysis input data, establishing an analysis model, inputting the analysis input data into the analysis model to obtain packaging module adjustment data, and adjusting the packaging module according to the obtained packaging module adjustment data.
The real-time adjustment of the encapsulation module in the subsequent production process is realized, and the encapsulation precision and the qualification rate of the encapsulation module are gradually improved.
The detailed data is converted into coordinates according to the items in the detailed data and the data of the corresponding items, and the specific conversion method is common knowledge in the art, so the detailed description is not given.
The working method of the data extraction unit comprises the following steps:
acquiring a large amount of detection data of the detection modules which detect unqualified detection data, analyzing the acquired unqualified detection data, identifying unqualified detection items contained in the unqualified detection data, setting key words corresponding to the unqualified detection items, acquiring unqualified parameters corresponding to the key words, integrating a group of unqualified detection numbers, the key words and the corresponding unqualified parameters into training data, integrating a plurality of training data into a training set, and establishing an artificial intelligence model; the artificial intelligence model comprises an error reverse propagation neural network, an RBF neural network and a deep convolution neural network; training through a training set, and marking the successfully trained artificial intelligence model as an extraction model; and setting a data filling template according to the key words, and associating the data filling template with the output data of the extraction model.
The filling of the template with the keyword setting data is an item using the keyword as the template, and the specific setting method is common knowledge in the art, and therefore, detailed description thereof will not be given.
The association of the data filling template with the output data of the extraction model is that the output data of the extraction model is associated with the corresponding item in the data filling template through the corresponding keyword, and the association is used for quickly filling the output data of the extraction model into the data filling template in the follow-up process.
The detailed implementation method for analyzing the obtained failure detection data and identifying the failed detection items contained in the failure detection data is common knowledge in the art, and therefore, detailed description thereof is omitted.
The method for establishing the reason analysis library comprises the following steps:
acquiring unqualified reasons of the chip package and selected data corresponding to the unqualified reasons, establishing a coordinate model, classifying the unqualified reasons, and acquiring unqualified reason classified data; establishing a first database, identifying the number of coordinate areas, setting a corresponding number of storage nodes in the first database according to the number of the coordinate areas, respectively storing unqualified reason classification data into each storage node, and associating the coordinate areas with the corresponding storage nodes; and storing the coordinate model into a first database, and marking the current first database as a reason analysis library.
The method for establishing the coordinate model comprises the following steps:
and carrying out coordinate conversion on the selected data to form a range coordinate, marking the range coordinate with a corresponding unqualified reason label, setting a coordinate system, inputting the range coordinate into the coordinate system, integrating the range coordinates of the same unqualified reason label in the coordinate system to form a plurality of coordinate areas, marking the corresponding unqualified reason label, and integrating the coordinate system into a coordinate model.
The integration of coordinate systems into coordinate models is common knowledge in the art and will not be described in detail.
And classifying the unqualified reasons according to different coordinate areas, realizing the re-refinement of the unqualified reasons, reducing the corresponding range and facilitating the subsequent data analysis.
The working method of the reason analysis library comprises the following steps:
acquiring input matching coordinates in real time, inputting the acquired matching coordinates into a coordinate model, identifying a coordinate area where the matching coordinates are located, and matching corresponding unqualified reason classification data according to the identified coordinate area.
The method for cutting the packaging monitoring data according to the unqualified reason classification data comprises the following steps:
acquiring a packaging step of chip packaging and a packaging action corresponding to the packaging step, and establishing a video segmentation model according to the packaging step and the corresponding packaging action, wherein the video segmentation model is used for segmenting a packaged monitoring video into different single packaging action videos; and identifying the packaging step corresponding to the unqualified reason classification data, acquiring the packaging monitoring data needing to be segmented, segmenting the packaging monitoring data, acquiring the corresponding packaging monitoring video according to the identified packaging step, and marking the corresponding packaging monitoring video as an analysis video.
The method for establishing the video segmentation model according to the encapsulation step and the corresponding encapsulation action is established based on a CNN network or a DNN network, and the specific establishment method is common knowledge in the field, so detailed description is not given.
By dividing the packaged monitoring data, the data analysis amount after the data analysis can be greatly reduced, meanwhile, the influence caused by irrelevant data in the subsequent data analysis process can be removed in advance, and the accuracy and precision are improved.
The analysis model is established based on a CNN network or a DNN network, the training set comprises analysis input data and correspondingly set packaging module adjustment data, the packaging module adjustment data is obtained by analyzing problems in the packaging process according to analysis videos, unqualified reason classification data and selected data by an expert group, and the corresponding packaging module adjustment data is set according to the analyzed analysis; the specific analytical model building and training process is common knowledge in the art and therefore will not be described in detail.
The working principle of the invention is as follows: the tracking module tracks the packaging process of the chip and uploads the collected packaging monitoring data to the cloud for storage; the data management module is used for acquiring and managing data, acquiring analysis data and sending the analysis data to the analysis module; the analysis module analyzes the received analysis data and is provided with a data extraction unit, a data filling template is arranged in the data extraction unit, the data extraction unit extracts the detection data, the extracted data is filled into the data filling template, the data filling template filled with the data is marked as the selected data, and the selected data is coordinated to obtain matched coordinates; establishing a reason analysis library, and inputting the matched coordinates into the reason analysis library to obtain corresponding unqualified reason classification data; and cutting the packaging monitoring data according to the unqualified reason classification data to obtain an analysis video, integrating the analysis video, the unqualified reason classification data and the selected data into analysis input data, establishing an analysis model, inputting the analysis input data into the analysis model to obtain packaging module adjustment data, and adjusting the packaging module according to the obtained packaging module adjustment data.
Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present invention.
Claims (8)
1. A packaging transmission control system of a photovoltaic module chip comprises a packaging module, a detection module and a server, wherein the packaging module and the detection module are in communication connection with the server; the system is characterized in that the server is also in communication connection with a tracking module, a data management module and an analysis module;
the tracking module is used for tracking the packaging process of the chip and uploading the collected packaging monitoring data to the cloud for storage; the data management module is used for carrying out data acquisition management, obtaining analysis data and sending the analysis data to the analysis module;
the analysis module is used for analyzing the received analysis data, and the specific method comprises the following steps:
setting a data extraction unit, wherein a data filling template is arranged in the data extraction unit, data extraction is carried out on the detection data through the data extraction unit, the extracted data is filled into the data filling template, the data filling template filled with the data is marked as refined data, and the refined data is coordinated to obtain matching coordinates;
establishing a reason analysis library, inputting the matched coordinates into the reason analysis library, and obtaining corresponding unqualified reason classification data; cutting the packaging monitoring data according to the unqualified cause classification data to obtain an analysis video, integrating the analysis video, the unqualified cause classification data and the carefully selected data into analysis input data, establishing an analysis model, inputting the analysis input data into the analysis model to obtain packaging module adjustment data, and adjusting the packaging module according to the obtained packaging module adjustment data.
2. The system of claim 1, wherein the tracking module comprises:
setting a monitoring unit at a chip packaging position, monitoring the packaging process of a current chip in real time through the monitoring unit, and packaging monitoring data of the corresponding chip package by the monitoring unit after the chip package is finished, wherein the monitoring data is marked as package monitoring data;
the electronic tag device is arranged, an electronic tag is printed on a packaged chip through the electronic tag device, the packaged monitoring data corresponding to the packaged chip are matched, the matched packaged monitoring data are associated with the corresponding electronic tag, and the associated packaged monitoring data are uploaded to the cloud for storage.
3. The system of claim 1, wherein the data management module comprises:
acquiring detection data of a detection module on a packaged chip and a corresponding detection result in real time, wherein the detection result comprises qualified detection and unqualified detection; an electronic tag reading and writing device is arranged at the position where the packaging chip is detected, the electronic tag on the packaging chip is read through the electronic tag reading and writing device, corresponding packaging monitoring data are matched from a cloud according to the identified electronic tag, and when the detection result of the corresponding packaging chip is qualified, the matched packaging monitoring data are deleted from the cloud; and when the detection result of the corresponding packaged chip is unqualified, integrating the matched packaged monitoring data and the detection data of the corresponding packaged chip into analysis data.
4. The system of claim 1, wherein the data extraction unit is operable to:
acquiring a large amount of detection data of the detection modules which detect unqualified detection data, analyzing the acquired unqualified detection data, identifying unqualified detection items contained in the unqualified detection data, setting key words corresponding to the unqualified detection items, acquiring unqualified parameters corresponding to the key words, integrating a group of unqualified detection numbers, the key words and the corresponding unqualified parameters into training data, integrating a plurality of training data into a training set, and establishing an artificial intelligence model; training through a training set, and marking the successfully trained artificial intelligence model as an extraction model; and setting a data filling template according to the key words, and associating the data filling template with the output data of the extraction model.
5. The system of claim 1, wherein the method for creating a causal analysis library comprises:
acquiring unqualified reasons of the chip package and selected data corresponding to the unqualified reasons, establishing a coordinate model, classifying the unqualified reasons, and acquiring unqualified reason classified data; establishing a first database, identifying the number of coordinate areas, setting a corresponding number of storage nodes in the first database according to the number of the coordinate areas, respectively storing unqualified reason classification data into each storage node, and associating the coordinate areas with the corresponding storage nodes; and storing the coordinate model into a first database, and marking the current first database as a reason analysis library.
6. The encapsulated transmission control system of photovoltaic module chips as claimed in claim 5, wherein said method of establishing a coordinate model comprises:
and carrying out coordinate conversion on the selected data to form a range coordinate, marking the range coordinate with a corresponding unqualified reason label, setting a coordinate system, inputting the range coordinate into the coordinate system, integrating the range coordinates of the same unqualified reason label in the coordinate system to form a plurality of coordinate areas, marking the corresponding unqualified reason label, and integrating the coordinate system into a coordinate model.
7. The system of claim 6, wherein the cause analysis library comprises:
acquiring input matching coordinates in real time, inputting the acquired matching coordinates into a coordinate model, identifying a coordinate area where the matching coordinates are located, and matching corresponding unqualified reason classification data according to the identified coordinate area.
8. The packaging transmission control system of the photovoltaic module chip as claimed in claim 1, wherein the method for clipping the packaging monitoring data according to the unqualified reason classification data comprises:
the method comprises the steps of obtaining the packaging steps of chip packaging and the packaging actions corresponding to the packaging steps, establishing a video segmentation model according to the packaging steps and the corresponding packaging actions, identifying the packaging steps corresponding to unqualified reason classification data, obtaining packaging monitoring data needing segmentation, segmenting the packaging monitoring data, obtaining corresponding packaging monitoring videos according to the identified packaging steps, and marking the corresponding packaging monitoring videos as analysis videos.
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