CN114698235A - Double-sided plastic package power supply product and connection method thereof - Google Patents

Double-sided plastic package power supply product and connection method thereof Download PDF

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Publication number
CN114698235A
CN114698235A CN202011626319.7A CN202011626319A CN114698235A CN 114698235 A CN114698235 A CN 114698235A CN 202011626319 A CN202011626319 A CN 202011626319A CN 114698235 A CN114698235 A CN 114698235A
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CN
China
Prior art keywords
plastic package
pcb substrate
product
power supply
metal terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011626319.7A
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Chinese (zh)
Inventor
谭友元
尹向阳
余志方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mornsun Guangzhou Science and Technology Ltd
Original Assignee
Mornsun Guangzhou Science and Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mornsun Guangzhou Science and Technology Ltd filed Critical Mornsun Guangzhou Science and Technology Ltd
Priority to CN202011626319.7A priority Critical patent/CN114698235A/en
Publication of CN114698235A publication Critical patent/CN114698235A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The invention provides a double-sided plastic package power supply product and a connecting method thereof, wherein the product comprises a PCB (printed Circuit Board) substrate, a plastic package body and a metal terminal, the upper surface and the lower surface of the PCB substrate are wrapped by the plastic package body, the metal terminal is connected with the PCB substrate and wrapped by the plastic package body, and the surface of the metal terminal, which protrudes out of the part of the PCB substrate, can be exposed on the surface of the product through cutting or thinning and is used as a pin or used for connecting the pin. The invention reduces the product volume of the double-sided plastic package type power supply product and increases the element layout space on the PCB substrate.

