CN114698363A - Manufacturing method of adapter assembly and adapter - Google Patents
Manufacturing method of adapter assembly and adapter Download PDFInfo
- Publication number
- CN114698363A CN114698363A CN202011610521.0A CN202011610521A CN114698363A CN 114698363 A CN114698363 A CN 114698363A CN 202011610521 A CN202011610521 A CN 202011610521A CN 114698363 A CN114698363 A CN 114698363A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- power chip
- glue
- groove
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000003292 glue Substances 0.000 claims abstract description 110
- 230000000903 blocking effect Effects 0.000 claims abstract description 90
- 239000000779 smoke Substances 0.000 claims abstract description 38
- 238000004382 potting Methods 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 24
- 239000003990 capacitor Substances 0.000 claims description 10
- 230000001050 lubricating effect Effects 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 66
- 238000010586 diagram Methods 0.000 description 24
- 230000008569 process Effects 0.000 description 19
- 239000012790 adhesive layer Substances 0.000 description 9
- 235000019504 cigarettes Nutrition 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000003546 flue gas Substances 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/005—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for making dustproof, splashproof, drip-proof, waterproof, or flameproof connection, coupling, or casing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0478—Simultaneously mounting of different components
- H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The application provides a manufacturing method of an adapter assembly and an adapter. The manufacturing method comprises the steps of providing a mold, a circuit board assembly and a blocking piece, wherein the mold is provided with a glue pouring groove; the circuit board assembly comprises a circuit board and a power chip arranged on the circuit board. At least part of the blocking part is arranged on the side of the power chip, which faces away from the circuit board. And arranging the circuit board assembly and at least part of the blocking piece in the glue pouring groove. And (5) pouring glue into the glue pouring groove to form a glue pouring layer on the circuit board assembly. And removing the mold and the blocking piece to expose the power chip. Because the blocking piece blocks at least one surface of the power chip, the surface of the power chip can be exposed after the glue filling is finished and the blocking piece is removed. Because the surface of the power chip is not provided with the encapsulating layer, and other areas are still protected by the encapsulating layer, when the power chip explodes to generate conductive smoke, the conductive smoke can be guided out of the adapter from the smoke exhaust groove formed at the blocking piece, and the safety performance of the adapter assembly is improved.
Description
Technical Field
The application belongs to the technical field of adapters, and particularly relates to a manufacturing method of an adapter assembly and an adapter.
Background
An adapter is one of the main components for charging an electronic device, and generally includes a housing and a circuit board assembly including a circuit board and various electronic components, such as power chips, disposed on the circuit board. When the adapter is manufactured, the circuit board assembly is usually required to be inserted into the accommodating space in the shell, and then glue is filled into the shell, so that the accommodating space is filled, but the conductive smoke of the power chip cannot be discharged in time when the power chip explodes due to the addition of the glue filling layer, and the safety performance of the adapter is reduced.
Disclosure of Invention
In view of this, the present application provides, in a first aspect, a method of manufacturing an adapter assembly, including:
providing a mold, a circuit board assembly and a blocking piece, wherein the mold is provided with a glue pouring groove; the circuit board assembly comprises a circuit board and a power chip arranged on the circuit board;
arranging at least part of the blocking piece on one side of the power chip, which is far away from the circuit board;
arranging the circuit board assembly and at least part of the blocking piece in the glue pouring groove;
pouring glue into the glue pouring groove to form a glue pouring layer on the circuit board assembly; and removing the die and the barrier piece to expose the power chip.
In the manufacturing method provided by the first aspect of the application, the required structure of the encapsulating layer is obtained by changing the time sequence for forming the encapsulating layer. Before the circuit board assembly is installed in the shell, the circuit board assembly is firstly placed in a glue pouring groove in a mould, and a glue pouring layer is formed on the surface of the circuit board assembly. And before the circuit board assembly is arranged in the glue filling groove, the blocking piece can be arranged on one side of the power chip, which is far away from the circuit board. When glue is poured into the glue pouring groove, the blocking piece blocks at least one surface of the power chip, so that the surface of the power chip can be exposed after the glue is poured and the blocking piece is removed, and the structure of the glue pouring layer is effectively controlled. Because the surface of the power chip is not provided with the encapsulating layer, and other areas are still protected by the encapsulating layer, when the power chip explodes to generate conductive smoke, the conductive smoke can be guided out of the adapter from the smoke exhaust groove formed at the blocking piece, and the safety performance of the adapter assembly is improved.
The application second aspect provides an adapter, the adapter includes shell, plug subassembly and adapter subassembly, accommodating space has in the shell, adapter subassembly locates in the accommodating space, circuit board subassembly electricity is connected plug subassembly, be equipped with on the encapsulating layer and arrange the cigarette groove and make power chip exposes, plug subassembly be equipped with the smoke vent of groove intercommunication of discharging fume.
