CN114686160B - Solvent-free high-toughness organic silicon conductive adhesive for photovoltaic shingle assembly and preparation method thereof - Google Patents
Solvent-free high-toughness organic silicon conductive adhesive for photovoltaic shingle assembly and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
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- C08K2003/0862—Nickel
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The application relates to the field of organosilicon conductive adhesive, and discloses solvent-free high-toughness organosilicon conductive adhesive for a photovoltaic shingle assembly and a preparation method thereof, wherein the conductive adhesive comprises, by mass, 10-30 parts of organosilicon base adhesive, 0.2-1.5 parts of chain extender, 1-4 parts of cross-linking agent, 70-90 parts of conductive filler, 1-2.5 parts of tackifying assistant, 0.5-3 parts of inhibitor and 0.15-1 part of platinum catalyst, and the organosilicon base adhesive is a mixture of vinyl-terminated silicone oil and methacryloxy polysilsesquioxane. The organic silicon conductive adhesive prepared by the application has long storage time at room temperature or low temperature and high reaction speed at high temperature; the product has the characteristics of no solvent, environmental protection, good flexibility, excellent adhesive property and the like.
Description
Technical Field
The application relates to the field of organosilicon conductive adhesive, in particular to solvent-free high-toughness organosilicon conductive adhesive for a photovoltaic shingle assembly and a preparation method thereof.
Background
Solar energy is an environment-friendly energy source, and is an important development direction for replacing conventional oil-gas energy sources by human beings and realizing the aim of double carbon. Photovoltaic cells are an important device for solar photoelectric conversion, and the shingled assembly technology has been attracting attention as one of the most efficient photovoltaic cell technologies at present. The tile-overlapping assembly technology utilizes conductive adhesive to connect the battery pieces in series in a tighter bonding mode, so that the area of the battery pieces is increased, and the output power of the assembly can be greatly increased. The performance of the conductive adhesive directly influences the operation stability and the service life of the photovoltaic module, so the conductive adhesive is one of the most important materials for determining the performance of the shingled photovoltaic module.
The current common conductive adhesive mainly comprises epoxy, acrylic acid and organic silicon systems. The epoxy conductive adhesive has good adhesive property, but needs higher curing temperature and longer curing time, and has poorer toughness and weather resistance after curing; the acrylic conductive adhesive has the advantages of quick solidification, good adhesion, poor heat aging resistance and ultraviolet resistance, and poor toughness; the organosilicon conductive adhesive has relatively low strength, can meet the requirements of a shingle assembly after being optimized, and has the performances of quick solidification, high and low temperature resistance, ultraviolet resistance, salt fog resistance and the like. Since photovoltaic modules generally need to be used outdoors for more than 25 years, silicone conductive adhesives are more suitable for use in photovoltaic modules.
However, the current organosilicon conductive adhesive has the following problems: 1. the organic silicon conductive adhesive needs to be added with a solvent to improve the construction performance and has poor flexibility, so that the organic silicon conductive adhesive does not meet the requirements of green environmental protection; 2. the battery piece is easy to crack or damage due to high-low temperature impact, and the application and popularization of the battery piece are affected. Therefore, development of an organosilicon conductive adhesive which is solvent-free and has good workability and flexibility is needed to ensure long-term stable operation of the photovoltaic module.
Disclosure of Invention
The application aims to provide a solvent-free high-toughness organic silicon conductive adhesive for a photovoltaic shingle assembly and a preparation method thereof, so as to solve the problem that the organic silicon conductive adhesive in the prior art cannot be compatible with solvent-free and high-flexibility.
In order to achieve the above purpose, the application adopts the following technical scheme: the solvent-free high-toughness organosilicon conductive adhesive for the photovoltaic shingle assembly comprises, by mass, 10-30 parts of organosilicon base adhesive, 0.2-1.5 parts of chain extender, 1-4 parts of cross-linking agent, 70-90 parts of conductive filler, 1-2.5 parts of tackifying additive, 0.5-3 parts of inhibitor and 0.15-1 part of platinum catalyst, wherein the organosilicon base adhesive is a mixture of vinyl-terminated silicone oil and methacryloxy polysilsesquioxane.