Description

Double-sided plastic package power supply product and connection method thereof
Technical Field
The invention relates to the field of plastic package power supplies, in particular to a double-sided plastic package power supply and a connecting method thereof.
Technical Field
In the existing double-sided plastic package type power supply product, one scheme is that a part of area is reserved on a PCB substrate and is not subjected to plastic package and used as a pin metal terminal of a product or connected with the pin.
One scheme is that the copper layer inside the PCB substrate is used as an electric contact to be assembled and welded with an external pin, the copper layer inside the PCB substrate is easy to oxidize after cutting, the area of the copper layer exposed after cutting is small, and the heat conducting performance of a product can be greatly influenced.
A scheme uses metal frame as the product base plate, and the product pin is drawn forth from the product side through metal frame, and this type of scheme adopts lead frame welding product, generally can only have 1 layer of wiring, can't want PCB to carry out multilayer wiring the same, and same component number, product area can be bigger.
Disclosure of Invention
The invention aims to provide a double-sided plastic package power supply product and a connecting method thereof, which can increase the board distribution area on a PCB substrate and reduce the product volume.
In order to achieve the purpose, the invention adopts the technical scheme that:
the utility model provides a two-sided plastic envelope power product, includes PCB base plate, plastic-sealed body and metal terminal, the upper and lower surface of plastic-sealed body parcel PCB base plate, its characterized in that: the metal terminals are connected with the PCB substrate and wrapped by the plastic package body, and the surfaces of the metal terminals, which protrude out of the PCB substrate, can be exposed on the surface of a product through cutting or thinning and used as pins or used for connecting the pins.
Further, the face used as a pin or for connecting a pin is subjected to plating treatment.
Further, the face used as a pin or for connecting a pin is flush with the face of the product on which it is located.
Preferably, the product further comprises a component, and the component assembly is welded on the surface of the PCB substrate and is wrapped by the plastic package body.
Preferably, the length and the width of the plastic package body correspond to the length and the width of the PCB substrate.
Preferably, the PCB substrate is a resin substrate or a ceramic substrate.
Preferably, the PCB substrate is a two-layer or multi-layer double-sided board.
Further, the metal terminals are attached to the PCB substrate by soldering or conductive adhesive.
Preferably, the PCB substrate thickness is greater than or equal to 0.6 mm.
Preferably, the length and width dimensions of the plastic package body correspond to those of the PCB substrate, and the tolerance is less than 0.1 mm.
The invention provides a connecting method of a double-sided plastic package power supply product, the product comprises a PCB substrate, a plastic package body and a metal terminal, the plastic package body wraps the upper surface and the lower surface of the PCB substrate, and the connecting method is characterized in that: comprises the following steps of (a) carrying out,
the metal terminal is embedded and connected with the PCB substrate and is wrapped by the plastic package body;
and cutting the plastic package body to expose the vertical surface of the metal terminal protruding out of the PCB substrate part on the surface of the product, and leveling the surface of the product to be used as a pin or be used for connecting the pin.
The invention also provides a connecting method of the double-sided plastic package power supply product, the product comprises a PCB substrate, a plastic package body and a metal terminal, the plastic package body wraps the upper surface and the lower surface of the PCB substrate, and the connecting method is characterized in that: comprises the following steps of (a) carrying out,
the metal terminal is connected with the PCB substrate and is wrapped by the plastic package body;
thinning makes the metal terminal protrude from the horizontal plane of the PCB substrate part, exposes on the surface of the product, and is flush with the surface of the product, and the metal terminal is used as a pin or used for connecting the pin.
Advantageous effects
By utilizing the scheme, the PCB is used as the substrate to carry out double-sided plastic package, the length and width of the PCB are consistent with those of the plastic package body, the product can be plastically packaged by adopting the integral plastic package mold, the compatibility of the plastic package mold to the product size is higher, and the mold cost for developing various products is greatly reduced;
the exposed parts of the metal terminals are used as product pins or connected with the pins for use, so that the metal terminals are more flexibly distributed on the PCB substrate, the space for distributing elements on the PCB substrate is increased, and similarly, the product size is reduced because the product pins do not need to be additionally arranged outside the plastic packaging body;
the metal terminals assembled on the PCB are directly adopted as product pins, the diameter of the metal terminals can be selected automatically, and the product thermal design is facilitated. Meanwhile, the metal terminals are directly assembled with the PCB of the client side, and the assembly distance is shortened, so that the heat dissipation of the product is facilitated.
Drawings
FIG. 1 is a cross-sectional view of a first embodiment of the present invention;
FIG. 2 is a metal terminal diagram of a first embodiment of the present invention;
FIG. 3 is a schematic cut-away view of a first embodiment of the present invention;
FIG. 4 is a schematic diagram of thinning according to the first embodiment of the present invention;
fig. 5 is a schematic view of a finished cylindrical terminal of the first embodiment of the present invention;
FIG. 6 is a schematic cut-away view of a first embodiment of the present invention;
fig. 7 is a schematic view of a finished square terminal of the first embodiment of the present invention;
FIG. 8 is a cross-sectional view of a second embodiment of the present invention;
FIG. 9 is a schematic representation of the completed product of the second embodiment of the present invention;
FIG. 10 is a cross-sectional view of a third embodiment of the present invention;
FIG. 11 is a schematic representation of the final product of the third embodiment of the present invention;
FIG. 12 is a solution 1 cross-sectional view of a fourth embodiment of the present invention;
fig. 13 is a scheme 2 cross-sectional view of a fourth embodiment of the invention.
Detailed Description
The technical scheme of the invention is explained in detail with reference to the attached drawings.
First embodiment
As shown in fig. 1, a double-sided plastic package power supply product according to a first embodiment of the present invention is composed of a PCB substrate 1, a first plastic package body 2, a second plastic package body 3, and metal terminals 4. The length and width dimensions of the first plastic package body 2 and the second plastic package body 3 are consistent with the length and width dimensions of the PCB substrate 1. The metal terminals 4 of the product are embedded on the PCB substrate 1 through hole welding, and the metal terminals 4 are distributed on the boundary of the product and distributed on the cutting line of the product. After plastic packaging, cutting off the metal terminals 4, wherein the metal terminals 4 protrude out of the vertical surface of the PCB substrate part and are exposed on the side surface of the product. Then, through product thinning, the horizontal plane of the metal terminal 4 protruding from the PCB substrate part is exposed on the surface of the product. Both sides of the exposed metal terminals 4 are used as product pins.