The adapter that this application second aspect provided, this adapter subassembly includes circuit board subassembly and locates the encapsulating layer on circuit board subassembly surface, and the encapsulating layer is equipped with row cigarette groove and makes power chip expose. Thus, after the shell, the plug assembly and the adapter assembly are assembled, the other areas are still protected by the glue filling layer. Therefore, when the power chip explodes and generates conductive smoke, the conductive smoke can be discharged out of the adapter from the smoke discharge hole along the smoke discharge groove because the surface of the power chip is not provided with the glue filling layer, and the safety performance of the adapter assembly is improved.
Drawings
In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.
FIG. 1 is a process flow diagram of a method of manufacturing an adapter assembly according to an embodiment of the present application.
Fig. 2-6 are schematic diagrams corresponding to S100, S200, S300, S400, and S500 in fig. 1, respectively.
Fig. 7 is a process flow diagram included in S200 according to an embodiment of the present disclosure.
Fig. 8 is a top view corresponding to S210 in fig. 7.
Fig. 9 is a process flow diagram included in S200 according to another embodiment of the present disclosure.
Fig. 10 is a schematic cross-sectional view corresponding to S220 in fig. 9.
Fig. 11 is a process flow diagram included in S200 according to yet another embodiment of the present disclosure.
Fig. 12 is a process flow diagram included in S300 according to an embodiment of the present disclosure.
Fig. 13 is a diagram corresponding to S310 in fig. 12.
Fig. 14 is a process flow diagram included in S300 according to another embodiment of the present disclosure.
Fig. 15 is a schematic cross-sectional view corresponding to 320 in fig. 14.
Fig. 16 is a process flow diagram included prior to S300 in an embodiment of the present application.
Fig. 17 is a schematic cross-sectional view corresponding to S240 in fig. 16.
Fig. 18 is a process flow diagram included in S100 in an embodiment of the present application.
Fig. 19 is a schematic diagram corresponding to S110 in fig. 18.
Fig. 20 is a corresponding process flow diagram after S500 in an embodiment of the present application.
Fig. 21-22 are schematic diagrams corresponding to S510 and S520 in fig. 20, respectively.
Fig. 23 is an exploded view of an adapter according to an embodiment of the present application.
Description of reference numerals:
the device comprises an adapter assembly-1, an adapter-2, a circuit board assembly-10, a circuit board-11, a power chip-12, a laminated capacitor-13, a mold-20, a first sub-mold-201, a second sub-mold-202, a glue pouring groove-21, a first sub-glue pouring groove-211, a second sub-glue pouring groove-212, a glue pouring hole-22, a support pillar-23, a blocking piece-30, an accommodating groove-31, a glue pouring layer-40, a smoke exhaust groove-41, a lubricating layer-50, a shell-60, an accommodating space-61, a plug assembly-70 and a smoke exhaust hole-71.
Detailed Description
The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.
Before the technical solutions of the present application are introduced, the technical problems in the related art will be described in detail.
The adapter is one of the main components for charging the electronic device, and with the continuous development of the electronic device, the adapter is also continuously updated. At present, the trend of the adapter toward miniaturization is continuously progressing. An adapter typically includes a housing and a circuit board assembly including a circuit board and various electronic components, such as power chips, disposed on the circuit board. Optionally, the material of the power chip includes gallium nitride, and when the adapter is manufactured, the circuit board assembly generally needs to be inserted into the accommodating space in the housing, and then glue is filled into the housing, so as to fill the accommodating space, and various performances of the adapter, such as structural stability, waterproof performance, heat conduction performance, structural strength, and the like, are improved by using the glue filling layer.
However, although the gan power chip is the core device of the ultra-small adapter, the internal circuit of the adapter may be burned down and "explode" in some extreme use environments, during which the gan power chip explodes and cracks and releases high-temperature conductive gas. However, since the power chip is submerged during the potting process, the explosion will occur in the sealed space, which is more dangerous, and the safety performance of the adapter is reduced. And the circuit board is usually provided with a laminated capacitor in addition to the power chip. When the adapter is in operation, because the piezoelectric effect of stromatolite electric capacity self, can send continuous noise, the noise propagates and reaches the external world in adapter inside space, and when the internal clearance was filled by the encapsulating, the propagation path and the space of noise were blocked, can greatly improve the noise.
In summary, the current contradictions are mainly: the glue is required to be filled in order to protect other electronic components (such as a laminated capacitor), and the glue cannot be filled in order to prevent the adapter from being further damaged when the power chip explodes. Noise relates to the user experience and fryers relate to user safety under extreme conditions, neither of which has compromised space. At present, the scheme of filling the rubber is adopted by people, so that the noise reduction requirement can be met, but the exhaust requirement cannot be met. Or someone adopts a half-pouring scheme, and the glue pouring position does not submerge the power chip, so that the exhaust requirement can be met, but the noise reduction requirement cannot be met. Therefore, there is no effective solution to the above problems.
