CN114717522A - Multi-arc ion plating device - Google Patents

Multi-arc ion plating device Download PDF

Info

Publication number
CN114717522A
CN114717522A CN202210517313.9A CN202210517313A CN114717522A CN 114717522 A CN114717522 A CN 114717522A CN 202210517313 A CN202210517313 A CN 202210517313A CN 114717522 A CN114717522 A CN 114717522A
Authority
CN
China
Prior art keywords
arc
coating
module
arc source
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210517313.9A
Other languages
Chinese (zh)
Inventor
王君
闫超颖
依君
梁惠朋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iks Pvd Technology Shenyang Co ltd
Original Assignee
Iks Pvd Technology Shenyang Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iks Pvd Technology Shenyang Co ltd filed Critical Iks Pvd Technology Shenyang Co ltd
Priority to CN202210517313.9A priority Critical patent/CN114717522A/en
Publication of CN114717522A publication Critical patent/CN114717522A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/32Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325Electric arc evaporation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/021Cleaning or etching treatments
    • C23C14/022Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders
    • C23C14/505Substrate holders for rotation of the substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The application relates to the technical field of vacuum coating, in particular to a multi-arc ion coating device. The multi-arc ion plating device comprises a plating module, wherein the plating module comprises a vacuum chamber, a plating arc source and an etching arc source, the plating arc source and the etching arc source are both connected with the vacuum chamber, and the inside of the vacuum chamber is used for introducing reaction gas. The multi-arc ion coating device adopts the etching component consisting of the etching arc source and the anode component to etch the surface of the workpiece, and then the coating arc source is used for depositing and coating the workpiece, so that the binding force between the outer surface of the workpiece and the coating can be improved, and the surface of the workpiece can obtain a compact, high-hardness and high-wear-resistant high-performance functional coating so as to meet various complex working conditions and process requirements.

