CN117334612A - Chip packaging method and system based on modularized design - Google Patents
Chip packaging method and system based on modularized design Download PDFInfo
- Publication number
- CN117334612A CN117334612A CN202311628205.XA CN202311628205A CN117334612A CN 117334612 A CN117334612 A CN 117334612A CN 202311628205 A CN202311628205 A CN 202311628205A CN 117334612 A CN117334612 A CN 117334612A
- Authority
- CN
- China
- Prior art keywords
- chip
- production
- packaging
- unit
- parameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 128
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 118
- 238000013461 design Methods 0.000 title claims abstract description 67
- 238000004519 manufacturing process Methods 0.000 claims abstract description 106
- 238000001514 detection method Methods 0.000 claims abstract description 34
- 238000010923 batch production Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims description 63
- 238000005457 optimization Methods 0.000 claims description 26
- 238000004458 analytical method Methods 0.000 claims description 21
- 238000012545 processing Methods 0.000 claims description 20
- 238000012858 packaging process Methods 0.000 claims description 10
- 238000005259 measurement Methods 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 238000003860 storage Methods 0.000 claims description 7
- 238000007726 management method Methods 0.000 claims description 6
- 238000012795 verification Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 230000007613 environmental effect Effects 0.000 claims description 4
- 238000004088 simulation Methods 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 claims 2
- 238000012423 maintenance Methods 0.000 abstract description 9
- 230000008901 benefit Effects 0.000 abstract description 5
- 230000006872 improvement Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 5
- 238000003032 molecular docking Methods 0.000 description 5
- 230000002950 deficient Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000003908 quality control method Methods 0.000 description 3
- 230000002159 abnormal effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000007405 data analysis Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000013439 planning Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000013524 data verification Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
- 238000012384 transportation and delivery Methods 0.000 description 1
- 238000010200 validation analysis Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Geometry (AREA)
- Evolutionary Computation (AREA)
- Architecture (AREA)
- Automation & Control Theory (AREA)
- General Factory Administration (AREA)
Abstract
The invention discloses a chip packaging method and a chip packaging system based on a modularized design, wherein the chip packaging system based on the modularized design comprises a control terminal module and further comprises the following components: the information acquisition module is used for acquiring parameter information of the packaging target chip and storing the parameter information into the memory; the device detection module is used for detecting the type, the model and the production capacity of the chip packaging devices and the position relation of each chip packaging device, and listing executable packaging procedures; the design module is used for matching the parameter information of the chip packaging equipment and the target chip and designing the process steps of packaging the target chip; and the debugging and optimizing module is used for optimizing the chip packaging equipment by changing one or more production parameters according to the production results of small-batch production and recording the production parameters and the production results optimized each time into the memory. The invention has the advantages of flexibility, high efficiency, convenient data sharing and maintenance, and convenient debugging.
Description
Technical Field
The invention belongs to the technical field of chip packaging, and particularly relates to a chip packaging method and system based on modular design.
Background
The invention discloses a modular design method and a modular design system for chip package, which relate to the technical field of chip package, in particular to a modular design method and a modular design system for chip package, and comprise the following steps: the control terminal is a main control terminal of the system and is used for sending out an execution command; the collection module is used for collecting attribute characteristics of the packaging target chip; the analysis module is used for analyzing the executable functions of the chip packaging equipment; the configuration module is used for acquiring the attribute characteristics of the packaging target chip stored in the storage unit and the executable functions of the chip packaging equipment analyzed in the analysis module, and adaptively configuring the attribute characteristics of the packaging target chip and the executable functions of the chip packaging equipment; the invention can be configured according to the attribute characteristics of the chip and the functions of the chip packaging equipment, and further generates the operation module of the chip packaging equipment according to the configuration, so that the operation of the chip packaging equipment is controlled by the generated operation module, and the requirements of the chip packaging equipment for packaging various different types of chips by intelligent control are met.
The problems with this prior art are: on one hand, the flexibility, the high efficiency and the convenience in data sharing and maintenance are deficient; on the other hand, when the processing requirement is changed, the debugging is not convenient and needs to be carried out again from the beginning.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a chip packaging method and system based on modular design, which have the advantages of flexibility, high efficiency, convenient data sharing and maintenance, and convenient debugging, and solve the problems in the prior art.
The invention is realized in such a way that the chip packaging system based on the modularized design comprises a control terminal module which is used as a main control end of the system and used for sending out an execution command and controlling the operation of the whole system, and the invention further comprises:
the information acquisition module is used for acquiring parameter information of the packaging target chip and storing the parameter information into the memory;
the device detection module is used for detecting the type, the model and the production capacity of the chip packaging devices and the position relation of each chip packaging device, and listing executable packaging procedures;
the design module is used for matching the parameter information of the chip packaging equipment and the target chip and designing the process steps of packaging the target chip;
the debugging and optimizing module changes one or more production parameters to optimize chip packaging equipment according to the production results of small-batch production, and records the production parameters and the production results optimized each time into the memory;
and the product detection module is used for detecting the quality of the product.