Referring to fig. 1-6 together, fig. 1 is a process flow diagram of a method for manufacturing an adapter assembly according to an embodiment of the present disclosure. Fig. 2-6 are schematic diagrams corresponding to S100, S200, S300, S400, and S500 in fig. 1, respectively. The present embodiment provides a method of manufacturing an adapter assembly 1, including S100, S200, S300, S400, and S500. The details of S100, S200, S300, S400, and S500 are as follows.
Referring to fig. 2, S100, providing a mold 20, a circuit board assembly 10, and a blocking member 30, wherein the mold 20 is provided with a glue filling groove 21; the circuit board assembly 10 includes a circuit board 11 and a power chip 12 disposed on the circuit board 11.
In order to realize the manufacturing method of the present application, the present embodiment is added with the mold 20 and the stopper 30, compared to the related art. The mold 20 is used to form the potting layer 40 on the surface of the circuit board assembly 10, and the barrier member 30 is used to prevent the potting layer 40 from being disposed on the surface of the power chip 12. As for the circuit board assembly 10, it includes a circuit board 11, and a power chip 12 provided on the circuit board 11. Optionally, the power chip 12 includes, but is not limited to, a gallium nitride power chip 12.
Referring to fig. 3, S200, at least a portion of the blocking member 30 is disposed on a side of the power chip 12 facing away from the circuit board 11.
In the present embodiment, at least a portion of the blocking member 30 may be disposed on a side of the power chip 12 away from the circuit board 11, that is, at least one surface of the power chip 12 is blocked by the blocking member 30, in the present embodiment, a portion of the blocking member 30 is disposed on a side of the power chip 12 away from the circuit board 11, and a portion of the blocking member 30 is disposed on the other side of the power chip 12 for illustration. I.e., both side surfaces of the power chip 12 are blocked by the blocking member 30.
Referring to fig. 4 and S300, the circuit board assembly 10 and at least a portion of the blocking member 30 are disposed in the glue filling groove 21.
The circuit board assembly 10 and at least a portion of the blocking member 30 are then disposed in the potting groove 21. in the related art, the circuit board assembly 10 is disposed in the housing 60, and then the potting is performed in the housing 60, thereby forming the potting layer 40. In order to form the required structure of the potting layer 40 first, the potting layer 40 needs to be formed first. In order to form the glue filling layer 40 first, the present embodiment needs to provide an additional mold 20 to provide a glue filling space, i.e. a glue filling groove 21, for the glue filling.
Optionally, the shape and size of the glue filling groove 21 are the same as those of the circuit board assembly 10, so that the required glue filling layer 40 can be directly prepared subsequently, and the shape and size of the glue filling layer also meet the requirements without performing secondary processing.
Referring to fig. 5, S400, glue is poured into the glue pouring groove 21 to form a glue pouring layer 40 on the circuit board assembly 10.
The glue is then poured into the glue groove 21, and since the glue is initially liquid, the liquid glue fills the glue groove 21 from the bottom of the glue groove 21 until the entire circuit board assembly 10 is submerged. Since the blocking member 30 is provided in the glue filling space in addition to the circuit board assembly 10, the space where the blocking member 30 is located is not filled with the glue during the glue filling. In addition, since the blocking member 30 is used to block the surface of the power chip 12 in the above steps, the surface of the power chip 12 is not provided with the potting adhesive
Optionally, the mold 20 of this embodiment is further provided with a glue filling hole 22 communicating with the glue filling groove 21, and glue can be filled into the glue filling groove 21 through the glue filling hole 22.
Referring to fig. 6, S500, the mold 20 and the blocking member 30 are removed to expose the power chip 12.
After the potting is completed, the potting layer 40 is formed after the potting is hardened, and at this time, the mold 20 and the blocking member 30 are removed, so that the adapter assembly 1 in which the potting layer 40 is coated on the surface of the circuit board assembly 10 can be obtained. And due to the operation of the above steps, the formed potting adhesive layer 40 is not complete, but the potting adhesive layer 40 is not formed at the position of the blocking member 30, that is, the smoke exhaust groove 41 is formed on the potting adhesive layer 40, and the blocking member 30 blocks at least one surface of the power chip 12, so that the power chip 12 is exposed at the smoke exhaust groove 41.
Thereby effectively controlling the structure of the encapsulating layer 40. Because the surface of the power chip 12 is not provided with the potting adhesive layer 40, when the power chip 12 explodes to generate conductive smoke, the conductive smoke can be guided out of the adapter 2 from the smoke exhaust groove 41 formed at the blocking piece 30, and the safety performance of the adapter assembly 1 is improved. The other areas (for example, the stacked capacitor 13) are not provided with the blocking member 30, so that the other areas are covered by the potting layer 40, and the noise problem of the stacked capacitor 13 can still be improved.
