CN114700886A - Sand blasting equipment for wafer processing - Google Patents
Sand blasting equipment for wafer processing Download PDFInfo
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- CN114700886A CN114700886A CN202210619308.9A CN202210619308A CN114700886A CN 114700886 A CN114700886 A CN 114700886A CN 202210619308 A CN202210619308 A CN 202210619308A CN 114700886 A CN114700886 A CN 114700886A
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- 238000005488 sandblasting Methods 0.000 title claims abstract description 44
- 238000012545 processing Methods 0.000 title claims abstract description 24
- 239000004576 sand Substances 0.000 claims abstract description 186
- 239000007921 spray Substances 0.000 claims abstract description 17
- 238000005422 blasting Methods 0.000 claims abstract description 14
- 238000007789 sealing Methods 0.000 claims description 34
- 238000001914 filtration Methods 0.000 claims description 19
- 238000004140 cleaning Methods 0.000 claims description 12
- 238000011084 recovery Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 8
- 230000006698 induction Effects 0.000 claims description 7
- 238000004064 recycling Methods 0.000 claims 1
- 239000000428 dust Substances 0.000 abstract description 8
- 239000012535 impurity Substances 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 79
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 210000002345 respiratory system Anatomy 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/08—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for polishing surfaces, e.g. smoothing a surface by making use of liquid-borne abrasives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/18—Abrasive blasting machines or devices; Plants essentially provided with means for moving workpieces into different working positions
- B24C3/20—Abrasive blasting machines or devices; Plants essentially provided with means for moving workpieces into different working positions the work being supported by turntables
- B24C3/22—Apparatus using nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C5/00—Devices or accessories for generating abrasive blasts
- B24C5/02—Blast guns, e.g. for generating high velocity abrasive fluid jets for cutting materials
- B24C5/04—Nozzles therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
- B24C9/003—Removing abrasive powder out of the blasting machine
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C9/00—Appurtenances of abrasive blasting machines or devices, e.g. working chambers, arrangements for handling used abrasive material
- B24C9/006—Treatment of used abrasive material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention discloses sand blasting equipment for processing a wafer, which comprises a rack assembly, wherein a wafer fixing assembly is arranged on a horizontal plate of the rack assembly and used for fixing the wafer, a sand blasting assembly is fixedly arranged on the horizontal plate and used for blasting sand on the surface of the wafer, a sand returning assembly is arranged on the horizontal plate and used for recovering sand grains on the rack assembly, the sand grains can be effectively prevented from leaking out through the combination of a lower shell and an upper shell, the wafer fixing assembly and a nozzle component are further sealed through the actions of a sand blasting outer shell, a feeding outer shell, a folding plate and the like in a sand grain collecting component, so that the aim of efficiently removing dust is fulfilled, the sand grains are collected through a funnel-shaped sand collecting bin after being sprayed out from a high-speed spray pipe, then are conveyed to a sand filter through a sand conveying driving piece for impurity removal, the sand grains after the impurities are removed are returned to a sand source, and the sand grains in the sand source enter the high-speed spray pipe through a sand inlet pipe again, this allows the grit to be reused, saving a significant amount of cost.
Description
Technical Field
The invention relates to the field of wafer processing equipment, in particular to sand blasting equipment for wafer processing.
Background
In the process of processing the quartz chip, some cut wafers need to be thinned, and the breakage rate caused by traditional grinding processing is high. Aiming at high-frequency and ultrahigh-frequency wafers, tests show that the wafer can be thinned by using a sand blasting and polishing method. However, the fine sand causes large dust, the manual operation environment is severe, and the damage to the respiratory system of people is large. In this context, such an automatic blasting apparatus has been developed to realize automatic production.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides sand blasting equipment for wafer processing.