As a preferred embodiment of the present invention, the information acquisition module includes:
the sensor acquisition unit automatically acquires parameter information of the target chip through the sensor;
a measurement input unit for manually inputting parameter information of the target chip through the measurement device;
the parameter input unit is used for directly inputting the parameter information of the target chip and manually inputting the parameter information into the information acquisition module according to the detailed parameters provided by the target chip supplier;
the parameter processing unit is used for processing and verifying the acquired or input target chip parameters;
the storage unit is used for storing the processed target chip parameter information into the memory;
and the inquiring and managing unit is used for inquiring and managing the stored parameter information of the target chip, and a user is allowed to inquire and acquire the parameter information of the target chip according to specific conditions by providing a user interface or an interface, and perform management, backup or export operations.
As a preferred embodiment of the present invention, the parameter information of the target chip includes the following parameters: size and package type, pin configuration and number, heat dissipation requirements, electrical characteristics, environmental requirements, and reliability metrics.
As a preferred aspect of the present invention, the device detection module includes:
the device identification unit is used for identifying the type and the model of the chip packaging device;
the productivity detection unit is used for estimating the productivity of the equipment by recording the production period and the speed of the equipment and storing the productivity into the system for subsequent inquiry and analysis;
a positioning detection unit for detecting the positional relationship of the device;
the procedure matching unit is used for matching the executable packaging procedure according to the type, model and position relation of the equipment;
and the process standard unit is used for listing process standards matched with equipment and providing corresponding process parameter and process standard information required by processing precision according to equipment capacity and limiting conditions so as to ensure the quality and consistency of the packaging process.
Preferably, the design module comprises the following units:
the device parameter matching unit is used for matching the parameter information of the chip packaging device according to the capability of the device, the limiting condition and the requirement of the target chip;
the target chip parameter analysis unit is used for analyzing parameter information of the target chip;
the process design unit is used for designing proper process steps according to the equipment parameter matching result and the target chip parameter analysis result and combining the requirements of the packaging process;
the process verification unit is used for verifying the feasibility and effectiveness of the process design, verifying whether the designed process step meets the packaging requirement of the target chip through simulation or actual operation, and carrying out necessary adjustment and optimization;
the process step generating unit is used for generating process steps of the target chip package, converting the verified process design result into specific process steps, including process parameter setting and operation guidance, and storing for subsequent use.
As a preferred embodiment of the present invention, the debugging and optimizing module includes:
the production result analysis unit is used for analyzing the small batch production result, analyzing the production effect and evaluating whether the requirement is met by collecting and counting key indexes in the production process;
the parameter adjusting unit is used for adjusting production parameters so as to optimize chip packaging equipment, and adjusting related production parameters according to feedback information analyzed by production results and combining the capability and limiting conditions of the equipment;
the optimization strategy generation unit is used for generating a corresponding optimization strategy according to the analysis of the production result and the parameter adjustment, and comprises a specific adjustment scheme, target setting and execution steps;
the parameter recording and storing unit is used for recording production parameters and production results optimized each time, storing the production parameters and the production results in the memory, and recording parameter changes and corresponding production results in the debugging process so as to facilitate subsequent backtracking and reference;
and the parameter searching and optimizing unit is used for searching similar production parameters and production results according to the requirements of the production results and optimizing the production parameters and the production results on the basis.
Preferably, the invention further comprises a modularized process docking module, which is used for associating a plurality of chip packaging systems based on modularized design, and can be used for process docking when one factory cannot process a certain process and the productivity of the process in the other factory is remained.
Preferably, the invention further comprises an order module, wherein the purchasing company places an order, and the factory takes the order.
As a preferred embodiment of the present invention, the order module includes an order splitting unit, configured to split an order into a plurality of sub-orders according to a processing procedure, where different factories can accept different sub-orders;
the transportation optimizing unit is used for reducing transportation cost among different sub orders;
and a responsibility dividing unit for determining responsibility of the reject in each process.
The chip packaging method based on the modularized design comprises the following steps:
step S1, acquiring parameter information of a packaging target chip and storing the parameter information into a memory;
step S2, detecting the type, model, productivity and position of the chip packaging equipment, and listing executable packaging procedures;
step S3, matching the parameter information of the chip packaging equipment and the target chip, and designing the target chip package;
step S4, according to the production results of small-batch production, changing one or more production parameters to optimize chip packaging equipment, and recording the production parameters and the production results optimized each time into a memory;
and S5, detecting the quality of the product.
Compared with the prior art, the invention has the following beneficial effects:
1. flexibility and scalability: through the modular design, the system can add or replace each functional module as required to adapt to different requirements and changes. For example, more device detection modules or product detection modules may be added according to the actual situation.