In summary, the manufacturing method provided in the present embodiment obtains the required structure of the encapsulating layer 40 by changing the timing of forming the encapsulating layer 40. Namely, before the circuit board assembly 10 is mounted in the housing 60, the circuit board assembly 10 is placed in the potting groove 21 in the mold 20, and the potting layer 40 is formed on the surface of the circuit board assembly 10. Furthermore, before the circuit board assembly 10 is disposed in the potting groove 21, a blocking member 30 may be disposed on a side of the power chip 12 facing away from the circuit board 11. Thus, when glue is poured into the glue pouring groove 21, the blocking piece 30 blocks at least one surface of the power chip 12, so that after the glue is poured and the blocking piece 30 is removed, the surface of the power chip 12 can be exposed, and the structure of the glue pouring layer 40 is effectively controlled. Because the surface of the power chip 12 is not provided with the potting adhesive layer 40, and other areas are still protected by the potting adhesive layer 40, when the power chip 12 explodes to generate conductive smoke, the conductive smoke can be guided out of the adapter 2 from the smoke exhaust groove 41 formed at the blocking piece 30, and the safety performance of the adapter assembly 1 is improved.
Referring to fig. 7-8 together, fig. 7 is a process flow diagram included in S200 according to an embodiment of the present disclosure. Fig. 8 is a top view corresponding to S210 in fig. 7. In this embodiment, S200 "disposing at least part of the blocking member 30 on a side of the power chip 12 away from the circuit board 11" includes S210. The details of S210 are as follows.
Referring to fig. 8, S210, at least a portion of the blocking member 30 is disposed on a side of the power chip 12 away from the circuit board 11, and an orthographic projection of the blocking member 30 on the circuit board 11 covers an orthographic projection of the power chip 12 on the circuit board 11.
In this embodiment, when at least part of the blocking member 30 is disposed on a side of the power chip 12 away from the circuit board 11, an orthographic projection of the blocking member 30 on the circuit board 11 may cover an orthographic projection of the power chip 12 on the circuit board 11. It can also be understood that the blocking member 30 covers a side surface of the power chip 12 facing away from the circuit board 11, so that a side surface of the power chip 12 facing away from the circuit board 11 is completely exposed, the exposed area is increased, the flowing speed of the conductive smoke is increased, and the safety performance of the adapter assembly 1 is further improved.
Referring to fig. 9-10 together, fig. 9 is a process flow diagram included in S200 according to another embodiment of the present disclosure. Fig. 10 is a schematic cross-sectional view corresponding to S220 in fig. 9. In this embodiment, the blocking member 30 is provided with a receiving groove 31, and S200 "at least part of the blocking member 30 is disposed on a side of the power chip 12 away from the circuit board 11" includes S220. The details of S220 are as follows.
Referring to fig. 10, S220, at least a portion of the blocking member 30 is disposed on a side of the power chip 12 away from the circuit board 11, so that at least a portion of the power chip 12 is disposed in the accommodating groove 31.
In this embodiment, an accommodating groove 31 may be formed in the blocking member 30, and when at least part of the blocking member 30 is disposed on a side of the power chip 12 away from the circuit board 11, at least part of the power chip 12 may be disposed in the accommodating groove 31. Block piece 30 alright not only shelter from the surface that power chip 12 deviates from circuit board 11 one side like this, still can utilize to block the lateral wall that piece 30 formed holding tank 31 and shelter from the side of power chip 12 to increase the area that exposes, improved the circulation speed of electrically conductive flue gas, further improved adapter assembly 1's security performance. In addition, the arrangement of the accommodating groove 31 also improves the positioning accuracy of the blocking piece 30 and the power chip 12, and reduces the positioning difficulty.
Referring to fig. 10-11 together, fig. 11 is a flowchart of a process included in S200 according to another embodiment of the present application. In this embodiment, S200 "disposing at least part of the blocking member 30 on a side of the power chip 12 away from the circuit board 11" includes S230. The details of S230 are as follows.
Referring to fig. 10, in S230, at least a portion of the blocking member 30 is disposed on a side of the power chip 12 away from the circuit board 11, and the blocking member 30 extends and protrudes from a side surface of the circuit board 11, which is bent and connected to the surface of the power chip 12.
The above embodiments are discussed from the perspective of the dam 30 and the power chip 12, and the present embodiment will be discussed from the perspective of the dam 30 and the circuit board 11. When at least part of the blocking member 30 is disposed on a side of the power chip 12 away from the circuit board 11, the blocking member 30 may be further extended and the blocking member 30 protrudes from a side surface of the circuit board 11, where the side surface is a surface on which the power chip 12 is disposed in a bending connection. Thus, after glue filling, the smoke evacuation grooves 41 formed on the glue filling layer 40 can penetrate through two surfaces of the glue filling layer 40, so that the smoke evacuation grooves 41 can be easily communicated with other smoke evacuation channels in the adapter 2, and finally the conductive smoke is exhausted from the smoke evacuation holes 71 on the adapter 2.