This product adopts whole plastic envelope mould, can piece up a plurality of products in a plastic envelope die cavity, leaves the cutting street between every product, the width of cutting street and the width cooperation of the cutting knife that corresponds, the width of general cutting street is slightly bigger than the thickness of cutting knife. The double-sided plastic package mold of the product can be provided with only one injection molding pouring gate opening or two injection molding pouring gate openings. When only one runner mouth of moulding plastics, need to open a groove that link up PCB base plate 1 at the runner mouth annex of moulding plastics that corresponds on PCB base plate 1 to during moulding plastics, the upper and lower surface of PCB base plate 1 can be filled to the plastic envelope material. When two injection molding pouring gates are arranged, the two injection molding pouring gates are respectively distributed on the upper surface and the lower surface of the PCB substrate 1.
The metal terminal 4 is composed of two cylindrical portions of different diameters, as shown in fig. 2 (a). The metal terminals 4 are soldered by the solder pads 404 on the upper surface of the PCB substrate 1, and the portions of the metal terminals 4 protruding from the lower surface of the PCB substrate are used as pins, where no soldering is performed, which is very helpful for solving the problem of solder overflow in reflow soldering of finished products of such terminals. As shown in fig. 3, the metal terminals 4 laid out on the cutting lines are cut along the cutting lines by the cutting blade 6, and the plastic package body 302 is cut off to expose the side surfaces of the metal terminals 4, so that the metal terminals 4 remain in the plastic package body. As shown in fig. 4, the cylindrical portion with a large diameter in the metal terminal 4 is exposed to the surface of the product after being thinned, and is used as a pin of the product; the cylindrical portion having a small diameter is soldered to the PCB substrate 1, and the metal terminal 4 is fitted to the PCB substrate 1. The diameter of the cylindrical part assembled with the PCB substrate 1 can be selected to be about 0.6mm, and the aperture of the bonding pad of the matched PCB substrate 1 can be selected to be 0.7 mm. The length of the cylindrical part with the small diameter of the metal terminal 4 is larger than the thickness of the PCB substrate 1, the metal terminal 4 is assembled on the lower surface of the PCB substrate 1, and the part of the metal terminal 4, which is welded with the PCB substrate 1, is on the upper surface of the PCB substrate 1. The cylindrical portion of the metal terminal 4 with a large diameter is laid on the cutting line, and the distance beyond the cutting line portion is more than 0.1mm, so that the metal terminal 4 can be exposed at the side of the product after the product is cut. The height of the large diameter cylindrical portion of the metal terminal 4 in the product is higher than each component 5 soldered to the lower surface of the PCB substrate 1. When the product is thinned and the metal terminal 4 is thinned, each element 5 on the lower surface of the PCB substrate 1 is not influenced by thinning.
The surfaces (402 and 403) of the metal terminals 4 exposed by cutting and thinning are required to be subjected to solderability treatment, and one solderability treatment is to plate the exposed portions of the metal terminals 4, either by immersing the product in a plating solution or by partial plating of the product, such as with a plating pen. By adopting the electroplating in the sinking electroplating solution, the electroplating time of the product needs to be taken into consideration to prevent the electroplating solution from penetrating into the product, thereby causing the product to lose efficacy. The use of localized targeted plating can avoid this problem.
The exposed surface of the metal terminal 4 in this embodiment may be square, as shown in fig. 6 and 7.
Second embodiment
As shown in fig. 8 and 9, the second embodiment of the present invention is different from the first embodiment in that: the metal terminals 4 need not be laid out on the cut lines of the product. The metal terminals 4 are more selectively arranged, and can be arranged on the whole PCB substrate 1. After plastic encapsulation, the metal terminals 4 are not exposed at the side of the product. One surface of the metal terminal 4 is exposed on the surface of the product through thinning the product, and the exposed surface is used as a pin of the product.
Third embodiment
As shown in fig. 10 and 11, the third embodiment of the present invention is different from the first embodiment in that: the metal terminals 4 of the product are arranged on the upper surface and the lower surface of the PCB substrate 1 in a patch welding mode, and the metal terminals 4 are arranged on one boundary of the product and on a certain cutting line of the product. After plastic packaging, after the product is cut and thinned, two surfaces of the metal terminal 4 are exposed on the surface of the product, and the two surfaces of the exposed metal terminal 4 are used as pins of the product. In the product of the type, the metal terminals 4 are arranged on two sides of the PCB substrate 1, and the terminals are exposed on the side surfaces of the product after the product is cut and thinned. When the product is used, the product needs to be vertically used, the occupied area of the product is the product of the width and the height of the product, and the occupied area is greatly reduced compared with the product of the length and the width of the product.
Fourth embodiment
As shown in fig. 12 and 13, the fourth embodiment of the present invention is different from the third embodiment in that: the metal terminals 4 of the product are arranged on the upper surface or the lower surface of the PCB substrate 1 in a patch welding mode, the metal terminals 4 are arranged on different boundaries of the product and are arranged on two cutting lines of the product. After plastic packaging, after the product is cut and thinned, two surfaces of the metal terminal 4 are exposed on the surface of the product, and the two surfaces of the exposed metal terminal 4 are used as pins of the product. In the product of the type, the metal terminals 4 are arranged on two sides of the PCB substrate 1, and the terminals are exposed on the side surfaces of the product after the product is cut and thinned.
The shape of the metal terminal 4 is an inverted "7" shape, or a "T" shape, and such terminal shapes can satisfy: after the product is cut, only one part of the metal terminal 4 is exposed on the side surface of the product, and the other part of the metal terminal 4 is still wrapped and fixed by the plastic package material. The terminal shape is partially wrapped and fixed by the molding compound except for the welding part of the metal terminal 4 and the PCB substrate 1. The metal terminal 4 with such a shape can enhance the bonding strength between the terminal and the plastic package material, and prevent the metal terminal 4 from being separated from the plastic package material. The vibration performance of the product after welding is improved.
When the metal terminal 4 with such a shape is designed, the weight matching between the two parts of the metal terminal 4 needs to be considered, so that the metal terminal 4 is ensured not to be inclined when the metal terminal 4 is subjected to surface mount welding in product manufacturing. In the manufacturing process of the product, the position of the metal terminal 4 can be corrected by the aid of the jig, and the metal terminal 4 is prevented from being inclined.
The above is only a preferred embodiment of the present invention, it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and it will be apparent to those skilled in the art that several modifications and decorations can be made without departing from the spirit and scope of the present invention, and these modifications and decorations should also be considered as the protection scope of the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims.