The purpose of the invention is realized by the following technical scheme:
a sand blasting device for wafer processing comprises a rack assembly, a wafer fixing assembly, a sand blasting assembly and a sand return assembly, wherein the wafer fixing assembly is arranged on a horizontal plate of the rack assembly and used for fixing a wafer, the sand blasting assembly is fixedly arranged on the horizontal plate and used for blasting sand on the surface of the wafer, and the sand return assembly is arranged on the horizontal plate and used for recovering sand grains on the rack assembly;
the wafer fixing assembly comprises a motor fixing frame, a driving motor, a rotating plate, a wafer rotating part, a positioning switch part and a driving cylinder body, the motor fixing frame is fixedly arranged on the horizontal plate, the driving motor is fixedly arranged on the motor fixing frame, the rotating plate is fixedly arranged on an output shaft of the driving motor, the wafer rotating part is fixedly arranged on the rotating plate, the wafer rotating part is arranged on the rotating plate in a cross shape, the driving cylinder body is fixedly arranged on the horizontal plate and used for driving the wafer rotating part to act, and the positioning switch part is arranged between the motor fixing frame and the rotating plate;
the wafer rotating part comprises a wafer rotating disc, a rotating shaft, a connecting piece, a reset spring, a reset movable plate, a connecting plate, a reset fixed plate, a sliding rail and a sliding plate, the wafer rotating disc is arranged on the upper side of the rotating plate and fixedly connected with the upper end of the rotating shaft, the rotating shaft is fixed on the rotating plate through a bearing, the lower end of the rotating shaft is arranged on the L-shaped connecting piece, the connecting piece is fixedly arranged on the lower surface of the rotating plate, a gear is fixedly arranged on the rotating shaft, a rack matched with the gear is arranged on the sliding plate, the sliding plate is arranged on the sliding rail and can slide on the sliding rail, the sliding rail is fixedly arranged at one end of the connecting plate, the other end of the connecting plate is fixedly connected with the lower surface of the rotating plate, the end part of the sliding plate is fixedly connected with the reset movable plate, one end of the reset spring is connected with the reset movable plate, the other end of the reset spring is connected with the reset fixed plate, the reset fixed plate is fixedly arranged on the lower surface of the rotating plate, the reset movable plate is arranged close to the driving motor side, and the telescopic direction of the reset spring is parallel to the sliding direction of the sliding plate.
Further, the sandblast assembly comprises a nozzle part and a position adjusting part, wherein the nozzle part is arranged on the position adjusting part, and the position adjusting part is fixedly arranged on the horizontal plate.
Furthermore, the nozzle part comprises a nozzle fixing plate, an airflow inlet pipe, a sand inlet pipe, a high-speed spray pipe and a sand cleaning nozzle, the nozzle fixing plate is fixedly connected with the position adjusting part, the airflow inlet pipe is fixedly arranged on the nozzle fixing plate, the high-speed spray pipe is coaxially, hermetically and fixedly connected with the airflow inlet pipe, the sand inlet pipe is obliquely arranged on the airflow inlet pipe, the sand cleaning nozzle for cleaning sand on the surface of the wafer is arranged on the nozzle fixing plate, the input end of the airflow inlet pipe is connected with a high-pressure air source, and the input end of the sand inlet pipe is connected with a sand source.
Further, the position adjusting part comprises a fixed support, a sliding seat and a height adjusting rod, the fixed support is fixedly connected with the horizontal plate, the fixed support is provided with an X-direction sliding rail, the X-direction motor drives the sliding support to slide on the fixed support through a screw rod, the sliding support is provided with a Y-direction sliding rail, the Y-direction motor drives the sliding seat to slide on the sliding support through a screw rod, the sliding seat is provided with an angle adjusting motor, the upper end of the height adjusting rod is connected with an output shaft of the angle adjusting motor, and the lower end of the height adjusting rod is fixedly connected with the spray head fixing plate.
Furthermore, the sand return component comprises a sand collecting component and a sand recovery filtering component, the sand collecting component is arranged on the horizontal plate, the output end of the sand collecting component is connected with the input end of the sand recovery filtering component, and the output end of the sand recovery filtering component is connected with the sand source.
Further, the sand collecting component comprises a sand blasting outer shell, a feeding outer shell, a folding plate, a sand blasting baffle, a sand collecting bin and a sand discharge pipe, the sand blasting outer shell is arranged on the horizontal plate in a sealing manner, a feeding door is arranged on the sand blasting outer shell, the feeding door is provided with the feeding outer shell in a sealing manner, a taking and placing door is arranged on the feeding outer shell, the feeding outer shell is connected with the horizontal plate in a sealing manner, one side of the folding plate is connected with the inner wall of the sand blasting outer shell in a sealing manner, the other side of the folding plate is connected with the lower end of the sand blasting baffle in a sealing manner, the sand blasting baffle is fixedly connected with the sliding support in a sealing manner, the sand blasting baffle and the folding plate are matched with the inner wall of the sand blasting outer shell in a sealing manner, and the wafer rotating component and the nozzle component are both arranged inside the sand blasting outer shell, the horizontal plate is provided with a sand collecting hole which is matched with the nozzle component, the sand collecting bin is arranged on the sand collecting hole in a sealing mode, the lower end of the sand collecting bin is connected with one end of the sand discharge pipe in a sealing mode, and the other end of the sand discharge pipe is connected with the sand recovery filtering component in a sealing mode.