Referring to fig. 12-13 together, fig. 12 is a process flow diagram included in S300 according to an embodiment of the present disclosure. Fig. 13 is a diagram corresponding to S310 in fig. 12. In this embodiment, the circuit board assembly 10 further includes a stacked capacitor 13 disposed on the circuit board 11, and S300 "disposing the circuit board assembly 10 and at least a portion of the blocking member 30 in the glue filling groove 21" includes S310. The details of S310 are as follows.
Referring to fig. 13, in S310, the circuit board assembly 10 and at least a portion of the blocking member 30 are disposed in the glue filling groove 21, and the power chip 12 is close to the surface of the mold 20 with the glue filling groove 21 compared to the stacked capacitor 13.
As can be seen from the above, by the manufacturing method provided in the present application, the potting adhesive layer 40 is not disposed at the power chip 12, but the potting adhesive layer 40 is still disposed at the stacked capacitor 13, so that the exhaust requirement and the noise reduction requirement can be met. There are many ways to place the circuit board assembly 10 and at least part of the blocking member 30 in the glue filling groove 21. The various placement manners are related to which component is closer to the surface of the mold 20 where the glue pouring groove 21 is formed. In this embodiment, the power chip 12 may be closer to the surface of the mold 20 where the potting groove 21 is opened than the multilayer capacitor 13, or the power chip 12 may be closer to the surface of the mold 20 where the potting groove 21 is opened. Fig. 13 is a schematic view showing a state where a part of the mold 20 is removed to expose the inside of the potting groove 21. Therefore, the blocking member 30 can be closer to the surface of the mold 20, on which the glue filling groove 21 is formed, so that the blocking member 30 can be more easily protruded out of the mold 20 or can be arranged flush with the mold 20, thereby improving the positioning accuracy of the circuit board assembly 10 and the blocking member 30 in the mold 20, and even avoiding the influence of the part of the blocking member 30 protruded out of the circuit board 11 on the formation of the glue filling layer 40.
Referring to fig. 14-15 together, fig. 14 is a process flow diagram included in S300 according to another embodiment of the present disclosure. Fig. 15 is a schematic cross-sectional view corresponding to 320 in fig. 14. In this embodiment, a support pillar 23 is disposed on a sidewall of the mold 20 forming the glue filling groove 21, and S300 "disposing the circuit board assembly 10 and at least a portion of the blocking member 30 in the glue filling groove 21" includes S320. The details of S320 are as follows.
Referring to fig. 15, in S320, the circuit board assembly 10 and at least a portion of the blocking member 30 are disposed in the glue filling groove 21, and the supporting pillar 23 abuts against the circuit board 11, so that the circuit board assembly 10 and the sidewall are disposed in a gap.
In order to form the glue-pouring layer 40 on the peripheral side of the electronic device assembly, the supporting pillars 23 may be disposed on the sidewall of the mold 20 forming the glue-pouring groove 21. Therefore, when the circuit board assembly 10 and at least part of the blocking piece 30 are arranged in the glue pouring groove 21, the supporting columns 23 can be abutted to the circuit board 11, namely, only a small number of surfaces of the circuit board 11 are abutted by the supporting columns 23 to cause that the glue pouring layer 40 cannot be formed at the positions, and the side wall gaps of the circuit board assembly 10 and the glue pouring groove 21 are arranged, so that the glue pouring layer 40 can be formed on the surfaces of most of the circuit board assemblies 10, and the coverage area of the glue pouring layer 40 is increased. It can also be understood that the circuit board assembly 10 is suspended in the potting groove 21 due to the support of the support posts 23, so that the potting layer 40 is formed on the periphery of the circuit board assembly 10. But also because of the existence of the supporting columns 23, the encapsulating layer 40 is provided with supporting grooves formed by the existence of the supporting columns 23 besides the smoke exhaust grooves 41.
Referring to fig. 16-17 together, fig. 16 is a process flow chart included before S300 in an embodiment of the present application. Fig. 17 is a schematic cross-sectional view corresponding to S240 in fig. 16. In this embodiment, before S300 "disposing the circuit board assembly 10 and at least a portion of the blocking member 30 in the potting groove 21", S240 is further included. The details of S240 are as follows.
Referring to fig. 17, S240, a lubricating layer 50 is formed on the sidewall of the mold 20 where the glue filling groove 21 is formed.