Claims (12)

1. The utility model provides a two-sided plastic envelope power product, includes PCB base plate, plastic-sealed body and metal terminal, the upper and lower surface of plastic-sealed body parcel PCB base plate, its characterized in that: the metal terminals are connected with the PCB substrate and wrapped by the plastic package body, and the surfaces of the metal terminals, which protrude out of the PCB substrate, can be exposed on the surface of a product through cutting or thinning and used as pins or used for connecting the pins.
2. The two-sided plastic package power supply product according to claim 1, characterized in that: the faces used as pins or for connecting pins are subjected to an electroplating process.
3. The two-sided plastic package power supply product according to claim 1, characterized in that: the faces used as pins or for connecting pins are flush with the face of the product on which they are located.
4. The two-sided plastic package power supply product according to claim 1, characterized in that: the PCB further comprises an element which is assembled and welded on the surface of the PCB substrate and wrapped by the plastic package body.
5. The two-sided plastic package power supply product according to claim 1, characterized in that: the length and the width of the plastic package body are correspondingly consistent with those of the PCB substrate.
6. The two-sided plastic package power supply product according to claim 1, characterized in that: the PCB substrate is a resin substrate or a ceramic substrate.
7. The two-sided plastic package power supply product according to claim 1, characterized in that: the PCB substrate is a double-layer or multi-layer double-sided board.
8. The two-sided plastic package power supply product according to claim 1, characterized in that: the metal terminals are connected to the PCB substrate by soldering or conductive adhesive.
9. The two-sided plastic package power supply product according to claim 1, characterized in that: the thickness of the PCB substrate is greater than or equal to 0.6 mm.
10. The two-sided plastic package power supply product according to claim 1, characterized in that: the length and width of the plastic package body and the length and width corresponding to the PCB substrate have a tolerance smaller than 0.1 mm.
11. A connecting method of a double-sided plastic package power supply product comprises a PCB substrate, a plastic package body and a metal terminal, wherein the upper surface and the lower surface of the PCB substrate are wrapped by the plastic package body, and the connecting method is characterized in that: comprises the following steps of (a) preparing a solution,
the metal terminal is embedded and connected with the PCB substrate and is wrapped by the plastic package body;
and cutting the plastic package body to expose the vertical surface of the metal terminal protruding out of the PCB substrate part on the surface of the product, and leveling the surface of the product to be used as a pin or be used for connecting the pin.
12. A connecting method of a double-sided plastic package power supply product comprises a PCB substrate, a plastic package body and a metal terminal, wherein the upper surface and the lower surface of the PCB substrate are wrapped by the plastic package body, and the connecting method is characterized in that: comprises the following steps of (a) preparing a solution,
the metal terminal is connected with the PCB substrate and is wrapped by the plastic package body;
thinning makes the metal terminal protrude from the horizontal plane of the PCB substrate part, exposes on the surface of the product, and is flush with the surface of the product, and the metal terminal is used as a pin or used for connecting the pin.
CN202011626319.7A 2020-12-31 2020-12-31 Double-sided plastic package power supply product and connection method thereof Pending CN114698235A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011626319.7A CN114698235A (en) 2020-12-31 2020-12-31 Double-sided plastic package power supply product and connection method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011626319.7A CN114698235A (en) 2020-12-31 2020-12-31 Double-sided plastic package power supply product and connection method thereof