Furthermore, the sand recovery filtering component comprises a sand conveying driving piece, a sand conveying pipe, a sand filtering machine and a sand return pipe, wherein the input end of the sand conveying driving piece is connected with the sand discharge pipe in a sealing mode, the output end of the sand conveying driving piece is connected with the upper end of the sand filtering machine in a sealing mode through the sand conveying pipe, and the lower end of the sand filtering machine is connected with the sand source through the sand return pipe.
Furthermore, the positioning switch component comprises an induction protrusion and a photoelectric switch, the induction protrusion is fixedly arranged on the lower surface of the rotating plate, and the photoelectric switch is fixedly arranged on the motor fixing frame and matched with the induction protrusion.
Furthermore, the motor fixing frame is provided with an auxiliary rotating frame, the auxiliary rotating frame is provided with a rotating roller, and the rotating roller is matched with the lower surface of the rotating plate.
Further, the rack assembly further comprises a lower shell and an upper shell, wherein the upper shell is connected to the upper side of the horizontal plate, and the lower shell is connected to the lower side of the horizontal plate.
The invention has the beneficial effects that:
1) in the equipment, through the combination of the lower shell and the upper shell, dust can be effectively prevented from leaking, and the wafer fixing component and the nozzle component are further sealed through the effects of the sand blasting outer shell, the feeding outer shell, the folding plate and the like in the sand grain collecting component, so that the aim of efficiently removing dust is fulfilled.
2) In this equipment, under the effect of drive cylinder body, the wafer carousel in the wafer rotating part can drive the reciprocal rotation of wafer for the surface of wafer has been evenly processed, prevents that the uneven condition of thickness from appearing in the wafer.
3) In this equipment, the sand grain is collected through hourglass shape receipts sand silo after the blowout from high-speed spray tube, then carries out the edulcoration operation in carrying the sand filter through defeated sand driving piece, and the sand grain after the edulcoration gets back to in the sand source, enters into high-speed spray tube through the sand grain admission pipe once more in the sand source, makes sand grain repeatedly usable like this to a large amount of costs have been practiced thrift.
4) In the equipment, the output end of the high-speed spray pipe can be adjusted at any position under the action of the sliding support, the sliding seat, the height adjusting rod and the like of the position adjusting component, so that the wafer can be better processed.
Drawings
FIG. 1 is a view of the external three-dimensional connection structure of the sand blasting equipment;
FIG. 2 is a perspective view of the sand collecting member attached to the sand blasting apparatus;
FIG. 3 is a three-dimensional connecting structure diagram of the inside of the sand blasting equipment;
FIG. 4 is a perspective view of the sandblasting assembly;
FIG. 5 is a perspective view of the wafer mounting assembly;
FIG. 6 is a three-dimensional connection structure diagram of the positioning switch component on the motor fixing frame;
FIG. 7 is a first view of a three-dimensional connection structure of a wafer rotation device;
FIG. 8 is a second perspective view of the wafer rotation member;
in the figure, 1-horizontal plate, 2-wafer, 3-motor fixing frame, 4-driving motor, 5-rotating plate, 6-driving cylinder, 7-wafer rotating disc, 8-rotating shaft, 9-connecting piece, 10-return spring, 11-return movable plate, 12-connecting plate, 13-return fixed plate, 14-sliding rail, 15-sliding plate, 16-gear, 17-rack, 18-nozzle fixing plate, 19-airflow inlet pipe, 20-sand inlet pipe, 21-high-speed spray pipe, 22-sand cleaning nozzle, 23-fixing bracket, 24-sliding bracket, 25-sliding seat, 26-height adjusting rod, 27-X-direction motor, 28-Y direction motor, 29-angle adjusting motor, 30-sand blasting outer shell, 31-feeding outer shell, 32-folding plate, 33-sand blasting baffle, 34-sand collecting bin, 35-sand discharging pipe, 36-fetching and placing door, 37-sand collecting hole, 38-sand conveying driving piece, 39-sand conveying pipe, 40-sand filter, 41-sand returning pipe, 42-induction bulge, 43-photoelectric switch, 44-auxiliary rotating frame, 45-rotating roller, 46-lower shell, 47-upper shell, 48-protective shell, 49-X-direction sliding rail and 50-Y-direction sliding rail. .