After the potting is complete, the mold 20 needs to be removed to obtain the desired adapter assembly 1. Therefore, in this embodiment, before the circuit board assembly 10 and at least a portion of the blocking member 30 are disposed in the potting groove 21, the lubricating layer 50 may be formed on the sidewall of the potting groove 21 formed in the mold 20. The lubricating layer 50 can reduce the friction coefficient and viscosity of the side wall of the glue filling groove 21, prevent the glue filling layer 40 from being stuck with the mold 20, and also facilitate the separation of the mold 20 from the glue filling layer 40.
Optionally, in this embodiment, before "providing at least part of the blocking member 30 on a side of the power chip 12 facing away from the circuit board 11", the method further includes:
a lubrication layer 50 is formed on the barrier 30.
After the potting is completed, the stopper 30 needs to be removed in this embodiment, so that the desired adapter assembly 1 is obtained. Therefore, in this embodiment, before the circuit board assembly 10 and at least a portion of the blocking member 30 are disposed in the potting groove 21, the lubricating layer 50 may be formed on the blocking member 30. The lubricating layer 50 can reduce the friction coefficient and viscosity of the blocking member 30, prevent the glue-pouring layer 40 from sticking to the blocking member 30, and facilitate the separation of the blocking member 30 from the glue-pouring layer 40.
Optionally, the material of the lubricating layer 50 includes, but is not limited to, silicone oil.
Referring to fig. 18-19 together, fig. 18 is a process flow diagram included in S100 according to an embodiment of the present disclosure. Fig. 19 is a schematic diagram corresponding to S110 in fig. 18. S100 "provides the mold 20, the circuit board assembly 10, and the dam 30", including S110. The details of S110 are as follows.
Referring to fig. 19, S110, providing a mold 20, a circuit board assembly 10, and a blocking member 30, where the mold 20 includes a first sub-mold 201 and a second sub-mold 202, the first sub-mold 201 is provided with a first sub-potting groove 211, and the second sub-mold 202 is provided with a first sub-potting groove 212; the first sub-mold 201 and the second sub-mold 202 cooperate with each other to enable the first sub-glue-pouring groove 211 and the first sub-glue-pouring groove 212 to form the glue-pouring groove 21.
In the present embodiment, the mold 20 is not an integral structure, but a split structure, and it can also be understood that the mold 20 is assembled by two parts, that is, the mold 20 includes a first sub-mold 201 and a second sub-mold 202. Each sub-mold 20 is provided with a sub-glue pouring groove 21, and each sub-glue pouring groove 21 is a part of the glue pouring groove 21. For example, the first sub-mold 201 is provided with a first sub-potting groove 211, and the second sub-mold 202 is provided with a first sub-potting groove 212.
The first sub-module and the second sub-module 202 are mutually matched and connected together, even if the first sub-module 201 and the second sub-module 202 are mutually matched, the first sub-glue pouring groove 211 and the first sub-glue pouring groove 212 can form the glue pouring groove 21.
Moreover, the mold 20 designed as a split structure in this embodiment is also beneficial to subsequently install the circuit board assembly 10 and the blocking member 30 in the potting groove 21.
Referring to fig. 20-22 together, fig. 20 is a corresponding process flow diagram after S500 in an embodiment of the present application. Fig. 21-22 are schematic diagrams corresponding to S510 and S520 in fig. 20, respectively. In this embodiment, after the step S500 "of removing the mold 20 and the stopper 30", the steps S510 and S520 are further included. The details of S510 and S520 are as follows.
Referring to fig. 21, S510, a housing 60 is provided, and the housing 60 has a receiving space 61 therein.
Referring to fig. 22, in S520, the circuit board assembly 10 and the adhesive-pouring layer 40 are disposed in the accommodating space 61, and the circumferential dimension of the adhesive-pouring layer 40 is greater than the circumferential dimension of the accommodating space 61; wherein, the encapsulating layer 40 has elasticity.
After the adapter assembly 1 is obtained, the adapter assembly 1, i.e. the circuit board assembly 10 and the potting adhesive layer 40, may be disposed in the receiving space 61, thereby completing the assembly of the adapter 2. In this embodiment, the circumferential dimension (the dimension shown in the direction L1 in fig. 22) of the potting layer 40 is larger than the circumferential dimension (the dimension shown in the direction L2 in fig. 23) of the accommodating space 61; wherein, the encapsulating layer 40 has elasticity. Therefore, the glue filling layer 40 with a slightly larger size can be installed in the shell 60 by elasticity, and the resilience force of the glue filling layer 40 can be used for enabling the circuit board assembly 10 and the glue filling layer 40 to be tightly abutted against the inner wall of the shell 60, so that the connection performance of the circuit board assembly 10, the glue filling layer 40 and the shell 60 is improved.