The principle and the advantages of the scheme are as follows: in practical application, the inventor researches and develops novel conductive adhesive aiming at the problems of ageing resistance and poor toughness of non-organic silicon conductive adhesive in the prior art and the problems of solvent contained in the organic silicon conductive adhesive and poor toughness. In the technical scheme, the research and development difficulty mainly is that the reinforcing filler needs to be compatible with the problems of no solvent, high strength and easiness in construction (low viscosity); the strength of the organosilicon base adhesive is low under the condition of no reinforcement, the traditional white carbon black reinforcement can cause serious thickening, and the construction performance needs to be adjusted by adding a solvent, which is inconsistent with the original purpose of research and development; the vinyl silicone resin is used for reinforcing and crosslinking, so that the crosslinking density is high and the toughness is poor. In the organic silicon base rubber of the technical scheme, the methacryloxy polysilsesquioxane is used as a reinforcing filler, so that the compatibility with silicone rubber is good, the reinforcing effect is good, the influence on viscosity is small (the viscosity is hardly thickened), and the easy construction is ensured. The vinyl in the methacryloxy is lower in reactivity than the vinyl in the vinyl silicone oil due to the steric hindrance effect of methyl, so that the vinyl silicone oil cannot compete for hydrogen silicone oil reaction sites at the end of the reaction at the initial stage of the reaction, the chain extension reaction is affected, the molecular chain of the vinyl silicone oil after chain extension is longer, and the cured conductive adhesive is better in toughness. Along with the consumption and temperature increase of vinyl-terminated silicone oil, the methacryloxy polysilsesquioxane and hydrogen-containing silicone oil undergo a crosslinking reaction to play a role in reinforcing, so that the prepared conductive adhesive has good strength, toughness and workability. The methacrylate can improve the activity of a platinum catalyst at a high temperature, and the inhibitor and the polysilsesquioxane containing the methacrylate structure are used together to ensure that the conductive adhesive has good storage stability and can be rapidly cured at a high temperature, so that the strength and toughness of the conductive adhesive are ensured and thickening is avoided on the premise of no solvent.
Preferably, as a modification, the mass ratio of the vinyl-terminated silicone oil to the methacryloxy polysilsesquioxane is 1 to 4:1.
In the technical scheme, the mass ratio of vinyl-terminated silicone oil to methacryloxy polysilsesquioxane has an important influence on the mechanical strength and toughness of the conductive adhesive, the too high addition of the methacryloxy polysilsesquioxane can cause too high crosslinking density, the poor toughness of the colloid, and the too low addition of the methacryloxy polysilsesquioxane can cause poor reinforcing effect and low colloid strength.
Preferably, as a modification, the viscosity of the vinyl-terminated silicone oil is 300 to 3000 mPas and the vinyl content of the vinyl-terminated silicone oil is 0.2 to 0.5wt%.
In the technical scheme, the second research and development difficulty is to ensure the toughness of the conductive adhesive. At present, in order to ensure high toughness of the conductive adhesive, a large amount of conductive filler is generally added, so that the conductive adhesive is increased, and the workability cannot be met. The technical scheme discovers that the viscosity of vinyl-terminated silicone oil can influence the viscosity of colloid, the vinyl content can influence the crosslinking density, the low crosslinking density can be caused by the low vinyl content, the colloid strength is low, the high crosslinking density can be caused by the high vinyl content, and the colloid toughness is poor. Through optimizing the viscosity, the prepared conductive adhesive can meet the construction performance requirement while ensuring high toughness.
Preferably, as a modification, the methacryloxypolysilsesquioxane has the structural formula (I) or (II),
wherein k is an integer of 2 to 20, R isn is an integer of 2 to 12.
In the technical scheme, compared with the traditional vinyl MQ resin or vinyl polysilsesquioxane, the vinyl reaction activity in the methacryloxy polysilsesquioxane is lower, and when the vulcanization reaction is in the initial stage, the methacryloxy polysilsesquioxane cannot compete with the vinyl-terminated silicone oil for a hydrogen-terminated silicone oil reaction point, so that chain extension of the vinyl-terminated silicone oil is realized, and the methacryloxy polysilsesquioxane and the hydrogen-containing silicone oil undergo a crosslinking reaction to play a reinforcing effect along with the consumption and the temperature increase of the vinyl-terminated silicone oil. And the molecular weight of polysilsesquioxane is smaller than that of silicone resin, so that the system consistency is not increased. In general, the products of the formulae (I) and (II) are difficult to isolate, and a mixture of both is generally obtained.