Publications (1)

Publication Number Publication Date
CN114698235A true CN114698235A (en) 2022-07-01

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CN202011626319.7A Pending CN114698235A (en) 2020-12-31 2020-12-31 Double-sided plastic package power supply product and connection method thereof

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW432557B (en) * 1999-12-14 2001-05-01 Siliconware Precision Industries Co Ltd Chip-scale package and its manufacturing method
JP2006278355A (en) * 2005-03-25 2006-10-12 Nec Corp Assembly structure and manufacturing method of integrated circuit package
KR20090107657A (en) * 2008-04-10 2009-10-14 주식회사 디에스엘시디 Leadfram for package base, electric and electronic devices package using thesame, and method of manufacturing there of
US20150189749A1 (en) * 2013-12-27 2015-07-02 Samsung Electro-Mechanics Co., Ltd. Package and method of manufacturing package thereof
JP2016167577A (en) * 2015-03-05 2016-09-15 エスアイアイ・セミコンダクタ株式会社 Resin sealed semiconductor device and manufacturing method of the same
CN206849833U (en) * 2017-05-17 2018-01-05 杭州士兰微电子股份有限公司 Substrate and encapsulating structure
CN109003948A (en) * 2018-07-23 2018-12-14 华进半导体封装先导技术研发中心有限公司 The two-sided three-dimensional stacked encapsulating structure of one kind and packaging method
CN211150513U (en) * 2019-08-30 2020-07-31 无锡天芯互联科技有限公司 Package body

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW432557B (en) * 1999-12-14 2001-05-01 Siliconware Precision Industries Co Ltd Chip-scale package and its manufacturing method
JP2006278355A (en) * 2005-03-25 2006-10-12 Nec Corp Assembly structure and manufacturing method of integrated circuit package
KR20090107657A (en) * 2008-04-10 2009-10-14 주식회사 디에스엘시디 Leadfram for package base, electric and electronic devices package using thesame, and method of manufacturing there of
US20150189749A1 (en) * 2013-12-27 2015-07-02 Samsung Electro-Mechanics Co., Ltd. Package and method of manufacturing package thereof
JP2016167577A (en) * 2015-03-05 2016-09-15 エスアイアイ・セミコンダクタ株式会社 Resin sealed semiconductor device and manufacturing method of the same
CN206849833U (en) * 2017-05-17 2018-01-05 杭州士兰微电子股份有限公司 Substrate and encapsulating structure
CN109003948A (en) * 2018-07-23 2018-12-14 华进半导体封装先导技术研发中心有限公司 The two-sided three-dimensional stacked encapsulating structure of one kind and packaging method
CN211150513U (en) * 2019-08-30 2020-07-31 无锡天芯互联科技有限公司 Package body

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