The present embodiment provides the adapter 2 of the adapter module 1 manufactured by the above-described manufacturing method, in addition to the manufacturing method of the adapter module 1. Referring specifically to fig. 23, fig. 23 is an exploded view of an adapter according to an embodiment of the present application. This embodiment provides an adapter 2, adapter 2 includes shell 60, plug subassembly 70 and adapter subassembly 1, accommodating space 61 has in the shell 60, adapter subassembly 1 locates in accommodating space 61, circuit board subassembly 10 electricity is connected plug subassembly 70, be equipped with on the encapsulating layer 40 and arrange the cigarette groove 41 and make power chip 12 exposes, plug subassembly 70 be equipped with arrange the smoke hole 71 that cigarette groove 41 communicates.
In the adapter 2 provided in this embodiment, the adapter assembly 1 includes a circuit board assembly 10 and a potting layer 40 disposed on a surface of the circuit board assembly 10. Since the circuit board assembly 10 and the potting layer 40 are prepared by the manufacturing method provided in the above embodiment, the potting layer 40 is provided with the smoke discharge groove 41 to expose the power chip 12. Thus, after the outer shell 60, the plug assembly 70 and the adapter assembly 1 are assembled, the glue filling layer 40 still protects the other areas, and the requirement of noise reduction can be met. When the power chip 12 explodes and generates conductive smoke, the conductive smoke can be discharged out of the adapter 2 from the smoke discharge hole 71 along the smoke discharge groove 41 because the glue filling layer 40 is not arranged on the surface of the power chip 12, and the safety performance of the adapter assembly 1 is improved.
Alternatively, the adapter module 1 provided in the present embodiment is manufactured by the method for manufacturing the adapter module 1 provided in the above-described embodiment of the present application.
The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A method of manufacturing an adapter assembly, comprising:
providing a mould, a circuit board assembly and a blocking piece, wherein the mould is provided with a glue pouring groove; the circuit board assembly comprises a circuit board and a power chip arranged on the circuit board;
arranging at least part of the blocking piece on one side of the power chip, which is far away from the circuit board;
arranging the circuit board assembly and at least part of the blocking piece in the glue pouring groove;
pouring glue into the glue pouring groove to form a glue pouring layer on the circuit board assembly; and
and removing the mold and the barrier piece to expose the power chip.
2. The method of manufacturing according to claim 1, wherein "providing at least part of the blocking member on a side of the power chip facing away from the circuit board" comprises:
and arranging at least part of the blocking piece at one side of the power chip, which is far away from the circuit board, and enabling the orthographic projection of the blocking piece on the circuit board to cover the orthographic projection of the power chip on the circuit board.
3. The manufacturing method of claim 1, wherein the blocking member has a receiving groove formed therein, and the step of disposing at least part of the blocking member on a side of the power chip facing away from the circuit board comprises:
at least part of the blocking piece is arranged on one side, away from the circuit board, of the power chip, so that at least part of the power chip is arranged in the accommodating groove.
4. The method of manufacturing according to claim 1, wherein "providing at least part of the blocking member on a side of the power chip facing away from the circuit board" comprises:
and at least part of the blocking piece is arranged on one side of the power chip, which is far away from the circuit board, and the blocking piece extends and protrudes out of the side surface of the circuit board, which is bent and connected with the surface of the power chip.
5. The method of manufacturing of claim 1, wherein the circuit board assembly further comprises a multilayer capacitor disposed on the circuit board, and disposing the circuit board assembly and at least a portion of the barrier within the potting bath comprises:
and arranging the circuit board assembly and at least part of the blocking piece in the glue pouring groove, and enabling the power chip to be close to the surface of the mold with the glue pouring groove compared with the laminated capacitor.
6. The method of claim 1, wherein the mold includes support posts on sidewalls of the potting groove, and positioning the circuit board assembly and at least a portion of the dam within the potting groove comprises:
and arranging the circuit board assembly and at least part of the blocking piece in the glue pouring groove, and enabling the supporting column to abut against the circuit board so as to enable the circuit board assembly and the side wall to be arranged in a clearance mode.
7. The method of manufacturing according to claim 1, further comprising, prior to disposing the circuit board assembly and at least a portion of the dam in the potting bath:
and forming a lubricating layer on the side wall of the glue pouring groove formed by the mould.
8. The method of manufacturing of claim 1, wherein providing the mold, the circuit board assembly, and the stop comprises:
providing a mould, a circuit board assembly and a blocking piece, wherein the mould comprises a first sub-mould and a second sub-mould, the first sub-mould is provided with a first sub-glue pouring groove, and the second sub-mould is provided with a second sub-glue pouring groove; the first sub-mold and the second sub-mold are matched with each other to enable the first sub-glue-pouring groove and the second sub-glue-pouring groove to form the glue-pouring groove.
9. The method of manufacturing according to claim 1, further comprising, after "removing the mold and the barrier":
providing a shell, wherein the shell is internally provided with a containing space;
arranging the circuit board assembly and the glue filling layer in the accommodating space, wherein the circumferential size of the glue filling layer is larger than that of the accommodating space; wherein, the encapsulating layer has elasticity.