2. High efficiency and accuracy: each module is focused on a specific task, so that the execution efficiency and accuracy of the system are improved. The control terminal module is responsible for the instruction sending and operation control of the whole system, the information acquisition module is responsible for acquiring and storing target chip parameter information, the design module is responsible for matching parameters and designing procedure steps, the debugging and optimizing module optimizes according to the production result, and the product detection module is used for guaranteeing the product quality.
3. Data sharing and reference: data and information can be shared among the modules, for example, equipment information provided by the equipment detection module can be used by the design module, and the optimization record can also be used as a reference for a subsequent optimization process, so that the efficiency and consistency can be improved, and repeated work can be avoided.
4. Fault isolation and maintenance are convenient: due to the modularization of the system, when a certain module fails, maintenance or replacement can be independently carried out without affecting the operation of the whole system. This helps to quickly solve the problem and reduce downtime.
5. Data recording and backtracking: by logging the production parameters and results of each optimization into memory, data backtracking and analysis can be performed, knowing the system performance and the effect of improvement, which is important for continuously improving debugging and quality control.
Drawings
FIG. 1 is a schematic block diagram of a chip packaging system based on a modular design provided by an embodiment of the present invention;
FIG. 2 is a schematic block diagram of an information acquisition module refinement of a chip packaging system based on a modular design provided by an embodiment of the present invention;
FIG. 3 is a schematic block diagram I of a device detection module refinement for a chip packaging system based on a modular design provided by an embodiment of the present invention;
FIG. 4 is a schematic block diagram II of a device detection module refinement of a chip packaging system based on a modular design provided by an embodiment of the present invention;
FIG. 5 is a schematic block diagram of a design module refinement of a modular design-based chip packaging system provided by an embodiment of the invention;
FIG. 6 is a schematic block diagram of a debug and optimization module refinement for a chip packaging system based on a modular design provided by an embodiment of the present invention;
FIG. 7 is a schematic block diagram of a modular design based chip packaging system with a modular process docking module provided by an embodiment of the present invention;
FIG. 8 is a schematic block diagram of a modular design based chip packaging system with order module provided by an embodiment of the present invention;
fig. 9 is a flow chart of a method for packaging a chip based on modular design according to an embodiment of the present invention.
Detailed Description
For a further understanding of the invention, its features and advantages, reference is now made to the following examples, which are illustrated in the accompanying drawings.
The structure of the present invention will be described in detail with reference to the accompanying drawings.
Referring to fig. 1, a chip packaging system based on a modular design according to an embodiment of the present invention includes a control terminal module, which is used as a main control end of the system, and is configured to send out an execution command and control operation of the whole system, and further includes:
the information acquisition module is used for acquiring parameter information of the packaging target chip and storing the parameter information into the memory;
the device detection module is used for detecting the type, the model and the production capacity of the chip packaging device and the position relation of each chip packaging device, and listing executable packaging procedures (including a processable target chip and a process standard which can be achieved, such as precision and even production capacity);
the design module is used for matching the parameter information of the chip packaging equipment and the target chip and designing the process steps of packaging the target chip;
the debugging and optimizing module changes one or more production parameters to optimize chip packaging equipment according to the production results of small-batch production, and records the production parameters and the production results optimized each time into the memory;
and the product detection module is used for detecting the quality of the product.
The chip packaging system based on the modularized design has the following beneficial effects:
flexibility and scalability: through the modular design, the system can add or replace each functional module as required to adapt to different requirements and changes. For example, more device detection modules or product detection modules may be added according to the actual situation.
High efficiency and accuracy: each module is focused on a specific task, so that the execution efficiency and accuracy of the system are improved. The control terminal module is responsible for the instruction sending and operation control of the whole system, the information acquisition module is responsible for acquiring and storing target chip parameter information, the design module is responsible for matching parameters and designing procedure steps, the debugging and optimizing module optimizes according to the production result, and the product detection module is used for guaranteeing the product quality.
Data sharing and reference: data and information can be shared among the modules, for example, equipment information provided by the equipment detection module can be used by the design module, and the optimization record can also be used as a reference for a subsequent optimization process, so that the efficiency and consistency can be improved, and repeated work can be avoided.
Fault isolation and maintenance are convenient: due to the modularization of the system, when a certain module fails, maintenance or replacement can be independently carried out without affecting the operation of the whole system. This helps to quickly solve the problem and reduce downtime.
Data recording and backtracking: by logging the production parameters and results of each optimization into memory, data backtracking and analysis can be performed, knowing the performance of the system and the effectiveness of the improvement, which is important for continued improvement and quality control.
In general, the chip packaging system based on the modularized design has the advantages of flexibility, high efficiency, convenience in data sharing and maintenance and the like, and can improve the production efficiency, the product quality and the system reliability.
Referring to fig. 2, the information acquisition module includes:
the sensor acquisition unit automatically acquires parameter information of the target chip through the sensor; and selecting a proper sensor for data acquisition according to the characteristics and parameter requirements of the target chip, such as a temperature sensor, a humidity sensor, a voltage sensor and the like.