Description

Multi-arc ion coating device
Technical Field
The application relates to the technical field of vacuum coating, in particular to a multi-arc ion coating device.
Background
Vacuum ion plating refers to a process of evaporating or sputtering a film material by using an evaporation source or a sputtering target in a vacuum atmosphere, ionizing a part of particles evaporated or sputtered in a gas discharge space into metal ions, and depositing the metal ions on a substrate under the action of an electric field to form a thin film.
However, the existing vacuum ion plating machine generally has the defects of single function, unstable plating quality, and particularly, poor film bonding force, film cracking and the like.
Disclosure of Invention
The application aims to provide a multi-arc ion coating device to solve the technical problems that a vacuum coating machine in the prior art is single in function, and coating quality defects such as film cracking, poor film binding force and the like are prone to occurring to a certain extent.
The application provides a multi-arc ion plating device which comprises a plating module, wherein the plating module comprises a vacuum chamber, a plating arc source and an etching component, and the etching component comprises an etching arc source, a baffle and an anode component;
the coating arc source and the etching arc source are both connected with the vacuum chamber, the anode assembly is arranged in the vacuum chamber corresponding to the etching arc source, the baffle is arranged between the etching arc source and the anode assembly, and reaction gas is introduced into the vacuum chamber.
In the above technical solution, further, the multi-arc ion plating apparatus further includes:
the vacuumizing module is connected with the vacuum chamber and is used for vacuumizing the vacuum chamber;
the cooling module can supply cooling fluid to the vacuumizing module and the coating module;
the power supply module can supply power to the coating module, the vacuumizing module and the cooling module;
the electric control module is electrically connected with the power supply module, the cooling module, the vacuumizing module and the coating module, and can cooperatively control the power supply module, the cooling module, the vacuumizing module and the coating module.
In any of the above technical solutions, further, the vacuum pumping module includes a pump set and a control valve set;
the control valve group, the cooling module and the coating module are integrated into a first structural part, and the power supply module, the air pump group and the electric control module are integrated into a second structural part;
the control valve group is connected with the coating module, and the control valve group is detachably connected with the air pumping pump group, so that the first structure part is detachably connected with the second structure part, and the air pumping pump group is communicated with the vacuum chamber through the control valve group.
In any of the above technical solutions, further, the control valve set is disposed on a side of the film coating module along a first direction, and the cooling module is disposed on a side of the film coating module along a second direction;
the power supply module and the electric control module are respectively arranged on two sides of the air pump group along the second direction;
the second structure portion is provided to a side of the first structure portion in the first direction.
In any of the above technical solutions, further, the etching component includes at least two etching arc sources, at least two etching arc sources form an etching arc source group, and at least three coating arc sources form a coating arc source group;
the number of the etching arc source groups and the number of the film plating arc source groups are at least one group;
the coating module further comprises a reaction gas supply pipe, one end of the reaction gas supply pipe is used for being communicated with a gas source, and the other end of the reaction gas supply pipe extends into the vacuum chamber;
the reaction gas supply pipes are arranged on each coating arc source and each etching arc source in a one-to-one correspondence mode.
In any of the above technical solutions, further, the vacuum chamber includes a side body, a top cover plate and a bottom cover plate, the side body includes eight side walls connected in an octagonal shape, and the top cover plate and the bottom cover plate respectively cover the top end opening and the bottom end opening of the side body;
the etching arc source group comprises two etching arc sources, and each etching arc source group is arranged on one side wall of the side main body;
the coating arc source group comprises three coating arc sources, and two coating arc sources and the other coating arc source of each coating arc source group are respectively arranged on two side walls of the side main body;
and one side wall of the side main body is also provided with a vacuum pumping hole, and the control valve group is connected with the vacuum chamber through the vacuum pumping hole.
In any of the above technical solutions, further, the side body includes an openable and closable door body section and a main body section, the door body section includes three side walls connected in sequence, and the main body section includes the remaining five side walls connected in sequence;
the number of the etching arc source groups is one group, the number of the coating arc source groups is three, and the three coating arc source groups are respectively a first coating arc source group, a second coating arc source group and a third coating arc source group;
the etching arc source group is arranged on the side wall positioned in the middle of the door body section, and the three coating arc sources of the first coating arc source group are respectively arranged on the other two side walls of the door body section;
the vacuum pumping hole is formed in the side wall, opposite to the etching arc source, of the main body section, and the second coating arc source and the third coating arc source are arranged on the main body section and are respectively arranged on the two side walls on two sides of the vacuum pumping hole.
In any of the above technical solutions, further, the multi-arc ion plating apparatus further comprises a suspension bracket;
the suspension bracket is arranged on the bottom cover plate, the top end of the anode assembly is connected with the top cover plate, the anode assembly and the etching arc source are respectively communicated with the anode and the cathode of the power supply module, and the anode assembly is positioned between the suspension bracket and the etching arc source;
the multi-arc ion plating device also comprises a bias mechanism for switching on the cathode of the power supply module;
the bias mechanism is arranged on the bottom cover plate and electrically connected with the suspension bracket so as to enable the workpiece on the suspension bracket to be charged with negative electricity.
In any of the above technical solutions, further, the suspension bracket includes a revolution plate, a primary sun gear, a primary planet gear, a transmission plate, and a plurality of suspension jigs;
the first-stage sun wheel is arranged on the bottom cover plate, the transmission disc is rotatably arranged on the inner side of the first-stage sun wheel at intervals, and the revolution disc is arranged on the top of the transmission disc so as to enable the revolution disc and the transmission disc to rotate synchronously;
the bottom surface of revolution dish is provided with one-level annular internal tooth, the one-level sun gear is located the inboard of annular internal tooth, and is a plurality of one-level planet wheel mesh in one-level annular internal tooth with between the external tooth of one-level sun gear, it is a plurality of the bottom one-to-one that hangs the tool passes revolution dish and a plurality of one-level planet wheel coaxial coupling, so that it is a plurality of hang the tool and rotationally locate immediately the revolution dish.
In any of the above technical solutions, further, the hanging jig includes a jig base and a plurality of hangers, and the plurality of hangers are rotatably disposed on the jig base;
a plurality of supporting columns are vertically arranged on the revolution plate, and one supporting column is arranged between every two adjacent hanging jigs;
the hanging jig further comprises a secondary sun gear, a shifting rod and a plurality of secondary planet gears, secondary annular internal teeth are formed on the jig base and are coaxially connected with the primary planet gears, the secondary sun gear is arranged on the inner side of the secondary annular internal teeth at intervals, the plurality of secondary planet gears are meshed between the secondary sun gear and the secondary annular internal teeth, one end of the shifting rod is connected with the secondary sun gear, and the other end of the shifting rod can abut against the supporting column on the side portion of the hanging jig;
or, hang the tool and include the tool base, the tool base with one-level planet wheel coaxial coupling, it is a plurality of the hanger respectively with the tool base rotationally connects, the surface of hanger is provided with circumference external tooth, hang the tool and still include the plectrum, the one end of plectrum connect in the support column, the other end of plectrum with circumference external tooth looks butt.
In any of the above technical solutions, further, the multi-arc ion plating apparatus further includes a positioning assembly, where the positioning assembly includes a rotary driving member, a rotating shaft, and a positioning disk;
the positioning disc is arranged on the bottom cover plate, a plurality of positioning pins are arranged on the positioning disc, and the primary sun wheel is detachably connected with the positioning disc through the plurality of positioning pins;
the rotary driving piece is arranged at the bottom side of the bottom cover plate, the bottom end of the rotating shaft is connected with the rotary driving piece, and the top end of the rotating shaft penetrates through the bottom cover plate and the positioning disc to extend into the vacuum chamber;
the transmission disc is detachably connected with the top end of the rotating shaft, so that the rotary driving piece can drive the suspension bracket through the rotating shaft and the transmission disc;
the biasing mechanism comprises an insulation protection, a lead-in electrode and a wiring board;
the insulation protection penetrates through the bottom cover plate, the leading-in electrode is arranged in the insulation protection, one end of the leading-in electrode is connected with the negative pressure of the power module at the bottom side of the bottom cover plate, and the other end of the leading-in electrode is communicated with the positioning plate through the wiring board.
In any of the above technical solutions, further, the plating arc source and the etching arc source each include a fixed magnetic field assembly, a movable magnetic field assembly, an adjusting assembly, and an arc target, the arc target is connected to the vacuum chamber and located inside the vacuum chamber, and the arc target is connected to a cathode of the power module;
the fixed magnetic field assembly is arranged outside the vacuum chamber corresponding to the arc target, and the movable magnetic field assembly is movably connected with the fixed magnetic field assembly through the adjusting assembly so as to generate a variable magnetic field and enable the variable magnetic field to act on the target surface of the arc target;
the multi-arc ion plating device also comprises an insulation connecting assembly, and the fixed magnetic field assembly and the arc target are both arranged in the vacuum chamber through the insulation connecting assembly.
In any of the above technical solutions, further, the fixed magnetic field assembly includes a mounting seat disposed on the insulating connection assembly and a fixed magnetic member disposed in the mounting seat;
the movable magnetic field assembly comprises a frame body and a movable magnetic member arranged on the frame body, the frame body is provided with a mounting hole, and the frame body is movably sleeved outside the mounting seat through the mounting hole;
the coating arc source and the etching arc source both further comprise outer plates;
the planking with insulation coupling assembling relatively fixedly sets up, adjusting part includes fixed cover and adjusting collar, the adjusting collar with planking looks spiro union, the one end of fixed cover with adjusting collar looks spiro union, the other end of fixed cover with the support body is connected.
In any of the above technical solutions, further, the target material of the arc target of the etching arc source is an elemental target material, and the target material of the arc target of the coating arc source is an elemental target material, a binary target material, a ternary target material or a multi-element arc target;
and/or the movable magnetic component of the etching arc source comprises a first movable magnetic component, the movable magnetic component of the coating arc source comprises a second movable magnetic component and a third movable magnetic component, and at least one of the second movable magnetic component and the third movable magnetic component is an electromagnetic coil.
In any of the above technical solutions, further, the outer wall of the vacuum chamber is provided with a first cooling channel and a second cooling channel;
the first cooling channel extends between a bottom end and a top end of the vacuum chamber, and the length of the first cooling channel is 0.1-2 times the height of the vacuum chamber;
the second cooling channel extends in a curved shape.
In any of the above technical solutions, further, the control valve set includes a valve body, the valve body is provided with an air inlet and a plurality of air exhaust channels, and each air exhaust channel is communicated between the air inlet and the air outlet;
the valve body is communicated with a vacuum pumping hole of the vacuum chamber through the air inlet, and the rough pumping assembly is connected between the air inlet and the vacuum pumping hole;
the valve body is also provided with a fine pumping outlet which is communicated with the pumping channel, and the fine pumping outlet is positioned between the air inlet and the air outlet;
the control valve group further comprises a plugging component and an opening and closing driving component, the plugging component can be covered on the fine extraction port in an opening and closing mode, and the opening and closing driving component is connected with the plugging component and can drive the plugging component to open and close the fine extraction port.
In any of the above technical solutions, further, the opening and closing driving assembly includes a driving member and an execution rod, the driving assembly is disposed outside the valve body, one end of the execution rod is connected to the driving assembly, the other end of the execution rod extends into the air exhaust channel and is connected to the plugging assembly, and the driving assembly drives the execution rod to push or pull the plugging assembly relative to the fine extraction opening, so that the plugging assembly closes or opens the fine extraction opening;
the air pump set comprises a rough pump assembly and a fine pump assembly;
the rough pump assembly comprises a first direct connection pump, a roots pump, a first filter and a first connecting pipe group, the first filter, the roots pump and the first direct connection pump are sequentially connected through the first connecting pipe group, and the inlet end of the first filter is communicated with the air outlet through the first connecting pipe group;
the fine pumping pump assembly comprises a second direct connection pump, a second connecting pipe set and a molecular pump, the second direct connection pump is communicated with the molecular pump through the second connecting pipe set, and the molecular pump is communicated with the fine pumping port;
the first connecting pipe group and the second connecting pipe group are provided with leak detection holes, and the leak detection holes are used for installing leak detection components.
In any of the above technical solutions, further, the cooling module includes a first liquid inlet pipeline, a first liquid outlet pipeline, a second liquid inlet pipeline, a second liquid outlet pipeline, a first liquid inlet joint, a first liquid outlet joint, a second liquid inlet structure, and a second liquid outlet joint;
the first liquid inlet pipeline is provided with a plurality of first liquid inlet joints so as to convey first cooling fluid to the temperature-raising-prone component through the first liquid inlet joints, and the first liquid outlet pipeline is provided with a plurality of first liquid outlet joints so as to enable the first cooling fluid in the temperature-raising-prone component to flow back to the first liquid outlet pipeline through the first liquid outlet joints;
the second liquid inlet pipeline is provided with a plurality of second liquid inlet joints so as to convey second cooling fluid to the temperature-raising-prone component through the second liquid inlet joints, and the second liquid outlet pipeline is provided with a plurality of second liquid outlet joints so as to enable the second cooling fluid in the temperature-raising-prone component to flow back to the second liquid outlet pipeline through the second liquid outlet joints;
the temperature of the first cooling fluid is lower than the temperature of the second cooling fluid.
In any of the above technical solutions, further, the first liquid inlet pipeline, the first liquid outlet pipeline, the second liquid inlet pipeline, and the second liquid outlet pipeline each include a first end and a second end;
the first end of the first liquid inlet pipeline is used for introducing a first cooling fluid, the first end of the second liquid inlet pipeline is used for communicating a second cooling fluid, and the second end of the first liquid inlet pipeline is communicated with the second end of the second liquid inlet pipeline;
the cooling module further comprises a first switching valve and a second switching valve, the first switching valve is arranged at the second end of the first liquid inlet pipeline, the second switching valve is arranged on the first liquid inlet pipeline and is arranged at a distance from the first end of the first liquid inlet pipeline, and a plurality of first liquid inlet connectors for communicating the inlets of the molecular pump and the roots pump are arranged between the second switching valve and the first end of the first liquid inlet pipeline;
the first end of the first liquid outlet pipeline is used for discharging a first cooling fluid, the first end of the second liquid outlet pipeline is used for discharging a second cooling fluid, and the second end of the first liquid outlet pipeline is communicated with the second end of the second liquid outlet pipeline;