10. The adapter is characterized by comprising a shell, a plug assembly and an adapter assembly, wherein an accommodating space is formed in the shell, the adapter assembly is arranged in the accommodating space, the circuit board assembly is electrically connected with the plug assembly, a smoke exhaust groove is formed in the glue filling layer and enables the power chip to be exposed, and a smoke exhaust hole communicated with the smoke exhaust groove is formed in the plug assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011610521.0A CN114698363A (en) | 2020-12-28 | 2020-12-28 | Manufacturing method of adapter assembly and adapter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011610521.0A CN114698363A (en) | 2020-12-28 | 2020-12-28 | Manufacturing method of adapter assembly and adapter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114698363A true CN114698363A (en) | 2022-07-01 |
Family
ID=82133159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011610521.0A Pending CN114698363A (en) | 2020-12-28 | 2020-12-28 | Manufacturing method of adapter assembly and adapter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114698363A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101317034A (en) * | 2005-11-29 | 2008-12-03 | 吉尔科有限公司 | LED light assemblies with thermal overmoulding |
| CN101989555A (en) * | 2009-07-29 | 2011-03-23 | 胜开科技股份有限公司 | Manufacturing method for molding image sensor package structure and image sensor package structure thereof |
| CN104812193A (en) * | 2014-01-24 | 2015-07-29 | 台达电子企业管理（上海）有限公司 | Encapsulated power supply |
| CN106877629A (en) * | 2017-02-17 | 2017-06-20 | 华为技术有限公司 | A kind of power supply adaptor of pin radiating |
| CN110462854A (en) * | 2017-03-24 | 2019-11-15 | 欧司朗光电半导体有限公司 | Method for manufacturing opto-electronic semiconductor module |
| CN111697117A (en) * | 2020-06-23 | 2020-09-22 | 深圳市聚飞光电股份有限公司 | Chip-scale packaging method and LED packaging device |
-
2020
- 2020-12-28 CN CN202011610521.0A patent/CN114698363A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101317034A (en) * | 2005-11-29 | 2008-12-03 | 吉尔科有限公司 | LED light assemblies with thermal overmoulding |
| CN101989555A (en) * | 2009-07-29 | 2011-03-23 | 胜开科技股份有限公司 | Manufacturing method for molding image sensor package structure and image sensor package structure thereof |
| CN104812193A (en) * | 2014-01-24 | 2015-07-29 | 台达电子企业管理（上海）有限公司 | Encapsulated power supply |
| CN106877629A (en) * | 2017-02-17 | 2017-06-20 | 华为技术有限公司 | A kind of power supply adaptor of pin radiating |
| CN110462854A (en) * | 2017-03-24 | 2019-11-15 | 欧司朗光电半导体有限公司 | Method for manufacturing opto-electronic semiconductor module |
| CN111697117A (en) * | 2020-06-23 | 2020-09-22 | 深圳市聚飞光电股份有限公司 | Chip-scale packaging method and LED packaging device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100812306B1 (en) | Battery pack | |
| US11088420B2 (en) | Manufacturing method of battery structure | |
| CN209880722U (en) | Secondary battery | |
| US20060083982A1 (en) | Lithium ion secondary battery | |
| CN101237031A (en) | Case for secondary battery and battery pack including the same | |
| EP3190653B1 (en) | Method for manufacturing embedded battery pack using hot-melting fixation structure, and battery pack manufactured using same | |
| JP2008067521A (en) | Charger | |
| EP3149788B1 (en) | Lead acid battery having a strap molding well | |
| JP6175218B2 (en) | Secondary battery | |
| CN216850095U (en) | Battery pack with compact structure | |
| CN114698363A (en) | Manufacturing method of adapter assembly and adapter | |
| KR20180032020A (en) | Rechargeable battery | |
| EP1298683A2 (en) | Non-contact transformer | |
| US20220104340A1 (en) | Electronic control device | |
| EP1143542A1 (en) | Battery with flank terminals and method of manufacturing the same | |
| KR100601501B1 (en) | Pack case of secondary battery | |
| EP3855873B1 (en) | Ventilation mechanism for electronic equipment housing | |
| EP4164033A1 (en) | Cover assembly, method of processing the same, and battery | |
| CN107579383A (en) | Electric connector | |
| JP2005071710A (en) | Manufacturing method of battery, and battery | |
| KR20180041530A (en) | Secondary battery including electrode lead | |
| CN217824712U (en) | Power adapter | |
| CN216928723U (en) | Shell structure with inner flange and battery | |
| CN217881680U (en) | Battery pack and electronic device | |
| CN217900885U (en) | Sensor shell |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20240906 |
|
| AD01 | Patent right deemed abandoned |