A measurement input unit for manually inputting parameter information of the target chip through the measurement device; when no sensor is applicable or manual intervention is needed, a measuring instrument is used for measuring the target chip, and a measurement result is input into the information acquisition module.
And the parameter input unit is used for directly inputting the parameter information of the target chip and manually inputting the parameter information into the information acquisition module through a keyboard, a mouse or other input equipment according to the detailed parameters provided by the target chip supplier.
And the parameter processing unit is used for processing and verifying the acquired or input target chip parameters. The method comprises the operations of data verification, unit conversion, range check and the like, and the accuracy and the effectiveness of parameters are ensured.
And the storage unit is used for storing the processed target chip parameter information into the memory. The method can use an internal memory, an external memory or cloud storage and the like to select proper storage equipment and schemes according to requirements.
And the inquiring and managing unit is used for inquiring and managing the stored parameter information of the target chip, and a user is allowed to inquire and acquire the parameter information of the target chip according to specific conditions by providing a user interface or an interface, and perform management, backup or export operations.
The above units may cooperate with each other to form a complete information acquisition module. The parameter information of the target chip is accurately recorded and stored through sensor acquisition, measurement input or parameter input, parameter processing and parameter storage, so that subsequent analysis, application and management can be realized.
Illustratively, the parameter information of the target chip includes the following parameters: size and package type, pin configuration and number, heat dissipation requirements, electrical characteristics, environmental requirements, and reliability metrics.
Size and package type: the size of the chip and the type of package, e.g., QFN, BGA, etc., are known to determine the proper packaging. Among them, QFN is an abbreviation of Quad Flat No-leads, meaning Quad No-lead package, which is a common surface mount technology package. QFN package has the advantages of small size, low cost, good heat dissipation performance and the like, and is widely applied in the field of integrated circuits. BGA is an abbreviation for Ball Grid Array, meaning Ball Grid Array packaging, is also a common surface mount technology package. BGA packages employ ball-shaped pins arranged at the bottom of the chip to provide higher pin density and better electrical performance. The BGA package also has good thermal conductivity and reliability, and is suitable for high-speed and high-density integrated circuits.
Pin configuration and number: the pin configuration and number of the chip is known to ensure proper connection and layout.
Heat dissipation requirements: the heat dissipation requirements of the chip, including power consumption, maximum operating temperature, etc., are known to select appropriate heat dissipation designs and packaging materials.
Electrical characteristics: the electrical characteristics of the chip, such as operating voltage, current requirements, signal transmission rate, etc., are known to ensure that the packaging process does not affect the performance of the chip.
Environmental requirements: the working environment requirements of the chip, such as antistatic, dustproof and moisture-proof grades, are known to select corresponding packaging materials and packaging modes.
Reliability index: the reliability index of the chip, such as MTBF (mean time between failure), failure rate, etc., is known to select the packaging process and materials that meet the requirements. MTBF is an abbreviation for Mean Time Between Failures, meaning mean time to failure. It is an indicator for measuring the reliability of a device or system, representing the number of occurrences of a fault between average operating times under normal use conditions. MTBF is typically expressed in hours and is calculated by dividing the sum of observed failure times by the number of observed failures. A higher MTBF value indicates a lower failure rate of the device or system, i.e., more reliable.
Knowledge of these parameters can help the packaging engineer select appropriate packaging techniques and materials to ensure that the chip will function properly and meet performance and reliability requirements after packaging.
It should be noted that, the information acquisition module may be automatically acquired by a sensor, or may be a parameter input after measurement, or a parameter directly input to the target chip (the target chip vendor will generally provide a detailed parameter of the target chip).
Referring to fig. 3, the device detection module includes the following units:
and the device identification unit is used for identifying the type and the model of the chip packaging device. The unique identification of the device is obtained by using an automatic identification technique such as bar code scanning or RFID, etc., thereby determining the type and model of the device.
And the productivity detection unit is used for estimating the productivity of the equipment by recording the production cycle and the speed of the equipment and storing the capacity into the system for subsequent inquiry and analysis.
And the positioning detection unit is used for detecting the position relation of the equipment. The position information of the equipment can be acquired in real time by utilizing indoor positioning technology such as Wi-Fi positioning, bluetooth positioning or RFID positioning, so as to support subsequent process allocation and scheduling.
And the procedure matching unit is used for matching the executable packaging procedure according to the type, model and position relation of the equipment. And screening out executable procedures matched with the equipment according to the capacity and the limiting conditions of the equipment through a preset procedure library, and providing the executable procedures for a user to check.
And the process standard unit is used for listing process standards matched with equipment and providing corresponding process parameter and process standard information required by processing precision according to equipment capacity and limiting conditions so as to ensure the quality and consistency of the packaging process.