Preferably, as an improvement, the chain extender is hydrogen terminated silicone oil, the hydrogen-containing mass fraction of the hydrogen terminated silicone oil is 0.08-0.15%, the viscosity is 5-15 mPa.s, the structural formula is shown as formula (III),
wherein m is an integer of 5 to 18.
In the technical scheme, when the viscosity of the hydrogen-terminated silicone oil is too low, the hydrogen-terminated silicone oil is easy to volatilize in the high-temperature vulcanization process, and the chain extension effect is influenced; when the viscosity of the hydrogen terminated silicone oil is too high, the molecular freedom degree is reduced, and the chain extension reaction rate is affected.
Preferably, as an improvement, the cross-linking agent is side chain hydrogen-containing silicone oil, the hydrogen mass fraction of the side chain hydrogen-containing silicone oil is 0.3-1.2%, the viscosity is 30-500 mPa.s, the structural formula is shown as formula (IV),
wherein R1 is methyl, ethyl or phenyl, p and q are positive integers, p+q is more than or equal to 20 and less than or equal to 100,2.5, and p is more than or equal to 0.5.
In the technical scheme, the viscosity of the hydrogen-containing silicone oil is too low, the molecular weight is too small, the degree of freedom of a crosslinked silicone rubber molecular chain is too high, and the colloid strength is reduced after the crosslinking reaction; the viscosity of the hydrogen-containing silicone oil is too high, the molecular weight is too large, the degree of freedom of a crosslinked silicone rubber molecular chain is too low, the colloid becomes brittle, and the toughness is reduced, and in addition, the research shows that the larger the p+q value is, the larger the molecular weight of the side chain hydrogen-containing silicone oil is, the larger the viscosity is, the larger the p:q value is, the lower the hydrogen mass fraction of the side chain hydrogen-containing silicone oil is, and the value interval of the p and the q is a reasonable interval verified by the test.
Preferably, as an improvement, the conductive filler is silver powder, silver-plated copper powder, silver-plated nickel powder or silver-plated graphite, and the particle size of the conductive filler is 0.2-10 mu m; the inhibitor is alkynol or silanized alkynol.
In the technical scheme, silver powder, silver-plated copper powder, silver-plated nickel powder and silver-plated graphite are common conductive materials in the field, can meet the processing requirements of the scheme, and are wide in raw material sources and mature in application technology. The alkynol or silanized alkynol is used as an inhibitor to meet the processing requirement of the conductive adhesive. In addition, the research shows that the particle size of the conductive filler has a larger influence on the conductivity and the appearance of the sizing material, the appearance of the sizing material is poor due to the excessively large particle size, the conductive filler is seriously agglomerated due to the excessively small particle size, the dispersion is difficult, and the conductivity is poor.
Preferably, as a modification, the tackifying agent has a structural formula as shown in formula (V),
wherein R is 3 Is thatR 2 Methoxy or ethoxy, j is an integer of 2 to 10.
The conductive adhesive belongs to the addition type silicon rubber, and the addition type silicon rubber is a nonpolar substance and does not contain active groups capable of generating interaction with a base material, so that the adhesive property is poor; and the conventional silane coupling agent containing amino with good adhesion promoting effect can cause the platinum catalyst of the addition type silicone rubber to be poisoned, so that the addition type silicone rubber is not solidified, and cannot be used in the addition type silicone rubber, which is another technical difficulty of the scheme. In the technical scheme, the alkoxy on the polyalkoxysilane oligomer has high activity, can be combined with the hydroxyl on the surface of the substrate, and the silane oligomer tackifying auxiliary agent with the structure can effectively improve the adhesive property of the conductive adhesive and improve the adhesive strength.
Preferably, as a modification, the platinum catalyst is a platinum-vinyl complex or a platinum-alkyne-based complex.
In the technical scheme, the platinum-vinyl complex or platinum-alkyne-based complex can be used as a catalyst to meet the processing requirement of the organosilicon conductive adhesive, and the effect is good.