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1 to 8, the present invention provides a technical solution:
the utility model provides a sand blasting equipment is used in wafer processing, includes frame subassembly, the fixed subassembly of wafer, sandblast subassembly and returns the sand subassembly, and the fixed subassembly of wafer sets up on the horizontal plate 1 of frame subassembly and is used for fixed wafer 2, and the sandblast subassembly is fixed to be set up on horizontal plate 1 and be used for carrying out the sandblast to the surface of wafer 2, returns the sand subassembly and sets up on horizontal plate 1 and be used for retrieving the sand grain on the frame subassembly. Wherein, the frame subassembly is used for bearing the fixed subassembly of wafer, sandblast subassembly and sand return subassembly, and the frame subassembly also plays sealed effect simultaneously, prevents to influence operating personnel with the dust that produces man-hour, and the fixed subassembly of wafer is used for fixed wafer 2, conveniently processes wafer 2, and the effect of sand return subassembly is that inside forms first sealed, prevents that sand grain and dust from leaking, filters the sand grain simultaneously for sand grain repeatedly usable in the course of working.
The wafer fixing component comprises a motor fixing frame 3, a driving motor 4, a rotating plate 5, a wafer rotating part, a positioning switch part and a driving cylinder body 6, the motor fixing frame 3 is fixedly arranged on a horizontal plate 1, the driving motor 4 is fixedly arranged on the motor fixing frame 3, the rotating plate 5 is fixedly arranged on an output shaft of the driving motor 4, the wafer rotating part is fixedly arranged on the rotating plate 5, the wafer rotating part is arranged on the rotating plate 5 in a cross shape, the driving cylinder body 6 is fixedly arranged on the horizontal plate 1 and used for driving the wafer rotating part to act, the positioning switch part is arranged between the motor fixing frame 3 and the rotating plate 5, an auxiliary rotating frame 44 is arranged on the motor fixing frame 3, a rotating roller 45 is arranged on the auxiliary rotating frame 44, and the rotating roller 45 is matched with the lower surface of the rotating plate 5. The positioning switch component comprises a sensing protrusion 42 and a photoelectric switch 43, the sensing protrusion 42 is fixedly arranged on the lower surface of the rotating plate 5, and the photoelectric switch 43 is fixedly arranged on the motor fixing frame 3 and matched with the sensing protrusion 42. The motor fixing frame 3 is used for fixing the driving motor 4 in the prior art, the driving motor 4 is used for driving the rotating plate 5 to rotate, four wafer rotating parts are arranged on the rotating plate 5 and are arranged in a cross mode, when a wafer 2 on one wafer rotating part is being machined, the wafer 2 on the opposite wafer rotating part is being loaded and unloaded, and therefore machining efficiency of the wafer 2 cannot be affected. The driving cylinder body 6 in the prior art can be a pneumatic cylinder or a hydraulic cylinder, and has the function that when the wafer 2 is processed, a piston rod on the driving cylinder body 6 pushes the wafer turntable 7 to rotate, so that the wafer 2 on the wafer turntable 7 can also rotate back and forth during processing, and the upper surface of the wafer 2 can not be uniformly processed. The rotating roller 45 is used for supporting the rotating plate 5 in an auxiliary mode, so that the gravity of the rotating plate 5 cannot act on the driving motor 4 completely, the driving motor 4 is prevented from being damaged, the rotating plate 5 is convenient to rotate, the rotating roller 45 is fixedly connected with the auxiliary rotating frame 44 through a roller shaft, the rotating roller 45 can rotate freely on the roller shaft, and four auxiliary rotating frames 44 are symmetrically and fixedly arranged on the motor fixing frame 3. The positioning switch component is used for positioning, when the induction protrusion 42 on the rotating plate 5 is matched with the photoelectric switch 43 in the prior art, the rotating plate 5 stops, the position at the moment is recorded as an initial position, the driving motor 4 transmits the position information at the moment to the control center in the prior art, and in the subsequent processing, the control center controls the driving motor 4 to rotate only 90 degrees at each time, and the automatic processing can be realized by equipment under the action of the control center. The driving motor 4 and the driving cylinder 6 are respectively arranged at two sides of the sand collecting hole 37.