Through the cooperation of the units, the equipment detection module can realize the detection of the type, the model, the production capacity and the position of the chip packaging equipment and provide executable packaging procedures and related process standards. This will help to optimize production scheduling, improve production efficiency, while ensuring that the packaging process meets specifications and requirements.
Referring to fig. 4, the device detection module includes an order filtering unit, that is, the devices are all in a networking state, and for the service that cannot be executed, the device detection module can be directly excluded and can be used for filtering orders.
Referring to fig. 5, the design module includes the following units:
and the device parameter matching unit is used for matching the parameter information of the chip packaging device, such as temperature range, size adaptation and the like, according to the capability of the device, the limiting condition and the requirement of the target chip.
And the target chip parameter analysis unit is used for analyzing the parameter information of the target chip. The packaging requirements, process characteristics, etc. of the chip are analyzed by obtaining detailed parameters or other related data provided by the target chip provider.
And the process design unit is used for designing proper process steps including welding, packaging, testing and the like according to the equipment parameter matching result and the target chip parameter analysis result and in combination with the requirements of the packaging process.
And the process verification unit is used for verifying the feasibility and the effectiveness of the process design, verifying whether the designed process steps meet the packaging requirement of the target chip through simulation or actual operation, and carrying out necessary adjustment and optimization.
The process step generating unit is used for generating process steps of the target chip package, converting the verified process design result into specific process steps, including process parameter setting and operation guidance, and storing for subsequent use.
Through the cooperation of the units, the design module can realize the matching of the chip packaging equipment and the target chip parameter information, design the process steps suitable for the target chip packaging, and verify and generate. Therefore, the packaging process can be ensured to be matched with the requirements of the target chip, and the production efficiency and the product quality are improved.
Referring to fig. 6, the debugging and optimizing module includes:
and the production result analysis unit is used for analyzing the small batch production result, analyzing the production effect and evaluating whether the requirement is met by collecting and counting key indexes in the production process, such as the defective rate, the yield, the production period and the like.
And the parameter adjusting unit is used for adjusting production parameters so as to optimize the chip packaging equipment, and adjusting related production parameters such as temperature, speed, pressure and the like according to feedback information analyzed by the production results and combining the capability and the limiting conditions of the equipment.
And the optimization strategy generation unit is used for generating a corresponding optimization strategy according to the analysis of the production result and the parameter adjustment, and comprises specific adjustment schemes, target setting and execution steps.
And the parameter recording and storing unit is used for recording production parameters and production results optimized each time, storing the production parameters and the production results in the memory, and recording parameter changes and corresponding production results in the debugging process so as to facilitate subsequent backtracking and reference.
And the parameter searching and optimizing unit is used for searching similar production parameters and production results according to the requirements of the production results and optimizing the production parameters and the production results on the basis. By comparing cases similar to the target requirement in the history record, a feasible debugging scheme is quickly found, and the debugging efficiency is improved.
Through cooperation of the units, the debugging and optimizing module can change production parameters according to the results of small-batch production and optimize the chip packaging equipment. The production process is continuously improved by analyzing the production results, adjusting the parameters and generating the optimization strategy, and the parameters and the results of each optimization are recorded for subsequent inquiry and reference. Meanwhile, through parameter retrieval and optimization, an optimization scheme under the similar condition can be quickly found in a new debugging task by using historical experience, and the debugging efficiency and accuracy are improved.
Referring to fig. 7, the system further comprises a modular process docking module for associating a plurality of the chip packaging systems based on modular design, wherein when one factory cannot process a certain process, and when the process capacity remains in another factory, process docking can be performed.
In the prior art, if a certain chip packaging device is damaged or missing, the processing of the process cannot be performed, which may lead to the shutdown of the whole factory. By the arrangement, production stopping can be prevented, and the productivity of the equipment is optimized. Of course, a decision is also required as to whether to agree or not.
Referring to FIG. 8, an order module is also included in which the buyer places an order, and in which the factory takes the order.
The order splitting unit is used for splitting the order into a plurality of sub orders according to the processing procedure, and different factories can accept different sub orders;
the transportation optimizing unit is used for reducing transportation cost among different sub orders;
and a responsibility dividing unit for determining responsibility of the reject in each process.
The transport optimization unit may be implemented by:
route planning and optimization: and through a transportation route planning and optimizing algorithm, the optimal transportation route and mode are selected so as to reduce the transportation cost. The shipping plans are arranged reasonably considering the location, order volume, and cargo characteristics of the different factories.
Batch assembling and transporting: adjacent or similar sub-orders are assembled and transported in batches to reduce transportation times and costs. The order is split into a plurality of sub orders according to the processing procedure through an order splitting unit, and the sub orders suitable for being accepted by the same factory are processed in batches according to the capacity and resource conditions of the factory.