the cooling module further comprises a third switching valve and a fourth switching valve, the third switching valve is arranged at the second end of the first liquid outlet pipeline, the fourth switching valve is arranged on the first liquid outlet pipeline and is arranged at a distance from the first end of the first liquid outlet pipeline, and a plurality of first liquid outlet joints for communicating the outlet of the molecular pump with the outlet of the roots pump are arranged between the fourth switching valve and the first end of the first liquid outlet pipeline;
and/or the cooling module further comprises a first pressure regulating pipeline, the first pressure regulating pipeline comprises a first pressure regulating pipe group and a first pressure regulating piece, the inlet end of the first pressure regulating piece is communicated with the first liquid inlet pipeline, and the outlet end of the first pressure regulating piece is communicated with the first liquid outlet pipeline through the first pressure regulating pipe group;
the cooling module further comprises a second pressure regulating pipeline, the second pressure regulating pipeline comprises a second pressure regulating pipe group and a second pressure regulating piece, the inlet end of the second pressure regulating piece is communicated with the second liquid inlet pipeline, and the outlet end of the second pressure regulating piece is communicated with the second liquid outlet pipeline;
and/or, the cooling module still includes the pressure release pipeline, the pressure release pipeline includes four relief valves and pressure release nest of tubes, four the entry of relief valve respectively with first liquid inlet pipe way first liquid outlet pipe way the second liquid inlet pipe way with the second liquid outlet pipe way communicates, the pressure release nest of tubes will four the export of relief valve is linked together with the external world.
In any of the above technical solutions, further, the power supply module includes a first power supply for supplying power to the coating arc source, a second power supply for supplying power to the etching arc source, a third power supply for supplying power to the biasing mechanism, and a fourth power supply for supplying power to the electromagnetic coil;
the electric control module comprises a master console, and the master console is arranged on the side part of the vacuum chamber along the second direction.
Compared with the prior art, the beneficial effect of this application is:
the application provides a many arcs ion coating device includes the coating film module, and the coating film module includes real empty room, coating film arc source and sculpture arc source, and real empty room's inside is used for letting in reaction gas on vacuum environment's basis, through the surperficial sputter and the bombardment electron of sculpture arc source to the work piece, reaches the purpose that carries out the surface etching to the work piece and handles to through the surface deposition coating film of coating film arc source to the work piece. Therefore, the multi-arc ion coating device adopts the etching arc source to etch the surface of the workpiece, and then carries out deposition coating on the surface of the workpiece through the coating arc source, so that the deposition coating of the priming film layer and the functional film layer can be realized, the binding force between the outer surface of the workpiece and the film layer can be improved, and the high-performance functional film layer with compact structure, high hardness and high wear resistance can be obtained on the surface of the workpiece so as to meet various complex working conditions and process requirements. Wherein the hardness of the film layer is at least not less than Vickers Hardness (HV)2200, and can even reach Vickers Hardness (HV)3700 and above.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a multi-arc ion plating apparatus according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a vacuum chamber provided in an embodiment of the present application;
FIG. 3 is a schematic structural diagram of a side body of a multi-arc ion plating apparatus according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of a coating arc source according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a bottom cover plate according to an embodiment of the present application;
FIG. 6 is a schematic structural diagram of a suspension bracket provided in an embodiment of the present application;
fig. 7 is a schematic structural diagram of a hanging fixture of a hanging bracket according to an embodiment of the present application;
fig. 8 is a first structural schematic view of another suspension fixture of a suspension bracket provided in an embodiment of the present application;
fig. 9 is a second structural schematic diagram of another suspension fixture of a suspension bracket according to an embodiment of the present application;
FIG. 10 is a schematic structural diagram of a biasing mechanism provided in accordance with an embodiment of the present application;
FIG. 11 is a schematic view of a first structure of an evacuation module according to an embodiment of the present disclosure;
FIG. 12 is a first structural diagram of a cooling module according to an embodiment of the present disclosure;
FIG. 13 is an enlarged view of a portion of FIG. 12 at A;
fig. 14 is a second structural schematic diagram of the vacuum pumping module according to the embodiment of the present application.
Reference numerals are as follows:
1-a film coating module; 10-a vacuum chamber; 100-a door body section; 101-a body section; 102-a second cooling channel; 103-an air extraction opening; 104-a side wall; 105-a first cooling channel; 106-bottom cover plate; 11-an anode holder; 12-coating arc source; 120-adjusting sleeve; 121-fixing sleeves; 122-target fixation flange; 123-insulating spacer bush; 124-insulating ring; 125-coating arc target; 126-a shield; 127-a fixed magnetic field assembly; 1270-mounting seat; 1271-a first magnetic member; 128-a movable magnetic field assembly; 129-electrode; 130-an outer plate; 131-a water-cooled seat assembly; 13-etching the arc source group; 14-a suspension bracket; 1410-primary sun gear; 1411-primary planet; 1412-revolution plate; 1413-a transmission disc; 142-hanging a fixture; 1420-a jig base; 1421-a hanger; 1422 — secondary sun gear; 1423-deflector rod; 1424-secondary planet gears; 1425 — first bushing; 1426-circumferential external teeth; 1427-plectrum; 1428-second bushing; 1429-stop bolt; 143-support columns; 144-a cage; 145-a photosensor; 1450-a photoemissive part; 1451-a photoelectric receiving part; 146-a sensing plate; 15-a biasing mechanism; 150-an insulating base; 151-glass tube; 152-an introduction electrode; 153-patch panel; 154-fastening a conductive bolt; 16-a first coating arc source group; 17-a second coating arc source group; 18-a third coating arc source group; 19-a positioning assembly; 190-a motor; 191-a motor synchronizing wheel; 192-synchronous belts; 193-magnetofluidic synchronizing wheel; 194-a magnetic fluid; 195-a positioning plate; 196-a positioning pin; 2-vacuumizing module; 20-a control valve group; 200-a valve body; 201-an air exhaust channel; 202-a plugging component; 203-a drive member; 204-executing the rod; 21-a roughing pump assembly; 210-a first direct pump; 211-roots pump; 212-a first filter; 213-a first connection tube set; 22-a fine pump assembly; 220-a molecular pump; 221-a second connecting tube set; 222-a second inline pump; 23-leak detection holes; 24-a leak detection member; 3-a cooling module; 30-a first liquid inlet line; 300-a first liquid inlet joint; 3000-a first specific liquid inlet joint; 31-a first outlet line; 310-a first liquid outlet joint; 3100-a first specific tapping connection; 32-a second liquid inlet line; 320-a second liquid inlet joint; 33-a second outlet line; 330-second liquid outlet joint; 351-a first switching valve; 352-second switching valve; 353-a third switching valve; 354-a fourth switching valve; 360-a first pressure regulating tube set; 361-a first pressure regulating member; 362-a second pressure regulating tube set; 363-a second pressure regulating member; 370-pressure relief valve; 371-relief tube group; 380-temperature detecting means; 381-flow detection means; 382-a pressure detecting member; 4-a power supply module; 5-an electric control module; 50-a master console.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 14, embodiments of the present application provide a multi-arc ion plating apparatus to perform multi-arc ion plating on a workpiece.
The multi-arc ion plating device comprises a plating module 1, a vacuumizing module 2, a cooling module 3, a power module 4, an electric control module 5 and a suspension bracket 14.
The coating module 1 comprises a vacuum chamber 10, a coating arc source 12 and an etching component, wherein the etching component comprises an etching arc source, a baffle plate and an anode component. The coating arc source 12 and the etching arc source are both connected with the vacuum chamber 10, the anode assembly is arranged in the vacuum chamber 10 corresponding to the etching arc source, the baffle is arranged between the etching arc source and the anode assembly, the inside of the vacuum chamber 10 is used for introducing reaction gas, the etching arc source, the baffle and the anode assembly of the etching assembly are matched to carry out etching treatment on the surface of a workpiece, and the coating is carried out on the surface of the workpiece through the coating arc source 12.
A hanger bracket 14 is provided within the vacuum chamber 10 for hanging the workpiece.
The vacuum pumping module 2 is connected to the vacuum chamber 10 to perform a vacuum pumping process on the vacuum chamber 10.
The cooling module 3 can supply a cooling fluid to the vacuum pumping module 2 and the coating module 1.
The power module 4 can supply power to the coating module 1, the vacuumizing module 2 and the cooling module 3.
The electric control module 5 is electrically connected with the power module 4, the cooling module 3, the vacuumizing module 2 and the coating module 1, and is used for carrying out cooperative electric control on the power module 4, the cooling module 3, the vacuumizing module 2 and the coating module 1, so that the integral automatic control of the multi-arc ion coating device is realized, and the coating process and the coating state are monitored in real time and automatically regulated and controlled.
Hereinafter, the above-described components of the multi-arc ion plating apparatus will be described in detail.
In the alternative of this embodiment, a specific embodiment of the coating module 1 will be described first.
A coating cavity is formed inside the vacuum chamber 10, and a reaction gas is introduced into the coating cavity, specifically, the vacuum chamber 10 is first vacuumized by the vacuuming mechanism, so that a vacuum environment is formed inside the vacuum chamber 10, and then the reaction gas is introduced into the vacuum chamber 10 by the inflating mechanism, wherein the type of the reaction gas can be selected according to the coating process, for example, argon, nitrogen or acetylene can be introduced into the coating cavity.
Regarding the structure of the vacuum chamber 10, in an alternative of the present embodiment, the vacuum chamber 10 includes a top cover plate (not shown), a bottom cover plate 106 and a side body, the side body includes eight side walls 104 connected in an octagonal shape, the top cover plate and the bottom cover plate 106 are respectively sealed and covered on the top opening and the bottom opening of the side body, the sectional area of the side body is set to be octagonal, so as to facilitate the installation of the coating arc target 125 and the etching arc target on the side body.
In order to control the temperature of the vacuum chamber 10 itself and the coating space therein, the outer wall of the vacuum chamber 10 is provided with a first cooling channel 105 and a second cooling channel 102.
The first cooling channels 105 extend between the bottom and top ends of the side walls 104, and the length of the first cooling channels 105 is 0.1-2 times the height of the vacuum chamber 10, in particular the first cooling channels 105 extend entirely, for example, in a straight line or only partially in a slightly curved shape, and further, for example, the first cooling channels 105 extend entirely in a substantially U-shape or a substantially W-shape. The fast-forward cooling device is suitable for areas with higher temperature, fast-forward and fast-forward of cooling fluid are achieved, and the cooling effect is improved.
Further, in order to reduce the probability of stagnant deposition of cooling fluid therein, the flow cross section of the first cooling channel 105 is provided in a "narrower and higher" form, in particular, the height and width of the flow cross section of the first cooling channel 105 are each provided in the range of 5mm to 20mm, for example 5mm, 10mm, 15mm or 20 mm.
The second cooling channel 102 extends in a curved shape, and is suitable for a region with convenient temperature control, so that single large-area cooling can be realized.
Regarding the mounting structure of the coating arc sources 12 and the etching arc sources relative to the vacuum chamber 10, in the alternative of this embodiment, the number of the coating arc sources 12 and the number of the etching arc sources are both multiple, a plurality of coating arc sources 12 cooperate to perform coating operation, and a plurality of etching arc sources cooperate to perform etching operation, so as to improve the coating effect and the etching effect.
In order to ensure that the reaction gas near the coating arc source 12 and the etching arc source is sufficient, so as to improve the coating quality and the etching quality, the coating module 1 further comprises a reaction gas supply pipe, one end of the reaction gas supply pipe is used for connecting a gas source, and the other end of the reaction gas supply pipe extends into the vacuum chamber 10.
Each coating arc source 12 and each etching arc source are provided with a reaction gas supply pipe in one-to-one correspondence.
Alternatively, the inlet ends of the plurality of reaction gas supply pipes are adapted to communicate with the aeration mechanism through a supply gas distribution line.
In this embodiment, the etching component includes at least two etching arc sources, the at least two etching arc sources form an etching arc source group 13, the number of the etching arc source group 13 is at least one group, that is, the etching component includes two, three or more etching arc sources, and the at least two etching arc sources in the etching component form an etching arc source group 13, and further, the number of the etching arc source group 13 in the etching component is one group, two groups, three groups or more groups.
The at least three coating arc sources 12 form at least one coating arc source group, that is, the coating arc source group includes two, three or more coating arc sources 12, and further, the number of the coating arc source groups is one, two, three or more.
When the number of the etching arc source groups 13 and the number of the coating arc source groups are multiple, the multiple etching arc source groups 13 can be used alone or in combination, and the multiple coating arc source groups can be used alone or in combination.
In this embodiment, optionally, the etching arc source group 13 includes two etching arc sources, and each etching arc source group 13 is disposed on one sidewall 104 of the side body.
The coating arc source group comprises three coating arc sources 12, two coating arc sources 12 and another coating arc source 12 of each coating arc source group are respectively arranged on two side walls 104 of the side main body, specifically, two coating arc sources 12 and another coating arc source 12 of each coating arc source group are respectively arranged on two adjacent side walls 104 of the side main body, or a side wall 104 is arranged between two side walls 104 of each coating arc source group where two coating arc sources 12 and another coating arc source 12 are arranged.
Thereby improving the etching uniformity and the coating uniformity.
One side wall 104 of the side body is further provided with a vacuum pumping port 103, and the control valve set 20 is connected with the vacuum chamber 10 through the vacuum pumping port 103, so that the vacuum pump set performs a vacuum pumping process on the vacuum chamber 10 through the vacuum pumping port 103.
Further, the side body comprises a door section 100 and a body section 101 which are openably and closably connected, for example, the door section 100 is hinged with the body section 101.
The door body section 100 includes three side walls 104 connected in sequence, the main body section 101 includes the remaining five side walls 104 connected in sequence, the number of the etching arc source groups 13 is one group, the number of the plating arc source groups is three, and the three plating arc source groups are respectively a first plating arc source group 16, a second plating arc source group 17 and a third plating arc source group 18.
The etching arc source group 13 is disposed on the central sidewall 104 of the door section 100 and the three coating arc sources 12 of the first coating arc source group 16 are disposed on the remaining two sidewalls 104 of the door section 100, respectively.
The vacuum pumping hole 103 is opened on the side wall 104 of the main body section 101 opposite to the etching arc source, and the second coating arc source group 17 and the third coating arc source group 18 are respectively arranged on the main body section 101 and are respectively arranged on the two side walls 104 at the two sides of the vacuum pumping hole 103.
The etching arc source group 13, the first plating arc source group 16, the second plating arc source group 17, and the third plating arc source group 18 are arranged in this way, so that the first plating arc source group 16 can be used alone, and the second plating arc source group 17 and the third plating arc source group 18 can be used in combination.
In this embodiment, the coating arc source 12 and the etching arc source both include a first fixed magnetic field assembly 127, a first movable magnetic field, a first insulating connection assembly and an arc target, the arc target of the coating arc source 12 is a coating arc target 125, and the arc target of the etching arc source is an etching arc target. The arc target is connected with the vacuum chamber 10 and positioned in the coating cavity, and the arc target is connected with the cathode in a switching way, specifically, when the arc source is needed to work, the arc target is connected with the cathode, and when the arc source is not needed to work, the arc target and the cathode can be cut off.