Preferably, as an improvement, the preparation method of the solvent-free high-toughness organic silicon conductive adhesive for the photovoltaic shingle assembly comprises the following steps:
step one: uniformly stirring the organosilicon base, the chain extender and the cross-linking agent to obtain a system I;
step two: adding the dehydrated and dried conductive filler into the system I, uniformly stirring, adding the tackifying additive and the inhibitor, and uniformly stirring to obtain a system II;
step three: and adding a platinum catalyst into the system II, stirring in vacuum, and filtering impurities to obtain the organosilicon conductive adhesive.
In the technical scheme, the preparation process of the organic silicon conductive adhesive is simple, is convenient to operate, and is very suitable for industrial popularization and application.
Detailed Description
The following is a detailed description of embodiments, but embodiments of the application are not limited thereto. The technical means used in the following embodiments are conventional means well known to those skilled in the art unless otherwise specified; the experimental methods used are all conventional methods; the materials, reagents, and the like used are all commercially available.
The solvent-free high-toughness organosilicon conductive adhesive for the photovoltaic shingle assembly comprises, by mass, 10-30 parts of organosilicon base adhesive, 0.2-1.5 parts of chain extender, 1-4 parts of cross-linking agent, 70-90 parts of conductive filler, 1-2.5 parts of tackifying additive, 0.5-3 parts of inhibitor and 0.15-1 part of platinum catalyst, wherein the organosilicon base adhesive is a mixture of vinyl-terminated silicone oil and methacryloxy polysilsesquioxane.
Wherein, the mixing mass ratio of vinyl-terminated silicone oil and methacryloxy polysilsesquioxane in the organosilicon base adhesive is 1-4:1; the viscosity of the vinyl-terminated silicone oil is 300-3000 mPa.s, and the vinyl content of the vinyl-terminated silicone oil is 0.2-0.5wt%; the structural formula of the methacryloxy polysilsesquioxane (manufacturer: bodavafu) is shown as formula (I) or formula (II),
wherein k is an integer of 2 to 20, R isn is an integer of 2 to 12.
The chain extender is hydrogen-terminated silicone oil, the hydrogen-containing mass fraction of the hydrogen-terminated silicone oil (manufacturer: new seedling wetting material) is 0.08-0.15%, the viscosity is 5-15 mPa.s, the structural formula is shown as formula (III),
wherein m is an integer of 5 to 18.
The cross-linking agent is side chain hydrogen-containing silicone oil, the hydrogen-containing mass fraction of the side chain hydrogen-containing silicone oil (manufacturer: new seedling wetting material) is 0.3-1.2%, the viscosity is 30-500 mPa.s, the structural formula is shown as formula (IV),
wherein R1 is methyl, ethyl or phenyl, p and q are positive integers, p+q is more than or equal to 20 and less than or equal to 100,2.5, and p is more than or equal to 0.5.
The structural formula of the tackifying additive is shown as the formula (V),
wherein R is 3 Is thatR 2 Methoxy or ethoxy, j is an integer of 2 to 10.
The tackifying additive is prepared by the following steps: the reaction polymerization device adopts a four-neck flask to be fixed on a magnetic stirrer, and is respectively provided with a thermometer, a feed inlet and an argon protection system. 40 parts of methacryloxypropyl trimethoxysilane (methacryloxypropyl triethoxysilane) is added into a four-necked flask, stirred and heated to 50-60 ℃, 60ml of acetone and 2-10 parts of dimethyl azodiisobutyrate are measured and added into a reaction bottle, and the temperature is kept at 50-60 ℃ and stirred for 4 hours for reaction. Vacuum-stripping at 50 ℃ to obtain the tackifying assistant.
A preparation method of solvent-free high-toughness organic silicon conductive adhesive for a photovoltaic shingle assembly comprises the following steps:
step one: uniformly stirring the organosilicon base, the chain extender and the cross-linking agent to obtain a system I;
step two: adding the dehydrated and dried conductive filler into the system I, uniformly stirring, adding the tackifying additive and the inhibitor, and uniformly stirring to obtain a system II;
step three: and adding a platinum catalyst into the system II, stirring in vacuum, and filtering impurities to obtain the organosilicon conductive adhesive.
Examples 1 to 6 are examples of the present application, and the difference between the examples is the selection of a part of raw materials and the addition amount, and the details are shown in Table 1.