Supply chain collaboration: a supply chain collaboration mechanism is established, including information sharing and coordination with suppliers and factories. The purchasing company places orders in the order module, and the factory takes orders in the order module, so that timely delivery and processing of orders can be realized, communication cost and time delay are reduced, and overall efficiency is improved.
Transport mode selection: and selecting a proper transportation mode, such as land transportation, sea transportation, air transportation and the like, according to the characteristics of goods, the distance, the ageing requirements and other factors. The cost and timeliness of the different modes of transportation are compared and the most economical and suitable mode of transportation is selected.
Data analysis and optimization: by analyzing the order data and the transportation cost data, the transportation strategy and the order management flow are continuously optimized. With data analysis tools and algorithms, potential cost savings and efficiency improvement points are identified, with continued improvement.
The above measures can help solve the problem of transportation cost and order management, improve transportation efficiency, reduce cost, and ensure that orders can be delivered to buyers on time.
Further, the responsibility dividing unit includes the following subunits:
a data acquisition subunit: the unit is responsible for collecting data relating to the quality of the product. The key production process data and the quality index data can be acquired by means of sensors, monitoring equipment, manual input and the like.
An anomaly monitoring subunit: the unit is responsible for identifying anomalies in the production process. By monitoring the data in real time and applying simple rules or algorithms, it is detected whether an abnormal situation exists, such as exceeding a threshold range, abnormal trend, etc.
Problem location subunit: the unit is responsible for the process where the problem of locating defective products is located. Based on the output result of the abnormality detecting unit and the process information of the production process, an attempt is made to determine in which process the problem may occur, in combination with empirical judgment or simple logical reasoning.
Verification validation subunit: the unit is responsible for verifying the accuracy of the process in which the problem is located. By further observing, measuring, testing or excluding other possibilities, it is confirmed that the problem does occur in a specific process and relevant information is recorded.
Responsible for dividing the subunits: the unit is responsible for dividing responsibility according to the result of the verification unit. And calculating factors such as quality problem times, severity and the like of each process according to a preset responsibility division rule so as to determine the responsibility proportion of each process.
Feedback improvement subunit: the unit is responsible for feeding back the questions and responsibility division results to the relevant personnel and for facilitating the implementation of the improvement measures. Through timely communication, training or introduction of improvement measures, the defective rate is reduced and the overall quality level is improved.
It is important to design this low cost responsibility division module, taking into account simplifying the data acquisition and processing process, and utilizing existing equipment and resources as much as possible to reduce costs. If the cost of separate processing is higher than the cost of unified processing at one factory, the order splitting unit is not enabled.
Referring to fig. 9, the invention further provides a chip packaging method based on modular design, comprising the following steps:
step S1, acquiring parameter information of a packaging target chip and storing the parameter information into a memory;
step S2, detecting the type, model, productivity and position of the chip packaging equipment, and listing executable packaging procedures;
step S3, matching the parameter information of the chip packaging equipment and the target chip, and designing the target chip package;
step S4, according to the production results of small-batch production, changing one or more production parameters to optimize chip packaging equipment, and recording the production parameters and the production results optimized each time into a memory;
and S5, detecting the quality of the product.
The working principle of the invention is as follows:
through the modular design, the system can add or replace each functional module as required to adapt to different requirements and changes. For example, more device detection modules or product detection modules may be added according to the actual situation. Each module is focused on a specific task, so that the execution efficiency and accuracy of the system are improved. The control terminal module is responsible for the instruction sending and operation control of the whole system, the information acquisition module is responsible for acquiring and storing target chip parameter information, the design module is responsible for matching parameters and designing procedure steps, the debugging and optimizing module optimizes according to the production result, and the product detection module is used for guaranteeing the product quality. Data and information can be shared among the modules, for example, equipment information provided by the equipment detection module can be used by the design module, and the optimization record can also be used as a reference for a subsequent optimization process, so that the efficiency and consistency can be improved, and repeated work can be avoided. Due to the modularization of the system, when a certain module fails, maintenance or replacement can be independently carried out without affecting the operation of the whole system. This helps to quickly solve the problem and reduce downtime. By logging the production parameters and results of each optimization into memory, data backtracking and analysis can be performed, knowing the performance of the system and the effectiveness of the improvement, which is important for continued improvement and quality control.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The chip packaging system based on the modularized design comprises a control terminal module which is used as a main control end of the system and used for sending out an execution command and controlling the operation of the whole system, and is characterized by further comprising:
the information acquisition module is used for acquiring parameter information of the packaging target chip and storing the parameter information into the memory;
the device detection module is used for detecting the type, the model and the production capacity of the chip packaging devices and the position relation of each chip packaging device, and listing executable packaging procedures;
the design module is used for matching the parameter information of the chip packaging equipment and the target chip and designing the process steps of packaging the target chip;
the debugging and optimizing module changes one or more production parameters to optimize chip packaging equipment according to the production results of small-batch production, and records the production parameters and the production results optimized each time into the memory;
the product detection module is used for detecting the quality of the product;
the information acquisition module includes:
the sensor acquisition unit automatically acquires parameter information of the target chip through the sensor;
a measurement input unit for manually inputting parameter information of the target chip through the measurement device;
the parameter input unit is used for directly inputting the parameter information of the target chip and manually inputting the parameter information into the information acquisition module according to the detailed parameters provided by the target chip supplier;
the parameter processing unit is used for processing and verifying the acquired or input target chip parameters;
the storage unit is used for storing the processed target chip parameter information into the memory;
and the inquiring and managing unit is used for inquiring and managing the stored parameter information of the target chip, and a user is allowed to inquire and acquire the parameter information of the target chip according to specific conditions by providing a user interface or an interface, and perform management, backup or export operations.