The wafer rotating part comprises a wafer rotating disk 7, a rotating shaft 8, a connecting piece 9, a reset spring 10, a reset movable plate 11, a connecting plate 12, a reset fixed plate 13, a sliding rail 14 and a sliding plate 15, wherein the wafer rotating disk 7 is arranged on the upper side of the rotating plate 5 and is fixedly connected with the upper end of the rotating shaft 8, the rotating shaft 8 is fixed on the rotating plate 5 through a bearing, the lower end of the rotating shaft 8 is arranged on the L-shaped connecting piece 9, the connecting piece 9 is fixedly arranged on the lower surface of the rotating plate 5, a gear 16 is fixedly arranged on the rotating shaft 8, a rack 17 matched with the gear 16 is arranged on the sliding plate 15, the sliding plate 15 is arranged on the sliding rail 14 and can slide on the sliding rail 14, the sliding rail 14 is fixedly arranged at one end of the connecting plate 12, the other end of the connecting plate 12 is fixedly connected with the lower surface of the rotating plate 5, the end part of the sliding plate 15 is fixedly connected with the reset movable plate 11, one end of the reset spring 10 is connected with the reset movable plate 11, the other end of the return spring 10 is connected with a return fixed plate 13, the return fixed plate 13 is fixedly arranged on the lower surface of the rotating plate 5, the return movable plate 11 is arranged close to the driving motor 4, and the extension direction of the return spring 10 is parallel to the sliding direction of the sliding plate 15. During the sand blasting process, a piston rod of the driving cylinder 6 pushes the sliding plate 15 to slide on the sliding rail 14, at the moment, a rack 17 arranged on the sliding rail 14 pushes a gear 16 to rotate, the gear 16 drives a rotating shaft 8 to rotate, the rotating shaft 8 drives a wafer rotating disc 7 to rotate, the wafer rotating disc 7 drives a wafer 2 fixed on the upper side of the wafer rotating disc to rotate, during the pushing process of the piston rod, the reset movable plate 11 moves away from the reset fixed plate 13 side, the reset spring 10 is in a continuous stretching state, then the piston rod slowly retracts, at the moment, under the action of the reset spring 10, the rack 17 moves towards the driving cylinder 6, at the moment, the gear 16 drives the rotating shaft 8 and the wafer rotating disc 7 to rotate reversely, the stretching of the piston rod is slowly performed, the edge of the wafer 2 is fixed on the wafer rotating disc 7 through a screw with an elastic gasket, and the wafer 2 can be prevented from being separated from the wafer rotating disc 7. A protective shell 48 is arranged on the lower side of the wafer rotating part, the connecting piece 9, the return spring 10, the return movable plate 11, the connecting plate 12, the return fixed plate 13, the slide rail 14 and the slide plate 15 are all arranged inside the protective shell 48, and a hole matched with an output shaft of the driving cylinder 6 is arranged on the side wall of the protective shell 48.
In some embodiments, the blasting assembly includes a head part and a position adjustment part, the head part is disposed on the position adjustment part, and the position adjustment part is fixedly disposed on the horizontal plate 1. The nozzle part comprises a nozzle fixing plate 18, an airflow inlet pipe 19, a sand inlet pipe 20, a high-speed nozzle 21 and a sand cleaning nozzle 22, the nozzle fixing plate 18 is fixedly connected with the position adjusting part, the airflow inlet pipe 19 is fixedly arranged on the nozzle fixing plate 18, the high-speed nozzle 21 is coaxially and fixedly connected with the airflow inlet pipe 19 in a sealing mode, the sand inlet pipe 20 is obliquely arranged on the airflow inlet pipe 19, the sand cleaning nozzle 22 used for cleaning sand on the surface of the wafer 2 is arranged on the nozzle fixing plate 18, the input end of the airflow inlet pipe 19 is connected with a high-pressure air source, and the input end of the sand inlet pipe 20 is connected with a sand source. The high-pressure air source is the equipment in the prior art, the high-pressure air source provides high-speed air to enter from the air flow inlet pipe 19, then the high-speed air is mixed with sand grains in the sand grain inlet pipe 20 and then is sprayed out from the high-speed spray pipe 21, the high-speed sand grains sprayed out from the high-speed spray pipe 21 act on the wafer 2, the purpose of processing the wafer 2 is achieved, sand grains are remained on the processed wafer 2, then the air is sprayed out through the sand cleaning spray head 22 to be cleaned, and the sand cleaning spray head 22 is connected with the high-pressure air source. The sand source delivers sand particles to the sand inlet pipe 20 by means of an auger conveyor of the prior art, thereby providing sand particles to the sand inlet pipe 20.