The basic operating principle of the coating arc source 12 is based on the cold cathode vacuum arc discharge theory. The vacuum chamber 10 and the coating arc target 125 are respectively connected with the anode and the cathode of the first power supply of the power supply module 4, after the coating arc target 125 ignites a vacuum arc, some discontinuous, various and bright spots with various sizes and shapes appear on the surface of the coating arc target 125, the spots move irregularly on the surface of the coating arc target 125 rapidly, and when some spots go out, some spots are formed at other parts, so that the arc target can maintain arc combustion, and the spots of the coating arc target 125 emit target steam into a coating space, wherein 1 metal atom can be emitted every 10 electrons, and then the atoms are ionized to form high-energy positive ions, and the positive ions are combined with other ions (inert reaction gas ions) to deposit on the surface of a workpiece to form a coating when running in the vacuum chamber 10.
Alternatively, the target of the arc-shaped plating target 125 may be, for example, a single-element target of titanium, chromium, etc., a binary target, a ternary target, or a higher-element target, etc.
The etching arc source is used for etching the surface of the workpiece, such as cleaning impurities on the surface of the workpiece, roughening the surface of the workpiece, and the like. The basic working principle of the etching arc source is as follows:
the etching arc source is used in cooperation with the baffle and the anode assembly, the anode assembly and the etching arc target are respectively communicated with the anode and the cathode of the second power supply of the power module 4, the etching arc target is enabled to be simultaneously emitted by ions and electrons, the baffle is covered on the outer side of the etching arc target and is located between the anode assembly and the etching arc target, the baffle blocks the ions, only the electrons are enabled to emit towards the anode assembly, the electrons sputter and bombard the surface of a workpiece, and the purpose of etching the surface of the workpiece is achieved.
Alternatively, the target of the etching arc target may be a simple substance target of titanium, chromium, and the like, for example.
Optionally, the anode assembly is connected to the top cover plate by an anode holder 11 and is connected to the anode of the second power supply of the power module 4.
Specifically, the multi-arc ion plating device etches the surface of a workpiece through an etching arc source group 13 matched with a baffle and an anode assembly, then carries out deposition plating of a priming film layer through a first plating arc source group 16, and then carries out deposition plating of a functional film layer through a second plating arc source group 17 and a third plating arc source group 18, so that the multi-arc ion plating device is suitable for plating films of hobbing cutters, rod-shaped milling cutters, micro-drills, tool grains, saw blades and the like.
Further, the target material of the coating arc target 125 of each coating arc source group is selected according to the reaction gas, and the film layers that can be realized include, but are not limited to, 1-1.5 μm thick multi-layer ZrN with Vickers Hardness (HV) up to 2900- AlCr, TiN with a thickness of 2-3 μm and a Vickers Hardness (HV) as high as 2200-.
In the case of an AlCr-silicon tungsten substrate with a thickness of 3 to 4 μm, the targets of the arc targets 125 of the first arc source group 16 may be tungsten silicide targets, and the targets of the arc targets 125 of the second arc source group 17 and the third arc source group 18 may be AlCr targets. Further, for example, in the case of an AlCr-boron substrate with a thickness of 4 to 5 μm, the target material of the plating arc targets 125 of the first plating arc source group 16 may be selected to be a boron target material, and the target materials of the plating arc targets 125 of the second plating arc source group 17 and the third plating arc source group 18 may be both selected to be AlCr materials. For example, in the case of TiN having a thickness of 2 to 3 μm, the targets of the arc targets 125 of the first, second and third arc source groups 16, 17 and 18 may be Zr targets.
The multi-arc ion coating device can finish the deposition coating of the film layer at one time or finish the deposition coating of the film layer in a layered manner.
In order to reasonably control the motion tracks of the electric arcs on the etching arc target and the coating arc target 125, thereby improving the target metal ionization rate of the two arc targets. The fixed magnetic field assembly 127 and the movable magnetic field assembly 128 are used in combination to obtain a variable magnetic field, and the variable magnetic field acts on the target surface of the arc target, so that the aim of magnetically controlling the arc on the target surface of the arc target is fulfilled.
Wherein, the etching arc target and the coating arc target 125 adopt the same structure to connect the fixed magnetic field assembly 127 and the movable magnetic field assembly 128. Since, hereinafter, the connection structure and the operation principle of the fixed magnetic field assembly 127 and the movable magnetic field assembly 128 of the arc target 125 are described by taking the arc target 125 as an example, the connection structure and the operation principle of the fixed magnetic field assembly 127 and the movable magnetic field assembly 128 of the arc target are only needed to refer to the arc target 125, which is not described herein again.
Specifically, the coating arc targets 125 are all mounted on the vacuum chamber 10 through an insulating connection assembly, the fixed magnetic field assembly 127 is disposed outside the vacuum chamber 10 corresponding to the coating arc targets 125, and the movable magnetic field assembly 128 is movably connected with the fixed magnetic field assembly 127 through an adjustment assembly, so that by operating the adjustment assembly, the relative position relationship and the superposition effect of the magnetic field generated by the movable magnetic field assembly 128 and the magnetic field generated by the fixed magnetic field assembly 127 can be changed, so as to generate a variable magnetic field acting on the coating arc targets 125. That is, the variable magnetic field is a superposition of the magnetic field generated by the first fixed magnetic field assembly 127 and the magnetic field generated by the first movable magnetic field assembly.
Through setting up fixed magnetic field subassembly 127, can ensure that variable magnetic field satisfies basic magnetic control requirement, on this basis, through setting up the movable magnetic field subassembly 128 with fixed magnetic field subassembly 127 swing joint for variable magnetic field can be adjusted as required, specifically speaking, only need adjust the position of movable magnetic field subassembly 128 for fixed magnetic field subassembly 127, can realize the regulation to the control magnetic field. Therefore, the variable magnetic field can be adjusted to a desired state, so that the collision ionization probability of electrons and argon can be increased, the deposition rate is improved, the collision probability of electrons and metal atoms is increased, and the metal ionization rate is greatly improved.
Wherein, insulating coupling assembling and lateral part bulk phase are connected, and coating arc target 125 connects in the part that is located the coating film cavity body of insulating coupling assembling to not only can install coating arc target 125 in vacuum chamber 10 through this insulating coupling assembling, can prevent coating arc target 125 and vacuum chamber 10 direct conduction through insulating coupling assembling moreover, ensure that coating arc target 125 can realize discharging and also realize the target evaporation.
Optionally, the coating arc target 125 and the etching arc target are powered by the first power supply of the power module 4 via the electrode 129.
In this embodiment, the fixed magnetic field assembly 127 includes a mounting seat 1270 disposed on the insulating connection assembly and a fixed magnetic member disposed in the mounting seat 1270, and the magnetic field of the fixed magnetic field assembly 127 is generated by the fixed magnetic member, specifically, a mounting space for accommodating the first magnetic member 1271 is formed inside the mounting seat 1270, so as to realize the fixed mounting of the fixed magnetic member and the generated magnetic field thereof with respect to the arc target.
The movable magnetic field assembly 128 includes a frame body and a movable magnetic member disposed on the frame body, the frame body is provided with a mounting hole, the frame body is movably sleeved outside the mounting seat 1270 through the mounting hole, so that the movable magnetic member can move synchronously with the frame body, and thus the movable magnetic member moves relative to the mounting seat 1270, that is, the movable magnetic member and the magnetic field generated by the movable magnetic member can be movably mounted relative to the arc target.
Further, the structures of the movable magnetic member of the etching arc source and the movable magnetic member of the plating arc source 12 can be arranged differently, the movable magnetic member of the etching arc source comprises a first movable magnetic member, the movable magnetic member of the plating arc source 12 comprises a second movable magnetic member and a third movable magnetic member, and at least one of the second movable magnetic member and the third movable magnetic member is an electromagnetic coil.
Because the magnetic field of the movable magnetic field assembly 128 of the etching arc source is only generated by the first movable magnetic member, and the magnetic field generated by the movable magnetic field assembly 128 of the coating arc source 12 is formed by overlapping the magnetic field of the second movable magnetic member and the magnetic field of the third movable magnetic member, the arrangement rule of the magnetic lines of force of the magnetic field generated by the coating arc source 12 can be more three-dimensional, so that the coating magnetic control is more accurate, the coating quality is improved, the structure of the etching arc source is simpler, and the cost control is facilitated on the premise of meeting the etching magnetic control requirement.
Optionally, the magnet wires are powered by a fourth power supply of the power module 4.
As an embodiment for achieving position adjustment between the movable magnetron assembly and the fixed magnetron assembly by the adjustment assembly, both the etching arc source and the coating arc source 12 further comprise an outer plate 130.
The outer plate 130 and the insulation connection assembly are relatively fixedly arranged, the adjustment assembly comprises a fixed sleeve 121 and an adjustment sleeve 120, the adjustment sleeve 120 is in threaded connection with the outer plate 130, one end of the fixed sleeve 121 is in threaded connection with the adjustment sleeve 120, and the other end of the fixed sleeve 121 is connected with the frame body. When the adjustment sleeve 120 is rotated with respect to the outer plate 130, the fixing sleeve 121 rotates with respect to the adjustment sleeve 120, and the fixing sleeve 121 moves in the height direction of the mount 1270 while rotating.
Such as forward rotation of the adjustment sleeve 120, the fixed sleeve 121 is raised relative to the mounting block 1270 and causes the movable field assembly 128 to raise relative to the fixed field assembly 127 to effect a forward superposition adjustment of the control field, whereas, such as reverse rotation of the adjustment sleeve 120, the fixed sleeve 121 is lowered relative to the mounting block 1270 and causes the movable field assembly 128 to lower relative to the fixed field assembly 127 to effect a reverse superposition adjustment of the variable field. So that the variable magnetic field can be conveniently adjusted as required by the adjusting assembly.
In this embodiment, as an implementation of the structure of the insulating connection assembly, the insulating connection assembly includes an insulating spacer 123, a target fixing flange 122, and an insulating ring 124. Hereinafter, the insulating connection component of the coating arc source 12 is taken as an example for explanation, and the structure of the etching arc source adjustment component can refer to the coating arc source 12, and therefore, the details are not described herein.
The vacuum chamber 10 is provided with an arc source mounting seat 1270, and specifically, the arc source mounting seat 1270 is provided on the side body of the vacuum chamber 10, and the target fixing flange 122 is fixedly connected to the vacuum chamber 10 through the arc source mounting seat 1270, in other words, the target fixing flange 122 is connected to the arc source mounting seat 1270 through a fastener such as a bolt or a screw, so that the target fixing flange 122 is mounted on the vacuum chamber 10.
The inner ring of the target fixing flange 122 and the outer ring of the coating arc target 125 form a chute connection, so that the target fixing flange 122 and the coating arc target 125 can be disassembled and assembled by rotating the target fixing flange 122, and the coating arc target 125 is a consumable product, so that the replacement requirement is met, the two arc targets are connected through the chute instead of welding, the coating arc target 125 can be replaced conveniently, and the recycling of the target fixing flange 122 can be realized.
The insulating ring 124 is bonded to the target mounting flange 122, and a portion of the insulating ring 124 is disposed between the arc target 125 and the arc source mount 1270 to insulate the arc target 125 from the arc source mount 1270. since the insulating ring 124 is typically a non-metallic material, such as ceramic, it is not easy to weld the target mounting flange 122 to the insulating ring 124, and this bonding process can properly address the need for the connection between the insulating ring 124 and the target mounting flange 122.
An insulating spacer 123 is interposed between the end face of the target fixation flange 122 and the arc source mount 1270, so that the target fixation flange 122 (especially the portion not covered by the insulating ring 124) is insulated from the arc source mount 1270 by the insulating spacer 123.
In this embodiment, the arc source 12 and the arc source each further comprise a shield 126 connected to the target mounting flange 122. The connection between the shielding cover 126 and the plating arc target 125 is described by taking the plating arc source 12 as an example, and the connection structure of the shielding cover 126 of the etching arc source can refer to the plating arc source 12, which is not described herein again.
The shielding cover 126 is a cylinder surrounding the outer side of the coating arc target 125 along the circumferential direction of the coating arc target 125, so that the movement path of the target metal evaporated and emitted from the coating arc target 125 is restricted by the shielding cover 126, and the target metal moves towards the inner part of the coating space instead of the edge position of the coating space, thereby improving the metal ionization rate.
Specifically, the inner ring of the insulating ring 124 and the outer ring of the shield 126 form a sliding groove connection, so that the shield 126 can be detached from the insulating ring 124 by rotating the shield 126, thereby facilitating the detachment of the etching arc source.
In an alternative embodiment, the coating arc source 12 and the etching arc source each further comprise a water-cooled base assembly 131 and a heat-conducting plate for controlling the temperature of the arc target surface. The connection mode between the water-cooling seat assembly 131, the heat-conducting plate and the plating arc target 125 is described by taking the plating arc source 12 as an example, and the connection structure of the water-cooling seat assembly 131 and the heat-conducting plate of the etching arc source refers to the plating arc source 12, which is not described herein again.
The water-cooled socket assembly 131 is disposed on the end face of the target mounting flange 122 facing away from the vacuum chamber 10.
The coating arc target 125 passes through the hollow part of the target fixing flange 122 and is attached to the water-cooling seat assembly 131, and a water-cooling channel for introducing cooling fluid is formed inside the water-cooling seat assembly 131, so that the coating arc target 125 is efficiently cooled by the cooling fluid circulating in the water-cooling channel, and the purpose of controlling the surface temperature of the coating arc target 125 is achieved.
The heat conducting plate is clamped between the water-cooling seat assembly 131 and the coating arc target 125, and the water-cooling seat assembly 131 is connected with the target fixing flange 122, so that a structural foundation is provided for directly clamping the heat conducting plate between the target fixing flange 122 and the water-cooling seat assembly 131, and compared with a complex welding scheme, the defect rate caused by improper welding is reduced, the structural reliability is improved, and the cost is reduced.
In addition, the heat-conducting performance of the heat-conducting plate is high, and heat on the coating arc target 125 can be absorbed in time, so that the arc target is rapidly cooled, and the water-cooling seat assembly 131 ensures that the heat-conducting plate continuously absorbs heat from the coating arc target 125 by cooling the heat-conducting plate.
The heat conducting plate is made of copper, such as brass or red copper, and has good heat conducting performance.
In an alternative of this embodiment, based on the connection manner of the insulating connection assembly and the water cooling assembly, the magnetron assembly is disposed on the end surface of the water cooling seat assembly 131 away from the arc target.
In the alternative of this embodiment, in order to ensure that the surface of the workpiece is fully exposed in the coating cavity, so as to improve the coating uniformity, the workpiece to be coated is suspended by the suspension bracket 14, so that the coated workpiece is coated in a suspended state.
The hanging bracket 14 is arranged on the bottom cover plate 106, and the hanging bracket 14 is detachably connected with the bottom cover plate 106 through a positioning assembly 19 so as to realize the assembly and disassembly between the workpiece hung on the hanging bracket 14 and the vacuum chamber 10.
The positioning assembly 19 includes a rotary drive member, a spindle, and a positioning plate 195.
The suspension support 14 includes a revolution plate 1412, a primary sun gear 1410, a primary planet wheel 1411, a transmission plate 1413, and a plurality of suspension fixtures 142.
The positioning plate 195 is arranged on the bottom cover plate 106, a plurality of positioning pins 196 are arranged on the positioning plate 195, the first-level sun gear 1410 is detachably connected with the positioning plate 195 through the positioning pins 196, specifically, the first-level sun gear 1410 is provided with pin holes matched with the positioning pins 196, so that the hanging jig 142 is detachably mounted on the bottom cover plate 106 through the pin holes of the first-level sun gear 1410 and the positioning pins 196 of the positioning plate 195, and the hanging jig 142 is supported by the positioning plate 195.