2. The modular design-based chip packaging system of claim 1, wherein:
the parameter information of the target chip comprises the following parameters: size and package type, pin configuration and number, heat dissipation requirements, electrical characteristics, environmental requirements, and reliability metrics.
3. The modular design-based chip packaging system of claim 1, wherein:
the device detection module comprises the following units:
the device identification unit is used for identifying the type and the model of the chip packaging device;
the productivity detection unit is used for estimating the productivity of the equipment by recording the production period and the speed of the equipment and storing the productivity into the system for subsequent inquiry and analysis;
a positioning detection unit for detecting the positional relationship of the device;
the procedure matching unit is used for matching the executable packaging procedure according to the type, model and position relation of the equipment;
and the process standard unit is used for listing process standards matched with equipment and providing corresponding process parameter and process standard information required by processing precision according to equipment capacity and limiting conditions so as to ensure the quality and consistency of the packaging process.
4. The modular design-based chip packaging system of claim 1, wherein:
the design module comprises the following units:
the device parameter matching unit is used for matching the parameter information of the chip packaging device according to the capability of the device, the limiting condition and the requirement of the target chip;
the target chip parameter analysis unit is used for analyzing parameter information of the target chip;
the process design unit is used for designing proper process steps according to the equipment parameter matching result and the target chip parameter analysis result and combining the requirements of the packaging process;
the process verification unit is used for verifying the feasibility and effectiveness of the process design, verifying whether the designed process step meets the packaging requirement of the target chip through simulation or actual operation, and carrying out necessary adjustment and optimization;
the process step generating unit is used for generating process steps of the target chip package, converting the verified process design result into specific process steps, including process parameter setting and operation guidance, and storing for subsequent use.
5. The modular design-based chip packaging system of claim 1, wherein:
the debugging and optimizing module comprises:
the production result analysis unit is used for analyzing the small batch production result, analyzing the production effect and evaluating whether the requirement is met by collecting and counting key indexes in the production process;
the parameter adjusting unit is used for adjusting production parameters so as to optimize chip packaging equipment, and adjusting related production parameters according to feedback information analyzed by production results and combining the capability and limiting conditions of the equipment;
the optimization strategy generation unit is used for generating a corresponding optimization strategy according to the analysis of the production result and the parameter adjustment, and comprises a specific adjustment scheme, target setting and execution steps;
the parameter recording and storing unit is used for recording production parameters and production results optimized each time, storing the production parameters and the production results in the memory, and recording parameter changes and corresponding production results in the debugging process so as to facilitate subsequent backtracking and reference;
and the parameter searching and optimizing unit is used for searching similar production parameters and production results according to the requirements of the production results and optimizing the production parameters and the production results on the basis.
6. The modular design-based chip packaging system of claim 1, wherein:
the system also comprises a modularized procedure butt joint module which is used for carrying out the correlation of a plurality of chip packaging systems based on modularized design, and when one factory cannot process a certain procedure, and when the productivity of the procedure in the other factory is remained, the procedure butt joint can be carried out.
7. The modular design-based chip packaging system of claim 1, wherein:
the system also comprises an order module, wherein the purchasing company places orders in the order module, and the factory takes orders in the order module.
8. The modular design-based chip packaging system as recited in claim 7, wherein:
the order splitting unit is used for splitting the order into a plurality of sub orders according to the processing procedure, and different factories can accept different sub orders;
the transportation optimizing unit is used for reducing transportation cost among different sub orders;
and a responsibility dividing unit for determining responsibility of the reject in each process.