In some embodiments, the position adjusting component includes a fixed bracket 23, a sliding bracket 24, a sliding seat 25 and a height adjusting rod 26, the fixed bracket 23 is fixedly connected with the horizontal plate 1, an X-direction sliding rail 49 is disposed on the fixed bracket 23, an X-direction motor 27 drives the sliding bracket 24 to slide on the fixed bracket 23 through a screw rod, a Y-direction sliding rail 50 is disposed on the sliding bracket 24, a Y-direction motor 28 drives the sliding seat 25 to slide on the sliding bracket 24 through a screw rod, an angle adjusting motor 29 is disposed on the sliding seat 25, the upper end of the height adjusting rod 26 is connected with an output shaft of the angle adjusting motor 29, and the lower end of the height adjusting rod 26 is fixedly connected with the nozzle fixing plate 18. The X-direction motor 27, the Y-direction motor 28 and the angle adjustment motor 29 are all motors in the prior art, and are controlled by a control center in the prior art. Since the area of the wafer 2 is large and the area of the high-speed nozzle 21 acting on the wafer 2 at a time is small, the high-speed nozzle 21 needs to move and process on the wafer 2. The high-speed nozzle 21 is moved in the front-rear direction by the X-direction motor 27, and the high-speed nozzle 21 is moved in the left-right direction by the Y-direction motor 28, and the angle adjusting motor 29 can be rotated, so that the spray angle of the high-speed nozzle 21 can be adjusted. The height adjusting rod 26 is detachably connected with the angle adjusting motor 29, so that any position of the height adjusting rod 26 can be fixed on the output shaft of the angle adjusting motor 29, thereby realizing the height adjustment of the high-speed nozzle 21.
In some embodiments, the sand reclamation assembly includes a sand collection component disposed on the horizontal plate 1, an output of the sand collection component coupled to an input of the sand reclamation filter component, and an output of the sand reclamation filter component coupled to a source of sand. The sand grain collecting component comprises a sand blasting outer shell 30, a feeding outer shell 31, a folding plate 32, a sand blasting baffle 33, a sand collecting bin 34 and a sand discharge pipe 35, wherein the sand blasting outer shell 30 is arranged on the horizontal plate 1 in a sealing manner, a feeding door is arranged on the sand blasting outer shell 30, the feeding outer shell 31 is arranged on the feeding door in a sealing manner, a taking and placing door 36 is arranged on the feeding outer shell 31, the feeding outer shell 31 is connected with the horizontal plate 1 in a sealing manner, one side of the folding plate 32 is connected with the inner wall of the sand blasting outer shell 30 in a sealing manner, the other side of the folding plate 32 is connected with the lower end of the sand blasting baffle 33 in a sealing manner, the sand blasting baffle 33 is fixedly connected with the sliding support 24 in a sealing manner, the sand blasting baffle 33 and the folding plate 32 are both matched with the inner wall of the sand blasting outer shell 30 in a sealing manner, a wafer rotating component and a nozzle component are both arranged inside the sand blasting outer shell 30, a sand collecting hole 37 is arranged on the horizontal plate 1, and the sand collecting hole 37 is matched with the nozzle component, the sand collecting bin 34 is arranged on the sand collecting hole 37 in a sealing mode, the lower end of the sand collecting bin 34 is connected with one end of the sand discharge pipe 35 in a sealing mode, and the other end of the sand discharge pipe 35 is connected with the sand recovery filtering component in a sealing mode. Wherein, sandblast shell body 30, material loading shell body 31 and receipts sand storehouse 34 all link to each other with 1 fixed seal of horizontal plate, it is sealed fixed continuous between sandblast shell body 30 and the material loading shell body 31, sandblast baffle 33 is fixed and can be slided together with sliding bracket 24 on sliding bracket 24, folded sheet 32 is connected between the inner wall of sandblast baffle 33 and sandblast shell body 30, the both ends of folded sheet 32 all set up in the spout, the spout sets up on the inner wall of sandblast shell body 30, prevent like this that sand grain and dust from leaking, it is used for taking out/putting in wafer 2 to get access door 36, it is provided with sealing door on the access door 36 to get access door, can seal man-hour. The sliding support 24 is also provided with a folding plate, and the folding plate is connected with the sliding seat 25 in a sealing way, so that the sliding seat 25 is prevented from leaking in the moving process.
In some embodiments, the sand recovery filter assembly includes a sand transport drive 38, a sand transport pipe 39, a sand filter 40, and a sand return pipe 41, wherein an input end of the sand transport drive 38 is sealingly connected to the sand discharge pipe 35, an output end of the sand transport drive 38 is sealingly connected to an upper end of the sand filter 40 through the sand transport pipe 39, and a lower end of the sand filter 40 is connected to a sand source through the sand return pipe 41. The sand conveying driving part 38 is a conveying auger in the prior art, so that sand grains containing impurities at the lower part can be conveyed to the upper end of the sand filtering machine 40 at the higher part, the sand filtering machine 40 is in the prior art, impurities in the sand grains can be filtered out, the purpose of purifying the sand grains is achieved, the purified sand grains enter a sand source again, the sand grains can be reused, and meanwhile, the impurities in the sand grains are completely removed.