The rotary driving member is disposed at the bottom side of the bottom cover plate 106, the bottom end of the rotating shaft is connected to the rotary driving member, and the top end of the rotating shaft penetrates through the bottom cover plate 106 and the positioning plate 195 and extends into the vacuum chamber 10, so that the rotary driving member can drive the rotating shaft to rotate while the bottom cover plate 106 and the positioning plate 195 are kept still.
The drive plate 1413 is removably attached to the top end of the shaft so that the rotary drive member can drive the hanger bracket 14 via the shaft and the drive plate 1413, and specifically, the primary sun gear 1410 remains stationary with the positioning plate 195 and the rotary drive member can drive the drive plate 1413 to rotate via the shaft.
The primary sun gear 1410 is arranged on the bottom cover plate 106, the transmission disc 1413 is rotatably arranged on the inner side of the primary sun gear 1410 at intervals, and the revolution disc 1412 is arranged on the top of the transmission disc 1413, so that the revolution disc 1412 and the transmission disc 1413 can rotate synchronously.
The bottom surface of the revolution disc 1412 is provided with primary annular inner teeth, the primary sun gear 1410 is located on the inner side of the primary annular inner teeth, the plurality of primary planet wheels 1411 are meshed between the primary annular inner teeth and the outer teeth of the primary sun gear 1410, specifically, the primary sun gear 1410 is kept static, the revolution disc 1412 rotates synchronously with the transmission disc 1413 and the rotating shaft, and meanwhile, each primary planet wheel 1411 revolves around the axis of the revolution disc 1412 along with the revolution disc 1412 and rotates around the axis of the revolution disc 1412.
The bottom ends of the plurality of hanging jigs 142 are coaxially connected with the plurality of primary planetary wheels 1411 through the revolution plate 1412 in a one-to-one correspondence manner, so that the plurality of hanging jigs 142 are rotatably erected on the revolution plate 1412, and each hanging jig 142 revolves and rotates once along with the corresponding primary planetary wheel 1411. Through revolution, the coating uniformity of workpieces on different hanging fixtures 142 is improved, and the influence of the hanging positions of the workpieces on the coating uniformity is reduced. Through one-time rotation, the coating uniformity of the same workpiece along the circumferential direction of the workpiece is improved, and the influence of the circumferential position of the workpiece on the coating uniformity is reduced.
Alternatively, the mounting and dismounting between the suspension frame 14 and the positioning assembly 19 may be achieved by a liftable forklift.
Alternatively, the rotary driving member is an electric motor 190 or an electric motor with a transmission mechanism, for example, the rotary driving member includes an electric motor 190, an electric motor synchronizing wheel 191, a synchronizing belt 192 and a magnetic fluid synchronizing wheel 193, the rotating shaft is a magnetic fluid 194, so that the electric motor 190 drives the electric motor synchronizing wheel 191 to rotate coaxially, the synchronizing belt 192 connects the electric motor synchronizing wheel 191 with the magnetic fluid synchronizing wheel 193, the magnetic fluid synchronizing wheel 193 rotates with the electric motor synchronizing wheel 191 and drives the magnetic fluid 194 to rotate, and the magnetic fluid 194 connects with the positioning plate 195 and drives the positioning plate 195 to rotate.
Optionally, a rotating shaft fixing flange is arranged at the top of the magnetic fluid 194, a rotating shaft transmission flange is arranged at the top of the rotating shaft fixing flange, a positioning slot is arranged on the bottom surface of the revolution plate 1412, and a positioning insertion column corresponding to the positioning slot is arranged on the top surface of the rotating shaft transmission flange. The rotating shaft fixing flange is fixedly connected with the magnetic fluid 194, and the rotating shaft transmission flange is fixedly connected with the rotating shaft fixing flange.
Alternatively, in order to reduce friction between the male rotation plate 1412 and the primary sun gear 1410, the male rotation plate 1412 is disposed at an opposite interval from the primary sun gear 1410 in the height direction of the vacuum chamber 10.
Optionally, a plurality of hanging jig mounting through holes are formed in the revolution plate 1412, the bottom ends of the hanging jigs 142 pass through the hanging jig mounting through holes to be coaxially connected with the corresponding first-stage planetary gears 1411, and a bearing member is installed between the hanging jigs 142 and the hanging jig mounting through holes to ensure that the hanging jigs 142 rotate smoothly with the first-stage planetary gears 1411.
Optionally, the suspension bracket 14 further includes a holder 144, the holder 144 is supported on the top of the revolution plate 1412 through the supporting column 143, and the top end of each suspension fixture 142 is rotatably connected to the holder 144, so that the shaking of each suspension fixture 142 can be effectively reduced, and the suspension fixture 142 is stably erected relative to the revolution plate 1412, so as to eliminate the adverse effect of the shaking of the suspension fixture 142 on the coating quality and improve the coating quality of the workpiece.
Optionally, in order to facilitate detecting the rotation of the revolution plate 1412, such as whether the revolution plate 1412 rotates, whether the revolution plate 1412 rotates to a zero position, and the like, the suspension bracket 14 further includes a rotation speed measuring assembly disposed at a side portion of the bottom end of the rotation shaft. Specifically, the rotation speed measuring assembly includes a photoelectric sensor 145, the photoelectric sensor 145 includes a photoelectric emitting portion 1450 and a photoelectric receiving portion 1451 which are disposed at intervals along the height direction of the vacuum chamber 10, the magnetofluid synchronizing wheel 193 is connected with an induction plate 146, the induction plate 146 always extends between the photoelectric emitting portion 1450 and the photoelectric receiving portion 1451, the induction plate 146 is provided with an induction slit, and only when the induction slit moves to the photoelectric emitting portion 1450 and the photoelectric receiving portion 1451, the photoelectric receiving portion 1451 can receive the photoelectric signal emitted by the photoelectric emitting portion 1450.
In this embodiment, as a first implementation manner of the hanging fixture 142, as shown in fig. 7, the hanging fixture 142 is a hanging rod.
In this embodiment, as another embodiment of the hanging jig 142, as shown in fig. 8 and 9, the hanging jig 142 is configured to be capable of performing secondary rotation. In order to realize the secondary rotation of the hanging fixture 142, the hanging fixture 142 includes a fixture base 1420 and a plurality of hangers 1421, the hangers 1421 are rotatably disposed on the fixture base 1420, and a supporting column 143 is disposed between every two adjacent hanging fixtures 142.
As a first embodiment of the secondary rotation, the hanging fixture 142 further includes a secondary sun gear 1422, a shift lever 1423, and a plurality of secondary planet gears 1424.
Jig base 1420 is formed with the annular internal tooth of second grade and with one-level planet wheel 1411 coaxial coupling, specifically speaking, jig base 1420 realizes coaxial coupling through first axle sleeve 1425 and one-level planet wheel 1411 to make jig base 1420 can take place once the rotation along with one-level planet wheel 1411.
The secondary sun wheels 1422 are arranged on the inner sides of the secondary annular inner teeth at intervals, a plurality of secondary planet wheels 1424 are meshed between the secondary sun wheels 1422 and the secondary annular inner teeth, one end of the shifting rod 1423 is connected with the secondary sun wheels 1422, the other end of the shifting rod 1423 can abut against the supporting column 143 on the side of the hanging jig 142, so that when the shifting rod 1423 abuts against the supporting column 143, the secondary sun wheels 1422 can be kept static relative to the supporting column 143, namely synchronously revolve along with the revolution disc 1412, and each secondary planet wheel 1424 rotates twice around the axis of the secondary planet wheel 1424 while rotating once along with the jig base 1420.
Specifically, the jig base 1420 may be provided with a plurality of hangers 1421, such as insertion tubes or hanging rods, coaxially connected to the primary planet wheels 1411.
Or, as a second embodiment of secondary rotation, the hanging fixture 142 includes a fixture base 1420, the fixture base 1420 is coaxially connected to the first-stage planetary gear 1411, specifically, the fixture base 1420 is provided with a second bushing 1428, a through hole for penetrating a shaft portion of the first-stage planetary gear 1411 is provided in the second bushing 1428, in order to ensure that the second bushing 1428 and the fixture base 1420 can rotate synchronously with the first-stage planetary gear 1411, the shaft portion of the first-stage planetary gear 1411 is connected to the second bushing 1428 through a rotation-stopping bolt 1429.
The plurality of hangers 1421 are respectively rotatably connected with the jig base 1420, the outer surface of the hanger 1421 is provided with circumferential external teeth 1426, the hanging jig 142 further comprises a shifting plate 1427, one end of the shifting plate 1427 is connected to the supporting column 143, the other end of the shifting plate 1427 is abutted with the circumferential external teeth 1426, wherein, the poking sheet 1427 has a certain elasticity, so that when the poking sheet 1427 abuts against one tooth of the circumferential external teeth 1426 of the hanger 1421, the hanger 1421 rotates once along with the jig base 1420, so that the hanger 1421 can apply pressure to the thumb pad 1427, so that the thumb pad 1427 deforms, the thumb pad 1427 applies a thumb force to the hanger 1421 during the deformation process, so that the hanging tool 1421 performs a secondary rotation around its axis, and after the hanging tool 1421 performs the secondary rotation, the dial 1427 is separated from the teeth of the hanging tool 1421, and contacts another tooth of the hanger 1421, thereby realizing continuous rotation of the hanger 1421.
In order to ensure that the hangers 1421 can rotate for two times continuously, a plurality of poking sheets 1427 may be arranged along the circumferential direction of the revolution plate 1412, so as to form a plurality of poking stations.
In this embodiment, the biasing mechanism 15 is used to introduce a bias voltage to the workpiece to be coated so that more electrons move toward the workpiece, and the biasing mechanism 15 includes an insulating protector, an introduction electrode 152, and a wiring board 153.
The insulation protection penetrates through the bottom cover plate 106, the introducing electrode 152 is arranged in the insulation protection, one end of the introducing electrode 152 is communicated with negative pressure at the bottom side of the bottom cover plate 106, the other end of the introducing electrode 152 is communicated with the positioning disc 195 through the wiring board 153, therefore, the positioning disc 195 introduces the negative pressure into a workpiece through the primary sun wheel 1410, the primary planet wheel 1411 and the hanging jig 142 in sequence, the workpiece with negative electricity can adsorb electrons emitted by an etching arc target, and the bombardment probability and the bombardment efficiency of the electrons to the workpiece are greatly improved.
Optionally, the insulating protection comprises an insulating seat 150 extending through the bottom cover plate 106, and a glass tube 151 protecting the lead-in electrode 152, so that electrical safety problems can be avoided.
Alternatively, the terminal plate 153 is connected to the lead-in electrode 152 by a fastening conductive bolt 154, and the terminal plate 153 is abutted against the positioning plate 195 by the fastening conductive bolt 154, so that the negative electricity on the lead-in electrode 152 is transmitted to the positioning plate 195 through the terminal plate 153 and the fastening conductive bolt 154 in sequence.
Alternatively, the leading electrode 152 of the biasing mechanism 15 is conducted to the cathode of the third power supply of the power module 4.
In this embodiment, the side body is provided with an observation window for facilitating observation of the operation in the vacuum chamber 10.
In an alternative of this embodiment, in order to realize the vacuum pumping of the coating chamber, the vacuum pumping module 2 includes a control valve set 20 and a pump set. The air pump group comprises a rough pump assembly 21 and a fine pump assembly 22, and the rough pump assembly 21 and the fine pump assembly 22 are communicated with the vacuum pumping port 103 through a control valve group 20.
Wherein, the rough pumping pump assembly 21 adopts large flow and high power to pump air, and the fine pumping pump assembly 22 adopts small flow and low power to pump air. Therefore, the rough pumping operation can be firstly carried out by adopting the rough pumping assembly 21 until the vacuum degree in the coating cavity reaches the basic requirement, and the rough pumping assembly 21 is closed to stop the operation. On one hand, in order to avoid the fluctuation of the vacuum degree in the coating cavity due to the lack of effective maintaining means, on the other hand, there may be a slight difference between the vacuum degree that can be achieved by the rough pumping assembly 21 and the ideal vacuum degree, so that in order to ensure that the vacuum degree can reach and be maintained at the ideal level, the fine pumping assembly 22 may be continuously or intermittently started to perform the pumping operation after the rough pumping assembly 21 stops operating.
In addition, the control valve set 20 can coordinate the communication switching relationship among the rough pumping pump assembly 21, the fine pumping pump assembly 22 and the coating chamber of the vacuum chamber 10.
In this embodiment, the control valve set 20 includes a valve body 200, the valve body 200 has an air inlet, an air outlet and a plurality of air pumping channels 201, each air pumping channel 201 is communicated between the air inlet and the air outlet, the valve body 200 is communicated with the vacuum pumping port 103 of the vacuum chamber 10 through the air inlet, and the rough pumping assembly 21 is connected between the air inlet and the vacuum pumping port 103.
Thereby carry out the operation when rough pump module 21, gaseous direct follow vacuum pump module 21 of being in the coating film cavity is taken out, do not pass through valve body 200, can avoid having impurity's gas for valve body 200, and the air of the smart pump module 22 air inlet department that is connected with valve body 200 shunts to a plurality of bleed passage 201 in, converge to the gas outlet again, the effect of shunting is carried out to the gas of taking out in valve body 200 inside has been realized, can slow down the velocity of flow to a certain extent, and then reach noise reduction effect.
The valve body 200 is further provided with a fine pumping outlet, the fine pumping outlet is communicated with the pumping channel 201, and the fine pumping outlet is located between the air inlet and the air outlet. Thereby when the back is shut down to rough pump module 21, during the operation of smart pump module 22, through dividing a plurality of pumping channel 201, can realize the multichannel is smart takes out, improves vacuum and maintains the precision, in addition, sets up a plurality of pumping channel 201 as each other not communicating, can avoid a plurality of smart pump module 22 to influence each other.
The control valve set 20 further includes a plugging component 202 and an opening/closing driving component, the plugging component 202 can be openably and closably covered on the fine pumping outlet, so that the fine pumping outlet is plugged by the plugging component 202 under the condition that the fine pumping pump component 22 is stopped, and especially under the condition that the rough pumping pump component 21 is operated, air leakage through the fine pumping outlet can be avoided, and air can be pumped from the air inlet to the air outlet.
The opening and closing driving assembly is connected with the plugging assembly 202 and can drive the plugging assembly 202 to open and close the fine extraction port, so that the automatic opening and closing of the fine extraction port is realized.
The opening and closing driving assembly comprises a driving member 203 and an execution rod 204, the driving assembly is arranged outside the valve body 200, one end of the execution rod 204 is connected with the driving assembly, the other end of the execution rod 204 extends into the air exhaust channel 201 to be connected with the plugging assembly 202, and the driving assembly drives the execution rod 204 to push or pull the plugging assembly 202 relative to the fine extraction opening so that the plugging assembly 202 closes or opens the fine extraction opening.
That is to say, the opening and closing driving assembly drives the actuating rod 204 to push the plugging assembly 202 relative to the fine extraction opening, so that the plugging assembly 202 closes the fine extraction opening; the opening and closing driving assembly drives the actuating rod 204 to pull the plugging assembly 202 relative to the fine extraction port, so that the plugging assembly 202 opens the fine extraction port.
Alternatively, the opening and closing driving assembly may be, for example, a member capable of driving the actuating rod 204 to push or pull, such as an air cylinder.
Optionally, the plugging assembly 202 includes a plugging plate and a crimping member, and one end of the actuating rod 204 is inserted into a slot of the plugging plate and connected to the plugging plate through the crimping member.
Specifically, the roughing pump assembly 21 includes a first direct pump 210, a roots pump 211, a first filter 212, and a first connection tube set 213, the first filter 212, the roots pump 211, and the first direct pump 210 are connected in sequence by the first connection tube set 213, and an inlet end of the first filter 212 communicates with the air outlet by the first connection tube set 213. The number of the first direct pumps 210 may be adjusted according to circumstances, for example, two first direct pumps 210 are respectively communicated with the roots pumps 211.