9. The chip packaging method based on the modularized design is characterized by comprising the following steps of:
acquiring parameter information of a packaging target chip and storing the parameter information into a memory;
detecting the type, model, productivity and position of chip packaging equipment, and listing executable packaging procedures;
matching the parameter information of the chip packaging equipment and the target chip, and designing a target chip package;
according to the production results of small-batch production, one or more production parameters are changed to optimize chip packaging equipment, and the production parameters and the production results optimized each time are recorded into a memory;
and detecting the quality of the product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311628205.XA CN117334612B (en) | 2023-12-01 | 2023-12-01 | Chip packaging method and system based on modularized design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311628205.XA CN117334612B (en) | 2023-12-01 | 2023-12-01 | Chip packaging method and system based on modularized design |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117334612A true CN117334612A (en) | 2024-01-02 |
| CN117334612B CN117334612B (en) | 2024-02-23 |
Family
ID=89293829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311628205.XA Active CN117334612B (en) | 2023-12-01 | 2023-12-01 | Chip packaging method and system based on modularized design |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117334612B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118507395A (en) * | 2024-07-11 | 2024-08-16 | 江南大学 | Multi-physical-quantity cooperative control method based on chip automatic packaging |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110263485A (en) * | 2019-06-27 | 2019-09-20 | 珠海泰芯半导体有限公司 | A kind of automatic Plotting System and computer system of chip package figure |
| CN113690159A (en) * | 2020-05-18 | 2021-11-23 | 联咏科技股份有限公司 | Chip package detection system and chip package detection method |
| CN114724985A (en) * | 2022-04-02 | 2022-07-08 | 安徽钜芯半导体科技有限公司 | Packaging transmission control system of photovoltaic module chip |
| CN115600539A (en) * | 2022-11-10 | 2023-01-13 | 上海威固信息技术股份有限公司（Cn） | Chip packaging modular design method and system |
| CN115831812A (en) * | 2022-11-10 | 2023-03-21 | 上海威固信息技术股份有限公司 | Module identification packaging method and system for chip module design |
| CN116245825A (en) * | 2023-02-01 | 2023-06-09 | 上海交通大学 | Wafer-level chip package image generation and splicing system and method |
-
2023
- 2023-12-01 CN CN202311628205.XA patent/CN117334612B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110263485A (en) * | 2019-06-27 | 2019-09-20 | 珠海泰芯半导体有限公司 | A kind of automatic Plotting System and computer system of chip package figure |
| CN113690159A (en) * | 2020-05-18 | 2021-11-23 | 联咏科技股份有限公司 | Chip package detection system and chip package detection method |
| CN114724985A (en) * | 2022-04-02 | 2022-07-08 | 安徽钜芯半导体科技有限公司 | Packaging transmission control system of photovoltaic module chip |
| CN115600539A (en) * | 2022-11-10 | 2023-01-13 | 上海威固信息技术股份有限公司（Cn） | Chip packaging modular design method and system |
| CN115831812A (en) * | 2022-11-10 | 2023-03-21 | 上海威固信息技术股份有限公司 | Module identification packaging method and system for chip module design |
| CN116245825A (en) * | 2023-02-01 | 2023-06-09 | 上海交通大学 | Wafer-level chip package image generation and splicing system and method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118507395A (en) * | 2024-07-11 | 2024-08-16 | 江南大学 | Multi-physical-quantity cooperative control method based on chip automatic packaging |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117334612B (en) | 2024-02-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Ante et al. | Developing a key performance indicators tree for lean and smart production systems | |
| CN117334612B (en) | Chip packaging method and system based on modularized design | |
| US8571904B2 (en) | Self sensing component interface system | |
| JP2019215929A (en) | Information management system | |
| KR102140731B1 (en) | System implementing smart factory | |
| Schreiber et al. | Integrated production and maintenance planning for cyber-physical production systems | |
| CN112116364A (en) | Production and manufacturing tracing system and platform | |
| CN112712314A (en) | Logistics data recommendation method based on sensor of Internet of things | |
| CN112348530A (en) | Automatic server production inspection and repair method | |
| CN113673835A (en) | Third generation semiconductor supply chain management system | |
| Scharfe et al. | A Taxonomy of Smart Machines in the Mechanical Engineering Industry: Toward Structuring the Design Solution Space. | |
| Siddhartha et al. | IoT enabled real-time availability and condition monitoring of CNC machines | |
| CN112700095B (en) | Battery Pack Production Management System | |
| CN113191738B (en) | Multi-template management and control method for test equipment and related equipment | |
| CN118071087A (en) | Material project full life cycle implementation management and control system and method | |
| KR102102591B1 (en) | System implementing smart factory | |
| EP3705964B1 (en) | A method for the scalable real-time state recognition of processes and/or sub-processes during production with electrically driven production plants | |
| CN117993819A (en) | Order production data chain system | |
| CN117689254A (en) | Yield and processing suggestion generation system and generation method | |
| CN109597361B (en) | Production line monitoring system and production line monitoring method | |
| Shagluf et al. | Derivation of a cost model to aid management of CNC machine tool accuracy maintenance | |
| KR102298342B1 (en) | Information Interface System and Method for Information Interface | |
| Lin | An integrated digital twin simulation and scheduling system under cyber-physical digital twin environment | |
| Heilala | Modeling and simulation for decision making in sustainable and resilient assembly system selection | |
| Hong | Implementing Lean Six Sigma to achieve inventory control in supply chain management |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| OL01 | Intention to license declared | ||
| OL01 | Intention to license declared |