TABLE 1
Comparative example 1
Comparative example 1 differs from example 1 in that: the methacryloxy polysilsesquioxane in the silicone base gum was replaced with an equivalent amount of vinyl terminated silicone oil.
Comparative example 2
Comparative example 2 differs from example 1 in that: the methacryloxypolysilsesquioxane in the silicone base gum was replaced with an equivalent amount of vinyl polysilsesquioxane.
Comparative example 3
Comparative example 3 differs from example 1 in that: the methacryloxy polysilsesquioxane in the organosilicon base gum is replaced by an equivalent amount of hydrophobic white carbon black.
Comparative example 4
Comparative example 4 differs from example 1 in that: and a chain extender hydrogen terminated silicone oil is not added.
Comparative example 5
Comparative example 5 differs from example 1 in that: the chain extender hydrogen terminated silicone oil was replaced with an equivalent hydrogen terminated silicone oil having a hydrogen content of 0.04% and a viscosity of 30 mPas.
Comparative example 6
Comparative example 6 differs from example 1 in that: no tackifying additive is added.
Comparative example 7
Comparative example 7 differs from example 1 in that: the adhesion promoter was replaced with an equivalent amount of vinyltrimethoxysilane.
The silicone conductive adhesives prepared in the above examples and comparative examples were subjected to performance tests, and the viscosity, storage time, curing time, hardness, tensile strength, elongation at break, adhesive strength, electrical resistivity, adhesive strength after aging, and electrical resistivity after aging of the silicone conductive adhesives were measured, and the measurement was performed with reference to GB/T2794, GB/T531.1, GB/T528, GB/T529, GB/T8949, GB/T19089, GB/T1695, GB/T1693, GB/T1692, and GB/T9286, and three repeated experiments were performed for each group, and the results are shown in Table 2.
TABLE 2
Note that: the aging test is 1000 hours aging at 85℃under 85% relative humidity.
As can be seen from the data in Table 2, the conductive adhesive prepared in examples 1 to 6 contains no solvent, has long low-temperature (5 ℃) and normal-temperature (25 ℃) operation time, high-temperature curing speed, high strength, good toughness and excellent conductive performance, and can still maintain good performance after double-85 (85 ℃ and 85% humidity) aging.
The conductive adhesive prepared in the comparative example 1 is not reinforced by resin, has low strength, does not contain an acrylic ester structure, cannot generate synergistic effect with an inhibitor, and has obviously reduced operation time and obviously prolonged high-temperature curing time; in the comparative example 2, vinyl polysilsesquioxane is used as a reinforcing filler, and the vinyl of the vinyl polysilsesquioxane competes with vinyl-terminated silicone oil for hydrogen silicone oil reaction sites, so that chain extension failure is caused, the prepared conductive adhesive has poor toughness, low elongation and lower strength, does not contain an acrylic ester structure, cannot generate a synergistic effect with an inhibitor, the operation time of the conductive adhesive is obviously reduced, and the high-temperature curing time is obviously prolonged; in the comparative example 3, the hydrophobic white carbon black is used as the reinforcing filler, the thickening of the white carbon black is serious, and the prepared conductive adhesive is too high and is not easy to construct; comparative example 4, which does not use a chain extender, cannot increase the molecular weight of the base polymer during the vulcanization reaction, the prepared conductive adhesive has poor toughness, low elongation and lower strength; in comparative example 5, the hydrogen terminated silicone oil has larger viscosity, the chain extension effect is affected, the prepared conductive adhesive has poor toughness, low elongation and lower strength; comparative example 6, in which no adhesion promoter was added, the conductive adhesive had poor adhesion and low shear strength; comparative example 7 replaces the adhesion promoter with vinyltrimethoxysilane, the conductive adhesive has poor adhesion and low shear strength. By adopting the schemes of the examples 1-6, the organosilicon conductive adhesive with better performance can be prepared.
The foregoing is merely exemplary of the present application, and specific technical solutions and/or features that are well known in the art have not been described in detail herein. It should be noted that, for those skilled in the art, several variations and modifications can be made without departing from the technical solution of the present application, and these should also be regarded as the protection scope of the present application, which does not affect the effect of the implementation of the present application and the practical applicability of the patent. The protection scope of the present application is subject to the content of the claims, and the description of the specific embodiments and the like in the specification can be used for explaining the content of the claims.