The fine pumping pump assembly 22 comprises a second direct pump 222, a second connecting pipe group 221 and a molecular pump 220, wherein the second direct pump 222 is communicated with the molecular pump 220 through the second connecting pipe group 221, and the molecular pump 220 is communicated with the fine pumping port. The number of the second direct connection pumps 222 is one, the number of the molecular pumps 220 is multiple and is the same as that of the pumping channels 201 of the control valve set 20, the plurality of molecular pumps 220 are communicated with the plurality of pumping channels 201 in a one-to-one correspondence, and the plurality of molecular pumps 220 are communicated with the second direct connection pumps 222 after being converged by the second connection pipe group 221.
Optionally, each of the first connection tube set 213 and the second connection tube set 221 may include a bellows, a connection tube, a tee, an elbow, a bend, and the like, wherein the space applicability of the vacuum pumping mechanism can be greatly improved by adjusting the length and the position of the bellows.
In order to facilitate the self-checking of the air leakage of the vacuum pumping module 2, the first connecting tube group 213 and the second connecting tube group 221 are both provided with a leakage checking hole 23 for installing a leakage checking member 24, wherein the leakage checking member 24 is a leakage checking probe.
In an alternative of this embodiment, the cooling module 3 includes a first liquid inlet pipeline 30, a first liquid outlet pipeline 31, a second liquid inlet pipeline 32, a second liquid outlet pipeline 33, a first liquid inlet joint 300, a first liquid outlet joint 310, a second liquid inlet structure, and a second liquid outlet joint 330.
The first liquid inlet pipeline 30 is provided with a plurality of first liquid inlet joints 300 to convey first cooling fluid to the temperature-raising parts through the plurality of first liquid inlet joints 300, the first liquid outlet pipeline 31 is provided with a plurality of first liquid outlet joints 310 to enable the first cooling fluid in the temperature-raising parts to flow back to the first liquid outlet pipeline 31 through the plurality of first liquid outlet joints 310, the first cooling fluid is cold water with lower temperature, and the cold water can be obtained by refrigerating normal-temperature water through a water chiller.
Therefore, the first liquid inlet pipeline 30 is matched with the first liquid outlet pipeline 31, the first cooling fluid is introduced into the temperature-easily-increased part through the first liquid inlet pipeline 30, and flows to the first liquid outlet pipeline 31 after cooling the temperature-easily-increased part through which the first cooling fluid passes, and the first cooling fluid after temperature increase is discharged through the first liquid outlet pipeline 31.
The second liquid inlet pipe 32 is provided with a plurality of second liquid inlet joints 320 to convey the second cooling fluid to the temperature-raising component through the plurality of second liquid inlet joints 320, the second liquid outlet pipe 33 is provided with a plurality of second liquid outlet joints 330 to enable the second cooling fluid in the temperature-raising component to flow back to the second liquid outlet pipe 33 through the plurality of second liquid outlet joints 330, the temperature of the first cooling fluid is lower than that of the second cooling fluid, and the second cooling fluid is normal-temperature warm water and can be directly connected with a tap water source to be obtained.
Therefore, the second liquid inlet pipeline 32 is matched with the second liquid outlet pipeline 33, the second cooling fluid is introduced into the second cooling flow channel through the second liquid inlet pipeline 32, and flows to the second liquid outlet pipeline 33 after cooling the parts which are easy to heat and pass through by the second cooling fluid, and the heated second cooling fluid is discharged through the second liquid outlet pipeline 33.
Wherein the temperature of the first cooling fluid is 12-19 ℃, and the temperature of the second cooling fluid is 25-30 ℃. Thereby be used for corresponding the easy components that heat up that need higher cooling capacity setting with first liquid inlet pipe way 30 and first liquid outlet pipe way 31, improve its cooling effect, and second liquid inlet pipe way 32 and second liquid outlet pipe way 33 are used for corresponding other easy components that heat up setting, not only are favorable to reducing the wasting of resources, can avoid these easy components that heat up department to appear condensation phenomenon moreover, and then reach the effect of having pointed to accurate cooling.
Alternatively, the first cooling fluid and the second cooling fluid may be supplied to the temperature increasing unit through a channel opened inside the temperature increasing unit, or may be supplied through a pipe externally disposed on the temperature increasing unit and in contact with the temperature increasing unit. Specifically, it is necessary to analyze which form is selected for supplying the cooling fluid according to the characteristics of the temperature-easily-raising member.
Specifically, the cooling requirements of the molecular pump 220, roots pump 211, etching arc source, coating arc source 12, and anode assembly are high, and thus the molecular pump 220, roots pump 211, etching arc source, coating arc source 12, and anode assembly need to be supplied with the first cooling fluid. That is, the first cooling fluid is delivered to the molecular pump 220, the roots pump 211, the etching arc source, the plating arc source 12 and the anode assembly through the first inlet line 30 to cool them, and is discharged through the first outlet line 31 after cooling and warming.
The cooling requirements of the arc source mount 1270, the arc striking mechanism, the biasing mechanism 15, the observation window, the door, the arc source mount 1270 and the power supply of the anode assembly can be met by the second cooling fluid, that is, the second cooling fluid is conveyed to the arc source mount 1270, the arc striking mechanism, the biasing mechanism 15, the observation window, the door, the arc source mount 1270 and the power supply of the anode assembly through the second liquid inlet pipeline 32 to cool the second cooling fluid, and after cooling and heating are completed, the second cooling fluid is discharged through the second liquid outlet pipeline 33.
Optionally, in order to reduce the risk of blocking the pipeline, a second filter is disposed at the inlet end of the second liquid inlet pipeline 32 to filter the second cooling fluid and then distribute the filtered second cooling fluid to the temperature-raising components of the second liquid inlet pipeline 32, and since the first cooling fluid output by the water chiller is usually pure water, there is no need to dispose a filter at the inlet end of the first liquid inlet pipeline 30.
In this embodiment, the first liquid inlet pipeline 30, the first liquid outlet pipeline 31, the second liquid inlet pipeline 32 and the second liquid outlet pipeline 33 all include a first end and a second end.
The first end of the first liquid inlet pipeline 30 is used for introducing a first cooling fluid, the first end of the second liquid inlet pipeline 32 is used for communicating a second cooling fluid, and the second end of the first liquid inlet pipeline 30 is communicated with the second end of the second liquid inlet pipeline 32.
The cooling module 3 further includes a first switching valve 351 and a second switching valve 352, the first switching valve 351 is disposed at the second end of the first liquid inlet pipeline 30, the second switching valve 352 is disposed at the first liquid inlet pipeline 30 and is spaced from the first end of the first liquid inlet pipeline 30, a plurality of first liquid inlet joints 300 for connecting the inlet of the molecular pump 220 and the inlet of the roots pump 211 are disposed between the second switching valve 352 and the first end of the first liquid inlet pipeline 30, and the first liquid inlet joint 300 for connecting the inlet of the molecular pump 220 and the inlet of the roots pump 211 is defined as a first specific liquid inlet joint 3000.
A first end of the first liquid outlet pipeline 31 is used for discharging the first cooling fluid, a first end of the second liquid outlet pipeline 33 is used for discharging the second cooling fluid, and a second end of the first liquid outlet pipeline 31 is communicated with a second end of the second liquid outlet pipeline 33.
The cooling module 3 further includes a third switching valve 353 and a fourth switching valve 354, the third switching valve 353 is disposed at the second end of the first liquid outlet pipe 31, the fourth switching valve 354 is disposed on the first liquid outlet pipe 31 and spaced from the first end of the first liquid outlet pipe 31, a plurality of first liquid outlet joints 310 for connecting the outlet of the molecular pump 220 and the outlet of the roots pump 211 are disposed between the fourth switching valve 354 and the first end of the first liquid outlet pipe 31, and the first liquid outlet joint 310 for connecting the outlet of the molecular pump 220 and the outlet of the roots pump 211 is defined as a first specific liquid outlet joint 3100.
The cooling module 3 can thus operate in several modes:
in a first mode: in a state where the first switching valve 351 is closed, the second switching valve 352 is opened, the third switching valve 353 is closed, and the fourth switching valve 354 is opened, the first liquid inlet line 30 and the second liquid inlet line 32 are blocked, and the first liquid outlet line 31 and the second liquid outlet line 33 are blocked, the first liquid inlet line 30 and the first liquid outlet line 31 can be cooled by the first cooling fluid, and the second liquid inlet line 32 and the second liquid outlet line 33 can be cooled by the second cooling fluid. This first mode is suitable for situations where the working environment is capable of providing both a first and a second supply of cooling fluid.
In the second mode, the first switching valve 351 is opened, the second switching valve 352 is closed, the third switching valve 353 is opened, and the fourth switching valve 354 is closed, so that the portion of the first liquid inlet pipeline 30 communicated with the second liquid inlet pipeline 32 is used for introducing the second cooling fluid, the portion of the first liquid inlet pipeline separated by the second switching valve 352 is used for introducing the first cooling fluid, correspondingly, the portion of the first liquid outlet pipeline 31 communicated with the second liquid outlet pipeline 33 is used for discharging the second cooling fluid, and the portion of the first liquid outlet pipeline 31 separated by the fourth switching valve 354 is used for discharging the first cooling fluid, that is, the molecular pump 220 and the roots pump 211 can still be cooled by the first cooling fluid in the first liquid inlet pipeline 30 and the first liquid outlet pipeline 31 through the first specific liquid inlet joint 3000 and the first specific liquid outlet joint 3100.
That is, the molecular pump 220 and the roots pump 211 can only be cooled by the first cooling fluid, and the coating arc source 12, the etching arc source, and the anode assembly can be actually determined to be cooled by the first cooling fluid or the second cooling fluid.
Because cooling module 3 is after operation certain time, the pressure oscillation appears easily, leads to first liquid inlet pipe way 30 and first liquid outlet pipe way 31 obvious pressure differential to appear, causes the damage to the pipeline easily. Therefore, in this embodiment, the cooling module 3 further includes a first pressure regulating pipeline, the first pressure regulating pipeline includes a first pressure regulating pipe set 360 and a first pressure regulating member 361, an inlet end of the first pressure regulating member 361 is communicated with the first liquid inlet pipeline 30, and an outlet end of the first pressure regulating member 361 is communicated with the first liquid outlet pipeline 31 through the first pressure regulating pipe set 360. When the first pressure regulating member 361 is turned on, the first liquid inlet pipeline 30 conveys the cooling fluid toward the first liquid outlet pipeline 31, so that the internal pressures of the first liquid inlet pipeline 30 and the first liquid outlet pipeline 31 are the same, thereby ensuring the pressure stability of the cooling module 3.
Optionally, the first pressure regulator 361 is a pressure relief valve.
Because cooling module 3 is after operation certain time, the pressure oscillation appears easily, leads to second liquid inlet pipe 32 and second liquid outlet pipe 33 obvious pressure differential to appear, causes the damage to the pipeline easily. Therefore, in this embodiment, the cooling module 3 further includes a second pressure regulating pipeline, the second pressure regulating pipeline includes a second pressure regulating pipe set 362 and a second pressure regulating member 363, an inlet end of the second pressure regulating member 363 is communicated with the second liquid inlet pipeline 32, and an outlet end of the second pressure regulating member 363 is communicated with the second liquid outlet pipeline 33. When the second pressure adjusting member 363 is turned on, the second liquid inlet pipe 32 conveys the cooling fluid toward the second liquid outlet pipe 33, so that the internal pressures of the second liquid inlet pipe 32 and the second liquid outlet pipe 33 are consistent, thereby ensuring the pressure stability of the cooling module 3.
Optionally, the second pressure regulator 363 is a pressure relief valve.
Optionally, in order to facilitate the monitoring of the pressure, the first liquid inlet line 30, the second liquid inlet line 32, the first liquid outlet line 31 and the second liquid outlet line 33 may be provided with a pressure detection member 382, such as a pressure gauge.
It is to be emphasized that, as shown in fig. 11 and 12, although the first pressure regulating line and the second pressure regulating line are viewed from the same angle in the figure, they are not actually communicated with each other, but two separate lines are used, and only because the heights of the two lines are set to be the same from the view angle in the figure, a visual error appears to be coincident.
In this embodiment, the cooling module 3 further includes a pressure relief pipeline, the pressure relief pipeline includes four pressure relief valves 370 and a pressure relief pipe group 371, inlets of the four pressure relief valves 370 are respectively communicated with the first liquid inlet pipeline 30, the first liquid outlet pipeline 31, the second liquid inlet pipeline 32 and the second liquid outlet pipeline 33, and the pressure relief pipe group 371 communicates outlets of the four pressure relief valves 370 with the outside.
Therefore, when any one of the first liquid inlet pipeline 30, the first liquid outlet pipeline 31, the second liquid inlet pipeline 32 and the second liquid outlet pipeline 33 has an overpressure phenomenon, the corresponding pressure relief valve 370 is triggered, and the overpressure pipeline discharges gas to the outside through the triggered pressure relief valve 370 and the outlet of the pressure relief pipe group 371, so as to achieve the purpose of pressure relief.
In this embodiment, the flow rate detection member 381 and the temperature detection member 380 are disposed on the second liquid outlet joint 330 and the first liquid outlet joint 310 to detect the drain flow rate and the drain temperature of the first cooling fluid and the second cooling fluid in real time, so as to avoid the leakage or over-temperature phenomenon. Specifically, the temperature of two paths of discharged water is required to be ensured not to exceed 35 ℃, and when the temperature is too high, the compressor of the water chiller is controlled to alarm.
Optionally, to facilitate the ignition of the arc of the etching arc target and the coating arc target 125, the multi-arc ion coating apparatus further comprises an arc striking mechanism disposed at a side of the etching arc source and a side of the coating arc source 12. The arc striking mechanism can be realized by adopting the existing structure, and the details are not described herein.
In this embodiment, in order to facilitate monitoring and controlling states of all the instruments, a coating process, and working states of the modules, the electronic control module 5 includes a console 50, and the console 50 is disposed on a side portion of the vacuum chamber 10 along the second direction, specifically, the console 50 is disposed on a side portion of the door section 100 of the vacuum chamber 10.
In an alternative of this embodiment, regarding the overall layout of the multi-arc ion plating apparatus, the control valve set 20, the cooling module 3 and the plating module 1 are integrated into a first structural portion, and the power module 4, the pump set and the electronic control module 5 are integrated into a second structural portion.
The control valve set 20 is connected with the coating module 1, and the control valve set 20 is detachably connected with the pumping pump set, so that the first structural part and the second structural part are detachably connected, and the pumping pump set is communicated with the vacuum chamber 10 through the control valve set 20.
Through the detachable connection of the first structure part and the second structure part, on one hand, the multi-arc ion plating device can be transported in a split mode, the transportation and carrying cost is saved, on the other hand, the control valve group 20 and the air pump group only relate to pipeline connection generally, and the connection between the control valve group and the air pump group is easy to operate, so that the first structure part and the second structure part can be efficiently disassembled and assembled.
Further, the control valve set 20 is disposed at a side of the coating module 1 along a first direction, and the cooling module 3 is disposed at a side of the coating module 1 along a second direction; the power supply module 4 and the electric control module 5 are respectively arranged on two sides of the air pump set along the second direction; the second structure portion is provided to a side portion of the first structure portion in the first direction. Therefore, the multi-arc ion plating device improves the space utilization rate, the whole layout is more compact, and the occupied area is saved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention. Furthermore, those skilled in the art will appreciate that while some embodiments described herein include some features included in other embodiments, rather than other features, combinations of features of different embodiments are meant to be within the scope of the invention and form different embodiments. For example, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