In some embodiments, the rack assembly further comprises a lower housing 46 and an upper housing 47, the upper housing 47 being attached to the upper side of the horizontal plate 1, the lower housing 46 being attached to the lower side of the horizontal plate 1. The lower shell 46 and the upper shell 47 can play a role of sealing again, so that dust is further prevented from leaking, and the purpose of protecting workers is achieved.
In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
The foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the invention is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a sand blasting equipment for wafer processing which characterized in that: the wafer fixing component is arranged on a horizontal plate (1) of the rack component and used for fixing a wafer (2), the sand blasting component is fixedly arranged on the horizontal plate (1) and used for blasting sand to the surface of the wafer (2), and the sand returning component is arranged on the horizontal plate (1) and used for recovering sand grains on the rack component;
the wafer fixing assembly comprises a motor fixing frame (3), a driving motor (4), a rotating plate (5), a wafer rotating part, a positioning switch part and a driving cylinder body (6), the motor fixing frame (3) is fixedly arranged on the horizontal plate (1), the driving motor (4) is fixedly arranged on the motor fixing frame (3), the rotating plate (5) is fixedly arranged on an output shaft of the driving motor (4), the wafer rotating part is fixedly arranged on the rotating plate (5), the wafer rotating part is arranged on the rotating plate (5) in a cross shape, the driving cylinder body (6) is fixedly arranged on the horizontal plate (1) and is used for driving the wafer rotating part to move, and the positioning switch part is arranged between the motor fixing frame (3) and the rotating plate (5);
the wafer rotating part comprises a wafer rotating disk (7), a rotating shaft (8), a connecting piece (9), a reset spring (10), a reset movable plate (11), a connecting plate (12), a reset fixed plate (13), a sliding rail (14) and a sliding plate (15), wherein the wafer rotating disk (7) is arranged on the upper side of the rotating plate (5) and fixedly connected with the upper end of the rotating shaft (8), the rotating shaft (8) is fixed on the rotating plate (5) through a bearing, the lower end of the rotating shaft (8) is arranged on the L-shaped connecting piece (9), the connecting piece (9) is fixedly arranged on the lower surface of the rotating plate (5), a gear (16) is fixedly arranged on the rotating shaft (8), a rack (17) matched with the gear (16) is arranged on the sliding plate (15), the sliding plate (15) is arranged on the sliding rail (14) and can slide on the sliding rail (14), the fixed setting of slide rail (14) is in the one end of connecting plate (12), the other end of connecting plate (12) with the lower fixed surface of rotor plate (5) links to each other, the tip of slide (15) with reset movable plate (11) are fixed to be continuous, the one end of reset spring (10) with reset movable plate (11) link to each other, the other end of reset spring (10) with reset fixed plate (13) link to each other, reset fixed plate (13) are fixed to be set up on the lower surface of rotor plate (5), reset movable plate (11) are close to driving motor (4) side sets up, reset spring (10) flexible direction with the sliding direction of slide (15) is parallel.
2. The blasting apparatus for wafer processing according to claim 1, wherein: the sand blasting assembly comprises a nozzle part and a position adjusting part, wherein the nozzle part is arranged on the position adjusting part, and the position adjusting part is fixedly arranged on the horizontal plate (1).
3. The blasting apparatus for wafer processing according to claim 2, wherein: the nozzle part comprises a nozzle fixing plate (18), an airflow inlet pipe (19), a sand inlet pipe (20), a high-speed spray pipe (21) and a sand cleaning nozzle (22), the nozzle fixing plate (18) is fixedly connected with the position adjusting part, the airflow inlet pipe (19) is fixedly arranged on the nozzle fixing plate (18), the high-speed spray pipe (21) is coaxially, hermetically and fixedly connected with the airflow inlet pipe (19), the sand inlet pipe (20) is obliquely arranged on the airflow inlet pipe (19), the sand cleaning nozzle (22) used for cleaning sand on the surface of the wafer (2) is arranged on the nozzle fixing plate (18), the input end of the airflow inlet pipe (19) is connected with a high-pressure air source, and the input end of the sand inlet pipe (20) is connected with a sand source.