Claims (6)
1. The solvent-free high-toughness organosilicon conductive adhesive for the photovoltaic shingle assembly is characterized in that: the adhesive comprises, by mass, 10-30 parts of an organosilicon base adhesive, 0.2-1.5 parts of a chain extender, 1-4 parts of a cross-linking agent, 70-90 parts of a conductive filler, 1-2.5 parts of a tackifying auxiliary agent, 0.5-3 parts of an inhibitor and 0.15-1 part of a platinum catalyst, wherein the organosilicon base adhesive is a mixture of vinyl-terminated silicone oil and methacryloxy polysilsesquioxane; the mass ratio of the vinyl-terminated silicone oil to the methacryloxy polysilsesquioxane is 1-4:1; the viscosity of the vinyl-terminated silicone oil is 300-3000 mPa.s, and the vinyl content of the vinyl-terminated silicone oil is 0.2-0.5wt%;
the chain extender is hydrogen terminated silicone oil, the hydrogen-containing mass fraction of the hydrogen terminated silicone oil is 0.08-0.15%, the viscosity is 5-15 mPa.s, the structural formula is shown as formula (III),
wherein m is an integer of 5 to 18;
the structural formula of the tackifying additive is shown as the formula (V),
wherein R is 3 Is that
R 2 Methoxy or ethoxy, j is an integer of 2 to 10.
2. The solvent-free high-toughness organosilicon conductive adhesive for a photovoltaic shingle assembly according to claim 1, wherein the solvent-free high-toughness organosilicon conductive adhesive comprises the following components in percentage by weight: the structural formula of the methacryloxy polysilsesquioxane is shown as a formula (I) or a formula (II),
wherein k is an integer of 2 to 20, R isn is an integer of 2 to 12.
3. The solvent-free high-toughness organosilicon conductive adhesive for a photovoltaic shingle assembly according to claim 2, wherein the solvent-free high-toughness organosilicon conductive adhesive comprises the following components in percentage by weight: the cross-linking agent is side chain hydrogen-containing silicone oil, the hydrogen mass fraction of the side chain hydrogen-containing silicone oil is 0.3-1.2%, the viscosity is 30-500 mPa.s, the structural formula is shown as formula (IV),
wherein R1 is methyl, ethyl or phenyl, p and q are positive integers, p+q is more than or equal to 20 and less than or equal to 100,2.5, and p is more than or equal to 0.5.
4. A solvent-free high-toughness organosilicon conductive adhesive for a photovoltaic shingle assembly according to claim 3, which is characterized in that: the conductive filler is silver powder, silver-plated copper powder, silver-plated nickel powder or silver-plated graphite, and the particle size of the conductive filler is 0.2-10 mu m; the inhibitor is alkynol or silanized alkynol.
5. The solvent-free high-toughness organosilicon conductive adhesive for a photovoltaic shingle assembly, according to claim 4, wherein the solvent-free high-toughness organosilicon conductive adhesive comprises the following components in percentage by weight: the platinum catalyst is a platinum-vinyl complex or a platinum-alkyne-based complex.
6. The method for preparing the solvent-free high-toughness organosilicon conductive adhesive for the photovoltaic shingle assembly according to any one of claims 1 to 5, which is characterized by comprising the following steps:
step one: uniformly stirring the organosilicon base adhesive, the chain extender and the cross-linking agent to obtain a system I;
step two: adding the dehydrated and dried conductive filler into the system I, uniformly stirring, adding the tackifying additive and the inhibitor, and uniformly stirring to obtain a system II;
step three: and adding a platinum catalyst into the system II, stirring in vacuum, and filtering impurities to obtain the organosilicon conductive adhesive.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210470548.7A CN114686160B (en) | 2022-04-28 | 2022-04-28 | Solvent-free high-toughness organic silicon conductive adhesive for photovoltaic shingle assembly and preparation method thereof |
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| CN202210470548.7A CN114686160B (en) | 2022-04-28 | 2022-04-28 | Solvent-free high-toughness organic silicon conductive adhesive for photovoltaic shingle assembly and preparation method thereof |
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| CN114686160A CN114686160A (en) | 2022-07-01 |
| CN114686160B true CN114686160B (en) | 2023-08-15 |
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