Claims (20)

1. A multi-arc ion plating apparatus, comprising:
the coating module comprises a vacuum chamber, a coating arc source and an etching assembly, wherein the etching assembly comprises an etching arc source, a baffle and an anode assembly;
the coating arc source and the etching arc source are both connected with the vacuum chamber, the anode assembly is arranged in the vacuum chamber corresponding to the etching arc source, the baffle is arranged between the etching arc source and the anode assembly, and reaction gas is introduced into the vacuum chamber.
2. The multi-arc ion plating apparatus of claim 1, further comprising:
the vacuumizing module is connected with the vacuum chamber and is used for vacuumizing the vacuum chamber;
the cooling module can supply cooling fluid to the vacuumizing module and the coating module;
the power supply module can supply power to the coating module, the vacuumizing module and the cooling module;
the electric control module is electrically connected with the power supply module, the cooling module, the vacuumizing module and the coating module, and can cooperatively control the power supply module, the cooling module, the vacuumizing module and the coating module.
3. The multi-arc ion plating apparatus of claim 2, wherein the vacuum pumping module comprises a pump set and a control valve set;
the control valve group, the cooling module and the coating module are integrated into a first structural part, and the power supply module, the air pump group and the electric control module are integrated into a second structural part;
the control valve group is connected with the coating module, and the control valve group is detachably connected with the air pumping pump group, so that the first structure part is detachably connected with the second structure part, and the air pumping pump group is communicated with the vacuum chamber through the control valve group.
4. The multi-arc ion plating apparatus of claim 3, wherein the control valve set is disposed at a side of the plating module along a first direction, and the cooling module is disposed at a side of the plating module along a second direction;
the power supply module and the electric control module are respectively arranged on two sides of the air suction pump group along the second direction;
the second structure portion is provided to a side of the first structure portion in the first direction.
5. The multi-arc ion plating apparatus of claim 3, wherein the etching assembly comprises at least two of the etching arc sources, at least two of the etching arc sources forming an etching arc source group, and at least three of the plating arc sources forming a plating arc source group;
the number of the etching arc source groups and the number of the coating arc source groups are at least one group;
the coating module further comprises a reaction gas supply pipe, one end of the reaction gas supply pipe is used for being communicated with a gas source, and the other end of the reaction gas supply pipe extends into the vacuum chamber;
the reaction gas supply pipes are arranged on each coating arc source and each etching arc source in a one-to-one correspondence mode.
6. The multi-arc ion plating apparatus according to claim 5,
the vacuum chamber comprises a side main body, a top cover plate and a bottom cover plate, the side main body comprises eight side walls connected in an octagonal shape, and the top cover plate and the bottom cover plate are respectively covered on a top end opening and a bottom end opening of the side main body;
the etching arc source group comprises two etching arc sources, and each etching arc source group is arranged on one side wall of the side main body;
the coating arc source group comprises three coating arc sources, and two coating arc sources and the other coating arc source of each coating arc source group are respectively arranged on two side walls of the side main body;
and one side wall of the side main body is also provided with a vacuum pumping hole, and the control valve group is connected with the vacuum chamber through the vacuum pumping hole.
7. The multi-arc ion plating apparatus of claim 6, wherein the side body comprises an openably and closably connected door section and a body section, the door section comprising three of the side walls connected in series, the body section comprising the remaining five of the side walls connected in series;
the number of the etching arc source groups is one group, the number of the coating arc source groups is three, and the three coating arc source groups are respectively a first coating arc source group, a second coating arc source group and a third coating arc source group;
the etching arc source group is arranged on the side wall positioned in the middle of the door body section, and the three coating arc sources of the first coating arc source group are respectively arranged on the other two side walls of the door body section;
the vacuum pumping hole is formed in the side wall, opposite to the etching arc source, of the main body section, and the second coating arc source and the third coating arc source are arranged on the main body section and are arranged on the two side walls on the two sides of the vacuum pumping hole respectively.
8. The multi-arc ion plating apparatus of claim 6, further comprising a suspension bracket;
the suspension bracket is arranged on the bottom cover plate, the top end of the anode assembly is connected with the top cover plate, the anode assembly and the etching arc source are respectively communicated with the anode and the cathode of the power supply module, and the anode assembly is positioned between the suspension bracket and the etching arc source;
the multi-arc ion film plating device also comprises a bias mechanism which is communicated with the cathode of the power supply module;
the bias mechanism is arranged on the bottom cover plate and electrically connected with the suspension bracket so as to enable the workpiece on the suspension bracket to be charged with negative electricity.
9. The multi-arc ion plating device according to claim 8, wherein the suspension bracket comprises a revolution plate, a primary sun wheel, a primary planet wheel, a transmission plate and a plurality of suspension jigs;
the first-stage sun wheel is arranged on the bottom cover plate, the transmission disc is rotatably arranged on the inner side of the first-stage sun wheel at intervals, and the revolution disc is arranged on the top of the transmission disc so as to enable the revolution disc and the transmission disc to rotate synchronously;
the bottom surface of revolution dish is provided with one-level annular internal tooth, the one-level sun gear is located the inboard of annular internal tooth, and is a plurality of one-level planet wheel mesh in one-level annular internal tooth with between the external tooth of one-level sun gear, it is a plurality of the bottom one-to-one that hangs the tool passes revolution dish and a plurality of one-level planet wheel coaxial coupling, so that it is a plurality of hang the tool and rotationally locate immediately the revolution dish.
10. The multi-arc ion plating apparatus of claim 9, wherein the hanging fixture comprises a fixture base and a plurality of hangers, the plurality of hangers being rotatably disposed on the fixture base;
a plurality of supporting columns are vertically arranged on the revolution plate, and one supporting column is arranged between every two adjacent hanging jigs;
the hanging jig further comprises a secondary sun gear, a shifting rod and a plurality of secondary planet gears, secondary annular internal teeth are formed on the jig base and are coaxially connected with the primary planet gears, the secondary sun gear is arranged on the inner side of the secondary annular internal teeth at intervals, the plurality of secondary planet gears are meshed between the secondary sun gear and the secondary annular internal teeth, one end of the shifting rod is connected with the secondary sun gear, and the other end of the shifting rod can abut against the supporting column on the side portion of the hanging jig;
or, hang the tool and include the tool base, the tool base with one-level planet wheel coaxial coupling, it is a plurality of the hanger respectively with the tool base rotationally connects, the surface of hanger is provided with circumference external tooth, hang the tool and still include the plectrum, the one end of plectrum connect in the support column, the other end of plectrum with circumference external tooth looks butt.
11. The multi-arc ion plating apparatus of claim 10, further comprising a positioning assembly, wherein the positioning assembly comprises a rotary driving member, a rotating shaft, and a positioning disk;
the positioning disc is arranged on the bottom cover plate, a plurality of positioning pins are arranged on the positioning disc, and the primary sun wheel is detachably connected with the positioning disc through the plurality of positioning pins;
the rotary driving piece is arranged at the bottom side of the bottom cover plate, the bottom end of the rotating shaft is connected with the rotary driving piece, and the top end of the rotating shaft penetrates through the bottom cover plate and the positioning disc to extend into the vacuum chamber;
the transmission disc is detachably connected with the top end of the rotating shaft, so that the rotary driving piece can drive the suspension bracket through the rotating shaft and the transmission disc;
and/or, the biasing mechanism includes an insulation shield, a lead-in electrode, and a terminal plate;
the insulation protection penetrates through the bottom cover plate, the leading-in electrode is arranged in the insulation protection, one end of the leading-in electrode is connected with the negative pressure of the power module at the bottom side of the bottom cover plate, and the other end of the leading-in electrode is communicated with the positioning plate through the wiring board.
12. The multi-arc ion plating device according to claim 8, wherein the plating arc source and the etching arc source each comprise a fixed magnetic field component, a movable magnetic field component, an adjusting component and an arc target, the arc target is connected with the vacuum chamber and located inside the vacuum chamber, and the arc target is connected with a cathode of the power module;
the fixed magnetic field assembly is arranged outside the vacuum chamber corresponding to the arc target, and the movable magnetic field assembly is movably connected with the fixed magnetic field assembly through the adjusting assembly so as to generate a variable magnetic field and enable the variable magnetic field to act on the target surface of the arc target;
the multi-arc ion plating device also comprises an insulation connecting assembly, and the fixed magnetic field assembly and the arc target are both arranged in the vacuum chamber through the insulation connecting assembly.
13. The multi-arc ion plating apparatus of claim 12, wherein the fixed magnetic field assembly comprises a mounting seat disposed on the insulating connection assembly and a fixed magnetic member disposed within the mounting seat;
the movable magnetic field assembly comprises a frame body and a movable magnetic member arranged on the frame body, the frame body is provided with a mounting hole, and the frame body is movably sleeved outside the mounting seat through the mounting hole;
the coating arc source and the etching arc source both further comprise outer plates;
the planking with insulation coupling assembling relatively fixedly sets up, adjusting part includes fixed cover and adjusting collar, the adjusting collar with planking looks spiro union, the one end of fixed cover with adjusting collar looks spiro union, the other end of fixed cover with the support body is connected.
14. The multi-arc ion plating device according to claim 12, wherein the target material of the arc target of the etching arc source is an elemental target material, and the target material of the arc target of the plating arc source is an elemental target material, a binary target material, a ternary target material or a multi-element target material;
and/or the movable magnetic component of the etching arc source comprises a first movable magnetic component, the movable magnetic component of the coating arc source comprises a second movable magnetic component and a third movable magnetic component, and at least one of the second movable magnetic component and the third movable magnetic component is an electromagnetic coil.
15. The multi-arc ion plating device according to claim 1, wherein the outer wall of the vacuum chamber is provided with a first cooling channel and a second cooling channel;
the first cooling channel extends between a bottom end and a top end of the vacuum chamber, and the length of the first cooling channel is 0.1-2 times the height of the vacuum chamber;
the second cooling channel extends in a curved shape.
16. The multi-arc ion plating apparatus of claim 14, wherein the control valve assembly comprises a valve body defining an inlet port, an outlet port, and a plurality of pumping channels, each of the pumping channels communicating between the inlet port and the outlet port;
the air pump set comprises a rough pump assembly and a fine pump assembly;
the valve body is communicated with a vacuum pumping hole of the vacuum chamber through the air inlet, and the rough pumping assembly is connected between the air inlet and the vacuum pumping hole;
the valve body is also provided with a fine pumping outlet which is communicated with the pumping channel, and the fine pumping outlet is positioned between the air inlet and the air outlet;
the control valve group further comprises a plugging assembly and an opening and closing driving assembly, the plugging assembly can be covered on the fine extraction port in an opening and closing mode, and the opening and closing driving assembly is connected with the plugging assembly and can drive the plugging assembly to open and close the fine extraction port.
17. The multi-arc ion plating device according to claim 16, wherein the opening/closing driving assembly comprises a driving member and an actuating rod, the driving member is disposed outside the valve body, one end of the actuating rod is connected to the driving member, the other end of the actuating rod extends into the pumping channel and is connected to the plugging member, and the driving member drives the actuating rod to push or pull the plugging member with respect to the fine pumping port, so that the plugging member closes or opens the fine pumping port;
the rough pump assembly comprises a first direct connection pump, a roots pump, a first filter and a first connecting pipe group, the first filter, the roots pump and the first direct connection pump are sequentially connected through the first connecting pipe group, and the inlet end of the first filter is communicated with the air outlet through the first connecting pipe group;
the fine pumping pump assembly comprises a second direct connection pump, a second connecting pipe set and a molecular pump, the second direct connection pump is communicated with the molecular pump through the second connecting pipe set, and the molecular pump is communicated with the fine pumping port;
the first connecting pipe group and the second connecting pipe group are provided with leak detection holes, and the leak detection holes are used for installing leak detection components.
18. The multi-arc ion plating device according to claim 17, wherein the cooling module comprises a first liquid inlet pipe, a first liquid outlet pipe, a second liquid inlet pipe, a second liquid outlet pipe, a first liquid inlet joint, a first liquid outlet joint, a second liquid inlet structure, and a second liquid outlet joint;
the first liquid inlet pipeline is provided with a plurality of first liquid inlet joints so as to convey first cooling fluid to the temperature-raising-prone component through the first liquid inlet joints, and the first liquid outlet pipeline is provided with a plurality of first liquid outlet joints so as to enable the first cooling fluid in the temperature-raising-prone component to flow back to the first liquid outlet pipeline through the first liquid outlet joints;
the second liquid inlet pipeline is provided with a plurality of second liquid inlet joints so as to convey second cooling fluid to the temperature-raising-prone component through the second liquid inlet joints, and the second liquid outlet pipeline is provided with a plurality of second liquid outlet joints so as to enable the second cooling fluid in the temperature-raising-prone component to flow back to the second liquid outlet pipeline through the second liquid outlet joints;
the temperature of the first cooling fluid is lower than the temperature of the second cooling fluid.
19. The multi-arc ion plating apparatus of claim 18, wherein the first fluid inlet line, the first fluid outlet line, the second fluid inlet line, and the second fluid outlet line each comprise a first end and a second end;
the first end of the first liquid inlet pipeline is used for introducing a first cooling fluid, the first end of the second liquid inlet pipeline is used for communicating a second cooling fluid, and the second end of the first liquid inlet pipeline is communicated with the second end of the second liquid inlet pipeline;
the cooling module further comprises a first switching valve and a second switching valve, the first switching valve is arranged at the second end of the first liquid inlet pipeline, the second switching valve is arranged on the first liquid inlet pipeline and is arranged at a distance from the first end of the first liquid inlet pipeline, and a plurality of first liquid inlet joints for communicating the inlet of the molecular pump with the inlet of the roots pump are arranged between the second switching valve and the first end of the first liquid inlet pipeline;
the first end of the first liquid outlet pipeline is used for discharging a first cooling fluid, the first end of the second liquid outlet pipeline is used for discharging a second cooling fluid, and the second end of the first liquid outlet pipeline is communicated with the second end of the second liquid outlet pipeline;
the cooling module further comprises a third switching valve and a fourth switching valve, the third switching valve is arranged at the second end of the first liquid outlet pipeline, the fourth switching valve is arranged on the first liquid outlet pipeline and is arranged at a distance from the first end of the first liquid outlet pipeline, and a plurality of first liquid outlet joints for communicating the outlet of the molecular pump with the outlet of the roots pump are arranged between the fourth switching valve and the first end of the first liquid outlet pipeline;
and/or the cooling module further comprises a first pressure regulating pipeline, the first pressure regulating pipeline comprises a first pressure regulating pipe group and a first pressure regulating piece, the inlet end of the first pressure regulating piece is communicated with the first liquid inlet pipeline, and the outlet end of the first pressure regulating piece is communicated with the first liquid outlet pipeline through the first pressure regulating pipe group;
the cooling module further comprises a second pressure regulating pipeline, the second pressure regulating pipeline comprises a second pressure regulating pipe group and a second pressure regulating piece, the inlet end of the second pressure regulating piece is communicated with the second liquid inlet pipeline, and the outlet end of the second pressure regulating piece is communicated with the second liquid outlet pipeline;
and/or, the cooling module still includes the pressure release pipeline, the pressure release pipeline includes four relief valves and pressure release nest of tubes, four the entry of relief valve respectively with first liquid inlet pipe way first liquid outlet pipe way the second liquid inlet pipe way with the second liquid outlet pipe way communicates, the pressure release nest of tubes will four the export of relief valve is linked together with the external world.
20. The multi-arc ion plating apparatus of claim 19, wherein the power module comprises a first power source for supplying power to the plating arc source, a second power source for supplying power to the etching arc source, a third power source for supplying power to the biasing mechanism, and a fourth power source for supplying power to the electromagnetic coil;
the electric control module comprises a master console, and the master console is arranged on the side part of the vacuum chamber along the second direction.
CN202210517313.9A 2022-05-12 2022-05-12 Multi-arc ion plating device Pending CN114717522A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210517313.9A CN114717522A (en) 2022-05-12 2022-05-12 Multi-arc ion plating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210517313.9A CN114717522A (en) 2022-05-12 2022-05-12 Multi-arc ion plating device