4. The blasting apparatus for wafer processing according to claim 3, wherein: the position adjusting component comprises a fixed bracket (23), a sliding bracket (24), a sliding seat (25) and a height adjusting rod (26), the fixed support (23) is fixedly connected with the horizontal plate (1), an X-direction sliding rail (49) is arranged on the fixed support (23), an X-direction motor (27) drives the sliding support (24) to slide on the fixed support (23) through a screw rod, a Y-direction sliding rail (50) is arranged on the sliding support (24), a Y-direction motor (28) drives the sliding seat (25) to slide on the sliding support (24) through a screw rod, an angle adjusting motor (29) is arranged on the sliding seat (25), the upper end of the height adjusting rod (26) is connected with an output shaft of the angle adjusting motor (29), the lower end of the height adjusting rod (26) is fixedly connected with the spray head fixing plate (18).
5. The blasting apparatus for wafer processing according to claim 3 or 4, wherein: the sand return assembly comprises a sand collecting component and a sand recovery filtering component, the sand collecting component is arranged on the horizontal plate (1), the output end of the sand collecting component is connected with the input end of the sand recovery filtering component, and the output end of the sand recovery filtering component is connected with the sand source.
6. The blasting apparatus for wafer processing according to claim 5, wherein: sand grain collecting part includes sandblast shell body (30), material loading shell body (31), folded sheet (32), sandblast baffle (33), receipts sand silo (34) and sand discharge pipe (35), sandblast shell body (30) is sealed to be set up on horizontal plate (1), be provided with the material loading door on sandblast shell body (30), the material loading door upper seal is provided with material loading shell body (31), be provided with on material loading shell body (31) and get and put door (36), material loading shell body (31) with horizontal plate (1) sealing connection, one side of folded sheet (32) with the inner wall sealing connection of sandblast shell body (30), the opposite side of folded sheet (32) with the lower extreme sealing connection of sandblast baffle (33), sandblast baffle (33) with sliding support (24) is sealed fixed to be connected to each other, sandblast baffle (33) with folded sheet (32) all with the inner wall of sandblast shell body (30) is sealed to be joined in marriage The wafer rotating part and the nozzle part are both arranged inside the sand blasting outer shell (30), a sand collecting hole (37) is formed in the horizontal plate (1), the sand collecting hole (37) is matched with the nozzle part, the sand collecting bin (34) is arranged on the sand collecting hole (37) in a sealing mode, the lower end of the sand collecting bin (34) is connected with one end of the sand discharge pipe (35) in a sealing mode, and the other end of the sand discharge pipe (35) is connected with the sand recovery filtering part in a sealing mode.
7. The blasting apparatus for wafer processing according to claim 6, wherein: the sand recycling and filtering component comprises a sand conveying driving piece (38), a sand conveying pipe (39), a sand filtering machine (40) and a sand return pipe (41), the input end of the sand conveying driving piece (38) is connected with the sand discharge pipe (35) in a sealing mode, the output end of the sand conveying driving piece (38) is connected with the upper end of the sand filtering machine (40) in a sealing mode, and the lower end of the sand filtering machine (40) is connected with the sand return pipe (41).
8. The blasting apparatus for wafer processing according to any one of claims 1 to 4, wherein: the positioning switch component comprises an induction protrusion (42) and a photoelectric switch (43), the induction protrusion (42) is fixedly arranged on the lower surface of the rotating plate (5), and the photoelectric switch (43) is fixedly arranged on the motor fixing frame (3) and matched with the induction protrusion (42).
9. The blasting apparatus for wafer processing according to any one of claims 1 to 4, wherein: the motor fixing frame (3) is provided with an auxiliary rotating frame (44), the auxiliary rotating frame (44) is provided with a rotating roller (45), and the rotating roller (45) is matched with the lower surface of the rotating plate (5).
10. The blasting apparatus for wafer processing according to any one of claims 1 to 4, wherein: the rack assembly further comprises a lower shell (46) and an upper shell (47), wherein the upper shell (47) is connected to the upper side of the horizontal plate (1), and the lower shell (46) is connected to the lower side of the horizontal plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210619308.9A CN114700886A (en) | 2022-06-02 | 2022-06-02 | Sand blasting equipment for wafer processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210619308.9A CN114700886A (en) | 2022-06-02 | 2022-06-02 | Sand blasting equipment for wafer processing |
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| CN114700886A true CN114700886A (en) | 2022-07-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210619308.9A Pending CN114700886A (en) | 2022-06-02 | 2022-06-02 | Sand blasting equipment for wafer processing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116276672A (en) * | 2023-05-25 | 2023-06-23 | 四川上特科技有限公司 | Wafer sand blasting mechanism and sand blasting device |
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Application publication date: 20220705 |