Publications (1)

Publication Number Publication Date
CN114717522A true CN114717522A (en) 2022-07-08

Family

ID=82231124

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210517313.9A Pending CN114717522A (en) 2022-05-12 2022-05-12 Multi-arc ion plating device

Country Status (1)

Country Link
CN (1) CN114717522A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115613001A (en) * 2022-10-26 2023-01-17 四川旭虹光电科技有限公司 Coated cylinder and use method thereof
CN117305800A (en) * 2023-11-29 2023-12-29 长沙正圆动力科技有限责任公司 Piston ring coating machine with multidimensional rotating frame

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115613001A (en) * 2022-10-26 2023-01-17 四川旭虹光电科技有限公司 Coated cylinder and use method thereof
CN115613001B (en) * 2022-10-26 2024-06-11 四川旭虹光电科技有限公司 Coating barrel and use method thereof
CN117305800A (en) * 2023-11-29 2023-12-29 长沙正圆动力科技有限责任公司 Piston ring coating machine with multidimensional rotating frame
CN117305800B (en) * 2023-11-29 2024-02-13 长沙正圆动力科技有限责任公司 Piston ring coating machine with multidimensional rotating frame

Similar Documents

Publication Publication Date Title
CN114717522A (en) Multi-arc ion plating device
JP3959273B2 (en) Ionized physical vapor deposition method and apparatus
TWI816698B (en) Substrate processing chamber having improved process volume sealing
US6641702B2 (en) Sputtering device
CN109844168B (en) Cathode unit for sputtering device
US9721769B2 (en) In-vacuum rotational device
CN101778961B (en) Sputtering apparatus and thin film formation method
CN108914073A (en) Sputtering target material with back-cooled slot
US5944968A (en) Sputtering apparatus
CN1603455A (en) Thin-film deposition system
CN114875358B (en) Composite vacuum coating equipment and application method thereof
CN217809633U (en) Multi-arc ion coating device
CN102066604A (en) Cathode unit and spattering device having same
CN219689835U (en) Vacuum magnetron sputtering double-sided coating system
CN113817999A (en) Vacuum coating equipment for preparing piezoelectric ceramics
US6402912B1 (en) Sputtering target assembly
TWI807165B (en) Physical vapor deposition methods
JP7326036B2 (en) Cathode unit for magnetron sputtering equipment
CN219526773U (en) Ion sputtering coating device
CN110592550A (en) Magnetron sputtering and electron beam evaporation double-cavity coating device and using method thereof
JP2006307274A (en) Vacuum system
CN115261801A (en) Diffusion plating integrated film coating device
CN220012774U (en) Coating equipment
CN114293153B (en) Multi-arc ion plating equipment
CN217600825U (en) Vacuum coating system

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination